Conductive gaskets and electromagnetic shielding devices using conductive gaskets.

Abstract

The invention relates to a conductive gasket and an electromagnetic shielding device using a conductive gasket, in which the gasket is easily pressed with little force by means of the elastic force of the bending portion of the polymer film and achieves reliable electrical contact with the object. The invention relates to a conductive gasket and an electromagnetic shielding device using a conductive gasket, in which the gasket is easily pressed with little force by means of the elastic force of the bending portion of the polymer film and achieves reliable electrical contact with the object.A conductive gasket consists of a polymer film with an adhesive layer formed on the inside and a metal layer formed on the outside, where the polymer film is bent to wrap around the adhesive layer on at least one side to form the bend; the adhesive layer does not self-adhere in at least part of the bend so that an internal void is formed by the polymer film; the adhesive layer self-adheres in the part, except for the bend, where the polymer films overlap so that a support layer is formed, and the support layer is formed by the support layer and the part where the polymer films overlap.

Description

Electrically conductive gasket and electromagnetic shielding device using the same

[0001] The present invention relates to an electrically conductive gasket, and more particularly, to an electrically conductive gasket that is low in height, can be pressed with a small amount of force, and can form reliable electrical contact with an object. Furthermore, the present invention relates to a technology that efficiently blocks the inflow and outflow of electromagnetic waves centered around a semiconductor chip, while selectively and efficiently dissipating heat generated from the semiconductor chip to the outside.

[0002] Electrically conductive gaskets, which are generally interposed between opposing electrically conductive objects to electrically connect the objects, must have good electrical conductivity and excellent elastic restoring force.

[0003] These electrically conductive gaskets are mounted on objects to shield electromagnetic waves generated from electronic components such as semiconductor chips or to electrically connect objects.

[0004] Domestic patent registration No. 1804881 by the present inventor discloses a coreless elastic electrical contact terminal, which is an electrical contact terminal that is interposed between objects and contacts them to form an electrical path between the objects, comprising: a polymer film having a metal layer adhered to an outer surface; and a support layer made of an elastic material adhered to an inner surface of the film by curing, wherein both side walls of the film are bent with a constant radius of curvature, and a) the support layer fills a portion of the space on the inner side of the both bent side walls, and the object is supported by the elastic force of the filled support layer, or b) the support layer is coated on the inner side of the both bent side walls to form an elastic sheet together with the film, and the object is supported by the restoring force of the elastic sheet.

[0005] However, these electrical contact terminals have a disadvantage in that it is difficult for a flat object to press them with a small amount of force because the upper surface is entirely flat.

[0006] That is, there is a limit to providing a structure of an electrical contact terminal that has a large operating distance and is pressed a lot in the height direction while applying a small pressing force, and it is difficult to reliably limit the height at which the electrical contact terminal is pressed.

[0007] In addition, when the lower surface of the electrical contact terminal is entirely flat and an adhesive tape is adhered to the lower surface of the electrical contact terminal, it is difficult for the metal layer of the electrical contact terminal to make direct electrical contact with an electrically conductive object due to the thickness of the adhesive tape.

[0008] In addition, when applied to a semiconductor chip mounted on a circuit board, there is a limit to shielding electromagnetic waves that flow in and out in a direction not covered by the polymer film of the electrical contact terminal based on the side wall of the semiconductor chip.

[0009] Meanwhile, a metal shield can with an opening is applied to shield the electromagnetic waves of the semiconductor chip mounted on the circuit board, protect the semiconductor chip, and transmit and disperse the heat generated from the semiconductor chip.

[0010] For example, domestic patent registration No. 2413323 discloses a structure that physically and electrically connects a shield can and a frame by interposing a conductive gasket between the frame and the shield can to maintain contact with the shield can.

[0011] However, according to these conventional technologies, there are limitations in effectively shielding electromagnetic waves while allowing the semiconductor chip and frame to conduct heat well.

[0012] In other words, there is a limit to ensuring that the conductive gasket is pressed against the opposing object with low force and has a thin thickness overall, that the pressing force is distributed rather than concentrated on the upper surface of the semiconductor chip when the frame presses the semiconductor chip in the vertical direction, and that the conductive gasket and shield can are integrated so that they can be picked up and mounted at once.

[0013] Accordingly, an object of the present invention is to provide a thin electrically conductive gasket that can be pressed with a small force.

[0014] Another object of the present invention is to provide a low-thickness electrically conductive gasket that is easy to make direct electrical contact with an electrically conductive object or to provide reliable electrical contact.

[0015] Another object of the present invention is to provide a low-thickness electrically conductive gasket that is easy to form an opening capable of accommodating a semiconductor chip or the like therein and that can significantly shield electromagnetic waves flowing in or out in the horizontal direction of the semiconductor chip accommodated in the opening.

[0016] Another object of the present invention is to provide an electromagnetic shielding device that can be pressed with a small force between objects and can make elastic contact with the objects with low electrical resistance.

[0017] Another object of the present invention is to provide an electromagnetic shielding device having a structure that is easy to limit the force applied to the upper surface of a semiconductor chip.

[0018] Another object of the present invention is to provide an electromagnetic shielding device having a structure that facilitates efficient transfer of heat generated in a semiconductor chip to a cooling unit while efficiently shielding electromagnetic waves generated from the side of a semiconductor chip or electromagnetic waves flowing into the semiconductor chip.

[0019] The above object is an electrically conductive gasket that is pressed and interposed between opposing objects to shield electromagnetic waves or make electrical connections, wherein the electrically conductive gasket comprises an electrically conductive member, and an electrically conductive film formed of an elastic curable adhesive layer bonded to the electrically conductive member by curing, wherein the electrically conductive film is bent in a curved manner on both sides of the width direction of the electrically conductive gasket so that the adhesive layer is positioned on the inside to form a bending portion having an internal space extending in the longitudinal direction of the electrically conductive gasket, and the adhesive layers are bonded to each other in a portion where the electrically conductive films face each other except for the bending portion to form a support layer, and the support portion is formed by the portion where the electrically conductive films overlap and the support layer, and the maximum height of the bending portion is higher than the maximum height of the support portion, and when the object presses the electrically conductive gasket, the electrically conductive gasket is characterized in that it makes elastic contact with the object by an elastic restoring force of the bending portion. This is achieved by a gasket.

[0020] Preferably, the electrically conductive member is a polymer film having a metal layer formed on one side or having electrically conductive fibers adhered thereto and an adhesive layer adhered thereto on the other side, and the metal layer may be formed by plating or composed of a metal foil.

[0021] Preferably, the support is flat, and both ends of the electrically conductive member can be positioned on the lower surface of the support.

[0022] Preferably, a number of micro-cavities made of air are formed in the support layer, which are smaller than the internal space, so that the support part can be made softer.

[0023] Preferably, the cross-section of the electrically conductive gasket may be symmetrical in the width direction, and the cross-sectional shape of the bending portion may be a circular or oval shape in which the height of the middle portion in the horizontal direction is the maximum height.

[0024] Preferably, an adhesive tape is adhered on an electrically conductive member formed on the lower surface of the support portion, and the adhesive tape does not protrude beyond the lowermost portion of the bending portion, so that the electrically conductive member on the lower surface of the bending portion can directly contact the object.

[0025] Preferably, at least one opening may be formed in the support portion to penetrate the electrically conductive gasket in the thickness direction, and the maximum height of the gasket in the bending portion may be greater than the maximum height of a semiconductor chip accommodated in the opening and mounted on the circuit board.

[0026] Preferably, an electrically conductive powder is mixed into the support layer to shield electromagnetic waves that flow into or out of the semiconductor chip accommodated in the opening in a direction in which the bending portion is not formed through the support layer.

[0027] Preferably, the electrically conductive member may be composed of a polymer film having a metal layer formed on one side or having electrically conductive fibers adhered thereto; and a flat reinforcing sheet having one side adhered to the other side of the polymer film and the adhesive layer adhered to the other side.

[0028] Preferably, the adhesive layers are not bonded to each other at the bending portion, so that an internal space surrounded by the electrically conductive film is formed, or the adhesive layers are bonded to each other at the bending portion, so that they can be connected to the support layer.

[0029] The above object is an electromagnetic shielding device that surrounds a semiconductor chip mounted on a circuit board and shields electromagnetic waves, and the electromagnetic shielding device comprises a metal shield case having an opening formed on an upper surface and a flange formed along an edge of the opening, and an electrically conductive gasket attached to an upper surface of the flange, the electrically conductive gasket comprising an electrically conductive member, and an electrically conductive film formed of a curable adhesive layer having elasticity and bonded to the electrically conductive member by curing, and the electrically conductive film is bent in a curved manner on both sides of the width direction of the electrically conductive gasket so that the adhesive layer is positioned on the inside to form a bending portion having an internal space extending in the longitudinal direction of the electrically conductive gasket, and the adhesive layers are bonded to each other in a portion where the electrically conductive films face each other except for the bending portion, and a support layer is formed by the portion where the electrically conductive films are overlapped and the support layer, and the electrically conductive gasket is attached to the support portion. An electromagnetic shielding device is achieved by a method characterized in that an opening penetrating in the thickness direction is formed, the maximum height of the bending portion is higher than the maximum height of the support portion, and when the object presses the electrically conductive gasket, the object is elastically contacted by the elastic restoring force of the bending portion, and the surface of the semiconductor chip is exposed to the outside through the opening of the electrically conductive gasket and the opening of the metal shield case.

[0030] Preferably, the opening of the metal shield case and the opening of the electrically conductive gasket can correspond to expose the surfaces of two or more semiconductor chips to the outside.

[0031] Preferably, the electrically conductive gasket can be mounted on the inside of the edge of the metal shield case, corresponds to a soldering temperature, the metal shield case is solderable, and the shielding device is surface-mountable by vacuum pickup at the electrically conductive gasket portion.

[0032] According to the present invention, the height of the bending portion is higher than that of the support portion, so that a large amount of pressure can be applied with a small amount of force.

[0033] In addition, reliable electrical contact with the target object can be achieved by the elastic restoring force of the bending portion and the thickness of the adhesive tape.

[0034] In addition, the conductive gasket is not pressed below a certain height by the conductive powder of the support layer, and electromagnetic waves that flow in and out from the side of the semiconductor chip accommodated in the opening of the conductive gasket can be largely shielded.

[0035] In addition, the force applied by the object such as the cooling unit is shared by the electrically conductive gasket, metal shield case, and semiconductor chip, which are thin and have elasticity that allows a lot of pressure to be applied with a small force, or at least not received by the semiconductor chip alone, thereby preventing damage to the semiconductor chip and effectively shielding electromagnetic waves from the semiconductor chip, while quickly transferring heat generated from the semiconductor chip to the cooling unit.

[0036] Additionally, if the support layer is electrically conductive, electromagnetic waves in the horizontal direction of the electrically conductive gasket including both ends not covered by the polymer film are shielded.

[0037] In addition, by filling the gap caused by the difference in height between the shield can and the semiconductor chip with a thin, electrically conductive gasket that can be pressed with little force and a low-hardness thermal conductive material, the heat generated from the semiconductor chip can be quickly transferred to the cooling unit while effectively shielding electromagnetic waves.

[0038] Figure 1 shows an electrically conductive gasket according to one embodiment of the present invention.

[0039] Figure 2 is a cross-sectional view taken along line 2-2' of Figure 1.

[0040] Figure 3 shows an electrically conductive gasket according to another embodiment of the present invention.

[0041] Figure 4 shows a state in which an electrically conductive gasket is mounted on a circuit board.

[0042] Figure 5 shows an exploded view of an electromagnetic shielding device according to an embodiment of the present invention.

[0043] Figure 6 is a cross-sectional view showing an integrated electromagnetic shielding device.

[0044] Figure 7 shows a state in which an electromagnetic shielding device is applied.

[0045] Figure 8 shows an electrically conductive gasket according to another embodiment of the present invention.

[0046] It should be noted that the technical terms used herein are used solely to describe specific embodiments and are not intended to limit the present invention. Furthermore, unless specifically defined otherwise, the technical terms used herein should be interpreted in the same way as would be generally understood by those skilled in the art to which the present invention pertains, and should not be interpreted in an overly broad or overly narrow sense.

[0047] Hereinafter, the present invention will be described in detail with reference to the attached drawings. The attached drawings are intended to aid in understanding the present invention, and for convenience of explanation, some components may be depicted with dimensions and other details disregarded and somewhat exaggerated.

[0048] FIG. 1 shows an electrically conductive gasket according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line 2-2' of FIG. 1.

[0049] An electrically conductive gasket (100) has a low thickness and elastic restoring force and is interposed between opposing electrically conductive objects to shield electromagnetic waves or provide electrical connection.

[0050] The electrically conductive gasket (100) preferably corresponds to the soldering temperature and is capable of reflow soldering using solder cream.

[0051] As shown in Fig. 1, the electrically conductive gasket (100) is in the shape of a sheet whose width and length are much larger than its thickness, and a bending portion (101) having an oval cross-section is formed on both sides of the width direction of the electrically conductive film (110), and a flat support portion (102) is formed between them.

[0052] In this embodiment, the bending portion (101) is formed on both sides of the width direction of the electrically conductive film (110), but the bending portion (101) may be formed on at least one side.

[0053] The height of the thickest part of the electrically conductive gasket (100), i.e., the maximum height (H) of the bending portion (101), is 0.15 mm to 1.2 mm, preferably 0.15 mm to 0.5 mm, but is not limited thereto.

[0054] The electrically conductive film (110) is composed of a polymer film (120) having a metal layer (130) formed on the outer surface, and an adhesive layer (140) formed on the inner surface of the polymer film (120).

[0055] In this embodiment, the polymer film (120) having a metal layer (130) formed on the outer surface shows one example of an electrically conductive member, but it is understood that other structures may be provided.

[0056] For example, the electrically conductive member may be a metal deposition layer or metal plating layer formed by metal deposition or metal plating on a polymer film (120), a metal foil formed on a polymer film (120), or an electrically conductive fiber (woven fabric, non-woven fabric) on which a metal is plated, and the electrically conductive fiber may be adhered on a polymer film (120) or used without a polymer film (120).

[0057] Accordingly, the electrically conductive film (110) is composed of an electrically conductive member and an adhesive layer (140) formed by bonding the electrically conductive member to the electrically conductive member, and a reinforcing sheet may be further interposed between the electrically conductive member and the adhesive layer (140).

[0058] The reinforcing sheet is bonded to the electrically conductive member, and may be a rubber sheet having a constant thickness and elasticity, or a material such as a polymer film (120).

[0059] The electrically conductive film (110) is bent so that the adhesive layer (140) is positioned on the inside on both sides facing each other in the width direction to form a bending portion (101) having one internal space (112) extending in the length direction of the gasket.

[0060] In addition, except for the bending portion (101), the adhesive layers (140) are bonded to each other in the overlapping portion of the electrically conductive films (110) to form a support layer (142), thereby forming a support portion (102) together with the electrically conductive film (110).

[0061] Optionally, in order to prevent the adhesive layers (140) from adhering to each other in the bending portion (101), the adhesive layer (l40) may not be formed at all in the bending portion (101).

[0062] The metal layer (130) may be composed of a material capable of reflow soldering using solder cream, and it is most preferable to apply a metal layer formed by plating on a polymer film (120) as the metal layer (130).

[0063] The adhesive layer (140) is, for example, an elastic rubber formed by curing liquid silicone rubber or polyurethane rubber, and the cured silicone rubber corresponds to the soldering temperature.

[0064] The polymer film (120) may be a conventional polyimide (PI) film or polyester (PET) film having a certain level of mechanical strength or higher, and the thickness of the polymer film (120) is preferably thicker than the thickness of the metal layer (130) so that the elastic recovery is good when the bending portion (101) in which the internal space (112) is formed is pressed and damage by an external force is reduced, and when the material of the polymer film (120) is polyimide, it corresponds to the soldering temperature.

[0065] For example, the thickness of the polymer film (120) may be 7 to 30 μm, the thickness of the metal layer (130) may be 2 to 15 μm, and when the material of the polymer film (120) is polyimide, it corresponds to the soldering temperature.

[0066] The elastic restoring force in the bending portion (101) can be determined by at least one of the radius of curvature of the bending portion (101), the material and hardness of the adhesive layer (140), and the thickness in addition to the thickness of the polymer film (120) and the metal layer (130), and the size of the bending portion (101) corresponds appropriately to the size of the metal shield case (180).

[0067] A double-sided adhesive tape (PSA) (150) is adhered to the metal layer (130) on the lower surface of the electrically conductive gasket (100), so that the electrically conductive gasket (100) can be adhered to an object by the double-sided adhesive tape (150), and the double-sided adhesive tape can be electrically conductive or electrically insulating.

[0068] Referring to Fig. 2, the adhesive tape (150) is adhered to the metal layer (130) on the lower surface of the electrically conductive gasket (100) corresponding to the support portion (102), and can be adhered to extend up to the thickest part of the bending portion (101).

[0069] The adhesive tape (150) may have a thickness such that when the electrically conductive gasket (100) is adhered to the object by the adhesive tape (150), at least a portion of the metal layer (130) on the lower surface of the bending portion (101) is in direct electrical contact with the object.

[0070] In other words, as indicated by the dotted line in the circle of FIG. 2, since the level of the lower surface of the bending portion (101) is lower than the level of the lower surface of the adhesive tape (150), that is, the lower surface of the bending portion (101) can make direct electrical contact with the object without pressing the electrically conductive gasket (100) due to the level difference Dt, and as a result, has low electrical contact resistance.

[0071] In Fig. 2, the support layer (142) is formed by self-adhesion of an adhesive layer (140) applied to the inner surface of a polymer film (120) during the manufacturing process, and is connected to the adhesive layer (140) formed on the inner surface of the polymer film (120) at the bending portion (101).

[0072] As described above, in the bending portion (101), the adhesive layers (140) are not bonded to each other, and an internal space (112) surrounded by the adhesive layers (140) is formed, and the cross-sectional shape of the bending portion (101) may be an ellipse with a width greater than a height, as in this embodiment.

[0073] The internal space (112) can be determined by the amount of adhesive corresponding to the adhesive layer (140), the thickness of the support layer (142), the dimensions of the electrically conductive gasket (100), the manufacturing process, etc., and preferably, when the bending portion (101) in which the internal space (112) is formed is pressed at the same height as the support portion (102), it can be pressed with less force. In other words, the force pressing the bending portion (101) in the height direction per unit area is less than the force pressing the support portion (102).

[0074] According to this embodiment, the height of the gasket in the bending portion (101) where the internal space (112) is formed is higher than the height of the gasket in the support portion (102), so that when the electrically conductive gasket (100) is pressed by an object, the bending portion (101) is pressed by the object first, ultimately increasing the pressing distance of the electrically conductive gasket (100), and as a result, a large amount of pressing can be performed with a small amount of force.

[0075] Although it may vary depending on the purpose of the electrically conductive gasket (100), in the present invention, since the height of the electrically conductive gasket (100) is low, the maximum height of the gasket at the bending portion (101) is preferably 1.1 to 2 times greater than the maximum height of the gasket at the support portion (102).

[0076] If it is less than 1.1 times, the effect of the present invention is small, and if it is greater than 2 times, there is a disadvantage in that it is difficult to form the bending portion (101) based on the maximum height of the gasket at the support portion (102) and handling is difficult.

[0077] According to this structure, when the electrically conductive gasket (100) is pressed to a certain height in the vertical direction by an object, the height of the gasket at the bending portion (101) is higher than the height of the gasket at the support portion (102), so that the contact is made from the bending portion (101), and thus the electrically conductive gasket (100) can be pressed a lot with a small force overall.

[0078] Here, when the electrically conductive gasket (100) is pressed vertically by an object, electrical contact with the object can be made with a small force because only the bending portion (101) is pressed, and thus direct electrical connection with the object is established. However, if the object also presses the support portion (102), it has a lower electrical contact resistance and can also shield electromagnetic waves well.

[0079] The internal space (112) of the bending portion (101) is formed by allowing the adhesive layer (140) in the bending portion (101) to separate without adhering to each other during the process of forming the bending portion (101) and the support portion (102) by bending the electrically conductive film (110) in a curved shape. This may be determined, for example, by the structure and manufacturing method of the mold for manufacturing the electrically conductive gasket (100), or the amount and viscosity of the liquid adhesive, the material and thickness of the polymer film (120) and the metal layer (130), etc.

[0080] The internal space (112) created in the process of forming the bending portion (101) can maintain the shape of the internal space (112) after the liquid adhesive hardens.

[0081] Preferably, the thickness of the support layer (142) can be formed to be thicker than the sum of the thickness of the polymer film (120) and the thickness of the metal layer (130) to have appropriate elasticity.

[0082] According to this structure, the electrically conductive gasket (100) can be easily pressed with a small force due to the restoring force of the bending portion (101) forming the internal space (112) and the height higher than the support portion (102), and as a result, reliable electrical contact can be made with the object.

[0083] As described above, the support layer (142) formed between the polymer film (120) in the support member (102) is formed by self-adhesion while the adhesive layers (140) face each other. Since the adhesive layers (140) are bonded to each other, a microvoid (141) can be formed in the process of forming the support layer (142).

[0084] The micro-space (141) can be formed by supplying air to the support layer (142) depending on the restoring force of the polymer film (120) and the metal layer (130) in the support (102), the structure of the mold for manufacturing the electrically conductive gasket, the manufacturing method, and the amount and viscosity of the liquid adhesive.

[0085] Preferably, a plurality of microcavities (141) can be formed within the entire support layer (142), and have a smaller dimension than the size of the internal space (112) of the bending portion (101), so that the support portion (102) can be made softer by the microcavities (141).

[0086] In the support layer (142) constituting the support portion (102), a plurality of powders having a diameter smaller than the thickness of the support layer (142) may be dispersed, and the powders serve as spacers that limit the height at which the support portion (102) is pressed or serve to increase the mechanical strength of the support portion (102).

[0087] The powder is uniformly distributed on the adhesive layer (140), and as a result, the powder can be uniformly dispersed on the support layer (142) formed by self-adhesion of the adhesive layers (140) to each other.

[0088] At least one of metal, ceramic, carbon and polymer can be applied as a powder.

[0089] Here, in the case of metal powder, copper or aluminum powder can be used for electromagnetic wave shielding, and magnetic metal powder can be used for electromagnetic wave absorption.

[0090] Preferably, considering the manufacturing productivity of the electrically conductive gasket (100) or the force pressing the electrically conductive gasket (100), the maximum diameter of the powder may be 1 / 5 to 1 / 3 of the thickness of the support layer (142), but is not limited thereto.

[0091] The support layer (142) containing powder is manufactured by mixing powder into liquid polymer rubber and then curing it, and the more the electrically conductive gasket (100) is pressed, the lower the electrical resistance of the support layer (142).

[0092] An electrically conductive metal member can be embedded in the support member (102). For example, the electrically conductive metal member can be placed between adhesive layers (140) corresponding to the support member (102) and self-adhesively bonded to each other to form a support layer (142).

[0093] Additionally, an electrically conductive metal member may be attached to the metal layer (130) on the lower surface of the electrically conductive gasket (100) corresponding to the support member (102).

[0094] The metal member is, for example, a foil-shaped member made of copper, iron or an alloy thereof with a uniform thickness and a width much larger than the thickness, and the electrically conductive gasket (100) can easily maintain flatness and better shield electromagnetic waves by the metal member.

[0095] When a metal member is attached to a metal layer (130) on the lower surface of an electrically conductive gasket (100), the metal member may be a material capable of soldering using solder cream.

[0096] In another embodiment, the ends of the polymer film (120) on the lower surface of the electrically conductive gasket (100) are spaced apart to form a gap (111), so that a part of the support layer (142) can be exposed to the outside through the gap (111).

[0097] In this structure, the support layer (142) has electrical conductivity by dispersing electrically conductive powder and is exposed to the outside through a gap (111) so that it can be electrically connected to an electrically conductive adhesive tape (150) or an electrically conductive object that comes into contact therewith.

[0098] As a result, the electromagnetic waves flowing in or out through the longitudinal ends of the electrically conductive gasket (100) that are not covered by the electrically conductive film (110) can be shielded, so that the overall electromagnetic wave shielding performance of the electrically conductive gasket (100) can be improved.

[0099] FIG. 3 shows an electrically conductive gasket according to another embodiment of the present invention, and FIG. 4 shows a state in which the electrically conductive gasket is mounted on a circuit board.

[0100] In this embodiment, one or more openings (105) penetrating the electrically conductive film (110) in the thickness direction are formed in the support portion (102), and a pair of bending portions (101) are formed at both ends in the width direction of the support portion (102).

[0101] Preferably, a pair of bending portions (101) can be made symmetrical to balance the object.

[0102] In this example, the opening (105) is formed in the support (102) in a square shape corresponding to, for example, a semiconductor chip (30), but is not limited thereto and may be formed in a shape corresponding to electronic components or circuit boards of various shapes.

[0103] Additionally, the heights of a plurality of semiconductor chips (30) or circuit boards (10) may be different from each other, and a plurality of semiconductor chips (30) may be mounted on different circuit boards.

[0104] Preferably, the maximum height of the bending portion (101) is greater than the maximum height of the semiconductor chip (30) accommodated in the opening (105) and mounted on the circuit board (10).

[0105] When an opposing object presses the electrically conductive gasket (100) in a vertical direction, the powder included in the support layer (142) and the support portion (102) serve to prevent the object from being pressed so as to contact the surface of the semiconductor chip (30), so that the support portion (102) can mechanically protect the semiconductor chip (30) and shield electromagnetic waves.

[0106] In this case, the support layer (142) preferably contains electrically conductive powder and has electrical conductivity.

[0107] When the electrically conductive gasket (100) of this structure is pressed against an opposing electrically conductive object, the support layer (142) has electrical conductivity and can more fully shield electromagnetic waves flowing in or flowing out in the horizontal direction of the semiconductor chip (30) accommodated in the opening (105) that is not covered with the electrically conductive film (110).

[0108] As described below, when the height of the semiconductor chip (30) is higher than the maximum height of the bending portion (101) of the electrically conductive gasket (100), or when necessary, the electrically conductive gasket (100) may not be mounted directly on the circuit board, but may be mounted on a shield case or shield frame soldered on the circuit board to shield electromagnetic waves by surrounding the semiconductor chip mounted on the circuit board.

[0109] In this case, the electrically conductive gasket (100) mounted on the shield case or shield frame has elasticity and makes electrical contact with the opposing electrically conductive mechanism covering the shield case or shield frame.

[0110] As shown in Fig. 4, it is considered that the electrically conductive gasket (100) of the present invention is applied by being pressed between opposing objects.

[0111] The electrically conductive gasket (100) may be mounted on the circuit board (10) by soldering the lower surface of the bending portion (101) to the circuit board (10) with solder (20), or by adhesive tape (150) being adhered to the metal layer (130) on the lower surface of the electrically conductive gasket (100) corresponding to the support portion (102) excluding the opening (105) and the bending portion (101). That is, the electrically conductive gasket (100) may be attached to the circuit board (10) or the electrically conductive object by soldering or adhesive tape.

[0112] Preferably, the electrically conductive gasket (100) provides a space for vacuum pickup in the support (102), so that surface mounting by vacuum pickup is possible.

[0113] Fig. 5 is an exploded view showing an electromagnetic shielding device according to an embodiment of the present invention, and Fig. 6 is a cross-sectional view showing an integrated electromagnetic shielding device.

[0114] An electromagnetic shielding device comprises a metal shield case (180) having an opening (185) formed on an upper surface and a flange (182, 183) formed along an edge of the opening (185), and an electrically conductive gasket (100) attached on the flange (182, 183).

[0115] Since the electrically conductive gasket (100) has the same structure as the electrically conductive gasket (100) according to the embodiment of FIG. 3, a detailed description thereof is omitted.

[0116] The electromagnetic shielding device is preferably vacuum-picked up at the conductive gasket (100) portion so that it can be surface-mounted on an object such as a circuit board, but it may also be vacuum-picked up at a flange (182, 183) where the conductive gasket (100) is not formed.

[0117] Preferably, the electrically conductive gasket (100) corresponds to the soldering temperature, the metal shield case (180) is mounted on a circuit board or the like by soldering, and the height of the metal shield case (180) may be higher than the maximum height of the electrically conductive gasket (100).

[0118] The size of the opening (185) of the metal shield case (180) corresponds to the size of the semiconductor chip mounted on the circuit board and may be smaller than or equal to the size of the opening (105) of the electrically conductive gasket (100), and each may be formed one or more times.

[0119] The electrically conductive gasket (100) is pressed with a small force at a thin thickness and has elastic restoring force, and is interposed to be pressed against the opposing metal shield case (180) and the cooling unit, thereby shielding electromagnetic waves or providing electrical connection.

[0120] The electrically conductive gasket (100) can be soldered to the object by soldering cream or attached to the object by an adhesive tape (150) adhered to the electrically conductive gasket (100).

[0121] The electrically conductive gasket (100) is mounted by soldering the lower surface of the bending portion (101) to the flange (182) of the metal shield case (180) using solder (20), and an adhesive tape (150) is attached to the metal layer (130) on the lower surface of the electrically conductive gasket (100) corresponding to the support portion (102) excluding the opening (105) and the bending portion (101), so that the gasket can be mounted on the flange (183).

[0122] Figure 7 shows a state in which an electromagnetic shielding device is applied.

[0123] At least one semiconductor chip (30) is mounted on a circuit board (10), and an integrated electromagnetic shielding device is mounted on the circuit board (10) to surround the semiconductor chip (30).

[0124] Here, the semiconductor chip (30) includes not only a single semiconductor chip but also a semiconductor chip mounted on a sub-circuit board.

[0125] The height of the upper surface of the semiconductor chip (30) is lower than the maximum height of the bending portion (101) of the electrically conductive gasket (100), and a thermoelectric member (300) having a thickness corresponding to the height difference is interposed between the semiconductor chip (30) and the cooling unit (40).

[0126] The thermoelectric member (300) may be in a gel or grease state, and after the electromagnetic shielding device is soldered to the circuit board (10), the thermoelectric member (300) may be formed on the upper surface of the semiconductor chip (30).

[0127] According to this structure, electromagnetic waves flowing into or flowing out of the semiconductor chip (30) can be shielded in all directions by the integrated electromagnetic shielding device, thereby increasing the reliability of electromagnetic shielding, and at the same time, heat emitted from the semiconductor chip (30) can be quickly transferred to the cooling unit through a thin thermoelectric member.

[0128] Here, the electrically conductive gasket (100) may be attached to the flange of the metal shield case (180) while the metal shield case (180) is mounted on the circuit board (10) to form an electromagnetic shielding device, or the electrically conductive gasket (100) may be attached to the flange of the metal shield case (180) to form an integrated electromagnetic shielding device, and then the integrated electromagnetic shielding device may be mounted on the circuit board (10).

[0129] Referring to Fig. 7, when the cooling unit (40) presses the electrically conductive gasket (100) in the vertical direction, the bending portion (101) first contacts and is pressed against the cooling unit (40), and then the cooling unit (40) presses the support portion (102).

[0130] At this time, if powder is dispersed on the support layer (142), as described above, the powder acts as a spacer, thereby preventing the cooling unit (40) from contacting and pressing the surface of the semiconductor chip (30), so that the support member (102) can mechanically protect the semiconductor chip (30) and shield electromagnetic waves.

[0131] In particular, when the powder included in the support layer (142) is an electrically conductive powder, it is possible to shield more electromagnetic waves flowing in or out in the horizontal direction of the semiconductor chip (30) from both ends that are not wrapped with the polymer film (120).

[0132] Figure 8 shows an electrically conductive gasket according to another embodiment of the present invention.

[0133] The electrically conductive film (210) is bent so that the adhesive layer (240) is positioned on the inside on both sides to form a bending portion (201). Unlike the above embodiment, an internal space is not formed in the bending portion (201), and the adhesive layers (240) inside are bonded to each other to form a support layer (242).

[0134] Accordingly, an adhesive layer (240) is bonded to both the bending portion (201) and the support portion (202) formed by the electrically conductive film (210) to form a support layer (242).

[0135] An opening (205) is formed in the support member (202) to penetrate the electrically conductive gasket (200) in the thickness direction.

[0136] According to this structure, the support part (202) maintains the same height up to the boundary of the bending part (201) indicated by a dotted line in Fig. 8, so that the maximum height of the bending part (201) is the same as the maximum height of the support part (202), and the height at the bending part (201) decreases toward the end, so that the cross-section forms a semi-elliptical shape.

[0137] While the above description focuses on specific embodiments of the present invention, those skilled in the art will appreciate that various modifications and variations can be made. These modifications and variations, as long as they do not depart from the scope of the present invention, are considered to be within the scope of the present invention. The scope of the present invention should be determined by the claims set forth below.

Claims

1. An electrically conductive gasket that is interposed between opposing objects to shield electromagnetic waves or provide electrical connection. The above-mentioned electrically conductive gasket comprises an electrically conductive member and an electrically conductive film comprising an elastic curable adhesive layer bonded to the electrically conductive member by curing. The above-mentioned electrically conductive film is bent in a curved manner on both sides of the width direction of the electrically conductive gasket so that the adhesive layer is positioned on the inside, thereby forming a bending portion having one internal space extending in the length direction of the electrically conductive gasket. Except for the above bending portion, the adhesive layers are bonded to each other in the overlapping portion where the electrically conductive films face each other to form a support layer, and a support portion is formed by the overlapping portion of the electrically conductive films and the support layer. The maximum height of the above bending portion is higher than the maximum height of the above support portion, An electrically conductive gasket characterized in that when the object presses the gasket, the gasket makes elastic contact with the object due to the elastic restoring force of the bending portion.

2. In claim 1, The above-mentioned electrically conductive member is a polymer film having a metal layer formed on one side and an adhesive layer adhered to the other side, or an electrically conductive fiber to which the adhesive layer is adhered. An electrically conductive gasket characterized in that the metal layer is formed by plating or is composed of a metal foil.

3. In claim 1, An electrically conductive gasket characterized in that the support portion is flat and both ends of the electrically conductive member are positioned on the lower surface of the support portion.

4. In claim 3, An electrically conductive gasket characterized in that a plurality of micro-cavities formed by air smaller than the internal space are formed in the support layer, thereby making the support portion softer.

5. In claim 1, An electrically conductive gasket characterized in that the cross-section of the electrically conductive gasket is symmetrical in the width direction.

6. In claim 1, An electrically conductive gasket characterized in that the cross-sectional shape of the above-mentioned bending portion is a circular or oval shape in which the height of the middle portion in the horizontal direction is the maximum height.

7. In claim 1, An adhesive tape is adhered on the electrically conductive member formed on the lower surface of the above support, An electrically conductive gasket characterized in that the adhesive tape does not protrude beyond the lowermost portion of the bending portion, so that the electrically conductive member of the lower surface of the bending portion directly contacts the object.

8. In claim 1, An electrically conductive gasket characterized in that at least one opening is formed in the support portion to penetrate the electrically conductive gasket in the thickness direction.

9. In claim 8, An electrically conductive gasket characterized in that the maximum height of the gasket in the above bending portion is greater than the maximum height of a semiconductor chip accommodated in the above opening and mounted on a circuit board.

10. In claim 8, An electrically conductive gasket characterized in that an electrically conductive powder is mixed into the support layer, and electromagnetic waves flowing into or out of the semiconductor chip accommodated in the opening through the support layer in a direction in which the bending portion is not formed are shielded.

11. In claim 1, The above electrically conductive member is, A polymer film having a metal layer formed on one side or having electrically conductive fibers adhered thereto; and An electrically conductive gasket characterized in that it comprises a flat reinforcing sheet having one side bonded to the other side of the polymer film and the adhesive layer bonded to the other side.

12. In claim 1, In the above bending portion, the adhesive layers are not bonded to each other, so that an internal space surrounded by the electrically conductive film is formed, or An electrically conductive gasket characterized in that the adhesive layers are bonded to each other at the bending portion and connected to the support layer.

13. It is an electromagnetic shielding device that surrounds a semiconductor chip mounted on a circuit board and shields electromagnetic waves. The above electromagnetic shielding device comprises a metal shield case having an opening formed on the upper surface and a flange formed along the edge of the opening, and an electrically conductive gasket attached to the upper surface of the flange. The above-mentioned electrically conductive gasket comprises an electrically conductive member and an electrically conductive film comprising a curable adhesive layer having elasticity bonded to the electrically conductive member by curing, The above-mentioned electrically conductive film is bent in a curved manner on both sides of the width direction of the gasket so that the adhesive layer is positioned on the inside, thereby forming a bending portion having one internal space extending in the length direction of the electrically conductive gasket. Except for the above bending portion, the adhesive layers are bonded to each other in the overlapping portion where the electrically conductive films face each other to form a support layer, and a support portion is formed by the overlapping portion of the electrically conductive films and the support layer. An opening is formed in the support portion to penetrate the electrically conductive gasket in the thickness direction, The maximum height of the above bending portion is higher than the maximum height of the above support portion, When the object presses the electrically conductive gasket, the object is elastically contacted by the elastic restoring force of the bending portion, An electromagnetic shielding device characterized in that the surface of the semiconductor chip is exposed to the outside through the opening of the gasket and the opening of the shield case.

14. In claim 13, An electromagnetic shielding device characterized in that the opening of the metal shield case and the opening of the electrically conductive gasket correspond to each other so that the surfaces of two or more semiconductor chips are exposed to the outside.

15. In claim 13, An electromagnetic shielding device characterized in that the electrically conductive gasket is mounted on the inside of the edge of the metal shield case.

16. In claim 13, An electromagnetic shielding device characterized in that the electrically conductive gasket corresponds to a soldering temperature, the metal shield case is solderable, and the electromagnetic shielding device is capable of surface mounting by vacuum pickup in the electrically conductive gasket portion.

17. Applies to the electromagnetic shielding device of claim 13, An electromagnetic shielding device mounting structure characterized in that the support portion of the electrically conductive gasket is attached to the lower surface of the cooling unit via an adhesive means, and the bending portion of the electrically conductive gasket contacts the flange of the metal shield case mounted on the circuit board facing the electromagnetic shielding device to form the electromagnetic shielding device.

18. In claim 17, An electromagnetic shielding device mounting structure characterized in that the surface of the semiconductor chip and the lower surface of the cooling unit are thermally coupled through a thermoelectric member through an opening of the metal shield case and an opening of the electrically conductive gasket.

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