COOLING DEVICES

Abstract

The invention relates to a heat dissipation device comprising: an evaporator plate assembly structured to make surface thermal contact with the heat-generating surface of a heat-generating element for the purpose of receiving heat, and to form a storage unit for the storage of liquid refrigerant; multiple condenser plate assemblies linked to the evaporator plate assembly and structured to create a refrigerant circulation space in which the vaporized refrigerant, phase-changed in the storage unit, is diffused and condensed; and a mounting plate structured to cover the storage unit of the evaporator plate assembly and to facilitate the connection of multiple condenser plate assemblies to the evaporator plate assembly; in which a sintered block is structured to receive heat of a defined temperature or higher from the heat-generating element and to vaporize the liquid refrigerant into a vapor refrigerant arranged within the storage unit of the evaporator plate assembly, thereby maximizing the heat dissipation efficiency of the heat dissipation device.

Description

heat sink

[0001] The present invention relates to a heat dissipation apparatus, and more particularly, to a heat dissipation apparatus that can prevent physical shaking due to an increase in internal pressure occurring during the gas-liquid circulation of a refrigerant and achieve a shorter gas-liquid circulation cycle.

[0002] In diverse industries such as communications, electronics, and electricity, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Therefore, the development of appropriate cooling systems is essential.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving, advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues, and heat dissipation devices are being developed to address this issue.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009] In addition, the heat transferred to the radiator should be used for the phase change of the refrigerant as much as possible, but if the energy is used for the shaking (flow) of the radiator itself due to the increase in internal pressure, the gas-liquid circulation cycle becomes long, which may have the problem of lowering the heat dissipation performance.

[0010]

[0011] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation device that can minimize the conversion of heat energy into physical force required for the phase change of a liquid refrigerant into a gaseous refrigerant, thereby shortening the gas-liquid circulation cycle per unit time, and thereby inducing more active gas-liquid circulation.

[0012] In addition, another object of the present invention is to provide a heat dissipation device capable of improving heat dissipation performance by inducing rapid capture and movement of liquid refrigerant, which is a condensed gaseous refrigerant, to a portion close to a heating element.

[0013] The tasks of the present invention are not limited to the tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0014]

[0015] A heat dissipation device according to one embodiment of the present invention includes an evaporation plate assembly which receives heat by making surface thermal contact with a heating surface of a heating element and has a storage portion formed in which liquid refrigerant among refrigerants is stored, a plurality of condensation plate assemblies which are coupled to the evaporation plate assembly and provide a refrigerant flow space in which a phase-changed gaseous refrigerant in the storage portion diffuses and condenses, and a mounting panel which shields the storage portion of the evaporation plate assembly and mediates the coupling of the plurality of condensation plate assemblies to the evaporation plate assembly, and a sintered block which receives heat having a predetermined temperature or higher from the heating element and evaporates the liquid refrigerant into gaseous refrigerant is disposed inside the storage portion of the evaporation plate assembly.

[0016] Here, the sintered body block is formed by sintering a predetermined metal powder, and can be arranged to occupy a portion of the storage section of the evaporation plate assembly.

[0017] In addition, the sintered block can be attached to the bottom surface of the storage unit, the lower surface of which is relatively lower with respect to the direction of gravity.

[0018] Additionally, the sintered body block can be mounted on the bottom surface of the storage unit so that its upper surface is spaced apart from the mounting panel corresponding to the upper side of the storage unit by a predetermined distance.

[0019] In addition, the sintered body block can be installed at a predetermined distance from one end and the other end in the longitudinal direction of the storage unit.

[0020] Additionally, the range in which heat above the predetermined temperature is transferred can be defined as between one end and the other end in the longitudinal direction of the storage unit.

[0021] Additionally, the sintered body block can be formed by sintering a metal powder made of copper (Cu).

[0022] Additionally, a plurality of rigid reinforcing columns, each having at least an upper end thereof to support a lower surface of the mounting panel, may be installed inside the storage compartment of the evaporation plate assembly.

[0023] In addition, the plurality of rigid reinforcement columns may include an outer column that simultaneously supports the bottom surface of the storage unit and the lower surface of the mounting panel, and a mid column that simultaneously supports the upper surface of the sintered block and the lower surface of the mounting panel.

[0024] Additionally, a plurality of support grooves may be formed on the upper surfaces of the outer column and the mid column to be sunken downward and to support a portion of the lower part of each of the plurality of condenser plate assemblies.

[0025] Additionally, the plurality of support grooves may be spaced apart from each other to correspond to the widthwise spacing distance of the plurality of condenser plate assemblies.

[0026] In addition, the outer column may be arranged in close contact with one end and the other end of the longitudinal direction of the sintered block, which is supported on the bottom surface of the storage unit at the lower surface and supported on the lower surface of the mounting panel at the upper surface, and is arranged at a predetermined distance apart from one end and the other end of the longitudinal direction of the storage unit at the respective ends.

[0027] Additionally, a plurality of liquid coolant collection holes may be formed in the outer column, the upper height of which is lower than the upper surface height of the sintered body block.

[0028] In addition, the plurality of liquid refrigerant collection holes may be formed to be connected to one end and the other end in the longitudinal direction of the sintered body block, respectively.

[0029] In addition, the liquid refrigerant located in the storage unit corresponding to the outer side of the outer column based on one end and the other end of the sintered body block can be absorbed and distributed to the sintered body block through the plurality of liquid refrigerant collection holes.

[0030] In addition, the plurality of condensing plate assemblies may each include a heat-conducting panel on one side formed of a metal panel member having a thermal conductivity of a predetermined level or higher and processed into sheet metal by a press molding process, and a heat-conducting panel on the other side formed of a metal panel member identical to the one side heat-conducting panel and processed into sheet metal by a press molding process, and may further include at least one liquid refrigerant induction column that induces the condensed liquid refrigerant in the refrigerant flow space to be close to one end and the other end of the sintered body block.

[0031] In addition, the liquid refrigerant induction columns may be arranged in a manner such that the width gradually narrows toward the bottom with respect to the direction of gravity when a pair of them is arranged at a predetermined distance apart.

[0032] In addition, the liquid refrigerant induction columns may be arranged in a manner such that the width gradually increases toward the bottom with respect to the direction of gravity when a pair of them is arranged at a predetermined distance apart.

[0033] In addition, when the liquid refrigerant induction column is arranged in a single unit, the upper end may be arranged to be close to one end or the other end of the sintered body block, and the lower end may be arranged to be close to one end or the other end of the sintered body block.

[0034] Additionally, the heat sink may further include a plurality of fin reinforcement panels arranged between each of the plurality of condenser plate assemblies, each of which supports an outer surface of an adjacent condenser plate assemblies.

[0035] Additionally, the plurality of pin reinforcement panels may be formed in a wave-like manner to have a vertical cross-section in a wave-like shape in the vertical direction.

[0036] Additionally, the plurality of pin reinforcement panels may be formed in a wave-like manner to have a horizontal cross-section in a wave shape in the longitudinal direction.

[0037] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel may be metal panel members made of SUS material.

[0038]

[0039] According to the heat dissipation device according to the present invention, there is an effect of preventing physical shaking due to an increase in internal pressure occurring during the gas-liquid circulation of the refrigerant, and improving heat dissipation performance by shortening the gas-liquid circulation cycle per unit time and thereby activating the gas-liquid circulation.

[0040] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0041]

[0042] Figures 1a and 1b are a downward perspective view and an upward perspective view showing a heat dissipation device according to one embodiment of the present invention,

[0043] Figures 2a and 2b are exploded perspective views of Figures 1a and 1b,

[0044] Figure 3 is a perspective view showing the evaporation plate assembly and mounting panel of the configuration of Figure 1.

[0045] Figure 4 is an exploded perspective view of Figure 3,

[0046] Figure 5 is a left side view of Figure 1a,

[0047] Figure 6 is a cross-sectional view taken along line AA of Figure 5.

[0048] Figure 7 is an exploded perspective view of a single condenser assembly in the configuration of Figure 1a, with the assembly separated.

[0049] Figure 8 is a perspective view showing a pair of condenser plate assembly for explaining the pin-reinforced panel among the configurations of Figure 1a.

[0050] Figure 9 is an exploded perspective view of Figure 8,

[0051] Fig. 10 is a perspective view showing a single evaporation plate assembly among the configurations of Fig. 1a.

[0052] Figure 11 is an exploded perspective view of Figure 10,

[0053] Fig. 12 is a cross-sectional view taken along the line BB of Fig. 5, showing various implementation examples of the pin column bar.

[0054] Fig. 13 is a cross-sectional view taken along line CC of Fig. 1a,

[0055] Fig. 14 is a cutaway perspective view of Fig. 13 and an enlarged view of a portion thereof.

[0056]

[0057] <Explanation of symbols>

[0058] 1: Heat sink 50: Air vent tube

[0059] 100: Evaporation plate assembly 110: Storage unit

[0060] 160: Sintered block 170: Reinforced column

[0061] 171: Outer column 171h: Liquid refrigerant collection hole

[0062] 173: Mid Column 173h: Dispersion Hole

[0063] 174: Support groove 175: Guide pin

[0064] 200: Condensing plate assembly 200A: One-sided heat-conducting panel

[0065] 200B: Other side heat conduction panel 205: Refrigerant flow space

[0066] 210; edge end 230; strength reinforcement

[0067] 250: Refrigerant induction column 290: Fin reinforcement panel

[0068] 300: Mounting panel 310: Installation slit

[0069]

[0070] Hereinafter, a heat dissipation device according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0071] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0072] When describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0073]

[0074] FIGS. 1A and 1B are downward perspective views and upward perspective views showing a heat dissipation device according to one embodiment of the present invention, and FIGS. 2A and 2B are exploded perspective views of FIGS. 1A and 1B.

[0075] A heat dissipation device (1) according to embodiments of the present invention may include, as shown in FIGS. 1A to 2B, a storage unit (see reference numeral '110' in FIG. 2A and below) in which a refrigerant capable of phase change depending on temperature is stored, an evaporation plate assembly (100) in which at least a portion of a lower surface is in surface thermal contact with a heating surface of heating elements (not shown), and a plurality of condensation plate assemblies (200) that are connected to the evaporation plate assembly (100) so as to be in communication with the storage unit (110) and release heat transferred from the heating elements through heat exchange with external air (outside air).

[0076] Here, the evaporator assembly (100) may be formed in surface thermal contact with the heating surface of a heating element (not shown), and a storage unit (110) in which liquid refrigerant is stored among the refrigerants may be formed.

[0077] At this time, the heating element may be an electrically driven electric field element, and a representative example is a system semiconductor element that receives electrical energy to drive the system and emits a certain amount of heat, but is not necessarily limited thereto, and any electric field element that generates heat when the system is driven can be included.

[0078] Meanwhile, a plurality of condensing plate assemblies (200) are connected to the evaporating plate assembly (100) via a mounting panel (300) described later, and can serve to cause the liquid refrigerant stored in the storage unit (110) to diffuse and condense the phase-changed gaseous refrigerant by heat supplied from heating elements (not shown).

[0079] More specifically, the plurality of condensing plate assemblies (200) are configured to be positioned relatively higher in the direction of gravity than the evaporating plate assembly (100), and generally provide a space (refrigerant flow space (205) described below) in which liquid refrigerant is transformed into gaseous refrigerant by the evaporating plate assembly (100) and then diffuses, while also providing a space in which gaseous refrigerant can condense back into liquid refrigerant through heat exchange with the outside air and naturally flow down in the direction of its own weight.

[0080] The evaporator assembly (100) is arranged parallel to the heating surfaces of the heating elements, but can be arranged horizontally so that the liquid refrigerant stored in the storage unit (110) is not biased.

[0081] In addition, the evaporation plate assembly (100) is provided in the form of a metal panel with a roughly rectangular shape and thin upper and lower thickness, and the storage section (110) formed on the upper part can also be formed in a rectangular groove shape with a long longitudinal distance between one end and the other end.

[0082] Here, the evaporator assembly (100) can receive heat from the heating surfaces of heating elements (not shown) that are electrically driven, such as electronic devices, and inevitably generate heat, and perform the function of evaporating the liquid refrigerant stored in the storage unit (110) into a gaseous refrigerant.

[0083] To this end, a thermal contact portion (105) that directly contacts the surface of the heating surface of the heating elements can be formed on the lower surface of the evaporation plate assembly (100).

[0084] In addition, since the evaporator assembly (100) performs the role of changing the liquid refrigerant stored in the storage unit (110) into a gaseous refrigerant by using the heat supplied from the heating elements, it is preferable to be equipped with a metal material having excellent thermal conductivity, and among the metal materials, copper (Cu) material, which is currently the most suitable in terms of cost and performance in the relevant industrial field, can be adopted.

[0085] In addition, the condensing plate assembly (200) is provided to communicate with the storage unit (110) of the evaporating plate assembly (100) via the mounting panel (300), and can discharge heat supplied from the heating elements to the outside through heat exchange with the outside air (outside air) during the process in which the phase-changed gaseous refrigerant in the evaporating plate assembly (100) diffuses and flows and condenses back into a liquid refrigerant.

[0086] Fig. 3 is a perspective view showing the evaporation plate assembly and mounting panel of the configuration of Fig. 1, and Fig. 4 is an exploded perspective view of Fig. 3.

[0087] As shown in FIGS. 3 and 4, the evaporation plate assembly (100) may have a storage section (110) formed in the shape of a groove of a predetermined depth so as to have a horizontal cross-section of approximately a rectangle in the center of the upper surface.

[0088] Here, in the storage unit (110), liquid refrigerant is stored, and the upper open portion can be shielded by a mounting panel (300) described later that mediates the connection of the condensing plate assembly (200) to the evaporating plate assembly (100).

[0089] More specifically, a plurality of condenser plate assemblies (200) can be coupled to an evaporator plate assembly (100) via a mounting panel (300). Here, when the evaporator plate assembly (100) is provided in a rectangular panel shape with roughly rounded corners, the mounting panel (300) can also be provided in a panel shape that can completely cover the upper surface of the evaporator plate assembly (100).

[0090] Here, the mounting panel (300) is provided to cover the storage section (110) of the evaporation plate assembly (100), and may serve to support portions of a plurality of condensation plate assemblies (200) by inserting them.

[0091] To this end, a plurality of installation slits (310) into which a plurality of condenser plate assemblies (200) are individually inserted are formed longitudinally in the mounting panel (300), and can be cut to communicate with the storage unit (110) and the refrigerant flow space (205) of the plurality of condenser plate assemblies (200).

[0092] That is, a plurality of condensing plate assemblies (200) are individually installed in a plurality of installation slits (310) formed in a mounting panel (300), but are sealedly installed in the mounting panel (300) so as to prevent leakage of refrigerant to the outside while communicating with the refrigerant flow space (205) of the plurality of condensing plate assemblies (200), thereby shielding the storage unit (110) of the evaporating plate assembly (100) from the outside.

[0093] A plurality of screw assembly holes (102) and a plurality of screw fastening holes (302) may be formed at the edge end of the evaporation plate assembly (100) and the edge end of the mounting panel (300), respectively, for mutual assembly through a mounting fastening member (not shown) described later.

[0094] More specifically, the plurality of screw assembly holes (102) may include a first assembly hole (102-1) formed to penetrate vertically through one longitudinal end and the other longitudinal end of the edge end of the evaporation plate assembly (100), and a second assembly hole (102-2) formed to penetrate vertically through the middle portion of the widthwise end of the edge end of the evaporation plate assembly (100).

[0095] In addition, a plurality of screw fastening holes (302) may also be formed in the mounting panel (300), and may include a first fastening hole (302-1) formed to penetrate vertically at a position corresponding to the first assembly hole (102-1) of the evaporation plate assembly (100) described above, and a second fastening hole (302-2) formed to penetrate vertically at a position corresponding to the second assembly hole (102-2) of the evaporation plate assembly (100).

[0096] Here, the mounting fastening member can be fastened via a fastening boss (not shown) that is coupled to a plurality of screw assembly holes (102) and a plurality of screw fastening holes (302).

[0097] The evaporator assembly (100) and the mounting panel (300) joined by the mounting fastening member can be sealed to prevent the liquid refrigerant (or gaseous refrigerant) stored in the internal storage (110) from leaking.

[0098] Here, since the liquid refrigerant needs to be prevented from leaking not only between the evaporator plate assembly (100) and the mounting panel (300), but also between the plurality of installation slits (310) formed in the mounting panel (300) and the plurality of condenser plate assemblies (200) coupled thereto, each of the plurality of condenser plate assemblies (200) can be coupled in a coupling manner that can prevent leaking, such as welding, when coupled to the plurality of installation slits (310).

[0099] In addition, a vacuum groove (104) for installing a ventilation tube (50) described later can be further processed and formed in a groove shape at least at one end of the edge of the evaporation plate assembly (100).

[0100] More specifically, the vacuum groove (104) may be formed to be in communication with the storage (110). In particular, the vacuum groove (104) may be formed in a groove shape in which a portion of the edge end of the evaporation plate assembly (100) is removed, but may be formed in a form in which at least a portion of the end in contact with the storage (110) is removed.

[0101] Meanwhile, at least one of the edge ends of the mounting panel (300) may be formed so as to be in communication with the vacuum groove (104) at a position corresponding to the vacuum groove (104) of the evaporator assembly (100), and a tube installation hole (304) for fixed installation of the air vent tube (50) described later may be formed through the vacuum groove (104).

[0102] In a heat dissipation device (1) according to one embodiment of the present invention, when a refrigerant that undergoes a phase change, such as a condensation plate assembly (200), is filled inside, a vacuuming process for evacuating the refrigerant flow space (205) to correspond to the change in internal pressure that occurs during the phase change is essential, and the above-described vacuuming process can be performed through an air vent tube (50) coupled through a vacuum groove (104) of an evaporation plate assembly (100) and a tube installation hole (304) of a mounting panel (300).

[0103] After the vacuum process is completed, an air tube caulking process may be performed to block ventilation from the outside after cutting off the air vent tube (50). However, it is not necessary to cut off the air vent tube (50), and it is sufficient to perform the caulking process to block the air flow path of the air vent tube (50).

[0104] Meanwhile, in a heat dissipation device (1) according to one embodiment of the present invention, as referenced in FIGS. 3 and 4, a sintered block (160) that receives heat above a predetermined temperature from a heating element(s) and evaporates liquid refrigerant into gaseous refrigerant may be placed inside a storage unit (110) of an evaporation plate assembly (100).

[0105] The sintered block (160) may be formed by sintering a predetermined metal powder. In addition, the sintered block (160) may be arranged to occupy a portion of the storage section (110) of the evaporation plate assembly (100).

[0106] At this time, the sintered block (160) can be attached to the bottom surface of the storage unit (110) with its lower surface being relatively lower with respect to the direction of gravity. In addition, the sintered block (160) can be placed on the bottom surface of the storage unit (110) with its upper surface being spaced apart from the mounting panel (300) corresponding to the upper side of the storage unit (110) by a predetermined distance.

[0107] More specifically, the thickness of the sintered block (160) is formed to a size such that it is placed on the bottom surface of the storage unit (110) while its upper surface does not come into contact with the mounting panel (300).

[0108] Here, when the storage unit (110) of the evaporation plate assembly (100) is formed in a rectangular shape in the longitudinal direction, the sintered body block (160) has a shape that is approximately close to a square and can be placed in the central part excluding each part of one end and the other end in the longitudinal direction of the storage unit (110).

[0109] More specifically, the sintered body block (160) can be installed at a predetermined distance from one end and the other end in the longitudinal direction of the storage unit (110).

[0110] Therefore, the range in which the above-described sintered block (160) receives heat above a predetermined temperature can be defined as between one end and the other end in the longitudinal direction of the storage unit (110).

[0111] When the liquid refrigerant condensed through heat exchange with the outside air (outside air) in the refrigerant flow space (205) of the plurality of condensing plate assemblies (200) described later flows downward in the direction of gravity, if it falls on the upper surface of the sintered block (160), it is absorbed and stored through the upper surface of the sintered panel (160), and if it falls between each part of one end and the other end of the storage unit (110) where the sintered block (160) is not provided, it can be absorbed and stored inside the sintered block (160) through each thickness part (side surface) of the sintered block (160).

[0112] And, among the components of the heat dissipation device (1) according to one embodiment of the present invention, the evaporation plate assembly (100) described above and at least one guide fin (175) described below can be redefined as a heat transfer plate assembly for substantially transferring heat generated from the heating element(s) to the condensation plate assembly (200) described above.

[0113] That is, the heat transfer plate assembly may further include at least one guide pin (175) to guide the above-described evaporation plate assembly (100) and the mounting panel (300) when they are combined.

[0114] At least one guide pin (175) can identify the correct position to be coupled when inserted into the guide pin installation hole (106, 306) formed in the evaporation plate assembly (100) and the mounting panel (300), and can also play a role in inducing the coupling between them in the correct position.

[0115] More specifically, at the edge end of the evaporation plate assembly (100), guide pin installation holes (106) for inserting and installing at least one guide pin (175) are formed at three locations spaced apart from each other, and can also be formed at three locations spaced apart from each other at the same location on the mounting panel (300).

[0116] Here, the upper part of the guide pin (175) is inserted into the guide pin installation hole (106) of the evaporation plate assembly (100) and protrudes a predetermined length toward the upper surface of the evaporation plate assembly (100), and then is inserted into the guide pin installation hole (306) of the mounting panel (300) when the mounting panel (300) is installed, thereby enabling installation in the correct position.

[0117] For reference, a total of four guide pin installation holes (306) of the mounting panel (300) are formed, and one of the four guide pin installation holes (306) where the vacuum groove (104) described above is formed can be designed to be replaced with the tube installation hole (304) described above.

[0118] In addition, the lower end of the guide pin (175) also protrudes a predetermined length toward the lower surface of the evaporation plate assembly (100), and the protruding lower end of the guide pin (175) can serve as a mediator for coupling with a configuration such as a housing (not shown) equipped with additional components or heating elements that are additionally installed.

[0119] At least one guide pin (175) like this may be formed of a ceramic material.

[0120] FIG. 5 is a left side view of FIG. 1a, FIG. 6 is a cross-sectional view taken along line AA of FIG. 5, FIG. 7 is an exploded perspective view of a single condenser plate assembly of the configuration of FIG. 1a in a separated state, FIG. 8 is a perspective view showing a pair of condenser plate assembly for explaining a pin-reinforced panel of the configuration of FIG. 1a, and FIG. 9 is an exploded perspective view of FIG. 8.

[0121] Inside the storage section (110) of the evaporation plate assembly (100), as referenced in FIGS. 3 to 9, a plurality of rigid reinforcement columns (170) having at least the upper portion thereof configured to support the lower surface of the mounting panel (300) can be installed.

[0122] More specifically, a plurality of rigid reinforcement columns (170) may be provided to simultaneously support the bottom surface of the storage unit (110) and the lower surface of the mounting panel (300), or to simultaneously support the upper surface of the sintered block (160) and the lower surface of the mounting panel (300).

[0123] Here, the plurality of rigid reinforcement columns (170) may include an outer column (171) that simultaneously supports the bottom surface of the storage unit (110) and the lower surface of the mounting panel (300) and a mid column (173) that simultaneously supports the upper surface of the sintered block (160) and the lower surface of the mounting panel (300).

[0124] On the upper surface of the outer column (171) and the mid column (173), a plurality of support grooves (174) may be formed to be sunken downward and to support a portion of the lower part of each of the plurality of condenser plate assemblies (200).

[0125] Here, since the plurality of support grooves (174) each support the plurality of condenser plate assemblies (200), it is preferable that they are spaced apart from each other to correspond to the widthwise spacing distance of the plurality of condenser plate assemblies (200).

[0126] Additionally, the width direction size of the plurality of support grooves (174) can be formed to correspond to the thickness of the lower part of the individual condenser plate assembly (200).

[0127] Here, when a plurality of condensing plate assemblies (200) are installed so that a portion of the lower portion is immersed in the liquid refrigerant stored in the storage portion (110) of the evaporating plate assembly (100) through the installation slit (310) formed in the mounting panel (300), the assembly process can be stabilized by being installed so as to be supported by a plurality of support grooves (174) formed in the upper surface of the outer column (171) and the mid column (173) before being joined through various fixing methods such as welding.

[0128] In particular, the plurality of condenser plate assemblies (200) are each secured at their lower ends in a plurality of support grooves (174) formed at the upper ends of a plurality of outer columns (171) and mid columns (173), so that even when excessive external force is transmitted to the plurality of condenser plate assemblies (200), the bonding strength of various fixing methods, such as the welding method described above, can be maintained.

[0129] Meanwhile, the outer columns (171) can be arranged in pairs spaced apart from each other at one end and the other end in the longitudinal direction of the storage section (110) of the evaporation plate assembly (100).

[0130] More specifically, the outer column (171) may have its lower surface supported and fixed on the bottom surface of the storage unit (110), and its upper surface supported on the lower surface of the mounting panel (300).

[0131] At this time, as described above, the mounting panel (300) is formed with a plurality of installation slits (310) for installing a plurality of condenser plate assemblies (200), and the upper surface of the outer column (171) (including the mid column (173) described below) can be designed to support the lower surface of the mounting panel (300) where the plurality of installation slits (310) are not formed or the lower surface of the mounting panel (300) corresponding to the area between each installation slit (310).

[0132] Here, the outer column (171) can be placed in close contact with one end and the other end in the longitudinal direction of the sintered block (160), which are placed at a predetermined distance from one end and the other end in the longitudinal direction of the storage unit (110).

[0133] In the outer column (171), a plurality of liquid coolant collection holes (171h) smaller than the height of the upper surface of the sintered body block (160) can be formed.

[0134] A plurality of liquid refrigerant collection holes (171h) can be formed to be connected to one end and the other end in the longitudinal direction of the sintered body block (160).

[0135] A plurality of such liquid refrigerant collection holes (171h) are formed to be no larger than the thickness (the distance between the upper and lower surfaces) of the sintered block (160), so that when the liquid refrigerant condensed in the refrigerant flow space (205) of the condensing plate assembly (200) flows down to the storage section (110) of the evaporating plate assembly (100) at the lower side based on the direction of gravity, it seeps through the side wall portion of the sintered block (160) and is absorbed and dispersed.

[0136] Meanwhile, a pair of outer columns (171) closely arranged at both ends in the longitudinal direction of the sintered body block (160) can play a role in preventing the condensed liquid refrigerant in the refrigerant flow space (205) of the plurality of condensing plate assemblies (200) from overflowing to the outside when it falls directly to the upper part of the sintered body block (160).

[0137] This structure is a design that can contribute to greatly shortening the gas-liquid circulation cycle by allowing the liquid refrigerant that has fallen directly onto the sintered body block (160) to evaporate immediately in an area where it can be evaporated.

[0138] To this end, the outer column (171) is provided as a pair and is placed in close contact with one end and the other end of the sintered body block (160), but the height of the upper end thereof can be formed to be at least higher than the upper surface of the sintered body block (160).

[0139] Meanwhile, the mid column (173) can be arranged in pairs spaced apart from each other on the upper surface of the sintered block (160) corresponding to the outer column (171) provided in pairs.

[0140] Here, the lower surface of each of a pair of mid-columns (173) is supported on the upper surface of a sintered block (160), and a plurality of dispersion holes (173h) that serve as passages so that the phase-changed gaseous refrigerant in the sintered block (160) of the storage unit (110) of the evaporation plate assembly (100) is uniformly distributed throughout the upper portion of the sintered block (160) can be formed in the lower portion of the mid-column (173).

[0141] At this time, the plurality of dispersion holes (173h) also play a role in preventing uneven evaporation within the sintered body block (160) by allowing the liquid refrigerant to pass through and spread evenly when the condensed liquid refrigerant is excessively stored in the storage unit (110).

[0142] Meanwhile, the sintered body block (160) is formed by sintering metal powder, and at least a large number of pores can be formed through which liquid refrigerant can permeate by surface tension or capillary force.

[0143] At this time, the material of the metal powder may be copper (Cu). Here, a large number of pores may be naturally formed when the copper powder is sintered.

[0144] For reference, in the heat dissipation device (1) according to one embodiment of the present invention, the evaporation plate assembly (100) may be prepared by processing a metal panel made of the same copper (Cu) material as the sintered body block (160), and the condensation plate assembly (200) may be prepared by processing a base material panel made of SUS material having a lower thermal conductivity than copper.

[0145] The evaporator assembly (100) having such a configuration is provided so as to be in surface thermal contact with the heating surfaces of the heating elements, and can serve as a heat sink that changes the liquid refrigerant stored in the internal storage unit (110) into a gaseous refrigerant by the heat supplied from the heating elements.

[0146] The heating surface of the heating elements may be in direct surface thermal contact with the heat contact portion (105) on the lower surface of the evaporator assembly (100), or may be in indirect surface thermal contact via a heat transfer medium not shown.

[0147] The evaporation plate assembly (100) may be formed of a metal material with excellent thermal conductivity. Preferably, the evaporation plate assembly (100) may be formed of a copper (Cu) material, and, except for the edge end for joining the mounting panel (300), the portion where the storage unit (110) is formed, which directly receives heat from the heating elements, may be formed to have as thin a thickness as possible.

[0148] Meanwhile, a plurality of installation slits (310) for installing a plurality of condensation plate assemblies (200) at a distance from each other can be formed to penetrate in the vertical direction in the mounting panel (300) that shields the upper surface of the storage section (110) of the evaporation plate assembly (100).

[0149] More specifically, when the mounting panel (300) is provided with a rectangular metal panel member that is formed long in the left-right direction, and when the lower part (240) of the condensation plate assembly (200) is installed long in the left-right direction, a plurality of installation slits (310) can be formed to be spaced apart in the width direction defined in the front-back direction.

[0150] Here, the portion forming the storage portion (110) of the evaporation plate assembly (100) is a metal panel member made of copper (Cu) and has very weak strength (hardness), so the weak strength between the evaporation plate assembly (100) and the mounting panel (300) can be supplemented through the above-described plurality of rigid reinforcement columns (170).

[0151] FIG. 10 is a perspective view showing a single evaporation plate assembly of the configuration of FIG. 1a, FIG. 11 is an exploded perspective view of FIG. 10, FIG. 12 is a cross-sectional view taken along the line BB of FIG. 5, showing various implementation examples of the pin column bar, FIG. 13 is a cross-sectional view taken along the line CC of FIG. 1a, and FIG. 14 is a cut-away perspective view of FIG. 13 and an enlarged view thereof.

[0152] In a heat dissipation device (1) according to one embodiment of the present invention, a plurality of condensation plate assemblies (200) coupled to the upper surface of an evaporation plate assembly (100) via a mounting panel (300) may include a heat-conducting panel (200A) on one side and a heat-conducting panel (200B) on the other side, as referenced in FIGS. 10 to 14.

[0153] Here, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are metal panel members each having a predetermined or higher thermal conductivity, and can be processed into sheet metal using a press mold process.

[0154] More specifically, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be formed by sheet metal processing a metal panel member as a base material into a trapezoidal shape in which the upper and lower sides are parallel to each other, but the length of the lower side that is joined to the evaporation plate assembly (100) is shorter than the length of the upper side, through the press mold process described above.

[0155] That is, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are connected so as to protrude upwards perpendicular to the upper surface of the evaporator assembly (100), and the internal refrigerant flow space (205) gradually becomes wider as it goes upwards, so that the heat dissipation area with respect to the external air (outside air) can gradually increase.

[0156] In addition, a border end (210) for mutual bonding, a plurality of strength reinforcing parts (230) and a refrigerant flow space (205) described later can be simultaneously formed in the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) during sheet metal processing according to a press mold process.

[0157] More specifically, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) are processed into a shape symmetrical to each other through the press mold process described above, and then each edge end (210) except for the lower portion that is joined to the evaporator assembly (100) is joined through a joining process, thereby forming a refrigerant flow space (205) inside.

[0158] More specifically, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can be mutually bonded through a bonding process, with the edge end (210) and the plurality of strength reinforcing parts (230) simultaneously formed during sheet metal processing through a press mold process, so that the refrigerant flow space (205) excluding the lower part, which is the bonding portion for the evaporator assembly (100), can be shielded. At this time, the bonding process may include a welding method, and the welding method may include laser welding and brazing welding.

[0159] Meanwhile, a plurality of strength reinforcing members (230) can be formed in a dot shape or an oval shape by recessing the refrigerant flow space (205) inward from the outside of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) when processing sheet metal through a press mold process.

[0160] Here, a plurality of strength reinforcing members (230) are formed at mutually symmetrical positions on one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), and are provided so that the sunken areas in the refrigerant flow space (205) are mutually contacted, and the contacted areas can be joined by a welding method including a laser welding method or a brazing welding method.

[0161] The multiple strength reinforcing members (230) formed in this manner can also play a role in reinforcing the rigidity of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) during sheet metal processing by a press mold process.

[0162] In addition, when the refrigerant undergoes a phase change within the refrigerant flow space (205), the internal pressure may increase as a bulge pressure. At this time, the plurality of strength reinforcing members (230) prevent a change in the distance between the outer surfaces of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B), thereby allowing the heat energy provided from the heating elements to be not converted into physical force but only involved in the phase change of the refrigerant, thereby inducing smoother gas-liquid circulation.

[0163] Meanwhile, each of the plurality of condensing plate assemblies (200) may further include at least one liquid refrigerant induction column (250) that induces the condensed liquid refrigerant in the refrigerant flow space (205) to be close to one end and the other end of the sintered body block (160).

[0164] As shown in (a) and (b) of FIG. 12, when a pair of liquid refrigerant induction columns (250a, 250b) are arranged at a predetermined distance apart, the liquid refrigerant induction columns may be arranged in a manner such that the width gradually narrows toward the bottom in the direction of gravity (see (b) of FIG. 12) or the width gradually increases toward the bottom in the direction of gravity (see (a) of FIG. 12).

[0165] In this case, it is preferable that the lower ends of the liquid refrigerant induction columns (250a, 250b) are arranged to match one end and the other end of the sintered block (160), respectively.

[0166] In addition, when a single liquid refrigerant induction column (250c) is arranged as shown in (c) of FIG. 12, the column may be arranged to be inclined so that the upper end is close to one end of the sintered block (160) and the lower end is close to the other end of the sintered block (160), or conversely, the column may be arranged to be inclined so that the upper end is close to the other end of the sintered block (160) and the lower end is close to one end of the sintered block (160).

[0167] Referring to FIGS. 10 to 14, a method for manufacturing a condenser plate assembly (202) according to one embodiment of the present invention is briefly described as follows.

[0168] First, a metal panel member, preferably made of SUS material as a base metal panel member, can be manufactured by forming a heat-conducting panel (200A) on one side and a heat-conducting panel (200B) on the other side through sheet metal processing using a press mold process so that the left and right sides are symmetrical with respect to the middle part in the longitudinal direction.

[0169] In particular, during the press mold process, a refrigerant flow space (205) is formed with a predetermined thickness inside one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), and the edge ends (210) can be simultaneously processed and formed to be mutually joined so that the refrigerant flow space (205) is closed except for the lower part (240) that is coupled to the evaporator assembly (100).

[0170] In addition, during the press mold process, multiple strength reinforcing parts (230) can be simultaneously formed and processed for welding-type mutual connection within the refrigerant flow space (205) between one side heat-conducting panel (200A) and the other side heat-conducting panel (200B).

[0171] After the edge end (210) and the strength reinforcement part (230) described above are formed through the press mold process, the edge end (210) and the strength reinforcement part (230) of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) are joined by welding through a joining process, thereby forming a refrigerant flow space (205) inside.

[0172] Meanwhile, a heat dissipation device (1) according to one embodiment of the present invention may further include a fin reinforcement panel (290) disposed between each of a plurality of condensation plate assemblies (200), as shown in FIGS. 5 to 9, and disposed to support the outer surface of each adjacent condensation plate assemblies (200).

[0173] Here, the pin reinforcement panel (290) can be formed in a wave-like manner so as to have a vertical cross-section in a wave shape in the up-down direction.

[0174] However, the wave-shaped cross-section of the pin reinforcement panel (290) does not necessarily have to have a vertical cross-section in the up-down direction, and although not shown in the drawing, it may be formed to have a horizontal cross-section in the longitudinal direction in a wave-shaped manner.

[0175] A protruding portion (290-1) of one side of the pin reinforcement panel (290) can be joined to contact the outer surface of an adjacent condensation plate assembly (reference numeral 200-2 of FIG. 9), and a protruding portion (290-2) of the other side of the pin reinforcement panel (290) can be joined to contact the outer surface of an adjacent condensation plate assembly (reference numeral 200-1 of FIG. 9).

[0176] In this way, the fin reinforcement panel (290) is arranged between each of the plurality of condensing plate assemblies (200), and is supported so that each protruding portion (290-1, 290-2) comes into contact with the outer surface of the adjacent condensing plate assemblies (200), thereby preventing the condensing plate assemblies (200) from shaking (flowing) during heat dissipation due to phase change of the refrigerant, thereby maintaining a stable bond. In addition, similar to the function of the plurality of strength reinforcement portions (230) described above, the fin reinforcement panels (290) are provided to support from each outer side of the plurality of condensing plate assemblies (200), thereby preventing the heat energy supplied from the heating elements from being converted into physical energy unrelated to heat dissipation, thereby helping to achieve higher heat dissipation performance.

[0177] In addition, the fin reinforcement panel (290) is provided with a metal material having a certain degree of thermal conductivity, and is provided so as to be in contact with the outer surfaces of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) that substantially perform heat exchange with the outside air (outside air), thereby providing an advantage of further improving heat dissipation performance by increasing the overall heat exchange area.

[0178]

[0179] Hereinafter, the heat dissipation device (1) according to embodiments of the present invention has been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described single embodiment, and it will be understood that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below.

Claims

1. An evaporator plate assembly that receives heat by making surface thermal contact with the heating surface of the heating element and has a storage section formed in which liquid refrigerant is stored among the refrigerants; A plurality of condensing plate assemblies coupled to the above evaporation plate assembly and providing a refrigerant flow space in which the phase-changed gaseous refrigerant in the storage section diffuses and condenses; and A mounting panel that shields the storage portion of the evaporation plate assembly and mediates the coupling of the plurality of condensation plate assemblies to the evaporation plate assembly; A heat dissipation device in which a sintered block is placed inside the storage section of the above evaporation plate assembly to receive heat above a predetermined temperature from the heating element and evaporate the liquid refrigerant into a gaseous refrigerant.

2. In claim 1, The above sintered block is made by sintering a predetermined metal powder, A heat dissipation device arranged to occupy a portion of the storage section of the above evaporation plate assembly.

3. In claim 1, The above sintered block is a heat dissipation device in which the lower surface is in close contact with the bottom surface of the storage unit, which is relatively lower with respect to the direction of gravity.

4. In claim 3, A heat dissipation device in which the above sintered block is mounted on the bottom surface of the storage unit with the upper surface thereof spaced apart from the mounting panel corresponding to the upper side of the storage unit by a predetermined distance.

5. In claim 1, A heat dissipation device in which the above sintered body block is installed at a predetermined distance from one end and the other end in the longitudinal direction of the storage unit.

6. In claim 1, A heat dissipation device in which the range of heat transferred above the above-mentioned predetermined temperature is defined between one end and the other end in the longitudinal direction of the storage unit.

7. In any one of claims 1 to 6, The above sintered block is a heat dissipation device formed by sintering copper metal powder.

8. In any one of claims 1 to 6, A heat dissipation device, wherein a plurality of rigid reinforcing columns are installed inside the storage compartment of the above evaporation plate assembly, at least the upper portion of which is provided to support the lower surface of the above mounting panel.

9. In claim 8, The above multiple stiffening columns are, An outer column that simultaneously supports the bottom surface of the storage unit and the lower surface of the mounting panel; and A heat dissipation device comprising a mid-column that simultaneously supports the upper surface of the sintered body block and the lower surface of the mounting panel.

10. In claim 9, A heat dissipation device in which the upper surfaces of the outer column and the mid column are formed to be sunken downward and a plurality of support grooves are formed to support a portion of the lower part of each of the plurality of condenser plate assemblies.

11. In claim 10, A heat dissipation device in which the plurality of support grooves are spaced apart from each other in a width direction corresponding to the spacing distance of the plurality of condenser plate assemblies.

12. In claim 9, The outer column is a heat dissipation device in which the lower surface is supported on the bottom surface of the storage unit and the upper surface is supported on the lower surface of the mounting panel, and the sintered block is positioned at a predetermined distance from one end and the other end of the storage unit in the longitudinal direction, and is positioned in close contact with one end and the other end of the sintered block in the longitudinal direction.

13. In claim 12, A heat dissipation device in which a plurality of liquid coolant collection holes are formed in the outer column, the upper height of which is at least lower than the upper surface height of the sintered body block.

14. In claim 13, A heat dissipation device in which the plurality of liquid refrigerant collection holes are formed to be connected to one end and the other end in the longitudinal direction of the sintered body block, respectively.

15. In claim 13, A heat dissipation device in which the liquid refrigerant located in the storage section corresponding to the outer side of the outer column based on one end and the other end of the sintered block is absorbed and distributed to the sintered block through the plurality of liquid refrigerant collection holes.

16. In claim 1, Each of the above multiple condenser plate assemblies is A one-sided heat-conducting panel formed by a press mold process as a metal panel member having a thermal conductivity higher than a predetermined level; and A second side heat-conducting panel formed of the same metal panel member as the first side heat-conducting panel by a press mold process; A heat dissipation device further comprising at least one liquid refrigerant induction column for inducing condensed liquid refrigerant in the refrigerant flow space to be close to one end and the other end of the sintered body block.

17. In claim 16, The above liquid refrigerant induction column is, A heat dissipation device that is arranged in a slanted manner so that the width gradually narrows toward the bottom with respect to the direction of gravity when a pair is arranged at a predetermined distance apart.

18. In claim 16, The above liquid refrigerant induction column is, A heat dissipation device that is arranged in a slanted manner with the width gradually increasing toward the bottom based on the direction of gravity when a pair is arranged at a predetermined distance apart.

19. In claim 16, The above liquid refrigerant induction column is, A heat dissipation device in which, when a single unit is arranged, the upper end is close to one end or the other end of the sintered body block, and the lower end is close to one end or the other end of the sintered body block, and is arranged in an inclined manner.

20. In claim 1, A heat dissipation device further comprising: a plurality of fin reinforcement panels arranged between each of the plurality of condenser plate assemblies, each of which supports an outer surface of an adjacent condenser plate assemblies; 21. In claim 20, A heat dissipation device in which the above plurality of fin reinforcement panels are formed in a wave-like manner so as to have a vertical cross-section in a wave shape in the vertical direction.

22. In claim 20, A heat dissipation device in which the above plurality of fin reinforcement panels are formed in a wave-like manner so as to have a horizontal cross-section in a wave shape in the longitudinal direction.

23. In claim 16, A heat dissipation device in which the above-mentioned one-side heat-conducting panel and the above-mentioned other-side heat-conducting panel are metal panel members made of SUS material.

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