FOUNDATION STRUCTURE AND LIQUID-COOLED HEAT SINK USING THIS FOUNDATION STRUCTURE

VN126417APending Publication Date: 2026-06-15ASIA VITAL COMPONENTS CO LTD
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Patent Information

Authority / Receiving Office
VN · VN
Patent Type
Applications
Current Assignee / Owner
ASIA VITAL COMPONENTS CO LTD
Filing Date
2026-05-13
Publication Date
2026-06-15

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Abstract

The invention relates to a base structure and a liquid-cooled radiator using such a base structure. The liquid-cooled radiator consists of a base structure, a bonding material, and a top cover structure. The base structure consists of a base and a cover. The base has numerous cooling fins that delineate numerous cooling fluid pathways. The cover covers the base and contacts the cooling fins to seal the base. The cover has at least one fluid inlet and at least one fluid outlet that communicates with the cooling fluid pathways. The top cover structure is fixed to the cover by means of a bonding material such that the fluid inlet and fluid outlet channels of the top cover structure communicate with the cooling fluid pathways of the base through the fluid inlet and fluid outlet, respectively.By placing a cover between the bonding material and the heat sink fins, the fins are protected from contact with the bonding material, thereby solving the problem of bonding material flowing into the gaps between the fins and blocking the coolant flow paths.
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