Electronic devices include antennas.

Abstract

The invention relates to an electronic device comprising: a housing consisting of an inner part that forms part of the outer surface of the electronic device and includes a conductive part; a circuit board arranged within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board comprises: multiple first-pair pads arranged on at least some of the multiple layers of the circuit board; at least one second-pair pad placed between multiple first-pair pads; a dielectric material arranged between multiple first-pair pads and at least one second-pair pad; and an electrical connection connected to multiple first-pair pads to form an electrical path, and connected to a conductive part. At least one second-pair pad is connected to a wireless communication circuit to form an electrical path.

Description

Electronic device including an antenna

[0001] The disclosure relates to an electronic device including an antenna.

[0002] Wireless communication technology enables the transmission and reception of various types of information. As wireless communication technology advances, electronic devices, such as smartphones, capable of wireless communication can provide services utilizing communication functions such as the global positioning system (GPS), Wi-Fi, long-term evolution (LTE), or near field communication (NFC). To perform such wireless communication, the electronic devices may include an antenna structure. The aforementioned background technology was acquired or acquired during the process of developing the present disclosure and cannot necessarily be considered publicly available technology prior to the filing of the present disclosure.

[0003] Additional aspects will be partly explained in the description that follows, and partly pointed out in the description, or may be learned by practicing the examples provided.

[0004] According to one aspect of the disclosure, an electronic device may include: a housing including a side member forming a portion of an outer side of the electronic device and including a conductive portion; a circuit board provided within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board may include: a plurality of first coupling pads provided on at least some of a plurality of layers of the circuit board; at least one second coupling pad spaced apart from the plurality of first coupling pads; a dielectric provided between the plurality of first coupling pads and the at least one second coupling pad; and an electrical connection member connected to the plurality of first coupling pads to form an electrical path and connected to the conductive portion. The at least one second coupling pad may be connected to form an electrical path with the wireless communication circuit, and at least a portion of the at least one second coupling pad may be provided between a pair of first coupling pads among the plurality of first coupling pads.

[0005] The at least one second coupling pad may be provided as a plurality of second coupling pads, and the plurality of first coupling pads and the plurality of second coupling pads may be alternately provided on at least some of the plurality of layers of the circuit board along the first direction.

[0006] The plurality of first coupling pads may be adjacent to the plurality of second coupling pads, and individual capacitances for indirect electrical signal transmission may be formed between the plurality of first coupling pads and the plurality of second coupling pads, and the total sum of the individual capacitances formed on the circuit board may be configured to be 10 pF or more.

[0007] The overlapping areas of the plurality of first coupling pads and the plurality of second coupling pads in the first direction are substantially similar.

[0008] The circuit board may further include one or more first conductive vias connected to form an electrical path to the plurality of first coupling pads; and one or more second conductive vias connected to form an electrical path to the second coupling pads.

[0009] The circuit board may include a first substrate surface and a second substrate surface opposite to the first substrate surface, and the dielectric may be arranged on the first substrate surface and the second substrate surface so that the plurality of first coupling pads and the at least one second coupling pad are not exposed to the outside of the circuit board.

[0010] The circuit board may further include a switch connected to at least one of the one or more first conductive vias and the one or more second conductive vias, and for selectively blocking an electrical path formed by the at least one conductive via.

[0011] The circuit board may further include a ground spaced apart from the plurality of first coupling pads and at least one second coupling pad; and a discharge induction unit for inducing discharge of an electrical signal from the plurality of first coupling pads to the ground.

[0012] At least one of the plurality of first coupling pads and the ground may be provided on the same layer of the circuit board. The discharge inducing portion may include one or more first discharge members that are directly connected to the first coupling pad disposed on the same layer as the ground and protrude toward the ground.

[0013] The above discharge inducing member may include one or more second discharge members connected to the ground and protruding toward the at least one first coupling pad provided on the same layer as the ground.

[0014] One first coupling pad among the plurality of first coupling pads may be adjacent to one second coupling pad among the at least one second coupling pad along a first direction, and the first coupling pad and the second coupling pad may form a coupling pad set, and a gap in the first direction between the first coupling pad and the second coupling pad forming the coupling pad set may be smaller than a gap between adjacent coupling pad sets.

[0015] At least one of the first coupling pads and the at least one second coupling pad among the plurality of first coupling pads may be provided on the same layer based on the first direction of the circuit board, and the at least one first coupling pad and the at least one second coupling pad on the same layer may be provided crosswise along the second direction of the circuit board perpendicular to the first direction.

[0016] The circuit board may further include a third coupling pad electrically insulated from the plurality of first coupling pads and the at least one second coupling pad through the dielectric, the third coupling pad and the at least one second coupling pad at least partially overlapping in the first direction of the circuit board, and the electrical connection member may be connected to the third coupling pad to form an electrical path.

[0017] The side member may include a first conductive portion and a second conductive portion that are electrically separated along an outer side of the electronic device, and the first electrical connection member and the second electrical connection member may be connected to the first conductive portion and the second conductive portion, respectively.

[0018] The circuit board may further include a fourth coupling pad that is electrically insulated from the plurality of first coupling pads and the at least one second coupling pad through the dielectric and connected to form an electrical path with the wireless communication circuit. At least one of the plurality of first coupling pads and the fourth coupling pad may at least partially overlap in the first direction of the circuit board.

[0019] The circuit board may further include a radiating member comprising a conductive material or a conductive pattern, wherein the radiating member may be overlapped with the at least one second coupling pad in the first direction of the circuit board or may be electrically connected to the wireless communication circuit.

[0020] According to one aspect of the disclosure, an electronic device may include a housing including a side member forming a portion of an outer side of the electronic device and including a conductive portion; a circuit board provided within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board may include a first coupling pad; a first coupling pad spaced apart from the first coupling pad and connected to form an electrical path to the wireless communication circuit; a dielectric configured to electrically insulate the first coupling pad and the second coupling pad; an electrical connection member connected to form an electrical path with the first coupling pad and connected to the conductive portion; a ground electrically isolated from the first coupling pad and the second coupling pad; and a discharge induction unit for inducing a discharge of an electrical signal from the first coupling pad to the ground, wherein the first coupling pad and the second coupling pad may at least partially overlap along a first direction of the circuit board.

[0021] The ground may be provided on the surface of the circuit board, the first coupling pad may be provided on the same layer as the ground, and the discharge induction unit may be between the first coupling pad on the same layer and the ground.

[0022] The discharge inducing member may include a first discharge member connected to the first coupling pad and protruding toward the ground; or a second discharge member connected to the ground and protruding toward the first coupling pad, and a gap may be formed between the first discharge member and the ground or between the second discharge member and the first coupling pad, and the dielectric may be provided in the gap.

[0023] According to one aspect of the disclosure, an electronic device may include a housing including a side member forming a portion of an outer side of the electronic device and including a first conductive portion and a second conductive portion that are electrically isolated from each other; a circuit board provided within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board may include a first coupling pad; a second coupling pad spaced apart from the first coupling pad and connected to form an electrical path to the wireless communication circuit; a third coupling pad spaced apart from the first coupling pad and the second coupling pad; a dielectric configured to electrically insulate the first coupling pad, the second coupling pad, and the third coupling pad; a first electrical connection member connected to form an electrical path to the first coupling pad and connected to the first conductive portion; And a second electrical connection member connected to the third coupling pad to form an electrical path and connected to the second conductive portion, wherein the first coupling pad and the third coupling pad can at least partially overlap the second coupling pad along the first direction of the circuit board.

[0024] According to one aspect of the disclosure, an electronic device may include a housing including a side member forming a portion of an outer side of the electronic device and including a conductive portion; a circuit board provided within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board may include a first coupling pad; a second coupling pad spaced apart from the first coupling pad and connected to the wireless communication circuit via a first signal line; a fourth coupling pad spaced apart from the first coupling pad and connected to the wireless communication circuit via a second signal line; a dielectric configured to electrically insulate the first coupling pad, the second coupling pad, and the fourth coupling pad; and an electrical connection member connected to form an electrical path with the first coupling pad and connected to the conductive portion, wherein the second coupling pad and the fourth coupling pad may at least partially overlap the first coupling pad along a first direction of the circuit board.

[0025] According to one aspect of the disclosure, an electronic device may include a housing including a side member forming a portion of an outer side of the electronic device and including a first conductive portion and a second conductive portion that are electrically isolated from each other; and a circuit board provided within the housing. The circuit board may include a first coupling pad, a second coupling pad spaced apart from the first coupling pad; a dielectric configured to electrically insulate the first coupling pad and the second coupling pad; a first electrical connection member connected to form an electrical path with the first coupling pad and connected to the first conductive portion; and a second electrical connection member connected to form an electrical path with the second coupling pad and connected to the second conductive portion, wherein the first coupling pad and the second coupling pad may at least partially overlap along a first direction of the circuit board.

[0026] According to one aspect of the disclosure, an electronic device may include a housing including a side member forming a portion of an outer side of the electronic device and including a conductive portion; a circuit board provided within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board may include a first coupling pad; a plurality of second coupling pads spaced apart from the first coupling pad; a dielectric configured to electrically insulate the first coupling pad and the plurality of second coupling pads; and an electrical connection member connected to form an electrical path to the first coupling pad and connected to the conductive portion. The plurality of second coupling pads are connected to form an electrical path to the wireless communication circuit, and at least a portion of the first coupling pad may be provided between a pair of second coupling pads among the plurality of second coupling pads.

[0027] In one aspect of the disclosure, an electronic device may include a housing including a side member forming a portion of an outer side of the electronic device and including a conductive portion; a circuit board provided within the housing; and a wireless communication circuit electrically connected to the circuit board. The circuit board may include a pair of first coupling pads each provided on different layers among a plurality of layers of the circuit board; a second coupling pad provided on a layer between the pair of first coupling pads and spaced apart from the pair of first coupling pads; a dielectric configured to electrically insulate the pair of first coupling pads and the second coupling pad; and an electrical connection member connected to the pair of first coupling pads to form an electrical path and connected to the conductive portion, wherein at least a portion of the second coupling pad is connected to form an electrical path to the wireless communication circuit and may overlap the pair of first coupling pads.

[0028] The above and other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0029] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0030] FIG. 2A is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0031] FIG. 2b is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0032] FIG. 3 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0033] FIG. 4A is a plan view schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment of the present disclosure.

[0034] FIG. 4b is a graph illustrating antenna performance when an electrical signal is transmitted through capacitance between coupling pads in an electronic device according to an embodiment of the present disclosure.

[0035] FIG. 5A is a cross-sectional view of a circuit board according to one embodiment of the present disclosure.

[0036] FIG. 5b is a partial cross-sectional view of a circuit board showing area A of FIG. 5a according to one embodiment of the present disclosure.

[0037] FIG. 5c is a partial perspective view of a circuit board showing area A of FIG. 5a according to one embodiment of the present disclosure.

[0038] FIG. 5d is a partial plan view of a circuit board illustrating a discharge induction unit according to one embodiment of the present disclosure.

[0039] FIG. 5e is a partial plan view of a circuit board illustrating a discharge induction unit according to one embodiment of the present disclosure.

[0040] FIG. 5f is a partial plan view of a circuit board illustrating a discharge induction unit according to an embodiment of the present disclosure.

[0041] FIG. 5g is a partial plan view of a circuit board illustrating a discharge induction unit according to an embodiment of the present disclosure.

[0042] FIG. 5h is a partial plan view of a circuit board illustrating a discharge induction unit according to an embodiment of the present disclosure.

[0043] FIG. 6A is a partial cross-sectional view of a circuit board according to an embodiment of the present disclosure.

[0044] FIG. 6b is a partial plan view of a circuit board illustrating a discharge induction unit according to one embodiment of the present disclosure.

[0045] FIG. 7A is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0046] FIG. 7b is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0047] FIG. 7c is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0048] FIG. 7d is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0049] FIG. 7e is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0050] FIG. 7f is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0051] FIG. 7g is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0052] FIG. 8A is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0053] FIG. 8b is an exploded perspective view illustrating the layer structure of a portion of a circuit board according to one embodiment of the present disclosure.

[0054] FIG. 9A is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0055] FIG. 9b is an exploded perspective view illustrating the layer structure of a portion of a circuit board according to one embodiment of the present disclosure.

[0056] FIG. 10 is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0057] FIG. 11 is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0058] FIG. 12 is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0059] FIG. 13 is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0060] FIG. 14a is a diagram schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment of the present disclosure.

[0061] FIG. 14b is a diagram schematically illustrating a circuit connection structure of a side member, a circuit board, and a wireless communication circuit according to one embodiment of the present disclosure.

[0062] FIG. 14c is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0063] FIG. 14d is an exploded perspective view illustrating the layer structure of a portion of a circuit board according to one embodiment of the present disclosure.

[0064] FIG. 15a is a drawing schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment of the present disclosure.

[0065] FIG. 15b is a diagram schematically illustrating a circuit connection structure of a side member, a circuit board, and a wireless communication circuit according to one embodiment of the present disclosure.

[0066] FIG. 15c is a partial perspective view of a circuit board according to one embodiment of the present disclosure.

[0067] FIG. 15d is an exploded perspective view illustrating the layer structure of a portion of a circuit board according to one embodiment of the present disclosure.

[0068] FIG. 16A is a diagram schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment of the present disclosure.

[0069] FIG. 16b is a perspective view illustrating a portion of a circuit board according to one embodiment of the present disclosure.

[0070] FIG. 17a is a perspective view illustrating a portion of a circuit board according to one embodiment of the present disclosure.

[0071] FIG. 17b is a perspective view illustrating a portion of a circuit board according to one embodiment of the present disclosure.

[0072] FIG. 17c is a graph for explaining changes in radiation performance of an antenna depending on the presence or absence of a radiation member in a circuit board according to an embodiment of the present disclosure.

[0073] FIG. 18a is a perspective view illustrating a portion of a circuit board according to one embodiment of the present disclosure.

[0074] FIG. 18b is a cross-sectional view illustrating a portion of a circuit board according to one embodiment of the present disclosure.

[0075] FIG. 19 is a cross-sectional view illustrating a portion of a circuit board according to one embodiment of the present disclosure.

[0076] FIG. 20A is a partially exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0077] FIG. 20b is a partial cross-sectional view illustrating a connection structure of a circuit board and a rear frame according to one embodiment of the present disclosure.

[0078] FIG. 21a is a drawing schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment of the present disclosure.

[0079] FIG. 21b is a partial cross-sectional view illustrating area F21 of FIG. 21a according to one embodiment of the present disclosure.

[0080] FIG. 22a is a perspective view illustrating a front side of an electronic device according to an embodiment of the present disclosure.

[0081] FIG. 22b is a perspective view illustrating a rear side of an electronic device according to an embodiment of the present disclosure.

[0082] FIG. 22c is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0083] FIG. 23 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to one embodiment of the present disclosure.

[0084] FIG. 24A is a perspective view illustrating a front side of an electronic device according to an embodiment of the present disclosure.

[0085] FIG. 24b is a perspective view illustrating a rear side of an electronic device according to an embodiment of the present disclosure.

[0086] FIG. 24c is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0087] FIG. 25 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to one embodiment of the present disclosure.

[0088] FIG. 26a is a front perspective view illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.

[0089] FIG. 26b is a rear view illustrating an unfolded state of an electronic device according to an embodiment of the present disclosure.

[0090] FIG. 26c is a perspective view illustrating a folded state of an electronic device according to an embodiment of the present disclosure.

[0091] FIG. 27 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to one embodiment of the present disclosure.

[0092] FIG. 28a is a front perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0093] FIG. 28b is a front perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0094] FIG. 28c is a rear perspective view illustrating a first state of an electronic device according to an embodiment of the present disclosure.

[0095] FIG. 28d is a rear perspective view illustrating a second state of an electronic device according to an embodiment of the present disclosure.

[0096] FIG. 29 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to one embodiment of the present disclosure.

[0097] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted. The embodiments described in this document are exemplary embodiments, and the disclosure is not limited thereto and may be implemented in various other forms. Terms including technical or scientific terms used in the disclosure may have similar meanings as commonly understood by those skilled in the art.

[0098] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0099] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0100] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0101] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0102] The memory (130) can store various data used by at least one component (e.g., the processor (120) or the sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., the program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a nonvolatile memory (134). The nonvolatile memory (134) can include a built-in memory (136) and an external memory (138).

[0103] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0104] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0105] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0106] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0107] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0108] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0109] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0110] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0111] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0112] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0113] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0114] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0115] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0116] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 eB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0117] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0118] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0119] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0120] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0121] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0122] It will be understood that the terms "includes," "comprise," "has," "having," "including," "comprising," and the like specify the presence of stated features, drawings, steps, operations, components, elements, or combinations thereof, but do not preclude the presence or addition of one or more other features, drawings, steps, operations, components, elements, or combinations thereof.

[0123] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0124] Embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0125] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0126] According to embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0127] FIG. 2A is a front perspective view of an electronic device according to one embodiment. FIG. 2B is a rear perspective view of an electronic device according to one embodiment. FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0128] Referring to FIGS. 2A, 2B, and 3, an electronic device (201) (e.g., the electronic device (101) of FIG. 1) may include a housing (210) forming a first side (210a) (or front side), a second side (210b) (or back side), and a side surface (211c) surrounding a space between the first side (210a) and the second side (210b). It should be noted that the shape of the housing illustrated in the drawings is exemplary.

[0129] An electronic device (201) according to one embodiment may include a housing (210) that forms an exterior and accommodates components therein. The housing (210) may form a front surface (210a) (e.g., a surface facing the +Z direction), a rear surface (210b) (e.g., a surface facing the -Z direction), and a side surface (211c) that surrounds an internal space between the front surface (210a) and the rear surface (210b). In one embodiment, the housing (210) may form the side surface (211c) through a first side surface (211c-1) (e.g., a surface facing the -Y direction), a second side surface (211c-2) (e.g., a surface facing the +Y direction), a third side surface (211c-3) (e.g., a surface facing the +X direction), and a fourth side surface (211c-4) (e.g., a surface facing the -X direction) connecting the front surface (210a) and the rear surface (210b).

[0130] In one embodiment, the front surface (210a) may be formed by a front plate (211a) that is at least partially substantially transparent. For example, the front plate (211a) may comprise a glass plate or a polymer plate including at least one coating layer. In one embodiment, the back surface (210b) may be formed by a substantially opaque back surface plate (211b). For example, the back surface plate (211b) may be formed by a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, magnesium, etc.), or a combination thereof. In one embodiment, the side surface (211c) may be formed by a side member (240) that is joined to the front plate (211a) and the back surface plate (211b) and includes a metal and / or a polymer. In one embodiment, the back surface plate (211b) and the side member (240) may be formed seamlessly as one body. In one embodiment, the back plate (211b) and the side member (240) may be formed of substantially the same material (e.g., aluminum).

[0131] In one embodiment, the front plate (211a) may include a plurality of first edge regions (212a-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface, a plurality of second edge regions (212a-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface, and a plurality of third edge regions (212a-3) extending from at least a portion of the front surface (210a) to the back plate (211b) and having a rounded surface and positioned between the plurality of first edge regions (212a-1) and the plurality of second edge regions (212a-2).

[0132] In one embodiment, the back plate (211b) may include a plurality of fourth edge regions (212b-1) facing one direction (e.g., + / - X direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, a plurality of fifth edge regions (212b-2) facing another direction (e.g., + / - Y direction) and extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface, and a plurality of sixth edge regions (212b-3) extending from at least a portion of the back plate (210b) to the front plate (211a) and having a rounded surface and positioned between the plurality of fourth edge regions (212b-1) and the plurality of fifth edge regions (212b-2).

[0133] In one embodiment, the side member (240) can surround at least a portion of the interior space between the front side (210a) and the back side (210b). In one embodiment, a display (261) can be positioned on one surface (e.g., in the +Z direction) of the side member (240), and a back plate (211b) can be positioned on the other surface (e.g., in the -Z direction) of the side member (240). In one embodiment, the side member (240) can include a conductive portion. For example, at least a portion of the side member (240) can be formed of a conductive material. In one embodiment, the side member (240) can include a side portion (241) positioned on at least a portion of the side surface (211c), and a support portion (242) connected to the side portion (241) and positioned inside the electronic device (201).

[0134] In one embodiment, the side portion (241) may connect the edges of the front plate (211a) and the rear plate (211b) and may form a side portion (211c) of the housing (210) by surrounding the front plate (211a) and the rear plate (211b). In one embodiment, the support portion (242) may be disposed inside the electronic device (201). In one embodiment, the side portion (241) and the support portion (242) may be formed integrally or may be formed separately and coupled to each other. When the side portion (241) and the support portion (242) are formed separately, the side member (240) may be formed to include only the side portion (241). In one embodiment, the side portion (241) (e.g., the side member (240)) may include a plurality of conductive portions disposed along the side portion (211c) of the electronic device (201). For example, the conductive portion may be formed of a metal and / or a conductive polymer material. In one embodiment, the support portion (242) may be formed of a metal and / or a conductive polymer material with the side portion (241). In one embodiment, when the support portion (242) is directly connected to the conductive portion of the side portion (241), the support portion (242) may form an electrical path from the conductive portion of the side portion (241) to ground.

[0135] In one embodiment, the electronic device (201) may include a display (261) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (261) may be located on the front surface (210a) of the electronic device (201). In one embodiment, the display (261) may be exposed through at least a portion of the front plate (211a) (e.g., the first edge regions (212a-1), the second edge regions (212a-2), and the third edge regions (212a-3). In one embodiment, the display (261) may have a shape substantially the same as the outer contour shape of the front plate (211a). Although not shown in the drawing, the display (261) according to one embodiment may include a touch screen panel (TSP), a pressure sensor, and / or a digitizer (not shown) for detecting a stylus pen.

[0136] In one embodiment, the display (261) may include a screen display area (261a) that is visually exposed to the outside of the electronic device (201) and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (261a) may include a sensing area (261a-1) and a camera area (261a-2). The sensing area (261a-1) may overlap at least a portion of the screen display area (261a). The sensing area (261a-1) may allow transmission of an input signal related to a sensor module (e.g., the sensor module (176) of FIG. 1). The sensing area (261a-1) may display content together with a screen display area (261a) that does not overlap with the sensing area (261a-1).

[0137] In one embodiment, the camera area (261a-2) may overlap at least a portion of the screen display area (261a). The camera area (261a-2) may expose a lens of a first camera module (280a) (e.g., camera module (180) of FIG. 1) positioned to face the front of the electronic device (201). For example, the camera area (261a-2) may allow transmission of an optical signal (e.g., light) associated with the first camera module (280a). In one embodiment, the camera area (261a-2) may display content similarly to the screen display area (261a) that does not overlap the camera area (261a-2). For example, the camera area (261a-2) may display content while the first camera module (280a) is not operating.

[0138] In one embodiment, the electronic device (201) may include a sensor module (276). The sensor module (276) may sense a signal applied to the electronic device (201). The sensor module (276) may be located, for example, on the front surface (210a) of the electronic device (201). The sensor module (276) may be arranged in the electronic device (201) to correspond to a sensing area (261a-1) of a screen display area (261a). For example, the sensor module (276) may be arranged to perform its function without being visually exposed through the display (261) in an internal space of the electronic device (201). The sensor module (276) may receive an input signal penetrating the sensing area (261a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As another example, the input signal may include signals relating to the user's biometric information (e.g., the user's fingerprint, voice, etc.).

[0139] In one embodiment, the electronic device (201) may include a camera module (280a, 280b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (280a, 280b) may include a first camera module (280a) and a second camera module (280b). In one embodiment, the electronic device (201) may include a flash (280c) disposed near the first camera module (280a) and the second camera module (280b).

[0140] In one embodiment, the first camera module (280a) is disposed on the front side (210a) of the housing (210) such that its lens is exposed, and can receive an optical signal from the front side (e.g., +Z direction) of the electronic device (201). The second camera module (280b) is disposed on the rear side (210b) of the housing (210) such that its lens is exposed, and can receive an optical signal from the rear side (e.g., -Z direction) of the electronic device (201). In one embodiment, at least a portion of the first camera module (280a) may be disposed on the housing (210) such that it is covered by the display (261). For example, the first camera module (280a) may include an under-display camera (UDC). In one embodiment, the first camera module (280a) may receive an optical signal that passes through the camera area (261a-2). In one embodiment, the second camera module (280b) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). In one embodiment, the flash (280c) may include a light-emitting diode or a xenon lamp.

[0141] In one embodiment, the electronic device (201) may include an input module (250) (e.g., the input module (150) of FIG. 1). The input module (250) may receive an operation signal from a user. For example, the input module (250) may include at least one key input device that is positioned so as to be exposed on a side surface (211c) of the housing (210).

[0142] In one embodiment, the electronic device (201) may include a connection terminal (278) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (278) may be disposed on an outer surface of the housing (210). The electronic device (201) may be wired to an external device (e.g., another electronic device or an external power source) through the connection terminal (278).

[0143] In one embodiment, the electronic device (301) may include one or more printed circuit boards. For example, the electronic device (201) may include a first circuit board (251) (or a main circuit board) and a second circuit board (252) (or a sub-circuit board). The first circuit board (251) and the second circuit board (252) may be disposed inside the electronic device (201), for example, in a second support structure (242). At least one of the circuit boards (251, 252) may be connected to the second support portion (242) via a ground. In one embodiment, the first circuit board (251) may be accommodated in a first substrate slot (242a) formed by the second support portion (242). In one embodiment, the second circuit board (252) may be accommodated in the second board slot (242b) formed by the second support portion (242). In one embodiment, the circuit boards (251, 252) may be a rigid printed circuit board (PCB) or a flexible printed circuit board (FPCB) that is at least partially bendable. In one embodiment, the circuit boards (251, 252) may be formed in a multi-layer structure. Hereinafter, for convenience of explanation, the direction in which each layer of the circuit board is stacked is referred to as the first direction.

[0144] In one embodiment, the electronic device (201) may include a battery (289) disposed therein. The battery (289) may be disposed in a battery slot (245) formed in the second support portion (242).

[0145] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0146] FIG. 4A is a plan view schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to one embodiment. FIG. 4B is a graph illustrating antenna performance when an electrical signal is transmitted through capacitance between coupling pads in an electronic device according to one embodiment.

[0147] Referring to FIG. 4A, an electronic device (401) according to one embodiment (e.g., electronic device (201) of FIG. 2A) may include a housing (e.g., housing (210) of FIG. 2A), a circuit board (450) (e.g., first circuit board (251) or second circuit board (252) of FIG. 3), and a wireless communication circuit (490).

[0148] In one embodiment, the housing may include a front surface (e.g., front surface (210a) of FIG. 2A), a back surface opposite the front surface (e.g., back surface (210b) of FIG. 2A), and a side surface surrounding an interior space between the front surface and the back surface (e.g., side surface (211c) of FIG. 2A). In one embodiment, the housing may include a side member (440) forming at least a portion of the side surface and surrounding the interior space (e.g., side member (240) of FIG. 3). In one embodiment, the side member (440) may include a plurality of conductive portions (4411) formed of a conductive material. In one embodiment, some of the conductive portions (4411) may function as radiators through which electrical signals flow. In one embodiment, the side member (440) may include an insulating portion (4412) disposed between the plurality of conductive portions (4411) and electrically isolating adjacent conductive portions (4411) from each other. In one embodiment, the side member (440) may include one or more connection portions (4413) formed on the conductive portion (4411) and electrically connected to the circuit board (450). In one embodiment, the connection portion (4413) may function as a power supply point to which an electrical signal is applied to the conductive portion (4411), or as a ground point from which an electrical signal applied to the conductive portion (4411) is discharged. In one embodiment, the connection portion (4413) may overlap at least a portion of the circuit board (450) disposed within the housing, based on a plan view such as FIG. 4. For example, the connection portion (4413) may be in direct contact with the electrical connection member (453) disposed on the circuit board (450), as illustrated in FIG. 4. Alternatively, the connection portion (4413) may be disposed so as not to overlap the circuit board (450). For example, the connection portion (4413) may be It may also be indirectly connected to an electrical connection member (453) arranged on a circuit board (450) through a separate circuit.

[0149] In one embodiment, the circuit board (450) may be disposed in the inner space of the housing. In one embodiment, the circuit board (450) may be formed as a multi-layer structure in which a plurality of layers are stacked. In one embodiment, the circuit board (450) may include one or more electrical connection members (453) electrically connected to the conductive portion (4411). In one embodiment, the electrical connection members (453) may be formed in the form of a conductive contact member formed of a conductive material or a C-clip. For example, the electrical connection members (453) may be connected to a connection member (4413) formed in the conductive portion (4411). In one embodiment, the circuit board (450) may be mounted in the inner space of the housing such that each electrical connection member (453) contacts the connection member (4413) of the corresponding conductive portion (4411).

[0150] In one embodiment, the circuit board (450) may be electrically connected to a wireless communication circuit (490). For example, the wireless communication circuit (490) may be disposed on the circuit board (450) or disposed on another circuit board. In one embodiment, the circuit board (450) may include one or more signal lines (454) connected to the wireless communication circuit (490). In one embodiment, the circuit board (450) may form one or more electrical paths from an electrical connection member (453) connected to a conductive portion (4411) to the wireless communication circuit (490) through the signal lines (454).

[0151] In one embodiment, the circuit board (450) may include a plurality of coupling pads (451) arranged in an electrical path. The coupling pads (451) may electrically connect a signal line (454) connected to an electrical connection member (453) and a corresponding wireless communication circuit (490) by a coupled feeding structure. In one embodiment, the coupling pads (451) may indirectly transmit an electrical signal through a capacitance formed between the coupling pads (451) by electrically connecting a corresponding electrical connection member (453) and a signal line (454) by the coupled feeding structure. According to one embodiment, by means of the coupling connection structure, direct electrical signal transmission between the conductive portion (4411) of the side member (440) and the wireless communication circuit (490) is prevented or blocked, so that an electro-static discharge (ESD) blocking structure can be formed that prevents or reduces transmission of noise signals or static electricity from the conductive portion (4411) to the wireless communication circuit (490).

[0152] In one embodiment, the circuit board (450) may include a ground (456) for grounding a static electricity or noise signal transmitted from the conductive portion (4411). In one embodiment, the ground (456) of the circuit board (450) is connected to a ground (456) area of ​​the electronic device (401) (e.g., a ground (456) area of ​​the side member (440)), thereby emitting and eliminating a noise signal applied to the circuit board (450) to the outside of the circuit board (450).

[0153] Referring to FIG. 4B, the radiation performance of the antenna can be confirmed when transmitting and receiving an electrical signal of a specific frequency band through the conductive portion (4411) of the side member (440). The horizontal axis of the graph of FIG. 4B represents the frequency band radiated through the conductive portion, and the vertical axis represents the total radiation efficiency through the conductive portion. Line G1 represents the radiation performance according to the frequency band that appears when the conductive portion (4411) and the wireless communication circuit (490) are directly connected through a circuit including an ESD protection element. Line G2 represents the radiation performance according to the frequency band that appears when the conductive portion (4411) and the wireless communication circuit (490) are connected through a capacitance formed between a plurality of coupling pads (451) under the same conditions as G1.

[0154] Comparing lines G1 and G2 illustrated in FIG. 4b, it can be seen that there is no significant difference in the radiation performance of G1 and G2 in the low frequency band, whereas G2 has more effective radiation performance than G1 in the high frequency band (e.g., Ultra high band region, 4,400 to 5,000 MHz). For example, it can be seen that in a specific frequency band, a method of connecting the conductive portion (4411) and the wireless communication circuit (490) through a coupling connection structure using a plurality of coupling pads (451) without a separate ESD protection element can maintain the radiation performance of the antenna more stably than a method of directly connecting the conductive portion (4411) and the wireless communication circuit (490) through a circuit including an ESD protection element. In other words, it can be seen that the phenomenon of the antenna's radiation performance deteriorating through a coupling connection structure in which the ESD element is omitted can be improved in a specific frequency band.

[0155] FIG. 5A is a cross-sectional view of a circuit board according to an embodiment. FIG. 5B is a partial cross-sectional view of a circuit board according to an embodiment, showing area A of FIG. 5A. FIG. 5C is a partial perspective view of a circuit board according to an embodiment, showing area A of FIG. 5A. FIG. 5D is a partial plan view of a circuit board showing a discharge induction unit according to an embodiment. FIG. 5E is a partial plan view of a circuit board showing a discharge induction unit according to an embodiment. FIG. 5F is a partial plan view of a circuit board showing a discharge induction unit according to an embodiment. FIG. 5G is a partial plan view of a circuit board showing a discharge induction unit according to an embodiment. FIG. 5H is a partial plan view of a circuit board showing a discharge induction unit according to an embodiment.

[0156] Referring to FIGS. 5A to 5C , coupling pads (551) may be formed on a portion of a circuit board (550) according to an embodiment. For example, as illustrated in FIG. 5A , the coupling pads (551) may be positioned at an edge of the circuit board (550) adjacent to a side member (e.g., a side member (440) of FIG. 4A ) of an electronic device (e.g., an electronic device (401) of FIG. 4A ), for example, an edge region of the circuit board (550) adjacent to a conductive portion (e.g., a conductive portion (4411) of FIG. 4A ). Although the drawing illustrates that a coupling connection structure is formed in region A shown in FIG. 5A through coupling pads (551), this is for convenience of explanation, and it should be noted that the coupling connection structure may be formed in various regions of the circuit board (550) that are connected to the conductive portions of the side members. In the following, when describing embodiments, the embodiments will be described with a focus on a coupling connection structure formed on a portion of a circuit board (550).

[0157] FIGS. 5A to 5H schematically illustrate a portion of a circuit board (550) on which coupling pads (551) are formed. Referring to FIGS. 5A to 5H, a circuit board (550) according to an embodiment (e.g., circuit board (450) of FIG. 4A) may include an electrical connection member (553), a signal line (554) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), a plurality of coupling pads (551), a dielectric (552), an electrical connection member (553), a plurality of conductive vias (5551, 5552), a ground (556), and a discharge induction member (557).

[0158] In one embodiment, the circuit board (550) may include a first substrate surface (550a) and a second substrate surface (550b) opposite to the first substrate surface (550a). The first substrate surface (550a) and the second substrate surface (550b) may form two outer surfaces that are exposed to the outside of the circuit board (550). Meanwhile, additional layers, not shown, may be arranged on at least a portion of the first substrate surface (550a) and the second substrate surface (550b) of the circuit board (550). For example, additional structures such as a protective layer (e.g., a dielectric layer formed of a dielectric (552)), a conductive layer for signal transmission, and a shield can for protecting elements disposed on the first substrate surface (550a) or the second substrate surface (550b) may be disposed on the outer surfaces of the first substrate surface (550a) and the second substrate surface (550b) of the circuit board (550). Hereinafter, for convenience of explanation, the first substrate surface (550a) and the second substrate surface (550b) of the circuit board (550) are illustrated as forming surfaces exposed to the outside of the circuit board (550). However, it should be noted that additional layers and / or structures may be disposed on at least a portion of the first substrate surface (550a) and the second substrate surface (550b) even if not otherwise mentioned, and the same may be applied to other embodiments.

[0159] In one embodiment, the circuit board (550) may be formed in a multilayer structure. For example, the circuit board (550) may be formed in a multilayer structure in which coupling pads (551) and dielectrics (552) are alternately overlapped. In one embodiment, at least one coupling pad (551) and dielectric (552) in the circuit board (550) may be arranged substantially in the same plane to form one layer.

[0160] In one embodiment, the electrical connection member (553) may be disposed on one surface of the circuit board (550), for example, the first substrate surface (550a) or the second substrate surface (550b). The electrical connection member (553) may be electrically connected to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A).

[0161] In one embodiment, the signal line (554) may be connected to a wireless communication circuit. In FIG. 5A, the signal line (554) is illustrated as being arranged on the first substrate surface (550a) of the circuit board (550), but this is for convenience of explanation, and it should be noted that the position of the signal line (554) on the circuit board (550), its arrangement relationship with other components, or its shape are not limited thereto.

[0162] In one embodiment, a plurality of coupling pads (551) may be arranged separately from each other on the circuit board (550). At least some of the coupling pads (5511-1, 5511-2, 5512-1, 5512-2) among the plurality of coupling pads (551) may have different positions in a first direction (T) of the circuit board (550) (e.g., the W-axis direction in FIG. 5B). For example, the plurality of coupling pads (551) may be arranged separately along the first direction (T) of the circuit board (550). In one embodiment, the first direction (T) of the circuit board (550) may refer to a direction in which a plurality of layers of the circuit board (550) are stacked. Hereinafter, unless otherwise stated, the first direction (T) is understood to refer to a stacking direction (e.g., a thickness direction) of the plurality of layers of the circuit board. In one embodiment, a dielectric (552) may be disposed between a plurality of coupling pads (551). Each of the plurality of coupling pads (551) may be electrically insulated through the dielectric (552). In one embodiment, the plurality of coupling pads (551) may include a plurality of first coupling pads (5511) and a plurality of second coupling pads (5512).

[0163] In one embodiment, a plurality of first coupling pads (5511) may be electrically connected to each other. The plurality of first coupling pads (5511) may be electrically connected to an electrical connection member (553). For example, the first coupling pads (5511) may be in direct contact with the electrical connection member (553), or may be connected to the electrical connection member (553) through a separate conductive connection line (5511) or a conductive via (555). For example, the conductive via may be a structure in which a conductive material is at least partially filled in a via hole. For example, the plurality of first coupling pads (5511) may form an electrical path through which an electrical signal flows with the electrical connection member (553). The first coupling pad (5511) can function as a feeding pad that forms an electrical path for applying an electrical signal to a conductive portion (e.g., the conductive portion (4411) of FIG. 4A) through an electrical connection member (553) or for directly receiving an electrical signal from the conductive portion.

[0164] In one embodiment, the first coupling pad (5511) may include a first-first coupling pad (5511-1) and a first-second coupling pad (5511-2) that are separately arranged along the first direction (T) of the circuit board (550). However, the number of the plurality of first coupling pads (5511) is not limited thereto, and may be singular, unlike that illustrated.

[0165] In one embodiment, the plurality of second coupling pads (5512) can be electrically connected to each other. The plurality of second coupling pads (5512) can be electrically insulated from the first coupling pads (5511) on the circuit board (550). In one embodiment, the plurality of second coupling pads (5512) can be electrically connected to a signal line (554) connected to a wireless communication circuit. For example, the second coupling pads (5512) can be in direct contact with the signal line (554) or can be connected to the signal line (554) connected to the wireless communication circuit through a separate conductive connection line or a second conductive via (5552). For example, the plurality of second coupling pads (5512) can form an electrical path through which an electrical signal flows with the wireless communication circuit through the signal line (554). In one embodiment, the second coupling pad (5512) may function as a signal deliver pad that receives an electrical signal from a wireless communication circuit via a signal line (554) or forms an electrical path for delivering an electrical signal to the wireless communication circuit via the signal line (554).

[0166] In one embodiment, the second coupling pad (5512) may include a second-first coupling pad (5512-1) and a second-second coupling pad (5512-2) that are separately arranged along the first direction (T) of the circuit board (550). However, the number of the plurality of second coupling pads (5512) is not limited thereto.

[0167] In one embodiment, the first coupling pad (5511) and the second coupling pad (5512) can transmit electrical signals in a non-contact manner. For example, the first coupling pad (5511) and the second coupling pad (5512) can be arranged to overlap at least a portion of the circuit board (550) when viewed in one direction and form a capacitance therebetween for indirect transmission of an electrical signal. In one embodiment, the capacitance formed between the first coupling pad (5511) and the second coupling pad (5512) can be determined according to factors such as the gap between the first coupling pad (5511) and the second coupling pad (5512), the overlapping area, or the permittivity of the dielectric (552). Depending on the capacitance formed between the plurality of coupling pads (551) arranged on the circuit board (550), the impedance of an electrical signal applied to a corresponding conductive portion (e.g., conductive portion (4411) of FIG. 4A) can be determined.

[0168] In one embodiment, when the circuit board (550) is viewed in the first direction (T), at least one second coupling pad (5512) may be positioned to overlap between at least one pair of first coupling pads (5511). For example, with respect to the first direction (T) of the circuit board (550), the second-first coupling pad (5512-1) may be positioned between the first-first coupling pad (5511-1) and the first-second coupling pad (5511-2).

[0169] In one embodiment, a plurality of first coupling pads (5511) and a plurality of second coupling pads (5512) may be alternately arranged along a first direction (T) of the circuit board (550). For example, a first-first coupling pad (5511-1), a second-first coupling pad (5512-1), a first-second coupling pad (5511-2), and a second-second coupling pad (5512-2) may be alternately arranged along the first direction (T) of the circuit board (550). In one embodiment, at least some of the first coupling pads (5511) and the second coupling pads (5512) may overlap each other along the first direction (T) of the circuit board (550).

[0170] In one embodiment, when the circuit board (550) is viewed in a first direction (T), the plurality of coupling pads (551) may be arranged such that the overlapping area (A) between the adjacent first coupling pads (5511) and the second coupling pads (5512) is substantially the same. For example, as shown in FIG. 5b, with respect to the first direction (T) of the circuit board (550), the overlapping area (A) of the first-first coupling pad (5511-1) and the second-first coupling pad (5512-1), the overlapping area (A) of the first-first coupling pad (5511-1) and the second-second coupling pad (5512-2), and the overlapping area (A) of the first-second coupling pad (5511-2) and the second-second coupling pad (5512-2) may be substantially the same. However, it should be noted that the arrangement of multiple coupling pads (551) is not limited to this, and the overlapping area between adjacent coupling pads may be set differently depending on the design.

[0171] In one embodiment, when two first coupling pads (5511) and two second coupling pads (5512) are alternately arranged to overlap along the first direction (T) of the circuit board (550) as shown in FIG. 5b, the total capacitance formed by the plurality of coupling pads (551) can be determined through the respective capacitances formed between the first-first coupling pad (5511-1) and the second-first coupling pad (5512-1), between the first-first coupling pad (5511-1) and the second-second coupling pad (5512-2), and between the second-second coupling pad (5512-2) and the first-second coupling pad (5511-2). For example, the total capacitance formed by the plurality of coupling pads (551) may be greater than or equal to the sum of the individual capacitances formed between the plurality of first coupling pads (5511) and the plurality of second coupling pads (5512) that are arranged adjacent to each other. In one embodiment, the total capacitance formed through the overlapping area of ​​the plurality of first coupling pads (5511) and the plurality of second coupling pads (5512) may be set to match the target capacitance. The total capacitance formed through the plurality of coupling pads (551) in the circuit board (550) may be determined through the type of dielectric, the thickness of the dielectric, the spacing between each coupling pad, or the overlapping area between the coupling pads. An individual capacitance for transmitting an indirect electrical signal is formed between the first coupling pad (5511) and the second coupling pad (5512) adjacent to each other, and the total sum of the individual capacitances formed on the circuit board (550), for example, the total capacitance, may be about 10 pF (picofrads) or more. However, the present invention is not limited thereto.

[0172] In one embodiment, a plurality of conductive vias (5551, 5552) may penetrate the circuit board (550) in a first direction (T) and electrically connect at least some of the coupling pads (5511, 5512) among the plurality of coupling pads (551) that are arranged separately from each other. In one embodiment, the plurality of conductive vias (5551, 5552) may individually connect the plurality of first coupling pads (5511) and the second coupling pads (5512). For example, the plurality of conductive vias (5551, 5552) may include one or more first conductive vias (5551) that are connected to a plurality of first coupling pads (5511) and electrically connect the plurality of first coupling pads (5511), and one or more second conductive vias (5552) that are connected to a plurality of second coupling pads (5512) and electrically connect the plurality of second coupling pads (5512). The first conductive vias (5551) and the second conductive vias (5552) may be electrically insulated from each other. For example, the plurality of conductive vias (5551, 5552) may not directly connect the first coupling pads (5511) and the second coupling pads (5512).

[0173] In one embodiment, one or more first conductive vias (5551) can electrically connect a plurality of first coupling pads (5511) along a first direction (T) of a circuit board (550). For example, the first conductive vias (5551) can form an electrical path between the plurality of first coupling pads (5511). In one embodiment, a plurality of first conductive vias (5551) can be provided on the circuit board (550) and each can be positioned between a pair of adjacent first coupling pads (5511). In one embodiment, a single first conductive via (5551) can penetrate the circuit board (550) in the first direction (T) to simultaneously connect a plurality of first coupling pads (5511) that are spaced apart from each other in the first direction (T) of the circuit board (550). In one embodiment, the first conductive via (5551) can electrically connect at least one first coupling pad (5511) and the electrical connection member (553) when the first coupling pad (5511) and the electrical connection member (553) are separately disposed on the circuit board (550), thereby forming an electrical path between the electrical connection member (553) and the first coupling pad (5511).

[0174] In one embodiment, one or more second conductive vias (5552) can electrically connect a plurality of second coupling pads (5512) along the first direction (T) of the circuit board (550). For example, the second conductive vias (5552) can form an electrical path between the plurality of second coupling pads (5512). In one embodiment, a plurality of second conductive vias (5552) can be provided on the circuit board (550) and each can be positioned between a pair of adjacent second coupling pads (5512). In one embodiment, a single second conductive via (5552) can be positioned to penetrate the circuit board (550) in the first direction (T) and simultaneously connect a plurality of second coupling pads (5512) that are spaced apart from each other in the first direction (T) of the circuit board (550). In one embodiment, the second conductive via (5552) can electrically connect at least one second coupling pad (5512) and the signal line (554) connected to the wireless communication circuit when the second coupling pad (5512) and the signal line (554) connected to the wireless communication circuit are separately arranged on the circuit board (550), thereby forming an electrical path between the second coupling pad (5512) and the wireless communication circuit.

[0175] In one embodiment, a switch (e.g., switch (1859) of FIG. 18B) may be disposed between at least one of the plurality of conductive vias (5551, 5552) and the first coupling pad (5511) or the second coupling pad (5512) to selectively block a connection path of an electrical signal formed through the conductive via. For example, the switch may be disposed on at least one layer of the circuit board (550) on which the first coupling pad (5511) or the second coupling pad (5512) is disposed. A detailed description thereof will be provided later.

[0176] In one embodiment, the ground (556) may be disposed on the circuit board (550) and may form a path for static electricity or noise signals introduced into the circuit board (550) to escape. For example, the ground (556) may prevent or reduce electrical signals, such as static electricity or noise signals, from being introduced into component elements arranged on the circuit board (550) by inducing the introduced electrical signals to travel through other electrical structures. For example, the ground (556) may be connected to another ground of the electronic device. In one embodiment, the ground (556) may be disposed on the circuit board (550) so as to be separated from a plurality of coupling pads (551). In one embodiment, the ground (556) may be placed on an exposed surface of the circuit board (550) (e.g., the second substrate surface (550b) of FIG. 5c) to contact other structures of the electronic device, but the location of the ground (556) on the circuit board (550) is not limited thereto. In one embodiment, the ground (556) may receive an electrical signal, such as a static electricity or noise signal, from the first coupling pad (5511) and discharge it to the outside of the circuit board (550).

[0177] In one embodiment, at least one first coupling pad (5511) among the plurality of first coupling pads (5511) may be disposed adjacent to the ground (556). For example, with respect to the first direction (T) of the circuit board (550), one first coupling pad (5511) may be disposed on the same layer as the ground (556) to form a gap adjacent to the ground (556). For example, as illustrated in FIG. 5D, one first coupling pad (5511D) and the ground (556) may be disposed on the second substrate surface (550b) of the circuit board (550), and the ground (556) may receive a static electricity or noise signal introduced into the circuit board (550) from the conductive portion through the adjacently disposed first coupling pad (5511D). However, this is just an example, and the ground (556) and the first coupling pad (5511) do not necessarily have to be arranged on the same layer of the circuit board (550). For example, as illustrated in FIG. 5g, the ground (556) is arranged adjacent to the first conductive via (5551) connected to the first coupling pad (5511), and can receive static electricity or noise signals introduced from the conductive portion to the circuit board (550) through the adjacently arranged first conductive via (5551). In one embodiment, when the ground (556) is arranged on the first substrate surface (550a) of the circuit board (550), the ground (556) may receive static electricity or noise signals through the first coupling pad (5511) arranged on the first substrate surface (550a) or the first conductive via (5551) connected to the first coupling pad (5511). In one embodiment, the ground (556) is preferably arranged on the first substrate surface (550a) or the second substrate surface (550b) of the circuit board (550), but it should be noted that the arrangement position of the ground (556) on the circuit board (550) is not limited, and the arrangement position of the ground (556) may be changed depending on the design of the circuit board (550).

[0178] In one embodiment, the discharge inducing portion (557D, 557E, 557F, 557G, 557H) can induce movement for discharge of an electrical signal from the first coupling pad (5511) to the ground (556). In one embodiment, the discharge inducing portion (557D, 557E, 557F, 557G, 557H) can function as a lightning rod to induce movement of an electrical signal by narrowing the gap between any one of the first coupling pads (5511) (e.g., the first-second coupling pad (5511-2)) and the ground (556). For example, the discharge inducing portion (557D, 557E, 557F, 557G, 557H) can induce movement for discharge of an electrical signal between the ground (556) and the first coupling pad (5511) disposed adjacent to the ground (556).

[0179] In one embodiment, the discharge inducing portion (557D, 557E, 557F, 557G, 557H) may include one or more discharge members (5571, 5572) for narrowing the gap between the first coupling pad (5511) and the ground (556). For example, the discharge members (5571, 5572) may be formed of a conductive material. The discharge members (5571, 5572) may narrow the gap between the first coupling pad (5511) and the ground (556) through which the electrical signal moves for discharge, for example, the gap through which the electrical signal moves through the dielectric (552), by a predetermined gap (G). In one embodiment, the gap (G) may be about 200 μm or less, but is not limited thereto.

[0180] Referring to FIG. 5D, in a circuit board (550D) according to one embodiment, a discharge inducing member (557D) may include a first discharge member (5571) that is connected to one of the first coupling pads (5511) and extends so as to protrude in a direction toward the ground (556) (e.g., the +v direction of FIG. 5D). In one embodiment, the discharge inducing member (557D) may be separately formed of a material that is the same as or different from the first coupling pad (5511) and connected to the first coupling pad (5511D), but may also mean a protruding portion of a part of the first coupling pad (5511D) that protrudes toward the ground (556). A gap (G) in which a dielectric (552) is positioned may be formed between the first discharge member (5571) and the ground (556).

[0181] Referring to FIG. 5E, in a circuit board (550E) according to one embodiment, a discharge inducing member (557E) may include a second discharge member (5572) that is connected to a ground (556) and extends protrudingly in a direction (e.g., -v direction of FIG. 5E) toward one of the first coupling pads (5511). In one embodiment, the second discharge member (5572) may be separately formed of a material identical to or different from the ground (556) and connected to the ground (556), but may also mean a protruding portion in which a portion of the ground (556) protrudes toward the first coupling pad (5511E). In one embodiment, a gap (G) in which a dielectric (552) is positioned may be formed between the second discharge member (5572) and the ground (556).

[0182] Referring to FIG. 5F, in a circuit board (550F) according to one embodiment, a discharge inducing member (557F) may include a first discharge member (5571) and a second discharge member (5572) that are respectively connected to one of the first coupling pads (5511) and the ground (556) and extend in a direction toward each other (e.g., the v-axis direction of FIG. 5F). In one embodiment, the first discharge member (5571) may be individually formed of a material that is the same as or different from the first coupling pad (5511F) and connected to the first coupling pad (5511F), but may also mean a protruding portion in which a portion of the first coupling pad (5511F) protrudes toward the ground (556). In one embodiment, the second discharge member (5572) may be formed separately from a material identical to or different from the ground (556) and connected to the ground (556), but may also mean a protruding portion of a portion of the ground (556) that protrudes toward the first coupling pad (5511F). In one embodiment, a gap (G) in which a dielectric (552) is disposed may be formed between the first discharge member (5571) and the second discharge member (5572).

[0183] Referring to FIG. 5G, in a circuit board (550G) according to one embodiment, a discharge inducing member (557G) may include a plurality of first discharge members (5571) and a plurality of second discharge members (5572) that are connected to one of the first coupling pads (5511) and the ground (556), respectively, and extend in a direction toward each other (e.g., the V-axis direction of FIG. 5G). For example, the plurality of first discharge members (5571) may include a first-first discharge member (5571-1) and a first-second discharge member (5571-2) that are connected to the first coupling pad (5511G) and spaced apart from each other. The plurality of second discharge members (5572) may include second-first discharge members (5572-1) and second-second discharge members (5572-2) that are connected to the ground (556) and spaced apart from each other. In one embodiment, the first-first discharge members (5571-1) and the second-first discharge members (5572-1) may correspond to each other and form a gap (G) therebetween. The first-second discharge members (5571-2) and the second-second discharge members (5572-2) may correspond to each other and form a gap (G) therebetween. In one embodiment, the number of the first discharge members (5571) and the second discharge members (5572) is not limited. For example, the first discharge member (5571) and the second discharge member (5572) may be formed in three or more, and may be arranged to correspond to each other. The lengths of the plurality of discharge members (5571, 5572) may be the same as each other, but may also be different from each other. For example, the gap (G) between the first discharge members (5571) and the second discharge members (5572) that correspond to each other may be constant. In one embodiment, the first discharge member (5571) may be individually formed of a material that is the same as or different from the first coupling pad (5511G) and may be connected to the first coupling pad (5511G), but may also mean a protruding portion where a part of the first coupling pad (5511G) protrudes toward the ground (556).In one embodiment, the second discharge member (5572) may be individually formed of the same or different material as the ground (556) and connected to the ground (556), but may also mean a protruding portion where a portion of the ground (556) protrudes toward the first coupling pad (5511G).

[0184] Referring to FIG. 5H, in a circuit board (550H) according to one embodiment, a discharge inducing member (557H) may include a first discharge member (5571) connected to a conductive via (5553) connected to a first coupling pad (5511). The first discharge member (5571) may be formed in a different layer from the first coupling pad (5511) and may be connected to the first coupling pad (5511) through the conductive via (5553). The first discharge member (5571) may extend in a direction toward the ground (556) (e.g., the +v direction in FIG. 5G). In one embodiment, the discharge inducing member (557G) may include a second discharge member (5572) connected to the ground (556) and extending in a direction toward the first discharge member (5571). The second discharge member (5572) may be formed separately from a material identical to or different from the ground (556) and connected to the ground (556), but may also refer to a protruding portion in which a portion of the ground (556) protrudes toward the first coupling pad (5511). In one embodiment, a gap (G) in which a dielectric (552) is positioned may be formed between the first discharge member (5571) and the second discharge member (5572).

[0185] In one embodiment, the circuit board (550) can form an indirect signal transmission path between an electrical connection member (553) connected to a conductive portion and a signal line (554) connected to a wireless communication circuit through a coupling connection structure between a first coupling pad (5511) and a second coupling pad (5512). Due to the indirect signal transmission through the first coupling pad (5511) and the second coupling pad (5512), a direct connection between the electrical connection member (553) and the wireless communication circuit on the circuit board (550) is prevented, and thus, a phenomenon in which static electricity or noise signals introduced into the circuit board (550) through the conductive portion are transmitted to the wireless communication circuit can be prevented or reduced. In one embodiment, a static electricity or noise signal introduced into the circuit board (550) through the conductive portion is induced to be transmitted from the first coupling pad (5511) to the ground (556) through the discharge inducing portion (557D, 557E, 557F, 557G, 557H), thereby allowing the static electricity or noise signal introduced into the circuit board (550) to be effectively discharged to the outside of the circuit board (550).

[0186] Hereinafter, for the convenience of explanation, the description of the ground (556) and the discharge induction unit (557D, 557E, 557F, 557G, 557H) may be omitted in certain embodiments, but it should be noted that it will be apparent to those skilled in the art that the configuration of the ground (556) and the discharge induction unit (557D, 557E, 557F, 557G, 557H) described in FIGS. 5d to 5g may be applied to other embodiments as well. For example, even if a separate description and indication in the drawings are omitted, it should be understood that an embodiment for a circuit board including a coupling connection structure includes the configuration of the above-described ground and discharge induction unit, unless there is a separate mention that the configuration is excluded.

[0187] Fig. 6a is a partial perspective view of a circuit board according to one embodiment. Fig. 6b is a partial plan view of a circuit board illustrating a discharge induction unit according to one embodiment.

[0188] Referring to FIGS. 6A and 6B, a circuit board (650) according to one embodiment may include a first coupling pad (6511), a second coupling pad (6512) that is separately disposed from the first coupling pad (6511), a dielectric (652) that electrically insulates the first coupling pad (6511) and the second coupling pad (6512), an electrical connection member (653) that is connected to form an electrical path with the first coupling pad (6511) and is connected to a conductive portion of a side member (e.g., the conductive portion (4411) of FIG. 4A), a signal line (654) that is connected to form an electrical path with the second coupling pad (6512) and is connected to a wireless communication circuit (e.g., the wireless communication circuit (490) of FIG. 4A), and a ground (656).

[0189] In one embodiment, the first coupling pad (6511) and the second coupling pad (6512) may be arranged to overlap each other while being separated along the first direction (T) of the circuit board (650). A capacitance for indirect signal transmission may be formed between the first coupling pad (6511) and the second coupling pad (6512).

[0190] In one embodiment, the electrical connection member (653) may be arranged to contact the first coupling pad (6511), but may be connected through a conductive connection line, such as a conductive via (e.g., the first conductive via (5551) of FIG. 5A). In one embodiment, the electrical connection member (653) may be arranged on a surface of the circuit board (650), for example, a first substrate surface (650a) of the circuit board (650). In one embodiment, the signal line (654) may be directly connected to the second coupling pad (6512), but may also be connected to the second coupling pad (6512) through a conductive connection line, such as a second conductive via (5552) of FIG. 5A. In one embodiment, the signal line (654) is formed separately from the same or different material as the second coupling pad (6512). It may be connected to the second coupling pad (6512) or may be formed integrally with the second coupling pad (6512) and extend from the second coupling pad (6512).

[0191] In one embodiment, the ground (656) may be disposed on the circuit board (650) so as to be separated from the first coupling pad (6511) and the second coupling pad (6512). For example, a dielectric (652) may be disposed between the ground (656) and the coupling pad to block direct connection between the ground (656) and the coupling pad. In one embodiment, the ground (656) may be disposed on a surface of the circuit board (650), for example, a second substrate surface (650b) of the circuit board (650), so as to be connected to another structure outside the circuit board (650). In one embodiment, the ground (656) may be disposed substantially on the same plane (i.e., substantially on the same layer) with respect to the first coupling pad (6511) and the circuit board (650) in the first direction (T).

[0192] In one embodiment, a discharge induction unit (657) may be disposed between the ground (656) and the first coupling pad (6511) to induce transmission of an electrical signal, such as a static electricity or noise signal. The discharge induction unit (657) may be connected to either the ground (656) or the first coupling pad (6511) disposed adjacent to the ground (656), thereby narrowing the gap between the first coupling pad (6511) and the ground (656). For example, when the discharge induction unit (657) is connected to the first coupling pad (6511) and protrudes toward the ground (656), as shown in FIG. 6B, a gap (G) in which a dielectric (652) is disposed may be formed between the discharge induction unit (657) and the ground (656).

[0193] FIG. 7A is a partial perspective view of a circuit board according to an embodiment. FIG. 7B is a partial perspective view of a circuit board according to an embodiment. FIG. 7C is a partial perspective view of a circuit board according to an embodiment. FIG. 7D is a partial perspective view of a circuit board according to an embodiment. FIG. 7E is a partial perspective view of a circuit board according to an embodiment. FIG. 7F is a partial perspective view of a circuit board according to an embodiment. FIG. 7G is a partial perspective view of a circuit board according to an embodiment. FIGS. 7A to 7F illustrate a portion of a circuit board having a coupling connection structure formed thereon, each illustrating various embodiments of the circuit board.

[0194] Referring to FIG. 7A, a circuit board (750A) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated by a dielectric (752), an electrical connecting member (753) (e.g., electrical connecting member (453) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), a plurality of conductive vias (755), a ground (756), and / or a discharge induction member (757).

[0195] In one embodiment, the plurality of coupling pads (751) may include a plurality of first coupling pads (7511) connected to form an electrical path to an electrical connection member (753), and a plurality of second coupling pads (7512) connected to form an electrical path to a wireless communication circuit via a signal line (754). For example, the first coupling pads (7511) may include a first-first coupling pad (7511-1) and / or a first-second coupling pad (7511-2), and the second coupling pads (7512) may include a second-first coupling pad (7512-1) and / or a second-second coupling pad (7512-2). In one embodiment, at least one of the second coupling pads (7512) may be disposed between a pair of first coupling pads (7511) with respect to the first direction (T) of the circuit board (750A). For example, the second-first coupling pad (7512-1) may be disposed to overlap between the first-first coupling pad (7511-1) and the first-second coupling pad (7511-2). In one embodiment, a plurality of first coupling pads (7511) and a plurality of second coupling pads (7512) may be disposed to alternately overlap along the first direction (T) of the circuit board (750A) (e.g., the W-axis direction of FIG. 7A). For example, along the first direction (T) of the circuit board (750A), the first-first coupling pad (7511-1), the second-first coupling pad (7512-1), the first-second coupling pad (7511-2), and the second-second coupling pad (7512-2) may be alternately arranged to overlap each other.

[0196] In one embodiment, a plurality of conductive vias (755) may be arranged to penetrate the circuit board (750A) in a first direction (T). For example, the plurality of conductive vias (755) may include one or more first conductive vias (7551) electrically connecting a first coupling pad (7511) and one or more second conductive vias (7552) electrically connecting a second coupling pad (7512). In one embodiment, the one or more second conductive vias (7552) may connect the second coupling pad (7512) and a signal line (754) connected to a wireless communication circuit.

[0197] In one embodiment, the ground (756) may be disposed on the surface of the circuit board (750A). In one embodiment, the ground (756) may be separately disposed on the circuit board (750) while being electrically insulated from the plurality of coupling pads (751) through a dielectric (752). In one embodiment, with respect to the first direction (T) of the circuit board (750), the ground (756) may be disposed on the same layer (e.g., on the same plane) as at least one first coupling pad (7511) among the plurality of first coupling pads (7511). For example, the ground (756) may be disposed on the same plane as the first-1 coupling pad (7511-1). In one embodiment, the discharge inducing portion (757) may be disposed between the first-first coupling pad (7511-1) and the ground (756) to induce transmission of an electrical signal, such as a static electricity or noise signal, from the first-first coupling pad (7511-1) toward the ground (756). For example, the discharge inducing portion (757) may be individually formed of a material identical to or different from the first-first coupling pad (7511-1) and connected to the first-first coupling pad (7511-1), or may mean a protruding portion in which a portion of the first-first coupling pad (7511-1) protrudes toward the ground (756).

[0198] When the discharge induction unit (757) extends from the first coupling pad (7511) toward the ground (756), a gap (G) in which a dielectric (752) is disposed can be formed between the discharge induction unit (757) and the ground (756).

[0199] Referring to FIG. 7B, a circuit board (750B) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) electrically insulated and separated by a dielectric (752), an electrical connecting member (753) (e.g., electrical connecting member (453) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), a plurality of conductive vias (755), a ground (756), and / or a discharge induction member (757) for reducing a gap (G) between the ground (756) and the first coupling pad (7511).

[0200] In one embodiment, the plurality of coupling pads (751) may include a plurality of first coupling pads (7511) electrically connected through one or more first conductive vias (7551), and a plurality of second coupling pads (7512) electrically connected through one or more second conductive vias (7552). The first coupling pads (7511) may be connected to form an electrical path to an electrical connection member (753). The second coupling pads (7512) may be connected to form an electrical path to a signal line (754) connected to a wireless communication circuit. In one embodiment, the plurality of first coupling pads (7511) may include first-first coupling pads (7511-1) and / or first-second coupling pads (7511-2) spaced apart from each other along a first direction (T) of a circuit board (750B). The plurality of second coupling pads (7512) may include second-first coupling pads (7512-1) and / or second-second coupling pads (7512-2) spaced apart from each other along the first direction (T) of the circuit board (750B). The plurality of first coupling pads (7511) and second coupling pads (7512) may be alternately arranged along the first direction (T) of the circuit board (750). When the circuit board (750B) is viewed along the first direction (T), the first coupling pads (7511) and second coupling pads (7512) that are adjacent to each other may overlap at least partially with each other. In one embodiment, a plurality of coupling pads (751) can transmit an electrical signal in a non-contact manner through a capacitance formed in an overlapping area of ​​a first coupling pad (7511) and a second coupling pad (7512) that are arranged adjacent to each other.

[0201] In one embodiment, the electrical connection member (753) may be connected to the first coupling pad (7511) through a connection line (7531) of a conductive material. For example, the connection line (7531) may be individually formed of the same or different material as the first coupling pad (7511) and connected, or may be a portion of the first coupling pad (7511) extending to the electrical connection member (753). A signal line (754) connected to the wireless communication circuit may be connected to the second coupling pad (7512) through a connection line (7541) of a conductive material. For example, the signal line (754) may be individually formed of the same or different material as the second coupling pad (7512) and connected to the second coupling pad (7512), or may be a portion extending from a portion of the second coupling pad (7512).

[0202] Referring to FIG. 7C, a circuit board (750C) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (752), an electrical connection member (753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (755).

[0203] In one embodiment, the plurality of coupling pads (751) may include a plurality of first coupling pads (7511) electrically connected to an electrical connection member (753), and a plurality of second coupling pads (7512) electrically connected to a signal line (754). For example, the plurality of first coupling pads (7511) may include a first-first coupling pad (7511-1) and / or a first-second coupling pad (7511-2). In one embodiment, the plurality of first coupling pads (7511) may be electrically connected through a first conductive via (7551). The second coupling pad (7512) may be connected to the signal line (754) through a second conductive via (7552). In one embodiment, the second coupling pad (7512) may be positioned between the first-first coupling pad (7511-1) and the first-second coupling pad (7511-2) with respect to the first direction (T) of the circuit board (750C). A capacitance for non-contact signal transmission may be formed between the second coupling pad (7512) and each of the first coupling pads (7511).

[0204] Referring to FIG. 7D, a circuit board (750D) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (752), an electrical connection member (753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (755).

[0205] In one embodiment, the plurality of coupling pads (751) may include a plurality of first coupling pads (7511) connected to form an electrical path to an electrical connection member (753), and a plurality of second coupling pads (7512) connected to form an electrical path to a signal line (754). For example, the plurality of first coupling pads (7511) may include a first-first coupling pad (7511-1), a first-second coupling pad (7511-2), and / or a first-third coupling pad (7511-3). In one embodiment, the plurality of second coupling pads (7512) may include a second-first coupling pad (7512-1), a second-second coupling pad (7512-2), and / or a second-third coupling pad (7512-3). In one embodiment, with respect to the first direction (T) of the circuit board (750D), at least one second coupling pad (7512) among the plurality of second coupling pads (7512) may be arranged to overlap between a pair of first coupling pads (7511). For example, when the circuit board (750D) is viewed in the first direction (T), the second-first coupling pad (7512-1) may be arranged to overlap between the first-first coupling pad (7511-1) and the first-second coupling pad (7511-2), and the second-second coupling pad (7512-2) may be arranged to overlap between the first-second coupling pad (7511-2) and the first-third coupling pad (7511-3). In one embodiment, a plurality of first coupling pads (7511) and second coupling pads (7512) may be alternately arranged along the first direction (T) of the circuit board (750) such that at least some of them overlap with each other. For example, along the first direction (T) of the circuit board (750D), three first coupling pads (7511-1, 7511-2, 7511-3) and three second coupling pads (7512-1, 7512-2, 7512-3) may be alternately arranged such that at least some of them overlap with each other.With respect to the first direction (T) of the circuit board (750D), a capacitance for non-contact signal transmission may be formed between the first coupling pad (7511) and the second coupling pad (7512) that are adjacent to each other. The total capacitance formed between the plurality of coupling pads (751) may be greater than the sum of the respective capacitances formed between the first coupling pad (7511) and the second coupling pad (7512) that are adjacent to each other.

[0206] In one embodiment, the plurality of conductive vias (755) may include a plurality of first conductive vias (7551) electrically connecting a plurality of first coupling pads (7511) and a plurality of second conductive vias (7552) electrically connecting a plurality of second coupling pads (7512). In one embodiment, the plurality of first conductive vias (7551) may electrically connect a pair of first coupling pads (7511) that are arranged adjacent to each other along a first direction (T) of the circuit board (750D). For example, a first conductive via (7551) may be arranged between the first-first coupling pad (7511-1) and the first-second coupling pad (7511-2) and between the first-second coupling pad (7511-2) and the first-third coupling pad (7511-3). In one embodiment, a plurality of second conductive vias (7552) may electrically connect a pair of second coupling pads (7512) that are arranged adjacent to each other along the first direction (T) of the circuit board (750D). For example, a second conductive via (7552) may be arranged between the second-first coupling pad (7512-1) and the second-second coupling pad (7512-2), and between the second-second coupling pad (7512-2) and the second-third coupling pad (7512-3). In one embodiment, when a signal line (754) connected to a wireless communication circuit is separated from the second coupling pad (7512) and the dielectric (752) by the second coupling pad (7512), at least one second connection conductive via (7552a) may electrically connect the second coupling pad (7512) and the signal line (754).

[0207] Referring to FIG. 7E, a circuit board (750E) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (752), an electrical connection member (753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (755).

[0208] In one embodiment, the plurality of coupling pads (751) may include a plurality of first coupling pads (7511) connected to form an electrical path to an electrical connection member (753), and a plurality of second coupling pads (7512) connected to form an electrical path to a signal line (754). In one embodiment, the plurality of second coupling pads (7512) may be connected to the signal line (754) via at least one conductive via (7522a). In one embodiment, the first coupling pads (7511) may include a first-first coupling pad (7511-1), a first-second coupling pad (7511-2), and / or a first-third coupling pad (7511-3). For example, the second coupling pad (7512) may include a second-first coupling pad (7512-1), a second-second coupling pad (7512-2), a second-third coupling pad (7512-3), and / or a second-fourth coupling pad (7512-4). In one embodiment, a plurality of first coupling pads (7511) may be electrically connected through one or more first conductive vias (7551). A plurality of second coupling pads (7512) may be electrically connected through one or more second conductive vias (7552).

[0209] In one embodiment, along the first direction (T) of the circuit board (750E), the plurality of coupling pads (751) may form a plurality of coupling pad sets including at least one first coupling pad (7511) and at least one second coupling pad (7512) that are arranged adjacent to each other. For example, the first-first coupling pad (7511-1) and the second-first coupling pad (7512-1) may be arranged adjacent to each other to form a first coupling pad set, the second-second coupling pad (7512-2), the first-second coupling pad (7511-2) and the second-third coupling pad (7512-3) may form a second coupling pad set, and the first-third coupling pad (7511-3) and the second-fourth coupling pad (7512-4) may form a third coupling pad set.

[0210] In one embodiment, the spacing (d1, d3, d4, d6) between the first coupling pad (7511) and the second coupling pad (7512) forming one set of coupling pads with respect to the first direction (T) of the circuit board (750E) may vary. For example, the gap (d1) between the first-first coupling pad (7511-1) and the second-first coupling pad (7512-1) forming the first coupling pad set, the gap (d3) between the second-second coupling pad (7512-2) and the first-second coupling pad (7511-2) forming the second coupling pad set, the gap (d4) between the first-second coupling pad (7511-2) and the second-third coupling pad (7512-3), and the gap (d6) between the first-third coupling pad (7511-3) and the second-fourth coupling pad (7512-4) forming the third coupling pad set may be smaller than the gap (d2) between the first coupling pad set and the second coupling pad set, and the gap (d5) between the second coupling pad set and the third coupling pad set. In one embodiment, the gap (d2) between the first coupling pad set and the second coupling pad set and the gap (d5) between the second coupling pad set and the third coupling pad set may be different from each other. In one embodiment, the gaps (d1, d3, d4, d6) between the first coupling pad (7511) and the second coupling pad (7512) forming each coupling pad set may be substantially the same, but are not limited thereto and may be different from each other.

[0211] Referring to FIG. 7F, a circuit board (750F) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (752), an electrical connection member (753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (755).

[0212] In one embodiment, the plurality of coupling pads (751) may include a plurality of first coupling pads (7511) electrically connected to an electrical connection member (753) and a plurality of second coupling pads (7512) electrically connected to a signal line (754). In one embodiment, the first coupling pads (7511) may include a first-first coupling pad (7511-1), a first-second coupling pad (7511-2), and / or a first-third coupling pad (7511-3). The plurality of first coupling pads (7511) may be electrically connected via a first conductive via (7551). In one embodiment, the second coupling pad (7512) may include a second-first coupling pad (7512-1), a second-second coupling pad (7512-2), and a second-third coupling pad (7512-3). In one embodiment, the plurality of second coupling pads (7512) may be connected to the signal line (754) through at least one conductive via (7522a). In one embodiment, with respect to the first direction (T) of the circuit board (750F), at least one second coupling pad (7512) may be disposed between a pair of first coupling pads (7511). In one embodiment, the plurality of first coupling pads (7511) and second coupling pads (7512) may be disposed alternately along the first direction (T) of the circuit board (750F) such that at least a portion thereof overlaps.

[0213] In one embodiment, along the first direction (T) of the circuit board (750F), the plurality of coupling pads (751) may form a plurality of sets of coupling pads (751) including at least one first coupling pad (7511) and at least one second coupling pad (7512) that are arranged adjacent to each other. For example, the first-first coupling pad (7511-1), the second-first coupling pad (7512-1), and the first-second coupling pad (7511-2) may be arranged adjacent to each other to form a first coupling pad set. The second-second coupling pad (7512-2), the first-third coupling pad (7511-3), and the second-third coupling pad (7512-3) may be arranged adjacent to each other to form a second coupling pad set. In one embodiment, the spacing (d1, d2, d4, d5) between the first coupling pad (7511) and the second coupling pad (7512) forming one coupling set may be smaller than the spacing (d3) between adjacent coupling pad sets.

[0214] In one embodiment, with respect to the first direction (T) of the circuit board (750F), the thickness of each of the plurality of coupling pads (751) and the spacing between adjacent coupling pads, for example, the thickness of the dielectric (752) disposed between adjacent coupling pads, may be different from each other. For example, the first-first coupling pad (7511-1) and the first-second coupling pad (7511-2) may have a first-first thickness (t1-1) and a first-second thickness (t1-2), respectively, and the second-first coupling pad (7512-1) disposed adjacent to the first-first coupling pad (7511-1) and the first-second coupling pad (7511-2) may have a second-first thickness (t2-1) greater than the first-first thickness (t1-1) and the first-second thickness (t1-2). For example, the second-second coupling pad (7512-2) and the second-third coupling pad (7512-3) may have a second-second thickness (t2-2) and a second-third thickness (t2-3), respectively, and the first-third coupling pad (7511-3) disposed between the second-second coupling pad (7512-2) and the second-third coupling pad (7512-3) may have a first-third thickness (t1-3) greater than the second-second thickness (t2-2) and the second-third thickness (t2-3). For example, the thicknesses of the plurality of coupling pads (751) may be the same as each other, or at least some of them may be different, and the spacing between adjacent coupling pads (7511, 7512) may also be the same as each other, or at least some of them may be different. Depending on the difference in thickness of each coupling pad (751), the capacitance formed between adjacent coupling pads (7511, 7512) may vary. Since the thickness of the dielectric (752) placed between the coupling pads (7511, 7512) varies depending on the spacing between the adjacent coupling pads (7511, 7512), the capacitance formed between the adjacent coupling pads (7511, 7512) may be set differently.

[0215] Referring to FIG. 7G, a circuit board (750G) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (752), an electrical connection member (753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (755).

[0216] In one embodiment, the plurality of coupling pads (751) may include a first coupling pad (7511) electrically connected to an electrical connection member (753) and a plurality of second coupling pads (7512) electrically connected to a signal line (754). In one embodiment, the first coupling pad (7511) may be electrically connected to the electrical connection member (753) through a first conductive via (7551). In one embodiment, the second coupling pad (7512) may include a second-first coupling pad (7512-1) and a second-second coupling pad (7512-2). In one embodiment, the plurality of second coupling pads (7512) may be electrically connected to each other through a second conductive via (7552).

[0217] In one embodiment, the first coupling pad (7511) may be disposed between a pair of second coupling pads (7512) with respect to the first direction (T) of the circuit board (750G). For example, the first coupling pad (7511) may be disposed in a layer located between the second-first coupling pad (7512-1) and the second-second coupling pad (7512-2). In one embodiment, the first coupling pad (7511) and the pair of second coupling pads (7512) may be disposed alternately along the first direction (T) of the circuit board (750G) such that at least a portion of the first coupling pads overlap.

[0218] FIG. 8A is a partial perspective view of a circuit board according to one embodiment. FIG. 8B is an exploded perspective view illustrating the layer structure of a portion of the circuit board according to one embodiment.

[0219] Referring to FIGS. 8A and 8B , a circuit board (850) according to one embodiment (e.g., circuit board (450) of FIG. 4A ) may include a plurality of coupling pads (851) (e.g., coupling pads (451) of FIG. 4A ) that are electrically insulated and separated from each other by a dielectric (852), an electrical connection member (853) (e.g., electrical connection member (453) of FIG. 4A ) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A ), a signal line (854) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A ), and / or a plurality of conductive vias (855).

[0220] In one embodiment, the plurality of coupling pads (851) may include a plurality of first coupling pads (8511) electrically connected through one or more first conductive vias (8551), and a plurality of second coupling pads (8512) electrically connected through one or more second conductive vias (8552). For example, the plurality of first coupling pads (8511) and second coupling pads (8512) may be alternately arranged along a first direction (T) of the circuit board (850), and the first coupling pads (8511) and second coupling pads (8512) that are adjacent to each other may at least partially overlap each other when viewed in the first direction (T) of the circuit board (850). For example, the first coupling pad (8511) may include a first-first coupling pad (8511-1), a first-second coupling pad (8511-2), and / or a first-third coupling pad (8511-3). For example, the second coupling pad (8512) may include a second-first coupling pad (8512-1), a second-second coupling pad (8512-2), and / or a second-third coupling pad (8512-3).

[0221] In one embodiment, with respect to the first direction (T) of the circuit board (850), the overlapping areas between the first coupling pad (8511) and the second coupling pad (8512) that are adjacent to each other may be different from each other. For example, among the plurality of coupling pads (851), the overlapping areas between the first coupling pad (8511) and the second coupling pad (8512) that are adjacent to each other may have an irregular shape. For example, each of the coupling pads (851) may have a different shape from each other. For example, as illustrated in FIG. 8B, when viewed in the first direction (T) of the circuit board (850), the overlapping area of ​​the 1-1 coupling pad (8511-1) and the 2-1 coupling pad (8512-1) that are arranged adjacent to each other may be different from the overlapping area of ​​the 2-1 coupling pad (8512-1) and the 1-2 coupling pad (8511-2). For example, when viewed in the first direction (T) of the circuit board (850), the 2-2 coupling pad (8512-2) and the 2-3 coupling pad (8512-3) may have different shapes, so that the overlapping area for the 1-3 coupling pad (8511-3) arranged therebetween may be set to be different from each other. As the overlapping area between the first coupling pad (8511) and the second coupling pad (8512) positioned adjacent to each other along the first direction (T) of the circuit board (850) is different, the size of each capacitance formed between the first coupling pad (8511) and the second coupling pad (8512) positioned adjacent to each other can be set differently.

[0222] FIG. 9A is a partial perspective view of a circuit board according to one embodiment. FIG. 9B is an exploded perspective view illustrating the layer structure of a portion of a circuit board according to one embodiment.

[0223] Referring to FIGS. 9A and 9B, a circuit board (950) according to an embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (951) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (952), an electrical connection member (953) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (954) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (955).

[0224] In one embodiment, the plurality of coupling pads (951) may include a plurality of first coupling pads (9511) electrically connected through one or more first conductive vias (9551), and a plurality of second coupling pads (9512) electrically connected through one or more second conductive vias (9552). In one embodiment, the plurality of first coupling pads (9511) may be separatedly arranged along the first direction (T) of the circuit board (950). For example, the plurality of first coupling pads (9511) may include a first-first coupling pad (9511-1), a first-second coupling pad (9511-2), a first-third coupling pad (9511-3), a first-fourth coupling pad (9511-4), and a first-fifth coupling pad (9511-5). In one embodiment, a plurality of second coupling pads (9512) may be separately arranged along the first direction (T) of the circuit board (950). For example, the plurality of second coupling pads (9512) may include a second-first coupling pad (9512-1), a second-second coupling pad (9512-2), a second-third coupling pad (9512-3), a second-fourth coupling pad (9512-4), and a second-fifth coupling pad (9512-5). In one embodiment, when looking at the first direction (T) of the circuit board (950), the first coupling pads (9511) and the second coupling pads (9512) that are arranged adjacent to each other may overlap at least partially. For example, with respect to the first direction (T) of the circuit board (950), the second-second coupling pad (9512-2) may be arranged to overlap between the first-first coupling pad (9511-1) and the first-third coupling pad (9511-3), the second-third coupling pad (9512-3) may be arranged to overlap between the first-third coupling pad (9511-3) and the first-fifth coupling pad (9511-5), and the second-fourth coupling pad (9512-4) may be arranged to overlap with the first-fourth coupling pad (9511-4). In one embodiment, with respect to the first direction (T) of the circuit board (950), the overlapping areas between the adjacent first coupling pads (9511) and the second coupling pads (9512) may be different from each other.For example, among the plurality of coupling pads (951), the overlapping area of ​​the first coupling pad (9511) and the second coupling pad (9512) adjacent to each other may have an irregular shape. For example, the coupling pads (951) may have different shapes from each other.

[0225] In one embodiment, at least one first coupling pad (9511) and at least one second coupling pad (9512) may be disposed on substantially the same layer with respect to the first direction (T) of the circuit board (950). For example, at least one first coupling pad (9511) and one second coupling pad (9512) may be disposed such that at least a portion thereof overlaps when viewed in a direction perpendicular to the first direction (T) of the circuit board (950). For example, the first-first coupling pad (9511-1) and the second-first coupling pad (9512-1) may be disposed such that they overlap when viewed in a direction perpendicular to the first direction (T) of the circuit board (950) (e.g., the V-axis direction). The first-second coupling pad (9511-2) and the second-second coupling pad (9512-2) may be arranged to overlap each other when viewed in a direction perpendicular to the first direction (T) of the circuit board (950) (e.g., the V-axis direction and the U-axis direction). The first-fourth coupling pad (9511-4) and the second-third coupling pad (9512-3) may be arranged to overlap each other when viewed in a second direction perpendicular to the first direction (T) of the circuit board (950) (e.g., the V-axis direction and the U-axis direction). The first-fifth coupling pad (9511-5) and the second-fourth coupling pad (9512-4) may be arranged to overlap each other when viewed in a second direction perpendicular to the first direction (T) of the circuit board (950) (e.g., the V-axis direction and the U-axis direction).

[0226] In one embodiment, the plurality of coupling pads (951) may form a capacitance (e.g., a capacitance formed in the first direction (T) of the circuit board (950)) formed between the first coupling pad (9511) and the second coupling pad (9512) arranged to overlap along the first direction (T) of the circuit board (950). At the same time, the plurality of coupling pads (951) may form a capacitance (e.g., a capacitance formed between the overlapping area in the U-axis or V-axis direction) formed between the first coupling pad (9511) and the second coupling pad (9512) arranged on the same layer (plane). For example, the total capacitance formed by the plurality of coupling pads (951) can be determined through the capacitance between the first coupling pad (9511) and the second coupling pad (9512) formed in the plane direction of the circuit board (950) as well as the first direction (T) of the circuit board (950).

[0227] Figure 10 is a partial perspective view of a circuit board according to one embodiment.

[0228] Referring to FIG. 10, a circuit board (1050) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1051) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (1052), an electrical connection member (1053) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (1054) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (1055).

[0229] In one embodiment, the circuit board (1050) may include a first substrate surface (1050a) and a second substrate surface (1050b) that are exposed to the outside with respect to the first direction (T). In one embodiment, the electrical connection member (1053) may be disposed on the first substrate surface (1050a) of the circuit board (1050). In one embodiment, the ground (e.g., the ground (556) of FIG. 5b) may be disposed on the first substrate surface (1050a) or the second substrate surface (1050b) of the circuit board (1050).

[0230] In one embodiment, the plurality of coupling pads (1051) may include a plurality of first coupling pads (10511) electrically connected through one or more first conductive vias (10551) and a plurality of second coupling pads (10512) electrically connected through one or more second conductive vias (10552). In one embodiment, the plurality of first coupling pads (10511) and second coupling pads (10512) may be alternately arranged along a first direction (T) of the circuit board (1050). When the circuit board (1050) is viewed in the first direction (T), the first coupling pads (10511) and the second coupling pads (10512) that are arranged adjacent to each other may be arranged such that at least a portion thereof overlaps. For example, the plurality of first coupling pads (10511) may include a first-first coupling pad (10511-1) and a first-second coupling pad (10511-2). The plurality of second coupling pads (10512) may include a second-first coupling pad (10512-1) and a second-second coupling pad (10512-2).

[0231] In one embodiment, the plurality of coupling pads (1051) may be arranged inside the circuit board (1050) so as not to be exposed to the outer surface of the circuit board (1050), for example, the first substrate surface (1050a) and the second substrate surface (1050b). For example, a dielectric (1052) may be arranged on the outer surface of the 1-1 coupling pad (10511-1) in the direction of the first substrate surface (1050a), and a dielectric (1052) may be arranged on the outer surface of the 2-2 coupling pad (10512-2) in the direction of the second substrate surface (1050b). Through the dielectric (1052), the plurality of coupling pads (1051) may not be exposed to the outer surface of the circuit board (1050).

[0232] Figure 11 is a partial perspective view of a circuit board according to one embodiment.

[0233] Referring to FIG. 11, a circuit board (1150) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1151) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (1152), an electrical connection member (1153) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4), a signal line (1154) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (1155).

[0234] In one embodiment, the plurality of coupling pads (1151) may include a plurality of first coupling pads (11511) electrically connected through one or more first conductive vias (11551) and a plurality of second coupling pads (11512) electrically connected through one or more second conductive vias (11552). In one embodiment, the plurality of first coupling pads (11511) may be separatedly arranged along the first direction (T) of the circuit board (1150). For example, the plurality of first coupling pads (11511) may include a first-first coupling pad (11511-1), a first-second coupling pad (11511-2), and a first-third coupling pad (11511-3). In one embodiment, a plurality of second coupling pads (11512) may be separately arranged along the first direction (T) of the circuit board (1150). For example, the plurality of second coupling pads (11512) may include a second-first coupling pad (11512-1) and a second-second coupling pad (11512-2).

[0235] In one embodiment, at least one first coupling pad (11511) and one second coupling pad (11512) may be arranged so that at least a portion thereof overlaps when viewed in the first direction (T) of the circuit board (1150). For example, when the circuit board (1150) is viewed in the first direction (T), the second-second coupling pad (11512-2) may be arranged between the first-second coupling pad (11511-2) and the first-third coupling pad (11511-3), and at least a portion thereof may overlap the first-second coupling pad (11511-2) and the first-third coupling pad (11511-3).

[0236] In one embodiment, at least one first coupling pad (11511) and at least one second coupling pad (11512) may be arranged on the same layer of the circuit board (1150) with respect to the first direction (T) of the circuit board (1150). For example, the first-first coupling pad (11511-1) and the second-first coupling pad (11512-1) may be arranged on the same layer in the first direction (T) of the circuit board (1150) while being separated from each other by a dielectric (1152). When viewed in a direction perpendicular to the first direction (T) of the circuit board (1150) (e.g., the V-axis direction), at least a portion of the first-first coupling pad (11511-1) and the second-first coupling pad (11512-1) may overlap. A capacitance may be formed between the overlapping areas of the 1-1 coupling pad (11511-1) and the 2-1 coupling pad (11512-1) in a direction perpendicular to the first direction (T) of the circuit board (1150) (e.g., V-axis direction).

[0237] Figure 12 is a partial perspective view of a circuit board according to one embodiment.

[0238] Referring to FIG. 12, a circuit board (1250) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1251) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other through a dielectric (1252), an electrical connection member (1253) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (1254) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and a plurality of conductive vias (1255).

[0239] In one embodiment, the plurality of coupling pads (1251) may include a plurality of first coupling pads (12511) electrically connected through one or more first conductive vias (12551) and a plurality of second coupling pads (12512) electrically connected through one or more second conductive vias (12552). In one embodiment, the plurality of first coupling pads (12511) may be separatedly arranged along the first direction (T) of the circuit board (1250). For example, the plurality of first coupling pads (12511) may include a first-first coupling pad (12511-1), a first-second coupling pad (12511-2), and a first-third coupling pad (12511-3). In one embodiment, a plurality of second coupling pads (12512) may be separately arranged along the first direction (T) of the circuit board (1250). For example, the plurality of second coupling pads (12512) may include a second-first coupling pad (12512-1) and a second-second coupling pad (12512-2).

[0240] In one embodiment, at least one first coupling pad (12511) and a second coupling pad (12512) may be arranged so that at least a portion thereof overlaps when viewed in the first direction (T) of the circuit board (1250). For example, when the circuit board (1250) is viewed in the first direction (T), the second-second coupling pad (12512-2) may be arranged between the first-second coupling pad (12511-2) and the first-third coupling pad (12511-3), and may at least a portion thereof overlap the first-second coupling pad (12511-2) and the first-third coupling pad (12511-3). In one embodiment, a capacitance may be formed in the first direction (T) of the circuit board (1250) between the first coupling pad (12511) and the second coupling pad (12512) that are arranged adjacent to each other.

[0241] In one embodiment, at least one first coupling pad (12511) and at least one second coupling pad (12512) may be arranged on the same layer with respect to the first direction (T) of the circuit board (1250). For example, the first-first coupling pad (12511-1) and the second-first coupling pad (12512-1) may be arranged on the same layer. In one embodiment, the first coupling pad (12511) and the second coupling pad (12512) arranged on the same layer may each include a plurality of pad portions that are arranged crosswise in a direction perpendicular to the first direction (T) of the circuit board (1250). For example, the first-first coupling pad (12511-1) may include a plurality of first-first pad portions (12511a) extending in the +V direction and being separated from each other, and the second-first coupling pad (12512-1) may include a plurality of second-first pad portions (12512a) extending in the -V direction and being separated from each other. In one embodiment, the plurality of first-first pad portions (12511a) and the plurality of second-first pad portions (12512a) may be arranged crosswise along a direction perpendicular to the first direction (T) of the circuit board (1250), for example, the U-axis direction, while being separated by a dielectric (1252). In one embodiment, a capacitance may be formed in the U-axis direction between the first-first pad portions (12511a) and the second-first pad portions (12512a) arranged adjacent to each other.

[0242] Figure 13 is a partial perspective view of a circuit board according to one embodiment.

[0243] Referring to FIG. 13, a circuit board (1350) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1351) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (1352), an electrical connection member (1353) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (1354) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), and / or a plurality of conductive vias (1355).

[0244] In one embodiment, the plurality of coupling pads (1351) may include a plurality of first coupling pads (13511) electrically connected through one or more first conductive vias (13551), and a plurality of second coupling pads (13512) electrically connected through one or more second conductive vias (13552).

[0245] In one embodiment, at least one first coupling pad (13511) and at least one second coupling pad (13512) may be arranged on the same layer with respect to the first direction (T) of the circuit board (1350). In one embodiment, the first coupling pad (13511) and the second coupling pad (13512) arranged on the same layer may each include a plurality of pad portions that are cross-arranged in a direction perpendicular to the first direction (T) of the circuit board (1350). For example, the first coupling pad (13511) may include a first-first pad portion (13511a) extending in the +V direction and a first-second pad portion (13511b) extending in the +U direction. The second coupling pad (13512) may include a second-first pad portion (13512a) extending in the -V direction and a second-second pad portion (13512b) extending in the -U direction. In one embodiment, the pad portions of the first coupling pad (13511) and the pad portions of the second coupling pad (13512) may be intersected along a direction perpendicular to the first direction (T) of the circuit board (1350) while being separated by a dielectric (1352). For example, the first-second pad portions (13511b) of the first coupling pad (13511) and the second-second pad portions (13512b) of the second coupling pad (13512) may be intersected along a direction perpendicular to the first direction (T) of the circuit board (1350), for example, along the V-axis direction. In one embodiment, a capacitance may be formed in the V-axis direction between the first-second pad portion (13511b) and the second-second pad portion (13512b) that are arranged adjacent to each other. In one embodiment, a capacitance may be formed in the U-axis direction between the first-first pad portion (13511a) and the second-second pad portion (13512b) that are arranged adjacent to each other. A capacitance may be formed in the U-axis direction between the second-first pad portion (13512a) and the first-second pad portion (13511b) that are arranged adjacent to each other.

[0246] In one embodiment, when a plurality of first conductive vias (13551) are connected to a first coupling pad (13511) and a plurality of second conductive vias (13552) are connected to a second coupling pad (13512), a capacitance can be formed between the first conductive vias (13551) and the second conductive vias (13552) that are arranged adjacent to each other along a direction perpendicular to the first direction (T) of the circuit board (1350).

[0247] Although FIG. 13 illustrates that the first coupling pad (13511) and the second coupling pad (13512) are disposed only on a surface layer (e.g., a surface facing the +W direction) of the circuit board (1350) for convenience of explanation, a plurality of first coupling pads (13511) and second coupling pads (13512) may be disposed on a layer of the circuit board (1350) along the first direction (T). In one embodiment, the first coupling pads (13511) and the second coupling pads (13512) disposed on the same layer of the circuit board (1350) may form the same pattern and may be disposed along the first direction (T) of the circuit board (1350).

[0248] FIG. 14a is a schematic diagram illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment. FIG. 14b is a schematic diagram illustrating a circuit connection structure of a side member, a circuit board, and a wireless communication circuit according to an embodiment. FIG. 14c is a perspective view illustrating a portion of a circuit board according to an embodiment. FIG. 14d is an exploded perspective view illustrating a layer structure of a portion of a circuit board according to an embodiment.

[0249] Referring to FIGS. 14A and 14B, an electronic device (1401) according to one embodiment may include a housing (e.g., housing (210) of FIG. 2A), a circuit board (1450) (e.g., circuit boards (251, 252) of FIG. 3), and a wireless communication circuit (1490).

[0250] In one embodiment, the housing may include a front surface (e.g., a front surface (210a) of FIG. 2a), a rear surface opposite to the front surface (e.g., a rear surface (210b) of FIG. 2b), and a side surface surrounding an interior space between the front surface and the rear surface (e.g., a side surface (211c) of FIG. 2a). In one embodiment, the housing may include a side member (1440) (e.g., a side member (240) of FIG. 3) forming at least a portion of the side surface and surrounding the interior space. In one embodiment, the side member (1440) may include a conductive portion (14411) formed of a conductive material. In one embodiment, the conductive portion (14411) may function as a radiator of an antenna through which an electrical signal flows. In one embodiment, the side member (1440) may include one or more connection portions (14413) formed on the conductive portion (14411) and electrically connected to a circuit board (1450). In one embodiment, the connecting portion (14413) may function as a power supply portion to which an electrical signal is applied to the conductive portion (14411), or as a ground portion for an electrical signal applied to the conductive portion (14411) to escape.

[0251] In one embodiment, a circuit board (1450) may be disposed in an interior space of the housing. In one embodiment, the circuit board (1450) may include one or more electrical connection members (1453) electrically connected to the conductive portion (14411). In one embodiment, the circuit board (1450) may be electrically connected to a wireless communication circuit (1490). The circuit board (1450) may include a plurality of signal lines (14541, 14542) connected to the wireless communication circuit (1490). For example, the circuit board (1450) may include a first signal line (14541) and a second signal line (14542) each connected to the wireless communication circuit (1490). Each of the plurality of signal lines (14541, 14542) may be connected to different wireless communication circuits (1490) or may be independently connected to a single wireless communication circuit (1490) to transmit and receive individual electrical signals, respectively. In one embodiment, the circuit board (1450) may form a plurality of electrical paths from an electrical connection member (1453) connected to a single conductive portion (14411) to the wireless communication circuit (1490) through each of the signal lines (14541, 14542). For example, the circuit board (1450) may form a first electrical path from the electrical connection member (1453) to the first signal line (14541), and a second electrical path from the electrical connection member (1453) to the second signal line (14542).

[0252] In one embodiment, the circuit board (1450) may include a plurality of coupling pads (1451) arranged in an electrical path. The plurality of coupling pads (1451) may electrically connect signal lines (14541, 14542) connected to an electrical connection member (1453) and a wireless communication circuit (1490) by a non-contact coupling connection structure. In one embodiment, the plurality of coupling pads (1451) may include a first coupling pad (14511) connected to the electrical connection member (1453), a second coupling pad (14512) coupled with the first coupling pad (14511) and connected to a first signal line (14541), and a fourth coupling pad (14514) coupled with the first coupling pad (14511) and connected to a second signal line (14542). For example, the second coupling pad (14512) and the fourth coupling pad (14514) may be coupled to the first coupling pad (14511) to form capacitance therebetween, respectively, thereby forming an electrical path between the electrical connection member (1453) and the first signal line (14541) and an electrical path between the electrical connection member (1453) and the second signal line (14542). In one embodiment, the electronic device (1401) may selectively transmit an electrical signal to one electrical connection member (1453) through the first signal line (14541) and the second signal line (14542), thereby utilizing one conductive portion (14411) to which the electrical connection member (1453) is connected as an antenna of a different frequency band. In one embodiment, the wireless communication circuit (1490) may include a first circuit (14901) and a second circuit (14902) connected to a first signal line (14541) and a second signal line (14542), respectively. In one embodiment, the wireless communication circuit (1490) may selectively transmit and receive an electrical signal to and from any one of the first signal line (14541) and the second signal line (14542) through switching operations of the first circuit (14901) and the second circuit (14902).

[0253] Referring to FIGS. 14c and 14d, a circuit board (1450) according to one embodiment may include a plurality of coupling pads (1451) that are electrically insulated and separated by a dielectric (1452), an electrical connection member (1453) for connection to a conductive portion (14411) of a side member (1440), a first signal line (14541), a second signal line (14542) connected to a wireless communication circuit (1490), and a plurality of conductive vias (1455).

[0254] In one embodiment, the plurality of coupling pads (1451) may include a plurality of first coupling pads (14511), a plurality of second coupling pads (14512), and a plurality of fourth coupling pads (14514). In one embodiment, the plurality of first coupling pads (14511) may be connected to an electrical connection member (1453) to form an electrical path. In one embodiment, the plurality of second coupling pads (14512) may be connected to a wireless communication circuit (1490) to form an electrical path via a first signal line (14541). In one embodiment, the plurality of fourth coupling pads (14514) may be connected to a wireless communication circuit (1490) to form an electrical path via a second signal line (14542).

[0255] In one embodiment, with respect to the first direction (T) of the circuit board (1450), at least one of the plurality of second coupling pads (14512) may be disposed between a pair of first coupling pads (14511). At least a portion of the second coupling pad (14512) may overlap an adjacent first coupling pad (14511) when the circuit board (1450) is viewed in the first direction (T). In one embodiment, with respect to the first direction (T) of the circuit board (1450), at least one of the plurality of fourth coupling pads (14514) may be disposed between a pair of first coupling pads (14511). At least a portion of the fourth coupling pad (14514) may overlap an adjacent first coupling pad (14511) when the circuit board (1450) is viewed in the first direction (T).

[0256] In one embodiment, a plurality of first coupling pads (14511) and second coupling pads (14512) may be alternately arranged along a first direction (T) of a circuit board (1450). For example, the plurality of first coupling pads (14511) may include a first-first coupling pad (14511-1), a first-second coupling pad (14511-2), and a first-third coupling pad (14511-3), and the plurality of second coupling pads (14512) may include a second-first coupling pad (14512-1), a second-second coupling pad (14512-2), and a second-third coupling pad (14512-3) that are alternately arranged with the respective first coupling pads (14511-1, 14511-2, and 14511-3). In one embodiment, a plurality of first coupling pads (14511) and fourth coupling pads (14514) may be alternately arranged along a first direction (T) of the circuit board (1450). For example, the fourth coupling pad (14514) may include a fourth-first coupling pad (14514-1), a fourth-second coupling pad (14514-2), and a fourth-third coupling pad (14514-3), and may be alternately arranged along the first direction (T) of the circuit board (1450) with the first-first coupling pad (14511-1), the first-second coupling pad (14511-2), and the first-third coupling pad (14511-3). In one embodiment, the first coupling pad (14511) and the second coupling pad (14512) that are adjacent to each other may overlap at least partially when the circuit board (1450) is viewed in the first direction (T) and may form a capacitance for indirect transmission of an electrical signal between the electrical connection member (1453) and the first signal line (14541). In one embodiment, the first coupling pad (14511) and the fourth coupling pad (14514) that are adjacent to each other may overlap at least partially when the circuit board (1450) is viewed in the first direction (T) and may form a capacitance for indirect transmission of an electrical signal between the electrical connection member (1453) and the second signal line (14542).

[0257] In one embodiment, the second coupling pad (14512) and the fourth coupling pad (14514) may be separated from each other in an insulated state through a dielectric (1452). In one embodiment, each of the second coupling pad (14512) and the fourth coupling pad (14514) may be disposed on the same layer, as illustrated in FIG. 14D. For example, the second-first coupling pad (14512-1) and the fourth-first coupling pad (14514-1) may be disposed on the same layer, the second-second coupling pad (14512-2) and the fourth-second coupling pad (14514-2) may be disposed on the same layer, and the second-third coupling pad (14512-3) and the fourth-third coupling pad (14514-3) may be disposed on the same layer. However, this is just one example, and at least one of the second coupling pad (14512) and the fourth coupling pad (14514) may not be arranged on the same layer. In one embodiment, the second coupling pad (14512) and the fourth coupling pad (14514) arranged on the same layer may have different overlapping areas with respect to the adjacent first coupling pad (14511). In this case, for the same first coupling pad (14511), the capacitances formed by the second coupling pad (14512) and the fourth coupling pad (14514) may be different from each other.

[0258] In one embodiment, the plurality of conductive vias (1455) may include one or more first conductive vias (14551) electrically connecting the plurality of first coupling pads (14511), one or more second conductive vias (14552) electrically connecting the plurality of second coupling pads (14512), and one or more fourth conductive vias (14554) electrically connecting the plurality of fourth coupling pads (14514). The first conductive vias (14551), the second conductive vias (14552), and the fourth conductive vias (14554) may be electrically insulated from each other. For example, the plurality of conductive vias (1455) may not directly connect the first coupling pads (14511), the second coupling pads (14512), and the fourth coupling pads (14514).

[0259] FIG. 15a is a schematic diagram illustrating a connection structure of a side member and a circuit board in an electronic device according to an embodiment. FIG. 15b is a schematic diagram illustrating a circuit connection structure of a side member, a circuit board, and a wireless communication circuit according to an embodiment. FIG. 15c is a perspective view illustrating a portion of a circuit board according to an embodiment. FIG. 15d is an exploded perspective view illustrating a layer structure of a portion of a circuit board according to an embodiment.

[0260] Referring to FIGS. 15A to 15D, an electronic device (1501) according to one embodiment may include a housing (e.g., housing (210) of FIG. 2A), a circuit board (1550) (e.g., circuit boards (251, 252) of FIG. 3), and a wireless communication circuit (1590).

[0261] In one embodiment, the housing may include a front surface (e.g., front surface (210a) of FIG. 2A), a back surface opposite the front surface (e.g., back surface (210b) of FIG. 2B), and a side surface (e.g., side surface (211c) of FIG. 2A) that surrounds an interior space between the front surface and the back surface. In one embodiment, the housing may include a side member (1540) that forms at least a portion of the side surface and surrounds the interior space (e.g., side member (440) of FIG. 4A). In one embodiment, the side member (1540) may include a plurality of conductive portions (15411) formed of a conductive material. The plurality of conductive portions (15411) may be physically separated by an insulating portion (15412) along the side surface. For example, the side member (1540) may include a first conductive portion (15411-1) and a second conductive portion (15411-2) that are physically separated by the insulating portion (15412). It may include a portion (15411-2). In one embodiment, each conductive portion (15411-1, 15411-2) may function as a radiator of an antenna through which an electrical signal flows. In one embodiment, the side member (1540) may include one or more connection portions (15413) formed on each conductive portion (15411-1, 15411-2) and electrically connected to a circuit board (1550). In one embodiment, the connection portions (15413) may function as a feeding portion through which an electrical signal is applied to the corresponding conductive portion (15411), or a ground portion through which an electrical signal applied to the conductive portion (15411) is emitted.

[0262] In one embodiment, a circuit board (1550) may be disposed in an internal space of the housing. In one embodiment, the circuit board (1550) may include a plurality of electrical connection members (15531, 15532) electrically connected to the first conductive portion (15411-1) and the second conductive portion (15411-2), respectively. For example, the plurality of electrical connection members (15531, 15532) may include a first electrical connection member (15531) electrically connected to the first conductive portion (15411-1) and a second electrical connection member (15532) electrically connected to the second conductive portion (15411-2).

[0263] In one embodiment, the circuit board (1550) may be electrically connected to a wireless communication circuit (1590). The circuit board (1550) may include signal lines (1554) connected to the wireless communication circuit (1590). In one embodiment, the circuit board (1550) may form a plurality of electrical paths from each of the electrical connecting members (15531, 15532) connected to the plurality of conductive portions (15411-1, 15411-2) to the wireless communication circuit (1590). For example, the circuit board (1550) may form a first electrical path from a first electrical connection member (15531) connected to a first conductive portion (15411-1) to a signal line (1554), and a second electrical path from a second electrical connection member (15532) connected to a second conductive portion (15411-2) to a signal line (1554).

[0264] In one embodiment, the circuit board (1550) may include a plurality of coupling pads (1551) arranged in an electrical path. The plurality of coupling pads (1551) may electrically connect an electrical connection member (1553) and a signal line (1554) connected to a wireless communication circuit (1590) by a non-contact coupling connection structure. In one embodiment, the plurality of coupling pads (1551) may include a first coupling pad (15511) connected to a first electrical connection member (15531), a third coupling pad (15513) connected to a second electrical connection member (15532), and a second coupling pad (15512) coupled to the first coupling pad (15511) and the third coupling pad (15513), respectively, and connected to the signal line (1554). For example, the second coupling pad (15512) may be coupled to the first coupling pad (15511) and the third coupling pad (15513) to form independent capacitances therebetween, thereby forming an electrical path between the first electrical connection member (15531) and the signal line (1554) and an electrical path between the second electrical connection member (15532) and the signal line (1554), respectively. In one embodiment, the electronic device (1501) can selectively transmit an electrical signal to a plurality of electrical connection members (15531, 15532) through one signal line (1554), thereby selectively utilizing either a first conductive portion (15411-1) to which a first electrical connection member (15531) is connected or a second conductive portion (15411-2) to which a second electrical connection member (15532) is connected as an antenna.

[0265] Referring to FIGS. 15c and 15d, a circuit board (1550) according to one embodiment may include a plurality of coupling pads (1551) that are electrically isolated and separated by a dielectric (1552), an electrical connection member (15531, 15532) for connection to a conductive portion (15411) of a side member (1540), a signal line (1554) connected to a wireless communication circuit (1590), and a plurality of conductive vias (1555).

[0266] In one embodiment, the plurality of coupling pads (1551) may include a plurality of first coupling pads (15511), a plurality of third coupling pads (15513), and a plurality of second coupling pads (15512). In one embodiment, the plurality of first coupling pads (15511) may be electrically connected to a first electrical connection member (15531). In one embodiment, the plurality of third coupling pads (15513) may be electrically connected to a second electrical connection member (15532). In one embodiment, the plurality of second coupling pads (15512) may be electrically connected to a signal line (1554).

[0267] In one embodiment, with respect to the first direction (T) of the circuit board (1550), at least one of the plurality of second coupling pads (15512) may be disposed between a pair of first coupling pads (15511). At least a portion of the second coupling pad (15512) may overlap an adjacent first coupling pad (15511) when the circuit board (1550) is viewed in the first direction (T). In one embodiment, with respect to the first direction (T) of the circuit board (1550), at least one of the plurality of second coupling pads (15512) may be disposed between a pair of third coupling pads (15513). At least a portion of the second coupling pad (15512) may overlap an adjacent third coupling pad (15513) when the circuit board (1550) is viewed in the first direction (T).

[0268] In one embodiment, a plurality of first coupling pads (15511) and second coupling pads (15512) may be alternately arranged along a first direction (T) of a circuit board (1550). For example, the plurality of first coupling pads (15511) may include a first-first coupling pad (15511-1), a first-second coupling pad (15511-2), and a first-third coupling pad (15511-3), and the plurality of second coupling pads (15512) may include a second-first coupling pad (15512-1), a second-second coupling pad (15512-2), and a second-third coupling pad (15512-3) alternately arranged with each of the first coupling pads (15511). In one embodiment, a plurality of third coupling pads (15513) and second coupling pads (15512) may be alternately arranged along the first direction (T) of the circuit board (1550). For example, the third coupling pad (15513) may include a third-first coupling pad (15513-1), a third-second coupling pad (15513-2), and a third-third coupling pad (15513-3), and may be alternately arranged along the first direction (T) of the circuit board (1550) with a second-first coupling pad (15512-1), a second-second coupling pad (15512-2), and a second-third coupling pad (15512-3). In one embodiment, the first coupling pad (15511) and the second coupling pad (15512) that are adjacent to each other may overlap at least partially when the circuit board (1550) is viewed in the first direction (T) and may form a capacitance for indirect transmission of an electrical signal between the first electrical connection member (15531) and the signal line (1554). In one embodiment, the third coupling pad (15513) and the second coupling pad (15512) that are adjacent to each other may overlap at least partially when the circuit board (1550) is viewed in the first direction (T) and may form a capacitance for indirect transmission of an electrical signal between the second electrical connection member (15532) and the signal line (1554).

[0269] In one embodiment, the first coupling pad (15511) and the third coupling pad (15513) may be separated from each other in an insulated state through a dielectric (1552). In one embodiment, each of the first coupling pad (15511) and the third coupling pad (15513) may be disposed on the same layer, as illustrated in FIG. 15D. For example, the first-first coupling pad (15511-1) and the third-first coupling pad (15513-1) may be disposed on the same layer, the first-second coupling pad (15511-2) and the third-second coupling pad (15513-2) may be disposed on the same layer, and the first-third coupling pad (15511-3) and the third-third coupling pad (15513-3) may be disposed on the same layer. However, this is just one example, and the first coupling pad (15511) and the third coupling pad (15513) may not be arranged on the same layer. In one embodiment, the first coupling pad (15511) and the third coupling pad (15513) arranged on the same layer may have different overlapping areas with respect to the adjacent second coupling pad (15512). In this case, for the same second coupling pad (15512), the capacitances formed by the first coupling pad (15511) and the third coupling pad (15513) may be different from each other.

[0270] In one embodiment, the plurality of conductive vias (1555) may include one or more first conductive vias (15551) electrically connecting the plurality of first coupling pads (15511), one or more second conductive vias (15552) electrically connecting the plurality of second coupling pads (15512), and one or more third conductive vias (15553) electrically connecting the plurality of third coupling pads (15513). The first conductive vias (15551), the second conductive vias (15552), and the third conductive vias (15553) may be electrically insulated from each other. For example, the plurality of conductive vias (1555) may not directly connect the first coupling pads (15511), the second coupling pads (15512), and the third coupling pads (15513).

[0271] FIG. 16a is a schematic diagram illustrating a connection structure of a side member and a circuit board in an electronic device according to one embodiment. FIG. 16b is a perspective view illustrating a portion of a circuit board according to one embodiment.

[0272] Referring to FIGS. 16A and 16B, another electronic device (1601) in one embodiment may include a housing (e.g., housing (210) of FIG. 2A), a circuit board (1650) (e.g., circuit boards (251, 252) of FIG. 3), and wireless communication circuitry (e.g., wireless communication circuitry (490) of FIG. 4).

[0273] In one embodiment, the housing may include a front surface (e.g., a front surface (210a) of FIG. 2a), a back surface opposite the front surface (e.g., a back surface (210b) of FIG. 2b), and a side surface (e.g., a side surface (211c) of FIG. 2a) surrounding an interior space between the front surface and the back surface. In one embodiment, the housing may include a side member (1640) forming at least a portion of the side surface and surrounding the interior space (e.g., a side member (440) of FIG. 4a). In one embodiment, the side member (1640) may include a plurality of conductive portions (16411) formed of a conductive material. The plurality of conductive portions (16411) may be physically separated by an insulating portion (16412) along the side surface. For example, the side member (1640) may include a first conductive portion (16411-1) and a second conductive portion (16411-2) that are physically separated. There is. In one embodiment, the conductive portions (16411-1, 16411-2) can function as a radiator of an antenna through which an electrical signal flows. For example, the conductive portions (16411-1, 16411-2) can function as a radiator of an antenna that transmits and receives a wireless signal of a frequency band corresponding to the length of an electrical path within the conductive portions (16411-1, 16411-2) through which an applied electrical signal flows. In one embodiment, the side member (1640) can include one or more connection portions (16413) formed on each of the conductive portions (16411-1, 16411-2) and electrically connected to a circuit board (1650).

[0274] In one embodiment, a circuit board (1650) may be disposed in an interior space of the housing. In one embodiment, the circuit board (1650) may include a plurality of electrical connection members (16531, 16532) each electrically connected to a different conductive portion (1641). For example, the plurality of electrical connection members (16531, 16532) may include a first electrical connection member (16531) electrically connected to a first conductive portion (16411-1) and a second electrical connection member (16532) electrically connected to a second conductive portion (16411-2).

[0275] In one embodiment, the circuit board (1650) may include a plurality of coupling pads (1651, 1651a) for indirect electrical signal transmission between the first conductive portion (16411-1) and the second conductive portion (16411-2). In one embodiment, the plurality of coupling pads (1651, 1651a) may be separately arranged on the circuit board (1650) while being spaced apart from each other by a dielectric (1652). In one embodiment, the plurality of coupling pads (1651) may electrically connect the first conductive portion (16411-1) and the second conductive portion (16411-2) by a non-contact coupling connection structure. In one embodiment, a plurality of coupling pads (1651) that are provided separately from a plurality of coupling pads (1651a) that connect the first conductive portion (16411-1) and the second conductive portion (16411-2) can connect the first conductive portion (16411-1) or the second conductive portion (16411-2) to a wireless communication circuit (1690) or a ground (1656).

[0276] In one embodiment, the plurality of coupling pads (1651) may include one or more first coupling pads (16511) connected to a first electrical connection member (16531) and one or more second coupling pads (16512) connected to a second electrical connection member (16532). For example, the first coupling pad (16511) may include a first-first coupling pad (16511-1), a first-second coupling pad (16511-2), and a first-third coupling pad (16511-3). The second coupling pad (16512) may include a second-first coupling pad (16512-1), a second-second coupling pad (16512-2), and a second-third coupling pad (16512-3). A plurality of first coupling pads (16511) may be electrically connected by first conductive vias (16551). A plurality of second coupling pads (16512) may be electrically connected by second conductive vias (16552). In one embodiment, the circuit board (1650) may further include other coupling pads for connecting the conductive portion (16411) to the wireless communication circuit (1690) or for connecting the conductive portion (16411) to the ground (1656).

[0277] In one embodiment, at least one of the plurality of second coupling pads (16512) may be disposed between a pair of first coupling pads (16511) with respect to the first direction (T) of the circuit board (1650). In one embodiment, the plurality of first coupling pads (16511) and second coupling pads (16512) may be alternately disposed along the first direction (T) of the circuit board (1650). In one embodiment, the first coupling pads (16511) and second coupling pads (16512) that are adjacent to each other may at least partially overlap each other when the circuit board (1650) is viewed in the first direction (T), and may form a capacitance for indirect transmission of an electrical signal between the first electrical connection member (16531) and the second electrical connection member (16532).

[0278] In one embodiment, a plurality of coupling pads (1651) can connect a first conductive portion (16411-1) to which a first electrical connection member (16531) is connected and a second conductive portion (16411-2) to which a second electrical connection member (16532) is connected in a non-contact manner through a capacitance formed between the first coupling pad (16511) and the second coupling pad (16512). For example, when an electrical signal is applied to the first conductive portion (16411-1), the circuit board (1650) can transmit the electrical signal applied to the first conductive portion (16411-1) to the second conductive portion (16411-2) through the coupling connection structure of the first coupling pad (16511) and the second coupling pad (16512). In this case, the first conductive part (16411-1) and the second conductive part (16411-2) can be utilized as one radiator.

[0279] Fig. 17a is a perspective view illustrating a portion of a circuit board according to one embodiment. Fig. 17b is a perspective view illustrating a portion of a circuit board according to one embodiment. Fig. 17c is a graph illustrating changes in the radiation performance of an antenna depending on the presence or absence of a radiation member in a circuit board according to one embodiment.

[0280] Referring to FIG. 17A, a circuit board (1750A) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1751) (e.g., coupling pads (451) of FIG. 4A) that are electrically insulated and separated from each other by a dielectric (1752), an electrical connection member (1753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (1754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), a plurality of conductive vias (1755), and a radiating member (1756).

[0281] In one embodiment, the plurality of coupling pads (1751) may include a plurality of first coupling pads (17511) that are electrically connected through one or more first conductive vias (17551) and connected to an electrical connection member (1753), and a plurality of second coupling pads (17512) that are electrically connected through one or more second conductive vias (17552) and connected to a signal line (1754). In one embodiment, the plurality of first coupling pads (17511) may be separately arranged along the first direction (T) of the circuit board (1750A). For example, the plurality of first coupling pads (17511) may include a first-first coupling pad (17511-1), a first-second coupling pad (17511-2), and a first-third coupling pad (17511-3). In one embodiment, a plurality of second coupling pads (17512) may be separately arranged along the first direction (T) of the circuit board (1750A). For example, the plurality of second coupling pads (17512) may include a second-first coupling pad (17512-1), a second-second coupling pad (17512-2), and a second-third coupling pad (17512-3).

[0282] In one embodiment, at least one of the second coupling pads (17512) is disposed between two of the first coupling pads (17511), and may overlap at least a portion of the two adjacent ones when the circuit board (1750A, 1750B) is viewed in a first direction (T). In one embodiment, a plurality of first coupling pads (17511) and second coupling pads (17512) may be alternately disposed along the first direction (T) of the circuit board (1750A, 1750B). In one embodiment, a capacitance for indirect transmission of an electrical signal may be formed between adjacent first coupling pads (17511) and second coupling pads (17512).

[0283] In one embodiment, the radiating member (1756) may be formed of a conductive material. In one embodiment, the radiating member (1756) may be physically separated from a plurality of coupling pads (1751) via a dielectric (1752). In one embodiment, the radiating member (1756) may be arranged to overlap the second coupling pad (17512) when the circuit board (1750A) is viewed in the first direction (T). For example, the radiating member (1756) may be arranged to overlap at least a portion of the second-first coupling pad (17512-1). In one embodiment, the radiating member (1756) and the second coupling pad (17512) may be configured to be coupled through an overlapping area in the first direction (T) of the circuit board (1750A). For example, a capacitance may be formed in the first direction (T) of the circuit board (1750A) between the radiating member (1756) and the second-first coupling pad (17512-1). In this case, when an electrical signal is applied to the second coupling pad (17512) through the signal line (1754), the radiating member (1756) may indirectly receive the electrical signal from the second coupling pad (17512). The radiating member (1756) may function as a radiator of an antenna that forms a radiation pattern through the electrical signal received from the second coupling pad (17512).

[0284] Referring to FIG. 17B, a circuit board (1750B) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1751) (e.g., coupling pads (451) of FIG. 4A) physically separated from each other by a dielectric (1752), an electrical connection member (1753) (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (1754) connected to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), a plurality of conductive vias (1755), and a radiating member (1757). In one embodiment, the plurality of coupling pads (1751) may include a plurality of first coupling pads (17511) that are electrically connected through one or more first conductive vias (17551) and connected to an electrical connection member (1753), and a plurality of second coupling pads (17512) that are electrically connected through one or more second conductive vias (17552) and connected to a signal line (1754). In one embodiment, the plurality of first coupling pads (17511) may include a first-first coupling pad (17511-1), a first-second coupling pad (17511-2), and a first-third coupling pad (17511-3) that are separately arranged along a first direction (T) of the circuit board (1750A, 1750B). In one embodiment, a plurality of second coupling pads (17512) may be separately arranged along a first direction (T) of a circuit board (1750B). For example, the plurality of second coupling pads (17512) may include a second-first coupling pad (17512-1), a second-second coupling pad (17512-2), and a second-third coupling pad (17512-3). In one embodiment, at least one of the second coupling pads (17512) is arranged between two of the first coupling pads (17511), and may overlap at least a portion of the two adjacent ones when the circuit board (1750B) is viewed in the first direction (T).In one embodiment, a plurality of first coupling pads (17511) and second coupling pads (17512) may be alternately arranged along the first direction (T) of the circuit board (1750B). In one embodiment, a capacitance for indirect transmission of an electrical signal may be formed between adjacent first coupling pads (17511) and second coupling pads (17512).

[0285] In one embodiment, the radiating element (1757) may include a conductive pattern. For example, the radiating element (1757) may be a PCB Embedded Antenna (PEA) having a radiating pattern formed on its surface. In one embodiment, the radiating element (1757) may be directly connected to the signal line (1754). The radiating element (1757) may receive an electrical signal from a wireless communication circuit through the signal line (1754) and function as a radiator of an antenna that radiates the electrical signal.

[0286] In one embodiment, when a radiation member (1757) is arranged on a circuit board (1750B), the radiation performance of the antenna can be improved when transmitting and receiving an electrical signal of a specific frequency band. Fig. 17c is a graph showing the radiation performance of an antenna depending on the presence or absence of a radiation member (1757) having a conductive pattern formed thereon when an electrical signal is applied to utilize the same conductive portion as an antenna. In Fig. 17c, the horizontal axis represents a frequency band, and the vertical axis represents radiation performance (Total radiation efficiency). The solid line represents the radiation performance of the antenna for each frequency when the radiation member (1757) is utilized, and the dotted line represents the radiation performance of the antenna for each frequency when the radiation member (1757) is not utilized.

[0287] Looking at Fig. 17c, it can be confirmed that the radiation performance of the antenna when utilizing the radiation element (1757) has significant radiation performance in a specific frequency band (e.g., 5 GHz to 6 GHz Wi-Fi band) compared to when the radiation element (1757) is not utilized. For example, when transmitting and receiving an electrical signal in a specific frequency band through a conductive portion, it can be confirmed that the radiation efficiency of the antenna can be improved by additionally utilizing a radiation element in which a corresponding radiation pattern is formed.

[0288] FIG. 18a is a perspective view illustrating a portion of a circuit board according to one embodiment. FIG. 18b is a cross-sectional view illustrating a portion of a circuit board according to one embodiment.

[0289] Referring to FIGS. 18A and 18B , a circuit board (1850) according to an embodiment (e.g., circuit board (450) of FIG. 4A ) may include a plurality of coupling pads (1851) physically separated from each other by a dielectric (1852) (e.g., coupling pads (451) of FIG. 4A ), an electrical connection member (1853) (e.g., electrical connection member (453) of FIG. 4A ) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A ), a signal line (1854) (e.g., signal line (454) of FIG. 4A ) for connection to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A ), and a plurality of conductive vias (1855).

[0290] In one embodiment, the plurality of coupling pads (1851) may include a plurality of first coupling pads (18511) connected to an electrical connection member (1853) and a plurality of second coupling pads (18512) connected to a signal line (1854). For example, the plurality of first coupling pads (18511) may include a first-first coupling pad (18511-1), a first-second coupling pad (18511-2), and a first-third coupling pad (18511-3), and the plurality of second coupling pads (18512) may include a second-first coupling pad (18512-1), a second-second coupling pad (18512-2), and a second-third coupling pad (18512-3). In one embodiment, at least one second coupling pad (18512) is disposed between a pair of first coupling pads (18511) and may overlap at least a portion of an adjacent first coupling pad (18511) when the circuit board (1850) is viewed in a first direction (T). In one embodiment, a plurality of first coupling pads (18511) and second coupling pads (18512) may be alternately disposed along the first direction (T) (e.g., the W-axis direction) of the circuit board (1850). In one embodiment, a capacitance for indirect transmission of an electrical signal may be formed between overlapping areas of adjacent first coupling pads (18511) and second coupling pads (18512).

[0291] In one embodiment, one or more first conductive vias (18551) may penetrate the circuit board (1850) in a first direction (T) and electrically connect a plurality of first coupling pads (18511). One or more second conductive vias (18552) may penetrate the circuit board (1850) in the first direction (T) and electrically connect a plurality of second coupling pads (18512).

[0292] In one embodiment, at least one of the plurality of conductive vias (1855) may be connected to a switch (1859) for selectively blocking electrical connection between coupling pads through the conductive via. For example, as shown in FIG. 18b, a plurality of switches (1859) may be connected to each of the first conductive vias (18551) for selectively blocking electrical connection with the first-first coupling pad (18511-1), the first-second coupling pad (18511-2), and the first-third coupling pad (18511-3). A plurality of switches (1859) may be connected to the second conductive via (18552) to selectively block electrical connection with the second-first coupling pad (18512-1), the second-second coupling pad (18512-2), and the second-third coupling pad (18512-3), respectively. For example, the plurality of switches (1859) may be arranged on one surface of the circuit board (1850) (e.g., the first substrate surface (550a) of FIG. 5A). In one embodiment, the plurality of switches (1859) may be implemented as a switch module (18590). For example, based on the embodiment illustrated in FIG. 18b, when the switch (1859) operates to connect only the first conductive via (18551) and the first-first coupling pad (18511-1), and to connect only the second conductive via (18552) and the second-first coupling pad (18512-1), an electrical signal can be transmitted and received through the capacitance formed between the first-first coupling pad (18511-1) and the second-first coupling pad (18512-1) among the plurality of first coupling pads (18511) and second coupling pads (18512) in the indirect transmission process of the electrical signal. For example, in the case of including a plurality of first coupling pads (18511) and second coupling pads (18512), the total capacitance formed between the plurality of coupling pads (1851) can be selectively changed through selective operation of the switch (1859).

[0293] FIG. 19 is a cross-sectional view illustrating a portion of a circuit board according to one embodiment.

[0294] Referring to FIG. 19, a circuit board (1950) according to one embodiment (e.g., circuit board (450) of FIG. 4A) may include a plurality of coupling pads (1951) (e.g., coupling pads (451) of FIG. 4A) physically separated from each other by a dielectric (1952), an electrical connection member (e.g., electrical connection member (453) of FIG. 4A) for connection to a conductive portion of a side member (e.g., conductive portion (4411) of FIG. 4A), a signal line (e.g., signal line (454) of FIG. 4A) for connection to a wireless communication circuit (e.g., wireless communication circuit (490) of FIG. 4A), a plurality of first conductive vias (19551), and a plurality of second conductive vias (19552).

[0295] In one embodiment, the plurality of coupling pads (1951) may include a plurality of first coupling pads (19511) electrically connected through a plurality of first conductive vias (19551), and a plurality of second coupling pads (19512) electrically connected through a plurality of second conductive vias (19552). In one embodiment, the first coupling pads (19511) may be connected to an electrical connection member. The second coupling pads (19512) may be connected to a wireless communication circuit through a signal line. In one embodiment, the plurality of first coupling pads (19511) may be separately arranged along a first direction (T) of the circuit board (1950). For example, the plurality of first coupling pads (19511) may include a first-first coupling pad (19511-1), a first-second coupling pad (19511-2), and a first-third coupling pad (19511-3). In one embodiment, the plurality of second coupling pads (19512) may be separately arranged along the first direction (T) of the circuit board (1950). For example, the plurality of second coupling pads (19512) may include a second-first coupling pad (19512-1), a second-second coupling pad (19512-2), and a second-third coupling pad (19512-3). In one embodiment, the first coupling pad (19511) and the second coupling pad (19512) may be arranged to overlap along the first direction (T). A capacitance for transmitting an electrical signal can be formed between the overlapping areas of the first coupling pad (19511) and the second coupling pad (19512) in the first direction (T).

[0296] In one embodiment, adjacent first coupling pads (19511) may be connected through respective first conductive vias (19551). For example, the first conductive vias (19551) may include a first-first conductive via (19551-1) electrically connecting a first-first coupling pad (19511-1) and a first-second coupling pad (19511-2) along a first direction (T) of the circuit board (1950), and a first-second conductive via (19551-2) electrically connecting a first-second coupling pad (19511-2) and a first-third coupling pad (19511-3). In one embodiment, adjacent second coupling pads (19512) may be individually connected to each other through respective second conductive vias (19552). For example, each first conductive via (19551) may individually connect adjacent first coupling pads (19511), and each second conductive via (19512) may individually connect adjacent second coupling pads (19511). For example, the second conductive vias (19552) may include a second-first conductive via (19552-1) electrically connecting the second-first coupling pad (19512-1) and the second-second coupling pad (19512-2) along the first direction (T) of the circuit board (1950), and a second-second conductive via (19552-2) electrically connecting the second-second coupling pad (19512-2) and the second-third coupling pad (19512-3).

[0297] In one embodiment, a plurality of first conductive vias (19551) may be arranged on different layers of the circuit board (1950). A plurality of second conductive vias (19552) may be arranged on different layers of the circuit board (1950). With this structure, by tuning (e.g., cutting the conductive via) one of the conductive vias (19551, 19552) connecting a pair of coupling pads (1951) to block or adjust the electrical connection between the corresponding coupling pads (1951), the capacitance formed between the plurality of coupling pads (1951) can be changed. Accordingly, by easily adjusting the set value of the capacitance through the conductive via (1955), it is possible to easily compensate for a design change of the circuit board (1950) or an error in capacitance due to manufacturing.

[0298] FIG. 20A is a partially exploded perspective view of an electronic device according to one embodiment. FIG. 20B is a partial cross-sectional view illustrating a connection structure of a circuit board and a rear frame according to one embodiment.

[0299] Referring to FIG. 20A, an electronic device (2001) according to one embodiment (e.g., electronic device (201) of FIG. 2A) may include a housing (2010) (e.g., housing (210) of FIG. 2A), a rear frame (2090), and a circuit board (2050) (e.g., circuit board (251) of FIG. 3).

[0300] In one embodiment, the housing (2010) may form the exterior of the electronic device (2001). The housing (2010) may include a front surface (e.g., a surface facing the +Z direction), a back surface (e.g., a surface facing the -Z direction), and a side surface (e.g., a side surface (211c) of FIG. 2A) that surrounds an interior space between the front surface and the back surface.

[0301] In one embodiment, the rear frame (2090) may be disposed in an internal space of the electronic device (2001). In one embodiment, the rear frame (2090) may support component elements (e.g., a circuit board (2050)) within the electronic device (2001). In one embodiment, the rear frame (2090) may include a conductive portion (2091) exposed on at least a portion of a surface thereof. For example, the rear frame (2090) may be formed of a non-conductive material such as a synthetic resin (e.g., polycarbonate (PC)), and the conductive portion (2091) may be formed of a metal pattern layer (2091) on a surface of the rear frame (2090) facing the circuit board (2050) (e.g., a surface facing the +Z direction). For example, the conductive portion (2091) may be formed on the surface of the rear frame (2090) through LDS (laser direct structuring) pattern plating processing, but the method of forming the conductive portion (2091) is not limited thereto. In one embodiment, the rear frame (2090) may be placed inside the electronic device (2001) such that at least a portion of the conductive portion (2091) is in contact with the circuit board (2050) or may be indirectly connected through another connecting member.

[0302] In one embodiment, a circuit board (2050) may be disposed in an internal space of an electronic device (2001). In one embodiment, the circuit board (2050) may include a plurality of coupling pads (2051) physically separated from each other by a dielectric (2052), an electrical connection member (2053) for connection to a conductive portion (2091) of a rear frame (2090), a signal line (e.g., a signal line (454) of FIG. 4A) connected to a wireless communication circuit (e.g., a wireless communication circuit (490) of FIG. 4A), or a plurality of conductive vias (2055).

[0303] In one embodiment, the plurality of coupling pads (2051) may include a plurality of first coupling pads (20511) electrically connected through first conductive vias (20551) and a plurality of second coupling pads (20512) electrically connected through second conductive vias (20552). In one embodiment, the first coupling pads (20511) may be connected to an electrical connection member (2053). In one embodiment, the second coupling pads (20512) may be connected to a wireless communication circuit via a signal line.

[0304] In one embodiment, a plurality of first coupling pads (20511) may be separately arranged along a first direction (T) of a circuit board (2050). For example, the plurality of first coupling pads (20511) may include a first-first coupling pad (20511-1) and a first-second coupling pad (20511-2). A plurality of second coupling pads (20512) may be separately arranged along a first direction (T) of a circuit board (2050). For example, the plurality of second coupling pads (20512) may include a second-first coupling pad (20512-2) and a second-second coupling pad (20512-2). In one embodiment, the first coupling pad (20511) and the second coupling pad (20512) may be arranged to overlap along the first direction (T). A capacitance for transmitting an electrical signal may be formed between the overlapping area of ​​each first coupling pad (20511) and each second coupling pad (20512) in the first direction (T).

[0305] In one embodiment, a plurality of coupling pads (2051) can transmit electrical signals between a conductive portion (2091) of the rear frame (2090) and a wireless communication circuit through a capacitance formed between the first coupling pad (20511) and the second coupling pad (20512). The conductive portion (2091) of the rear frame (2090) can function as an antenna exhibiting radiation characteristics through an electrical signal transmitted from the wireless communication circuit.

[0306] FIG. 21a is a drawing schematically illustrating a connection structure of a side member and a circuit board in an electronic device according to one embodiment. FIG. 21b is a partial cross-sectional view illustrating area F21 of FIG. 21a.

[0307] Referring to FIGS. 21A and 21B, an electronic device (2101) according to one embodiment may include a housing (e.g., housing (210) of FIG. 2A), a plurality of circuit boards (2150a, 2150b), a connection circuit board (2150) connecting the plurality of circuit boards (2150a, 2150b), and a wireless communication circuit (2190) disposed on the first circuit board (2150a).

[0308] In one embodiment, the housing may include a front surface (e.g., a front surface (210a) of FIG. 2A), a rear surface opposite to the front surface (e.g., a rear surface (210b) of FIG. 2B), and a side surface surrounding an internal space between the front surface and the rear surface (e.g., a side surface (211c) of FIG. 2A). In one embodiment, the housing may include a side member (2140) (e.g., a side member (240) of FIG. 3) forming at least a portion of the side surface and surrounding the internal space. In one embodiment, the side member (2140) may include a conductive portion (2141) formed of a conductive material. In one embodiment, the conductive portion (2141) may function as a radiator of an antenna through which an electrical signal flows. In one embodiment, the electronic device (2101) may include a connection portion formed on the conductive portion (2141) and functioning as a feeding portion for receiving an electrical signal or a grounding portion for grounding an electrical signal.

[0309] In one embodiment, a plurality of circuit boards (2150a, 2150b) may be arranged in an internal space of the housing. For example, the plurality of circuit boards (2150a, 2150b) may include a first circuit board (2150a) and a second circuit board (2150b) that are spaced apart from each other. In one embodiment, a wireless communication circuit (2190) may be arranged on the first circuit board (2150a).

[0310] In one embodiment, a connecting circuit board (2150) may be connected to the first circuit board (2150a) and the second circuit board (2150b) to electrically connect the first circuit board (2150a) and the second circuit board (2150b), respectively. In one embodiment, at least a portion of the connecting circuit board (2150) may be connected to the conductive portion (2141). For example, the connecting circuit board (2150) may be connected to a connection portion formed on the conductive portion (2141).

[0311] In one embodiment, the connecting circuit board (2150) may be formed as a flexible printed circuit board (FPCB). The connecting circuit board (2150) may be at least partially bendable. In one embodiment, the connecting circuit board (2150) may form an electrical path for transmitting an electrical signal between the conductive portion (2141) and the wireless communication circuit (2190).

[0312] In one embodiment, the connecting circuit board (2150) may include an electrical connection member (2153) electrically connected to the conductive portion (2151), and a signal line (2154) electrically connected to the wireless communication circuit (2190). The connecting circuit board (2150) may include a plurality of coupling pads (2151) for transmitting electrical signals between the electrical connection member (2153) and the signal line (2154), and conductive vias (2155) for electrically connecting the plurality of coupling pads (2151).

[0313] In one embodiment, a plurality of coupling pads (2151) may be separated and arranged in a layer of a connection circuit board (2150) via a dielectric (2152). In one embodiment, the coupling pads (2151) may include one or more first coupling pads (21511) connected to an electrical connection member (2153) and one or more second coupling pads (21512) connected to a signal line (2154). In one embodiment, the one or more first coupling pads (21511) and the one or more second coupling pads (21512) may be arranged to overlap at least a portion of the first coupling pads (21511) along a first direction (T) of the connection circuit board (2150) to form a capacitance therebetween. For example, along the first direction (T) of the connecting circuit board (2150), the second coupling pad (21512) may be positioned so as to overlap at least a portion between the first-first coupling pad (21511-1) and the first-second coupling pad (21511-2). In one embodiment, the first-first coupling pad (21511-1) and the first-second coupling pad (21511-2) may be electrically connected through a first conductive via (21551). The second coupling pad (21512) may be directly connected to the signal line (2154) or may be connected through a second conductive via (21552).

[0314] In one embodiment, the connecting circuit board (2150) is connected to a wireless communication circuit (2190) disposed on the first circuit board (2150a) via a signal line (2154), and can transmit an electrical signal between the conductive portion (2141) and the signal line (2154) via a capacitance formed between a plurality of coupling pads (2151).

[0315] Hereinafter, embodiments of various types of electronic devices will be described. In describing various types of electronic devices, it will be apparent to those skilled in the art that the structures of the circuit boards of the various embodiments described above, for example, the method of connecting a conductive portion functioning as an antenna and a wireless communication circuit through the circuit boards of the various embodiments to which a coupling connection structure through coupling pads is applied, can be applied to various types of electronic devices according to the embodiments below. For example, it should be noted that the structures of the circuit boards according to the various embodiments described through FIGS. 4A to 21B and the method of transmitting signals between the conductive portion and the wireless communication circuit through the circuit board can be easily changed, modified, and combined by those skilled in the art and applied to the embodiments below.

[0316] FIG. 22a is a perspective view illustrating a front side of an electronic device according to an embodiment. FIG. 22b is a perspective view illustrating a rear side of an electronic device according to an embodiment. FIG. 22c is an exploded perspective view of an electronic device according to an embodiment.

[0317] Referring to FIGS. 22A, 22B, and 22C, an electronic device (2201) according to an embodiment may include a first housing (2210) (e.g., a first housing (2210) structure) and a second housing (2220) (e.g., a second housing (2220) structure) that are foldable with respect to each other via at least one hinge device (2270, 2270-1) (e.g., a hinge module or a hinge structure) with respect to a folding axis (F). For example, the first housing (2210) and the second housing (2220) may be configured as a foldable housing (e.g., a housing structure). In one embodiment, the first housing (2210) may include a first surface (2211) and a second surface (2212) facing in an opposite direction (e.g., in the -Z direction of FIG. 22A) of the first surface (2211). The second housing (2220) may include a third surface (2221) and a fourth surface (2222) facing in an opposite direction (e.g., in the -Z direction of FIG. 22A) of the third surface (2221). In one embodiment, the first housing (2210) may include a first side surface formed between the first surface (2211) and the second surface (2212). The second housing (2220) may include a second side surface formed between the third surface (2221) and the fourth surface (2222).

[0318] In one embodiment, the first housing (2210) can include a first side member (2240a) forming at least a portion of the first side (e.g., a first side bezel). The first side member (2240a) can include a conductive portion. In one embodiment, the first housing (2210) can include a first rear cover (2214) coupled with the first side member (2240a) and forming a second side (2212). In one embodiment, the second housing (2220) can include a second side member (2240b) forming at least a portion of the second side (e.g., a second side bezel). The second side member (2240b) can include a conductive portion. In one embodiment, the second housing (2220) may include a second rear cover (2224) coupled with the second side member (2240b) and forming a fourth surface (2222).

[0319] In one embodiment, the electronic device (2201) may change shape as the relative angles of the first housing (2210) and the second housing (2220) about the folding axis (F) change. For example, the electronic device (2201) may change shape between a first state (e.g., an unfolded state or an unfolded state) in which the first surface (2211) and the second surface (2212) are completely unfolded so that they are substantially on the same plane, and a second state (e.g., a folded state or a folded state) in which the first surface (2211) and the second surface (2212) are completely folded inward so that they face each other or completely folded outward so that they face each other in opposite directions. In one embodiment, the electronic device (2201) may be operated to have a shape in a third state (e.g., an intermediate unfolded state) between the first state and the second state.

[0320] In one embodiment, the electronic device (2201) may include a first receiver (2200), at least one first sensor module (2204) (e.g., an ambient light sensor) and / or at least one first camera module (2205) (e.g., an under display camera; UDC) disposed through a first side (2211) of the first housing (2210). In one embodiment, the electronic device (2201) may include at least one button (2206) formed on a first side member (2240a). In one embodiment, the electronic device (2201) may include at least one second camera module (2208) and / or a flash (2209) disposed through a second side (2212) of the first housing (2210) (e.g., a first rear cover (2214)).

[0321] In one embodiment, the electronic device (2201) may include a first display (2236) (e.g., a flexible display (2236), a foldable display (2236), or a main display (2236)) supported by the first housing (2210) and the second housing (2220) and arranged to be visually displayed through the first side (2211) and the third side (2221).

[0322] In one embodiment, the first display (2236) may include a first area (2236a) corresponding to at least a portion of the first surface (2211) (e.g., a first planar area), a second area (2236b) corresponding to at least a portion of the third surface (2221) (e.g., a second planar area), and a folding area (2236c) (e.g., a folding area) that connects the first area (2236a) and the second area (2236b) and whose shape is deformed during the folding process of the electronic device (2201). In one embodiment, the folding area (2236c) may be positioned to at least partially overlap at least one hinge device (2270, 2270-1) when the first display (2236) is viewed from above (e.g., in the +Z direction of FIG. 22A). For example, the first display (2236) may be arranged so as not to be visible from the outside in a second state of the electronic device (2201) in which the first side (2211) and the third side (2221) face each other (e.g., in the case of an in-folding type). For example, the first display (2236) may be arranged so as to be visible from the outside in a second state of the electronic device (2201) in which the first side (2211) and the third side (2221) face opposite directions (e.g., in the case of an out-folding type).

[0323] In one embodiment, the electronic device (2201) may include a second display (2236) (e.g., an auxiliary display) disposed through a fourth side (2222) of the second housing (2220), at least one third camera module (2225), at least one second sensor module (2226), and / or a second receiver (2227). For example, the second display (2231) may be disposed to be visually visible from the outside through at least a portion of the second rear cover (2224). In one embodiment, the electronic device (2201) may include a speaker (2202) disposed through a second side member (2240b), a microphone (2203) disposed through a first side member (2240a), and / or a connector port (2207). At least some of the components described above may be arranged and / or modified between the first housing (2210) and / or the second housing (2220).

[0324] In one embodiment, at least one hinge device (2270, 2270-1) may be disposed at a lower portion (e.g., in the -Z direction of FIG. 22c) of the first display (2236) and may connect the first housing (2210) and the second housing (2220). For example, the at least one hinge device (2270, 2270-1) may include a first hinge device (2270) disposed along a folding axis (F) and a second hinge device (2270-1) disposed spaced apart from the first hinge device (2270). In one embodiment, the first hinge device (2270) may be formed in a configuration that is substantially symmetrical or substantially identical to the second hinge device (2270-1). For example, at least one hinge device (2270, 2270-1) may be supported by a first support member (2281) extending from the first side member (2240a) to the first space (22101) of the first housing (2210), and a second support member (2282) extending from the second side member (2240b) to the second space (22202) of the second housing (2220). In one embodiment, at least one hinge device (2270, 2270-1) may be covered by a hinge housing (2250) between the first housing (2210) and the second housing (2220) and may not be visible from the outside.

[0325] In one embodiment, the hinge device (2270, 2270-1) may include a gear assembly (2243) that symmetrically rotates a first rotational member (2251) (e.g., a first arm or a first rotator) disposed on a first support member (2281) of a first housing (2210) and a second rotational member (2252) (e.g., a second arm or a second rotator) disposed on a second support member (2282) of a second housing (2220) relative to each other. For example, the gear assembly may include a plurality of gears (e.g., spur gears and / or worm gears) that are gear-coupled relative to each other.

[0326] For example, the gear assembly (2243) may include a plurality of gears (e.g., spur gears and / or worm gears) that are gear-engaged with respect to one another. For example, the gear assembly (2243) may include a cam coupling structure and / or a spring structure for urging the first housing (2210) and the second housing (2220) at a predetermined angle with respect to one another in a direction in which the first state is to be transitioned to the second state or in a direction in which the second state is to be transitioned to the first state.

[0327] In one embodiment, the electronic device (2201) may be coupled with at least one hinge device (2270, 2270-1) and may include at least one detent module for providing a stopping sensation at various folding angles of the electronic device (2201). For example, the at least one hinge device (2270, 2270-1) and / or the detent module may form substantially the same plane as the first support member (2281) and the second support member (2282) when the electronic device (2201) is in the first state.

[0328] In one embodiment, the electronic device (2201) may include a first hinge plate (2261) connected to the first support member (2281) and / or the first rotation member (2251). The electronic device (2201) may include a second hinge plate (2262) connected to the second support member (2282) and / or the second rotation member (2252). For example, at least one hinge device (2270, 2270-1), the first rotation member (2251), the second rotation member (2252), the first hinge plate (2261), and the second hinge plate (2262) may form substantially the same plane as the first support member (2281) and the second support member (2282) when the electronic device (2201) is in the first state.

[0329] FIG. 23 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to one embodiment.

[0330] Referring to FIG. 23, an electronic device (2301) according to an embodiment (e.g., the electronic device (2201) of FIGS. 22a to 22c) may include a housing structure (2300) including a first housing (2310) and a second housing (2320) that are rotatable relative to each other about a folding axis (F), a first circuit board (2350a) disposed in the first housing (2310), a second circuit board (2350b) disposed in the second housing (2320), a connection circuit board (e.g., FPCB) (2350c) connecting the first circuit board (2350a) and the second circuit board (2350b) across the folding axis (F), and a wireless communication circuit (2390).

[0331] In one embodiment, the first housing (2310) and the second housing (2320) can rotate relative to each other about the folding axis (F). In one embodiment, the housing structure (2300) can include side members (2340) that surround the interior space of the electronic device (2301). For example, the first housing (2310) and the second housing (2320) can include a first side member (2340a) and a second side member (2340b), respectively, that form the side surfaces surrounding the interior space of the electronic device (2301). In one embodiment, the first side member (2340a) and the second side member (2340b) can each include a plurality of conductive portions (23411) that include a conductive material. In one embodiment, at least some of the conductive portions (23411) can function as radiators through which electrical signals flow. In one embodiment, the conductive portions (23411) can include first conductive portions (23411a) positioned in the first housing (2310) and second conductive portions (23411b) positioned in the second housing (2320). In one embodiment, the first side member (2340a) and the second side member (2340b) can include insulating portions (23412) formed of an insulating material. The insulating portions (23412) can physically separate adjacent conductive portions (23411). Each of the conductive portions (23411) physically separated by the insulating portions (23412) can form an electrical path through which electrical signals flow. In one embodiment, the first side member (2340a) and the second side member (2340b) may be formed with one or more conductive portions (23411) and may include a connection portion for connecting to a circuit board (2350a, 2350b).

[0332] In one embodiment, at least some of the plurality of conductive portions (23411) may be connected to a wireless communication circuit (2390) via a circuit board (2350a, 2350b) and may each form an antenna area for transmitting and receiving a wireless signal of a frequency band corresponding to the length of a path along which an electrical signal flows. For example, the first conductive portions (23411a) formed on the first side member (2340a) may be connected to the wireless communication circuit (2390) and function as an antenna, and the second conductive portions (23411b) formed on the second side member (2340b) may not be connected to the wireless communication circuit (2390). However, it should be noted that this is merely an example, and at least some of the second conductive portions (23411b) may be connected to the wireless communication circuit (2390) and form an antenna area.

[0333] Hereinafter, for convenience of explanation, an example of utilizing a part of the conductive parts (23411) of the electronic device (2301) as an antenna through the connection structure of the conductive parts (23411) and the wireless communication circuit (2390) illustrated in FIG. 23 is described, but it should be noted that the length, arrangement, and connection structure with the wireless communication circuit (2390) and the ground (2356) of each conductive part (23411) formed in the electronic device (2301) are not limited thereto.

[0334] In one embodiment, the first conductive portions (23411a) formed on the first side member (2340a) may include a first-first conductive portion (23411a-1), a first-second conductive portion (23411a-2), a first-third conductive portion (23411a-3), a first-fourth conductive portion (23411a-4), a first-fifth conductive portion (23411a-5), a first-sixth conductive portion (23411a-6), and / or a first-seventh conductive portion (23411a-7). In one embodiment, the second conductive portions (23411b) formed on the second side member (2340b) may include a second-first conductive portion (23411b-1), a second-second conductive portion (23411b-2), a second-third conductive portion (23411b-3), a second-fourth conductive portion (23411b-4), a second-fifth conductive portion (23411b-5), a second-sixth conductive portion (23411b-6), and / or a second-seventh conductive portion (23411b-7).

[0335] In one embodiment, the length and arrangement of the first conductive portions (23411a) formed on the first side member (2340a) and the second conductive portions (23411b) formed on the second side member (2340b) may be formed to be symmetrical with respect to the folding axis (F). For example, in a folded state of the electronic device (2301), at least some of the facing first conductive portions (23411a) and the facing second conductive portions (23411b) may be formed to have substantially the same length so as to be symmetrical with respect to the folding axis (F). For example, the first-first conductive portion (23411a-1) and the second-first conductive portion (23411b-1) may be symmetrical with respect to the folding axis (F). For example, the first-second conductive portion (23411a-2) and the second-second conductive portion (23411b-2) may be mutually symmetrical with respect to the folding axis (F). For example, the first-third conductive portion (23411a-3) and the second-third conductive portion (23411b-3) may be mutually symmetrical with respect to the folding axis (F). For example, the first-fourth conductive portion (23411a-4) and the second-fourth conductive portion (23411b-4) may be mutually symmetrical with respect to the folding axis (F). For example, the first-fifth conductive portion (23411a-5) and the second-fifth conductive portion (23411b-5) may be mutually symmetrical with respect to the folding axis (F). For example, the first-sixth conductive portion (23411a-6) and the second-sixth conductive portion (23411b-6) may be mutually symmetrical with respect to the folding axis (F). For example, the first-seventh conductive portion (23411a-7) and the second-seventh conductive portion (23411b-7) may be mutually symmetrical with respect to the folding axis (F).

[0336] In one embodiment, when at least some of the first conductive portions (23411a) and the second conductive portions (23411b) are formed symmetrically with respect to the folding axis (F), the phenomenon of antenna performance deteriorating through the symmetrical conductive portion due to an electrical signal introduced into the conductive portion that does not function as an antenna can be reduced or prevented. For example, as illustrated in FIG. 23, assuming that the first-first conductive portion (23411a-1) and the second-first conductive portion (23411b-1) are symmetrical with respect to the folding axis (F) and that the first-first conductive portion (23411a-1) is connected to a wireless communication circuit (2390) and the second-first conductive portion (23411b-1) is not connected to the wireless communication circuit (2390), the frequency band of the electrical path formed by the electrical signal (e.g., an unintended electrical signal) introduced into the second-first conductive portion (23411b-1) is formed similarly to the frequency band of the electrical path formed by the electrical signal applied to the first-first conductive portion (23411a-1), thereby reducing deterioration of antenna performance through the first-first conductive portion (23411a-1). In addition, when the electronic device (2301) is used in a folded state, if the facing first conductive portion (e.g., the first-first conductive portion (23411a-1)) and the second conductive portion (e.g., the second-first conductive portion (23411b-1)) have mutually symmetrical lengths and arrangements, the electrical signal applied to the first conductive portion (e.g., the first-first conductive portion (23411a-1)) is transmitted to the corresponding second conductive portion (e.g., the second-first conductive portion (23411b-1)), thereby minimizing or preventing the change in the electrical path through which the electrical signal flows, thereby minimizing the deterioration of the antenna performance through the first conductive portion (e.g., the first-first conductive portion (23411a-1)) by the electrical signal applied to the second conductive portion (e.g., the second-first conductive portion (23411b-1)). Or it can be prevented.Meanwhile, the above-described example has been described focusing on the first-first conductive portion (23411a-1) and the second-first conductive portion (23411b-1), but this is for convenience of explanation, and it should be noted that it can be substantially equally applied to the first-first conductive portions (23411a) and the second-first conductive portions (23411b) that are symmetrical to each other.

[0337] In one embodiment, the wireless communication circuit (2390) may be disposed on a first circuit board (2350a) (e.g., a main circuit board), but may alternatively be disposed on a second circuit board (2350b) or another circuit board. Alternatively, the wireless communication circuit (2390) may be disposed on each of the first circuit board (2350a) and the second circuit board (2350b).

[0338] In one embodiment, the first circuit board (2350a) and / or the second circuit board (2350b) may include one or more electrical connection members (2353). In one embodiment, the first circuit board (2350a) may be connected to a connection member (2353) formed in the first conductive portions (23411a) through the electrical connection member (2353), thereby being electrically connected to the first conductive portions (23411a). The second circuit board (2350b) may be connected to a connection member (2353) formed in the second conductive portions (23411b) through the electrical connection member (2353), thereby being electrically connected to the second conductive portions (23411b).

[0339] In one embodiment, the circuit board (2350a, 2350b) may include one or more coupling connection structures (2351) for transmitting an electrical signal. In one embodiment, the coupling connection structure (2351) may include one or more first coupling pads (e.g., the first coupling pad (5511) of FIG. 5A) and one or more second coupling pads (e.g., the second coupling pad (5512) of FIG. 5B) that are arranged on different layers of the circuit board and are separated from each other. In one embodiment, the coupling connection structure (2351) may transmit an electrical signal through a capacitance formed between the first coupling pad and the second coupling pad. In one embodiment, the coupling connection structure (2351) may be implemented through the arrangement and connection structure of a plurality of coupling pads according to various embodiments illustrated in FIGS. 4A to 21B described above.

[0340] In one embodiment, the plurality of coupling connection structures (2351) may include a first coupling connection structure (2351a) for forming an electrical path between a conductive portion (23411) and a wireless communication circuit (2390) and / or a second coupling connection structure (2351b) for forming an electrical path between a pair of adjacent conductive portions (23411).

[0341] In one embodiment, the first coupling connection structure (2351a) can form an electrical path with the conductive portion (23411) through one or more first coupling pads, and can form an electrical path with the wireless communication circuit (2390) or the ground (2356) through one or more second coupling pads. In one embodiment, the first coupling connection structure (2351a) can transmit an electrical signal between the conductive portion (23411) and the wireless communication circuit (2390), or between the conductive portion (23411) and the ground (2356), through a capacitance formed between the one or more first coupling pads and the one or more second coupling pads. In one embodiment, the first coupling connection structure (2351a) may implement an ESD blocking function to prevent or reduce the transmission of noise signals or static electricity from the conductive portion (23411) to the wireless communication circuit (2390) by preventing direct transmission of electrical signals between the conductive portion (23411) and the wireless communication circuit (2390). In one embodiment, the first coupling connection structure (2351a) may include a discharge induction unit (e.g., a discharge induction unit (557D) of FIG. 5d) to induce the discharge of static electricity or noise signals transmitted from the conductive portion (23411) to the first coupling pad to the ground (2356). In one embodiment, the discharge induction unit may be implemented through the arrangement and structure of the discharge induction unit according to various embodiments illustrated in FIGS. 5a to 5h described above.

[0342] In one embodiment, the second coupling connection structure (2351b) (e.g., the coupling connection structure (1651) of FIG. 16a) can form an electrical path for an electrical signal to travel between a pair of adjacent conductive portions (23411) separated by an insulating portion (23412). For example, the second coupling connection structure (2351b) can form an electrical path with one conductive portion (e.g., the first-fifth conductive portion (23511a-5)) of a pair of adjacent conductive portions (e.g., the first-fifth conductive portion (23511a-5) and the first-sixth conductive portion (23511a-6)) through one or more first coupling pads, and can form an electrical path with another conductive portion (e.g., the first-sixth conductive portion (23511a-6)) through one or more second coupling pads. In one embodiment, the second coupling connection structure (2351b) can transmit an electrical signal between a pair of adjacent conductive portions (e.g., the first-fifth conductive portion (23511a-5) and the first-sixth conductive portion (23511a-6)) through a capacitance formed between the first coupling pad and the second coupling pad. For example, the second coupling connection structure (2351b) can utilize a pair of separated conductive portions (e.g., the first-fifth conductive portion (23511a-5) and the first-sixth conductive portion (23511a-6)) as a single radiator.

[0343] In one embodiment, each of the first conductive portions (23411a) formed on the first side member (2340a) may be connected to a wireless communication circuit (2390) and form an antenna region through which electrical signals corresponding to different frequency bands flow. For example, the first-first conductive portion (23411a-1) may form a first antenna region (A1). The first-second conductive portion (23411a-2) may form a second antenna region (A2). The first-third conductive portion (23411a-3) may form a third antenna region (A3). The first-fourth conductive portion (23411a-4) may form a fourth antenna region (A4). The first-fifth conductive portion (23411a-5) can form a fifth antenna region (A5). The first-sixth conductive portion (23411a-6) can form a sixth antenna region (A6). The first-seventh conductive portion (23411a-7) can form a seventh antenna region (A7).

[0344] In one embodiment, among the plurality of antenna regions, some of the antenna regions (A1, A2, A5) may be utilized to transmit and receive wireless signals in a specific frequency band (e.g., a frequency band of 3 GHz or higher). For example, the first antenna region (A1), the second antenna region (A2), and the fifth antenna region (A5) may function as antennas for transmitting and receiving wireless signals in an ultra-high band (UHB) (e.g., a frequency band of 6 GHz to 10 GHz). In one embodiment, the first-first conductive portion (23411a-1) forming the first antenna region (A1), the first-second conductive portion (23411a-2) forming the second antenna region (A2), and the first-fifth conductive portion (23411a-5) forming the fifth antenna region (A5) may be connected to a wireless communication circuit (2390) or a ground (2356) via a first coupling connection structure (2351a). In one embodiment, when applying an electrical signal to the conductive portions (23411a-1, 23411a-2, 23411a-5) or grounding an electrical signal from the conductive portions (23411a-1, 23411a-2, 23411a-5) through the first coupling connection structure (2351a), the loss of the electrical signal occurring in a high frequency band (e.g., UHB) can be minimized or reduced, and a separate element for removing ESD (e.g., ESD protection element (2358)) during the transmission of the electrical signal can be omitted.

[0345] In one embodiment, the conductive portions (23411a-1, 23411a-2, 23411a-5) forming the antenna regions (A1, A2, A5) connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may be arranged more on the upper side (e.g., the portion of the first side member (2340a) adjacent to the +Y direction) of the electronic device (2301) than on the lower side (e.g., the portion of the first side member (2340a) adjacent to the -Y direction) of the electronic device (2301) based on the usage state of the electronic device (2301). In one embodiment, the antenna regions connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may be arranged adjacent to a housing region (e.g., the first housing (2310)) in which a main circuit board (e.g., the first circuit board (2350a)) is arranged. For example, the main circuit board may be a circuit board on which an application processor (AP) or a communication processor (CP) is arranged. For example, when the main circuit board is a first circuit board (2350a), as illustrated in FIG. 23, the antenna regions (A1, A2, A5) connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may be arranged more on the first side member (2340a) of the first housing (2310) than on the second side member (2340b) of the second housing (2320). In this case, the antenna region connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may not be arranged on the second side member (2340b) of the second housing (2320). In one embodiment, the antenna regions connected to the wireless communication circuit (2390) via the first coupling connection structure (2351a) may be positioned adjacent to a camera module (e.g., the second camera module (2208) of FIG. 22b).For example, as illustrated in FIG. 22b, when the camera module is positioned closer to the upper side (e.g., the first side member (2340a) portion adjacent to the + Y direction) of the electronic device (2301) than to the lower side (e.g., the first side member (2340a) portion adjacent to the -Y direction), more antenna areas connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may be positioned on the first side member (2340a) portion adjacent to the upper side than on the lower side of the electronic device (2301). In this case, the antenna area connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may not be positioned on the first side member (2340a) portion adjacent to the lower side of the electronic device (2301).

[0346] However, each of the above-described embodiments is an example, and the arrangement and number of antenna areas (A1, A2, A5) connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) are not limited.

[0347] In one embodiment, at least some of the antenna areas (A1, A5) among the antenna areas (A1, A2, A5) connected to the wireless communication circuit (2390) through the first coupling connection structure (2351a) may additionally include a connection path directly connected to the wireless communication circuit (2390) or the ground (2356) so as to transmit and receive wireless signals of a specific frequency band (e.g., a frequency band of 3 GHz or less). For example, as illustrated in FIG. 23, the first-first conductive portion (23411a-1) forming the first antenna region (A1) and the first-fifth conductive portion (23411a-5) forming the fifth antenna region (A5) may be directly connected to the wireless communication circuit (2390) or the ground (2356) through a signal transmission path in which the ESD protection element (2358) is disposed, separately from the signal transmission path formed by the first coupling connection structure (2351a). In this case, the first antenna region (A1) or the fifth antenna region (A5) may be connected to the wireless communication circuit (2390) or the ground (2356) through the signal transmission path formed by the first coupling connection structure (2351a) or the signal transmission path including the ESD protection element (2358), depending on the frequency band of the wireless signal to be transmitted and received.

[0348] In one embodiment, among the plurality of antenna regions, some antenna regions (A6) may be connected to a wireless communication circuit (2390) or ground (2356) via a signal transmission path including an ESD protection element (2358) to transmit and receive wireless signals of a specific frequency band (e.g., a frequency band of 3 GHz or less). For example, the first-sixth conductive portion (23411a-6) forming the sixth antenna region (A6) may be directly connected to a wireless communication circuit (2390) or ground (2356) via a signal transmission path in which an ESD protection element (2358) is disposed.

[0349] In one embodiment, some of the conductive portions (23411a) forming the antenna area (23411a) may be connected to ground (e.g., the ground of the electronic device) by contacting a conductive structure of the electronic device (2301) (e.g., the support member (2282) of FIG. 22c, or the hinge plate (2262), etc.). For example, the first-third conductive portion (23411a-3) forming the third antenna area (A3) and the first-seventh conductive portion (23411a-7) forming the seventh antenna area (A7) may be connected to ground by contacting the hinge plate without a separate signal transmission path connecting to the first circuit board (2350a). For example, the first to fourth conductive portions (23411a-4) forming the fourth antenna area (A4) may be connected to the ground without a separate signal transmission path connecting to the first circuit board (2350a) by contacting the support member (2282). In one embodiment, the conductive portions (23411a-3, 23411a-4, 23411a-7) forming the antenna areas (A3, A4, A7) directly connected to the ground may be connected to the wireless communication circuit (2390) via a signal transmission path in which the ESD protection element (2358) is omitted.

[0350] In one embodiment, the first-fifth conductive portion (23411a-5) forming the fifth antenna region (A5) and the first-sixth conductive portion (23411a-6) forming the sixth antenna region (A6) can be connected to transmit and receive electrical signals via the second coupling connection structure (2351b). In this case, the first-fifth conductive portion (23411a-5) and the first-sixth conductive portion (23411a-6) can function as a single radiator via the second coupling connection structure (2351b). For example, an electrical signal applied to the 1st-5th conductive portion (23411a-5) may travel to the 6th conductive portion (23411a-6) through the 2nd coupling connection structure (2351b), thereby forming an electrical path that flows through at least a portion of the 1st-5th conductive portion (23411a-5) and at least a portion of the 1st-6th conductive portion (23411a-6).

[0351] In one embodiment, the second conductive portions (23411b) may not be connected to the wireless communication circuit (2390). At least some of the second conductive portions (23411b-1, 23411b-2, 23411b-5, 23411b-6) of the second conductive portions (23411b) may transmit an applied electrical signal or noise signal to the ground (2356) through a signal transmission path including the ESD protection element (2358). At least some of the second conductive portions (23411b) (23411b-3, 23411b-4, 23411b-7) of the second conductive portions (23411b) can be connected to ground by contacting a conductive structure of the electronic device (2301) (e.g., support member (2282) of FIG. 22c, or hinge plate (2262), etc.).

[0352] In one embodiment, at least one pair of adjacent conductive portions among the plurality of second conductive portions (23411b) may be connected to transmit an electrical signal through a second coupling connection structure (2351b). For example, the second-sixth conductive portion (23411b-6) and the second-seventh conductive portion (23411b-7) may be electrically connected through the second coupling connection structure (2351b). In this case, an electrical signal (e.g., a noise signal) applied to a portion of the second-sixth conductive portion (23411b-6) adjacent to the second-seventh conductive portion (23411b-7) may be transmitted to the second-sixth conductive portion (23411b-6) through the second coupling connection structure (2351b) and may be discharged to the ground. An electrical signal (e.g., noise signal) applied to the 2-6 conductive portion (23411b-6) adjacent to the 2-5 conductive portion (23411b-5) can escape to the ground (2356) through a signal transmission path in which an ESD protection element (2358) is arranged.

[0353] FIG. 24a is a perspective view illustrating a front side of an electronic device according to an embodiment. FIG. 24b is a perspective view illustrating a rear side of an electronic device according to an embodiment. FIG. 24c is an exploded perspective view of an electronic device according to an embodiment.

[0354] Referring to FIGS. 24A, 24B, and 24C, an electronic device (2401) according to an embodiment may include a first housing (2410) (e.g., a first housing structure) and a second housing (2420) (e.g., a second housing structure) that are foldable with respect to each other via at least one hinge device (2460, 2460-1) (e.g., a hinge module or a hinge structure) with respect to a folding axis (F). For example, the first housing (2410) and the second housing (2420) may be configured as a foldable housing (e.g., a housing structure). In one embodiment, the first housing (2410) may include a first surface (2411) and a second surface (2412) facing in an opposite direction (e.g., in the -Z direction of FIG. 22A) of the first surface (2411). The second housing (2420) may include a third surface (2421) and a fourth surface (2422) facing in an opposite direction (e.g., in the -Z direction of FIG. 22A) of the third surface (2421). In one embodiment, the first housing (2410) may include a first side surface formed between the first surface (2411) and the second surface (2412). The second housing (2420) may include a second side surface formed between the third surface (2421) and the fourth surface (2422).

[0355] In one embodiment, the first housing (2410) can include a first side member (2440a) forming at least a portion of the first side (e.g., a first side bezel). The first side member (2440a) can include a conductive portion. In one embodiment, the first housing (2410) can include a first rear cover (2414) coupled with the first side member (2440a) and forming a second side (2412). In one embodiment, the second housing (2420) can include a second side member (2440b) forming at least a portion of the second side (e.g., a second side bezel). The second side member (2440b) can include a conductive portion. In one embodiment, the second housing (2420) may include a second rear cover (2424) coupled with the second side member (2440b) and forming a fourth surface (2422).

[0356] In one embodiment, the electronic device (2401) may change shape as the relative angles of the first housing (2410) and the second housing (2420) about the folding axis (F) change. For example, the electronic device (2401) may change shape between a first state (e.g., an unfolded state or an unfolded state) in which the first surface (2411) and the second surface (2412) are completely unfolded so that they are substantially on the same plane, and a second state (e.g., a folded state or a folded state) in which the first surface (2411) and the second surface (2412) are completely folded inward so that they face each other or completely folded outward so that they face each other in opposite directions. In one embodiment, the electronic device (2401) may be operated to have a shape in a third state (e.g., an intermediate unfolded state) between the first state and the second state.

[0357] In one embodiment, the electronic device (2401) may include a first receiver (2481), at least one first sensor module (2404) (e.g., an ambient light sensor) and / or at least one first camera module (2405) (e.g., an under display camera; UDC) disposed through a first side (2411) of the first housing (2410). In one embodiment, the electronic device (2401) may include at least one button (2406) formed on a first side member (2440a). In one embodiment, the electronic device (2401) may include at least one second camera module (2408) and / or a flash (2409) disposed through a second side (2421) of the first housing (2410) (e.g., a first rear cover (2414)).

[0358] In one embodiment, the electronic device (2401) may include a first display (2436) (e.g., a flexible display (2436), a foldable display (2436), or a main display (2436)) supported by the first housing (2410) and the second housing (2420) and arranged to be visually displayed through the first side (2411) and the third side (2421).

[0359] In one embodiment, the first display (2436) may include a first area (2436a) corresponding to at least a portion of the first surface (2411) (e.g., a first planar area), a second area (2436b) corresponding to at least a portion of the third surface (2421) (e.g., a second planar area), and a folding area (2436c) (e.g., a folding area) that connects the first area (2436a) and the second area (2436b) and whose shape is deformed during the folding process of the electronic device (2401). In one embodiment, the folding area (2436c) may be positioned to at least partially overlap at least one hinge device (2460, 2460-1) when the first display (2436) is viewed from above (e.g., in the +Z direction of FIG. 22A). For example, the first display (2436) may be arranged so as not to be visible from the outside in a second state of the electronic device (2401) in which the first side (2411) and the third side (2421) face each other (e.g., in the case of an in-folding type). For example, the first display (2436) may be arranged so as to be visible from the outside in a second state of the electronic device (2401) in which the first side (2411) and the third side (2421) face opposite directions (e.g., in the case of an out-folding type).

[0360] In one embodiment, the electronic device (2401) may include a second display (2431) (e.g., an auxiliary display) disposed through a third side (2412) of the first housing (2410), at least one third camera module (2408), at least one second sensor module (2409), and / or a second receiver. For example, the second display (2431) may be disposed to be visually visible from the outside through at least a portion of the first rear cover (2414). In one embodiment, the electronic device (2401) may include a speaker (2402) disposed through a second side member (2440b), a microphone (2403) disposed through a first side member (2440a), and / or a connector port (2407). At least some of the components described above may be arranged and / or modified between the first housing (2410) and / or the second housing (2420).

[0361] In one embodiment, at least one hinge device (2460, 2460-1) may be disposed at the lower portion (e.g., in the -Z direction of FIG. 22C) of the first display (2436) and may connect the first housing (2410) and the second housing (2420). For example, the at least one hinge device (2460, 2460-1) may include a first hinge device (2460) disposed along the folding axis (F) and a second hinge device (2460-1) disposed spaced apart from the first hinge device (2460). In one embodiment, the first hinge device (2460) may be formed in a configuration that is substantially symmetrical or substantially identical to the second hinge device (2460-1). For example, at least one hinge device (2460, 2460-1) may be supported by a first support member (24131) extending from the first side member (2440a) to the first space (24101) of the first housing (2410), and a second support member (24231) extending from the second side member (2440b) to the second space (24201) of the second housing (2420). In one embodiment, at least one hinge device (2460, 2460-1) may be covered by a hinge housing (2450) between the first housing (2410) and the second housing (2420) and may not be visible from the outside.

[0362] In one embodiment, the hinge device (2460, 2460-1) may include a gear assembly (2463) that symmetrically rotates a first rotational member (2461) (e.g., a first arm or a first rotator) disposed on a first support member (24131) of a first housing (2410) and a second rotational member (2462) (e.g., a second arm or a second rotator) disposed on a second support member (24231) of a second housing (2420) relative to each other. For example, the gear assembly (2463) may include a plurality of gears (e.g., spur gears and / or worm gears) that are gear-coupled to each other. For example, the gear assembly (2463) may include a cam coupling structure and / or a spring structure for urging the first housing (2410) and the second housing (2420) at a predetermined angle relative to each other in a direction in which the first state is to be transitioned to the second state or in a direction in which the second state is to be transitioned to the first state.

[0363] In one embodiment, the electronic device (2401) may be coupled with at least one hinge device (2460, 2460-1) and may include at least one detent module (2464) to provide a stopping sensation at various folding angles of the electronic device (2401). For example, the at least one hinge device (2460, 2460-1) and / or the detent module (2464) may form substantially the same plane as the first support member and the second support member when the electronic device (2401) is in the first state.

[0364] FIG. 25 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to an embodiment. Referring to FIG. 25, an electronic device (2501) according to an embodiment (e.g., electronic device (2401) of FIG. 24) may include a housing structure (2500) including a first housing (2510) and a second housing (2520) that are rotatable relative to each other about a folding axis (F), a first circuit board (2550a) disposed in the first housing (2510), a second circuit board (2550b) disposed in the second housing (2520), a connection circuit board (2550c) (e.g., FPCB) connecting the first circuit board (2550a) and the second circuit board (2550b), and a wireless communication circuit (2590).

[0365] In one embodiment, the first housing (2510) and the second housing (2520) can rotate relative to each other about the folding axis (F). The housing structure (2500) can include a side member (2540) forming a side surface surrounding the interior space. For example, the first housing (2510) and the second housing (2520) can each include a first side member (2540a) and a second side member (2540b) forming a side surface surrounding the interior space. In one embodiment, the first side member (2540a) and / or the second side member (2540b) can each include a plurality of conductive portions (25411) including a conductive material. In one embodiment, at least some of the conductive portions (25411) can function as radiators through which electrical signals flow. In one embodiment, the conductive portions (25411) may include first conductive portions (25411a) positioned in the first housing (2510) and second conductive portions (25411b) positioned in the second housing (2520). In one embodiment, the first side member (2540a) and the second side member (2540b) may include insulating portions (25412) formed of an insulating material. The insulating portions (25412) may be arranged to separate adjacent conductive portions (25411). The conductive portions (25411) physically separated by the insulating portions (25412) may form an electrical path through which an electrical signal flows. In one embodiment, the first side member (2540a) and the second side member (2540b) may be formed on at least one of the conductive portions (25411) of the conductive portions (25411) and may include a connection portion for connecting to a circuit board (2550a, 2550b).

[0366] In one embodiment, some of the plurality of conductive portions (25411) may be connected to a wireless communication circuit (2590) through a circuit board (2550a, 2550b) and may form an antenna area for transmitting and receiving a wireless signal of a frequency band corresponding to the length of a path along which an electrical signal flows. Other some of the plurality of conductive portions (25411) may not be connected to the wireless communication circuit (2590). Hereinafter, for the convenience of explanation, an example of utilizing some of the conductive portions (25411) of the electronic device (2501) as an antenna will be described based on the connection structure of the conductive portions (25411) and the wireless communication circuit (2590) illustrated in FIG. 25. However, it should be noted that the length and arrangement structure of each conductive portion (25411) formed in the electronic device (2501), the wireless communication circuit (2590), and the connection structure with the ground (2556) are not limited thereto.

[0367] In one embodiment, the first conductive portions (25411a) formed on the first side member (2540a) may include a first-first conductive portion (25411a-1), a first-second conductive portion (25411a-2), a first-third conductive portion (25411a-3), a first-fourth conductive portion (25411a-4), and / or a first-fifth conductive portion (25411a-5). In one embodiment, the second conductive portions (25411b) formed on the second side member (2540b) may include a second-first conductive portion (25411b-1), a second-second conductive portion (25411b-2), a second-third conductive portion (25411b-3), a second-fourth conductive portion (25411b-4), and / or a second-fifth conductive portion (25411b-5).

[0368] In one embodiment, the length and arrangement of the first conductive portions (25411a) formed on the first side member (2540a) and the second conductive portions (25411b) formed on the second side member (2540b) may be formed to be symmetrical with respect to the folding axis (F). For example, when the electronic device (2501) is in a folded state, at least some of the first conductive portions (25411a) and the second conductive portions (25411b) of the first side members (2540a) facing each other may be formed to have substantially the same length so as to be symmetrical with respect to the folding axis (F). For example, the first-first conductive portion (25411a-1) and the second-first conductive portion (25411b-1) may be symmetrical with respect to the folding axis (F). For example, the first-second conductive portion (25411a-2) and the second-second conductive portion (25411b-2) may be mutually symmetrical with respect to the folding axis (F). For example, the first-third conductive portion (25411a-3) and the second-third conductive portion (25411b-3) may be mutually symmetrical with respect to the folding axis (F). For example, the first-fourth conductive portion (25411a-4) and the second-fourth conductive portion (25411b-4) may be mutually symmetrical with respect to the folding axis (F). For example, the first-fifth conductive portion (25411a-5) and the second-fifth conductive portion (25411b-5) may be mutually symmetrical with respect to the folding axis (F). Meanwhile, in the drawing, each of the first conductive parts (25411a) and each of the second conductive parts (25411b) is depicted as being symmetrical with respect to the folding axis (F), but is not limited thereto.

[0369] In one embodiment, the wireless communication circuit (2590) may be disposed on a first circuit board (2550a) (e.g., a main circuit board), but may alternatively be disposed on a second circuit board (2550b) or another circuit board. Alternatively, the wireless communication circuit (2590) may be disposed on each of the first circuit board (2550a) and the second circuit board (2550b).

[0370] In one embodiment, the first circuit board (2550a) and the second circuit board (2550b) may each include one or more electrical connection members (2553). In one embodiment, the first circuit board (2550a) may be connected to a connection portion formed in the first conductive portions (25511a) via the electrical connection members (2553) to form a signal transmission path with the first conductive portions (25411a). The second circuit board (2550b) may be connected to a connection portion formed in the second conductive portions (25411b) via the electrical connection members (2553) to form a signal transmission path with a portion of the second conductive portions (25411b).

[0371] In one embodiment, the circuit board (2550a, 2550b) may include one or more coupling connection structures (2551) for transmitting an electrical signal. In one embodiment, the coupling connection structures (2551) may include one or more first coupling pads (e.g., the first coupling pads (5511) of FIG. 5A) and one or more second coupling pads (e.g., the second coupling pads (5512) of FIG. 5B) that are arranged on different layers of the circuit board (2550a, 2550b) and are separated from each other. In one embodiment, the coupling connection structures (2551) may transmit an electrical signal through a capacitance formed between the first coupling pads and the second coupling pads. In one embodiment, the coupling connection structure (2551) can be implemented through the arrangement and connection structure of a plurality of coupling pads according to the various embodiments illustrated in FIGS. 4A to 21B described above.

[0372] In one embodiment, the coupling connection structure (2551) can form an electrical path with the conductive portion (25411) through one or more first coupling pads, and can form an electrical path with the wireless communication circuit (2590) or the ground (2556) through one or more second coupling pads. In one embodiment, the coupling connection structure (2551) can transmit an electrical signal between the conductive portion (25411) and the wireless communication circuit (2590), or between the conductive portion (25411) and the ground (2556), through a capacitance formed between the one or more first coupling pads and the one or more second coupling pads. In one embodiment, the coupling connection structure (2551) may implement an ESD blocking function to prevent or reduce the transmission of noise signals or static electricity from the conductive portion (25411) to the wireless communication circuit (2590) by preventing direct transmission of electrical signals between the conductive portion (25411) and the wireless communication circuit (2590). In one embodiment, the coupling connection structure (2551) may include a discharge induction unit (e.g., a discharge induction unit (557D) of FIG. 5D) to induce the discharge of static electricity or noise signals transmitted from the conductive portion (25411) to the first coupling pad to the ground (2556). In one embodiment, the discharge induction unit may be implemented through the arrangement and structure of the discharge induction unit according to various embodiments illustrated in FIGS. 5A to 5H described above.

[0373] In one embodiment, some of the conductive portions (25411) may be connected to a wireless communication circuit (2590) and form an antenna region through which electrical signals corresponding to various frequency bands flow. For example, the first-first conductive portion (25411a-1) may form a first antenna region (A1). The first-second conductive portion (25411a-2) may form a second antenna region (A2). The first-third conductive portion (25411a-3) may form a third antenna region (A3). The first-fourth conductive portion (25411a-4) may form a fourth antenna region (A4). The first-fifth conductive portion (25411a-5) may form a fifth antenna region (A5) or a sixth antenna region (A6). The second-fifth conductive portion (25411b-5) can form a seventh antenna region (A7). The second-second conductive portion (25411b-2) can form an eighth antenna region (A8). The second-third conductive portion (25411b-3) can form a ninth antenna region (A9).

[0374] In one embodiment, among the plurality of antenna regions, some of the antenna regions (A3, A4, A7) may be utilized to transmit and receive wireless signals of a specific frequency band (e.g., a frequency band of 3 GHz or higher). For example, the third antenna region (A3), the fourth antenna region (A4), and the seventh antenna region (A7) may function as antennas for transmitting and receiving wireless signals of an UHB (e.g., a frequency band of 6 GHz to 10 GHz). In one embodiment, the first-third conductive portion (25411a-3) forming the third antenna region (A3), the first-fourth conductive portion (25411a-4) forming the fourth antenna region (A4), and the second-fifth conductive portion (25411b-5) forming the seventh antenna region (A7) may be connected to a wireless communication circuit (2590) or a ground (2556) via a coupling connection structure (2551). In one embodiment, when transmitting an electrical signal between a wireless communication circuit (2590) and a conductive portion (25411a-3, 25411a-4, 25411b-5) through a coupling connection structure (2551), the loss of the electrical signal occurring in a high frequency band (e.g., UHB) can be minimized or reduced, and a separate element for removing ESD (e.g., ESD protection element (2558)) during the transmission of the electrical signal can be omitted.

[0375] In one embodiment, the antenna areas (A3, A4, A7) connected to the wireless communication circuit (2590) through the coupling connection structure (2551) may be arranged more on the upper side of the electronic device (2501) (e.g., the first side member (2540a) adjacent to the +Y direction) than on the lower side of the electronic device (2501) (e.g., the second side member (2540b) adjacent to the -Y direction) based on the usage state of the electronic device (2501).

[0376] In one embodiment, the antenna regions connected to the wireless communication circuit (2590) through the coupling connection structure (2551) may be arranged adjacent to a housing region (e.g., the first housing (2510)) on which a main circuit board (e.g., the first circuit board (2550a)) is arranged. For example, the main circuit board may be a circuit board on which an application processor (AP) or a communication processor (CP) is arranged. For example, when the main circuit board is the first circuit board (2550a), as illustrated in FIG. 25, the antenna regions (A3, A4, A7) connected to the wireless communication circuit (2590) through the coupling connection structure (2551) may be arranged more on the first side member (2540a) of the first housing (2510) than on the second side member (2540b) of the second housing (2520). For example, the antenna region connected to the wireless communication circuit (2590) through the coupling connection structure (2551) may not be disposed on the second side member (2540b) of the second housing (2520). In one embodiment, the antenna regions connected to the wireless communication circuit (2590) through the coupling connection structure (2551a) may be disposed adjacent to a camera module (e.g., the second camera module (2408) of FIG. 24b). For example, when the camera module is positioned closer to the upper side (e.g., the first side member (2540a) portion adjacent to the +Y direction) than to the lower side (e.g., the first side member (2540a) portion adjacent to the -Y direction) of the electronic device (2501), more antenna areas connected to the wireless communication circuit (2590) through the coupling connection structure (2551) may be positioned on the first side member (2540a) portion adjacent to the upper side than on the lower side of the electronic device (2501). In this case, the antenna area connected to the wireless communication circuit (2590) through the coupling connection structure (2551) may not be positioned on the first side member (2540a) portion adjacent to the lower side of the electronic device (2501).

[0377] However, each of the above-described embodiments is an example, and the number and arrangement of antenna areas (A3, A4, A7) connected to the wireless communication circuit (2590) through the coupling connection structure (2551) are not limited thereto.

[0378] In one embodiment, among the plurality of antenna regions, some of the antenna regions (A2, A8, A9) may be connected to a wireless communication circuit (2590) or a ground (2556) via a signal transmission path including an ESD protection element (2558) to transmit and receive wireless signals of a specific frequency band (e.g., a frequency band of 3 GHz or less). For example, the first-second conductive portion (25411a-2) forming the second antenna region (A2), the second-second conductive portion (25411b-2) forming the eighth antenna region (A8), and the second-third conductive portion (25411b-3) forming the ninth antenna region (A9) may be directly connected to the wireless communication circuit (2590) or the ground (2556) via a signal transmission path in which the ESD protection element (2558) is disposed.

[0379] In one embodiment, some of the conductive portions (25411) forming the antenna area (25411a-1, 25411a-5) may be directly connected to the ground without a separate signal transmission path connecting to the circuit board (2550a) by contacting a conductive structure (e.g., a support member, a hinge plate, etc.) of the electronic device (2501). For example, the 1-1 conductive portion (25411a-1) forming the first antenna area (A1) and the 1-5 conductive portions (25411a-5) forming the fifth antenna area (A5) and the sixth antenna area (A6) are directly connected to the ground, and thus may be connected to the wireless communication circuit (2590) through a signal transmission path in which the ESD protection element (2558) is omitted. In one embodiment, the fifth conductive portion (25411a-5) may be formed with multiple grounding / feeding portions. Depending on the path along which an electrical signal applied to the fifth conductive portion (25411a-5) flows, the fifth conductive portion may function as a fifth antenna region (A5) or a sixth antenna region (A6).

[0380] FIG. 26a is a front perspective view illustrating an unfolded state of an electronic device according to one embodiment. FIG. 26b is a rear perspective view illustrating an unfolded state of an electronic device according to one embodiment. FIG. 26c is a perspective view illustrating a folded state of an electronic device according to one embodiment.

[0381] Referring to FIGS. 26A, 26B, and 26C, an electronic device (2601) according to an embodiment may have a shape that can be transformed depending on a usage state. For example, the electronic device (2601) may be provided as a foldable type that can be folded or unfolded depending on a usage state. In an embodiment, the electronic device (2601) may include a first housing (2610), a second housing (2620), a third housing (2630), a display (2661), a first hinge housing (2615), and a second hinge housing (2625).

[0382] Hereinafter, in describing FIGS. 26a to 26c, for convenience of explanation, the surface of the display (2661) that is visually visible to the outside is referred to as the front surface (2601a) of the electronic device (e.g., the surface facing the +Z direction in FIG. 26a), the surface opposite to the front surface (2601a) is referred to as the back surface (2601b) of the electronic device (2601) (e.g., the surface facing the -Z direction in FIG. 26a), and the outer surface of the electronic device (2601) that surrounds the internal space between the front surface (2601a) and the back surface (2601b) is referred to as the side surface (2601c).

[0383] In one embodiment, a first housing (2610), a second housing (2620), and a third housing (2630) may form an exterior of an electronic device (2601). In one embodiment, the first housing (2610) may include a first front surface (2610a) and a first rear surface (2610b). The second housing (2620) may include a second front surface (2620a) and a second rear surface (2620b). The third housing (2630) may include a third front surface (2630a) and a third rear surface (2630b). In one embodiment, the first front surface (2610a) of the first housing (2610), the second front surface (2620a) of the second housing (2620), and the third front surface (2630a) of the third housing (2630) may form the front surface (2601a) of the electronic device (2601) based on the unfolded state of the electronic device (2601) as shown in FIG. 26A. In one embodiment, the front surface (2601a) of the electronic device (2601) may be formed so that most of the area is open so that the display (2661) is visually visible to the outside. In one embodiment, the first rear surface (2610b) of the first housing (2610), the second rear surface (2620b) of the second housing (2620), and the third rear surface (2630b) of the third housing may form the rear surface (2601b) of the electronic device (2601) based on the unfolded state of the electronic device (2601) as shown in FIG. 26b. In one embodiment, the first housing (2610), the second housing (2620), and the third housing (2630) may form a side surface (2601c) that surrounds an internal space between the front surface (2601a) and the rear surface (2601b) of the electronic device (2601), respectively.

[0384] In one embodiment, the first housing (2610) may include a first side member (2640a) forming a portion of a side surface (2601c) of the electronic device (2601). The first side member (2640a) may include a conductive portion. In one embodiment, the second housing (2620) may include a second side member (2640b) forming a portion of a side surface (2601c) of the electronic device (2601). The second side member (2640b) may include a conductive portion. In one embodiment, the third housing (2630) may include a third side member (2640c) forming a portion of a side surface (2601c) of the electronic device (2601). The third side member (2640c) may include a conductive portion.

[0385] In one embodiment, a first rear cover (2651) may be disposed on a first rear surface (2610b) of a first housing (2610). At least a portion of an edge of the first rear cover (2651) may be surrounded by the first housing (2610). In one embodiment, a second rear cover (2652) may be disposed on a second rear surface (2620b) of a second housing (2620). At least a portion of an edge of the second rear cover (2652) may be surrounded by the second housing (2620). In one embodiment, a third rear cover (2653) may be disposed on a third rear surface (2630b) of a third housing (2630). At least a portion of an edge of the third rear cover (2653) may be surrounded by the third housing (2630). In one embodiment, the first rear cover (2651), the second rear cover (2652), and the third rear cover (2653) may be formed integrally with the first housing (2610), the second housing (2620), and the third housing (2630), respectively.

[0386] In one embodiment, the first housing (2610), the second housing (2620), the third housing (2630), the first rear cover (2651), the second rear cover (2652), and the third rear cover (2653) may be coupled to each other to form a space in which various components of the electronic device (2601) may be placed (e.g., circuit boards (2750a, 2750b, 2750c) of FIG. 27). In one embodiment, at least one component may be placed so as to be visually visible on the rear surface (2601b) of the electronic device (2601). For example, at least one component (e.g., a proximity sensor, a rear camera module, and / or a flash) may be visually visible to the outside through the second rear area (2652a) of the second rear cover (2652). In one embodiment, at least a portion of the sub-display (2670) may be visually exposed through the third rear area (2653a) of the third rear cover (2653).

[0387] In one embodiment, the first hinge housing (2615) can rotatably connect the first housing (2610) and the second housing (2620) about the first folding axis (F1). In one embodiment, the second hinge housing (2625) can rotatably connect the second housing (2620) and the third housing (2630) about the second folding axis (F2). In one embodiment, the first folding axis (F1) and the second folding axis (F2) can be parallel to each other.

[0388] In one embodiment, the display (2661) may be deformable in at least some areas such that the shape thereof may change in response to a shape deformation of the electronic device (2601) (e.g., an opening and closing operation of the electronic device (2601) between the first state (e.g., an unfolded state, or a fully open state) of FIG. 26a and the second state (e.g., a folded state, or a fully closed state) of FIG. 26c). In one embodiment, the display (2661) may be supported by the first housing (2610), the second housing (2620), the third housing (2630), the first hinge housing (2615), and the second hinge housing (2625), and may be arranged to be visually visible to the outside through the front surface (2601a) of the electronic device (2601).

[0389] In one embodiment, the display (2661) may include a first planar portion (2661a) corresponding to the first housing (2610), a second planar portion (2661b) corresponding to the second housing (2620), a third planar portion (2661c) corresponding to the third housing (2630), a first folding portion (2661d) connecting the first planar portion (2661a) and the second planar portion (2661b) and corresponding to the first hinge housing (2615), and a second folding portion (2661e) connecting the second planar portion (2661b) and the third planar portion (2661c) and corresponding to the second hinge housing (2625). In one embodiment, the first folding portion (2661d) and the second folding portion (2661e) can be at least partially bent to conform to changes in the shape of the electronic device (2601).

[0390] In one embodiment, the electronic device (2601) may include a connector port (2678) (e.g., connection terminal (178) of FIG. 1) disposed through a side (2601c), and an audio output module (2655) including one or more holes formed in the side (2601c).

[0391] FIG. 27 is a diagram schematically illustrating an exemplary connection structure of a side member and a circuit board in an electronic device according to one embodiment.

[0392] Referring to FIG. 27, an electronic device (2701) according to an embodiment (e.g., electronic device (2601) of FIG. 26) includes a housing structure (2700) including a first housing (2710), a second housing (2720), and a third housing (2730), a first circuit board (2750a) disposed in the first housing (2710), a second circuit board (2750b) disposed in the second housing (2720), a third circuit board (2750c) disposed in the third housing (2730), a first connection circuit board (2750d) connecting the first circuit board (2750a) and the second circuit board (2750b), a second connection circuit board (2750e) connecting the second circuit board (2750b) and the third circuit board (2750c), and / or a wireless It may include a communication circuit (2790).

[0393] In one embodiment, the first housing (2710) and the second housing (2720) can rotate around the first folding axis (F1). The second housing (2720) and the third housing (2730) can rotate around the second folding axis (F2).

[0394] In one embodiment, the housing structure (2700) may include side members (2740) forming side surfaces surrounding the interior space. For example, the first housing (2710), the second housing (2720), and the third housing (2730) may each include a first side member (2740a), a second side member (2740b), and a third side member (2740c) forming side surfaces surrounding the interior space. In one embodiment, the first side member (2740a), the second side member (2740b), and the third side member (2740c) may include a plurality of conductive portions (27411) comprising a conductive material. In one embodiment, at least a portion of the conductive portions (27411) may function as radiators through which electrical signals flow. In one embodiment, the first side member (2740a), the second side member (2740b), and the third side member (2740c) may be disposed between a plurality of conductive portions (27411) and may include an insulating portion (27412) that electrically isolates adjacent conductive portions (27411). For example, the first side member (2740a), the second side member (2740b), and the third side member (2740c) may be formed on the conductive portions (27411) and may include one or more connecting portions for connecting to a circuit board (2750a, 2750b).

[0395] In one embodiment, some of the conductive portions (27411) formed on the first side member (2740a), the second side member (2740b), and the third side member (2740c) may be connected to a wireless communication circuit (2790) through a circuit board (2750a, 2750b, 2750c) and may function as radiators for transmitting and receiving wireless signals of a frequency band corresponding to the length of a path along which an electrical signal flows. Other portions of the plurality of conductive portions (27411) may not be connected to the wireless communication circuit (2790). In the following, for convenience of explanation, the embodiment will be described based on the antenna area illustrated in the drawing, but it should be noted that the antenna structure and arrangement formed in the electronic device (2701) are not limited thereto.

[0396] In one embodiment, the plurality of conductive portions (27411) may include a first conductive portion (27411-1), a second conductive portion (27411-2), a third conductive portion (27411-3), a fourth conductive portion (27411-4), a fifth conductive portion (27411-5), a sixth conductive portion (27411-6), a seventh conductive portion (27411-7), an eighth conductive portion (27411-8), a ninth conductive portion (27411-9), a tenth conductive portion (27411-10), an eleventh conductive portion (27411-11), a twelfth conductive portion (27411-12), and / or a thirteenth conductive portion (27411-13). In one embodiment, the first conductive portion (27411-1), the second conductive portion (27411-2), the third conductive portion (27411-3), the sixth conductive portion (27411-6), the seventh conductive portion (27411-7), the eighth conductive portion (27411-8), and / or the tenth conductive portion (27411-10) may be formed on the first side member (2740a). In one embodiment, the fourth conductive portion (27411-4), the fifth conductive portion (27411-5), the ninth conductive portion (27411-9), and / or the eleventh conductive portion (27411-11) may be formed on the second side member (2740b). In one embodiment, the twelfth conductive portion (27411-12) and / or the thirteenth conductive portion (27411-13) may be formed on the third side member (2740c).

[0397] In one embodiment, among the plurality of conductive portions (27411) formed on the first side member (2740a), the second side member (2740b), and the third side member (2740c), the conductive portions (27411) that face each other when the electronic device (2701) is folded may be formed to be symmetrical with respect to the first folding axis (F1) and / or the second folding axis (F2). For example, the fifth conductive portion (27411-5) may be formed to be symmetrical with respect to the second conductive portion (27411-2) with respect to the first folding axis (F1), and may be formed to be symmetrical with respect to the twelfth conductive portion (27411-12) with respect to the second folding axis (F2). The 11th conductive portion (27411-11) may be formed symmetrically with the 7th conductive portion (27411-7) with the 1st folding axis (F1) as the center, and may be formed symmetrically with the 13th conductive portion (27411-13) with the 2nd folding axis (F2) as the center.

[0398] In one embodiment, the wireless communication circuit (2790) may be disposed on the first circuit board (2750a), but may alternatively be disposed on the second circuit board (2750b), the third circuit board (2750c), or another circuit board.

[0399] In one embodiment, the first circuit board (2750a), the second circuit board (2750b), and the third circuit board (2750c) are disposed in the first housing (2710), the second housing (2720), and the third housing (2730), respectively, and may include one or more electrical connection members (2753) electrically connected to conductive portions (27411) of each housing. In one embodiment, the electrical connection members (2753) may be connected to the conductive portions (27411) by contacting a connection portion formed on the conductive portions (27411).

[0400] In one embodiment, the circuit board (2750a, 2750b, 2750c) may include one or more coupling connection structures (2751) for transmitting an electrical signal. In one embodiment, the coupling connection structures (2751) may include one or more first coupling pads (e.g., the first coupling pads (5511) of FIG. 5A) and one or more second coupling pads (e.g., the second coupling pads (5512) of FIG. 5B) that are arranged on different layers of the circuit board (2750a, 2750b, 2750c) and are separated from each other. In one embodiment, the coupling connection structures (2751) may transmit an electrical signal through a capacitance formed between the first coupling pad and the second coupling pad. In one embodiment, the coupling connection structure (2751) can be implemented through the arrangement and connection structure of a plurality of coupling pads according to the various embodiments illustrated in FIGS. 4A to 21B described above.

[0401] In one embodiment, the coupling connection structure (2751) can form an electrical path with the conductive portion (27411) through one or more first coupling pads, and can form an electrical path with the wireless communication circuit (2790) or the ground (2756) through one or more second coupling pads. In one embodiment, the coupling connection structure (2751) can transmit an electrical signal between the conductive portion (27411) and the wireless communication circuit (2790), or between the conductive portion (27411) and the ground (2756), through a capacitance formed between the one or more first coupling pads and the one or more second coupling pads. In one embodiment, the coupling connection structure (2751) may implement an ESD blocking function to prevent or reduce the transmission of noise signals or static electricity from the conductive portion (27411) to the wireless communication circuit (2790) by preventing direct transmission of electrical signals between the conductive portion (27411) and the wireless communication circuit (2790). In one embodiment, the coupling connection structure (2751) may include a discharge induction unit (e.g., a discharge induction unit (557D) of FIG. 5D) to induce the discharge of static electricity or noise signals transmitted from the conductive portion (27411) to the first coupling pad to the ground (2756). In one embodiment, the discharge induction unit may be implemented through the arrangement and structure of the discharge induction unit according to various embodiments illustrated in FIGS. 5A to 5H described above.

[0402] In one embodiment, some of the plurality of conductive portions (27411) may be connected to a wireless communication circuit (2790) and form an antenna region through which electrical signals corresponding to various frequency bands flow. For example, the first conductive portion (27411-1) may form a first antenna region (A1). The second conductive portion (27411-2) may form a second antenna region (A2). The third conductive portion (27411-3) may form a third antenna region (A3). The fourth conductive portion (27411-4) may form a fourth antenna region (A4). The fifth conductive portion (27411-5) may form a fifth antenna region (A5). The sixth conductive portion (27411-6) can form a sixth antenna region (A6). The seventh conductive portion (27411-7) can form a seventh antenna region (A7). The eighth conductive portion (27411-8) can form an eighth antenna region (A8). The ninth conductive portion (27411-9) can form a ninth antenna region (A9). The tenth conductive portion (27411-10) can form a tenth antenna region (A10).

[0403] In one embodiment, among the plurality of antenna regions, some of the antenna regions (A1, A2) may be utilized to transmit and receive wireless signals of a specific frequency band (e.g., a frequency band of 3 GHz or higher). For example, the first antenna region (A1) and the second antenna region (A2) may function as antennas for transmitting and receiving wireless signals of an UHB (e.g., a frequency band of 6 GHz to 10 GHz). In one embodiment, the first conductive portion (27411-1) forming the first antenna region (A1) and the second conductive portion (27411-2) forming the second antenna region (A1) may be connected to a wireless communication circuit (2790) or a ground (2756) via a coupling connection structure (2751). In one embodiment, when transmitting an electrical signal between a wireless communication circuit (2790) and a conductive portion (27411-1, 27411-2) through a coupling connection structure (2751), loss of an electrical signal occurring in a high frequency band (e.g., UHB) can be minimized or reduced, and a separate element for removing ESD (e.g., ESD protection element (2758)) during the transmission of the electrical signal can be omitted.

[0404] In one embodiment, the antenna areas (A1, A2) connected to the wireless communication circuit (2790) through the coupling connection structure (2751) may be arranged more toward the upper side (e.g., +Y direction) of the electronic device (2901) than toward the lower side (e.g., -Y direction) of the electronic device (2901) based on the usage state of the electronic device (2901). In one embodiment, the antenna areas connected to the wireless communication circuit (2790) through the coupling connection structure (2751) may be arranged adjacent to a housing area (e.g., second housing (2720)) in which a main circuit board (e.g., second circuit board (2750b)) is arranged. For example, the main circuit board may be a circuit board in which an application processor (AP) or a communication processor (CP) is arranged. For example, when the main circuit board is the second circuit board (2750b), the antenna areas connected to the wireless communication circuit (2790) through the coupling connection structure (2751) may be arranged more on the side member (2740b) of the second housing (2720) than on the first housing (2710) or the third housing (2730). In this case, the antenna areas connected to the wireless communication circuit (2790) through the coupling connection structure (2751) may not be arranged on the first housing (2710) or the third housing (2730). In one embodiment, the antenna areas connected to the wireless communication circuit (2790) through the coupling connection structure (2751) may be arranged adjacent to a camera module (e.g., at least one camera module (2680a) arranged on the first rear cover (2652) of FIG. 26b).For example, when the camera module is positioned closer to the upper side (e.g., the second side member (2720b) ​​portion adjacent to the + Y direction) than the lower side (e.g., the second side member (2620a) portion adjacent to the -Y direction) of the electronic device (2701), more antenna areas connected to the wireless communication circuit (2790) via the coupling connection structure (2751) may be positioned in the second side member (2740b) portion adjacent to the upper side than the lower side of the electronic device (2701). For example, the first housing (2710) and the third housing (2730) in which the camera module (2680a) is not positioned may have the same number of antenna areas connected to the wireless communication circuit (2790) via the coupling connection structure (2751). For example, the antenna area connected to the wireless communication circuit (2790) through the coupling connection structure (2751) may not be placed in the second side member (2740b) portion adjacent to the lower side of the electronic device (2701).

[0405] However, each of the above embodiments is an example, and the number and arrangement of antenna areas connected to the wireless communication circuit (2790) through the coupling connection structure (2751) are not limited thereto.

[0406] In one embodiment, the first antenna area (A1) may include a separate signal transmission path directly connected to the wireless communication circuit (2790) or the ground (2756) so as to transmit and receive wireless signals of a different frequency band (e.g., a frequency band of 3 GHz or less) from the frequency band for transmission and reception through the coupling connection structure (2751). For example, the first conductive portion (27411-1) may be directly connected to the wireless communication circuit (2790) or the ground (2756) through a signal transmission path in which an ESD protection element (2758) is disposed, separately from the signal transmission path formed by the coupling connection structure (2751). Depending on the path along which the electrical signal applied to the first conductive portion (27411-1) flows, the frequency band of the wireless signal transmitted and received through the first antenna area (A1) may change.

[0407] In one embodiment, among the plurality of antenna regions, some of the antenna regions (A5, A6, A7) may be connected to a wireless communication circuit (2790) or a ground (2756) via a signal transmission path including an ESD protection element (2758) to transmit and receive wireless signals of a specific frequency band (e.g., a frequency band of 3 GHz or less). For example, the fifth conductive portion (27411-5) forming the fifth antenna region (A5), the sixth conductive portion (27411-6) forming the sixth antenna region (A6), and the seventh conductive portion (27411-7) forming the seventh antenna region (A7) may be directly connected to the wireless communication circuit (2790) or a ground (2756) via a signal transmission path in which an ESD protection element (2758) for removing noise signals is disposed.

[0408] In one embodiment, some of the conductive portions (23411-3, 23411-4, 23411-8, 23411-9, 23411-10) forming the antenna region may be connected to ground by contacting a conductive structure (e.g., a support member, a hinge plate, etc.) of the electronic device (2701). For example, the third conductive portion (27411-3) forming the third antenna area (A3), the fourth conductive portion (27411-4) forming the fourth antenna area (A4), the eighth conductive portion (27411-8) forming the eighth antenna area (A8), the ninth conductive portion (27411-9) forming the ninth antenna area (A9), and / or the tenth conductive portion (27411-10) forming the tenth antenna area (A10) can be connected to the ground without a separate signal transmission path connected to the circuit board (2750a, 2750b, 2750c). In one embodiment, conductive portions (27411-3, 27411-4, 27411-8, 27411-9, 27411-10) forming antenna areas (A3, A4, A8, A9, A10) directly connected to the ground can be connected to the wireless communication circuit (2790) via a signal transmission path with the ESD protection element (2758) omitted.

[0409] FIG. 28a is a front perspective view illustrating a first state of an electronic device according to an embo...

Claims

1. In electronic devices (101; 201; 401; 1401; 1501; 2301; 2501; 2701; 2901), A housing (210; 2300; 2500; 2700; 2900) comprising a side member forming a portion of an outer side surface of the electronic device (101; 201; 401; 1401; 1501; 2301; 2501; 2701; 2901) and including a conductive portion (4411; 14411; 15411; 23411; 25411; 27411; 29411); Circuit boards (450;550;650;750A;750B;750C;750D;750E;750F;750G;850;950;1050;1150;1250;1350;1450;1550;1650;1750A;1750B;1850;1950;2350a;2550a;2750a;2950a) provided within the housing (210;2310;2510;2710;2910); and Contains a wireless communication circuit (490; 1490; 1590; 2390; 2590; 2790; 2990) electrically connected to the above circuit board, The above circuit board, A plurality of first coupling pads (5511;7511;8511;9511;10511;11511;12511;13511;14511;15511;17511;18511;19511) provided on at least some of the plurality of layers of the circuit board; At least one second coupling pad (5512;7512;8512;9512;10512;11512;12512;13512;14512;15512;17512;18512;19512) spaced apart from the plurality of first coupling pads; A dielectric (552;752;852;952;1052;1152;1252;1352;1452;1552;1752;1852;1952) provided between the plurality of first coupling pads and the at least one second coupling pad; and It includes an electrical connecting member (453;553;653;753;853;953;1053;1153;1253;1353;1453;1553;1753;1853) connected to form an electrical path with the plurality of first coupling pads and connected to the conductive portion, The at least one second coupling pad is connected to form an electrical path with the wireless communication circuit, An electronic device, wherein at least a portion of said at least one second coupling pad is provided between a pair of first coupling pads among said plurality of first coupling pads.

2. In paragraph 1, The above at least one second coupling pad (5512; 7512) is provided as a plurality of second coupling pads, An electronic device, wherein the plurality of first coupling pads (5511; 7511) and the plurality of second coupling pads (5512; 7512) are alternately provided on at least some of the plurality of layers of the circuit board along the first direction.

3. In either of paragraphs 1 and 2, The plurality of first coupling pads (5511; 7511) are adjacent to the plurality of second coupling pads (5512; 7512), and are configured to form individual capacitances for indirect electrical signal transmission between the plurality of first coupling pads and the plurality of second coupling pads. An electronic device configured so that the total sum of individual capacitances formed on the circuit board is 10 pF or more.

4. In any one of paragraphs 1 to 3, An electronic device, wherein the overlapping areas of the plurality of first coupling pads (5511; 7511) and the plurality of second coupling pads (5512; 7512) in the first direction are substantially similar.

5. In any one of paragraphs 1 to 4, The above circuit board, One or more first conductive vias (5551; 7551; 8551; 9551; 10551; 11551; 12551; 13551; 14551; 15551; 17551; 18551; 19551) connected to form an electrical path to the plurality of first coupling pads; and An electronic device further comprising one or more second conductive vias (5512;7552;8552;9552;10552;11552;12552;13552;14552;15552;17552;18552;19552) connected to form an electrical path to the second coupling pad.

6. In any one of paragraphs 1 to 5, The above circuit board (1050) includes a first substrate surface (1050a) and a second substrate surface (1050b) opposite to the first substrate surface, An electronic device, wherein the dielectric (1052) is arranged on the first substrate surface and the second substrate surface so that the plurality of first coupling pads (10511) and at least one second coupling pad (10512) are not exposed to the outside of the circuit board (1050).

7. In any one of paragraphs 1 to 6, The above circuit board (350; 450; 1850) is An electronic device further comprising a switch (1859) connected to at least one of the first conductive vias (18551) and the second conductive vias (18552), the switch being configured to selectively block an electrical path formed by the at least one conductive via.

8. In any one of paragraphs 1 to 7, The above circuit board (550;550D;550E;550F;550G;550H) is A ground (556) spaced apart from the plurality of first coupling pads (5511) and at least one second coupling pad (5512); and An electronic device further comprising a discharge inducing unit (557) for inducing discharge of an electrical signal from the plurality of first coupling pads (5511) to the ground (556).

9. In any one of paragraphs 1 to 8, At least one of the plurality of first coupling pads (5511; 5511D; 5511E; 5511F; 5511G) and the ground (556) are provided on the same layer of the circuit board, The above discharge induction unit (557) is One or more first discharge members (5571) directly connected to the first coupling pad (5511D; 5511F; 5511G) arranged in the same layer as the ground (556) and protruding toward the ground (556), or An electronic device comprising at least one second discharge member (5572) connected to the ground (556) and protruding toward at least one first coupling pad (5511; 5511D; 5511E; 5511F; 5511G) provided on the same layer as the ground (556).

10. In any one of paragraphs 1 to 9, One of the first coupling pads (7511) of the plurality of first coupling pads is adjacent to one of the second coupling pads (7512) in the first direction, The above first coupling pad and the above second coupling pad form a coupling pad set, An electronic device, wherein the spacing (d1) in the first direction between the first coupling pad and the second coupling pad forming the coupling pad set is smaller than the spacing (d2) in the first direction between adjacent coupling pad sets.

11. In any one of paragraphs 1 to 10, At least one of the first coupling pads (12511; 13511) and at least one of the second coupling pads (12512; 13512) among the plurality of first coupling pads are provided on the same layer based on the first direction of the circuit board (1250; 1350), An electronic device, wherein the at least one first coupling pad and the at least one second coupling pad on the same layer are provided crosswise along a second direction of the circuit board that is perpendicular to the first direction.

12. In any one of paragraphs 1 to 11, The above circuit board (1550) is Further comprising a third coupling pad (15513) electrically insulated from the plurality of first coupling pads (15511) and the at least one second coupling pad (15512) through the above dielectric (1552), The third coupling pad (15513) and the at least one second coupling pad (15512) at least partially overlap in the first direction of the circuit board (1550), The above electrical connection member (1553) is A first electrical connecting member (15531) connected to form an electrical path with at least some of the plurality of first coupling pads (15511); and An electronic device comprising a second electrical connecting member (15532) connected to form an electrical path with the third coupling pad (15513).

13. In any one of paragraphs 1 to 12, The above side member (1540) includes a first conductive portion (15411-1) and a second conductive portion (15411-2) electrically separated along an outer side of the electronic device, An electronic device, wherein the first electrical connecting member (15531) and the second electrical connecting member (15532) are connected to the first conductive portion (15411-1) and the second conductive portion (15411-2), respectively.

14. In any one of paragraphs 1 to 13, The above circuit board (1450) is Further comprising a fourth coupling pad (14514) electrically insulated from the plurality of first coupling pads (14511) and the at least one second coupling pad (14512) through the dielectric (1452) and connected to form an electrical path with the wireless communication circuit (1490), An electronic device, wherein at least one of the plurality of first coupling pads (14511) and the fourth coupling pad (14514) at least partially overlap in the first direction of the circuit board (1450).

15. In any one of paragraphs 1 to 14, The above circuit board (1750A; 1750B) is Further comprising a radiating member (1756; 1757) comprising a conductive material or a conductive pattern; An electronic device in which the above-described radiating member (1756; 1757) overlaps the at least one second coupling pad (17512) in the first direction of the circuit board (1750A; 1750B) or is electrically connected to the wireless communication circuit (490).

Images