ELECTRONIC DEVICES

Abstract

The invention relates to an electronic device. The electronic device comprises an enclosure consisting of an outer and inner enclosure which is arranged within the outer enclosure and includes at least one inward protrusion, a circuit board located within the enclosure, at least one photoelectron arranged within the enclosure in position corresponding to at least one protrusion and mounted on the circuit board, and a conductor connecting the circuit board and at least one photoelectron, wherein the inner enclosure includes a first coating arranged to enclose at least one photoelectron, the first coating including the first light transmittance.

Description

wearable electronic devices

[0001] One embodiment disclosed in this document relates to a wearable electronic device.

[0002] Recently, electronic devices have evolved into various forms for user convenience and are becoming smaller and more portable. For example, electronic devices can be provided in the form of a wearable ring. Furthermore, interest in health is increasing, and so is interest in technologies that can monitor health conditions.

[0003] Accordingly, electronic devices may include sensors for measuring the user's bio-information, and are being developed in various forms to measure and utilize various bio-signals of the human body using sensors, and provide various services for managing the user's health or checking the health status through measurement of various bio-signals.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure may include a housing including an outer housing portion and an inner housing portion including at least one protrusion disposed on the inner side of the outer housing portion and protruding inwardly, a circuit board positioned within the housing, an optical element positioned within the housing at a position corresponding to the at least one protrusion and mounted on the circuit board, and a conductor electrically connecting the circuit board and the optical element. The inner housing portion may be arranged to surround the optical element and may include a first coating layer having a first light transmittance.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing including an outer housing portion and an inner housing portion disposed inside the outer housing portion, a circuit board positioned within the housing, an optical element positioned within the housing and mounted on the circuit board, and a conductor electrically connecting the circuit board and the optical element. The inner housing portion may include a first coating layer disposed to surround the optical element and having a first light transmittance, and a second coating layer disposed to surround the first coating layer and having a second light transmittance lower than the first light transmittance.

[0007] An electronic device according to one embodiment of the present disclosure may include a housing including an outer housing portion and an inner housing portion including at least one protrusion disposed on the inner side of the outer housing portion and protruding inwardly, a circuit board positioned within the housing, an optical element positioned within the housing at a position corresponding to the at least one protrusion and mounted on the circuit board, and a conductor electrically connecting the circuit board and the optical element. The inner housing portion may include a first coating layer disposed to surround the optical element and having a first light transmittance, and a second coating layer disposed to surround the first coating layer and having a second light transmittance lower than the first light transmittance.

[0008] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0010] FIG. 2 is a drawing for explaining usage examples of a wearable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a perspective view illustrating a wearable electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is a cross-sectional view of a wearable electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is an exploded perspective view of a wearable electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6A is a cross-sectional side view of a wearable electronic device (200) according to one embodiment of the present disclosure.

[0015] FIG. 6b is an enlarged view of at least one protrusion of a wearable electronic device (200) according to one embodiment of the present disclosure.

[0016] FIG. 7 is a cross-sectional side view of a portion of a wearable electronic device according to one embodiment of the present disclosure.

[0017] FIG. 8 is a cross-sectional side view of an inner housing portion of a wearable electronic device according to one embodiment of the present disclosure.

[0018] FIG. 9 is a diagram illustrating a circuit board according to one embodiment of the present disclosure.

[0019] FIG. 10A and FIG. 10B are drawings illustrating the transmittance for the first coating layer and the second coating layer of the inner housing portion according to one embodiment of the present disclosure.

[0020] FIG. 11 is a cross-sectional side view of an internal housing portion of a wearable electronic device in which both a light-emitting element and a light-receiving element are arranged, according to one embodiment of the present disclosure.

[0021] FIG. 12 is a drawing illustrating the transmittance of the first coating layer and the second coating layer of the inner housing portion according to one embodiment of the present disclosure.

[0022] FIG. 13 is a cross-sectional side view of a portion of a wearable electronic device including an inner housing portion having substantially the same transmittance, according to one embodiment of the present disclosure.

[0023] FIGS. 14A and 14B are drawings illustrating transmittance for an inner housing portion according to embodiments of the present disclosure.

[0024] FIG. 15 is a diagram showing changes in the amount of light in a blood vessel according to the curvature of at least one protrusion and the distance between at least one protrusion and the user's skin, according to one embodiment of the present disclosure.

[0025] FIG. 16 is a cross-sectional side view showing the distribution of the amount of light entering an optical element according to one embodiment of the present disclosure.

[0026] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0027] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0029] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0030] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0031] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0032] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0033] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0034] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0035] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0036] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0037] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0039] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0041] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0042] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0045] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0046] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0047] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a circuit board, an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0048] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0049] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0050] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.

[0051] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0052] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0053] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0054] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0055] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0056] FIG. 2 is a diagram illustrating examples of use of a wearable electronic device according to one embodiment of the present disclosure. The embodiment of FIG. 2 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 3 to 17.

[0057] Referring to FIG. 2, a wearable electronic device (200) (e.g., the electronic device (101) of FIG. 1) may be configured to be worn on a user's body. For example, the wearable electronic device (200) may be implemented as a wearable electronic device that can be worn on a user's finger. For example, the wearable electronic device (200) may be provided in the form of a ring that can be worn on a user's wrist. The wearable electronic device (200) may be defined and / or referred to as a smart ring.

[0058] According to one embodiment, the wearable electronic device (200) can perform wireless communication with another electronic device (e.g., the electronic device (102, 104) of FIG. 1) via a wireless communication network (e.g., the first network (198) or the second network (199) of FIG. 1). For example, the wearable electronic device (200) can perform wireless communication with another electronic device, such as a smart phone (S1), a desktop / laptop computer (S2, S3), a car (S4), a smart TV (S5), indoor smart home devices (S6), a tablet PC (S7), or a smart watch (S8). The wireless communication between the wearable electronic device (200) and the other electronic device can be implemented as wireless communication via a short-range communication network (e.g., the first network (198) of FIG. 1) or a long-range communication network (e.g., the second network (199) of FIG. 1). For example, when a Bluetooth communication link is established between the wearable electronic device (200) and an electronic device that the user wishes to connect, message transmission may be possible between the two electronic devices, and the wearable electronic device (200) worn by the user may generate commands corresponding to specific movements / gestures of the user's fingers and transmit the commands to another electronic device. In order to detect the user's finger movements / gestures, etc., motion sensors such as an accelerometer, a gyroscope, or an electronic compass (e.g., the sensor module (176) of FIG. 1) may be arranged in the wearable electronic device (200). When a message is received from another electronic device to the wearable electronic device (200), the electronic device (200) may notify the user of the receipt of the message using sound, vibration, a display screen, or lighting (e.g., a light-emitting diode or a xenon lamp).To this end, the wearable electronic device (200) may include an acoustic module (e.g., an acoustic output module (155) or an audio module (170) of FIG. 1), a haptic module (e.g., a haptic module (179) of FIG. 1), or a display module (e.g., a display module (160) of FIG. 1). According to one embodiment, at least one of the acoustic module, the haptic module, or the display module may be omitted from the electronic device, or one or more other components may be output. In addition, the wearable electronic device (200) may obtain biometric information of the user (e.g., oxygen saturation) and provide the biometric information to another electronic device.

[0059] FIG. 3 is a perspective view illustrating a wearable electronic device according to an embodiment of the present disclosure. FIG. 4 is a cross-sectional view of a wearable electronic device according to an embodiment of the present disclosure. FIG. 5 is an exploded perspective view of a wearable electronic device according to an embodiment of the present disclosure.

[0060] The embodiments of FIGS. 3 to 5 may be combined with the embodiments of FIGS. 1 to 2, or the embodiments of FIGS. 6 to 17. The configuration of the wearable electronic device (200) of FIGS. 3 to 5 may be partially or entirely identical to the configuration of the electronic device (101) of FIG. 1, or the configuration of the wearable electronic device (200) of FIG. 2.

[0061] Referring to FIGS. 3 to 5, a wearable electronic device (200) may include a housing (210). The housing (210) may form the overall appearance of the wearable electronic device (200).

[0062] According to one embodiment, the housing (210) may be in a ring shape (e.g., a ring shape). For example, the housing (210) may include an opening configured to receive a user's finger. For example, the housing (210) may include an opening configured to receive a user's wrist. For example, the opening may be defined as a hole implemented by the housing (210). However, the wearable electronic device (200) is not limited to the ring-shaped embodiment, and may be designed in various shapes (e.g., a box shape) that can be worn and / or fixed on a user's body (e.g., a finger, a wrist).

[0063] In one embodiment, the housing (210) may include an outer housing portion (211) or an inner housing portion (212). The inner housing portion (212) may be coupled to the outer housing portion (211). For example, the inner housing portion (212) may be coupled to the outer housing portion (211) on the inside of the outer housing portion (211). In one embodiment, the outer housing portion (211) and the inner housing portion (212) may be manufactured separately and assembled, or may be formed integrally. In one embodiment, the outer housing portion may be manufactured from a metal material, and the inner housing portion may be formed by applying a liquid material to the inside of the outer housing portion and curing the liquid material. In one embodiment, a portion of the inner housing portion may be implemented by combining a part made from a metal material or a synthetic resin, and a part formed by applying / curing a liquid material.

[0064] According to one embodiment, the outer housing portion (211) may include a material capable of withstanding external impacts and / or scratches and implementing design features. For example, the outer housing portion (211) may include at least one of titanium, stainless steel, or ceramic. The outer housing portion (211) may be color-treated or coated to implement the design.

[0065] According to one embodiment, the inner housing portion (212) may be a portion that comes into contact with a user's finger when the user wears the wearable electronic device (200). The inner housing portion (212) may be made of a material such as a molding material for sensing, transparent plastic, or glass. For example, the inner housing portion (212) may be configured to be at least partially transparent. For example, the inner housing portion (212) may include a material that is transparent to light for measuring biometric information. At least a portion of the inner housing portion (212) may be made of a material that is substantially the same as or similar to that of the outer housing portion (211). In addition, at least a portion of the inner housing portion (212) may include a metal material for measuring biometric information.

[0066] According to one embodiment, the outer housing portion (211) and the inner housing portion (212) may be combined to provide an internal space of the housing (210). Here, the “internal space of the housing (210)” may be understood as a space separate from an opening for accommodating a part of the user’s body. For example, various electrical / electronic components of the wearable electronic device (200) may be arranged and / or mounted in the internal space of the housing (210). For example, the housing (210) may accommodate various electrical / electronic components.

[0067] According to one embodiment, a wearable electronic device (200) may include a circuit board (220), a battery (230), and at least one optical module (240) disposed within a housing (210).

[0068] According to one embodiment, a circuit board (220) may be placed in the interior space of the housing (210). The circuit board (220) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

[0069] According to one embodiment, various electrical / electronic components may be arranged and / or mounted on the circuit board (220). For example, the circuit board (220) may be equipped with a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), a communication module (e.g., a communication module (190) of FIG. 1), or a sensor module (e.g., a sensor module (197) of FIG. 1, or at least one optical module (240) of FIG. 4).

[0070] According to one embodiment, the circuit board (220) may include a plurality of circuit boards. For example, the plurality of circuit boards may be arranged according to the shape of the internal space of the housing (210) and may be electrically connected to each other. The circuit board (220) may include a flexible printed circuit board (FPCB). For example, the flexible printed circuit board may be at least partially bendable according to the shape of the internal space of the housing (210). For example, the circuit board (220) may be a rigid circuit board and a flexible circuit board that are alternately arranged based on the circumferential direction (or the periphery direction) of the housing (210).

[0071] According to one embodiment, the battery (230) is a device for supplying power to components of the wearable electronic device (200), and may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (230) may be integrally disposed within the wearable electronic device (200), or may be detachably disposed with the wearable electronic device (200). According to one embodiment, the battery (230) may be formed as a single integral battery or may include multiple detachable batteries. The battery (230) may include a battery pack that is flexible according to the shape of the internal space of the housing (210). The battery (230) may include a plurality of non-flexible battery packs of the housing (210). The battery (230) may include a flexible battery pack and a plurality of non-flexible battery packs.

[0072] According to one embodiment, the circuit board (220) may be disposed in the second region (202) of the housing (210) (e.g., the lower region of the housing in the state illustrated in FIG. 4). According to one embodiment, the battery (230) may be disposed in the first region (201) (e.g., the upper region of the housing in the state illustrated in FIG. 4) of the housing (210) rather than in the second region (202). For example, the housing (210) may be divided into a first region (201) above an imaginary reference line passing through the center (O) and a second region (202) below the reference line, and the battery (230) may be disposed in the first region (201) and the circuit board (220) may be disposed in the second region (202). The first region (201) and the second region (202) may have substantially the same size and shape. The first region and the second region may be substantially symmetrical with respect to the center (O) of the housing (210). However, the embodiment(s) of the present disclosure are not limited thereto, and the region where the circuit board (220) is arranged and the region where the battery (230) is arranged may be defined differently from those illustrated in the drawing depending on the size or number of the battery(s) and the circuit board(s).

[0073] According to one embodiment, a wearable electronic device (200) may include a power management module (e.g., power management module (188) of FIG. 1) disposed on a circuit board (220).

[0074] According to one embodiment, the optical module (240) of the wearable electronic device (200) may be disposed within the housing (210) and electrically connected to the circuit board (220). According to one embodiment, the optical module (240) of the wearable electronic device (200) may include at least one light emitting module (241) and at least one light receiving module (242). According to one embodiment, the optical module (240) of the wearable electronic device (200) may be used as a sensor for obtaining (or measuring) at least one biometric information. For example, the at least one biometric information may include at least one of user's oxygen saturation information or user's heart rate information. For example, the sensor may include a PPG (photo plethysmography) sensor for measuring oxygen saturation or heart rate.

[0075] According to one embodiment, the PPG sensor may include a light source (e.g., at least one light emitting module (241)) configured to emit light in two wavelength bands (e.g., a RED wavelength band or an infrared wavelength band). The PPG sensor may include a light receiving unit (e.g., at least one light receiving module (242)) configured to detect light reflected from, or at least a portion of light transmitted by, a body part of a user (e.g., a finger, skin or blood vessel of a finger).

[0076] According to one embodiment, at least one light emitting module (241) may emit light of substantially the same or different wavelengths to irradiate light to a body part of the user (e.g., a finger, skin of the finger, and / or blood vessels) for measuring the oxygen saturation of the user. For example, at least one light emitting module (241) may emit light of various bands and may include at least one of a light emitting diode (LED), a laser diode, or a vertical cavity surface emitting laser (VCSEL). At least one light emitting module (241) may be arranged and / or mounted on the circuit board (220). At least one light emitting module (241) may be configured to sequentially (or repeatedly) emit light of different wavelength bands by dividing time.

[0077] According to one embodiment, at least one light receiving module (242) can accumulate photoelectric charge corresponding to the amount of light incident on a user's body part by being reflected and / or transmitted, and convert a biosignal in the form of an analog current according to the accumulated photoelectric charge into a digital signal. For example, light (or optical signal) acquired (or detected) through at least one light receiving module (242) can be converted through an analog to digital converter (ADC) and stored in a memory or a sensor buffer. At least one light receiving module (242) can include at least one of a photodiode (PD), a photo transistor, a charge-coupled device (CCD), or a complementary metal oxide semiconductor (CMOS). At least one light receiving module (242) can include, but is not limited to, various elements capable of converting an incident optical signal into an electrical signal.

[0078] According to one embodiment, at least one light receiving module (242) may be configured to receive at least a portion of light transmitted through a body part of the user or reflected by at least a portion of the body part of the user. The at least one light receiving module (242) may receive light transmitted through the body part of the user, convert the transmitted light into an electrical signal, and transmit the electrical signal to a processor (e.g., processor (120) of FIG. 1). According to one embodiment, the light receiving module (242) may be configured to receive light reflected by at least a portion of the body part of the user. The light receiving module (242) may receive light reflected by the body part of the user, convert the reflected light into an electrical signal, and transmit the electrical signal to a processor (e.g., processor (120) of FIG. 1).

[0079] According to one embodiment, light emitted from at least one light-emitting module (241) can reach at least one light-receiving module (242) through an optical path. For example, the optical path can be a path that transmits to a body part of the user (e.g., a finger, the skin of the finger, or a blood vessel of the finger) or a path that reflects to a body part of the user. For example, at least a portion of the light emitted from the light-emitting module can transmit to the body of the user or be reflected by the body of the user and then reach the light-receiving module. The light-receiving module receives the light that transmits to the body of the user or is reflected by the body of the user and converts it into an electrical signal, and the converted electrical signal can be used as data for determining user biometric information (e.g., oxygen saturation information or heart rate information of the user).

[0080] According to one embodiment, the wearable electronic device (200) may include at least one blocking member (270). The at least one blocking member (270) may include a material that absorbs or blocks at least a portion of light emitted from the at least one light-emitting module (241). The at least one blocking member (270) may be configured to block light emitted from the at least one light-emitting module (241) from propagating within the internal space of the housing (210). For example, the at least one blocking member (270) may be disposed adjacent to the light-receiving module (242) within the internal space of the housing (210). For example, the at least one blocking member (270) may be positioned between the light-receiving module (242) and the light-emitting module (241) within the internal space of the housing (210).

[0081] FIG. 6A is a cross-sectional side view of a wearable electronic device (200) according to one embodiment of the present disclosure. FIG. 6B is an enlarged view of at least one protrusion (C) of the wearable electronic device (200) of FIG. 6A according to one embodiment of the present disclosure.

[0082] Referring to FIGS. 6A and 6B , a wearable electronic device (200) may include a housing (210) including an outer housing portion (211) and an inner housing portion (212), and at least one protrusion (213) disposed on the inner housing portion (212). The at least one protrusion (213) may be understood as a portion of a portion that directly contacts a user's body when the user wears the wearable electronic device. When a plurality of protrusions (213) are provided, some of the protrusions may directly contact the user's body, and other protrusions may not directly contact the user's body. The configuration of the wearable electronic device (200) of FIG. 6 may be all or part of the same as the configuration of the wearable electronic device (200) of FIGS. 3 to 5 . The embodiment of FIG. 6 may be partially combined with the embodiments of FIGS. 3 to 5 .

[0083] According to one embodiment, at least one protrusion (213) can compress the blood vessel of the finger to secure the blood vessel well when emitting or receiving light to or from the blood vessel of the finger (e.g., when the light-emitting module emits light). According to one embodiment, at least one protrusion (213) can be arranged on the inner housing portion (212). According to one embodiment, at least one protrusion (213) can form at least a portion of the inner housing portion (212). For example, as shown in FIG. 6A, at least one protrusion (213) can be arranged to protrude from the inner housing portion (212) toward the center (O) of the wearable electronic device (200). According to one embodiment, at least one protrusion (213) can be formed to protrude inwardly from another area (e.g., an area where no protrusion is arranged) on the surface of the inner housing portion (212).

[0084] According to one embodiment, at least one protrusion (213) may be formed integrally with the inner housing portion (212). For example, at least one protrusion (213) may be a partial shape of the inner housing portion (212). The at least one protrusion (213) may be made of a material such as a molding material for sensing, transparent plastic, or glass. For example, the at least one protrusion (213) may be configured to be at least partially transparent. For example, the at least one protrusion (213) may include a material that is transparent to light for measuring biometric information. For example, the transparent material may be a material that is transparent to at least a portion of light emitted from at least one light-emitting module (241) for measuring biometric information or to at least a portion of light reflected from a body part of the user for obtaining the biometric information. At least a portion of one of the protrusions (213) may be made of a material substantially identical or similar to that of the inner housing portion (212) and / or the outer housing portion (211).

[0085] According to one embodiment, a portion of at least one protrusion (213) may include a metal material for measuring biometric information. For example, a sensor for acquiring biometric information may be implemented in a structure that directly applies an electric signal to the user's body or directly detects an electric signal from the user's body, other than the optical module (240) described above. In a sensor that directly applies or detects an electric signal to the user's body, the protrusion that comes into contact with the user's body may function as an electrode terminal or electrode pad.

[0086] According to one embodiment, a plurality of protrusions (213) may be arranged along one surface (e.g., an inner circumferential surface) of the inner housing portion (212). For example, when a plurality of protrusions (213) are provided, the protrusions (213) may be arranged along a circumferential direction (e.g., a radial direction) of the inner housing portion (212). For example, the plurality of protrusions (213) may be arranged in a first direction (e.g., a counterclockwise direction) and / or a second direction opposite to the first direction (e.g., a clockwise direction).

[0087] According to one embodiment, at least one protrusion (213) may be formed so that its length from one surface of the portion (212) of the inner housing increases as it moves toward the center portion (2130) rather than toward the edge portion. As described below, the phrase “the length of the protrusion from one surface of the portion (212) of the inner housing increases as it moves toward the center portion (2130)” may be understood as meaning that the center portion (2130) on the surface of the protrusion (213) is arranged closest to the center (O) of the wearable electronic device (200). According to one embodiment, the center portion (2130) of the at least one protrusion (213) may be defined as the portion having the longest distance from one surface of the inner housing portion (212). According to one embodiment, the at least one protrusion (213) may be formed so as to protrude toward the center (O) of the wearable electronic device (200). According to one embodiment, a distance from a central portion (2130) of at least one protrusion (213) to the center (O) of the wearable electronic device (200) may be shorter than a distance from an edge portion of at least one protrusion (213) to the center (O) of the wearable electronic device (200). For example, a vertical distance from one surface of the inner housing portion (212) to the central portion (2130) of at least one protrusion (213) may be a first distance (h1). According to one embodiment, a vertical distance from one surface of the inner housing portion (212) to an edge portion of at least one protrusion (213) may be a second distance (h2). For example, the second distance (h2) may be 0 or greater than 0. For example, the second distance (h2) may be formed to be shorter than the first length (h1). In one embodiment, the central portion (2130) of at least one protrusion (213) may have a relatively large area in contact with the user's finger. In one embodiment, the edge portion of at least one protrusion (213) may have a relatively narrow area in contact with the user's finger or may not make contact at all.For example, a central portion (2130) of at least one protrusion (213) may substantially contact the user's body.

[0088] According to one embodiment, the shape of at least one protrusion (213) may vary. For example, at least one protrusion (213) may be disposed on the inner housing portion (212) and may have a curved surface on one surface facing the center (O) of the wearable electronic device (200). For example, at least a portion of a central portion (2130) of at least one protrusion (213) may be disposed substantially perpendicular to a reference line (A) passing through the center (O) of the wearable electronic device (200). "At least a portion of the central portion (2130) is disposed perpendicular to the reference line (A) passing through the center (O) of the wearable electronic device (200)" may refer to a case where a surface of the central portion (2130) or a tangent at the central portion (2130) is aligned perpendicular to a straight line passing through the center (O) and the center (O). However, the shape of at least one protrusion (213) is not limited to the above embodiment, and at least a part of it may form a plane, and the design may be changed in various ways.

[0089] According to one embodiment, at least one protrusion (213) may be positioned to correspond to a position where an optical module (240) (e.g., a light-emitting module (241), a light-receiving module (242)) is positioned. The structure and arrangement relationship of the optical module (240) and the at least one protrusion (213) will be described below.

[0090] FIG. 7 is a side cross-sectional view of a portion of a wearable electronic device according to an embodiment of the present disclosure. FIG. 8 is a side cross-sectional view of an inner housing portion of a wearable electronic device according to an embodiment of the present disclosure. FIG. 9 is a diagram illustrating a circuit board (220) according to an embodiment of the present disclosure. FIGS. 10A and 10B are diagrams illustrating transmittances of a first coating layer (212a) and a second coating layer (212b) of an inner housing portion (212) according to an embodiment of the present disclosure.

[0091] Referring to FIGS. 7 to 9, the wearable electronic device (200) may include a housing (210) including an outer housing portion (211) and an inner housing portion (212), and at least one protrusion (213), a circuit board (220), and an optical element (240) disposed on the inner housing portion (212). The configuration of the wearable electronic device (200) of FIGS. 7 to 9 may be all or part of the same as the configuration of the wearable electronic device (200) of FIG. 6. The embodiments of FIGS. 7 to 9 may be partially combined with the embodiment of FIG. 6.

[0092] According to one embodiment, the circuit board (220) may include at least one of a flexible printed circuit board (FPCB) or a rigid-flexible PCB (RF-PCB). According to one embodiment, various electrical / electronic components may be arranged and / or mounted on the circuit board (220). For example, an optical element (240) may be arranged on one surface facing upward of the circuit board (220). For example, various components (221) (e.g., a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), a communication module (e.g., a communication module (190) of FIG. 1), or a sensor module (e.g., a sensor module (197) of FIG. 1)) may be arranged on one surface facing downward of the circuit board (220).

[0093] According to one embodiment, the optical element (240) may be disposed on the circuit board (220). For example, the optical element (240) may include a light emitting element (241) (e.g., a light emitting diode; LED) configured to emit light through the inner housing portion (212) and a light receiving element (242) (e.g., a photodiode; PD) configured to receive light transmitted or reflected by a user's finger. The optical element (240), the light emitting element (241), and the light receiving element (242) may be substantially the same as, or may be a single component of, the optical module (240), the light emitting module (241), and the light receiving module (242) of FIG. 4.

[0094] In one embodiment, the optical element (240) may be electrically connected to the circuit board (220). In one embodiment, the optical element (240) (e.g., a photodiode) may be directly mounted on the circuit board (220) and electrically connected to the circuit board (220) via a conductor (301). The conductor (301) may include, for example, a bonding wire. For example, the optical element (240) may be unpackaged with the substrate and other components (e.g., a semiconductor die).

[0095] According to one embodiment, when the unpackaged optical element (240) is directly mounted on the circuit board (220), the size of the optical element (240) may be formed relatively larger than that of the packaged element. The packaged element may be relatively smaller in size in consideration of connection with other packaged components, but the unpackaged optical element (240) may use a wider area for the optical element (240) without a connection portion with other components. In this case, the amount of incident light increases, and a large biosignal can be received. For example, the width direction (X-axis direction) or length direction (Y-axis direction) of the optical element (240) may be approximately 2.0 mm. For example, the height direction (Z-axis direction) of the optical element (240) may be approximately 2.5 mm or less. For example, the area of ​​the optical element (240) may be approximately 4.0 mm. 2 It could be.

[0096] According to one embodiment, compared to a packaged device, by directly mounting an unpackaged optical element (240) on a circuit board (220), an increase in the size of the circuit board (220) or the wearable electronic device can be suppressed. In one embodiment, when placed in the same mounting space, the unpackaged optical element (240) can provide a wider light-emitting area or light-receiving area than a packaged structure. For example, a packaged device may have difficulty in securing a light-emitting area or light-receiving area in the same mounting space because an additional structure is required for connection with other components. According to the embodiment(s) of the present disclosure, the optical element (240) is directly mounted on the circuit board (220) in an unpackaged state, thereby simplifying the structure for connection with other components, thereby securing a wider light-emitting area or light-receiving area.

[0097] According to one embodiment, the optical element (240) may include an active area (240a) and an inactive area (240b) extending from the active area (240a). According to one embodiment, when the unpackaged optical element (240) is directly mounted on the circuit board (220), the active area (240a) of the optical element (240) may be larger than that of the element in a packaged state. For example, when the width and length of the unpackaged optical element (240) are approximately 2 mm, the width direction (X-axis direction) or length direction (Y-axis direction) of the active area (240a) may be approximately 1.88 mm. For example, the area of ​​the active area (240a) is approximately 3.53 mm. 2 It could be.

[0098] According to one embodiment, when the unpackaged optical element (240) is directly mounted on the circuit board (220), the exclusive area ratio of the optical element (240) (e.g., the area of ​​the active region (240a) relative to the surface area of ​​the optical element) may be greater than that of the element in a packaged state. For example, the exclusive area ratio may be approximately 80% or more and 90% or less. For example, the exclusive area ratio may be approximately 88%. In a wearable electronic device (200) of a limited size, the amount of light may be improved, thereby improving the accuracy of biometric measurements. In addition, if the accuracy of biometric measurements is the same, miniaturization in the mounting of the optical element (240) may be facilitated, which may be useful for miniaturizing the wearable electronic device (200), and the degree of design freedom may be improved within the electronic device.

[0099] In one embodiment, the optical element (240) may be electrically connected to the circuit board (220) through a conductor (301). The conductor (301) may be, for example, any one of a wire, an electrical wire, or an FPCB. In one embodiment, the optical element (240) may be in contact with the conductor (301) by a first adhesive member (302). For example, the first adhesive member (302) may be a silver paste (Ag paste) that can be cured even at a low temperature (about 100 degrees Celsius). The circuit board (220) may be in contact with the conductor (301) by a second adhesive member (303). For example, the first adhesive member (302) may be a silver paste (Ag paste) that can be cured even at a low temperature (about 100 degrees Celsius). For example, the length of the conductor (301) may be approximately 0.01 mm or more and 0.03 mm or less. For example, the length of the conductor (301) may be approximately 0.017 mm. For example, the length of the conductor (301) may be approximately 0.5 mil or more and 1 mil or less. For example, the length of the conductor (301) may be approximately 0.7 mil. For example, the length of the first adhesive member (302) in the width direction (X-axis direction) or the length direction (Y-axis direction) may be approximately 0.1 mil or more and 0.2 mil or less (e.g., approximately 0.002 mm or more and 0.006 mm or less). For example, the length of the first adhesive member (302) in the width direction (X-axis direction) or the length direction (Y-axis direction) may be approximately 0.15 mil (e.g., approximately 0.003 mm or more and 0.004 mm or less). For example, the width direction (X-axis direction) or length direction (Y-axis direction) length of the second adhesive member (303) may be 0.1 mil or more and 0.3 mil or less (e.g., approximately 0.002 mm or more and 0.008 mm or less). For example, the width direction (X-axis direction) or length direction (Y-axis direction) length of the second adhesive member (303) may be 0.2 mil (e.g., approximately 0.005 mm or more and 0.006 mm or less).For example, the width direction (X-axis direction) or length direction (Y-axis direction) of the second adhesive member (303) may be 0.15 mil (e.g., approximately 0.003 mm or more and 0.004 mm or less). For example, the second adhesive member (303) may be disposed at a distance from the optical element (240) of approximately 0.2 mil or more and 0.5 mil or less (e.g., approximately 0.005 mm or more and 0.02 mm or less). For example, the second adhesive member (303) may be disposed at a distance from the optical element (240) of approximately 0.3 mil (e.g., approximately 0.007 mm or more and 0.008 mm or less).

[0100] According to one embodiment, the inner housing portion (212) may be a structure in which a solution such as epoxy is cured to enclose components placed therein. For example, the inner housing portion (212) may have substantially no empty space or air gap therein. For example, after a process of assembling and / or joining various components (e.g., a printed circuit board, a battery, an optical element) within the outer housing portion (211) is performed, a process of injecting a molding solution while the outer housing portion is inserted into a molding jig, and a curing process and / or a processing process may be performed to form the inner housing portion (212).

[0101] According to one embodiment, the inner housing portion (212) may include a first coating layer (212a) and a second coating layer (212b) having different light transmittances. The first coating layer (212a) is arranged to surround the optical element (240) and may have a light transmittance of the first transmittance. The second coating layer (212b) is arranged to surround the first coating layer (212a) and may have a light transmittance of the second transmittance that is lower than the first transmittance. Here, the “(light) transmittance” may be defined as a transmittance for light emitted from the light emitting element (241) or light to be detected through the light receiving element (242).

[0102] According to one embodiment, the first coating layer (212a) and the second coating layer (212b) may be formed of substantially the same solution, but there may be a difference in the mixing concentration. For example, the first coating layer (212a) and the second coating layer (212b) may be formed of a solution such as epoxy. According to one embodiment, since the first coating layer (212a) and the second coating layer (212b) are formed of the same solution, the permittivity may be similar or substantially the same. Since the permittivity of the first coating layer (212a) and the second coating layer (212b) is substantially similar, the reflectivity for light passing through the boundary between the first coating layer (212a) and the second coating layer (212b) may be low. For example, a reflected wave may not occur at the boundary between the first coating layer (212a) and the second coating layer (212b). In one embodiment, the first coating layer (212a) positioned relatively inward may have a lower strength than the second coating layer (212b) positioned relatively outward. For example, the strength of the second coating layer (212b) forming the surface of the wearable electronic device may be relatively higher than the strength of the first coating layer (212a).

[0103] In one embodiment, the first coating layer (212a) may have higher transmittance than the second coating layer (212b). In one embodiment, when comparing the first coating layer (212a) and the second coating layer (212b), the transmittance of the first coating layer (212a) having relatively low strength may be relatively high, and the transmittance of the second coating layer (212b) having relatively high strength may be relatively low. For example, the first transmittance of the first coating layer (212a) may be approximately 90%, and the second transmittance of the second coating layer (212b) may be approximately 80%. For example, the first transmittance of the first coating layer (212a) may be approximately 95%, and the second transmittance of the second coating layer (212b) may be approximately 90%.

[0104] According to one embodiment, referring to FIG. 10A, when the height of the first coating layer (212a) is a first length (d1) and the height of the second coating layer (212b) is a second length (d2), for example, when the first transmittance of the first coating layer (212a) is approximately 90% and the second transmittance of the second coating layer (212b) is approximately 80%, light emitted from the light emitting element (241) can transmit 90% of the first length (d1) through the first coating layer (212a) and 80% of the second length (d2) through the second coating layer (212b). For example, when the first length (d1) and the second length (d2) are substantially similar, the average transmittance can be 85%. For example, referring to FIG. 10b, when the first transmittance of the first coating layer (212a) is approximately 95% and the second transmittance of the second coating layer (212b) is approximately 90%, light received by the light receiving element (242) can be transmitted 90% of the second length (d2) through the second coating layer (212b) and 95% of the first length (d1) through the first coating layer (212a). For example, when the first length and the second length are substantially similar, the average transmittance can be 92.5%.

[0105] According to one embodiment, the first coating layer (212a) and the second coating layer (212b) having different transmittances and strengths can be laminated to improve both transmittance and strength.

[0106] FIG. 11 is a cross-sectional side view of an inner housing portion of a wearable electronic device in which both a light-emitting element (241) and a light-receiving element (242) are arranged, according to one embodiment of the present disclosure. FIG. 12 is a diagram illustrating the transmittance of a first coating layer (212a) and a second coating layer (212b) of an inner housing portion (212), according to one embodiment of the present disclosure.

[0107] Referring to FIGS. 11 and 12 , a wearable electronic device (200) may include a housing (210) including an outer housing portion (211) and an inner housing portion (212), and at least one protrusion (213), a circuit board (220), and an optical element (240) disposed on the inner housing portion (212). The configuration of the wearable electronic device (200) of FIGS. 11 and 12 may be all or part of the same as the configuration of the wearable electronic device (200) of FIGS. 7 to 9 . The embodiment of FIGS. 11 and 12 may be partially combined with the embodiment of FIGS. 7 to 9 .

[0108] According to one embodiment, the optical element (240) may be disposed on the circuit board (220). For example, the optical element (240) may include a light-emitting element (241) (e.g., a light emitting diode; LED) configured to emit light through the inner housing portion (212) and a light-receiving element (242) (e.g., a photodiode; PD) configured to receive light transmitted or reflected by a user's finger. The optical element (240), the light-emitting element (241), and the light-receiving element (242) may be substantially the same as, or may be a single component of, the optical module (240), the light-emitting module (241), and the light-receiving module (242) of FIG. 4.

[0109] In one embodiment, the optical element (240) may be electrically connected to the circuit board (220). In one embodiment, the optical element (240) (e.g., a photodiode) may be directly mounted on the circuit board (220) and electrically connected to the circuit board (220) via a conductor (301). The conductor (301) may include, for example, a bonding wire. For example, the optical element (240) may be unpackaged with the substrate and other components (e.g., a semiconductor die).

[0110] According to one embodiment, the light emitting element (241) and the light receiving element (242) may be disposed adjacent to each other on the circuit board (220). The light emitting element (241) and the light receiving element (242) may be disposed side by side on the circuit board (220). According to one embodiment, referring to FIG. 11, the light receiving element (242) may be disposed to substantially correspond to the center portion (2130) of at least one protrusion (213), and the light emitting element (241) may be disposed to correspond to the edge portion of at least one protrusion (213). However, the arrangement of the light emitting element (241) and the light receiving element (242) is not limited by the above embodiment, and may be variously designed and changed. For example, the light-emitting element (241) may be arranged to correspond to the central portion (2130) of at least one protrusion (213), and the light-receiving element (242) may be arranged to correspond to the edge portion of at least one protrusion (213). At this time, the light-emitting element (241) that may be arranged adjacent to the light-receiving element (242) may be, for example, any one of a green LED chip, a red LED chip, a blue LED chip, and an infrared LED chip. The light-emitting element (241) that may be arranged adjacent to the light-receiving element (242) may be, for example, a green LED chip.

[0111] According to one embodiment, the inner housing portion (212) may be a structure in which a solution such as epoxy is cured to enclose components placed therein. For example, the inner housing portion (212) may have substantially no empty space or air gap therein. For example, after a process of assembling and / or joining various components (e.g., a printed circuit board, a battery, an optical element) within the outer housing portion (211) is performed, a process of injecting a molding solution while the outer housing portion is inserted into a molding jig, and a curing process and / or a processing process may be performed to form the inner housing portion (212).

[0112] According to one embodiment, the first coating layer (212a) is arranged to surround both the light-emitting element (241) and the light-receiving element (242), and may have a light transmittance of the first transmittance. The second coating layer (212b) is arranged to surround the first coating layer (212a), and may have a light transmittance of the second transmittance that is lower than the first transmittance.

[0113] According to one embodiment, when referring to FIG. 12, when the light emitting element (241) and the light receiving element (242) are adjacently arranged, two-way transmission may be possible. When the height of the first coating layer (212a) is a first length (d1) and the height of the second coating layer (212b) is a second length (d2), for example, when the first transmittance of the first coating layer (212a) is approximately 90% and the second transmittance of the second coating layer (212b) is approximately 80%, light emitted from the light emitting element (241) may transmit 90% of the first length (d1) in the first coating layer (212a) and 80% of the second length (d2) in the second coating layer (212b). At the same time, light received by the light receiving element (242) can be transmitted 80% through the second coating layer (212b) along the second length (d2) and 90% through the first coating layer (212a) along the first length (d1). For example, when the first length (d1) and the second length (d2) are substantially similar, the average transmittance can be 85%. According to one embodiment, the first coating layer (212a) and the second coating layer (212b) having different transmittances and intensities can be stacked to improve both the transmittance and the intensity.

[0114] FIG. 13 is a cross-sectional side view of a portion of a wearable electronic device including an inner housing portion (212) having substantially the same transmittance, according to one embodiment of the present disclosure. FIGS. 14A and 14B are diagrams illustrating the transmittance for the inner housing portion (212), according to one embodiment of the present disclosure.

[0115] Referring to FIGS. 13 to 14B, a wearable electronic device (200) may include a housing (210) including an outer housing portion (211) and an inner housing portion (212), and at least one protrusion (213), a circuit board (220), and an optical element (240) disposed on the inner housing portion (212). The configuration of the wearable electronic device (200) of FIGS. 13 to 14B may be all or part of the same as the configuration of the wearable electronic device (200) of FIGS. 11 to 12. The embodiment of FIGS. 13 to 14B may be partially combined with the embodiment of FIGS. 11 to 12.

[0116] According to one embodiment, the optical element (240) may be disposed on the circuit board (220). For example, the optical element (240) may include a light-emitting element (241) (e.g., a light emitting diode; LED) configured to emit light through the inner housing portion (212) and a light-receiving element (242) (e.g., a photodiode; PD) configured to receive light transmitted or reflected by a user's finger. The optical element (240), the light-emitting element (241), and the light-receiving element (242) may be substantially the same as, or may be a single component of, the optical module (240), the light-emitting module (241), and the light-receiving module (242) of FIG. 4.

[0117] In one embodiment, the inner housing portion (212) may be composed of a single layer. For example, the inner housing portion (212) may be composed of a first coating layer having a first transmittance (e.g., 212a of FIG. 11). The inner housing portion (212) is arranged to surround the optical element (240), and the light transmittance may be the first transmittance. For example, the inner housing portion (212) may be composed of a solution such as epoxy.

[0118] FIG. 15 is a diagram illustrating changes in the amount of light in a blood vessel according to the curvature of at least one protrusion and the distance between at least one protrusion and the user's skin, according to one embodiment of the present disclosure. FIG. 16 is a cross-sectional side view illustrating the distribution of the amount of light entering an optical element (240), according to one embodiment of the present disclosure.

[0119] Referring to FIGS. 15 and 16 , a wearable electronic device (200) may include a housing (210) including an outer housing portion (211) and an inner housing portion (212), and at least one protrusion (213), a circuit board (220), and an optical element (240) disposed on the inner housing portion (212). The configuration of the wearable electronic device (200) of FIGS. 15 and 16 may be all or part of the same as the configuration of the wearable electronic device (200) of FIGS. 6 to 14 . The embodiments of FIGS. 15 and 16 may be partially combined with the embodiments of FIGS. 6 to 14 .

[0120] According to one embodiment, the central portion (2400 of FIG. 8), the central portion (2130 of FIG. 8) of the optical element (240), and the center (O) of the wearable electronic device (200) may be arranged substantially in a straight line to maximize the amount of light irradiated to the blood vessel portion or the amount of light reflected by the blood vessel portion (or transmitted through the blood vessel portion) and then received by the light receiving element (242). According to one embodiment, the curvature of the at least one protrusion (213) may increase from the edge portion of the at least one protrusion (213) toward the center portion (2130). Referring to FIG. 16, the larger the curvature of the at least one protrusion (213), the greater the amount of incident light. The amount of incident light may increase from the edge portion of the at least one protrusion (213) toward the center portion (2130 of FIG. 6A). That is, when the central portion (2400) of the optical element (240), the central portion (2130) of at least one protrusion (213), and the center (O) of the wearable electronic device (200) are arranged in a straight line, the amount of incident light can increase, and an optical path is formed in the central portion (2130) of at least one protrusion (213) where no air gap is created with the user's skin, so that light acquisition of the blood vessel can be advantageous. When the amount of light emitted from the light-emitting element (241) is the same, the more the amount of light is irradiated to a narrower area on the user's body, and / or the greater the amount of light received by the light-receiving element (242) after transmitting through or reflecting by the user's body, the higher the accuracy of acquisition or determination of biometric information.

[0121] According to one embodiment, referring to FIG. 15, it is possible to know the change in the amount of light in a blood vessel according to the distance (d) between at least one protrusion (213) and the user's skin and the curvature (R) of at least one protrusion (213). According to one embodiment, (C) of FIG. 15 is a case where the distance (d) between at least one protrusion (213) and the user's skin is 0.1T, and the protrusion surface of at least one protrusion (213) is a plane. (B) of FIG. 15 is a case where the distance (d) between at least one protrusion (213) and the user's skin is 0, and the protrusion surface of at least one protrusion (213) is a plane. (A) of FIG. 15 is a case where the distance (d) between at least one protrusion (213) and the user's skin is 0, and the protrusion surface of at least one protrusion (213) is a curved surface. Each graph is a graph representing the curvature (R) of at least one protrusion (213). Each graph represents the vascular light amount / total light amount (%) when the curvature (R) of at least one protrusion (213) is 51, 81, 111, 141, and 171.

[0122] According to one embodiment, in the case of (C) of FIG. 15, it can be confirmed that the vascular light amount / total light reception amount (%) is very low, below 20%, regardless of the curvature (R) of at least one protrusion (213). When at least one protrusion (213) and the user's skin are spaced apart, it can be confirmed that the vascular light amount / total light reception amount (%) is low.

[0123] According to one embodiment, in case of (B) of FIG. 15, it can be confirmed that the vascular light amount / total light reception amount (%) is relatively higher compared to (C), and it can be confirmed that the vascular light amount / total light reception amount (%) increases as the distance (d) between the protrusion (213) and the user's skin decreases.

[0124] According to one embodiment, in case of (A) of FIG. 15, it can be confirmed that the blood vessel light amount / total light reception amount (%) is relatively higher compared to (B), and it can be confirmed that the blood vessel light amount / total light reception amount (%) is higher when at least one protrusion (213) is curved than when at least one protrusion (213) is flat. For example, when the curvature (R) of at least one protrusion (213) is 171, the blood vessel light amount / total light reception amount (%) may be approximately 30% or more and 35% or less. For example, when the curvature (R) of at least one protrusion (213) is 141, the blood vessel light amount / total light reception amount (%) may be approximately 25% or more and 30% or less. For example, when the curvature (R) of at least one protrusion (213) is 111, the blood vessel light amount / total light reception amount (%) may be approximately 25%. For example, when the curvature (R) of at least one protrusion (213) is 81, the vascular light amount / total light reception amount (%) may be approximately 20% or more and 25% or less. For example, when the curvature (R) of at least one protrusion (213) is 51, the vascular light amount / total light reception amount (%) may be approximately 20%. That is, it can be confirmed that the higher the curvature of at least one protrusion (213), the higher the vascular light amount / total light reception amount (%).

[0125] An electronic device according to one embodiment of the present disclosure may include a housing (210) including an outer housing portion (211), and an inner housing portion (212) disposed on the inner side of the outer housing portion and including at least one protrusion (213) protruding inwardly, a circuit board (220) positioned within the housing, an optical element (240) positioned within the housing at a position corresponding to the at least one protrusion and mounted on the circuit board, and a conductor (301) electrically connecting the circuit board and the optical element. The inner housing portion may include a first coating layer (212a) disposed to surround the optical element and having a first light transmittance.

[0126] According to one embodiment, the inner housing portion may further include a second coating layer (212b) having a second light transmittance lower than the first light transmittance and arranged to surround the first coating layer, at least a portion of which is positioned on the at least one protrusion.

[0127] According to one embodiment, the center (O) of the electronic device, the center portion (2130) of the at least one protrusion, and the center portion (2400) of the optical element may be arranged in a straight line.

[0128] In one embodiment, the conductor may be any one of a wire, a cable, or a flexible printed circuit board (FPCB).

[0129] In one embodiment, the first coating layer may have a lower strength than the second coating layer.

[0130] According to one embodiment, the device further comprises a processor disposed within the housing, wherein the at least one optical element (240) comprises a light-emitting element (241) configured to emit light through the inner housing portion and a light-receiving element (242) configured to receive at least a portion of light emitted from the light-emitting element and then transmitted through or reflected by the user's body, wherein the processor may be configured to obtain at least one piece of biometric information using a signal detected through the light-receiving element.

[0131] According to one embodiment, the at least one biometric information may include at least one of oxygen saturation information and heart rate information.

[0132] According to one embodiment, the light-receiving element is arranged to correspond to the central portion of the at least one protrusion, the light-emitting element is arranged parallel to the light-receiving element and to correspond to an edge portion of the at least one protrusion, and the first coating layer can be arranged to surround the light-emitting element and the light-receiving element.

[0133] According to one embodiment, the at least one protrusion and the inner housing portion may be formed integrally.

[0134] According to one embodiment, the at least one protrusion may be configured to be at least partially transparent.

[0135] According to one embodiment, the circuit board may have rigid circuit boards and flexible circuit boards alternately arranged.

[0136] According to one embodiment, the housing further includes a battery (230) disposed within the housing, the battery being disposed in a first region of the housing, and the circuit board being disposed in a second region of the housing different from the first region.

[0137] In one embodiment, the optical element may be configured to radiate light in an inward direction of the housing via the central portion of the at least one protrusion.

[0138] According to one embodiment, the light emitting element is configured to emit light in a plurality of wavelength bands, wherein the plurality of wavelength bands may include a green wavelength band, a red wavelength band, a blue wavelength band, and an infrared wavelength band.

[0139] In one embodiment, the housing or the outer housing portion may be ring-shaped.

[0140] An electronic device according to one embodiment of the present disclosure may include a housing (210) including an outer housing portion (211) and an inner housing portion (212) disposed inside the outer housing portion, a circuit board (220) positioned within the housing, an optical element (240) positioned within the housing at a position corresponding to the at least one protrusion and mounted on the circuit board, and a conductor (301) electrically connecting the circuit board and the optical element. The inner housing portion may include a first coating layer (212a) disposed to surround the optical element and having a first light transmittance, and a second coating layer disposed to surround the first coating layer and having a second transmittance lower than the first transmittance.

[0141] According to one embodiment, the inner housing portion may further include at least one protrusion protruding inwardly.

[0142] According to one embodiment, the center (O) of the electronic device, the center portion (2130) of the at least one protrusion, and the center portion (2400) of the optical element may be arranged in a straight line.

[0143] According to one embodiment, the device further comprises a processor disposed within the housing, wherein the at least one optical element (240) comprises a light-emitting element (241) configured to emit light through the inner housing portion and a light-receiving element (242) configured to receive at least a portion of light emitted from the light-emitting element and then transmitted through or reflected by the user's body, wherein the processor may be configured to obtain at least one piece of biometric information using a signal detected through the light-receiving element.

[0144] An electronic device according to one embodiment of the present disclosure may include a housing (210) including an outer housing portion (211), and an inner housing portion (212) disposed on the inner side of the outer housing portion and including at least one protrusion protruding inwardly, a circuit board (220) positioned within the housing, an optical element (240) positioned within the housing at a position corresponding to the at least one protrusion and mounted on the circuit board, and a conductor (301) electrically connecting the circuit board and the optical element. The inner housing portion may include a first coating layer (212a) disposed to surround the optical element and having a first light transmittance, and a second coating layer disposed to surround the first coating layer and having a second transmittance lower than the first transmittance.

[0145] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0146] Ring-type wearable electronic devices, which can be worn on the finger, incorporate healthcare functions and have recently been gaining market share. However, the size of these devices is limited, and the size of the light-receiving element is also limited, which can lead to issues with light-receiving performance.

[0147] According to one embodiment of the present disclosure, in a ring-shaped wearable electronic device with a limited size, the size and active area of ​​a light-receiving portion are maximized, a plurality of materials are stacked to increase transmittance, and the optical element, the protrusion (213), and the center of the electronic device are arranged in a straight line to improve the light quantity of a photo plethysmography (PPG) signal and increase light reception efficiency. As the light reception efficiency improves, the power consumption is reduced, thereby increasing the usage time.

[0148] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

Claims

1. In electronic devices, A housing (210) including an outer housing portion (211) and an inner housing portion (212) including at least one protrusion (213) disposed on the inner side of the outer housing portion and protruding in an inward direction; A circuit board (220) located within the housing; At least one optical element (240) positioned within the housing at a position corresponding to at least one of the protrusions and mounted on the circuit board; and Including a conductor (301) electrically connecting the circuit board and the at least one optical element, An electronic device in which the inner housing portion is arranged to surround at least one optical element and includes a first coating layer (212a) having a first optical transmittance.

2. In paragraph 1, The above inner housing portion, An electronic device further comprising a second coating layer (212b), at least a portion of which is positioned on said at least one protrusion and arranged to surround said first coating layer, and having a second light transmittance lower than said first light transmittance.

3. In either of paragraphs 1 and 2, An electronic device wherein the center (O) of the electronic device, the center portion (2130) of the at least one protrusion, and the center portion (2400) of the optical element are arranged in a straight line.

4. In any one of paragraphs 1 to 3, An electronic device wherein the conductor is any one of a wire, a wire, or a flexible circuit board (FPCB).

5. In paragraph 2, An electronic device wherein the first coating layer has a lower strength than the second coating layer.

6. In paragraph 3, Further comprising a processor disposed within the housing, At least one optical element (240) above, A light-emitting element (241) configured to emit light through the inner housing portion; and A light-receiving element (242) configured to receive at least a portion of light emitted from the light-emitting element and transmitted through or reflected by the user's body; An electronic device wherein the processor is configured to obtain at least one piece of biometric information using a signal detected through the photodetector.

7. In paragraph 6, An electronic device wherein said at least one biometric information comprises at least one of oxygen saturation information and heart rate information.

8. In paragraph 6, The above light-receiving element is arranged to correspond to the central portion of the at least one protrusion, The light-emitting element is arranged parallel to the light-receiving element and is arranged to correspond to an edge portion of the at least one protrusion, An electronic device in which the first coating layer is arranged to surround the light-emitting element and the light-receiving element.

9. In any one of paragraphs 1 to 8, An electronic device in which at least one protrusion and the inner housing portion are integrally formed.

10. In any one of paragraphs 1 to 9, An electronic device wherein at least one of said protrusions is configured to be at least partially transparent.

11. In any one of paragraphs 1 to 10, The above circuit board is an electronic device in which rigid circuit boards and flexible circuit boards are alternately arranged.

12. In any one of paragraphs 1 to 11, Further comprising a battery (230) placed within the housing, An electronic device wherein the battery is disposed in a first area of ​​the housing, and the circuit board is disposed in a second area of ​​the housing that is different from the first area.

13. In paragraph 3, An electronic device wherein the optical element is configured to radiate light in an inward direction of the housing via the central portion of the at least one protrusion.

14. In paragraph 6, The above light-emitting element is configured to emit light of a plurality of wavelength bands, The above plurality of wavelength bands include an electronic device including a green wavelength band, a red wavelength band, a blue wavelength band, and an infrared wavelength band.

15. In any one of paragraphs 1 to 14, An electronic device wherein the housing or the outer housing portion is ring-shaped.

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