Semiconductor manufacturing methods and semiconductor devices

Abstract

This invention relates to a method for manufacturing a semiconductor device. The method consists of a preparation of a plate whose first surface is coupled to a carrier plate and whose second surface is opposite to the first, and the mounting of a semiconductor chip stack on the second surface of the plate. The mounting is performed so that the optical interface of the semiconductor chip stack is on the periphery of the second surface of the plate. The method also consists of steps for forming a photoresist pattern to cover the periphery of the second surface and the region of the semiconductor chip stack containing the optical interface, forming a die in the space surrounded by the photoresist pattern, grinding the die so that the semiconductor chip package is exposed, removing the photoresist pattern after the second die grinding step, and removing the carrier plate from the first surface of the plate. The invention also proposes a semiconductor device.

Images