FLOATING LIQUID COOLING EQUIPMENT

Abstract

The invention relates to a floating liquid cooling device comprising a base plate and at least one floating liquid cooling element. The base plate has at least one mounting groove and at least one liquid cooling path circulating liquid with the mounting groove. The floating liquid cooling element is placed floating in the mounting groove and has the floating path circulating liquid with the liquid cooling path, so that coolant can flow between them. By using the floating liquid cooling element, the position at which the floating liquid cooling element contacts the heat source can be adjusted to automatically match the height of the heat source, thereby providing uniform contact pressure, preventing damage to chips or high-temperature resistant interfaces due to uneven contact pressure, and reducing the maintenance complexity and thermal stress associated with conventional fixed installation methods.

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