HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR BLOCK INTEGRATED WITH THE HEAT SINK

Abstract

The invention relates to a heat sink and a semiconductor block combined with a heat sink, specifically to a heat sink of an improved design for the efficient dissipation of heat generated from a semiconductor block through different surfaces of the semiconductor block and the semiconductor block combined with the heat sink. The heat sink, according to a design of the invention, comprises two or more heat sinks in contact with the first and second surfaces of the semiconductor block for the transfer of heat.Each heat sink may consist of a first heat sink comprising a first region with a flat surface in contact with one surface of the semiconductor block and a third region of length corresponding to the first region on opposite sides of the first region; and a second heat sink comprising a second region extending from the first region along the longitudinal direction of the semiconductor block and a fourth region of length corresponding to the second region on opposite sides of the second region, where the second through the fourth region may have heat dissipation fins to expand the surface area in contact with the cooling air.