The stamping method for shielding electronic components requires no cleaning and utilizes controlled evaporation of rapidly evaporating stamping oil and critical conditions of the hot air drying process.

VN129356APending Publication Date: 2026-09-15SUNGWOO ELECTRONICS
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Patent Information

Application Number
VN1202606751
Authority / Receiving Office
VN · VN
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-05-07
Filing Date
2026-08-07
Publication Date
2026-09-15

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Abstract

The invention relates to a method for stamping shielding plates without the need for a cleaning step for stamped products using fast-evaporating stamping oil. By applying controlled hot air drying conditions to promote the evaporation of fast-drying stamping oil and inhibit carbon deposit formation, this method can ensure superior surface quality and applicability to Surface Mount Technology (SMT) without the need for a separate cleaning step. According to the invention, by controlling the hot air temperature and product transport speed within critical conditions, it is possible to effectively remove residual components of fast-evaporating stamping oil, while inhibiting discoloration, staining, oxidation, and carbon deposit formation. This simplifies the process, increases productivity, and reduces production costs.
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