Display substrate and manufacturing method therefor, and display device

Abstract

A display substrate, comprising a base substrate, an insulating layer, an electrically conductive layer and a plurality of second transmission portions, wherein the insulating layer is located on the base substrate; the electrically conductive layer is located on one side of the insulating layer, and comprises a plurality of first transmission portions, which are arranged in a first direction; the plurality of second transmission portions are located on the side of the insulating layer away from the electrically conductive layer; at least one first transmission portion extends in a second direction; the insulating layer is provided with a plurality of connecting via holes; the at least one first transmission portion is electrically connected to at least one second transmission portion by means of at least one connecting via hole; and an orthographic projection of part of the edge of the at least one first transmission portion extending in the second direction on the base substrate falls within an orthographic projection of the connecting via hole on the base substrate. In the display substrate, at least part of the edge of the first transmission portion extending in the second direction is located in the connecting via hole, which helps to reduce the area occupied by the first transmission portion in the second direction, thereby facilitating layout arrangement.

Description

Display substrate, manufacturing method thereof, and display device Technical Field

[0001] At least one embodiment of the present disclosure relates to a display substrate, a manufacturing method thereof, and a display device. Background Art

[0002] As an important display technology, ultra-high-resolution display technology can enhance the display quality of displays and can be applied to a variety of special display products. Currently, when ultra-high-resolution display technology is applied to 3D display products, how to optimize the pixel structure design to achieve good 3D display effects has become an important research direction.

[0003] Summary of the Invention

[0004] At least one embodiment of the present disclosure provides a display substrate, a manufacturing method thereof, and a display device.

[0005] At least one embodiment of the present disclosure provides a display substrate, comprising a base substrate, an insulating layer, a conductive layer and a plurality of second transmission parts, wherein the insulating layer is located on the base substrate; the conductive layer is located on one side of the insulating layer, and the conductive layer includes a plurality of first transmission parts arranged along a first direction; the plurality of second transmission parts are located on a side of the insulating layer away from the conductive layer; wherein at least one first transmission part extends along a second direction, a plurality of connecting vias are provided in the insulating layer, and the at least one first transmission part is electrically connected to at least one second transmission part through the at least one connecting via; the orthographic projection of at least part of at least one edge of the at least one first transmission part extending along the second direction on the base substrate falls within the orthographic projection of the connecting via on the base substrate, and the second direction intersects with the first direction.

[0006] For example, according to the display substrate provided by the present disclosure, the first transmission portion and the second transmission portion are made of different materials.

[0007] For example, according to the display substrate provided by the present disclosure, the orthographic projection area of ​​the overlapping portion of the first transmission portion and the second transmission portion in the connecting via on the base substrate is 0.3 to 0.8 of the orthographic projection area of ​​the connecting via on the base substrate.

[0008] For example, according to the display substrate provided by the present disclosure, the display substrate also includes a plurality of sub-pixels located on the base substrate, wherein at least some of the sub-pixels include a light-emitting element and a pixel circuit, the light-emitting element includes a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the base substrate, and the first electrode is located between the light-emitting functional layer and the base substrate; the pixel circuit includes a plurality of transistors, and the first electrode of the light-emitting element is electrically connected to the transistor.

[0009] For example, according to the display substrate provided by the present disclosure, the pixel circuit includes an active semiconductor layer, the active semiconductor layer includes a channel region and a source / drain region of each transistor, and the active semiconductor layer is located between the conductive layer and the base substrate; the multiple second transmission parts include at least one first sub-transmission part located in the active semiconductor layer, the insulating layer includes a first insulating layer located between the conductive layer and the at least one first sub-transmission part, the multiple connecting vias include a first connecting via located in the first insulating layer, and the multiple first transmission parts include a first type transmission part, and the first type transmission part is connected to the first sub-transmission part through the first connecting via.

[0010] For example, according to the display substrate provided by the present disclosure, at least one first sub-transmission portion includes a first sub-transmission portion extending along the second direction, and the orthographic projections of at least part of the two opposite edges of the first sub-transmission portion extending along the second direction on the base substrate fall into the orthographic projections of the first connecting via on the base substrate, and the orthographic projections of at least part of the two opposite edges of the first type transmission portion extending along the second direction on the base substrate both fall into the orthographic projections of the first connecting via on the base substrate.

[0011] For example, according to the display substrate provided by the present disclosure, the first type transmission portion includes an edge extending along the first direction, and an orthographic projection of at least part of the edge on the base substrate falls within an orthographic projection of the first connecting via on the base substrate.

[0012] For example, according to the display substrate provided by the present disclosure, the first sub-transmission portion extending along the second direction includes an edge extending along the first direction, and at least part of the orthographic projection of the edge on the base substrate falls into the orthographic projection of the first connecting via on the base substrate.

[0013] For example, according to the display substrate provided by the present disclosure, at least one first sub-transmission portion includes a first sub-transmission portion extending along the first direction, and the orthographic projection of at least part of an edge of the first sub-transmission portion extending along the first direction on the base substrate falls within the orthographic projection of the first connecting via on the base substrate, and the orthographic projection of at least part of two opposite edges of the first type transmission portion extending along the second direction on the base substrate both fall within the orthographic projection of the first connecting via on the base substrate.

[0014] For example, according to the display substrate provided by the present disclosure, the pixel circuit includes an active semiconductor layer, the active semiconductor layer includes a channel region and a source-drain region of each transistor, and the active semiconductor layer is located between the conductive layer and the base substrate; the multiple second transmission parts include at least one second sub-transmission part located between the conductive layer and the active semiconductor layer, the insulating layer includes a second insulating layer located between the multiple first transmission parts and the at least one second sub-transmission part, the multiple first transmission parts include a second type transmission part, the multiple connection vias include a second connection via located in the second insulating layer, and the second type transmission part is connected to the second sub-transmission part through the second connection via.

[0015] For example, according to the display substrate provided by the present disclosure, the orthographic projections of at least part of the two opposite edges of the second type transmission portion extending along the second direction on the base substrate fall into the orthographic projections of the second connecting via on the base substrate, and the orthographic projections of at least part of the two opposite edges of the second sub-transmission portion extending along the second direction on the base substrate both fall into the orthographic projections of the second connecting via on the base substrate.

[0016] For example, according to the display substrate provided by the present disclosure, the maximum dimension of the connection via in the second direction is greater than the maximum dimension of the connection via in the first direction.

[0017] For example, according to the display substrate provided by the present disclosure, the display substrate also includes a first adjacent transmission part and a second adjacent transmission part adjacent to the first transmission part in the first direction and arranged at intervals, the first adjacent transmission part is closer to the first transmission part than the second adjacent transmission part, wherein the first transmission part includes a first edge close to the first adjacent transmission part and a second edge close to the second adjacent transmission part, the first edge and the second edge both extend along the second direction, and the area of ​​the portion of the orthographic projection of the first edge on the base substrate falling into the connecting via is greater than the area of ​​the portion of the orthographic projection of the second edge on the base substrate falling into the connecting via.

[0018] For example, according to the display substrate provided by the present disclosure, the multiple second transmission parts include at least one third sub-transmission part located on the side of the conductive layer away from the base substrate, the third sub-transmission part is located between the first electrode and the conductive layer, the insulating layer includes a third insulating layer and a fourth insulating layer located between the multiple first transmission parts and the at least one third sub-transmission part, the third insulating layer is located between the fourth insulating layer and the base substrate, the multiple connecting vias include a third connecting via located in the third insulating layer and a fourth connecting via located in the fourth insulating layer, the third connecting via is connected to the fourth connecting via, and the inner diameter of the third connecting via is smaller than the inner diameter of the fourth connecting via, the multiple first transmission parts include a third type transmission part, and the third type transmission part is connected to the third sub-transmission part through the third connecting via and the fourth connecting via.

[0019] For example, according to the display substrate provided by the present disclosure, at least part of the orthographic projection of two opposite edges of the third type transmission portion extending along the second direction on the base substrate falls within the orthographic projection of the fourth connection via on the base substrate.

[0020] For example, according to the display substrate provided by the present disclosure, the third sub-transmission portion extends along the first direction, and the orthographic projection of the fourth connection via on the base substrate falls into the orthographic projection of the third sub-transmission portion on the base substrate.

[0021] For example, according to the display substrate provided by the present disclosure, the orthographic projection area of ​​the portion of the third type transmission portion located in the fourth connecting via on the base substrate is greater than the orthographic projection area of ​​the portion of the first type transmission portion located in the first connecting via on the base substrate.

[0022] For example, according to the display substrate provided by the present disclosure, the orthographic projection of another third type transmission portion adjacent to and spaced apart from the third type transmission portion on the base substrate falls within the orthographic projection of the fourth insulating layer on the base substrate.

[0023] For example, according to the display substrate provided by the present disclosure, the display substrate also includes: an anode insulating layer, located between the first electrode and the third sub-transmission part, the anode insulating layer includes an anode connection hole, and the first electrode is connected to the third sub-transmission part through the anode connection hole; wherein the orthographic projection of the anode connection hole on the base substrate does not overlap with the orthographic projection of the fourth connection via on the base substrate; the orthographic projections of at least part of the edge of the third type transmission part extending along the second direction and away from the anode connection via and at least part of the edge extending along the first direction on the base substrate both fall within the orthographic projection of the third connection via on the base substrate.

[0024] At least one embodiment of the present disclosure further provides a display device comprising the display substrate according to any one of claims 1-19.

[0025] For example, according to a display device provided in accordance with at least one embodiment of the present disclosure, the display device further includes a plurality of sub-pixels and a spectroscopic structure, wherein the plurality of sub-pixels are located on the base substrate; the spectroscopic structure is arranged on the light-emitting side of the display substrate, and the spectroscopic structure is configured to direct the light emitted by the plurality of sub-pixels to different viewing areas, wherein the spectroscopic structure includes a plurality of spectroscopic parts extending along the first direction and arranged along the second direction, and the spectroscopic parts include lenses.

[0026] At least one embodiment of the present disclosure also provides a method for manufacturing a display substrate, comprising: forming an insulating layer, a conductive layer, and a plurality of second transmission parts on a base substrate, the conductive layer being located on one side of the insulating layer, and the plurality of second transmission parts being located on a side of the insulating layer away from the conductive layer, wherein forming the conductive layer comprises forming a first transmission layer, and patterning the first transmission layer to form a first pattern, the first pattern comprising a plurality of first transmission parts; forming the insulating layer comprises patterning the insulating layer so that the insulating layer comprises at least one connecting via; forming the plurality of second transmission parts comprises forming a second transmission layer, and patterning the second transmission layer to form a second pattern, the second pattern comprising the plurality of second transmission parts; wherein the at least one first transmission part is electrically connected to the at least one second transmission part through the at least one connecting via, the orthographic projection of a portion of an edge of the at least one first transmission part extending along the second direction on the base substrate falls within the orthographic projection of the connecting via on the base substrate, and the second direction overlaps with the first direction.

[0027] For example, according to at least one embodiment of the present disclosure, a method for manufacturing a display substrate is provided, wherein the orthographic projection of a portion of an edge of the at least one first transmission portion extending along the second direction on the base substrate falls within the orthographic projection of the connection via on the base substrate, including: setting a distance between the portion of the edge of the at least one first transmission portion extending along the second direction and the first connection via as Space, and making Space satisfy:

[0028] Among them, OL1 represents the minimum spacing between the routing in the first transmission layer and the corresponding design position, OL2 represents the minimum spacing between the routing in the second transmission layer and the corresponding design position, Tor1 represents the uniformity of the first pattern, Tor2 represents the uniformity of the second pattern, Bias1 represents the dimensional accuracy of the first pattern, and Bias2 represents the dimensional accuracy of the second pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0030] FIG1 is a plan view of a stacked layer of a display substrate provided by at least one embodiment of the present disclosure.

[0031] FIG2 is a schematic cross-sectional view of a display substrate provided by at least one embodiment of the present disclosure.

[0032] FIG3 shows a schematic diagram of a partial structure corresponding to the first connecting via 511 in FIG1 .

[0033] FIG. 4 is a schematic cross-sectional view taken along line A1 - A1 ′ in FIG. 3 .

[0034] FIG. 5 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 3 taken along line B1 - B1 ′.

[0035] FIG. 6 shows a schematic diagram of a partial structure corresponding to the first connecting via 512 in FIG. 1 .

[0036] FIG. 7 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 6 taken along line B2 - B2 ′.

[0037] FIG. 8 shows a schematic diagram of a partial structure corresponding to the first connecting via 513 in FIG. 1 .

[0038] FIG. 9 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 8 taken along line B3 - B3 ′.

[0039] FIG. 10 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 8 taken along line A3 - A3 ′.

[0040] FIG. 11 shows a schematic diagram of a partial structure corresponding to the first connecting via 514 in FIG. 1 .

[0041] FIG12 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG11 taken along line B4-B4′.

[0042] FIG. 13 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 11 taken along line A4 - A4 ′.

[0043] FIG. 14 shows a schematic diagram of a partial structure corresponding to the second connecting via 521 in FIG. 1 .

[0044] FIG. 15 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 14 taken along line B5 - B5 ′.

[0045] FIG. 16 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 14 taken along line A5 - A5 ′.

[0046] FIG. 17 shows a schematic diagram of a partial structure corresponding to the third connection via 531 and the fourth connection via 532 in FIG. 1 .

[0047] FIG18 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG17 taken along line B6-B6′.

[0048] FIG19 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG17 taken along line A6-A6′.

[0049] FIG. 20 shows a schematic diagram of a partial structure corresponding to the anode connection hole 54 and the fourth connection via 5321 in FIG. 1 .

[0050] FIG. 21 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 20 taken along line B7 - B7 ′.

[0051] FIG. 22 is a schematic cross-sectional view of a partial structure of the display substrate shown in FIG. 20 taken along line A7 - A7 ′.

[0052] FIG23 is a schematic diagram of a pixel circuit corresponding to a display substrate provided by at least one embodiment of the present disclosure.

[0053] FIG. 24 shows a schematic diagram of a partial structure corresponding to the first connecting via 511 in FIG. 1 in another embodiment of the present disclosure.

[0054] FIG25A is a schematic diagram of a display device provided according to an embodiment of the present disclosure.

[0055] FIG25B is a schematic diagram of another display device provided according to an embodiment of the present disclosure.

[0056] 26 to 31 are schematic flow charts of a method for manufacturing a display substrate provided by at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0057] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0058] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0059] The features "perpendicular," "parallel," and "identical" used in the embodiments of the present disclosure include the features "perpendicular," "parallel," and "identical" in the strict sense, as well as "approximately perpendicular," "approximately parallel," and "approximately identical" that include certain errors, taking into account the errors associated with the measurement of specific quantities (i.e., the limitations of the measurement system), and represent within the acceptable deviation range for the specific value determined by ordinary technicians in this field. The "center" in the embodiments of the present disclosure can include a position strictly at the geometric center and a position approximately at the center of a small area around the geometric center.

[0060] Typically, 3D display products include multiple viewing angles, each used to display different object information. Microlenses are used to achieve a 3D display effect. The greater the number of viewing angles, the higher the resolution and, consequently, the better the 3D display effect. However, as the number of viewing angles in 3D display products continues to increase, the space available for pixel arrangement within these products becomes increasingly limited. Therefore, achieving an orderly distribution of multiple sub-pixels within the limited layout space has become a pressing challenge.

[0061] During the research, the inventors of the present application found that: in 3D display products, the pixel circuit of the sub-pixel is usually provided with a connection via for connecting the conductive structures arranged at different layers. Usually, the conductive structure includes a first part located in the connection via, and a second part located outside the connection via and surrounding the connection via in the circumferential direction. That is, the orthographic projection of the connection via on the base substrate of the 3D display product usually falls completely within the orthographic projection of the conductive structure on the base substrate. Under this design method, the electrical connection of the conductive structures located at different layers is mainly achieved through the first part of the conductive structure, while the second part of the conductive structure located outside the connection via is usually unnecessary, and this part of the conductive structure will also occupy too much layout space in the layer where the conductive structure is located, which is not conducive to layout design and affects the resolution of the 3D display product. At the same time, it may also bring the risk of signal crosstalk between different conductive structures, resulting in poor display and other phenomena.

[0062] At least one embodiment of the present disclosure provides a display substrate, comprising a base substrate, an insulating layer, a conductive layer, and a plurality of second transmission parts, wherein the insulating layer is located on the base substrate; the conductive layer is located on one side of the insulating layer and comprises a plurality of first transmission parts arranged along a first direction; the plurality of second transmission parts are located on a side of the insulating layer away from the conductive layer; at least one first transmission part extends along a second direction, a plurality of connecting vias are provided in the insulating layer, and at least one first transmission part is electrically connected to at least one second transmission part through at least one connecting via; the orthographic projection of a portion of an edge of at least one first transmission part extending along the second direction on the base substrate falls within the orthographic projection of the connecting via on the base substrate, and the second direction intersects with the first direction.

[0063] The display substrate provided by the embodiments of the present disclosure enables at least a portion of the edge of the first transmission portion extending along the second direction to be located in the connecting via, thereby reducing the coverage area of ​​the first transmission portion on the portion outside the edge of the connecting via and reducing the space occupied by the first transmission portion in the first direction, thereby facilitating layout and improving the display effect.

[0064] The display substrate and its manufacturing method, and the display device provided by the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0065] FIG1 is a plan view of a stack of layers of a display substrate provided by at least one embodiment of the present disclosure; FIG2 is a schematic cross-sectional view of a display substrate provided by at least one embodiment of the present disclosure.

[0066] As shown in Figures 1 and 2, the display substrate 01 includes a base substrate 10, an insulating layer 20, a conductive layer 30, and a plurality of second transmission portions 40. The insulating layer 20 is located on the base substrate 10. The conductive layer 30 is located on one side of the insulating layer 20 and includes a plurality of first transmission portions 31 arranged along a first direction X.

[0067] As shown in FIG2 , the plurality of second transmission portions 40 are located on a side of the insulating layer 20 away from the conductive layer 30. For example, the plurality of second transmission portions 40 may be located on the same layer or on different layers. For example, the insulating layer 20 may be located between the second transmission portions 40 and the conductive layer 30, and may be in contact with the second transmission portions 40 and the conductive layer 30, respectively, but the present invention is not limited thereto.

[0068] As shown in Figures 1 and 2, at least one first transmission portion 31 extends along the second direction Y, and a plurality of connection vias 50 are provided in the insulating layer 20. At least one first transmission portion 31 is electrically connected to at least one second transmission portion 40 through at least one connection via 50. For example, one first transmission portion 31 can be electrically connected to one second transmission portion 40 through one connection via 50, or one first transmission portion 31 can be electrically connected to the same second transmission portion 40 through two or more connection vias 50, or one first transmission portion 31 can be electrically connected to two or more second transmission portions 40 through at least one connection via 50.

[0069] As shown in Figures 1 and 2, the orthographic projection of a portion of the edge of at least one first transmission portion 31 extending along the second direction Y on the base substrate 10 falls within the orthographic projection of the connecting via 50 on the base substrate 10. For example, the first transmission portion 31 contacts the second transmission portion 40 via the portion located in the connecting via 50 to establish an electrical connection. In the second direction Y, the size of the portion of the first transmission portion 31 located in the connecting via 50 is smaller than the size of the connecting via 50, thereby reducing the area occupied by the first transmission portion 31 in the first direction X and facilitating layout space conservation. The second direction Y intersects the first direction X; for example, the first direction X may be perpendicular to the second direction Y.

[0070] For example, in some embodiments of the present disclosure, in the first direction X, the size of the portion of the first transmission portion 31 that extends along the second direction Y and does not overlap with the connecting via 50 may also be smaller than the size of the connecting via 50, thereby reducing the size of the first transmission portion 31 as a whole to save layout space.

[0071] The display substrate provided by the embodiments of the present disclosure enables at least a portion of the edge of the first transmission portion extending along the second direction Y to be located in the connecting via, thereby reducing the coverage area of ​​the first transmission portion outside the edge of the connecting via and reducing the space occupied by the first transmission portion in the first direction X, thereby facilitating layout and improving display effects.

[0072] For example, as shown in Figures 1 and 2, the first transmission part 31 and the second transmission part 40 include a conductive material, such as a metal material, but not limited thereto. For example, the materials of the first transmission part 31 and the second transmission part 40 are different. For example, the first transmission part 31 can be made of a composite material including Ti / Al / Ti stacked in sequence, but not limited thereto. For example, when forming the first transmission part 31, the size of the portion where the material used to form the first transmission part 31 overlaps with the edge of the connecting via 50 can be set to a specific design value. Exposure, development, and etching processes can cause the size of the material to change. For example, the edge portion with a specific design value can be eventually shrunk into the connecting via 50 (this part involves the method for forming the display substrate, and can be seen in the embodiments described in detail later). At the same time, in order to enable the edge portion with a specific design value to eventually retract into the connecting via 50, the range of the above-mentioned design value is generally small, for example, it can be 1μm to 1.2μm, but not limited to this. Therefore, by making the material of the first transmission part 31 different from the material of the second transmission part 40, the influence of the later-made film layer (such as the first transmission part 31 or the second transmission part 40) on the earlier-made film layer (such as the second transmission part 40 or the first transmission part 31) during the manufacturing process (for example, during the etching process) can be reduced, thereby reducing the risk of damaging the earlier-made film layer.

[0073] For example, as shown in Figures 1 and 2, the material of the first transmission part 31 can have an etching selectivity that is different from that of the material of the second transmission part 40. Thus, in the process of patterning the conductive layer 30 with an etching solution to form the first transmission part 31, the risk of the etching solution etching the second transmission part 40 or other film layers can be reduced.

[0074] For example, as shown in Figures 1 and 2, in order to ensure that the first transmission part 31 can be effectively electrically connected to the second transmission part 40 in the connecting via 50, the first transmission part 31 and the second transmission part 40 must have sufficient contact area in the connecting via 50 to ensure normal transmission of the electrical signal. For example, the orthographic projection area of ​​the portion where the first transmission part 31 and the second transmission part 40 overlap in the connecting via 50 on the base substrate 10 can be 0.3 to 0.8 of the orthographic projection area of ​​the connecting via 50 on the base substrate 10, but is not limited thereto. For example, the above-mentioned size can be at least one of 0.3 to 0.5, 0.4 to 0.7, 0.5 to 0.8, 0.35 to 0.65, and 0.25 to 0.75, and can be set specifically according to design requirements, and the embodiments of the present disclosure are not limited thereto.

[0075] For example, as shown in Figures 1 and 2, the display substrate 01 further includes a plurality of sub-pixels 60 located on a base substrate 10. At least some of the sub-pixels 60 include light-emitting elements 61 and pixel circuits 62. The light-emitting elements 61 include a light-emitting functional layer 610, and a first electrode 611 and a second electrode 612 located on either side of the light-emitting functional layer 610 in a direction perpendicular to the base substrate 10. The first electrode 611 is located between the light-emitting functional layer 610 and the base substrate 10. For example, the direction perpendicular to the base substrate 10 may be a third direction Z, such as, for example, the third direction Z is perpendicular to the first direction X, and the third direction Z is perpendicular to the second direction Y, but is not limited thereto.

[0076] For example, as shown in FIG2 , the pixel circuit 62 may include a plurality of transistors, and the first electrode 611 of the light-emitting element 61 is electrically connected to one of the plurality of transistors (e.g., a driving transistor) so that the pixel circuit 62 can drive the light-emitting element 61 to emit light. For example, the pixel circuit 62 is configured to provide a driving current to drive the light-emitting element 61 to emit light. For example, the light-emitting element 61 is an organic light-emitting diode (OLED) or a micron light-emitting diode (MicroLED) or a quantum dot light-emitting diode (QLED), and the light-emitting element 61 emits red light, green light, blue light, or white light, etc., when driven by its corresponding pixel circuit 62. For example, the plurality of sub-pixels 60 may include a plurality of first-type sub-pixels, a plurality of second-type sub-pixels, and a plurality of third-type sub-pixels, each type of sub-pixel being configured to emit light of a different color, such as red, green, and blue. For example, one of the first-type sub-pixel and the second-type sub-pixel is a blue sub-pixel that emits blue light, the other is a red sub-pixel that emits red light, and the third-type sub-pixel is a green sub-pixel that emits green light. For example, the first type of sub-pixel is a blue sub-pixel, and the second type of sub-pixel is a red sub-pixel. The area of ​​the light-emitting area of ​​the blue sub-pixel is larger than the area of ​​the light-emitting area of ​​the red sub-pixel. For example, the area of ​​the light-emitting area of ​​the blue sub-pixel is larger than the area of ​​the light-emitting area of ​​the green sub-pixel. Of course, the embodiments of the present disclosure are not limited to this. For example, according to the actual layout design requirements, the arrangement of the sub-pixels 60 can be in different forms. For example, "diamond arrangement", "diamond-like arrangement", "GGRB arrangement", etc., which are not limited in the embodiments of the present disclosure.

[0077] For example, as shown in Figures 1 and 2, the orthographic projection of the pixel circuit 62 of each color sub-pixel 60 on the base substrate 10 is approximately located within a rectangular area, the size L of each rectangular area in the first direction X is 55μm to 60μm, and each rectangular area in at least some of the rectangular areas is provided with 8 to 15 first transmission portions 31. For example, for the display substrate 01 shown in Figure 1, the size L of each rectangular area in the first direction X is related to the size of the display substrate 01 and satisfies the following formula: (W*b*N)^2+(L*3*M)^2=a^2 (W*b*N) / (L*3*M)=c / d

[0078] Wherein, L represents the height (μm) of the view in the sub-pixel, W represents the width (μm) of the view in the sub-pixel, a represents the size (inch) of the display substrate along its diagonal, b represents the number of views in the sub-pixel, c / d represents the aspect ratio of the display substrate, M represents the number of rows of sub-pixels in the display substrate, and N represents the number of columns of sub-pixels in the display substrate. For example, for the display substrate 01 shown in FIG1 , a can be 30 inches, M can be 3840, N can be 2160, c / d can be 16 / 9, b can be 11, and W can be 15.8μm to 16μm, but is not limited thereto. For example, the above-mentioned L can be at least one of 57μm to 58μm and 57.5μm to 59.5μm, but is not limited thereto.

[0079] As can be seen from FIG. 1 , within the rectangular area corresponding to the orthographic projection of the pixel circuit 62 of each sub-pixel 60 , the first transmission portions 31 substantially all extend along the second direction Y, and multiple first transmission portions 31 are arranged along the first direction X, with a certain spacing distance between adjacent first transmission portions 31 . Thus, the embodiments of the present disclosure facilitate reducing the coverage area of ​​the first transmission portions 31 outside the edges of the connecting vias 50 by ensuring that at least a portion of the edges of the first transmission portions 31 extending along the second direction Y are located within the connecting vias 50 , thereby reducing the space occupied by the first transmission portions 31 in the first direction X, thereby adapting to layout requirements in high-pixel-density layout designs.

[0080] For example, the layout arrangement shown in FIG1 can be used for ultra-high-resolution display products, but is not limited thereto. For example, within each rectangular region, the number of first transmission portions 31 can be at least one of 8 to 12, 9 to 13, or 10 to 14, but is not limited thereto, and can be set based on design requirements.

[0081] For example, as shown in FIG2 , the insulating layer 20 of the display substrate 01 includes a first insulating layer 21, a second insulating layer 22, a third insulating layer 23, a fourth insulating layer 24, and an anode insulating layer 25. The display substrate 01 also includes a buffer layer 11, and the buffer layer 11, the first insulating layer 21, the second insulating layer 22, the third insulating layer 23, the fourth insulating layer 24, and the anode insulating layer 25 are arranged in sequence along a direction perpendicular to the base substrate 10. For example, the second insulating layer 22 may also be referred to as a gate insulating layer, and the third insulating layer 23 may also be referred to as an interlayer insulating layer, but are not limited thereto. The pixel circuit 62 includes an active semiconductor layer 63 located on the buffer layer 11. The active semiconductor layer 63 includes a channel region and a source / drain region of each transistor. The active semiconductor layer 63 is located between the conductive layer 30 and the base substrate 10. As shown in FIG2 , the active semiconductor layer 63 is located between the second insulating layer 22 and the buffer layer 11. For example, portions of the active semiconductor layer 63 in the source / drain region are electrically connected to the source electrode E1 and the drain electrode E2. The source electrode E1 and the drain electrode E2 are covered by the third insulating layer 23, and both the source electrode E1 and the drain electrode E2 are connected to the active semiconductor layer 63. A gate electrode GT is provided on the first insulating layer 21, and the drain electrode E2 is electrically connected to the first electrode 611 in the light-emitting element 61 via a via hole that penetrates the third insulating layer 23, the fourth insulating layer 24, and the anode insulating layer 25. For example, the active semiconductor layer 63 may be made of, but is not limited to, low-temperature polysilicon (LTPS).

[0082] For example, as shown in FIG2 , the first transmission portion 30 is located in the third insulating layer 23. The multiple second transmission portions 40 in the display substrate 01 include at least one first sub-transmission portion 41 located in the active semiconductor layer 63. The first insulating layer 21 is located between the conductive layer 30 and the at least one first sub-transmission portion 41. The multiple connection vias 50 in the display substrate 01 include first connection vias 51 located in the first insulating layer 21. The multiple first transmission portions 30 in the display substrate 01 include first-type transmission portions 31, which are connected to the first sub-transmission portion 41 via the first connection vias 51. For example, the first sub-transmission portion 41 can be the source or drain of a transistor in the display substrate 01, and the first-type transmission portion 31 can be part of a signal line. After the first-type transmission portion 31 is connected to the first sub-transmission portion 41 via the first connection via 51, it can transmit electrical signals to the first sub-transmission portion 41, but the present invention is not limited to this. For example, the first insulating layer 21 may also be a portion of the insulating layer located between the first sub-transmission portion 41 and the first transmission portion 30 , or may be the entire insulating layer, which is not limited in the embodiments of the present disclosure.

[0083] For example, as shown in Figures 1 and 2, the at least one first sub-transmission portion 41 in the active semiconductor layer 63 may include multiple first sub-transmission portions 41, and the multiple first sub-transmission portions 41 may have different shapes and extension directions. For example, the multiple first sub-transmission portions 41 can be configured to be electrically connected to different signal lines to transmit different electrical signals. For example, a first insulating layer 21 and a second insulating layer 22 are provided between the first sub-transmission portion 41 and the first type transmission portion 31. For example, the second insulating layer 22 can be an insulating layer of the first insulating layer 21 away from the base substrate 10, or it can be an insulating layer in the first insulating layer 21, and the embodiments of the present disclosure are not limited to this.

[0084] For example, as shown in FIG1 , the at least one first sub-transmission portion 41 located in the active semiconductor layer 63 may include a first sub-transmission portion 411 extending along the second direction Y, the plurality of first-type transmission portions 31 may include first-type transmission portions 311 extending along the second direction Y, and the first connection via 51 located in the first insulating layer 21 of the display substrate 01 includes a first connection via 511 that electrically connects the first sub-transmission portion 411 and the first-type transmission portion 311. For example, in FIG1 , the first-type transmission portion 311 and the first sub-transmission portion 411 are stacked, with the first-type transmission portion 311 overlying the first sub-transmission portion 411. For example, for clarity, FIG3 shows a schematic diagram of a partial structure corresponding to the first connection via 511 in FIG1 ; FIG4 is a schematic cross-sectional view taken along line A1-A1' in FIG3 ; and FIG5 is a schematic cross-sectional view of the partial structure of the display substrate shown in FIG3 taken along line B1-B1'.

[0085] For example, as shown in Figures 1, 3, and 4, line A1-A1' extends along the first direction X, and the signal transmission directions of the first type transmission portion 311 and the first sub-transmission portion 411 are both perpendicular to the first direction X. The orthographic projections of at least portions of two opposing edges of the first sub-transmission portion 411 extending along the second direction Y on the base substrate fall within the orthographic projections of the first connection via 511 on the base substrate, and the orthographic projections of at least portions of two opposing edges of the first type transmission portion 311 extending along the second direction Y on the base substrate also fall within the orthographic projections of the first connection via 511 on the base substrate.

[0086] For example, as shown in Figures 1, 3, and 4, in the first direction X, the size of the portion of the first-type transmission portion 311 located in the first connection via 511 is smaller than the size of the first connection via 511, and the size of the portion of the first sub-transmission portion 411 located in the first connection via 511 is also smaller than the size of the first connection via 511. For example, at least portions of the opposing edges of the first-type transmission portion 311 extending along the second direction Y are both located in the first connection via 511, and at least portions of the opposing edges of the first sub-transmission portion 411 extending along the second direction Y are both located in the first connection via 511. As a result, the sizes of the portions of the first-type transmission portion 311 and the first sub-transmission portion 411 overlapping with the first connection via 511 can be reduced, thereby reducing the layout area occupied by the first-type transmission portion 311 and the first sub-transmission portion 411, thereby saving layout space.

[0087] For example, as shown in Figures 1 and 3 , the first sub-transmission portion 411 and the first-type transmission portion 311 extend in the same direction, and the orthographic projection of the first sub-transmission portion 411 on the base substrate substantially overlaps with the orthographic projection of the first-type transmission portion 311 on the base substrate. Therefore, as can be seen from Figure 1 , the signal transmission directions of the first sub-transmission portion 411 and the first-type transmission portion 311 are both in the second direction Y.

[0088] For example, as shown in Figures 1 and 4 , portions of two opposing edges of the first-type transmission portion 311 extending along the second direction Y are both located within the connection via 50, but the embodiments of the present disclosure are not limited thereto. For example, a portion of one edge of the first-type transmission portion 311 extending along the second direction Y may be located within the connection via 50, while another edge of the first-type transmission portion 311 extending along the second direction Y may be located outside the connection via 50 to accommodate different design requirements, and the embodiments of the present disclosure are not limited thereto.

[0089] For example, as can be seen from FIG. 5 , in the second direction Y, the size of the first connection via 511 is smaller than the size of the first-type transmission portion 311, and the size of the first connection via 511 is smaller than the size of the first sub-transmission portion 411. The first-type transmission portion 311 and the first sub-transmission portion 411 each include a portion located within the first connection via 511, as well as a portion that overlaps with the edge of the first connection via 511 and extends along the second direction Y. The size of the portions of the first-type transmission portion 311 and the first sub-transmission portion 411 located within the first connection via 511 in the second direction Y is equal to the size of the first connection via 511 in the second direction Y. Thus, in the second direction Y, the size of the portion where the first-type transmission portion 311 and the first sub-transmission portion 411 contact each other is equal to the size of the first connection via 511 in the second direction Y, thereby enabling good signal transmission between the first-type transmission portion 311 and the first sub-transmission portion 411 in the signal transmission direction.

[0090] For example, as shown in FIG1 and FIG3 , in the first direction X, the size of the portion of the first type transmission portion 311 located outside the first connection via 511 and on both sides of the first connection via 511 in the second direction Y may not be larger than the size of the first connection via 511. For example, the size may be equal to or smaller than the size of the first connection via 511, but the present invention is not limited thereto. For example, the size of the portion of the first type transmission portion 311 located outside the first connection via 511 and on both sides of the first connection via 511 in the second direction Y may be equal to, or substantially equal to, the size of the portion of the first type transmission portion 311 located within the first connection via 511, thereby facilitating an overall reduction in the size of the first type transmission portion 311 in the first direction X. Similarly, the size of the portion of the first sub-transmission portion 411 located outside the first connection via 511 and on both sides of the first connection via 511 in the second direction Y can also be equal to, or approximately equal to, the size of the portion of the first sub-transmission portion 411 located within the first connection via 511, to save layout space. In the direction from upstream of the first type transmission portion 311 to downstream of the first type transmission portion 311, the first type transmission portion 311 is continuously arranged, and the size of the first type transmission portion 311 in this direction is equal to the size of the first connection via 511 in this direction, so that the first type transmission portion 311 can effectively transmit signals.

[0091] For example, as shown in FIG. 2 and FIG. 4 , a portion of the first connection via 511 where the first type transmission portion 311 is not provided may be filled with the third insulating layer 23 , but is not limited thereto.

[0092] For example, as shown in Figures 1 and 2 , the at least one first sub-transmission portion 41 located in the active semiconductor layer 63 may further include a first sub-transmission portion 412 extending along the second direction Y, the plurality of first-type transmission portions 31 may include a first-type transmission portion 312 extending along the second direction Y, and the first connection via 51 located in the first insulating layer 21 may include a first connection via 512 electrically connecting the first sub-transmission portion 412 and the first-type transmission portion 312. For example, in Figure 1 , the first-type transmission portion 312 and the first sub-transmission portion 412 are stacked, with the first-type transmission portion 312 overlying the first sub-transmission portion 412. For example, for clarity, Figure 6 shows a schematic diagram of a partial structure corresponding to the first connection via 512 in Figure 1 ; and Figure 7 is a schematic cross-sectional view of the partial structure of the display substrate shown in Figure 6 taken along line B2-B2'.

[0093] For example, as shown in Figures 1 and 6 , the first sub-transmission portion 412 and the first-type transmission portion 312 extend in the same direction, and the orthographic projection of the first sub-transmission portion 412 on the substrate substantially overlaps with the orthographic projection of the first-type transmission portion 312 on the substrate. Therefore, as can be seen from Figure 1 , the signal transmission direction of the first sub-transmission portion 412 and the signal transmission direction of the first-type transmission portion 312 are both in the second direction Y.

[0094] For example, as shown in FIG6 and FIG7 , the first type transmission portion 312 includes an edge 3121 extending along the first direction X, and an orthographic projection of at least a portion of the edge 3121 on the base substrate falls within an orthographic projection of the first connection via 512 on the base substrate 10 .

[0095] For example, as shown in Figures 6 and 7, the first type transmission portion 312 and the first sub-transmission portion 412 may each include a portion located in the first connection via 512 and a portion overlapping with an edge of the first connection via 512 and extending along the second direction Y. Since the portion of the first type transmission portion 312 that is connected to the first sub-transmission portion 412 through the first connection via 512 includes the end portion of the first type transmission portion 312, the portion of the first type transmission portion 311 that overlaps with the edge of the first connection via 512 and extends along the second direction Y may be located on one side of the first connection via 512 in the second direction Y. The edge 3121 of the first type transmission portion 312 extending in the first direction X is located at the aforementioned end portion of the first type transmission portion 312 and is located in the first connection via 512. This can reduce the size of the first type transmission portion 312 in the second direction Y while not affecting signal transmission by the first type transmission portion 312.

[0096] For example, as shown in Figures 6 and 7, the first sub-transmission portion 412 extending along the second direction Y includes an edge 4121 extending along the first direction X, and at least a portion of the edge 4121 on the base substrate 10 also falls within the orthographic projection of the first connection via 512 on the base substrate 10.

[0097] For example, as shown in Figures 6 and 7, the portion of the first sub-transmission portion 412 connected through the first connection via 512 includes the end portion of the first sub-transmission portion 412, and the portion of the first sub-transmission portion 412 overlapping with the edge of the first connection via 512 and extending along the second direction Y is located on one side of the first connection via 512, and in the second direction Y, the portion of the first sub-transmission portion 412 located outside the first connection via 512 and the portion of the first type transmission portion 312 located outside the first connection via 512 are located on the same side of the first connection via 512, and the edge 4121 of the first sub-transmission portion 412 extending along the first direction X is located at the above-mentioned end portion of the first sub-transmission portion 412, and the edge 4121 is located in the first connection via 512, so that the size of the first sub-transmission portion 412 in the second direction Y can be reduced without affecting the signal transmission of the first sub-transmission portion 412.

[0098] For example, as shown in Figures 6 and 7 , in the first direction X, the size of the portion of the first type transmission portion 312 located in the first connection via 512 is smaller than the size of the first connection via 512, and the size of the portion of the first sub-transmission portion 412 located in the first connection via 512 is also smaller than the size of the first connection via 512. For example, at least portions of the opposing edges of the first type transmission portion 312 extending along the second direction Y are both located in the first connection via 512, and at least portions of the opposing edges of the first sub-transmission portion 412 extending along the second direction Y are both located in the first connection via 512. This allows the sizes of the portions of the first type transmission portion 312 and the first sub-transmission portion 412 overlapping with the first connection via 512 to be reduced.

[0099] For example, in the first direction X, the size of the portion of the first type transmission portion 312 located outside the first connection via 512 and on one side of the first connection via 512 in the second direction Y can be equal to, or substantially equal to, the size of the portion of the first type transmission portion 312 located within the first connection via 512, thereby facilitating an overall reduction in the size of the first type transmission portion 312 in the first direction X. For example, the size of the portion of the first sub-transmission portion 412 located outside the first connection via 512 and on one side of the first connection via 512 in the second direction Y can be equal to, or substantially equal to, the size of the portion of the first sub-transmission portion 412 located within the first connection via 512, thereby facilitating a reduction in layout space.

[0100] For example, as shown in FIG. 2 and FIG. 7 , a portion of the first connection via 512 where the first type transmission portion 312 is not provided may be filled with the third insulating layer 23 , but is not limited thereto.

[0101] For example, as shown in Figures 1 and 2 , the at least one first sub-transmission portion 41 located in the active semiconductor layer 63 may further include a first sub-transmission portion 413 extending along the first direction X, the plurality of first-type transmission portions 31 may include a first-type transmission portion 313 extending along the second direction Y, and the first connection via 51 located in the first insulating layer 21 may include a first connection via 513 that electrically connects the first sub-transmission portion 413 and the first-type transmission portion 313. For example, for clarity, Figure 8 shows a schematic diagram of a partial structure corresponding to the first connection via 513 in Figure 1 ; Figure 9 is a schematic cross-sectional view of the partial structure of the display substrate shown in Figure 8 taken along line B3-B3'; and Figure 10 is a schematic cross-sectional view of the partial structure of the display substrate shown in Figure 8 taken along line A3-A3'.

[0102] For example, as shown in Figures 1 and 8, the first type transmission portion 313 extends along the second direction Y, the first sub-transmission portion 412 extends along the first direction X, the signal transmission direction of the first type transmission portion 313 is the second direction Y, and the signal transmission direction of the first sub-transmission portion 412 is the first direction X.

[0103] For example, as shown in Figures 1, 8, and 9, the first-type transmission portion 313 includes a portion located within the first connection via 513 and a portion overlapping with an edge of the first connection via 513 and extending along the second direction Y. Because the portion of the first-type transmission portion 313 that connects to the first sub-transmission portion 413 via the first connection via 513 includes the end portion of the first-type transmission portion 313, the portion of the first-type transmission portion 313 that overlaps with the edge of the first connection via 513 and extends along the second direction Y can be located on one side of the first connection via 513 in the second direction Y. The edge of the first-type transmission portion 313 extending in the first direction X is located at the aforementioned end portion of the first-type transmission portion 313 and is located within the first connection via 513. As shown in Figure 9, in the second direction Y, the size of the portion of the first-type transmission portion 313 located within the first connection via 513 is smaller than that of the first connection via 513. This allows the size of the first-type transmission portion 313 in the second direction Y to be reduced without affecting signal transmission by the first-type transmission portion 313.

[0104] For example, as shown in Figures 1, 8, and 9, the first sub-transmission portion 413 includes a portion located in the first connection via 513, and a portion overlapping with the edge of the first connection via 513 and extending along the second direction Y. In the signal transmission direction of the first-type transmission portion 313, that is, in the second direction Y, the size of the portion of the first sub-transmission portion 413 located in the first connection via 513 is equal to the size of the first connection via 513, so as to ensure sufficient contact area with the first-type transmission portion 313, avoid the first-type transmission portion 313 located in the first connection via 513 from connecting to the first sub-transmission portion 413 by "climbing", and make the first-type transmission portion 313 located in the first connection via 513 more smooth and uniform in structure, facilitating signal transmission.

[0105] For example, as shown in Figures 1, 8, and 10, the orthographic projections of at least portions of two opposite edges of the first-type transmission portion 313 extending along the second direction Y on the base substrate 10 both fall within the orthographic projection of the first connection via 513 on the base substrate 10. The orthographic projection of at least portions of one edge of the first sub-transmission portion 413 extending along the second direction Y on the base substrate falls within the orthographic projection of the first connection via 513 on the base substrate 10.

[0106] For example, as shown in Figures 1, 8, and 10, in the second direction Y, the size of the portion of the first-type transmission portion 313 located in the first connection via 513 is smaller than the size of the first connection via 513, and the size of the portion of the first sub-transmission portion 413 located in the first connection via 513 is also smaller than the size of the first connection via 513. For example, at least portions of two opposing edges of the first-type transmission portion 313 extending along the second direction Y are both located in the first connection via 513, and at least portions of one edge of the first sub-transmission portion 413 extending along the second direction Y are both located in the first connection via 513. This allows the sizes of the portions of the first-type transmission portion 313 and the first sub-transmission portion 413 overlapping with the first connection via 513 to be reduced, thereby reducing the layout area occupied by the first-type transmission portion 313 and the first sub-transmission portion 413, thereby saving layout space.

[0107] For example, as shown in FIG. 2 and FIG. 9 , a portion of the first connection via 513 where the first type transmission portion 313 is not provided may be filled with the third insulating layer 23 , but is not limited thereto.

[0108] For example, as shown in FIG1 , at least one first sub-transmission portion 41 located in the active semiconductor layer 63 includes a first sub-transmission portion 414 extending along a first direction X, the plurality of first-type transmission portions 31 may include a first-type transmission portion 314 extending along a second direction Y, and the first connection via 51 located in the first insulating layer 21 includes a first connection via 514 that electrically connects the first sub-transmission portion 414 to the first-type transmission portion 314. For example, for clarity, FIG11 shows a schematic diagram of a partial structure corresponding to the first connection via 514 in FIG1 ; FIG12 is a schematic cross-sectional view of the partial structure of the display substrate shown in FIG11 taken along line B4-B4'; and FIG13 is a schematic cross-sectional view of the partial structure of the display substrate shown in FIG11 taken along line A4-A4'.

[0109] For example, as shown in Figures 1 and 11, the first type transmission portion 314 extends along the second direction Y, and the first sub-transmission portion 414 extends along the first direction X. The signal transmission direction of the first type transmission portion 314 is the second direction Y, and the signal transmission direction of the first sub-transmission portion 414 is the first direction X. For example, in some embodiments of the present disclosure, when multiple insulating layers are disposed between the first sub-transmission portion 414 and the first type transmission portion 314, for example, as shown in Figure 2, a second insulating layer 22 located on a side of the first insulating layer 21 away from the base substrate 10 is further disposed between the first sub-transmission portion 414 and the first type transmission portion 314, the first connection via 514 penetrates the second insulating layer 22 and the first insulating layer 21 in the third direction Z, but the present disclosure is not limited thereto. For example, only the first insulating layer 21 may be disposed between the first sub-transmission portion 414 and the first type transmission portion 314, and the embodiments of the present disclosure are not limited thereto.

[0110] For example, as shown in Figures 1, 11, and 12, the first type transmission portion 314 includes a portion located within the first connection via 514 and a portion overlapping with an edge of the first connection via 514 and extending along the second direction Y. In the second direction Y, the portion of the first type transmission portion 314 overlapping with the edge of the first connection via 514 and extending along the second direction Y may be located on both sides of the first connection via 514, so that the size of the portion of the first type transmission portion 314 located within the first connection via 514 in the second direction Y is equal to the size of the first connection via 514 in the second direction Y, thereby facilitating signal transmission by the first type transmission portion 314.

[0111] For example, as shown in Figures 1, 11, and 12, the first sub-transmission portion 414 includes a portion located within the first connection via 514, and a portion overlapping with the edge of the first connection via 514 and extending along the first direction X. In the signal transmission direction of the first-type transmission portion 314, i.e., the second direction Y, the size of the portion of the first sub-transmission portion 414 located within the first connection via 514 is equal to the size of the first connection via 514, thereby ensuring sufficient contact area with the first-type transmission portion 314 and preventing the first-type transmission portion 314 located within the first connection via 514 from "climbing" to connect with the first sub-transmission portion 414. This ensures that the first-type transmission portion 314 located within the first connection via 514 is structurally smoother and more uniform, facilitating signal transmission.

[0112] For example, as shown in Figures 1, 11 and 13, the orthographic projection of at least a portion of one edge of the first sub-transmission portion 414 extending along the second direction Y on the base substrate falls within the orthographic projection of the first connection via 514 on the base substrate, and the orthographic projections of portions of two opposite edges of the first-type transmission portion 314 extending along the second direction Y on the base substrate both fall within the orthographic projection of the first connection via 514 on the base substrate.

[0113] For example, as shown in Figures 1, 11, and 13, in the first direction X, the size of the portion of the first-type transmission portion 314 located in the first connection via 514 is smaller than the size of the first connection via 514, and the size of the portion of the first sub-transmission portion 414 located in the first connection via 514 is also smaller than the size of the first connection via 514. For example, at least portions of two opposing edges of the first-type transmission portion 314 extending along the second direction Y are both located in the first connection via 514, and at least portions of one edge of the first sub-transmission portion 414 extending along the second direction Y are both located in the first connection via 514. As a result, the sizes of the portions of the first-type transmission portion 314 and the first sub-transmission portion 414 overlapping with the first connection via 514 can be reduced, thereby reducing the layout area occupied by the first-type transmission portion 314 and the first sub-transmission portion 414, thereby saving layout space.

[0114] For example, as shown in Figure 2, the multiple second transmission parts 40 also include at least one second sub-transmission part 42 located between the conductive layer 30 and the active semiconductor layer 63, the insulating layer 20 in the display substrate 01 includes a second insulating layer 22 located between the multiple first transmission parts 30 and the second sub-transmission parts 42, the multiple connecting vias 50 include second connecting vias 52 located in the second insulating layer 22 (as shown in Figure 1), the multiple first transmission parts 30 include second type transmission parts 32, and the second type transmission parts 32 are connected to the second sub-transmission parts 42 through the second connecting vias 52.

[0115] For example, as shown in Figure 2, the second sub-transmission part 42 can be located in a layer where the gate line is located. For example, the second sub-transmission part 42 can be at least a part of a gate line, but is not limited to this. For example, the second sub-transmission part 42 can be made of molybdenum, but is not limited to this. For example, at least one second sub-transmission part 42 can include a plurality of second sub-transmission parts 42, and the plurality of first sub-transmission parts 42 can have different shapes and extension directions. For example, the plurality of first sub-transmission parts 42 can be configured to be electrically connected to different signal lines to transmit different electrical signals. For example, the first transmission part 30 can be a part of a signal line, and after the first transmission part 30 is connected to the first sub-transmission part 42 through the first connecting via 52, it can transmit electrical signals with the first sub-transmission part 42, but is not limited to this.

[0116] For example, as shown in Figures 1 and 2 , at least one second sub-transmission portion 42 located between the conductive layer 30 and the active semiconductor layer 63 includes a second sub-transmission portion 421 extending along the second direction Y, the plurality of second-type transmission portions 32 may include a second-type transmission portion 315 extending along the second direction Y, and the second connection via 52 located in the second insulating layer 22 includes a second connection via 521 that electrically connects the second sub-transmission portion 421 and the second-type transmission portion 315. For clarity, Figure 14 shows a schematic diagram of a partial structure corresponding to the second connection via 521 in Figure 1 ; Figure 15 is a schematic cross-sectional view of the partial structure of the display substrate shown in Figure 14 taken along line B5-B5'; and Figure 16 is a schematic cross-sectional view of the partial structure of the display substrate shown in Figure 14 taken along line A5-A5'.

[0117] For example, as shown in Figures 1, 14 and 15, the second type transmission portion 315 and the second sub-transmission portion 421 both extend along the second direction Y, and the signal transmission direction of the second type transmission portion 315 and the second sub-transmission portion 421 is the second direction Y.

[0118] For example, as shown in Figures 1, 14, and 15, the second-type transmission portion 315 includes a portion located in the second connection via 521, and a portion overlapping with the edge of the second connection via 521 and extending along the second direction Y. In the second direction Y, the portion of the second-type transmission portion 315 that overlaps with the edge of the second connection via 521 and extends along the second direction Y can be located on both sides of the second connection via 521, so that the size of the portion of the second-type transmission portion 315 located in the second connection via 521 in the second direction Y is equal to the size of the second connection via 521 in the second direction Y, thereby facilitating signal transmission by the second-type transmission portion 315.

[0119] For example, as shown in Figures 1, 14, and 15, the second sub-transmission portion 421 includes a portion located in the second connection via 521, and a portion overlapping with the edge of the second connection via 521 and extending along the second direction Y. In the signal transmission direction of the second sub-transmission portion 421, that is, in the second direction Y, the size of the portion of the second sub-transmission portion 421 located in the second connection via 521 is equal to the size of the second connection via 521, so as to ensure sufficient contact area with the second-type transmission portion 315, avoid the second-type transmission portion 315 located in the second connection via 521 from connecting to the second sub-transmission portion 421 by "climbing", and make the second-type transmission portion 315 located in the second connection via 521 more smooth and uniform in structure, facilitating signal transmission.

[0120] For example, as shown in Figures 1, 14, and 16, the orthographic projections of two opposite edges of the second-type transmission portion 315 extending along the second direction Y on the base substrate both fall within the orthographic projections of the second connection via 521 on the base substrate. The orthographic projections of two opposite edges of the second sub-transmission portion 421 extending along the second direction Y on the base substrate both fall within the orthographic projections of the second connection via 521 on the base substrate.

[0121] For example, as shown in Figures 1, 14, and 16, in the first direction X, the size of the portion of the second-type transmission portion 315 located in the second connection via 521 is smaller than the size of the second connection via 521, and the size of the portion of the second sub-transmission portion 421 located in the second connection via 521 is also smaller than the size of the second connection via 521. For example, at least portions of two opposing edges of the second-type transmission portion 315 extending along the second direction Y are both located in the second connection via 521, and at least portions of two opposing edges of the second sub-transmission portion 421 extending along the second direction Y are both located in the second connection via 521. As a result, the sizes of the second-type transmission portion 315 and the second sub-transmission portion 421 in the first direction X can be reduced, thereby reducing the layout area occupied by the second-type transmission portion 315 and the second sub-transmission portion 421, thereby saving layout space.

[0122] For example, as shown in FIG1 , the maximum dimension of the connection via 50 in the second direction Y is greater than the maximum dimension of the connection via 50 in the first direction X. For example, the maximum dimension of any of the first connection vias 51, such as the first connection via 511, the first connection via 512, the first connection via 513, and the first connection via 514, in the second direction Y is greater than its maximum dimension in the first direction X, but the present invention is not limited thereto. For example, the maximum dimension of any of the second connection vias 52, such as the second connection via 521, in the second direction Y is greater than its maximum dimension in the first direction X, but the present invention is not limited thereto. For example, the orthographic projection of the connection via 50 on the substrate is rectangular or elliptical, which is not limited to this embodiment of the present disclosure.

[0123] Such a configuration can reduce the space occupied by the connecting vias 50 in the first direction X, thereby reducing the space occupied by the signal lines overlapping with each connecting via 50 (for example, each first transmission portion 30 extending along the second direction Y) in the first direction X, thereby reducing the risk of crosstalk between adjacent signal lines.

[0124] For example, as shown in FIG1 , the size of the connecting via 50 in the second direction Y can be 2 μm to 2.1 μm, and the size of the connecting via 50 in the first direction X can be 1.4 μm to 1.5 μm. For example, the size of the connecting via 50 in the second direction Y can be 2 μm to 2.05 μm or 2.05 μm to 2.10 μm, but is not limited thereto. For example, the size of the connecting via 50 in the first direction X can be 1.4 μm to 1.45 μm or 1.45 μm to 1.50 μm, but is not limited thereto. Such an arrangement helps to reduce the space occupied by each connecting via 50 in a high pixel density layout, thereby improving the display effect.

[0125] For example, as shown in Figures 1 and 2, at least one second sub-transmission portion 42 located between the conductive layer 30 and the active semiconductor layer 63 also includes a second sub-transmission portion 422 extending along the second direction Y, the multiple second type transmission portions 32 may include a second type transmission portion 316 extending along the second direction Y, and the second connection via 52 located in the second insulating layer 22 includes a second connection via 522 that electrically connects the second sub-transmission portion 422 and the second type transmission portion 316.

[0126] For example, the partial structure corresponding to the second connecting via 522 in Figure 1 can be seen in Figures 14 to 16. For example, the orthographic projections of the two opposing edges of the second-type transmission portion 316 extending along the second direction Y on the substrate both fall within the orthographic projection of the second connecting via 522 on the substrate. The orthographic projections of the two opposing edges of the second sub-transmission portion 422 extending along the second direction Y on the substrate also both fall within the orthographic projection of the second connecting via 522 on the substrate. This can reduce the layout area occupied by the second-type transmission portion 316 and the second sub-transmission portion 422, saving layout space.

[0127] For example, as shown in FIG2 , the plurality of second transmission portions 40 may further include at least one third sub-transmission portion 43 located on the side of the conductive layer 30 away from the base substrate 10 , and the third sub-transmission portion 43 is located between the first electrode 611 and the conductive layer 30 . For example, the third sub-transmission portion 43 may be made of a composite material including Ti / Al / Ti stacked in sequence, but is not limited thereto. For example, the first electrode 611 may be made of indium tin oxide (ITO) or indium zinc oxide (IZO), but is not limited thereto. For example, as shown in FIG2 , the insulating layer 20 in the display substrate 01 includes a third insulating layer 23 and a fourth insulating layer 24 located between the first type transmission portion 31 and the at least one third sub-transmission portion 43 , and the third insulating layer 23 is located between the fourth insulating layer 24 and the base substrate 10 .

[0128] For example, as shown in FIG2 , the plurality of connection vias 50 include a third connection via 531 located in the third insulating layer 23 and a fourth connection via 532 located in the fourth insulating layer 24. The third connection via 531 communicates with the fourth connection via 532, and the inner diameter of the third connection via 531 is smaller than the inner diameter of the fourth connection via 532. The plurality of first transmission portions 30 in the display substrate include a third-type transmission portion 33, and the third-type transmission portion 33 is connected to the third sub-transmission portion 43 via the third connection via 531 and the fourth connection via 532. For example, as shown in FIG1 and FIG2 , the third-type transmission portion 33 and the first-type transmission portion 314 may be two connected portions of the same first transmission portion 30, with at least a portion of the third-type transmission portion 33 connected to the third sub-transmission portion 43, and at least a portion of the first-type transmission portion 314 connected to the first sub-transmission portion 414, but the present invention is not limited thereto.

[0129] For example, for clarity of illustration, Figure 17 shows a schematic diagram of the local structure corresponding to the third connecting via 531 and the fourth connecting via 532 in Figure 1; Figure 18 is a schematic cross-sectional diagram of the local structure of the display substrate shown in Figure 17 taken along line B6-B6'; and Figure 19 is a schematic cross-sectional diagram of the local structure of the display substrate shown in Figure 17 taken along line A6-A6'.

[0130] For example, as shown in Figures 1, 17, and 18, the third type transmission portion 33 may include a third type transmission portion 331, and the third connection via 531 and the fourth connection via 532 are connected to each other as a sleeve hole extending along the third direction Z. For example, adopting this design approach can reduce the impact of the third sub-transmission portion 43 on the third type transmission portion 331 during the formation process. For example, in some embodiments of the present disclosure, the third sub-transmission portion 43 and the third type transmission portion 331 can be made of the same material. For example, during the process of forming the third sub-transmission portion 43 using an etching solution, the etching solution entering the fourth connection via 532 may be blocked outside the third connection via 531 by the third insulating layer 23. Therefore, adopting this sleeve hole form can reduce the risk of the etching solution etching the third type transmission portion 331.

[0131] For example, as shown in Figures 1, 17, and 18, the maximum dimension of the third connection via 531 in the second direction Y and the maximum dimension in the first direction X are both 1 μm to 1.1 μm, for example, 1.05 μm to 1.09 μm or 1.03 μm to 1.07 μm, but are not limited thereto. For example, the distance K1 between the inner wall of the third connection via 531 and the inner wall of the fourth connection via 532 is 0.7 μm to 0.8 μm, for example, 0.73 μm to 0.78 μm or 0.75 μm to 0.79 μm, but are not limited thereto.

[0132] For example, as shown in Figures 1 and 17, the third type transmission portion 331 extends along the second direction Y, the third sub-transmission portion 43 extends along the first direction X, the signal transmission direction of the third type transmission portion 331 is the second direction Y, and the signal transmission direction of the third sub-transmission portion 43 is the first direction X.

[0133] For example, as shown in Figures 1, 17, and 18, the third type transmission portion 331 includes a portion located within the third connection via 531 and a portion overlapping with an edge of the third connection via 531 and extending along the second direction Y. In the second direction Y, the portions of the third type transmission portion 331 overlapping with an edge of the third connection via 531 and extending along the second direction Y may be located on both sides of the third connection via 531, such that the size of the portion of the third type transmission portion 331 located within the third connection via 531 in the second direction Y is equal to the size of the third connection via 531 in the second direction Y, thereby facilitating signal transmission by the third type transmission portion 331.

[0134] For example, as shown in Figures 1, 17, and 18, the third sub-transmission portion 43 includes a portion located in the third connection via 531, a portion located in the fourth connection via 532, and a portion overlapping the edge of the fourth connection via 532. For example, the third sub-transmission portion 43 extends along the first direction X, so that the third sub-transmission portion 43 includes a portion overlapping the edge of the fourth connection via 532 and extending along the first direction X. For example, the third sub-transmission portion 43 also includes a portion overlapping the edge of the fourth connection via 532 and extending along the second direction Y, so that the orthographic projection of the fourth connection via 532 on the base substrate falls within the orthographic projection of the third sub-transmission portion 43 on the base substrate 10, thereby reducing the risk of the third sub-transmission portion 43 breaking at the edge of the fourth connection via 532 and failing to electrically connect with the third-type transmission portion 331.

[0135] For example, the region where the third sub-transmission portion 43 may be fractured may be the edge portion M of the fourth connection via 532 shown in FIG17 , but is not limited thereto. For example, in the second direction Y, the distance U1 between the edge of the third sub-transmission portion 43 extending along the first direction X and the fourth connection via 532 may be 2.7 μm to 2.8 μm, for example, at least one of 2.73 μm to 2.75 μm, 2.74 μm to 2.76 μm, and 2.75 μm to 2.78 μm, but is not limited thereto.

[0136] For example, as shown in Figures 1, 17, and 18, the orthographic projection of another third-type transmission portion 332, which is adjacent to and spaced apart from the third-type transmission portion 331, on the base substrate falls within the orthographic projection of the fourth insulating layer 24 on the base substrate. For example, because the third-type transmission portion 331 and the third-type transmission portion 332, which are adjacent and spaced apart in the first direction X, are configured to transmit different signals, the fourth insulating layer 24 covering the side of the third-type transmission portion 332 away from the base substrate can reduce the risk of the third sub-transmission portion 43 shorting with the third-type transmission portion 332 while being electrically connected to the third-type transmission portion 331.

[0137] For example, as shown in Figures 1, 17, and 19, the orthographic projections of two opposing edges of the third-type transmission portion 331 extending along the second direction Y on the substrate both fall within the orthographic projections of the fourth connection via 532 on the substrate. For example, in the first direction X, the size of the portion of the third-type transmission portion 331 located within the fourth connection via 532 is smaller than the size of the fourth connection via 532, thereby reducing the size of the portion where the third-type transmission portion 331 overlaps with the fourth connection via 532, thereby reducing the layout area occupied by the third-type transmission portion 331 and conserving layout space. For example, in the first direction X, the size of the portion of the third-type transmission portion 331 located within the fourth connection via 532 is larger than the size of the third connection via 531, thereby facilitating a good electrical connection with the third sub-transmission portion 43.

[0138] For example, as shown in Figures 1, 17, and 19, the third sub-transmission portion 43 extends along the first direction X, and the third sub-transmission portion 43 completely covers the fourth connection via 532. For example, in the first direction X, the size of the portion of the third sub-transmission portion 43 located in the fourth connection via 532 is the same as the size of the fourth connection via 532, and the third sub-transmission portion 43 also includes a portion that overlaps with the edge of the fourth connection via 532 and extends along the first direction X, thereby enabling a good electrical connection with the third sub-transmission portion 43.

[0139] For example, as shown in FIG. 2 , the display substrate 01 further includes an anode insulating layer 25 between the first electrode 611 and the third sub-transmitting portion 43 . The anode insulating layer 25 includes an anode connection hole 54 , and the first electrode 611 is connected to the third sub-transmitting portion 43 through the anode connection hole 54 .

[0140] For example, as shown in FIG1 , the display substrate 01 further includes another fourth connection via 5321 disposed adjacent to the anode connection hole 54, and a third connection via 5311 located on a side of the fourth connection via 5321 closer to the base substrate. The orthographic projection of the anode connection hole 54 on the base substrate does not overlap with the orthographic projection of the fourth connection via 5321 on the base substrate. For example, the anode connection hole 54 and the fourth connection via 5321 are arranged sequentially in the first direction X, but this is not limited thereto.

[0141] For clarity of illustration, Figure 20 shows a schematic diagram of the local structure corresponding to the anode connection hole 54 and the fourth connection via 5321 in Figure 1; Figure 21 is a schematic cross-sectional view of the local structure of the display substrate shown in Figure 20 taken along line B7-B7'; and Figure 22 is a schematic cross-sectional view of the local structure of the display substrate shown in Figure 20 taken along line A7-A7'.

[0142] For example, as shown in Figures 1, 20, and 21, the anode insulating layer 25 may include a first anode insulating sublayer 251 and a second anode insulating sublayer 252, wherein the second anode insulating sublayer 252 is further away from the first electrode 611 than the first anode insulating sublayer 251. The anode connection holes 54 include a first anode connection hole 541 located in the first anode insulating sublayer 251 and a second anode connection hole 542 located in the second anode insulating sublayer 252. The first anode connection hole 541 is connected to the second anode connection hole 542, and the first electrode 611 is connected to the third sub-transmission portion 43 through the first anode connection hole 541 and the second anode connection hole 542. For example, the first anode connection hole 541 and the second anode connection hole 542 are connected to each other to form a sleeve hole extending along the third direction Z. For example, adopting this design can reduce the impact of the anode insulating layer 25 on the third sub-transmission portion 43 during the formation process. For example, the orthographic projection of the anode connection hole 54 on the base substrate falls within the orthographic projection of the first electrode 611 on the base substrate, and falls within the orthographic projection of the third sub-transmission portion 43 on the base substrate, so that the anode connection hole 54 can effectively electrically connect the first electrode 611 and the third sub-transmission portion 43.

[0143] For example, as shown in Figures 20 and 22, the first electrode 611 is connected to the third sub-transmission part 43 through the first anode connection hole 541 and the second anode connection hole 542, the third type transmission part 33 includes a third type transmission part 333, and the third type transmission part 333 is connected to the third sub-transmission part 43 through the third connection via 531 and the fourth connection via 532, and the anode connection hole 54 and the fourth connection via 5321 are staggered with each other in the first direction X, which is beneficial to the process and enables the first electrode 611 to be effectively electrically connected to the first transmission part 316.

[0144] For example, as shown in Figure 20, the orthographic projections of at least a portion of the edge 3101 of the third type transmission portion 333 extending along the second direction Y and away from the anode connection via 54 and at least a portion of the edge 3102 extending along the first direction X on the substrate fall within the orthographic projection of the fourth connection via 5321 on the substrate.

[0145] For example, as shown in Figures 20 and 22, the portion of the third-type transmission portion 333 that connects to the fourth connection via 532 includes the end of the third-type transmission portion 333. By positioning at least a portion of an edge 3101 of the third-type transmission portion 333 extending in the second direction Y and away from the anode connection via 540 within the fourth connection via 532, the size of the third-type transmission portion 333 in the first direction X can be reduced, thereby facilitating a reduction in the layout area occupied by the third-type transmission portion 333. For example, by positioning a portion of an edge 3102 of the third-type transmission portion 333 extending in the first direction X within the fourth connection via 532, the size of the third-type transmission portion 333 in the second direction Y can be reduced, thereby facilitating a reduction in layout space.

[0146] FIG23 is a schematic diagram of a pixel circuit corresponding to a display substrate provided in at least one embodiment of the present disclosure. As shown in FIG23 , the pixel circuit includes a data write transistor T1, a first reset transistor T2, a second reset transistor T3, a light emission control transistor T4, a drive transistor T5, and a storage capacitor Cst. For example, the pixel circuit shown in FIG1 may have a 5T1C circuit structure (i.e., five transistors and one capacitor).

[0147] For example, as shown in Figures 1 and 23, the gate of the driving transistor T5 is electrically connected to the second electrode of the data write transistor T1 and the second electrode of the first reset transistor T2, the first electrode of the driving transistor T5 is electrically connected to the second electrode of the light emitting control transistor T4, and the second electrode of the driving transistor T5 is electrically connected to the first end of the light emitting element EL and the second electrode of the second reset transistor T3. For example, the first electrode of the data write transistor T1 is configured to be electrically connected to the data line Data to receive the data signal, the gate of the data write transistor T1 is electrically connected to the first gate line G1_ODD and is configured to write the data signal to the gate of the driving transistor T5 in response to the first control signal. For example, the first electrode of the first reset transistor T2 is electrically connected to the reset signal line Vref, the gate of the first reset transistor T2 is electrically connected to the second gate line G2 and is configured to transmit the reference voltage to the gate of the driving transistor T5 in response to the second control signal. For example, a first electrode of the second reset transistor T3 is electrically connected to the reset signal line Vini, a gate of the second reset transistor T3 is electrically connected to the third gate line G3, and is configured to transmit an initialization voltage to the second electrode of the driving transistor T5 and the first terminal of the light-emitting element EL in response to a third control signal. For example, a first electrode of the light-emitting control transistor T4 is electrically connected to the first power supply ELVDD, a gate of the light-emitting control transistor T4 is electrically connected to the light-emitting control signal line EM, and is configured to transmit the first power supply voltage to the first electrode of the driving transistor T5 in response to the light-emitting control signal. For example, a first plate of the storage capacitor Cst is electrically connected to the gate of the driving transistor T5, a second plate of the storage capacitor Cst is electrically connected to the second electrode of the driving transistor T5, and the storage capacitor Cst is configured to store a data signal. For example, a second terminal of the light-emitting element EL is electrically connected to the second power supply ELVSS. For example, a capacitor Coled is further provided in parallel across both ends of the light-emitting element EL.

[0148] For example, as shown in FIG23 , the driving method of the pixel circuit includes: a reset stage, a compensation stage, a data writing stage and a light emitting stage.

[0149] For example, in the reset stage, the signals of the second gate line G2 and the third gate line G3 are both high levels, the signals of the first gate line G1_ODD and the light-emitting control signal line EM are both low levels, the second control signal and the third control signal are input, the first reset transistor T2 and the second reset transistor T3 are turned on, the data writing transistor T1 and the light-emitting control transistor T4 are turned off, the reference voltage is transmitted to the gate of the driving transistor T5 through the first reset transistor T2 to reset the gate of the driving transistor T5, and the initialization voltage is transmitted to the second electrode of the driving transistor T5 and the first end of the light-emitting element EL through the second reset transistor T3 to reset the second electrode of the driving transistor T5 and the first end of the light-emitting element EL.

[0150] For example, in the compensation stage, the signals of the second gate line G2 and the light-emitting control signal line EM are at a high level, the signals of the first gate line G1_ODD and the third gate line G3 are both at a low level, the second control signal and the light-emitting control signal are input, the first reset transistor T2 is kept turned on, the data writing transistor T1 and the second reset transistor T3 are turned off, and the light-emitting control transistor T4 and the driving transistor T5 are turned on, and the second electrode of the driving transistor T5 is charged by the first power supply VDD to compensate the driving transistor T5.

[0151] For example, in the data writing stage, the signal of the first gate line G1_ODD is at a high level, the signals of the second gate line G2, the third gate line G3 and the light-emitting control signal line EM are all at a low level, the data writing transistor T1 is turned on, and the other transistors are turned off. The voltage of the gate of the driving transistor T5 jumps from the reference voltage to the data voltage, the voltage of the two plates of the storage capacitor Cst jumps accordingly, and the storage capacitor Cst is charged.

[0152] For example, in the light-emitting phase, the voltage of the light-emitting control signal line EM is at a high level, the voltages of the first gate line G1_ODD, the second gate line G2, and the third gate line G3 are all at a low level, the light-emitting control transistor T4 and the driving transistor T5 are turned on to generate a driving current, thereby driving the light-emitting element EL to emit light. The data writing transistor T1, the first reset transistor T2, and the second reset transistor T3 are turned off.

[0153] Currently, transistor compensation methods are divided into internal compensation and external compensation. Since internal compensation is adaptive and the external driver integrated circuit (IC) is simple, pixels with the pixel circuit shown in Figure 23 are widely used in small-sized display devices.

[0154] FIG. 24 shows a schematic diagram of a partial structure corresponding to the first connecting via 511 in FIG. 1 in another embodiment of the present disclosure.

[0155] For example, in some embodiments of the present disclosure, referring to FIG. 1 , the display substrate 01 may further include a first adjacent transmission portion 3111 and a second adjacent transmission portion adjacent to the first transmission portion 30, such as the first type transmission portion 311, in the first direction X and arranged at intervals, and the first adjacent transmission portion 3111 is closer to the first type transmission portion 311 than the second adjacent transmission portion.

[0156] For example, referring to Figures 1 and 24, the first type transmission portion 311 may include a first edge 3110 close to the first adjacent transmission portion 3111 and a second edge 3112 close to the second adjacent transmission portion, the first edge 3110 and the second edge 3112 both extend along the second direction Y, and the area of ​​the portion of the orthographic projection of the first edge 3110 on the base substrate that falls into the connection via is greater than the area of ​​the portion of the orthographic projection of the second edge 3112 on the base substrate that falls into the connection via. For example, the connection via may be the first connection via 511 corresponding to the first type transmission portion 311, but is not limited thereto.

[0157] For example, referring to Figures 1 and 24, in the first direction X, when the space between the first-type transmission portion 311 and the first adjacent transmission portion 3111 is small, and the space between the first-type transmission portion 311 and the second adjacent transmission portion is relatively loose, the portion of the second edge 3112 of the first-type transmission portion 311 that falls within the first connection via 511 can be reduced, thereby increasing the contact area between the first-type transmission portion 311 and the first sub-transmission portion 411 in the first connection via 511, thereby improving signal transmission efficiency. For example, as shown in Figure 24, only at least a portion of the first edge 3110 can be made to fall within the first connection via 511, while the second edge 3112 can be located outside the first connection via 511. For example, in some embodiments of the present disclosure, a portion of the second edge 3112 can also fall within the first connection via 511, and the orthographic projection of this portion on the substrate can be smaller than the orthographic projection of the portion of the first edge 3110 that falls within the first connection via 511, but the present invention is not limited thereto. For example, the orthographic projection area of ​​the portion of the second edge 3112 that falls into the first connecting via 511 on the substrate can be at least one of 20% to 60%, 30% to 50%, 35% to 45%, 40% to 55%, and 25% to 30% of the orthographic projection area of ​​the portion of the first edge 3110 that falls into the first connecting via 511 on the substrate, which can be specifically set according to the layout space.

[0158] Such a configuration can improve the signal transmission efficiency while saving the space between the first type transmission portion 311 and the first adjacent transmission portion 3111 .

[0159] Similarly, the above design is not limited to the first type transmission portion 311 , and other first transmission portions in the display substrate 01 may also be designed accordingly according to the layout space, and the embodiments of the present disclosure are not limited thereto.

[0160] For example, in some embodiments of the present disclosure, referring to FIG1 , depending on the signal transmitted by the first transmission portion, the orthographic projection area of, for example, the portion of the third-type transmission portion 331 located in the fourth connection via 532 on the substrate substrate can be larger than the orthographic projection area of, for example, the portion of the first-type transmission portion 313 located in the first connection via 513 on the substrate substrate. For example, the first-type transmission portion 313 can transmit the initialization voltage signal shown in FIG23 in the above-described embodiment, and the third-type transmission portion 331 can transmit the first power supply ELVDD in the above-described embodiment, but the present invention is not limited thereto. This configuration can provide a larger overlapping area between the third-type transmission portion 331 and the third sub-transmission portion 43 (shown in FIG2 ) in the fourth connection via 532, thereby facilitating signal transmission of the first power supply ELVDD and improving signal transmission efficiency.

[0161] For example, in some embodiments of the present disclosure, the data line Data in the display substrate 01 is shown in Figure 1. For example, when the data line Data is connected to other signal lines through a via, the orthographic projection of the data line Data on the base substrate completely covers the orthographic projection of the via on the base substrate, so that the data signal can be effectively transmitted, but is not limited to this.

[0162] At least one embodiment of the present disclosure further provides a display device comprising any of the aforementioned display substrates. Figure 25A is a schematic diagram of a display device provided by one embodiment of the present disclosure. As shown in Figure 25A , the display device 1000 comprises a display substrate 100. Display substrate 100 is any of the aforementioned display substrates. Therefore, the technical effects of the aforementioned display substrates can also be realized in this display device and will not be further elaborated here.

[0163] FIG25B is a schematic diagram of another display device provided according to an embodiment of the present disclosure.

[0164] For example, as shown in FIG25B , according to at least one embodiment of the present disclosure, the display device 1000 further includes a plurality of sub-pixels 60 and a light-splitting structure 70. The plurality of sub-pixels 60 are located on the base substrate 10. The light-splitting structure 70 is disposed on the light-emitting side of the display substrate 01 and is configured to direct light emitted by the plurality of sub-pixels 60 toward different viewpoints. The light-splitting structure 70 includes a plurality of light-splitting portions 701 extending along a first direction X and arranged along a second direction Y, and the light-splitting portions 701 include lenses.

[0165] For example, the display device provided in the embodiments of the present disclosure is a 3D display device. As shown in FIG25B , a single spectrometer 701 may be provided with multiple sub-pixels 60, for example, corresponding to multiple sub-pixels 60 of different colors. For example, each sub-pixel 60 may include multiple display units, and the multiple display units included in each sub-pixel may display images corresponding to the left and right eyes of the human eye, respectively. Thus, the multiple viewpoint image information displayed by each sub-pixel can form a naked-eye 3D image after passing through the corresponding spectrometer.

[0166] For example, the light splitting portion 701 may include a cylindrical lens, but is not limited thereto. For example, the size of the light splitting portion 701 along the second direction Y and the distance from the display substrate 01 in the third direction Y may be set according to design requirements, and the embodiments of the present disclosure are not limited thereto.

[0167] The display substrate mentioned in the embodiments of the present disclosure may also be referred to as a display panel. For example, the display substrate may be a flexible display substrate, but is not limited thereto. For example, the display device 1000 may be a display device such as an organic light-emitting diode display device, as well as any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigation system, including the display device. The embodiments of the present disclosure include but are not limited to these.

[0168] At least one embodiment of the present disclosure further provides a method for manufacturing a display substrate, comprising: forming an insulating layer, a conductive layer, and a plurality of second transmission portions on a base substrate, wherein the conductive layer is located on one side of the insulating layer, and the plurality of second transmission portions are located on a side of the insulating layer away from the conductive layer. For example, the second transmission portions may be located on a side of the conductive layer away from the base substrate, or on a side of the conductive layer closer to the base substrate, although this is not limited in the present disclosure. The following description will take the second transmission portions located on a side of the conductive layer away from the base substrate as an example.

[0169] 26 to 31 are schematic flow charts of a method for manufacturing a display substrate provided by at least one embodiment of the present disclosure.

[0170] For example, as shown in Figures 26 and 27, forming the conductive layer includes depositing a first transmission layer 1010 on a base substrate 10, and patterning the first transmission layer 1010 to form a first pattern 10100. The first pattern 10100 includes a plurality of first transmission portions 1011. For example, the first transmission portion 1011 may correspond to the first transmission portion 30 in Figure 2 of the above embodiment, but is not limited thereto.

[0171] For example, as shown in FIG28 , forming the insulating layer includes depositing an insulating layer 1020 on one side of the first transmission portion 1011, and patterning the insulating layer 1020 so that the insulating layer 1020 includes at least one connection via 1021. For example, the insulating layer 1020 may correspond to the third insulating layer 23 and the fourth insulating layer 24 in FIG2 of the above embodiment, but is not limited thereto.

[0172] For example, as shown in FIG. 29 , forming the plurality of second transmission parts includes forming a second transmission layer 1030 . For example, the second transmission layer 1030 is located on a side of the insulating layer 1020 away from the first transmission part 1011 , but is not limited thereto.

[0173] 30 , the second transmission layer 1030 is patterned to form a second pattern 10300, and the second pattern 10300 includes a plurality of second transmission portions 1031. For example, the insulating layer 1020 may correspond to the second transmission portion 40 in the above embodiment, such as the third sub-transmission portion 43 in FIG. 2 of the above embodiment, but is not limited thereto.

[0174] For example, as shown in FIG31 , the first transmission portion 1011 is electrically connected to the at least one second transmission portion 1031 through the at least one connecting via 1021. At the same time, since the second transmission portion 1031 has a retraction characteristic, in the final state, the orthographic projection of the edge of the at least one first transmission portion 1011 extending along the second direction Y (see FIG1 ) on the base substrate 10 falls within the orthographic projection of the connecting via 1021 on the base substrate 10, and the second direction Y intersects with the first direction X.

[0175] For example, as shown in FIG30 , in order to enable at least a portion of the edge of the first transmission portion 1011 extending along the second direction Y to retract into the connecting via 1021, the design should ensure that: the orthographic projection of a portion of the edge of at least one first transmission portion 1011 extending along the second direction Y on the base substrate 10 falls within the orthographic projection of the connecting via 1021 on the base substrate 10, including:

[0176] The distance between the edge of at least one first transmission portion 1011 extending along the second direction Y and the first connection via 1021 is set to Space, and Space satisfies the following formula:

[0177] In the formula, OL1 represents the minimum spacing between the routing in the first transmission layer 1010 and the corresponding design position, OL2 represents the minimum spacing between the routing in the second transmission layer 1030 and the corresponding design position, Tor1 represents the uniformity of the first pattern 10100, Tor2 represents the uniformity of the second pattern 10300, Bias1 represents the dimensional accuracy of the first pattern 10100, and Bias2 represents the dimensional accuracy of the second pattern 10300.

[0178] For example, in some embodiments of the present disclosure, as shown in Figure 31, Space can be 1μm~1.8μm, for example, it can be at least one of 1μm~1.5μm, 1.2μm~1.7μm, 1.3μm~1.6μm, 1.4μm~1.8μm, 1.5μm~1.7μm, 1μm~1.2μm, and 1.1μm~1.2μm. It can be specifically set according to design requirements, process environment, performance of the exposure machine, etc., and the embodiments of the present disclosure are not limited to this.

[0179] The embodiments of the present disclosure facilitate layout by positioning at least a portion of the edge of the first transmission portion extending along the second direction within the connecting via, thereby reducing the coverage area of ​​the first transmission portion outside the edge of the connecting via and reducing the space occupied by the first transmission portion in the first direction, thereby facilitating layout and improving display effects.

[0180] There are a few points to note:

[0181] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to conventional designs.

[0182] (2) Unless there is any conflict, the features of the same embodiment or different embodiments of the present disclosure may be combined with each other.

[0183] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure, which is determined by the appended claims.

Claims

1. A display substrate, comprising: substrate substrate; An insulating layer, located on the substrate; A conductive layer, located on one side of the insulating layer, the conductive layer comprising a plurality of first transmission parts arranged along a first direction; A plurality of second transmission parts, located on a side of the insulating layer away from the conductive layer; Wherein, at least one first transmission portion extends along the second direction, a plurality of connection vias are provided in the insulating layer, and the at least one first transmission portion is electrically connected to the at least one second transmission portion through the at least one connection via; An orthographic projection of at least part of at least one edge of the at least one first transmission portion extending along the second direction on the base substrate falls within an orthographic projection of the connecting via on the base substrate, and the second direction intersects the first direction.

2. The display substrate according to claim 1, wherein: The first transmission portion and the second transmission portion are made of different materials.

3. The display substrate according to claim 1 or 2, wherein: An orthographic projection area of ​​a portion where the first transmission portion and the second transmission portion overlap each other in the connecting via hole on the base substrate is 0.3 to 0.8 of an orthographic projection area of ​​the connecting via hole on the base substrate.

4. The display substrate according to any one of claims 1 to 3, further comprising a plurality of sub-pixels located on the base substrate, wherein: At least some sub-pixels include a light-emitting element and a pixel circuit, wherein the light-emitting element includes a light-emitting functional layer and a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the substrate, and the first electrode is located between the light-emitting functional layer and the substrate; the pixel circuit includes a plurality of transistors, and the first electrode of the light-emitting element is electrically connected to the transistor.

5. The display substrate according to claim 4, wherein: The pixel circuit comprises an active semiconductor layer, the active semiconductor layer comprises a channel region and a source / drain region of each transistor, and the active semiconductor layer is located between the conductive layer and the substrate; The plurality of second transmission parts include at least one first sub-transmission part located in the active semiconductor layer, the insulating layer includes a first insulating layer located between the conductive layer and the at least one first sub-transmission part, the plurality of connection vias include a first connection via located in the first insulating layer, The plurality of first transmission parts include a first type transmission part, and the first type transmission part is connected to the first sub-transmission part through the first connection via.

6. The display substrate according to claim 5, wherein: At least one first sub-transmission portion includes a first sub-transmission portion extending along the second direction, and at least part of the two opposite edges of the first sub-transmission portion extending along the second direction have their orthographic projections on the substrate substrate falling into the orthographic projections of the first connecting via on the substrate substrate, and at least part of the two opposite edges of the first type transmission portion extending along the second direction have their orthographic projections on the substrate substrate falling into the orthographic projections of the first connecting via on the substrate substrate.

7. The display substrate according to claim 5 or 6, wherein: The first type transmission portion includes an edge extending along the first direction, and an orthographic projection of at least a portion of the edge on the base substrate falls within an orthographic projection of the first connecting via on the base substrate.

8. The display substrate according to claim 6, wherein: The first sub-transmission portion extending along the second direction includes an edge extending along the first direction, and an orthographic projection of at least a portion of the edge on the base substrate falls within an orthographic projection of the first connecting via on the base substrate.

9. The display substrate according to claim 5, wherein: At least one first sub-transmission portion includes a first sub-transmission portion extending along the first direction, and at least a portion of an edge of the first sub-transmission portion extending along the first direction has an orthographic projection on the substrate substrate that falls within the orthographic projection of the first connecting via on the substrate substrate, and at least a portion of two opposite edges of the first type transmission portion extending along the second direction have an orthographic projection on the substrate substrate that falls within the orthographic projection of the first connecting via on the substrate substrate.

10. The display substrate according to claim 4, wherein: The pixel circuit comprises an active semiconductor layer, the active semiconductor layer comprises a channel region and a source / drain region of each transistor, and the active semiconductor layer is located between the conductive layer and the substrate; The multiple second transmission parts include at least one second sub-transmission part located between the conductive layer and the active semiconductor layer, the insulating layer includes a second insulating layer located between the multiple first transmission parts and the at least one second sub-transmission part, the multiple connecting vias include second connecting vias located in the second insulating layer, the multiple first transmission parts include a second type transmission part, and the second type transmission part is connected to the second sub-transmission part through the second connecting via.

11. The display substrate according to claim 10, wherein: The orthographic projection of at least part of the two opposite edges of the second type transmission portion extending along the second direction on the base substrate falls into the orthographic projection of the second connecting via on the base substrate, and the orthographic projection of at least part of the two opposite edges of the second sub-transmission portion extending along the second direction on the base substrate falls into the orthographic projection of the second connecting via on the base substrate.

12. The display substrate according to any one of claims 5 to 11, wherein: A maximum dimension of the connection via in the second direction is greater than a maximum dimension of the connection via in the first direction.

13. The display substrate according to claim 6 , further comprising a first adjacent transmission portion and a second adjacent transmission portion adjacent to the first transmission portion in the first direction and arranged at an interval, wherein the first adjacent transmission portion is closer to the first transmission portion than the second adjacent transmission portion. in, The first transmission portion includes a first edge close to the first adjacent transmission portion and a second edge close to the second adjacent transmission portion, the first edge and the second edge both extend along the second direction, and an area of ​​a portion of the orthographic projection of the first edge on the substrate that falls into the connecting via is greater than an area of ​​a portion of the orthographic projection of the second edge on the substrate that falls into the connecting via.

14. The display substrate according to claim 5, wherein: The plurality of second transmission parts include at least one third sub-transmission part located on a side of the conductive layer away from the base substrate, and the third sub-transmission part is located between the first electrode and the conductive layer. The insulating layer includes a third insulating layer and a fourth insulating layer located between the multiple first transmission parts and the at least one third sub-transmission part, the third insulating layer is located between the fourth insulating layer and the base substrate, the multiple connecting vias include a third connecting via located in the third insulating layer and a fourth connecting via located in the fourth insulating layer, the third connecting via is connected to the fourth connecting via, and the inner diameter of the third connecting via is smaller than the inner diameter of the fourth connecting via, the multiple first transmission parts include a third type transmission part, and the third type transmission part is connected to the third sub-transmission part through the third connecting via and the fourth connecting via.

15. The display substrate according to claim 14, wherein: An orthographic projection of at least a portion of two opposite edges of the third type transmission portion extending along the second direction on the base substrate falls within an orthographic projection of the fourth connection via on the base substrate.

16. The display substrate according to claim 15, wherein: The third sub-transmission portion extends along the first direction, and the orthographic projection of the fourth connecting via on the base substrate falls into the orthographic projection of the third sub-transmission portion on the base substrate.

17. The display substrate according to any one of claims 14 to 16, wherein: An orthographic projection area of ​​a portion of the third type transmission portion located in the fourth connection via on the base substrate is greater than an orthographic projection area of ​​a portion of the first type transmission portion located in the first connection via on the base substrate.

18. The display substrate according to any one of claims 14 to 16, wherein: The orthographic projection of another third type transmission portion adjacent to and arranged at an interval with the third type transmission portion on the base substrate falls within the orthographic projection of the fourth insulating layer on the base substrate.

19. The display substrate according to claim 14, further comprising: an anode insulating layer, located between the first electrode and the third sub-transmission portion, the anode insulating layer comprising an anode connection hole, and the first electrode is connected to the third sub-transmission portion through the anode connection hole; Wherein, the orthographic projection of the anode connection hole on the base substrate does not overlap with the orthographic projection of the fourth connection via on the base substrate; The orthographic projections of at least a portion of the edge of the third type transmission portion extending along the second direction and away from the anode connection via and at least a portion of the edge extending along the first direction on the base substrate fall within the orthographic projection of the third connection via on the base substrate.

20. A display device comprising the display substrate according to any one of claims 1 to 19.

21. The display device according to claim 20, further comprising A plurality of sub-pixels are located on the substrate; a light splitting structure, the light splitting structure being arranged at the light emitting side of the display substrate, the light splitting structure being configured to direct the light emitted by the plurality of sub-pixels to different viewpoint areas, in, The light splitting structure includes a plurality of light splitting parts extending along the first direction and arranged along the second direction, and the light splitting parts include lenses.

22. A method for manufacturing a display substrate, comprising: An insulating layer, a conductive layer and a plurality of second transmission parts are formed on a base substrate, wherein the conductive layer is located on one side of the insulating layer, and the plurality of second transmission parts are located on a side of the insulating layer away from the conductive layer. Wherein, forming the conductive layer includes forming a first transmission layer, and patterning the first transmission layer to form a first pattern, wherein the first pattern includes a plurality of first transmission parts; Forming the insulating layer includes patterning the insulating layer so that the insulating layer includes at least one connecting via; Forming the plurality of second transmission parts includes forming a second transmission layer, and patterning the second transmission layer to form a second pattern, wherein the second pattern includes the plurality of second transmission parts; Wherein, the at least one first transmission part is electrically connected to the at least one second transmission part through at least one connecting via, the orthographic projection of the edge of the at least one first transmission part extending along the second direction on the substrate falls into the orthographic projection of the connecting via on the substrate, and the second direction overlaps with the first direction.

23. The method for manufacturing a display substrate according to claim 22, wherein: The orthographic projection of a portion of the edge of the at least one first transmission portion extending along the second direction on the base substrate falls within the orthographic projection of the connecting via on the base substrate, comprising: The distance between the edge of the at least one first transmission portion extending along the second direction and the first connecting via hole is set to Space, and Space satisfies: Among them, OL1 represents the minimum spacing between the routing in the first transmission layer and the corresponding design position, OL2 represents the minimum spacing between the routing in the second transmission layer and the corresponding design position, Tor1 represents the uniformity of the first pattern, Tor2 represents the uniformity of the second pattern, Bias1 represents the dimensional accuracy of the first pattern, and Bias2 represents the dimensional accuracy of the second pattern.

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