Electronic device

Abstract

This electronic device is provided with a first electronic component, a sealing resin, and a first lead that comprises a first inner part and a first outer part. The first inner part comprises a first die pad part on which the first electronic component is mounted, and a first connection part that connects the first outer part and the first die pad part to each other. The first outer part is disposed on one side in a first direction with respect to the first die pad part. The first connection part is connected to a first side surface of the first die pad part. In a second direction, the center of the first outer part is located further toward one side in the second direction than the center of the first die pad part. The first side surface comprises a connection region that is connected to the first connection part, and a pair of side regions that are located on both sides of the connection region in the second direction.

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