Signal modulation method, chip and system, device, and storage medium

Abstract

Disclosed in embodiments of the present application are a signal modulation method, chip and system, a device, and a storage medium, which are applied to the field of cloud technology. The signal modulation chip comprises N first electrodes, N modulators, an input interface, and an output interface; the N first electrodes are distributed on different side edges of the signal modulation chip; one first electrode is connected to one modulator; the first electrode i is used for transmitting a received electric signal to the modulator i connected to the first electrode i; the first electrode i is any one of the N first electrodes; the modulator i is a modulator among the N modulators which is connected to the first electrode i; the input interface is used for transmitting a received optical signal to the modulator i; the modulator i is used for modulating the optical signal on the basis of the electric signal to obtain a modulated optical signal; and the output interface is used for outputting the modulated optical signal. The present application can enhance the performance of signal modulation chips.

Description

Signal modulation method, chip, system, device and storage medium

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on August 22, 2023, with application number 2023110586795 and application name “Signal Modulation Method, Chip, System, Device and Storage Medium”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to fields such as Internet technology, and in particular to a signal modulation method, chip, system, device and storage medium. Background Art

[0003] With the development of artificial intelligence and machine learning, applications such as natural language processing and machine vision are increasing, and the amount of data that needs to be transmitted is rapidly increasing. Optical transceiver modules are key components for high-speed data transmission in the current industrial stage. They play a vital role within and between data centers, and demand for them is growing year by year.

[0004] The manufacturing process of the signal modulation chip (silicon photonic chip) is compatible with the process of traditional electronic chips. It has the advantages of high integration, good reliability, and strong supply capacity, and has gradually become one of the main solutions for optical transceiver modules. At present, the cost of the signal modulation chip is strongly related to the chip area. Reducing the chip area can significantly reduce the chip cost and improve the chip competitiveness. Due to the process capability limitations of the printed circuit board used to deploy the signal modulation chip, and the purpose of reducing the crosstalk between the electrodes in the signal modulation chip, the spacing between adjacent electrodes in the signal modulation chip cannot be too small, which limits the reduction in the area of ​​the signal modulation chip. At present, the area of ​​the signal modulation chip is mainly reduced by reducing the length of the modulator, input interface, and output interface in the signal modulation chip, but this will reduce the performance of the signal modulation chip.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a signal modulation method, apparatus, device, and storage medium to improve the performance of a signal modulation chip.

[0007] In one aspect, an embodiment of the present application provides a signal modulation chip, comprising N first electrodes and N modulators, an input interface, and an output interface, wherein the N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, and N is an integer greater than 1;

[0008] The first electrode i is used to transmit the received electrical signal to the modulator i; i is a positive integer less than or equal to N; the first electrode i is any first electrode among the N first electrodes, and the modulator i is a modulator among the N modulators connected to the first electrode i;

[0009] The input interface is used to transmit the received optical signal to the modulator i;

[0010] The modulator i is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal;

[0011] The output interface is used to output the modulated optical signal.

[0012] In one aspect, an embodiment of the present application provides a signal modulation method applied to a signal modulation chip. The signal modulation chip includes N first electrodes and N modulators, an input interface, and an output interface. The N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, and N is an integer greater than 1. The method includes:

[0013] The received electrical signal is transmitted to the modulator i through the first electrode i; i is a positive integer less than or equal to N; the first electrode i is any first electrode among the N first electrodes, and the modulator i is a modulator connected to the first electrode i among the N modulators;

[0014] Transmitting the received optical signal to the modulator i through the input interface;

[0015] modulating the optical signal according to the electrical signal by the modulator i to obtain a modulated optical signal;

[0016] The modulated optical signal is output through the output interface.

[0017] In one aspect, an embodiment of the present application provides a signal modulation system, comprising a signal modulation chip, the signal modulation chip comprising N first electrodes and N modulators, an input interface, and an output interface, wherein the N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, and N is an integer greater than 1;

[0018] The first electrode i is used to transmit the received electrical signal to the modulator i; i is a positive integer less than or equal to N; the first electrode i is any first electrode among the N first electrodes, and the modulator i is a modulator among the N modulators connected to the first electrode i;

[0019] The input interface is used to transmit the received optical signal to the modulator i;

[0020] The modulator i is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal;

[0021] The output interface is used to output the modulated optical signal.

[0022] On one hand, an embodiment of the present application provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the above method are implemented.

[0023] On one hand, an embodiment of the present application provides a computer program product, including a computer program, which implements the steps of the above method when executed by a processor.

[0024] [Corrected 29.06.2024 according to Rule 91] In the present application, by disposing the N first electrodes in the signal modulation chip on different sides of the signal modulation chip, the number of first electrodes on each side is reduced, more space is available on the side for disposing the first electrodes, and the spacing restrictions between the first electrodes on the side are more easily met, thereby weakening the spacing restrictions between the N first electrodes, which is conducive to reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip. There is no need to reduce the length of the output interface, output interface, and modulator in the signal modulation chip, which can avoid problems such as sudden changes in electrical signals and optical signals during transmission, improve the performance of the signal modulation chip, and improve the modulation accuracy of the signal modulation chip for optical signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] [Corrected on 29.06.2024 according to Rule 91] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] FIG1a is a schematic diagram showing the distribution of first electrodes on the same side in a signal modulation chip provided by the present application;

[0027] FIG1b is a schematic diagram of the distribution of first electrodes on adjacent sides in a signal modulation chip provided by the present application;

[0028] FIG1c is a schematic diagram showing the distribution of first electrodes on adjacent sides in another signal modulation chip provided by the present application;

[0029] FIG1d is a schematic diagram of the distribution of first electrodes on adjacent sides in another signal modulation chip provided by the present application;

[0030] FIG2a is a schematic diagram showing the distribution of first electrodes on opposite sides of a signal modulation chip provided by the present application;

[0031] FIG2 b is a schematic diagram showing the distribution of first electrodes on opposite sides in another signal modulation chip provided by the present application;

[0032] FIG2c is a schematic diagram showing the distribution of first electrodes on three sides of a signal modulation chip provided by the present application;

[0033] FIG3 is a flow chart of a signal modulation method provided by the present application;

[0034] FIG4 is a schematic structural diagram of a signal modulation system provided by the present application;

[0035] FIG5 is a schematic structural diagram of another signal modulation system provided by the present application;

[0036] [Corrected 29.06.2024 according to Rule 91] Figure 6 is a structural diagram of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0037] [Corrected 29.06.2024 in accordance with Rule 91] The following will clearly and completely describe the technical solutions in the embodiments of this application in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0038] This application mainly relates to cloud technology. Cloud technology refers to a hosting technology that unifies a series of resources such as hardware, software, and network in a wide area network or a local area network to realize the calculation, storage, processing and sharing of data. Cloud technology is a general term for network technology, information technology, integration technology, management platform technology, application technology, etc. based on the cloud computing business model. It can form a resource pool that can be used on demand and is flexible and convenient. Cloud computing technology will become an important support. The background services of technical network systems require a large amount of computing and storage resources, such as video websites, picture websites and more portal websites. With the rapid development and application of the Internet industry, each item may have its own identification mark in the future, and all need to be transmitted to the background system for logical processing. Data of different levels will be processed separately. All kinds of industry data require strong system backing support, which can only be achieved through cloud computing.

[0039] For example, the signal modulation chip in this application can be deployed in a cloud server. The cloud server can call the signal modulation chip to receive electrical signals and optical signals, modulate the optical signal according to the electrical signal to obtain a modulated optical signal, and transmit the modulated optical signal to other devices. Modulating the optical signal by the signal modulation chip of the cloud server facilitates efficient and long-distance transmission of the optical signal.

[0040] In one embodiment, the signal modulation chip is a chip used to modulate an optical signal according to an electrical signal. For example, the signal modulation chip can be a silicon photonic chip. The signal modulation chip includes N first electrodes and N modulators, an input interface and an output interface. One first electrode is connected to one modulator, and the N modulators are all connected to the input interface and the output interface. N is an integer greater than 1.

[0041] If these N first electrodes are deployed on the same side of the signal modulation chip, then at least the spacing between every two first electrodes with adjacent positional relationships among the N first electrodes needs to be limited. Limiting the spacing between two first electrodes means making the spacing between the two first electrodes greater than a spacing threshold, so as to avoid crosstalk between electrical signals received by different first electrodes. The spacing threshold can be determined based on parameters such as the material of the first electrode. For example, as shown in FIG1a , the signal modulation chip includes 4 first electrodes and 4 modulators as an example for explanation. As shown in FIG1a , the signal modulation chip 10a includes a first electrode 12a, a first electrode 13a, a first electrode 14a and a first electrode 15a, 4 second electrodes are marked as 16a, the input interface and the input interface are both marked as 18a, and 4 modulators are marked as 17a. As shown in Figure 1a, the four first electrodes are distributed along side 11a of the signal modulation chip 10a. As shown in Figure 1a, the spacing between first electrode 12a and first electrode 13a, the spacing between first electrode 13a and first electrode 14a, and the spacing between first electrode 14a and first electrode 15a need to be limited. Since the length of side 11a of the signal modulation chip 10a is limited, if the four first electrodes are distributed along side 11a, the length of side 11a needs to be extended, which in turn increases the area of ​​the signal modulation chip 10a. If the area of ​​the signal modulation chip 10a needs to be reduced, the only way to do this is to reduce the length of the four modulators, as well as the input and output interfaces. Reducing the length of the four modulators, as well as the input and output interfaces, can cause abnormalities such as sudden changes and attenuation in the electrical or optical signals transmitted by the signal modulation chip, resulting in poor performance of the signal modulation chip, i.e., reduced signal modulation accuracy of the signal modulation chip.

[0042] Based on this, in the present application, by distributing the N first electrodes on different sides of the signal modulation chip, the number of first electrodes distributed on the sides is reduced, and more space is available on different sides for deploying the first electrodes. Then, the spacing restrictions between the first electrodes are easily met, which weakens the spacing restrictions between the first electrodes at different side positions. This can weaken the spacing restrictions between the N first electrodes, which is beneficial to reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip. There is no need to reduce the length of the output interface, output interface, and modulator in the signal modulation chip. This can avoid problems such as sudden changes in electrical signals and optical signals during transmission, improve the performance of the signal modulation chip, and improve the modulation accuracy of the signal modulation chip on the optical signal.

[0043] In one embodiment, K first electrodes are located on a first side of the signal modulation chip, and L first electrodes are located on a second side of the signal modulation chip; the first side and the second side are adjacent to each other, K and L are positive integers, and the sum of K and L is N. That is, the N first electrodes are distributed on two adjacent sides of the signal modulation chip. Since there is a large amount of space on the adjacent sides that can be used to deploy the first electrodes, this can reduce the spacing restrictions between the N first electrodes, which is beneficial for reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip. K and L can be the same or different; for example, when the number of first electrodes is 4, that is, N = 4, K and L can both be 2; or, K can be 3 and L can be 1; or, K can be 1 and L can be 3. For example, when the number of first electrodes is 3, that is, N = 3, K can be 2 and L can be 1; or, K can be 1 and L can be 2.

[0044] In this embodiment, the first side may be the main side, and the second side may be the side adjacent to the main side; the main side is the side of the signal modulation chip whose distance from the host is less than a distance threshold, that is, the main side may refer to the side of the signal modulation chip close to the host; the host may refer to the computer device on which the signal modulation chip is deployed, that is, the main side may refer to the side close to the display screen of the computer device.

[0045] For example, as shown in Figures 1b, 1c, and 1d, a signal modulation chip including four first electrodes and four modulators is used for illustration. In Figure 1b, signal modulation chip 10b includes first electrodes 12b, 13b, 14b, and 15b, an output interface 17b, and an input interface 18b. The four modulators are labeled 19b, two second electrodes adjacent to first electrode 12b are labeled 11b, and two second electrodes adjacent to first electrode 15b are labeled 16b. As shown in Figure 1b, first electrodes 12b and 13b are located on the main side of signal modulation chip 10b, while first electrodes 14b and 15b are located on adjacent sides of the main side of signal modulation chip 10b. Since only two first electrodes are required on the main side and the adjacent sides of the main side, the number of first electrodes required on the main side and the main side is reduced. Therefore, the spacing between different first electrodes can be easily met, thus reducing the spacing restrictions between different first electrodes.

[0046] Similarly, as shown in FIG1c , the signal modulation chip 10c in FIG1c includes a first electrode 12c, a first electrode 13c, a first electrode 14c, a first electrode 15c, an output interface 17c, and an input interface 18c; the four modulators are labeled 19c, the two second electrodes adjacent to the first electrode 12c are labeled 11c, and the two second electrodes adjacent to the first electrode 14c are labeled 16c. As shown in FIG1c , the first electrodes 12c and 13c are located on the main side of the signal modulation chip 10c, and the first electrodes 14c and 15c are located on adjacent sides of the main side of the signal modulation chip 10c. Among them, there are two second electrodes between the first electrode 13c and the first electrode 14c. Therefore, the spacing between the first electrode 13c and the first electrode 14c is already large enough, and there is no need to limit the spacing between the first electrode 13c and the first electrode 14c. That is, there is no need to limit the spacing between the first electrodes on different sides, which weakens the spacing restrictions between different first electrodes.

[0047] Similarly, as shown in Figure 1d, signal modulation chip 10d in Figure 1d includes first electrode 12d, first electrode 13d, first electrode 14d, and first electrode 15d, output interface 17d, and input interface 18d; four modulators are labeled 19d, two second electrodes adjacent to first electrode 13d are labeled 11d, and two second electrodes adjacent to first electrode 14d are labeled 16d. As shown in Figure 1d, first electrodes 12d and 13d are located on the main side of signal modulation chip 10d, while first electrodes 14d and 15d are located on adjacent sides of the main side of signal modulation chip 10d. There are four second electrodes between first electrode 13d and first electrode 14d. Therefore, the spacing between first electrode 13d and first electrode 14d is already sufficiently large, and there is no need to limit the spacing between first electrode 13d and first electrode 14d. In other words, there is no need to limit the spacing between first electrodes on different sides, which reduces the spacing restrictions between different first electrodes.

[0048] As can be seen from Figures 1b, 1c, and 1d above, by distributing the four first electrodes on adjacent sides of the signal modulation chip, the spacing restrictions between different first electrodes are weakened, which is beneficial to reducing the area of ​​the signal modulation chip. As shown in Figures 1b, 1c, and 1d, since the number of first electrodes on the main side is reduced, the length of the main side can be reduced; in addition, since there is no need to limit the spacing between the first electrodes on different sides in Figures 1c and 1d, Figures 1c and 1d can also reduce the length of the adjacent sides of the main side (i.e., the adjacent sides where the first electrodes are deployed). Therefore, compared with Figure 1a, Figures 1b, 1c, and 1d all reduce the area of ​​the signal modulation chip, which can reduce the cost of the signal modulation chip; there is no need to reduce the length of the output interface, output interface, and modulator in the signal modulation chip, which can avoid problems such as sudden changes in electrical signals and optical signals during transmission, thereby improving the performance of the signal modulation chip, that is, improving the modulation accuracy of the signal modulation chip for optical signals.

[0049] It should be noted that the positional relationship between the input interface, the output interface, and the second electrode in the signal modulation chip can be as shown in Figures 1b, 1c, and 1d. Of course, the positional relationship between the input interface, the output interface, and the second electrode in the signal modulation chip can be different from that shown in Figures 1b, 1c, and 1d. Taking Figure 1b as an example, the output interface 17b and the input interface 18b can be interchanged. In one embodiment, in Figure 1b, the first electrode 14b and the first electrode 15b can be translated to the side where the input interface 18b is located, and the input interface 18b is translated to the side where the first electrode 14b and the first electrode 15b are located, or the input interface 18b can remain in its original position. In one embodiment, in Figure 1c, the first electrode 14c and the first electrode 15c can be translated to the side where the input interface 18c is located, and the input interface 18c is translated to the side where the first electrode 14c and the first electrode 15c are located, or the input interface 18c can remain in its original position. In one embodiment, in FIG1d , the first electrode 14d and the first electrode 15d can be translated to the side where the input interface 18d is located, and the input interface 18d can be translated to the side where the first electrode 14d and the first electrode 15d are located, or the input interface 18d can remain in its original position. It should be noted that since the electrical signal is transmitted from the host to the first electrode, when the signal modulation chip is in use, the K first electrodes are oriented toward the host, or the L first electrodes are oriented toward the host, which is conducive to improving the transmission efficiency of the electrical signal.

[0050] In one embodiment, S first electrodes are located on a first side of the signal modulation chip, and D first electrodes are located on a second side of the signal modulation chip; the first side and the second side are in a relative relationship; S and D are positive integers, and the sum of S and D is N. The relative relationship can mean that the first side and the second side are opposite sides of each other, that is, the first side and the second side are not adjacent to each other. For example, when the signal modulation chip is shaped as a parallelogram, the first side and the second side are in a parallel positional relationship. In other words, the spacing between the first electrodes on the sides in a relative relationship is relatively large, that is, there is no need to limit the spacing between the first electrodes on different side positions, which can reduce the spacing restrictions between the N first electrodes, thereby reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip. There is no need to reduce the length of the output interface, the output interface, and the modulator in the signal modulation chip. This can avoid problems such as sudden changes in electrical and optical signals during transmission, improve the performance of the signal modulation chip, and specifically improve the modulation accuracy of the optical signal by the signal modulation chip.

[0051] It should be noted that S and D may be the same or different. For example, when the number of first electrodes is 4, that is, N = 4, S and D may both be 2; or, S may be 3 and D may be 1; or, S may be 1 and D may be 3. For example, when the number of first electrodes is 3, that is, N = 3, S may be 2 and D may be 1; or, S may be 1 and D may be 2. This application uses the example of S and D being the same as an example for explanation.

[0052] The first side and the second side are both perpendicular to the normal of the main side of the signal modulation chip, and the main side is a side of the signal modulation chip whose distance from the host is less than a distance threshold.

[0053] Optionally, the first electrode connected to the first modulator belongs to the S first electrodes, and the first electrode connected to the second modulator belongs to the D first electrodes; the first modulator and the second modulator are adjacent modulators among the N modulators. In other words, the first electrodes connected to two adjacent modulators among the N modulators are located on different sides, that is, the N first electrodes are alternately distributed on the first side and the second side.

[0054] For example, as shown in Figure 2a, a signal modulation chip including four first electrodes and four modulators is used for illustration. In Figure 2a, signal modulation chip 20a includes first electrode 21a, first electrode 22a, first electrode 26a, first electrode 27a, second electrode 25a, second electrode 28a, output interface 29a, and input interface 24a. The four modulators are labeled 30a, and the two second electrodes adjacent to first electrode 22a are labeled 23a. The modulator corresponding to first electrode 22a and the modulator corresponding to first electrode 26a are adjacent to each other; that is, the modulator corresponding to first electrode 22a can be referred to as first modulator q1, and the modulator connected to first electrode 26a can be referred to as second modulator q2. The first electrode 22a connected to first modulator q1 is located on a first side of the signal modulation chip, and the first electrode 26a connected to second modulator q2 is located on a second side of the signal modulation chip, that is, the first electrode 22a and the first electrode 26a are located on different sides. The modulator corresponding to the first electrode 22a and the modulator corresponding to the first electrode 27a are adjacent to each other. The modulator connected to the first electrode 27a can be referred to as the second modulator q3. The first electrode 27a connected to the second modulator q3 is located on the second side of the signal modulation chip, meaning that the first electrode 22a connected to the first modulator q1 and the first electrode 27a connected to the second modulator q3 are located on different sides. The modulator corresponding to the first electrode 27a and the modulator corresponding to the first electrode 21a are adjacent to each other. The modulator corresponding to the first electrode 21a can be referred to as the first modulator q4. The first electrode 21a connected to the first modulator q4 is located on the first side of the signal modulation chip, meaning that the first electrode 21a connected to the first modulator q4 and the first electrode 27a connected to the second modulator q3 are located on different sides. Because the spacing between the two opposing sides is relatively large, as can be seen from FIG2a , there is no need to limit the spacing between first electrode 22a and first electrode 26a, nor between first electrode 22a and first electrode 27a, nor between first electrode 21a and first electrode 27a. In other words, there is no need to limit the spacing between first electrodes on two opposing sides, thus weakening the spacing restrictions between different first electrodes.

[0055] Optionally, the modulators to which the S first electrodes are respectively connected have an adjacent positional relationship, and the modulators to which the D first electrodes are respectively connected have an adjacent positional relationship.

[0056] For example, in Figure 2b, signal modulation chip 20b includes first electrode 21b, first electrode 22b, first electrode 26b, first electrode 27b, second electrode 25b, second electrode 28b, output interface 29b, and input interface 24b. Four modulators are labeled 30b, and two second electrodes adjacent to first electrode 22b are labeled 23b. The modulator corresponding to first electrode 22b is adjacent to the modulator corresponding to first electrode 21b; first electrode 22b and first electrode 21b are located on a first side of the signal modulation chip. The modulator corresponding to first electrode 26b is adjacent to the modulator corresponding to first electrode 27b; first electrode 26b and first electrode 27b are located on a second side of the signal modulation chip. However, the modulator corresponding to first electrode 22a is adjacent to the modulator corresponding to first electrode 27a, and first electrode 27a is located on the second side of the signal modulation chip, meaning that first electrode 22a and first electrode 27a are located on different sides. In other words, there is no need to limit the distance between the first electrode 22a and the first electrode 27a, and the distance restriction between different first electrodes is weakened.

[0057] As can be seen from Figures 2a and 2b, by distributing the four first electrodes on opposite sides of the signal modulation chip, the spacing restrictions between different first electrodes are weakened, which is beneficial to reducing the area of ​​the signal modulation chip. As shown in Figures 2a and 2b, due to the reduction in the number of first electrodes on the first side and the second side, the length of the first side and the second side can be reduced. Furthermore, compared with Figure 1a, Figures 2a and 2b both reduce the area of ​​the signal modulation chip, which can reduce the cost of the signal modulation chip; there is no need to reduce the output interface, the output interface and the length of the modulator in the signal modulation chip, which can avoid problems such as sudden changes in electrical signals and optical signals during transmission, thereby improving the performance of the signal modulation chip, that is, improving the modulation accuracy of the signal modulation chip for the optical signal.

[0058] It should be noted that Figures 1b, 1c, 1d, 2a, and 2b are all illustrated using the example of N first electrodes being distributed on two sides of the signal modulation chip. Of course, the N first electrodes can also be distributed on more sides, such as N first electrodes can be distributed on three sides or four sides of the signal modulation chip; the number of sides on which the N first electrodes are distributed can be adaptively adjusted based on the number of first electrodes. For example, as shown in Figure 1b, the first electrode 14b can be translated to the side where the input interface 18b is located, or the first electrode 15b can be translated to the side where the input interface 18b is located. In this case, the four first electrodes are distributed on three sides of the signal modulation chip. It should be noted that the side where the output interface is located in Figures 1b, 1c, 1d, 2a, and 2b is the side of the cable. If the first electrode is deployed on the side of the cable, the electrical signal input to the first electrode will need to bypass the signal modulation chip before reaching the first electrode, which can easily cause the electrical signal received by the first electrode to attenuate. Therefore, the first electrode is typically not deployed on the side of the cable. The cable side refers to the side of the signal modulation chip that is away from the display screen of the computer device.

[0059] For example, in FIG2c , signal modulation chip 20c includes a first electrode 21c, a first electrode 22c, a first electrode 26c, a first electrode 27c, a second electrode 25c, a second electrode 28c, an output interface 29c, and an input interface 24c. Four modulators are labeled 30c, and two second electrodes adjacent to first electrode 22c are labeled 23c. The modulator corresponding to first electrode 21c is adjacent to the modulator corresponding to first electrode 26c and the modulator corresponding to first electrode 27c. First electrode 21c is located on a first side, while first electrode 26c and first electrode 27c are located on a second side. This means that first electrode 21c, first electrode 26c, and first electrode 27c are located on different sides. Therefore, there is no need to limit the spacing between first electrode 21c and first electrode 26c, nor between first electrode 21c and first electrode 27c. In other words, the spacing restrictions between first electrode 21c and first electrode 26c and between first electrode 21c and first electrode 27c are avoided. The first electrode 22c is located on the third side, that is, the first electrode 22c and the first electrode 21c, the first electrode 26c and the first electrode 27c are located on different sides. The number of first electrodes on the third side is relatively small. Therefore, the spacing between the first electrode 22c and the first electrode 21c, the first electrode 26c and the first electrode 27c can easily meet the requirements, thereby weakening the spacing restriction between the first electrode 22c and the first electrode 21c, the first electrode 26c and the first electrode 27c.

[0060] It should be noted that the first electrode 26c or the first electrode 27c in FIG. 2c can be moved to the third side, the third side is the main side, and the first side and the second side are adjacent sides of the main side.

[0061] The first electrode i is configured to transmit the received electrical signal to a modulator i connected to the first electrode i; i is a positive integer less than or equal to N; the first electrode i belongs to the N first electrodes, and the modulator i belongs to the N modulators. The electrical signal is generated by the host, and the first electrode i can be any of the N first electrodes. The first electrode can be referred to as a high-speed electrode, and the first electrode is configured to receive an electrical signal, and the electrical signal can be referred to as a high-speed electrical signal, i.e., the first electrode can be a high-speed electrode configured to receive a high-speed electrical signal, and the high-speed electrical signal can be determined based on at least one of the rising edge time, falling edge time, and frequency of the electrical signal. A high-speed electrical signal can have one or more of the following meanings: 1. A digital signal consisting of high and low levels; 2. A frequency greater than 30 MHz or 50 MHz; 3. A signal with a relatively fast rise or fall speed, such as a signal with a rising edge / falling edge time less than 1 ns.

[0062] It should be noted that the high-speed electrode has the characteristics of anti-interference and anti-attenuation. Therefore, by transmitting the high-speed electrical signal to the high-speed electrode and then to the modulator, this helps to reduce the energy loss of the high-speed electrical signal and improve the energy efficiency of the high-speed electrical signal, thereby improving the efficiency and stability of the transmission of the high-speed electrical signal; avoiding the problem of high-speed electrical signal being directly transmitted to the modulator without passing through the high-speed electrode, causing a large energy loss of the high-speed electrical signal. It should be noted that the present application can be used in scenarios such as the Internet (such as data centers, cloud computing), medical care, and environmental protection. The electrical signal can refer to a signal carrying information to be transmitted, mainly through parameters such as the frequency, amplitude, and phase of the electrical signal to reflect the information to be transmitted. For example, in the Internet scenario, the electrical signal can reflect videos, texts, web pages, etc. transmitted on the Internet; in the medical scenario, the electrical signal can reflect medical data, medical reimbursement data, etc. to be transmitted; in the environmental protection scenario, the electrical signal can reflect data such as the carbon emissions of an organization or individual.

[0063] It should be noted that the signal modulation chip may include N first electrodes, where N may be 2, 3, 4, etc. Different first electrodes may be used to receive electrical signals associated with different services, such as first electrode i for receiving electrical signals associated with medical care, first electrode i+1 for receiving electrical signals related to the Internet, and so on. Alternatively, the electrical signals received by the N first electrodes may be determined by the computer device based on the operating status of the N first electrodes. When receiving an electrical signal, the computer device may select an idle first electrode from the N first electrodes and transmit the electrical signal to the idle first electrode.

[0064] It should be noted that the electrical signal received by the first electrode i is transmitted to the first electrode i by the host through the printed circuit board.

[0065] The input interface is used to transmit the received optical signal to the modulator i. The optical signal can be information generated by a light source device, which can be integrated into a signal modulation chip or externally located. The optical signal here can refer to a signal that does not carry any information, such as an optical signal with a constant amplitude.

[0066] In one embodiment, the signal modulation chip has N channels, which may mean that the signal modulation chip can modulate N optical signals. The number of light source devices associated with the signal modulation chip may be any one of N, N / 2, and N / 4.

[0067] In one embodiment, when the number of light source devices associated with the signal modulation chip is N, one light source device corresponds to one first electrode, such as the first electrode i among the N first electrodes corresponds to the light source device i among the N light source devices, and the electrical signal received by the first electrode i is used to modulate the optical signal generated by the light source device i.

[0068] In one embodiment, when the number of light source devices associated with the signal modulation chip is N / 2, the optical signal generated by one light source device can be divided into two optical signals, and one optical signal corresponds to one first electrode. For example, the optical signal generated by the light source device x is divided into a first optical signal and a second optical signal, and the sum of the first optical signal and the second optical signal is the optical signal generated by the light source device x. The first electrode i and the first electrode i+1 are respectively associated with the first optical signal and the second optical signal generated by the light source device x, where x is a positive integer less than or equal to N / 2. The electrical signal received by the first electrode i is used to modulate the first optical signal, and the electrical signal received by the first electrode i+1 is used to modulate the second optical signal.

[0069] In one embodiment, when the number of light source devices associated with the signal modulation chip is N / 4, the optical signal generated by one light source device can be divided into four optical signals, with one optical signal corresponding to one first electrode. For example, the optical signal generated by light source device y is divided into a first optical signal, a second optical signal, a third optical signal, and a fourth optical signal, and the sum of the first optical signal, the second optical signal, the third optical signal, and the fourth optical signal is the optical signal generated by light source device y. The first electrode i, the first electrode i+1, the first electrode i+2, and the first electrode i+4 are respectively associated with the first optical signal, the second optical signal, the third optical signal, and the fourth optical signal generated by light source device y, where y is a positive integer less than or equal to N / 4. The electrical signal received by the first electrode i is used to modulate the first optical signal, the electrical signal received by the first electrode i+1 is used to modulate the second optical signal; the electrical signal received by the first electrode i+2 is used to modulate the third optical signal, and the electrical signal received by the first electrode i+3 is used to modulate the fourth optical signal.

[0070] It is understandable that the signal modulation chip can be a silicon photonic chip with four channels, or the signal modulation chip can be a silicon photonic chip with eight channels, etc. The number of channels of the signal modulation chip can be set according to demand, and this application does not limit this.

[0071] It's important to note that optical signals are transmitted via optical fiber, while electrical signals are transmitted via cables. Optical signals typically have a higher frequency than electrical signals. Optical signals are extremely fast, reaching speeds of tens of billions of bits per second, making them the preferred method for high-speed data transmission and communication. Optical signals are also highly resistant to electromagnetic interference and are not susceptible to interference or leakage. Furthermore, optical signals can be transmitted over very long distances, for example, down to the ocean floor.

[0072] The modulator i is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal, which is equivalent to loading the electrical signal into the optical signal so that one or more parameters of the modulated optical signal change according to the parameters of the electrical signal, that is, the modulated optical signal carries the information to be transmitted carried by the electrical signal. Compared with electrical signals, modulated optical signals are more conducive to high-speed transmission, long-distance transmission, and are more resistant to interference. The modulation of the optical signal here can refer to modulating at least one parameter of the amplitude, phase, and frequency of the optical signal. Specifically, the modulator i is used to modulate the optical signal according to the electrical signal and a modulation algorithm to obtain a modulated optical signal; the modulation algorithm can include polarization shift modulation keying (PoLSK), amplitude shift keying (ASK), frequency shift keying (FSK), and phase shift keying (PSK).

[0073] It is understandable that in the present application, by disposing the N first electrodes in the signal modulation chip on different sides of the signal modulation chip, it is possible to meet the requirements of the host side, that is, the spacing between each first electrode meets the requirements, that is, the spacing between each first electrode is greater than the spacing threshold, which can reduce the signal crosstalk between different first electrodes, and can also reduce the chip area and cost. In addition, there is no need to reduce the output interface, output interface and modulator length in the signal modulation chip, which can avoid problems such as sudden changes in electrical signals and optical signals during transmission, improve the performance of the signal modulation chip, that is, improve the modulation accuracy of the signal modulation chip for optical signals. At the same time, the manufacturing process of the signal modulation chip does not require the development of a new process, and can borrow the traditional process technology, which is simple to implement, reduces the manufacturing cost of the signal modulation chip, and improves the production efficiency of the signal modulation chip.

[0074] The output interface is used to output the modulated optical signal. This modulated optical signal can be used in scenarios such as the Internet (such as data centers and cloud computing), medical care, and environmental protection. For example, in a data center scenario, a terminal can access the cloud of the data center based on the modulated optical signal to browse the web, send and receive emails, and stream videos. The modulated optical signal can also be used to achieve data center interconnection, such as data replication and software and system upgrades. The modulated optical signal can also be used to store, generate, and mine information within the data center.

[0075] In one embodiment, the signal modulation chip further includes N second electrodes, one of which is connected to a modulator; the N second electrodes can be referred to as low-speed electrodes. The second electrode j is used to control the modulator i to be in an operating state. Here, the second electrode j being used to control the modulator i to be in an operating state can mean that the second electrode j controls the voltage of the modulator i to be an optimal operating voltage, the current to be an optimal operating current, etc., where the optimal operating voltage and the optimal operating current are determined based on parameters such as the material and operating environment of the modulator. The modulator i in the operating state is used to modulate the optical signal based on the electrical signal to obtain a modulated optical signal; the second electrode j is the second electrode among the N second electrodes that is connected to the modulator i. This helps improve the modulation accuracy of the modulator with respect to the optical signal.

[0076] In the present application, by deploying the N first electrodes in the signal modulation chip on different sides of the signal modulation chip, the number of first electrodes on each side is reduced, more space is available on the side for deploying the first electrodes, and the spacing restrictions between the first electrodes on the side are more easily met, thereby weakening the spacing restrictions between the N first electrodes, which is conducive to reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip. There is no need to reduce the length of the output interface, output interface, and modulator in the signal modulation chip. This can avoid problems such as sudden changes in electrical signals and optical signals during transmission, improve the performance of the signal modulation chip, and improve the modulation accuracy of the optical signal by the signal modulation chip.

[0077] Further, please refer to Figure 3, which is a flow chart of a signal modulation method provided in an embodiment of the present application. As shown in Figure 3, the method can be applied to a computer device, which may include a signal modulation chip, the signal modulation chip including N first electrodes and N modulators, an input interface, and an output interface. The N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, and N is an integer greater than 1. The method may include the following steps:

[0078] S101. Transmitting the received electrical signal to the modulator i connected to the first electrode i through the first electrode i; i is a positive integer less than or equal to N; the first electrode i belongs to the N first electrodes, and the modulator i belongs to the modulator connected to the first electrode i among the N modulators.

[0079] In this application, when a computer device receives an electrical signal, it can obtain a first electrode associated with the electrical signal from N first electrodes, denoted as first electrode i, and transmit the electrical signal to first electrode i. After first electrode i receives the electrical signal, it can transmit the received electrical signal to modulator i. For example, first electrode i can refer to an idle first electrode among the N first electrodes; alternatively, first electrode i can refer to a first electrode among the N first electrodes that is associated with the service corresponding to the electrical signal.

[0080] S102: Transmit the received optical signal to the modulator i through the input interface.

[0081] In the present application, the received optical signal is transmitted to the modulator i through the input interface. The optical signal may refer to information generated by a light source device. The light source device may be integrated on a signal modulation chip or may be separately external.

[0082] S103 . Modulate the optical signal according to the electrical signal through the modulator i to obtain a modulated optical signal.

[0083] In the present application, the optical signal is modulated by the modulator i according to the electrical signal and the modulation algorithm to obtain a modulated optical signal; the modulation algorithm may include polarization shift keying (PoLSK), amplitude shift keying (ASK), frequency shift keying (FSK) and phase shift keying (PSK), etc.

[0084] S104: Output the modulated optical signal through the output interface.

[0085] In the present application, the modulated optical signal is output through the output interface, that is, the modulated optical signal is output to other devices through the output interface.

[0086] It should be noted that for the explanation of the signal modulation chip, reference may be made to the above-mentioned Figures 1b, 1c, 1d, 2a and 2b, and the repeated parts will be omitted.

[0087] In the present application, by deploying the N first electrodes in the signal modulation chip on different sides of the signal modulation chip, the spacing limitation between the N first electrodes is weakened, which is beneficial to reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip; there is no need to reduce the output interface, output interface and modulator length in the signal modulation chip, so as to avoid problems such as sudden changes in electrical signals and optical signals during transmission, thereby improving the performance of the signal modulation chip, that is, improving the modulation accuracy of the signal modulation chip for the optical signal.

[0088] In one embodiment, the signal modulation system includes a signal modulation chip, which includes N first electrodes and N modulators, an input interface, and an output interface. The N first electrodes are distributed on different sides of the signal modulation chip, and each first electrode is connected to a modulator, where N is an integer greater than 1. First electrode i is configured to transmit a received electrical signal to modulator i; i is a positive integer less than or equal to N; first electrode i belongs to the N first electrodes, and modulator i belongs to the N modulators. The input interface is configured to transmit a received optical signal to modulator i; modulator i is configured to modulate the optical signal based on the electrical signal to obtain a modulated optical signal; and the output interface is configured to output the modulated optical signal.

[0089] Alternatively, the signal modulation system further includes a signal transmitter and a drive amplifier; the signal transmitter may be a gold finger, which is composed of a plurality of conductive contacts. The signal transmitter is configured to transmit the received initial electrical signal to the drive amplifier; the drive amplifier is configured to amplify the initial electrical signal to obtain the electrical signal, such as by amplifying the amplitude of the initial electrical signal to obtain the electrical signal, and transmit the electrical signal to the first electrode i.

[0090] Optionally, the signal modulation system also includes an optical fiber array and an optical connector; the optical fiber array can be composed of multiple optical fibers, and the optical connector is a device for receiving and sending optical signals; in the present application, the optical fiber array is used to transmit the modulated optical signal output by the output interface to the optical connector; the optical connector is used to output the modulated optical signal.

[0091] For example, as shown in Figure 4, the signal modulation system includes a signal modulation chip 40a, a signal transmitter 50a, a driver amplifier 51a, an optical fiber array 52a, and an optical connector 53a. In Figure 4, the signal modulation chip 40a includes a first electrode 42a, a first electrode 43a, a first electrode 44a, and a first electrode 45a, an output interface 47a, and an input interface 48a; four modulators, wherein the modulator corresponding to the first electrode 43a is marked as 49a, the two second electrodes adjacent to the first electrode 42a are marked as 41a, and the two second electrodes adjacent to the first electrode 45a are marked as 46a. As shown in Figure 4, the first electrodes 42a and 43a are located on the main side of the signal modulation chip 40a, and the first electrodes 44a and 45a are located on the adjacent sides of the main side of the signal modulation chip 40a.

[0092] The signal transmitter 50a can transmit the received initial electrical signal to the driver amplifier 51a. The initial electrical signal can be generated by the host. That is, the signal transmitter 50a can transmit the initial electrical signal generated by the host to the printed circuit board, and the printed circuit board outputs the initial electrical signal to the driver amplifier 51a. The driver amplifier 51a can amplify the initial electrical signal to obtain the electrical signal mentioned above, and transmit the electrical signal to the first electrode 43a. The first electrode 43a can transmit the electrical signal to the modulator 49a.

[0093] The input interface 48a can send the received optical signal to the modulator 49a, and the modulator 49a can modulate the optical signal according to the electrical signal to obtain a modulated optical signal, and send the modulated optical signal to the output interface 47a. The output interface 47a can send the modulated optical signal to the optical fiber array 52a, and the optical fiber array 52a can send the modulated optical signal to the optical connector 53a, and the optical connector 53a can send the modulated optical signal to an external device.

[0094] In one embodiment, the signal modulation system may be a linear direct-drive optical transceiver system. As shown in FIG5 , the signal modulation system may include a housing 70a, a printed circuit board (PCB) 60a, a signal transmitter 61a (gold finger), a driver amplifier 62a, a signal modulation chip 63a, an optical fiber array 64a, a light source device 65a, an optical fiber array 66a, a photodetector 67a, an optical connector 68a, and a transimpedance amplifier 69a. The PCB comprises two major parts: a high-speed signal transmitter and a receiver. The transmitter consists of a driver amplifier 62a (Driver), a signal modulation chip 63a (SiPho), an optical fiber array 64a (FAU), and a light source device 65a (Laser Source), while the receiver consists of a transimpedance amplifier 68a (TIA), a photodetector 67a (PIN), and an optical fiber array 66a. The photodetector 67a may be a dual-output transceiver detector and may be either a discrete detector made of III-V materials or an integrated detector made of Ge-Si materials.

[0095] The first electrodes in the signal modulation chip 63a are distributed on two adjacent sides. The transimpedance amplifier 69a is attached to the PCB; the optical fiber array 64a and the optical fiber array 66a are coupled and bonded to the signal modulation chip 63a and the optical detector 67a, respectively; and the PCB and the optical connector 68a are installed inside the housing. The initial electrical signal enters the PCB from the signal transmitter 61a and enters the driver amplifier 62a. The driver amplifier 62a amplifies the initial electrical signal to obtain the electrical signal mentioned above. The driver amplifier 62a sends the electrical signal to any first electrode of the signal modulation chip 63a, and the first electrode can send the electrical signal to the modulator of the signal modulation chip 63a. The input interface of the signal modulation chip 63a can receive the optical signal generated by the light source device 65a, and send the received optical signal to the modulator of the signal modulation chip 63a. The modulator of the signal modulation chip 63a can modulate the optical signal according to the electrical signal to obtain a modulated optical signal, and send the modulated optical signal to the output interface of the signal modulation chip 63a. The output interface of the signal modulation chip 63a can send the modulated optical signal to the optical fiber array 64a. The optical fiber array 64a can send the modulated optical signal to the optical connector 68a. The optical connector 68a can send the modulated optical signal to an external device.

[0096] In one embodiment, the optical connector 68a is used to receive the optical signal, which then passes through the optical fiber array 66a in sequence and is coupled into the optical detector 67a. The optical detector 67a converts the optical signal into a current signal, enters the transimpedance amplifier 69a for amplification, and is finally output through the signal transmitter 61a.

[0097] In the present application, by deploying the N first electrodes in the signal modulation chip on different sides of the signal modulation chip, the number of first electrodes on each side is reduced, more space is available on the side for deploying the first electrodes, and the spacing restrictions between the first electrodes on the side are more easily met, thereby weakening the spacing restrictions between the N first electrodes, which is conducive to reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip. There is no need to reduce the length of the output interface, output interface, and modulator in the signal modulation chip. This can avoid problems such as sudden changes in electrical signals and optical signals during transmission, improve the performance of the signal modulation chip, and improve the modulation accuracy of the optical signal by the signal modulation chip.

[0098] Please refer to Figure 6, which is a structural diagram of a computer device provided in an embodiment of the present application. As shown in Figure 6, the above-mentioned computer device 1000 may refer to a terminal or a server, including: a processor 1001, a network interface 1004 and a memory 1005. In addition, the above-mentioned computer device 1000 may also include: a user interface 1003, and at least one communication bus 1002. Among them, the communication bus 1002 is used to realize the connection and communication between these components. Among them, in some embodiments, the user interface 1003 may include a display screen (DiSPlay), a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a WI-FI interface). The memory 1005 may be a high-speed RAM memory, or it may be a non-volatile memory (non-volatile MeMory), such as at least one disk storage. The memory 1005 may also be at least one storage device away from the aforementioned processor 1001. As shown in FIG6 , the memory 1005 as a computer-readable storage medium may include an operating system, a network communication module, a user interface module, and a computer program.

[0099] In the computer device 1000 shown in FIG6 , the network interface 1004 provides network communication functions; the user interface 1003 is primarily used to provide an input interface; and the processor 1001 includes a signal modulation chip, which includes N first electrodes and N modulators, an input interface, and an output interface. The N first electrodes are distributed on different sides of the signal modulation chip, and one first electrode is connected to one modulator, where N is an integer greater than 1.

[0100] The first electrode i is used to transmit the received electrical signal to the modulator i connected to the first electrode i; i is a positive integer less than or equal to N; the first electrode i is any first electrode among the N first electrodes, and the modulator i is a modulator connected to the first electrode i among the N modulators;

[0101] The input interface is used to transmit the received optical signal to the modulator i;

[0102] The modulator i is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal;

[0103] The output interface is used to output the modulated optical signal.

[0104] In one embodiment, K first electrodes are located on the first side of the signal modulation chip, and L first electrodes are located on the second side of the signal modulation chip; the first side and the second side are adjacent to each other; K and L are positive integers, and the sum of K and L is N.

[0105] In one embodiment, the first side is a main side, and the second side is a side adjacent to the main side; the main side is a side of the signal modulation chip whose distance from the host is less than a distance threshold.

[0106] In one embodiment, S first electrodes are located on the first side of the signal modulation chip, and D first electrodes are located on the second side of the signal modulation chip; there is a relative relationship between the first side and the second side; S and D are positive integers, and the sum of S and D is N.

[0107] In one embodiment, when the signal modulation chip is in use, the K first electrodes are oriented toward a host computer; alternatively, the L first electrodes are oriented toward the host computer. In one embodiment, the modulators connected to the S first electrodes are adjacent to each other, and the modulators connected to the D first electrodes are adjacent to each other.

[0108] In one embodiment, the first electrode connected to the first modulator belongs to the S first electrodes, and the first electrode connected to the second modulator belongs to the D first electrodes; the first modulator and the second modulator are modulators with adjacent positional relationships among the N modulators.

[0109] In one embodiment, the first side and the second side are both perpendicular to the normal of the main side of the signal modulation chip, and the main side is the side of the signal modulation chip whose distance from the host is less than a distance threshold.

[0110] In one embodiment, the signal modulation chip further includes N second electrodes, one second electrode being connected to one modulator;

[0111] The second electrode j is used to control the modulator i to be in a working state; the modulator i in the working state is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal; the second electrode j is the second electrode connected to the modulator i among the N second electrodes.

[0112] In one embodiment, the N first electrodes are all high-speed electrodes, and the N second electrodes are all low-speed electrodes.

[0113] In one embodiment, the electrical signal received by the first electrode i is transmitted to the first electrode i by the host through a printed circuit board.

[0114] In one embodiment, the optical signal received by the input interface is generated by a light source device, wherein the light source device is integrated on the signal modulation chip, or the light source device is separately external.

[0115] In one embodiment, the signal modulation chip has N channels, and the number of light source devices associated with the signal modulation chip is any one of N, N / 2, and N / 4.

[0116] In one embodiment, the signal modulation chip is a silicon photonic chip having four channels.

[0117] In the present application, by deploying the N first electrodes in the signal modulation chip on different sides of the signal modulation chip, the spacing limitation between the N first electrodes is weakened, which is beneficial to reducing the area of ​​the signal modulation chip, reducing the cost of the signal modulation chip, and improving the applicability of the signal modulation chip; there is no need to reduce the output interface, output interface and modulator length in the signal modulation chip, so as to avoid problems such as sudden changes in electrical signals and optical signals during transmission, thereby improving the performance of the signal modulation chip, that is, improving the modulation accuracy of the signal modulation chip for the optical signal.

[0118] In addition, it should be pointed out here that: the embodiment of the present application also provides a computer-readable storage medium, and the above-mentioned computer-readable storage medium stores a computer program executed by the signal modulation device mentioned above, and the above-mentioned computer program includes program instructions. When the above-mentioned processor executes the above-mentioned program instructions, it can execute the description of the above-mentioned signal modulation method in the corresponding embodiment above. Therefore, it will not be repeated here. In addition, the description of the beneficial effects of adopting the same method will not be repeated. For technical details not disclosed in the computer-readable storage medium embodiment involved in this application, please refer to the description of the method embodiment of this application.

[0119] As an example, the above program instructions may be deployed on a computer device for execution, or deployed on at least two computer devices at one location for execution, or executed on at least two computer devices distributed at at least two locations and interconnected via a communication network. The at least two computer devices distributed at at least two locations and interconnected via a communication network may constitute a blockchain network.

[0120] The computer-readable storage medium may be the signal modulation device provided in any of the aforementioned embodiments or the central memory of the computer device, such as the hard disk or memory of the computer device. The computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, a smart memory card (SMART Media card, SMC), a secure digital (SD) card, a flash memory card (flash card), etc. equipped on the computer device. Furthermore, the computer-readable storage medium may also include both the central memory of the computer device and an external storage device. The computer-readable storage medium is used to store the computer program and other programs and data required by the computer device. The computer-readable storage medium may also be used to temporarily store data that has been output or is to be output.

[0121] The terms "first", "second", etc. in the description, claims, and drawings of the embodiments of the present application are used to distinguish between contents in different media, rather than to describe a specific order. In addition, the terms "including" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product, or device that includes a series of steps or modules is not limited to the listed steps or modules, but may optionally include steps or modules that are not listed, or may optionally include other steps and modules that are inherent to these processes, methods, apparatuses, products, or devices.

[0122] The collection and processing of the relevant data in this application should be strictly in accordance with the requirements of relevant national laws and regulations when applied in practice, and the informed consent or separate consent of the personal information subject should be obtained. Subsequent data use and processing should be carried out within the scope of authorization of laws and regulations and the personal information subject.

[0123] The present application also provides a computer program product, including a computer program. When executed by a processor, the computer program implements the signal modulation method and decoding method described in the corresponding embodiments above. Therefore, they will not be described in detail here. In addition, the description of the beneficial effects of using the same method will not be repeated here. For technical details not disclosed in the embodiments of the computer program product involved in this application, please refer to the description of the method embodiments of this application.

[0124] Those skilled in the art will appreciate that the devices and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the composition and steps of each example according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0125] The methods and related devices provided in the embodiments of the present application are described with reference to the method flow charts and / or structural diagrams provided in the embodiments of the present application. Specifically, each process and / or box in the method flow charts and / or structural diagrams, as well as the combination of the processes and / or boxes in the flow charts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable network connection device to produce a machine, so that the instructions executed by the processor of the computer or other programmable network connection device generate a device for implementing the function specified in one or more processes in the flow chart and / or one or more boxes in the structural diagram. These computer program instructions can also be stored in a computer-readable memory that can guide a computer or other programmable network connection device to work in a specific manner, so that the instructions stored in the computer-readable memory generate a product including an instruction device, which implements the function specified in one or more processes in the flow chart and / or one or more boxes in the structural diagram. These computer program instructions can also be loaded onto a computer or other programmable network-connected device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, whereby the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more processes in the flowchart and / or one or more boxes in the structural diagram.

[0126] The above disclosure is only a preferred embodiment of the present application, and certainly cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A signal modulation chip, characterized in that: The signal modulation chip includes N first electrodes and N modulators, an input interface and an output interface, wherein the N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, and N is an integer greater than 1; The first electrode i is used to transmit the received electrical signal to the modulator i; i is a positive integer less than or equal to N; The first electrode i belongs to any first electrode among the N first electrodes, and the modulator i belongs to a modulator connected to the first electrode i among the N modulators; The input interface is used to transmit the received optical signal to the modulator i; The modulator i is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal; The output interface is used to output the modulated optical signal.

2. The chip according to claim 1, characterized in that: K first electrodes are located on the first side of the signal modulation chip, and L first electrodes are located on the second side of the signal modulation chip; the first side and the second side are adjacent to each other; K and L are positive integers, and the sum of K and L is N.

3. The chip according to claim 2, characterized in that: The first side is a main side, and the second side is a side adjacent to the main side; the main side is a side of the signal modulation chip whose distance from the host is less than a distance threshold.

4. The chip according to claim 2 or 3, characterized in that: When the signal modulation chip is in use, the K first electrodes are directed toward the host; or, the L first electrodes are directed toward the host.

5. The chip according to any one of claims 1 to 4, characterized in that: S first electrodes are located on the first side of the signal modulation chip, and D first electrodes are located on the second side of the signal modulation chip; there is a relative relationship between the first side and the second side; S and D are positive integers, and the sum of S and D is N.

6. The chip according to any one of claims 1 to 5, characterized in that: The modulators to which the S first electrodes are respectively connected have an adjacent position relationship, and the modulators to which the D first electrodes are respectively connected have an adjacent position relationship.

7. The chip according to any one of claims 1 to 6, characterized in that: The first electrode connected to the first modulator belongs to the S first electrodes, and the first electrode connected to the second modulator belongs to the D first electrodes; the first modulator and the second modulator are modulators having an adjacent position relationship among the N modulators.

8. The chip according to any one of claims 1 to 7, characterized in that: The first side edge and the second side edge are both perpendicular to the normal line of the main side edge of the signal modulation chip, and the main side edge is a side edge of the signal modulation chip whose distance from the host is less than a distance threshold.

9. The chip according to any one of claims 1 to 8, characterized in that: The signal modulation chip further includes N second electrodes, one second electrode being connected to one modulator; The second electrode j is used to control the modulator i to be in a working state; the modulator i in the working state is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal; The second electrode j is one of the N second electrodes connected to the modulator i is connected to a second electrode.

10. The chip according to any one of claims 1 to 9, characterized in that: The N first electrodes are all high-speed electrodes, and the N second electrodes are all low-speed electrodes.

11. The chip according to any one of claims 1 to 10, characterized in that: The electrical signal received by the first electrode i is transmitted to the first electrode i by the host through a printed circuit board.

12. The chip according to any one of claims 1 to 11, characterized in that: The optical signal received by the input interface is generated by a light source device, wherein the light source device is integrated on the signal modulation chip, or the light source device is separately external.

13. The chip according to any one of claims 1 to 12, characterized in that: The signal modulation chip has N channels, and the number of light source devices associated with the signal modulation chip is any one of N, N / 2 and N / 4.

14. The chip according to any one of claims 1 to 13, characterized in that: The signal modulation chip is a silicon photonic chip with four channels.

15. A signal modulation method, characterized in that: Applied to a signal modulation chip, the signal modulation chip includes N first electrodes and N modulators, an input interface and an output interface, the N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, N is an integer greater than 1, and the method includes: The received electrical signal is transmitted to the modulator i through the first electrode i; i is a positive integer less than or equal to N; the first electrode i belongs to any first electrode among the N first electrodes, and the modulator i belongs to a modulator connected to the first electrode i among the N modulators; Transmitting the received optical signal to the modulator i through the input interface; Modulating the optical signal according to the electrical signal through the modulator i to obtain a modulated optical signal; The modulated optical signal is outputted through the output interface.

16. A signal modulation system, characterized in that: The signal modulation system includes a signal modulation chip, the signal modulation chip includes N first electrodes and N modulators, an input interface and an output interface, the N first electrodes are distributed on different sides of the signal modulation chip, one first electrode is connected to one modulator, and N is an integer greater than 1; The first electrode i is used to transmit the received electrical signal to the modulator i; i is a positive integer less than or equal to N; The first electrode i belongs to any first electrode among the N first electrodes, and the modulator i belongs to a modulator connected to the first electrode i among the N modulators; The input interface is used to transmit the received optical signal to the modulator i; The modulator i is used to modulate the optical signal according to the electrical signal to obtain a modulated optical signal; The output interface is used to output the modulated optical signal.

17. The system according to claim 16, characterized in that The signal modulation system also includes a signal transmitter and a driving amplifier; The signal transmitter is used to send the received initial electrical signal to the driving amplifier; The driving amplifier is used to amplify the initial electrical signal to obtain the electrical signal, and send the electrical signal to the first An electrode i.

18. The system according to claim 16 or 17, characterized in that The signal modulation system also includes an optical fiber array and an optical connector; The optical fiber array is used to transmit the modulated optical signal output by the output interface to the optical connector; The optical connector is used to output the modulated optical signal.

19. A computer device, characterized in that: Comprising the signal modulation chip as claimed in any one of claims 1 to 14.

20. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to claim 15 are implemented.

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