Depth information camera module

Abstract

Disclosed in the present invention is a depth information camera module. The depth information camera module comprises a projection module, a receiving module, and a circuit board; the projection module comprises a light source chip assembly; the receiving module comprises a photosensitive chip and an optical lens arranged on a photosensitive path of a first photosensitive area of the photosensitive chip; the light source chip assembly and the photosensitive chip are respectively connected to the circuit board; and the light source chip assembly and the photosensitive chip have an overlapped part in the height direction so as to reduce the transverse size of the depth information camera module.

Description

Depth information camera module Technical Field

[0001] The present invention relates to the field of photography, and in particular to a depth information photography module. Background Art

[0002] As living standards rise, consumers are demanding more advanced camera functions in mobile phones, tablets, and other devices. For example, this has led to a growing demand for distance measurement capabilities. However, depth cameras with distance measurement functionality require both a projector and a receiver module, and these modules are typically placed side by side. This results in large depth cameras occupying valuable internal space in the device, hindering the development of depth cameras from meeting the trend toward thinner and lighter devices.

[0003] Therefore, an improved depth information camera module is needed to meet the configuration requirements of future terminal devices.

[0004] Summary of the Invention

[0005] One object of the present invention is to provide a depth information camera module, wherein the light source chip component and the photosensitive chip of the depth information camera module have an overlapping part in the height direction to reduce the lateral size of the depth information camera module.

[0006] One object of the present invention is to provide a depth information camera module, wherein the circuit board and the front packaging part of the depth information camera module isolate the first photosensitive area and the second photosensitive area of ​​the photosensitive chip to prevent the sensing light generated by the light source chip assembly from directly reaching the first photosensitive area of ​​the photosensitive chip inside the depth information camera module, so as to ensure the sensing accuracy of the depth information camera module.

[0007] One object of the present invention is to provide a depth information camera module, wherein a light shielding portion is provided between the circuit board and the non-photosensitive area of ​​the photosensitive chip to prevent a gap from being generated between the non-photosensitive area of ​​the photosensitive chip and the back side of the circuit board, so as to prevent the sensing light generated by the light source chip assembly from directly reaching the first photosensitive area of ​​the photosensitive chip inside the depth information camera module, thereby ensuring the sensing accuracy of the depth information camera module.

[0008] One object of the present invention is to provide a depth information camera module, wherein the bracket of the depth information camera module includes a bracket tube, and the bracket tube is mounted on the top surface of the front packaging part and covers the second photosensitive window of the front packaging part, so that when the light source chip assembly generates sensing light, the second photosensitive area of ​​the photosensitive chip can receive the sensing light inside the depth information camera module.

[0009] One object of the present invention is to provide a depth information camera module, wherein the bracket arm of the bracket extends laterally from the shoulder of the bracket tube, and the optical lens is assembled on the bracket arm. In this way, the depth information camera module allows the optical lens and the shoulder of the bracket tube to have an overlapping portion in the height direction on the basis of increasing the mounting area of ​​the top surface of the bracket and the front packaging part to improve the reliability of the mounting relationship between the bracket and the front packaging part, so as to reduce the lateral size of the depth information camera module.

[0010] According to one aspect of the present invention, the present invention provides a depth information camera module, comprising:

[0011] A projection module, wherein the projection module includes a light source chip assembly;

[0012] A receiving module, wherein the receiving module comprises a photosensitive chip and an optical lens disposed in a photosensitive light path of a first photosensitive area of ​​the photosensitive chip; and

[0013] A circuit board, wherein the light source chip assembly and the photosensitive chip are respectively connected to the circuit board, wherein the light source chip assembly and the photosensitive chip have overlapping parts in a height direction.

[0014] According to one embodiment of the present invention, the circuit board has a front side of the board, a back side of the board corresponding to the front side of the board, and a first opening extending from the front side of the board to the back side of the board, wherein the light source chip assembly is mounted on the front side of the board of the circuit board, the photosensitive chip is mounted on the back side of the board of the circuit board, and the first photosensitive area of ​​the photosensitive chip corresponds to the first opening of the circuit board.

[0015] According to one embodiment of the present invention, the depth information camera module further includes a non-light-transmitting front packaging part, the front packaging part has a light source window and a first photosensitive window, the front packaging part is arranged on the front side of the plate of the circuit board, and the light-emitting area of ​​the light source chip assembly corresponds to the light source window of the front packaging part, the sensing light generated by the light source chip assembly is allowed to be projected outward through the light source window of the front packaging part, the first opening of the circuit board corresponds to the first photosensitive window of the front packaging part, and the external light incident from the optical lens is allowed to reach the first photosensitive area of ​​the photosensitive chip through the first photosensitive window of the front packaging part and the first opening of the circuit board.

[0016] According to one embodiment of the present invention, the projection module includes a diffraction optical element, the depth information camera module includes a bracket, the bracket includes a bracket tube, the diffraction optical element is assembled in the bracket tube, wherein the bracket tube is mounted on the top surface of the front packaging part, so that the extension optical element is set in the output light path of the light source chip assembly by the bracket tube.

[0017] According to one embodiment of the present invention, the bracket includes a bracket arm, the bracket arm having a bracket channel, the bracket arm extending laterally from one side of the bottom of the bracket tube, wherein the bracket arm is mounted on the top surface of the front packaging portion in a manner that the bracket channel and the first photosensitive window correspond to each other, wherein the optical lens is assembled on the bracket arm, and the bracket channel of the bracket arm corresponds to the optical lens.

[0018] According to one embodiment of the present invention, the thickness of the adhesive used to bond the optical lens and the bracket arm is greater than the thickness of the adhesive used to bond the bracket and the top surface of the front packaging part.

[0019] According to one embodiment of the present invention, the circuit board has a second opening, which extends from the front side of the plate to the back side of the plate, and the second photosensitive area of ​​the photosensitive chip corresponds to the second opening of the circuit board, wherein the front packaging part has a second photosensitive window, and the second photosensitive window corresponds to the second opening of the circuit board, wherein the bracket tube covers the second photosensitive window of the front packaging part.

[0020] According to one embodiment of the present invention, the depth information camera module further includes a light-shielding portion, which is located between the back side of the plate of the circuit board and the non-photosensitive area of ​​the photosensitive chip, and at least one of the first photosensitive area and the second photosensitive area of ​​the photosensitive chip is surrounded by the light-shielding portion.

[0021] According to one embodiment of the present invention, the photosensitive chip has a non-photosensitive area, and the non-photosensitive area has an edge portion and a partition portion, the edge portion is located outside the first photosensitive area and the second photosensitive area, and the partition portion separates the first photosensitive area and the second photosensitive area so that the first photosensitive area and the second photosensitive area are independent of each other, wherein the chip pad of the photosensitive chip is arranged at the edge portion of the non-photosensitive area, wherein the depth information camera module further includes a light-shielding portion, and the light-shielding portion is located between the back side of the plate of the circuit board and the partition portion of the non-photosensitive area of ​​the photosensitive chip.

[0022] According to one embodiment of the present invention, the depth information camera module includes a light-transmitting element, and the light-transmitting element is entirely located in the second opening of the circuit board.

[0023] According to one embodiment of the present invention, the depth information camera module includes a light-transmitting element, the bottom of the light-transmitting element extends to the second opening of the circuit board, and the top of the light-transmitting element extends to the second light-sensitive window of the front packaging part.

[0024] According to one embodiment of the present invention, the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the front packaging part is integrally combined with the front surface of the plate of the circuit board and the light source chip assembly during molding and wraps the side of the top of the light-transmitting element, and exposes the top surface of the light-transmitting element; or the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the top of the light-transmitting element is inserted into the second light-sensitive window of the front packaging part.

[0025] According to one embodiment of the present invention, a portion of the light-transmitting element is molded in the second opening of the circuit board, and another portion of the light-transmitting element protrudes from the front surface of the plate material of the circuit board. The front packaging portion wraps the side of the top of the light-transmitting element during molding and exposes the top surface of the light-transmitting element.

[0026] According to one embodiment of the present invention, a reflective film is provided on the peripheral wall of the light-transmitting element.

[0027] According to one embodiment of the present invention, the projection module includes a reflective element, which is suspended directly above the second photosensitive window of the front packaging part to allow the second photosensitive area of ​​the photosensitive chip to face the reflective surface of the reflective element in the height direction.

[0028] According to one embodiment of the present invention, the reflective element is arranged on the inner wall of the bracket tube so that the bracket tube suspends the reflective element directly above the second photosensitive window of the front packaging part; or, the reflective element is applied to the inner wall of the bracket tube so that the bracket tube suspends the reflective element directly above the second photosensitive window of the front packaging part. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a cross-sectional schematic diagram of a depth information camera module according to a preferred embodiment of the present invention.

[0030] FIG2 is a schematic top view of a partial structure of the depth information camera module according to the preferred embodiment of the present invention.

[0031] FIG3 is a cross-sectional schematic diagram of a modified example of the depth information camera module according to the above preferred embodiment of the present invention.

[0032] FIG4 is a cross-sectional schematic diagram of another modified example of the depth information camera module according to the above preferred embodiment of the present invention.

[0033] FIG5 is a cross-sectional schematic diagram of another modified example of the depth information camera module according to the above preferred embodiment of the present invention.

[0034] FIG6 is a cross-sectional schematic diagram of another modified example of the depth information camera module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0035] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components set forth in the following description or illustrated in the following figures. The present invention is capable of other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "comprises," "includes," or "has" and variations thereof herein is intended to cover the items and their equivalents set forth below, as well as additional items. Unless otherwise specified or limited, the terms "mount," "connect," "support," and "couple" and variations thereof are used broadly and cover both direct and indirect mounting, connection, support, and coupling. In addition, "connect" and "couple" are not limited to physical or mechanical connections or couplings.

[0036] Furthermore, on the first hand, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second hand, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0037] With reference to Figures 1 and 2 of the accompanying drawings in the specification of the present invention, a depth information camera module according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the depth information camera module includes a projection module 10, a receiving module 20 and a circuit board 30.

[0038] Specifically, the projection module 10 includes a light source chip assembly 11, wherein the light emitting area of ​​the light source chip assembly 11 can generate sensing light. Furthermore, the projection module 10 includes a diffractive optical element (DOE) 12, which is arranged in the outgoing light path of the light source chip assembly 11, wherein the sensing light generated by the light emitting area of ​​the light source chip assembly 11 can be projected to the outside of the depth information camera module after passing through the diffractive optical element 12. For example, the sensing light generated by the light emitting area of ​​the light source chip assembly 11 can be projected toward a direction of a measured object after passing through the diffractive optical element 12. The diffractive optical element 12 is used to diffract the sensing light generated by the light emitting area of ​​the light source chip assembly 11 to form a desired light beam. The receiving module 20 includes a photosensitive chip 21 and an optical lens 22 disposed in the photosensitive optical path of the photosensitive chip 21. Light outside the depth information camera module (e.g., sensing light reflected by the object being measured) can reach the photosensitive chip 21 after passing through the optical lens 22. The light source chip assembly 11 and the photosensitive chip 21 are respectively connected to the same circuit board 30, and the light source chip assembly 11 and the photosensitive chip 21 have an overlapping portion in the height direction to reduce the lateral size of the depth information camera module.

[0039] It will be understood by those skilled in the art that the depth information camera module of the present invention is a time of flight (ToF) module, which obtains three-dimensional information of the object under test by measuring the flight time of the sensing light projected by the projection module 10 in space. For example, the distance information or surface depth information of the object under test can be measured by the depth information camera module. Specifically, the projection module 10 is used to project sensing light in the direction of the object under test, wherein at least part of the sensing light is reflected by the object under test, and the receiving module 20 is used to receive the sensing light reflected by the object under test, and the three-dimensional information of the object under test is obtained by calculating the flight time of the sensing light (that is, the time difference between the time when the projection module 10 starts to project the sensing light and the time when the receiving module 20 receives the sensing light).

[0040] Continuing to refer to Figures 1 and 2, the circuit board 30 has a plate front 31, a plate back 32 corresponding to the plate front 31, and a first opening 33 extending from the plate front 31 to the plate back 32. The light source chip assembly 11 is mounted on the plate front 31 of the circuit board 30, the photosensitive chip 21 is mounted on the plate back 32 of the circuit board 30, and the first photosensitive area 211 of the photosensitive chip 21 corresponds to the first opening 33 of the circuit board 30. The optical lens 22 is arranged in the photosensitive light path of the first photosensitive area 211 of the photosensitive chip 21. In this way, the depth information camera module can avoid mutual interference between the light source chip assembly 11 and the photosensitive chip 21, making it possible for the light source chip assembly 11 and the photosensitive chip 21 to have overlapping parts in the height direction. In other words, the depth information camera module does not require the circuit board 30 to reserve a position on the front surface 31 of the plate for simultaneously mounting the light source chip assembly 11 and the photosensitive chip 21, so as to reduce the lateral size of the depth information camera module. The shape of the first opening 33 of the circuit board 30 is consistent with the shape of the first photosensitive area 211 of the photosensitive chip 21, and the size of the first opening 33 of the circuit board 30 is slightly larger than the size of the first photosensitive area 211 of the photosensitive chip 21, so as to prevent the circuit board 30 from blocking external light passing through the optical lens 22.

[0041] In some embodiments of the depth information camera module of the present invention, the light source chip assembly 11 includes a driver chip 111 and at least one light source chip 112, and the driver chip 111 and the light source chip 112 are stacked and arranged on the front surface 31 of the plate of the circuit board 30 to reduce the lateral size of the depth information camera module. Specifically, based on the surface mounting technology (SMT), the driver chip 111 can be mounted on the front surface 31 of the plate of the circuit board 30, wherein the light source chip 112 is stacked and mounted above the driver chip 111, and based on the wire bonding process, the light source chip 112 can be electrically connected to the driver chip 111 or electrically connected to the circuit board 30, so that the driver chip 111 and the light source chip 112 are stacked and arranged on the front surface 31 of the plate of the circuit board 30. It can be understood that the wire bonding process refers to the process of electrically conducting two components that need to be electrically connected through wires such as gold wires.

[0042] The process of stacking the light source chip 112 on top of the driver chip 111 can be: first, bonding the light source chip 112 on top of the driver chip 111 by glue, and secondly, electrically connecting the light source chip 112 to the driver chip 111 or electrically connecting to the circuit board 30 by a wire bonding process. In this way, in the process of electrically connecting the light source chip 112 and the driver chip 111 or electrically connecting the light source chip 112 and the circuit board 30 by a wire bonding process, the relative position of the light source chip 112 and the circuit board 30 can be reliably maintained at the designed position to improve the yield of the depth information camera module.

[0043] It is worth mentioning that the specific type of the light source chip 112 is not limited in the depth information camera module of the present invention. For example, the light source chip 112 can be a light source in the form of a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, abbreviated as VCSEL, which can also be translated as vertical resonant cavity surface emitting laser), an edge emitting laser (Edge Emitting Laser, EEL), a light emitting diode (Light Emitting Diode, LED), a laser diode (Laser Diode, LD), etc., among which the edge emitting laser can be a Fabry Perot (FP) laser, a distributed feedback (DFB) laser, an electro-absorption modulated laser (Electro-absorption Modulated, EML), etc.

[0044] It is also worth mentioning that the number of the light source chips 112 in the depth information camera module of the present invention is not limited and can be singular or plural. In the embodiment where the number of the light source chips 112 is plural, the plural light source chips 112 can be arranged regularly, such as in an array, or can be arranged irregularly and randomly. In addition, in the embodiment where the number of the light source chips 112 is plural, the specific types of the plural light source chips 112 can be the same or different.

[0045] Continuing to refer to Figures 1 and 2, the depth information camera module further includes a non-transparent front packaging part 40, the front packaging part 40 has a light source window 41 and a first photosensitive window 42, the front packaging part 40 is integrally combined with the light source chip component 11 and the plate front 31 of the circuit board 30, and the light-emitting area of ​​the light source chip component 11 corresponds to the light source window 41 of the front packaging part 40, so as to allow the sensing light generated by the light source chip component 11 to be emitted through the light source window 41 of the front packaging part 40 and the diffraction optical element 12, and the first opening 33 of the circuit board 30 corresponds to the first photosensitive window 42 of the front packaging part 40, so as to allow the sensing light reflected by the object to be measured to reach the first photosensitive area 211 of the photosensitive chip 21 after passing through the optical lens 22 through the first photosensitive window 42 of the front packaging part 40 and the first opening 33 of the circuit board 30.

[0046] It can be understood that, since the front packaging portion 40 is integrally combined with the light source chip assembly 11 and the plate front 31 of the circuit board 30, the front packaging portion 40 enables the light source chip assembly 11 to be reliably mounted on the plate front 31 of the circuit board 30, thereby preventing the light source chip assembly 11 from falling off the plate front 31 of the circuit board 30. At the same time, the front packaging portion 40 can improve the flatness of the circuit board 30 and reinforce the strength of the circuit board 30, thereby preventing the circuit board 30 from deforming. In addition, since the front packaging portion 40 is integrally combined with the light source chip assembly 11, the front packaging portion 40 wraps the edge of the light source chip assembly 11. In this way, the heat generated by the light source chip assembly 11 when projecting sensing light to the outside of the depth information camera module can be quickly radiated outward through the front packaging portion 40, thereby helping to reduce the operating temperature of the depth information camera module and preventing the depth information camera module from degrading performance or malfunctioning due to prolonged high temperature.

[0047] In other examples of the depth information camera module of the present invention, the front packaging part 40 can be a preformed part, and the front packaging part 40 is arranged on the front side 31 of the plate of the circuit board 30. For example, the front packaging part 40 can be bonded to the front side 31 of the plate of the circuit board 30 by glue or other adhesives, wherein the light-emitting area 11 of the light source chip assembly 11 corresponds to the light source window 41 of the front packaging part 40, so as to allow the sensing light generated by the light source chip assembly 11 to be emitted through the light source window 41 of the front packaging part 40 and the diffraction optical element 12, and the first opening 33 of the circuit board 30 corresponds to the first photosensitive window 42 of the front packaging part 40, so as to allow the sensing light reflected by the object to be measured to reach the first photosensitive area 211 of the photosensitive chip 21 after passing through the optical lens 22 through the first photosensitive window 42 of the front packaging part 40 and the first opening 33 of the circuit board 30.

[0048] Continuing with reference to Figures 1 and 2 , the depth information camera module further includes a backside packaging portion 50 having a mounting channel 51. The backside packaging portion 50 is integrally coupled to the backside 32 of the circuit board 30, and the first opening 33 of the circuit board 30 corresponds to the mounting channel 51 of the backside packaging portion 50. The photosensitive chip 21 is mounted on the backside 32 of the circuit board 30 via the mounting channel 51 of the backside packaging portion 50.

[0049] It can be understood that by integrally combining the back packaging part 50 with the back side 32 of the plate of the circuit board 30, the back packaging part 50 can not only reinforce the strength of the circuit board 30 and prevent the circuit board 30 from deformation, but also further improve the heat dissipation capacity of the depth information camera module, which is conducive to further reducing the operating temperature of the depth information camera module.

[0050] Preferably, the bottom surface of the back packaging part 50 is flush with or lower than the bottom surface of the photosensitive chip 21. In this way, whether in the process of assembling the depth information camera module or in the process of assembling the depth information camera module in the terminal device, the back packaging part 50 can prevent the photosensitive chip 21 from being collided in the circumferential direction of the photosensitive chip 21, so as to ensure the reliability and stability of the depth information camera module.

[0051] In other examples of the depth information camera module of the present invention, the back side packaging part 50 can be a prefabricated part, and the back side packaging part 50 is arranged on the back side 32 of the plate of the circuit board 30. For example, the back side packaging part 50 can be bonded to the back side 32 of the plate of the circuit board 30 by adhesives such as glue.

[0052] In some embodiments of the depth information camera module of the present invention, the front packaging portion 40 can be first integrated with the plate front surface 31 of the circuit board 30 and the light source chip assembly 11, and then the back packaging portion 50 can be integrated with the plate back surface 32 of the circuit board 30. In some embodiments of the depth information camera module of the present invention, the back packaging portion 50 can be first integrated with the plate back surface 32 of the circuit board 30, and then the front packaging portion 40 can be integrated with the plate front surface 31 of the circuit board 30 and the light source chip assembly 11. In some embodiments of the depth information camera module of the present invention, the front packaging portion 40 and the back packaging portion 50 are manufactured by the same process, that is, while the front packaging portion 40 is integrated with the plate front surface 31 of the circuit board 30 and the light source chip assembly 11, the back packaging portion 50 is allowed to be integrated with the plate back surface 32 of the circuit board 30.

[0053] It is worth mentioning that the specific manner in which the front side packaging portion 40 is integrally combined with the front side panel 31 of the circuit board 30 and the light source chip assembly 11, and the back side packaging portion 50 is integrally combined with the back side panel 32 of the circuit board 30, is not limited in the depth information camera module of the present invention. For example, based on a molding process, the front side packaging portion 40 can be integrally combined with the front side panel 31 of the circuit board 30 and the light source chip assembly 11, and the back side packaging portion 50 can be integrally combined with the back side panel 32 of the circuit board 30, and by virtue of the advantages of the mold, the bottom surfaces of the front side packaging portion 40 and the bottom surfaces of the back side packaging portion 50 can have good flatness.

[0054] Continuing to refer to Figures 1 and 2, the depth information camera module further includes a plurality of electronic components 60, which may be resistors, capacitors, processors, drivers, diodes, memory chips, etc. The front side 31 of the board and / or the back side 32 of the board of the circuit board 30 may be mounted with the electronic components 60, wherein the front side packaging portion 40 wraps the electronic components 60 mounted on the front side 31 of the board of the circuit board 30, and the back side packaging portion 50 wraps the electronic components 60 mounted on the back side 32 of the board of the circuit board 30.

[0055] It can be understood that, since the light source chip assembly 11 is mounted on the front surface 31 of the board 30, the light source chip assembly 11 and the electronic components 60 mounted on the back surface 32 of the board 30 can overlap in height. Correspondingly, since the photosensitive chip 21 is mounted on the back surface 32 of the board 30, the photosensitive chip 21 and the electronic components 60 mounted on the front surface 31 of the board 30 can overlap in height. In this way, the lateral size of the depth information camera module can be reduced. At the same time, the light source chip assembly 11 and the electronic components 60 mounted on the front surface 31 of the board 30 can overlap in the horizontal direction, and the photosensitive chip 21 and the electronic components 60 mounted on the back surface 32 of the board 30 can overlap in the horizontal direction. In this way, the height size of the depth information camera module can also be controlled within a reasonable range.

[0056] Continuing to refer to Figures 1 and 2, the depth information camera module includes a non-transparent bracket 70, the bracket 70 includes a bracket tube 71, the bracket tube 71 includes a barrel 711 and a shoulder 712 extending laterally outward from the bottom of the barrel 711, the diffraction optical element 12 is assembled in the barrel 711 of the bracket tube 71, wherein the shoulder 712 of the bracket tube 71 is mounted on the top surface of the front packaging part 40, for example, the shoulder 712 of the bracket tube 71 can be mounted on the top surface of the front packaging part 40 by glue, so that the diffraction optical element 12 is set in the output light path of the light source chip assembly 11 by the bracket tube 71.

[0057] Preferably, the projection module 10 further includes a light-transmitting protective element 13, which is assembled to the barrel 711 of the support barrel 71 and is located outside the diffractive optical element 12 so as to protect the diffractive optical element 12. In this specific example of the depth information camera module shown in Figures 1 and 2, a gap is provided between the protective element 13 and the diffractive optical element 12. Alternatively, in other examples of the depth information camera module of the present invention, the protective element 13 may be stacked above the diffractive optical element 12.

[0058] Continuing to refer to Figures 1 and 2, the bracket 70 further includes a bracket arm 72, which has a bracket channel 721, wherein the bracket arm 72 extends laterally from one side of the shoulder 712 of the bracket tube 71, and the bracket arm 72 is mounted on the top surface of the front packaging part 40 in a manner corresponding to the bracket channel 721 and the first photosensitive window 42. For example, the bracket arm 72 can be mounted on the top surface of the front packaging part 40 by glue, so that the bracket arm 72 can increase the mounting area of ​​the bracket 70 and the top surface of the front packaging part 40, so that the bracket 70 is reliably mounted on the top surface of the front packaging part 40, wherein the optical lens 22 is assembled on the bracket arm 72, so that the bracket arm 72 sets the optical lens 22 in the photosensitive light path of the first photosensitive area 211 of the photosensitive chip 21.

[0059] It can be understood that through the above-mentioned structure, the depth information camera module can increase the mounting area of ​​the bracket 70 and the front packaging part 40 to improve the reliability of the mounting relationship between the bracket 70 and the front packaging part 40, while allowing the optical lens 22 and the shoulder 712 of the bracket tube 71 to have an overlapping part in the height direction to reduce the lateral size of the depth information camera module.

[0060] In addition, in the process of mounting the bracket 70 on the top surface of the front packaging part 40 and assembling the optical lens 22 on the bracket arm 72 of the bracket 70, first, after being identified by machine vision, the bracket 70 can be directly fixed to the top surface of the front packaging part 40 by glue or other adhesives. At this time, the bracket tube 71 of the bracket 70 enables the diffraction optical element 12 to be maintained in the output light path of the light source chip assembly 11. Secondly, the optical lens 22 is assembled on the bracket arm 72 of the bracket 70 by glue or other adhesives after active calibration. At this time, the bracket arm 72 enables the optical lens 22 to be maintained in the photosensitive light path of the first photosensitive area 211 of the photosensitive chip 21, wherein active calibration refers to continuing to adjust the position of the optical lens 22 based on the image obtained from the first photosensitive area 211 of the photosensitive chip 21. It is understandable that since the optical lens 22 needs to be actively calibrated, the thickness of the glue or other adhesive between the optical lens 22 and the bracket arm 72 is greater than the thickness of the glue or other adhesive between the bracket 70 and the top surface of the front packaging part 40.

[0061] Continuing to refer to Figures 1 and 2, the circuit board 30 has a second opening 34, which extends from the front side 31 of the plate to the back side 32 of the plate, wherein the second photosensitive area 212 of the photosensitive chip 21 corresponds to the second opening 34 of the circuit board 30, wherein the front packaging part 40 has a second photosensitive window 43, and the second opening 34 of the circuit board 30 corresponds to the second photosensitive window 43 of the front packaging part 40, and the bracket tube 71 is configured to cover the second photosensitive window 43 of the front packaging part 40, so that the sensing light projected by the light source chip assembly 11 toward the bracket tube 71 can reach the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging part 40 and the second opening 34 of the circuit board 30.

[0062] It can be understood that since the bracket tube 71 is arranged to cover the second photosensitive window 43 of the front packaging part 40, the portion of the sensing light projected by the light source chip assembly 11 toward the bracket tube 71 that is not projected outward through the diffraction optical element 12 and the protective element 13 is blocked from entering the receiving module 20, so as to avoid interfering with the sensing light reflected by the object to be measured and entering the receiving module 20 through the optical lens 22, thereby ensuring the sensing accuracy of the depth information camera module.

[0063] It can also be understood that when the light source chip assembly 11 of the projection module 10 projects sensing light toward the outside of the depth information camera module, the portion projected by the light source chip assembly 11 to the bracket tube 71 and not projected outward through the diffraction optical element 12 and the protection element 13 is allowed to pass through the second photosensitive window 43 of the front packaging portion 40 and the second opening 34 of the circuit board 30 to reach the second photosensitive area 212 of the photosensitive chip 21, so as to obtain the projection time point, that is, the second photosensitive area 212 of the photosensitive chip 21. The sensing light generated by the light source chip assembly 11 is directly received inside the projection module 10. The sensing light reflected by the object to be measured is allowed to pass through the optical lens 22 of the receiving module 20 and then reach the first photosensitive area 211 of the photosensitive chip 21 through the first photosensitive window 42 of the front packaging portion 40 and the first opening 33 of the circuit board 30 to obtain a receiving time point. By calculating the time difference between the projection time point and the receiving time point, the flight time of the sensing light in space can be obtained, thereby obtaining three-dimensional information of the object to be measured.

[0064] It is worth mentioning that, since the depth information camera module only uses the time point when the second photosensitive area 212 of the photosensitive chip 21 receives the sensing light generated by the light source chip assembly 11 as the projection time point, therefore, on the one hand, the area of ​​the second photosensitive area 212 of the photosensitive chip 21 can be smaller than the area of ​​the first photosensitive area 211. For example, in some embodiments of the depth information camera module of the present invention, the second photosensitive area 212 of the photosensitive chip 21 can include only one pixel point or multiple pixel points; on the other hand, the size of the second opening 34 of the circuit board 30 can be Greater than, equal to or smaller than the size of the second photosensitive area 212 of the photosensitive chip 21. Nevertheless, in this specific example of the depth information camera module of the present invention shown in Figures 1 and 2, the size of the second opening 34 of the circuit board 30 is designed to be larger than the size of the second photosensitive area 212 of the photosensitive chip 21. In this way, when sensing light is generated in the light-emitting area of ​​the light source chip assembly 11, more sensing light is allowed to reach the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging part 40 and the second opening 34 of the circuit board 30.

[0065] It is worth mentioning that the shape of the second opening 34 of the circuit board 30 is not limited in the depth information camera module of the present invention, and it can be circular, rectangular, or rounded rectangular, etc.

[0066] It is also worth noting that in some embodiments of the depth information camera module of the present invention, the size of the second opening 34 of the circuit board 30 increases from the back surface 32 of the board toward the front surface 31 of the board, thereby increasing the amount of sensing light that reaches the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging portion 40 and the second opening 34 of the circuit board 30. In other embodiments of the depth information camera module of the present invention, the size of the second opening 34 of the circuit board 30 increases from the front surface 31 of the board toward the back surface 32 of the board. In this way, after the sensing light reaches the second opening 34 of the circuit board 30 through the second photosensitive window 43 of the front packaging portion 40, it is less likely to be reflected by the inner wall of the circuit board 30 forming the second opening 34. As a result, the majority of the sensing light that reaches the second opening 34 of the circuit board 30 reaches the second photosensitive area 212 of the photosensitive chip 21. Of course, in other examples of the depth information camera module of the present invention, the second opening 34 of the circuit board 30 is a straight cylindrical opening.

[0067] In addition, the specific manner in which the photosensitive chip 21 is formed with the first photosensitive area 211 and the second photosensitive area 212 is not limited in the depth information camera module of the present invention. For example, in some embodiments of the depth information camera module of the present invention, the photosensitive chip 21 is formed with the first photosensitive area 211 and the second photosensitive area 212 of different sizes on the front of the photosensitive chip 21 during manufacturing. In some other embodiments of the depth information camera module of the present invention, the photosensitive chip 21 has a complete photosensitive area during manufacturing, and a mask is stacked on the complete photosensitive area to cover a portion of the complete photosensitive area, so that the remaining portion forms the first photosensitive area 211 and the second photosensitive area 212 of different sizes.

[0068] It can be understood that no matter how the photosensitive chip 21 is formed with the first photosensitive chip 211 and the second photosensitive area 212, the photosensitive chip 21 has a non-photosensitive area 213, and the non-photosensitive area 213 has an edge portion 2131 and a separating portion 2132. The edge portion 2131 is located on the outside of the first photosensitive area 211 and the second photosensitive area 212, and the separating portion 2132 separates the first photosensitive area 211 and the second photosensitive area 212, so that the first photosensitive area 211 and the second photosensitive area 212 are independent of each other. That is, a portion of the edge portion 2131 of the non-photosensitive region 213 and the partition portion 2132 surround the first photosensitive region 211, i.e., the first photosensitive region 211 is surrounded by the non-photosensitive region 213, and another portion of the edge portion 2131 of the non-photosensitive region 213 and the partition portion 2132 surround the second photosensitive region 212, i.e., the second photosensitive region 212 is surrounded by the non-photosensitive region 213. It will be understood that in the embodiment of the photosensitive chip 21 in which the partition portion 2132 of the non-photosensitive region 213 is formed by a mask, the chip bonding pad of the photosensitive chip 21 is located at the edge portion 2131 of the non-photosensitive region 213.

[0069] Preferably, the inner side surface of the light source window 41 of the front packaging portion 40 is an inclined surface, and its radial dimension gradually increases from bottom to top, so as to facilitate demolding when the front packaging portion 40 is molded by means of a mold and to facilitate the emission of the sensing light generated by the light source chip assembly 11. The inner side surfaces of the first light-sensitive window 42 and the second light-sensitive window 43 of the front packaging portion 40 are inclined surfaces, and their radial dimension gradually increases from bottom to top, so as to facilitate demolding when the front packaging portion 40 is molded by means of a mold and to facilitate the incidence of sensing light on the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21.

[0070] Referring to Figure 1, in this specific example of the depth information camera module of the present invention, the photosensitive chip 21 is upside down on the back side 32 of the circuit board 30 by hot pressing bonding, so that the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 can correspond to the first opening 33 and the second opening 34 of the circuit board 30 respectively.

[0071] Specifically, a sheet pad is provided on the back surface 32 of the sheet of the circuit board 30. A first solder is applied to the sheet pad of the circuit board 30. A chip pad is provided on the non-photosensitive area 213 of the photosensitive chip 21. For example, the chip pad can be provided at the edge portion 2131 of the non-photosensitive area 213 of the photosensitive chip 21, or at the partition portion 2132 of the non-photosensitive area 213. A second solder is applied to the chip pad of the photosensitive chip 21. When the photosensitive chip 21 is stacked on the circuit board 30, the position of the pad of the photosensitive chip 21 corresponds to the position of the sheet pad of the circuit board 30. Subsequently, the first solder and the second solder are bonded by thermocompression to achieve mounting between the circuit board 30 and the photosensitive chip 21. It is understood that after the first and second pads are thermocompressively bonded, the chip pad of the photosensitive chip 21 and the sheet pad of the circuit board 30 are electrically connected. Preferably, a non-conductive glue is provided at the bonding position of the photosensitive chip 21 and the circuit board 30. The non-conductive glue can enhance the connection strength between the photosensitive chip 21 and the circuit board 30 while protecting the solder, so that the photosensitive chip 21 can be reliably mounted on the circuit board 30.

[0072] It is worth mentioning that the material of the solder is not limited in the depth information camera module of the present invention. For example, in some embodiments of the depth information camera module of the present invention, the first solder may be a tin material, and the second solder may be a gold material. After the first solder of the tin material and the second solder of the gold material are hot-pressed and bonded, the photosensitive chip 21 can be mounted on the circuit board 30.

[0073] Continuing to refer to FIG1, since the second photosensitive area 212 of the photosensitive chip 21 directly receives the sensing light generated by the light source chip assembly 11 inside the projection module 10 to obtain the projection time point, the first photosensitive area 211 of the photosensitive chip 21 receives the sensing light reflected by the measured object to obtain the receiving time point, and the first photosensitive area 211 and the second photosensitive area 212 are located at different positions on the same side of the same photosensitive chip 21, so in order to avoid the sensing light generated by the light source chip assembly 11 from being projected onto the depth information camera module In the case of external light, the light is directly transmitted to the first photosensitive area 211 of the photosensitive chip 21. The depth information camera module further includes at least one light shielding portion 80, and the light shielding portion 80 is located between the back side 32 of the board 30 and the non-photosensitive area 213 of the photosensitive chip 21, and at least one of the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 is surrounded by the light shielding portion 80 to isolate the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 from each other.

[0074] The light-shielding portion 80 can be formed by glue applied between the back side 32 of the plate of the circuit board 30 and the non-photosensitive area 213 of the photosensitive chip 21. In this way, the light-shielding portion 80 can not only isolate the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21, but also can bond the back side 32 of the plate of the circuit board 30 and the non-photosensitive area 213 of the photosensitive chip 21, thereby enhancing the connection strength between the photosensitive chip 21 and the circuit board 30, so that the photosensitive chip 21 can be reliably mounted on the circuit board 30.

[0075] In this specific example of the depth information camera module of the present invention shown in Figures 1 and 2, the chip pad of the photosensitive chip 21 is only arranged at the edge part 2131 of the non-photosensitive area 213, that is, the partition part 2132 of the non-photosensitive area 213 of the photosensitive chip 21 is not provided with a chip pad. After the photosensitive chip 21 is mounted on the back side 32 of the plate of the circuit board 30, in order to avoid the formation of a gap between the photosensitive chip 21 and the circuit board 30 at the position corresponding to the partition part 2132 of the non-photosensitive area 213, the depth information camera module needs to set the light shielding part 80 between the photosensitive chip 21 and the circuit board 30 at the position corresponding to the partition part 2132 of the non-photosensitive area 213 to avoid the first photosensitive area 211 of the photosensitive chip 21 directly receiving the sensing light generated by the light source chip assembly 11 inside the depth information camera module.

[0076] In some embodiments of the depth information camera module of the present invention, the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 are respectively surrounded by the light shielding portion 80. In this way, light outside the depth information camera module is prevented from reaching the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 through the mounting position of the photosensitive chip 21 and the circuit board 30. Preferably, the glue used to form the light shielding portion 80 can be a non-conductive glue used to protect solder during the thermocompression bonding process.

[0077] Figure 3 shows a modified example of the depth information camera module according to the above-mentioned preferred embodiment of the present invention. Different from the depth information camera module shown in Figures 1 and 2, in this specific example of the depth information camera module of the present invention shown in Figure 3, the depth information camera module further includes a light-transmitting element 90, which is arranged above the second photosensitive area 212 of the photosensitive chip 21, wherein the sensing light generated by the light source chip assembly 11 is allowed to reach the second photosensitive area 212 of the photosensitive chip 21 after passing through the light-transmitting element 90.

[0078] Specifically, in this specific example of the depth information camera module shown in FIG3 , the bottom of the light-transmitting element 90 extends to and is retained in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 extends to and is retained in the second photosensitive window 43 of the front packaging portion 40, so that the light-transmitting element 90 is retained above the second photosensitive area 212 of the photosensitive chip 21 by the circuit board 30 and the front packaging portion 40. Preferably, a reflective film 100 is provided on the peripheral wall of the light-transmitting element 90 to allow more sensing light to reach the second photosensitive area 212 of the photosensitive chip 21. In some embodiments of the depth information camera module of the present invention, the reflective film 100 can be attached to the peripheral wall of the light-transmitting element 90. In other embodiments of the depth information camera module of the present invention, the reflective film 100 can be applied to the peripheral wall of the light-transmitting element 90.

[0079] In some embodiments of the depth information camera module of the present invention, the light-transmitting element 90 is a preformed part. For example, the light-transmitting element 90 can be an optical fiber, or other material made of glass or plastic, wherein the bottom of the light-transmitting element 90 is inserted into the second opening 34 of the circuit board 30, and the front packaging part 40 wraps the top of the light-transmitting element 90 during molding and exposes the top surface of the front packaging part 40, so that the bottom of the light-transmitting element 90 extends to and is retained in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 extends to and is retained in the second light-sensitive window 43 of the front packaging part 40. In some embodiments of the depth information camera module of the present invention, the light-transmitting element 90 is integrally formed on the circuit board 30, and the bottom of the light-transmitting element 90 is formed in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 protrudes from the front surface 31 of the plate of the circuit board 30. For example, a molding process can be used to allow a transparent molding material to form the light-transmitting element 90 on the circuit board 30, and the front packaging part 40 wraps the top of the light-transmitting element 90 during molding and exposes the top surface of the front packaging part 40, so that the bottom of the light-transmitting element 90 extends to and is retained in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 extends to and is retained in the second light-sensitive window 43 of the front packaging part 40.

[0080] Figure 4 shows a modified example of the depth information camera module according to the above-mentioned preferred embodiment of the present invention. Different from the depth information camera module shown in Figure 3, in this specific example of the depth information camera module of the present invention shown in Figure 4, the light-transmitting element 90 is located as a whole at the second opening 34 of the circuit board 30, that is, the height position of the top surface of the light-transmitting element 90 is flush with or slightly lower than the front surface 31 of the plate of the circuit board 30, and the light-transmitting element 90 corresponds to the second photosensitive window 43 of the front packaging part 40, so that the sensing light generated by the light source chip assembly 11 is allowed to reach the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging part 40 and the light-transmitting element 90.

[0081] FIG5 shows a variation of the depth information camera module according to the preferred embodiment of the present invention. Unlike the depth information camera module shown in FIG1 and FIG2 , in this specific example of the depth information camera module of the present invention shown in FIG5 , the projection module 10 further includes a reflective element 14. The reflective element 14 is suspended directly above the second light-sensitive window 43 of the front packaging portion 40 to allow the second light-sensitive area 212 of the light-sensitive chip 21 to correspond to the reflective element 14 in the height direction. In this way, the sensing light generated by the light source chip assembly 11 can be reflected by the reflective surface 141 of the reflective element 14 toward the second light-sensitive area 212 of the light-sensitive chip 21, thereby improving the accuracy of obtaining the projection time point. The extension direction of the reflective surface 141 of the reflective element 14 and the extension direction of the front surface 31 of the circuit board 30 can be parallel to each other or at an angle, which is selected as needed.

[0082] In some embodiments of the depth information camera module of the present invention, the reflective element 14 is a prefabricated component, which can be a reflective mirror. The reflective element 14 is disposed on the inner wall of the bracket tube 71 of the bracket 70. For example, the reflective element 14 can be bonded to the inner wall of the bracket tube 71 by glue, so that the reflective element 14 is suspended by the bracket tube 71 directly above the second light-sensitive window 43 of the front packaging portion 40. In some other embodiments of the depth information camera module of the present invention, the reflective element 14 can be applied to the inner wall of the bracket tube 71, so that the reflective element 14 is suspended by the bracket tube 71 directly above the second light-sensitive window 43 of the front packaging portion 40.

[0083] FIG6 shows a variation of the depth information camera module according to the preferred embodiment of the present invention. Unlike the depth information camera module shown in FIG1 and FIG2 , in this specific example of the depth information camera module of the present invention shown in FIG6 , the receiving module 20 further includes a filter element 23. The filter element 23 is mounted on the front packaging portion 40 so that the front packaging portion 40 holds the filter element 23 between the first photosensitive area 211 of the photosensitive chip 21 and the optical lens 22, thereby filtering stray light from the light entering the receiving module 20 through the optical lens 22. For example, in the specific example of the depth information camera module in which the first photosensitive area 211 of the photosensitive chip 21 only needs to receive infrared light, the filter element 23 is configured to filter light other than infrared light. Preferably, the top surface of the front packaging portion 40 surrounding the first photosensitive window 42 is recessed to form a mounting groove 44, and the filter element 23 is mounted on the mounting groove 44 of the front packaging portion 40 to avoid the setting of the filter element 23 increasing the height dimension of the depth information camera module.

[0084] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A depth information camera module, characterized in that: include: A projection module, wherein the projection module comprises a light source chip assembly; A receiving module, wherein the receiving module comprises a photosensitive chip and an optical lens disposed in a photosensitive light path of a first photosensitive area of ​​the photosensitive chip; as well as A circuit board, wherein the light source chip assembly and the photosensitive chip are respectively connected to the circuit board, wherein the light source chip assembly and the photosensitive chip have an overlapping portion in a height direction.

2. The depth information camera module according to claim 1, wherein the circuit board has a front side of the board, a back side of the board corresponding to the front side of the board, and a first opening extending from the front side of the board to the back side of the board, wherein the light source chip assembly is mounted on the front side of the board of the circuit board, the photosensitive chip is mounted on the back side of the board of the circuit board, and the first photosensitive area of ​​the photosensitive chip corresponds to the first opening of the circuit board.

3. The depth information camera module according to claim 2, wherein the depth information camera module further includes a non-light-transmissive front packaging part, the front packaging part having a light source window and a first photosensitive window, the front packaging part is arranged on the front side of the plate of the circuit board, and the light-emitting area of ​​the light source chip assembly corresponds to the light source window of the front packaging part, the sensing light generated by the light source chip assembly is allowed to be projected outward through the light source window of the front packaging part, the first opening of the circuit board corresponds to the first photosensitive window of the front packaging part, and the external light incident from the optical lens is allowed to reach the first photosensitive area of ​​the photosensitive chip through the first photosensitive window of the front packaging part and the first opening of the circuit board.

4. The depth information camera module according to claim 3, wherein the projection module includes a diffraction optical element, the depth information camera module includes a bracket, the bracket includes a bracket tube, the diffraction optical element is assembled in the bracket tube, wherein the bracket tube is mounted on the top surface of the front packaging part so that the extension optical element is set in the output light path of the light source chip assembly by the bracket tube.

5. The depth information camera module according to claim 4, wherein the bracket includes a bracket arm, the bracket arm has a bracket channel, the bracket arm extends laterally from one side of the bottom of the bracket tube, wherein the bracket arm is mounted on the top surface of the front packaging portion in a manner that the bracket channel and the first photosensitive window correspond, wherein the optical lens is assembled to the bracket arm, and the bracket channel of the bracket arm corresponds to the optical lens.

6. The depth information camera module according to claim 5, wherein the thickness of the adhesive used to bond the optical lens and the bracket arm is greater than the thickness of the adhesive used to bond the bracket and the top surface of the front packaging part.

7. The depth information camera module according to claim 4, 5 or 6, wherein the circuit board has a second opening, the second opening extends from the front side of the plate to the back side of the plate, the second photosensitive area of ​​the photosensitive chip corresponds to the second opening of the circuit board, wherein the front packaging part has a second photosensitive window, the second photosensitive window corresponds to the second opening of the circuit board, and the bracket tube covers the second photosensitive window of the front packaging part.

8. The depth information camera module according to claim 7, wherein the depth information camera module further comprises a light shielding portion, the light shielding portion is located between the back side of the plate of the circuit board and the non-photosensitive area of ​​the photosensitive chip, and at least one of the first photosensitive area and the second photosensitive area of ​​the photosensitive chip is surrounded by the light shielding portion.

9. The depth information camera module according to claim 7, wherein the photosensitive chip has a non-photosensitive area, the non-photosensitive area has an edge portion and a partition portion, the edge portion is located on the outside of the first photosensitive area and the second photosensitive area, the partition portion separates the first photosensitive area and the second photosensitive area so that the first photosensitive area and the second photosensitive area are independent of each other, wherein the chip pad of the photosensitive chip is arranged at the edge portion of the non-photosensitive area, wherein the depth information camera module further includes a shading portion, and the shading portion is located between the back side of the plate of the circuit board and the partition portion of the non-photosensitive area of ​​the photosensitive chip. 10 . The depth information camera module according to claim 7 , wherein the depth information camera module comprises a light-transmitting element, and the light-transmitting element is entirely located in the second opening of the circuit board.

11. The depth information camera module according to claim 7, wherein the depth information camera module comprises a light-transmitting element, the bottom of the light-transmitting element extends to the second opening of the circuit board, and the top of the light-transmitting element extends to the second light-sensitive window of the front packaging part.

12. The depth information camera module according to claim 11, wherein the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the front packaging part is integrally combined with the front surface of the plate material of the circuit board and the light source chip assembly during molding and wraps the side of the top of the light-transmitting element and exposes the top surface of the light-transmitting element; or the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the top of the light-transmitting element is inserted into the second light-sensitive window of the front packaging part.

13. The depth information camera module according to claim 11, wherein a portion of the light-transmitting element is molded in the second opening of the circuit board, another portion of the light-transmitting element protrudes from the front side of the plate of the circuit board, and the front packaging portion wraps the side of the top of the light-transmitting element during molding and exposes the top surface of the light-transmitting element.

14. The depth information camera module according to claim 11, wherein a reflective film is provided on the peripheral wall of the light-transmitting element.

15. The depth information camera module according to claim 7, wherein the projection module comprises a reflective element, and the reflective element is suspended directly above the second photosensitive window of the front packaging portion to allow the second photosensitive area of ​​the photosensitive chip to face the reflective surface of the reflective element in the height direction.

16. The depth information camera module according to claim 15, wherein the reflective element is arranged on the inner wall of the bracket tube so that the reflective element is suspended by the bracket tube directly above the second photosensitive window of the front packaging part; or, the reflective element is applied to the inner wall of the bracket tube so that the reflective element is suspended by the bracket tube directly above the second photosensitive window of the front packaging part.

Images