Display substrate and preparation method therefor, and display apparatus
By combining the TGBC structure and the Top Gate structure on the display substrate, and adopting a three-layer metal layout and a mesh power supply signal transmission structure, the problems of complex hole punching process and large area in the existing technology are solved, and higher display resolution and product yield are achieved.
Patent Information
- Application Number
- PCT/CN2024/112303
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-14
- Filing Date
- 2024-08-15
- Publication Date
- 2025-03-20
AI Technical Summary
The hole punching process of existing display substrates is complicated, resulting in a large area occupancy of pixel driving circuits, which limits the improvement of display resolution and affects product yield.
The display substrate design combining the top gate bottom layer connection (TGBC) structure and the Top Gate structure is adopted to reduce the number of vias in the adapter structure, increase the capacitance value of the storage capacitor through the three-layer metal-layout sandwich structure, and set power connection lines on the first conductive layer to form a mesh power supply signal transmission structure.
It effectively reduces the area occupied by the pixel driving circuit, improves the display resolution, reduces the complexity of the hole punching process, improves product yield, and improves display uniformity and quality.