Imaging element and imaging device

Abstract

An imaging element according to the present invention detects flare light. The imaging element according to the present disclosure has a pixel array unit and a detection pixel. The pixel array unit included in the imaging element is provided with a photoelectric conversion unit for performing photoelectric conversion of incident light, and has disposed therein a plurality of pixels for generating a pixel signal based on the charge generated by the photoelectric conversion. The detection pixel included in the imaging element is disposed in the pixel array unit, includes a photoelectric conversion unit, detects incident light obliquely incident from a boundary region with an adjacent pixel, and generates a detection pixel signal.

Description

Image pickup element and image pickup device

[0001] The present disclosure relates to an imaging element and an imaging device.

[0002] An image sensor that captures an image of a subject and generates an image is configured by arranging pixels in a two-dimensional matrix, each pixel having a photoelectric conversion unit that performs photoelectric conversion of incident light to generate electric charges. To improve image quality, an image sensor that detects and corrects image signals based on light different from direct light from the subject has been proposed. For example, an image sensor that includes a detection pixel that detects light leaking from an adjacent pixel has been proposed (see, for example, Patent Document 1).

[0003] JP 2013-034086 A

[0004] However, the above-described conventional technology has a problem in that it is difficult to detect an image due to flare light that occurs when capturing an image of a high-brightness subject, such as when capturing an image outdoors. Here, flare light refers to light that is generated when part of the light from the high-brightness subject is reflected by the incident surface of the image sensor, and this reflected light directly or indirectly enters surrounding pixels. When this flare light is photoelectrically converted by the pixels, an optical image other than the original subject is generated, resulting in a problem of degraded image quality.

[0005] Therefore, the present disclosure proposes an image sensor and an image pickup device that detect flare light.

[0006] The imaging element according to the present disclosure includes a pixel array section in which a plurality of pixels are arranged, each having a photoelectric conversion section that performs photoelectric conversion of incident light and that generates a pixel signal based on the charge generated by the photoelectric conversion, and a detection pixel that is arranged in the pixel array section, each having a photoelectric conversion section, and that detects the incident light that is obliquely incident from a boundary region between adjacent pixels and generates a detection pixel signal.

[0007] 1 is a diagram illustrating an example configuration of an imaging device according to an embodiment of the present disclosure. FIG. 2 is a diagram illustrating an example configuration of an imaging element according to an embodiment of the present disclosure. FIG. 3 is a diagram illustrating an example configuration of a pixel according to an embodiment of the present disclosure. FIG. 4 is a diagram illustrating an example configuration of a pixel according to an embodiment of the present disclosure. FIG. 5 is a diagram illustrating an example configuration of a pixel array unit according to an embodiment of the present disclosure. FIG. 6 is a diagram illustrating an example processing procedure for flare region detection processing according to an embodiment of the present disclosure. FIG. 7 is a diagram illustrating an example configuration of a pixel according to a first modified example of an embodiment of the present disclosure. FIG. 8 is a diagram illustrating an example configuration of a pixel according to a first modified example of an embodiment of the present disclosure. FIG. 9 is a diagram illustrating an example configuration of a pixel according to a second modified example of an embodiment of the present disclosure. FIG. 10 is a diagram illustrating an example configuration of a pixel according to a third modified example of an embodiment of the present disclosure. FIG. 11 is a diagram illustrating an example configuration of a pixel according to a fourth modified example of an embodiment of the present disclosure. FIG. 12 is a diagram illustrating an example configuration of a pixel according to a fifth modified example of an embodiment of the present disclosure. FIG. 13 is a diagram illustrating an example configuration of a pixel according to a sixth modified example of an embodiment of the present disclosure. FIG. 14 is a block diagram illustrating an example of a schematic configuration of a vehicle control system. FIG. 15 is an explanatory diagram illustrating an example of installation positions of an outside vehicle information detection unit and an imaging unit.

[0008] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order. Note that in the following embodiments, the same components are designated by the same reference numerals, and redundant description will be omitted. 1. Embodiment 2. Modification 3. Application Example

[0009] (1. Embodiment) [Configuration of Imaging Device] FIG. 1 is a diagram illustrating an example configuration of an imaging device according to an embodiment of the present disclosure. The figure is a block diagram illustrating an example configuration of an imaging device 1. The imaging device 1 captures an image based on incident light from a subject and generates image data. The imaging device 1 in the figure outputs pixel signals that constitute the image data. The imaging device 1 also detects flare light and further outputs a flare region, which is a region of the image caused by the flare light. The imaging device 1 includes an image sensor 2, an imaging lens 3, and a flare region detection unit 4.

[0010] The imaging lens 3 forms an optical image based on incident light from a subject on the light receiving surface of the imaging element 2 .

[0011] The image sensor 2 captures an image based on incident light and generates pixel signals. The image sensor 2 also detects flare light and generates detected pixel signals that are the detection results. The pixel signals are output to a device external to the image sensor 1. The detected pixel signals are also output to a flare area detector 4.

[0012] The flare region detection unit 4 detects a flare. This flare region detection unit 4 detects a flare region, which is a region where an optical image is formed by flare light, based on a detected pixel signal. The detected flare region is output to a device external to the imaging device 1. The flare region detection unit 4 is an example of a "processing unit" in the present disclosure.

[0013] [Configuration of Image Sensor] Fig. 2 is a diagram showing an example configuration of an image sensor according to an embodiment of the present disclosure. The figure is a block diagram showing an example configuration of an image sensor 2. The image sensor 2 is a semiconductor element that generates pixel signals of a subject. The image sensor 2 includes a pixel array unit 10, a vertical drive unit 20, a column signal processing unit 30, and a control unit 40.

[0014] The pixel array unit 10 is configured by arranging a plurality of pixels 100. The pixel array unit 10 in the figure illustrates an example in which the plurality of pixels 100 are arranged in a two-dimensional matrix. Here, the pixel 100 includes a photoelectric conversion unit that performs photoelectric conversion of incident light and generates a pixel signal of an object based on the incident light. The photoelectric conversion unit may be, for example, a photodiode. The pixel 100 also includes a pixel circuit that generates a pixel signal based on electric charges generated by the photoelectric conversion unit. Signal lines 11 and 12 are wired to each pixel 100. The pixel 100 generates a pixel signal under the control of a control signal transmitted through the signal line 11 and outputs the generated pixel signal via the signal line 12. The signal line 11 is arranged in rows of the two-dimensional matrix and is wired in common to the plurality of pixels 100 arranged in one row. The signal line 12 is arranged in columns of the two-dimensional matrix and is wired in common to the plurality of pixels 100 arranged in one column.

[0015] The vertical drive unit 20 generates control signals for the above-mentioned pixels 100. The vertical drive unit 20 in the figure generates control signals for each row of the two-dimensional matrix of the pixel array unit 10 and outputs them sequentially via signal lines 11.

[0016] The column signal processing unit 30 processes pixel signals generated by the pixels 100. The column signal processing unit 30 in the figure simultaneously processes pixel signals from multiple pixels 100 arranged in one row of the pixel array unit 10, which are transmitted via signal lines 12. This processing can include, for example, analog-to-digital conversion, which converts analog pixel signals generated by the pixels 100 into digital pixel signals, and correlated double sampling (CDS), which removes offset errors in the pixel signals. The processed pixel signals are output to a circuit or the like external to the image sensor 2.

[0017] The control unit 40 controls the vertical drive unit 20 and the column signal processing unit 30. The control unit 40 in the figure controls the vertical drive unit 20 and the column signal processing unit 30 by outputting control signals via signal lines 41 and 42, respectively.

[0018] The pixel array unit 10 in the figure includes detection pixels 200 (not shown). The detection pixels 200 perform photoelectric conversion of flare light to generate detection pixel signals.

[0019] [Configuration of Image Sensor] Fig. 3 is a diagram showing an example configuration of a pixel according to an embodiment of the present disclosure. Fig. 3 is a plan view showing an example configuration of a pixel 100 and a detection pixel 200 arranged in a pixel array unit 10 of the image sensor 2. The dotted line area in Fig. 3 represents the pixel 100. The pixel 100 is formed on a semiconductor substrate (semiconductor substrate 120). The white area in Fig. 3 represents the area of ​​the semiconductor substrate 120.

[0020] The pixel 100 includes a first photoelectric conversion unit 101 and a second photoelectric conversion unit 102. The dashed-dotted lines in FIG. 3 represent the regions of the first photoelectric conversion unit 101 and the second photoelectric conversion unit 102. The first photoelectric conversion unit 101 is an example configured to be octagonal in a planar view. The second photoelectric conversion unit 102 is an example configured to be rectangular in a planar view. The first photoelectric conversion unit 101 is a photoelectric conversion unit with a large light-receiving area. The second photoelectric conversion unit 102 is a photoelectric conversion unit with a smaller light-receiving area than the first photoelectric conversion unit 101. By switching between the first photoelectric conversion unit 101 and the second photoelectric conversion unit 102, the sensitivity during imaging can be switched. When the first photoelectric conversion unit 101 is used, high-sensitivity imaging can be performed. On the other hand, when the second photoelectric conversion unit 102 is used, low-sensitivity imaging can be performed. This makes it possible to capture images with a high dynamic range (HDR).

[0021] Furthermore, a color filter (color filter 170) described below is disposed in the pixel 100. This color filter 170 is an optical filter that transmits incident light of a predetermined wavelength. The color filter 170 may be a color filter that transmits red light, a color filter that transmits green light, or a color filter that transmits blue light. The alphabets in FIG. 3 indicate the type of color filter 170 disposed in the pixel 100. "R" indicates a color filter 170 that corresponds to red light. "G" indicates a color filter 170 that corresponds to green light. "B" indicates a color filter 170 that corresponds to blue light.

[0022] Furthermore, separating portions 135 (not shown) and light-shielding portions 136 are arranged at the boundaries of the pixels 100. As will be described later in FIG. 4 , the separating portions 135 are arranged on the semiconductor substrate 120 at the boundaries of the pixels 100 to electrically isolate the pixels 100 from each other. Furthermore, the light-shielding portions 136 are arranged near the rear surface of the semiconductor substrate 120 at the boundaries of the pixels 100 to block light from adjacent pixels 100. The dotted hatched areas in FIG. 3 represent the light-shielding portions 136.

[0023] A detection pixel 200 is shown in the center of the pixel array unit 10 in FIG. 3 . The dashed line area represents the area of ​​the detection pixel 200. The semiconductor substrate 120 of the detection pixel 200 is distinguished by diagonal hatching. The detection pixel 200 in FIG. 3 represents an example including a second photoelectric conversion unit 102. A light-shielding film 251 is also arranged in the detection pixel 200. This light-shielding film 251 blocks incident light other than flare light. An opening 137 is also formed in the light-shielding unit 136 in the area between the detection pixel 200 and the pixel 100.

[0024] The detection pixel 200 may also be configured to include the first photoelectric conversion unit 101. Specifically, a light-shielding film may be disposed on the pixel 100 adjacent to the lower left of the detection pixel 200 in FIG. 3 , and the pixel 100 may also be used as the detection pixel 200. The detection pixel 200 may also be configured to include both the first photoelectric conversion unit 101 and the second photoelectric conversion unit 102.

[0025] 4 is a diagram showing an example of the configuration of a pixel according to an embodiment of the present disclosure. The figure is a cross-sectional view showing an example of the configuration of a pixel 100 and a detection pixel 200 arranged in a pixel array unit 10 of the image sensor 2. The left side of the figure shows an example of the configuration of the pixel 100, and the right side of the figure shows an example of the configuration of the detection pixel 200. The pixel 100 includes a semiconductor substrate 120, a wiring region 140, a color filter 170, and on-chip lenses 171 and 172.

[0026] The semiconductor substrate 120 is a semiconductor substrate on which elements such as the pixel 100 are formed. This semiconductor substrate 120 can be made of silicon (Si). For convenience, the semiconductor substrate 120 in FIG. 4 is assumed to constitute a p-type well region. Elements can be formed by arranging an n-type or p-type semiconductor region in this well region. The open rectangles represent semiconductor regions. FIG. 4 shows an n-type semiconductor region 121 that constitutes the first photoelectric conversion unit 101 and an n-type semiconductor region 122 that constitutes the second photoelectric conversion unit 102. The pn junctions at the interfaces between these semiconductor regions and the surrounding well regions constitute photodiodes.

[0027] A wiring region 140 is disposed on the front surface of the semiconductor substrate 120 via an insulating film 131. This wiring region 140 is a region where wiring for transmitting signals and the like to elements of the pixel 100 is disposed.

[0028] An insulating film 132 is disposed on the rear surface of the semiconductor substrate 120. Furthermore, a separation section 135 is disposed in the region of the semiconductor substrate 120 at the boundary of the pixels 100. This separation section 135 serves to insulate the pixels 100 from each other. The separation section 135 is made of, for example, silicon oxide (SiO ２ The separation section 135 is also disposed between the first photoelectric conversion section 101 and the second photoelectric conversion section 102. The separation section 135 is formed by disposing a SiO ２ can be formed by arranging

[0029] Furthermore, a light-shielding portion 136 is disposed at the boundary between pixels 100 near the rear surface of the semiconductor substrate 120. This light-shielding portion 136 blocks light incident obliquely from adjacent pixels 100. By disposing this light-shielding portion 136, color mixing and crosstalk can be reduced. The light-shielding portion 136 can be made of tungsten or the like.

[0030] The above-mentioned color filter 170 and on-chip lenses 171 and 172 are arranged on the back surface side of the semiconductor substrate 120. The on-chip lens 171 corresponds to the first photoelectric conversion unit 101, and the on-chip lens 172 corresponds to the second photoelectric conversion unit 102.

[0031] The detection pixel 200 includes a second photoelectric conversion unit 102 and an on-chip lens 172. The detection pixel 200 also includes a light-shielding film 251. This light-shielding film 251 is disposed on the light-receiving surface side of the second photoelectric conversion unit 102 and blocks direct light from incident light. The dotted arrows in FIG. 4 represent direct light. This direct light is blocked by the light-shielding film 251 after passing through the on-chip lens 172 and the color filter 170. This inhibits photoelectric conversion based on the direct light in the second photoelectric conversion unit 102. The light-shielding film 251 can be made of tungsten, similar to the light-shielding unit 136.

[0032] Furthermore, an opening 137 is disposed in the light-shielding portion 136 between the detection pixel 200 and the pixel 100. That is, the light-shielding portion 136 is not disposed in the boundary region between the detection pixel 200 and the pixel 100. Therefore, oblique incident light is incident on the detection pixel 200 through the region between the detection pixel 200 and the pixel 100. The arrows in FIG. 4 represent this oblique incident light. Such light at a high incident angle (e.g., 60 to 80 degrees) corresponds to flare light. The detection pixel 200 performs photoelectric conversion of the flare light to generate a pixel signal. This pixel signal corresponds to the detection pixel signal. Note that FIG. 4 illustrates an example in which an opening 137 is disposed between the detection pixel 200 and the pixel 100 on the right side of the drawing. Here, the detection pixel 200 in FIG. 4 has a different color filter 170 disposed therein than the pixel 100 on the right side of the drawing. For example, a color filter 170 corresponding to green light is arranged in the detection pixel 200, and a color filter 170 corresponding to red light is arranged in the pixel 100 on the right side. In this case, the detection pixel 200 can detect red flare light. Note that a configuration in which a light-shielding portion 136 is arranged between the detection pixel 200 and the pixel 100 on the right side of the drawing, and an opening 137 is arranged between the detection pixel 200 and the pixel 100 on the left side of the drawing. The pixel 100 on the left side of the drawing has the same color filter 170 as the detection pixel 200 (a color filter 170 corresponding to green light). In this case, the detection pixel 200 can detect green flare light. Note that a configuration in which an opening 137 is arranged between the detection pixel 200 and the adjacent pixel 100.

[0033] 5 is a diagram illustrating an example configuration of a pixel array unit according to an embodiment of the present disclosure. The diagram illustrates an example configuration of a pixel array unit 10. The pixels 100 and the like of the pixel array unit 10 in the diagram are divided into a plurality of regions 300. A detection pixel 200 is arranged in each of the regions 300. The region 300 can be configured to include, for example, pixels 100 arranged in 100 rows and 100 columns. The flare region detection unit 4 in FIG. 1 detects the range of the optical image of the flare in units of the region 300.

[0034] [Flare Region Detection Processing] FIG. 6 is a diagram illustrating an example of a processing procedure of the flare region detection processing according to an embodiment of the present disclosure. The figure is a flowchart illustrating an example of a processing procedure of the flare region detection processing in the flare region detection unit 4. First, the flare region detection unit 4 selects one of the regions 300 (step S101). Next, the flare region detection unit 4 acquires detection pixel signals of the detection pixels 200 included in the selected region 300 (step S102). Next, the flare region detection unit 4 determines whether the acquired detection pixel signals are greater than a threshold (step S103). As a result, if the detection pixel signals are not greater than the threshold (step S103, No), the flare region detection unit 4 proceeds to step S105. On the other hand, if the detection pixel signals are greater than the threshold (step S103, Yes), the flare region detection unit 4 outputs the region 300 as a flare region (step S104) and proceeds to step S105.

[0035] In step S105, the flare region detection unit 4 determines whether all regions 300 have been selected (step S105). As a result, if all regions 300 have been selected (step S105, Yes), the flare region detection unit 4 ends the process. On the other hand, if all regions 300 have not been selected (step S105, No), the flare region detection unit 4 returns to the process of step S101 and selects another region 300.

[0036] The image of the area determined to be a flare area can be excluded from the image data. For example, it can be determined that another sensor (such as a Lidar or millimeter-wave sensor) is to be used for recognition in that area. This makes it possible to suppress the occurrence of erroneous recognition due to flare. Note that the image data for the detection pixel 200 will be missing. By performing defect correction processing, the image data for this detection pixel 200 can be complemented.

[0037] In this way, the image sensor 2 according to the embodiment of the present disclosure can detect flare light using the detection pixels 200 arranged in the pixel array section 10 .

[0038] (2. Modifications) Modifications of the above-described embodiment will now be described.

[0039] 7 and 8 are diagrams showing an example of the configuration of a pixel according to a first modified example of the embodiment of the present disclosure. Fig. 7 is a plan view showing the example of the configuration of a pixel 100 and a detection pixel 200. Fig. 8 is a cross-sectional view showing the example of the configuration of the pixel 100 and the detection pixel 200. The pixel 100 adjacent to the detection pixel 200 in Figs. 7 and 8 includes a second light-shielding film 151. This can reduce the influence of stray light from the pixel 100.

[0040] 9 and 10 are diagrams illustrating an example configuration of a pixel according to a second modified example of the embodiment of the present disclosure. Fig. 9 is a plan view illustrating the example configuration of a pixel 100 and a detection pixel 200. Fig. 10 is a cross-sectional view illustrating the example configuration of the pixel 100 and the detection pixel 200. The color filter 170 is omitted from the pixel 100 adjacent to the detection pixel 200 in Figs. 9 and 10. This makes it possible to reduce the wavelength dependency of flare light.

[0041] 11 is a diagram showing an example of the configuration of a pixel according to a third modified example of the embodiment of the present disclosure. The figure is a cross-sectional view showing the example of the configuration of a detection pixel 200. The detection pixel 200 in the figure shows an example in which the separation unit 135 is omitted. This allows the detection pixel 200 in the figure to detect crosstalk and color mixture from adjacent pixels 100.

[0042] 12 is a diagram showing a configuration example of a pixel according to a fourth modified example of the embodiment of the present disclosure. The figure is a cross-sectional view showing the configuration example of a detection pixel 200. The detection pixel 200 in the figure shows an example in which the on-chip lens 172 is omitted.

[0043] FIG. 13 is a diagram illustrating an example of a pixel configuration according to a fifth modified example of an embodiment of the present disclosure. This figure is a cross-sectional view illustrating an example of the configuration of a pixel 100 and a detection pixel 200. The pixel 100 in this figure illustrates an example in which pupil correction is performed. Here, pupil correction refers to a process of displacing and positioning the on-chip lenses 171 and 172 and the color filter 170 in accordance with the distance from the center of the pixel array unit 10. This allows the pixels 100 in the peripheral portion of the pixel array unit 10 to improve the detection efficiency of obliquely incident light. Pupil correction can also be performed on the detection pixel 200 in this figure. Specifically, the on-chip lens 172, color filter 170, and light-shielding film 251 of the detection pixel 200 are displaced and positioned in accordance with the distance from the center of the pixel array unit 10. This allows the detection efficiency of the detection pixels 200 in the peripheral portion of the pixel array unit 10 to improve.

[0044] 14 is a diagram showing a configuration example of a pixel according to a sixth modified example of the embodiment of the present disclosure. The figure is a plan view showing configuration examples of a pixel 100 and a detection pixel 200. The pixel 100 in the figure includes a first photoelectric conversion unit 103 configured in an L-shape and a second photoelectric conversion unit 104 configured in a rectangular shape. Also, circles in the figure represent on-chip lenses 173. As shown in the figure, three on-chip lenses 173 are arranged in the first photoelectric conversion unit 103. The detection pixel 200 in the figure includes the second photoelectric conversion unit 104.

[0045] The configuration of the image sensor 2 other than that described above is the same as the configuration of the image sensor 2 in the embodiment of the present disclosure, and therefore description thereof will be omitted.

[0046] (3. Application Examples to Mobile Bodies) The technology according to the present disclosure (the present technology) can be applied to various products. For example, the technology according to the present disclosure may be realized as a device mounted on any type of mobile body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, or a robot.

[0047] FIG. 15 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile object control system to which the technology according to the present disclosure can be applied.

[0048] The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in Fig. 15, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside-vehicle information detection unit 12030, an inside-vehicle information detection unit 12040, and an integrated control unit 12050. Also shown as functional components of the integrated control unit 12050 are a microcomputer 12051, an audio / video output unit 12052, and an in-vehicle network I / F (Interface) 12053.

[0049] The drivetrain control unit 12010 controls the operation of devices related to the drivetrain of the vehicle in accordance with various programs. For example, the drivetrain control unit 12010 functions as a control device for a drive force generating device for generating a drive force of the vehicle, such as an internal combustion engine or a drive motor, a drive force transmission mechanism for transmitting the drive force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating a braking force of the vehicle.

[0050] The body system control unit 12020 controls the operation of various devices equipped in the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for a keyless entry system, a smart key system, a power window device, or various lamps such as headlamps, backup lamps, brake lamps, turn signals, and fog lamps. In this case, radio waves transmitted from a portable device that serves as a key or signals from various switches can be input to the body system control unit 12020. The body system control unit 12020 receives these radio waves or signals and controls the vehicle's door lock device, power window device, lamps, etc.

[0051] The outside-vehicle information detection unit 12030 detects information outside the vehicle equipped with the vehicle control system 12000. For example, an imaging unit 12031 is connected to the outside-vehicle information detection unit 12030. The outside-vehicle information detection unit 12030 causes the imaging unit 12031 to capture images outside the vehicle and receives the captured images. The outside-vehicle information detection unit 12030 may perform object detection processing or distance detection processing for people, cars, obstacles, signs, characters on the road surface, etc. based on the received images.

[0052] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image or as distance measurement information. The light received by the imaging unit 12031 may be visible light or invisible light such as infrared light.

[0053] The in-vehicle information detection unit 12040 detects information inside the vehicle. For example, a driver state detection unit 12041 that detects the state of the driver is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that captures an image of the driver, and the in-vehicle information detection unit 12040 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041, or may determine whether the driver is dozing off.

[0054] The microcomputer 12051 can calculate control target values ​​for the driving force generating device, steering mechanism, or braking device based on the information inside and outside the vehicle acquired by the outside-vehicle information detection unit 12030 or the inside-vehicle information detection unit 12040, and output control commands to the drive system control unit 12010. For example, the microcomputer 12051 can perform cooperative control aimed at realizing the functions of an ADAS (Advanced Driver Assistance System), including vehicle collision avoidance or impact mitigation, following driving based on the distance between vehicles, maintaining vehicle speed, vehicle collision warning, vehicle lane departure warning, etc.

[0055] In addition, the microcomputer 12051 can perform cooperative control for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation, by controlling the driving force generating device, steering mechanism, braking device, etc. based on information about the surroundings of the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040.

[0056] Furthermore, the microcomputer 12051 can output a control command to the body system control unit 12030 based on the information outside the vehicle acquired by the outside information detection unit 12030. For example, the microcomputer 12051 can control the headlamps according to the position of a preceding vehicle or an oncoming vehicle detected by the outside information detection unit 12030, and perform cooperative control aimed at preventing glare, such as switching from high beams to low beams.

[0057] The audio / video output unit 12052 transmits at least one of audio and video output signals to an output device capable of visually or audibly notifying the passengers of the vehicle or the outside of the vehicle of information. In the example of Fig. 15, the output devices are exemplified by an audio speaker 12061, a display unit 12062, and an instrument panel 12063. The display unit 12062 may include, for example, at least one of an on-board display and a head-up display.

[0058] FIG. 16 is a diagram showing an example of the installation position of the imaging unit 12031.

[0059] In FIG. 16, the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0060] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as the front nose, side mirrors, rear bumper, back door, and the top of the windshield inside the vehicle cabin of the vehicle 12100. The imaging unit 12101 provided on the front nose and the imaging unit 12105 provided on the top of the windshield inside the vehicle cabin mainly acquire images of the front of the vehicle 12100. The imaging units 12102 and 12103 provided on the side mirrors mainly acquire images of the sides of the vehicle 12100. The imaging unit 12104 provided on the rear bumper or back door mainly acquires images of the rear of the vehicle 12100. The imaging unit 12105 provided on the top of the windshield inside the vehicle cabin is mainly used to detect preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, etc.

[0061] 16 shows an example of the imaging ranges of the imaging units 12101 to 12104. Imaging range 12111 indicates the imaging range of the imaging unit 12101 provided on the front nose, imaging ranges 12112 and 12113 indicate the imaging ranges of the imaging units 12102 and 12103 provided on the side mirrors, respectively, and imaging range 12114 indicates the imaging range of the imaging unit 12104 provided on the rear bumper or back door. For example, by overlaying the image data captured by the imaging units 12101 to 12104, an overhead image of the vehicle 12100 viewed from above can be obtained.

[0062] At least one of the image capturing units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the image capturing units 12101 to 12104 may be a stereo camera made up of multiple image capturing elements, or may be an image capturing element having pixels for phase difference detection.

[0063] For example, based on the distance information obtained from the imaging units 12101 to 12104, the microcomputer 12051 can calculate the distance to each three-dimensional object within the imaging ranges 12111 to 12114 and the change in this distance over time (relative speed with respect to the vehicle 12100), thereby extracting as a preceding vehicle, in particular, the three-dimensional object that is the closest three-dimensional object on the path of the vehicle 12100 and traveling in approximately the same direction as the vehicle 12100 at a predetermined speed (e.g., 0 km / h or higher). Furthermore, the microcomputer 12051 can set a vehicle-to-vehicle distance to be maintained in advance in front of the preceding vehicle, and perform automatic braking control (including follow-up stop control), automatic acceleration control (including follow-up start control), etc. In this way, cooperative control can be performed for the purpose of autonomous driving, which allows the vehicle to travel autonomously without relying on driver operation.

[0064] For example, the microcomputer 12051 classifies and extracts three-dimensional object data regarding three-dimensional objects into two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on distance information obtained from the imaging units 12101 to 12104, and can use the data for automatic obstacle avoidance. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 then determines a collision risk that indicates the risk of collision with each obstacle, and when the collision risk is equal to or greater than a set value and a collision is possible, the microcomputer 12051 can provide driving assistance for collision avoidance by outputting an alarm to the driver via the audio speaker 12061 or the display unit 12062, or by performing forced deceleration or avoidance steering via the drive system control unit 12010.

[0065] At least one of the image capturing units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the images captured by the image capturing units 12101 to 12104. Such pedestrian recognition is performed, for example, by extracting feature points from the images captured by the image capturing units 12101 to 12104 as infrared cameras and performing pattern matching on a series of feature points that indicate the outline of an object to determine whether the object is a pedestrian. When the microcomputer 12051 determines that a pedestrian is present in the images captured by the image capturing units 12101 to 12104 and recognizes the pedestrian, the audio / image output unit 12052 controls the display unit 12062 to superimpose a rectangular outline on the recognized pedestrian for emphasis. The audio / image output unit 12052 may also control the display unit 12062 to display an icon or the like indicating the pedestrian at a desired position.

[0066] The above describes an example of a vehicle control system to which the technology according to the present disclosure can be applied. The technology according to the present disclosure can be applied to the imaging unit 12031 of the above-described configuration. Specifically, the imaging device 1 in FIG. 1 can be applied to the imaging unit 12031.

[0067] The effects described in this specification are merely examples and are not limiting, and other effects may also be present.

[0068] The present technology may also be configured as follows: (1) An imaging element including: a pixel array section in which a plurality of pixels are arranged, each pixel including a photoelectric conversion unit that performs photoelectric conversion of incident light and generates a pixel signal based on electric charges generated by the photoelectric conversion; and a detection pixel that is arranged in the pixel array section, each pixel including a photoelectric conversion unit, and that detects the incident light that is obliquely incident from a boundary region between an adjacent pixel and the pixel, and generates a detection pixel signal. (2) The imaging element according to (1), wherein the detection pixel includes a light-shielding film arranged on a light-receiving surface side of the photoelectric conversion unit. (3) The imaging element according to (2), further including a second light-shielding film arranged on a light-receiving surface side of the photoelectric conversion unit of the pixel adjacent to the detection pixel. (4) The imaging element according to (2), wherein the light-shielding film is arranged at a position corresponding to a distance from the center of the pixel array section. (5) The imaging element according to any one of (1) to (4), wherein the pixel includes a first photoelectric conversion unit that is the photoelectric conversion unit having a large light-receiving area and a second photoelectric conversion unit that is the photoelectric conversion unit having a small light-receiving area. (6) The imaging element according to (5), wherein the detection pixel includes at least one of the first photoelectric conversion unit and the second photoelectric conversion unit. (7) The imaging element according to any one of (1) to (6), further including a light-shielding unit disposed at a boundary of the pixels to block the incident light, wherein the light-shielding unit includes an opening disposed between the detection pixel and the pixel. (8) The imaging element according to any one of (1) to (7), wherein the pixel includes an on-chip lens disposed therein to focus the incident light onto the photoelectric conversion unit, and wherein the detection pixel does not include the on-chip lens. (9) The imaging element according to any one of (1) to (8), further including a color filter disposed in the pixels other than the pixel adjacent to the detection pixel and transmitting the incident light of a predetermined wavelength. (10) The imaging element according to any one of (1) to (9), further including a separation unit disposed between the pixels, wherein the separation unit is not disposed between the detection pixel and the pixel. (11) The imaging element according to any one of (1) to (10), wherein the plurality of pixels in the pixel array unit are divided into a plurality of regions, and the detection pixel is disposed in each of the regions.(12) An imaging device comprising: a pixel array section in which a plurality of pixels are arranged, each having a photoelectric conversion section that performs photoelectric conversion of incident light and that generates a pixel signal based on an electric charge generated by the photoelectric conversion, and a detection pixel that is arranged in the pixel array section, each having a photoelectric conversion section, and that detects the incident light that is obliquely incident from a boundary region between the adjacent pixels and generates a detection pixel signal, and a processing section that processes the detection pixel signal. (13) The imaging device described in (12), in which the processing section performs processing to detect flare based on the detection pixel signal.

[0069] REFERENCE SIGNS LIST 1 imaging device 2 imaging element 4 flare area detection section 10 pixel array section 100 pixel 101, 103 first photoelectric conversion section 102, 104 second photoelectric conversion section 135 separation section 136 light-shielding section 137 opening 151 second light-shielding film 170 color filter 171 to 173 on-chip lens 200 detection pixel 251 light-shielding film 300 area 12031, 12101 to 12104 imaging section

Claims

1. An imaging element having: a pixel array section in which a plurality of pixels are arranged, each having a photoelectric conversion section that performs photoelectric conversion of incident light and that generates a pixel signal based on an electric charge generated by the photoelectric conversion; and a detection pixel arranged in the pixel array section, each having a photoelectric conversion section, each detecting the incident light that is obliquely incident from a boundary region between adjacent pixels, and generating a detection pixel signal.

2. The imaging element according to claim 1, wherein the detection pixel is provided with a light-shielding film disposed on the light-receiving surface side of the photoelectric conversion portion.

3. The imaging element according to claim 2, further comprising a second light-shielding film disposed on the light-receiving surface side of the photoelectric conversion section of the pixel adjacent to the detection pixel.

4. The imaging element according to claim 2, wherein the light-shielding film is disposed at a position according to a distance from the center of the pixel array portion.

5. The image sensor according to claim 1, wherein the pixel comprises a first photoelectric conversion unit having a large light receiving area and a second photoelectric conversion unit having a small light receiving area.

6. The imaging element according to claim 5, wherein the detection pixel comprises at least one of the first photoelectric conversion unit and the second photoelectric conversion unit.

7. The imaging element according to claim 1, further comprising a light-shielding portion disposed at a boundary between the pixels to block the incident light, the light-shielding portion having an opening disposed between the detection pixel and the pixel.

8. The imaging element according to claim 1, wherein the pixel is provided with an on-chip lens that focuses the incident light onto the photoelectric conversion unit, and the detection pixel is not provided with the on-chip lens.

9. The image sensor according to claim 1, further comprising a color filter arranged at each of the pixels other than the pixel adjacent to the detection pixel, for transmitting the incident light of a predetermined wavelength.

10. The imaging element according to claim 1, further comprising a separation section disposed between the pixels, the separation section not being disposed between the detection pixel and the pixel.

11. The imaging element according to claim 1, wherein the plurality of pixels in the pixel array section are divided into a plurality of regions, and the detection pixel is disposed in each of the regions.

12. An imaging device having: a pixel array section in which a plurality of pixels are arranged, each having a photoelectric conversion section that performs photoelectric conversion of incident light and generates a pixel signal based on an electric charge generated by the photoelectric conversion; an imaging element including a detection pixel arranged in the pixel array section, each having a photoelectric conversion section, detecting the incident light that is obliquely incident from a boundary region between adjacent pixels, and generating a detection pixel signal; and a processing section that processes the detection pixel signal.

13. The imaging device according to claim 12, wherein the processing unit performs processing for detecting flare based on the detection pixel signal.

Images