Electronic device including antenna

Abstract

An electronic device according to an embodiment comprises: a first housing; a second housing which includes a side member containing a conductive material, is movably connected to the first housing along the direction of movement, and is at least partially inserted into the first housing; a PCB which is disposed inside the electronic device and on which a wireless communication circuit is disposed; a power supply unit which applies current to the side member; and a ground for grounding the side member. The side member may include: a segmentation portion that is formed open in a first direction so as to segment the side member into a first conductive region and a second conductive region that are different from each other; and a first slit that is formed open in a second direction, perpendicular to the first direction, from the segmentation portion, and located in the first conductive region.

Description

Electronic device including an antenna

[0001] The disclosure below relates to an electronic device including an antenna.

[0002] Electronic devices supporting wireless communication include antennas for transmitting and receiving signals in a specified frequency range. Recently, with the miniaturization of electronic devices such as smartphones, the space required for antennas for communication has decreased, leading to the use of metal frames forming the exterior of electronic devices as antennas. The background technology described above was acquired or acquired during the process of deriving the present invention and cannot necessarily be considered publicly available technology prior to the filing of the present disclosure.

[0003] In one embodiment, an electronic device may include a first housing, a second housing movably connected to the first housing along a direction of movement, at least a portion of which is inserted into the first housing, and a side member including a conductive material, a PCB disposed inside the electronic device and having a wireless communication circuit disposed thereon, a power supply unit for applying current to the side member, and a ground for grounding the side member. In one embodiment, the side member may include a segment formed to be open in a first direction so as to segment the side member into a first conductive region and a second conductive region that are electrically insulated from each other, and a first slit formed to be open in a second direction perpendicular to the first direction from the segment and positioned in the first conductive region.

[0004] An electronic device according to one embodiment may include a first housing, a second housing movably connected to the first housing along a direction of movement such that the electronic device changes states between a first state having a minimum size and a second state having a maximum size, and a PCB disposed inside the electronic device, the PCB having wireless communication circuitry disposed thereon. In one embodiment, the second housing includes a side member comprising a conductive material, the side member including a first side portion forming at least a portion of the side, a second side portion connected to the first side portion and retractable into the first housing in the first state and retractable from the first housing in the second state, a segment formed openly in the first side portion and segmenting the first side portion into a first conductive region facing the second side portion and a second conductive region electrically insulated from the first conductive region, and a first slit disposed in the first conductive region and having at least a portion formed in the first side portion along a direction perpendicular to the segment from the segment. In one embodiment, a first feed portion for applying a current and a first ground for grounding a current from the first conductive region may be connected to the first conductive region.

[0005] An electronic device according to one embodiment may include a housing including a front surface, a rear surface opposite to the front surface, and a side surface that surrounds a space between the front surface and the rear surface and includes a conductive material, a PCB disposed inside the housing and having a wireless communication circuit disposed thereon, a power supply unit that applies current to the side surface, and a ground that grounds the side surface. In one embodiment, the side surface may include a segment that segments the side surface into a first conductive region and a second conductive region that are electrically insulated from each other and is formed to be open in a first direction perpendicular to the rear surface, and a first slit that is formed to be open in a second direction perpendicular to the first direction from the segment and is located in the first conductive region.

[0006] The above and other aspects, features and advantages according to specific embodiments of the present disclosure will become more apparent from the detailed description below with reference to the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0008] FIG. 2A is a front perspective view illustrating a first state of an electronic device according to one embodiment.

[0009] FIG. 2b is a front perspective view illustrating a second state of an electronic device according to one embodiment.

[0010] FIG. 2c is a rear perspective view illustrating a first state of an electronic device according to one embodiment.

[0011] FIG. 2d is a rear perspective view illustrating a second state of an electronic device according to one embodiment.

[0012] FIG. 3A is a perspective view illustrating a first state of an electronic device having a conductive region according to one embodiment.

[0013] FIG. 3b is a perspective view illustrating a second state of an electronic device having a conductive region according to one embodiment.

[0014] FIG. 3c is a partial cross-sectional view of an electronic device illustrating a conductive region of a side member according to one embodiment.

[0015] FIG. 3d is a partial perspective view of a side member illustrating a conductive region according to one embodiment.

[0016] FIGS. 4A and 4B are graphs for explaining antenna resonance efficiency by a first slit in an electronic device according to one embodiment.

[0017] FIGS. 5A and 5B are graphs for explaining the difference in antenna performance depending on the presence or absence of the first slit in an electronic device according to one embodiment.

[0018] FIG. 6 is a partial perspective view of a side member for illustrating a challenging region according to one embodiment.

[0019] FIG. 7A is a side view illustrating a first state of an electronic device according to one embodiment.

[0020] FIG. 7b is a side view illustrating a second state of an electronic device according to one embodiment.

[0021] Figure 8a is a graph measuring the resonance efficiency of the antenna illustrated in Figure 7.

[0022] FIG. 8b is a graph showing the performance deviation of an antenna including the conductive region illustrated in FIG. 7.

[0023] FIG. 9 is a side view of an electronic device illustrating a first slit according to one embodiment.

[0024] Figure 10 is a graph showing the change in resonance frequency according to the width of the first slit.

[0025] FIG. 11 is a side view of an electronic device illustrating a first slit according to one embodiment.

[0026] Figure 12 is a graph showing the change in resonant frequency according to the length of the first slit.

[0027] FIGS. 13 to 16 are partial side views of side members for illustrating a conductive region according to one embodiment, respectively.

[0028] FIG. 17 is a graph showing the antenna resonance efficiency using each of the side members illustrated in FIG. 3a, FIG. 14 to FIG. 16.

[0029] FIG. 18 is a side view illustrating a second state of an electronic device according to one embodiment.

[0030] FIG. 19A is a perspective view illustrating a first state of an electronic device having a conductive region according to one embodiment.

[0031] FIG. 19b is a perspective view illustrating a second state of an electronic device having a conductive region according to one embodiment.

[0032] FIG. 20 is a perspective view illustrating a second state of an electronic device having a conductive region according to one embodiment.

[0033] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0034] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0035] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2A is a front perspective view illustrating a first state of an electronic device according to an embodiment, and FIG. 2B is a front perspective view illustrating a second state of the electronic device according to an embodiment. FIG. 2C is a rear perspective view illustrating a first state of the electronic device according to an embodiment, and FIG. 2D is a rear perspective view illustrating a second state of the electronic device according to an embodiment.

[0057] Referring to FIGS. 2A to 2D , an electronic device (301) according to an embodiment (e.g., the electronic device (101) of FIG. 1 ) may be deformable. In an embodiment, the electronic device (301) may change in size by expanding and contracting along a movement direction (e.g., a direction parallel to the Y-axis of FIG. 2A ). For example, the electronic device (301) may be deformed between a first state (e.g., a slide-in state) as in FIG. 2A and a second state (e.g., a slide-out state) as in FIG. 2B .

[0058] In one embodiment, the electronic device (301) may include housings (310, 320) that form an exterior and accommodate components therein. In one embodiment, the housings (310, 320) may include a first housing (310) and a second housing (320) that are movably connected to each other. In one embodiment, the second housing (320) may be slidably connected to the first housing (310). For example, the second housing (320) may move relative to the first housing (310) in a first movement direction (①) (e.g., in the -Y-axis direction), or may slide in a second movement direction (②) (e.g., in the +Y-axis direction) opposite to the first movement direction (①). Hereinafter, in the embodiment disclosed in this document, the state transformation of the electronic device (301) is described based on the movement of the second housing (320) with respect to the first housing (310), but this is for describing the relative movement motion between the first housing (310) and the second housing (320), and can also be understood as the first housing (310) moving with respect to the second housing (320).

[0059] In one embodiment, the state of the electronic device (301) can change between a first state (e.g., a slide-in state) and a second state (e.g., a slide-out state) depending on the relative movement of the second housing (320) with respect to the first housing (310). In one embodiment, the electronic device (301) can have a minimum exposure area of ​​the display (361) in the first state, and the electronic device (301) can have a maximum exposure area of ​​the display (361) in the second state. In one embodiment, the electronic device (301) can be used in the first state and the second state, but can also be used in an intermediate state between the first state and the second state.

[0060] In one embodiment, the first housing (310) has a first-first side (310a) (e.g., a first front side), a first-second side (310b) opposite to the first-first side (310a) (e.g., a first rear side), a first-first side (310c) facing a first side direction (e.g., +X direction) and formed between the first-first side (310a) and the first-second side (310b), a second side (310d) facing a second side direction opposite to the first side direction (e.g., -X direction) and formed between the first-first side (310a) and the first-second side (310b), and a third side (310d) facing a third side direction (e.g., -Y direction) intersecting the first side direction and formed between the first-first side (310a) and the first-second side (310b). It may include a side (310e).

[0061] In one embodiment, the first housing (310) may include a first plate (311) and a first side member (312) extending substantially in the thickness direction (e.g., +Z direction) along the edge of the first plate (311). In one embodiment, the first plate (311) may form a first-second surface (310b), and the first side member (312) may form side surfaces (310c, 310d, 310e) of the first housing (310). In one embodiment, the first plate (311) and the first side member (312) may be formed integrally, or may be formed separately and then joined.

[0062] In one embodiment, the second housing (320) has a 2-1 side (320a) (e.g., a second front side), a 2-2 side (320b) opposite to the 2-1 side (320a) (e.g., a second rear side), a 2-1 side (320c) formed between the 2-1 side (320a) and the 2-2 side (320b) and facing a first side direction (e.g., +X direction), a 2-2 side (320d) formed between the 2-1 side (320a) and the 2-2 side (320b) and facing a second side direction opposite to the first side direction (e.g., -X direction), and a fourth side (320d) formed between the 2-1 side (320a) and the 2-2 side (320b) and facing a fourth side direction (e.g., +Y direction) intersecting the first side direction. It may include a side (320e).

[0063] In one embodiment, the second housing (320) may include a second plate (321) and a second side member (322) extending substantially in the thickness direction (e.g., +Z direction) along the edge of the second plate (321). In one embodiment, the second plate (321) may form a fourth surface (320b), and the second side member (322) may form side surfaces (320c, 320d, 320e) of the second housing (320). In one embodiment, the second plate (321) and the second side member (322) may be formed integrally, or may be formed separately and then joined.

[0064] In one embodiment, the first housing (310) and the second housing (320) may form a first side (front side) (201a) (e.g., a side facing +Z) of the electronic device (301) through the first-first side (310a) and the second-first side (320a), and may form a second side (rear side) (301b) (e.g., a side facing -Z) of the electronic device (301) through the first-second side (310b) and the second-second side (320b). In one embodiment, the first side (301a) of the electronic device (301) may be opened to expose the display (361). In one embodiment, the first housing (310) and the second housing (320) may form a first side (301c) (e.g., a side facing +X) of the electronic device (301) through the first-first side (310c) and the second-first side (320c), and may form a second side (301d) (e.g., a side facing -X) of the electronic device (301) through the first-second side (310d) and the second-second side (320d).

[0065] In one embodiment, the second housing (320) can be drawn out or inserted into the first housing (310) while being partially inserted into the first housing (310). In one embodiment, the first housing (310) can include an open portion (310g) that is formed to be open in a fourth side direction opposite to the third side direction so that the second housing (320) can be inserted. In one embodiment, in the process of the second housing (320) being inserted into the first housing (310), at least a portion of the 2-1 side (320c) and the 2-2 side (320d) of the second housing (320) can be inserted into the interior of the first housing (310) and be covered by the 1-1 side (310c) and the 1-2 side (310d). Accordingly, the first side (301c) and the second side (301d) of the electronic device (301) can change in length depending on the state of the electronic device.

[0066] In one embodiment, the electronic device (301) may include a display (361) (e.g., a flexible display or a rollable display) for displaying visual information. In one embodiment, the display (361) may be exposed to the outside, for example, the front, of the electronic device (301) through a display area (3610). In one embodiment, the display area (3610) may include a first area (361a) positioned on the first-first side (310a) and the second-first side (320a), a second area (361b) positioned adjacent to the third side (310e), and a third area (361c) positioned adjacent to the fourth side (320e). In one embodiment, the second area (361b) and / or the third area (361c) may form a flexibly curved surface. In one embodiment, the display area (3610) can be expanded or contracted according to the change in the size of the first area (361a). In one embodiment, the display (361) can display a screen using the display area (3610). In one embodiment, the display (361) can display a single connected screen through the display area (3610) or can display a screen using only a portion of the display area (3610). In one embodiment, the display (361) can display a plurality of distinct screens on the display area (3610).

[0067] In one embodiment, the display (361) may include a planar portion (3611) that forms at least a portion of a display area (3610) (e.g., the first area (361a) in the first state of FIG. 2A) and is supported by the first housing (310) and the second housing (320), and a rolling portion (3612) (or bending portion) that extends in a first movement direction from the planar portion (3611) and is supported by the first housing (310). In one embodiment, the planar portion (3611) may be exposed to the first surfaces of the housings (310, 320) to form the display area (3610) regardless of a state change of the electronic device (301). In one embodiment, the rolling portion (3612) may be introduced into the interior of the electronic device (301) or withdrawn to the exterior of the electronic device (301) according to the movement motion of the second housing (320) with respect to the first housing (310). In one embodiment, the rolling portion (3612) withdrawn to the exterior of the electronic device (301) may be disposed on the first-first surface (310a) of the first housing (310) so as to be exposed to the exterior of the electronic device (301) and may form a display area (3610) together with the flat portion (3611). For example, the area of ​​the display area (3610) may change depending on the degree of withdrawal of the rolling portion (3612).

[0068] In one embodiment, the display (361) may change the area of ​​the display area (3610) (e.g., the first area (361a), the second area (361b), and the third area (361c)) in response to a change in the state of the electronic device (301). In one embodiment, the display area (3610) of the display (361) may form a first area (e.g., a minimum area) that is minimized in a first state of the electronic device (301) (e.g., a slide-in state of FIG. 2a), and a second area (e.g., a maximum area) that is maximized in a second state of the electronic device (301) (e.g., a slide-out state of FIG. 2b). When the electronic device (301) is in a state between the first state and the second state, the display (361) can change its state in response to the state of the electronic device (301), thereby allowing the display area (3610) to have an area between the first area and the second area. For example, in an operation in which the state of the electronic device (301) changes from the first state to the second state, when the second housing (320) moves in the second movement direction (②) with respect to the first housing (310) by a predetermined length (d), the display area (3610) can be expanded as the length of the display area (3610) parallel to the second movement direction (②) (e.g., the length parallel to the Y-axis) changes from the first length (d1) to a second length (d2) that increases by the predetermined length (d). For example, when the state of the electronic device (301) changes from the second state to the first state, and the second housing (320) moves in the first movement direction (①) with respect to the first housing (310) by a certain length (d), the length of the display area (3610) parallel to the first movement direction (①) (e.g., the length parallel to the Y axis) may change from the second length (d2) to the first length (d1) that is reduced by the certain length (d), thereby reducing the display area (3610).In one embodiment, the sizes of the second region (361b) and the third region (361c) can be maintained substantially constant regardless of the state change of the electronic device (301).

[0069] In one embodiment, the electronic device (301) may include an input button (350) (e.g., an input module (150) of FIG. 1), an audio output module (e.g., an audio output module (155) of FIG. 1), a camera module (380) (e.g., a camera module (180) of FIG. 1), and a connector port (308). In one embodiment, the electronic device (301) may omit at least one of the above-described components or may additionally include other components.

[0070] In one embodiment, the input button (350) can receive an input signal according to a user's operation. The input button (350) is arranged on the outside of the electronic device (301) and can be pressed by the user to transmit the input signal to the processor (processor (120) of FIG. 1). In one embodiment, the input button (350) can be formed on the side surfaces of the housings (310, 320). For example, the input button (350) can be formed on at least one of the third side surface (310c) or the fourth side surface (310d) of the first housing (310). Hereinafter, for the convenience of explanation, an embodiment in which one input button (B) is formed on the third side surface (310c) of the first housing (310) will be described. However, it should be noted that the arrangement location and number of input buttons (350) for the electronic device (301) in the following description are for convenience of explanation and are not limited to the embodiments.

[0071] In one embodiment, the sound output module can be radiated to the outside through sound holes (H1, H2) that are in communication with the outside of the housings (310, 320). In one embodiment, the sound holes (H1, H2) can include, for example, a first sound hole (H1) formed in the first housing (310) and a second sound hole (H2) formed in the second housing (320). In one embodiment, the first sound hole (H1) and the second sound hole (H2) can be substantially aligned to be in communication with each other in the first state of the electronic device (301).

[0072] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0073] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0074] The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0075] One embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0076] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0077] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0078] FIG. 3A is a perspective view illustrating a first state of an electronic device having a conductive region according to one embodiment, and FIG. 3B is a perspective view illustrating a second state of an electronic device having a conductive region according to one embodiment. FIG. 3C is a partial cross-sectional view of an electronic device for illustrating a conductive region of a side member according to one embodiment, and FIG. 3D is a partial perspective view of a side member for illustrating a conductive region according to one embodiment.

[0079] Referring to FIGS. 3A to 3D, an electronic device (401) according to one embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (301) of FIG. 2A) may include a first housing (410), a second housing (420), and a PCB.

[0080] In one embodiment, the electronic device (401) may change its state depending on the relative movement of the first housing (410) and the second housing (420). For example, the second housing (420) may be movably connected to the first housing (410) along a direction of movement (e.g., the Y-axis direction of FIG. 3A). In one embodiment, the second housing (420) may be at least partially retractable relative to the first housing (410).

[0081] In one embodiment, the second housing (420) can include a side member (460) forming a side surface (e.g., the second side member (322) of FIG. 2A). For example, the side member (460) can include a conductive material and at least a portion thereof can be recessed into the first housing (410). In one embodiment, the side member (460) can form a second-first side surface (420c) of the second housing (410) (e.g., the second-first side surface (320c) of FIG. 2A), a second-second side surface (420d) (e.g., the second-second side surface (320d) of FIG. 2A), and a fourth side surface (420e) (e.g., the fourth side surface (320c) of FIG. 2A).

[0082] In one embodiment, a portion of the side member (460) may function as a radiator of an antenna that transmits and receives electrical signals to and from the outside. For example, by forming a slot in the opening area (O), which is a non-conductive area, the antenna may be operated. In one embodiment, the side member (460) may include one or more segments (461) that segment the side member (460) into a plurality of conductive areas (A1, A2).

[0083] In one embodiment, one or more segments (461) may segment the side member (460) along the side of the electronic device (401) into a plurality of conductive regions (A1, A2).

[0084] Hereinafter, for convenience of explanation, an embodiment is described in which a segment (461) is formed on the 2-1 side of the side member (460), and a first conductive region (A1) and a second conductive region (A2) are partitioned based on the segment (461), but the partitioning of the conductive region formed on the side member (460) is not limited thereto.

[0085] According to one embodiment, the antenna may be formed as a slit antenna. The slit antenna may perform wireless communication by radiating electromagnetic waves using a slit that forms a gap between two conductors. In one embodiment, the slit structure (A) of the slit antenna may include a segment (461) and a first slit (462) formed in a side member (460) of the second housing (420).

[0086] In one embodiment, the segmented portion (461) may be formed to be open in the thickness direction (e.g., in the direction parallel to the Z-axis direction of FIG. 3A) on the side member (460) so as to segment the side member (460). From this structure, the side member (460) may be segmented into two different conductive regions (A1, A2). Among the two conductive regions (A1, A2), the conductive region located closer to the first housing (410) with respect to the segmented portion (461) may be referred to as the first conductive region (A1), and the other may be referred to as the second conductive region (A2). The first conductive region (A1) and the second conductive region (A2) may, for example, operate as antenna radiators of different frequency bands. The first conductive region (A1) and the second conductive region (A2) can be connected to the PCB and the power supply unit (440).

[0087] In one embodiment, a Printed Circuit Board (PCB) may be disposed inside an electronic device (401). A processor (e.g., processor (120) of FIG. 1) may be disposed on the PCB. The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), an image signal processor, a sensor hub processor, or a communication processor.

[0088] In one embodiment, a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be disposed on a PCB. The wireless communication circuit may communicate with, for example, an external device (e.g., an electronic device (104) of FIG. 1). The electronic device (401) may include an antenna (e.g., an antenna module (197) of FIG. 1), and the wireless communication circuit may be electrically connected to the antenna. In one embodiment, the wireless communication circuit may generate a signal to be transmitted through the antenna, or detect a signal received through the antenna. In one embodiment, the PCB may include a ground, and the ground of the PCB may function as a ground of an antenna implemented using the wireless communication circuit.

[0089] In one embodiment, the antenna connection unit (440) may be configured to operate as a feed unit or a ground unit. Hereinafter, a case in which the first antenna connection unit (441) and the second antenna connection unit (442) each operate as a feed unit will be described.

[0090] In one embodiment, the power supply unit (440) can apply current to the side member (460). In one embodiment, the power supply unit (440) can be connected to a wireless communication circuit and can radiate electromagnetic waves for wireless communication by applying current to the side member (460). In one embodiment, the power supply unit (440) can include a first power supply unit (441) connecting the wireless communication circuit and the first conductive area (A1), and a second power supply unit (442) connecting the wireless communication circuit and the second conductive area (A2). For example, the current applied through the first power supply unit (441) can travel along the side member (460) to the first ground. For example, the current applied through the second power supply unit (442) can travel along the side member (460) to the second ground. In one embodiment, when both the first antenna connection portion (441) and the second antenna connection portion (442) operate as feed portions, the first conductive region (A1) and the second conductive region (A2) along the periphery of the opening area (O) may each operate as an open slit antenna. In one embodiment, the second antenna connection portion (442) may also operate as a ground portion of the antenna generated by the first feed portion (441).

[0091] In one embodiment, the length of the electrical path along which the current travels may be equal to a resonant length matching the desired frequency. For example, the length of the electrical path (L1) (hereinafter referred to as the “first electrical path”) that is applied from the first power supply (441) and exits through the first ground may be matched to the first target frequency, and the length of the electrical path (L2) (hereinafter referred to as the “second electrical path”) that is applied from the second power supply (442) and exits through the second ground may be matched to the second target frequency. For example, the first ground or the second ground may include a ground included in the PCB. For example, the first ground or the second ground may be one ground.

[0092] In one embodiment, the first slit (462) may be formed in a direction perpendicular to the length direction of the segment (461) from the segment (461) and may be formed in the first conductive region (A1). The first slit (462) may have, for example, a length different from the length of the segment (461). For example, the first slit (462) may have a width different from the width of the segment (461). The first slit (462) may be opened to the outside of the electronic device (401), for example, to the outside of the second housing (420). In one embodiment, a dielectric injection material (P) having a constant permittivity may be placed in the opening area (O), the segment (461), and the first slit (462) to maintain the rigidity of the segment (461) of the second housing (420) and to block the inflow of foreign substances.

[0093] In one embodiment, the first slit (462) may be electrically connected to the PCB and the first power supply unit (441) to form an electrical path. The current applied through the first power supply unit (441) may travel to the ground included in the PCB along the periphery of the first slit (462). At this time, the length of the electrical path along which the current flows may be referred to as a third electrical path (L3).

[0094] In one embodiment, depending on the location of the first conductive region (A1) connected to the ground, the electrical path along which the current applied to the first conductive region (A1) flows can be changed. With this structure, a new frequency band matching the third electrical path (L3) can be additionally secured using a single power supply.

[0095] FIGS. 4A and 4B are graphs for explaining antenna resonance efficiency by a first slit in an electronic device according to one embodiment.

[0096] Referring to FIGS. 4A and 4B, a first slit (e.g., the first slit (462) of FIG. 3A) according to one embodiment can secure a new frequency band that could not be secured through an antenna slit (e.g., the antenna slit (A) of FIG. 3A) formed only with a segment (e.g., the segment (461) of FIG. 3A) without a first slit.

[0097] As illustrated in Fig. 4a, an antenna slit formed only with a segment without a first slit can exhibit high resonance efficiency in the vicinity of about 2 GHz and about 3 GHz in the first state (e.g., slide-in state) and the second state (e.g., slide-out state). In this case, it can be understood that the conductive region uses about 2 GHz and about 3 GHz as its resonance frequency.

[0098] In Fig. 4b, the graph showing the resonance efficiency of the conductive region by the slit structure in which only the segmented portion is formed without the first slit is denoted as 'Default', and the graph showing the resonance efficiency of the conductive region by the slit structure in which the first slit is additionally formed in the segmented portion is denoted as 'First Slit'. As illustrated in Fig. 4b, the conductive region by the slit structure in which the first slit is additionally formed can exhibit high efficiency not only at about 2 GHz, about 3 GHz, but also in the vicinity of about 5 GHz. In this case, the electronic device according to one embodiment (e.g., the electronic device (401) of Fig. 3a) can additionally utilize a frequency band in the vicinity of about 5 GHz that was not secured in the conductive region by the slit structure in which only the segmented portion is formed without the first slit. The antenna performance deviation between the first and second states of the conductive region illustrated in Fig. 4a will be described in Figs. 5a and 5b.

[0099] FIGS. 5A and 5B are graphs for explaining the difference in antenna performance depending on the presence or absence of the first slit in an electronic device according to one embodiment.

[0100] Referring to FIGS. 5A and 5B, a first slit according to one embodiment (e.g., the first slit (462) of FIG. 3A) can reduce the performance deviation of the antenna between the first state and the second state compared to an antenna including a conductive region formed by a slit structure with only a segmented portion (e.g., the segmented portion (461) of FIG. 3A) without the first slit.

[0101] As illustrated in FIG. 5A, in an antenna including a conductive region formed by a slit structure with only segmented portions, a deviation of the antenna may occur between the first and second states. For example, for a target frequency used to perform the same function, a difference in frequency values ​​may occur between the first and second states. For example, referring to FIG. 5A, in the first state, the resonance efficiency is high around 3 GHz, while in the second state, the resonance efficiency is high around 3.5 GHz.

[0102] Such performance deviations may be caused by ground conditions in the first and second states. For example, in the first state, a portion of the second housing (e.g., the second housing (420) of FIG. 3A) may be inserted into the first housing (e.g., the first housing (410) of FIG. 3A). From this structure, a stable ground condition can be formed due to electrical coupling between the first and second housings.

[0103] In contrast, in the second state, the area of ​​the second housing overlapping the first housing may be reduced. For example, electrical coupling between the first and second housings may be reduced, and an unstable ground condition may be created.

[0104] In one embodiment, as illustrated in FIG. 5b, in an antenna including a conductive region with a slit structure in which a first slit is additionally formed in the segment, performance deviation can be reduced. Meanwhile, as described above, in FIG. 5b, it can be confirmed that a new frequency band not shown in FIG. 5a is added by additionally forming a first slit in the segment.

[0105] FIG. 6 is a partial perspective view of a side member for illustrating a challenging region according to one embodiment.

[0106] Referring to FIG. 6, an electronic device according to an embodiment (e.g., the electronic device (401) of FIG. 3A) may further include a dielectric (770) filled in a first slit (762) (e.g., the first slit (462) of FIG. 3A). The dielectric (770) may be filled in at least a portion of the first slit (762). In an embodiment, the dielectric (770) has its own permittivity, so that a resonant frequency may be changed according to the flow of current applied to the first slit (762).

[0107] In one embodiment, for example, as illustrated in FIG. 4B, in a high frequency band of about 5 GHz or more, the resonance efficiency of an antenna including a conductive region formed by a slit structure in which a first slit (762) is formed may decrease as the frequency increases. By arranging a dielectric (770) in the first slit (762), electrical interference occurring between the side members (760) of the second housing defining the first slit (762) (e.g., the side members (460) of FIG. 3A) may be reduced. The current applied from the first feed portion (770) (e.g., the feed portion (440) of FIG. 3C) may flow stably along the third electrical path (e.g., the third electrical path (L3) of FIG. 3D), and the resonance efficiency may increase in a high frequency band of about 5 GHz or more.

[0108] FIG. 7A is a side view illustrating a first state of an electronic device according to an embodiment, and FIG. 7B is a side view illustrating a second state of the electronic device according to an embodiment. FIG. 8A is a graph measuring the resonance efficiency of the antenna illustrated in FIG. 7, and FIG. 8B is a graph showing the performance deviation of an antenna including the conductive region illustrated in FIG. 7.

[0109] Referring to FIGS. 7A to 7D , an electronic device (801) according to an embodiment (e.g., the electronic device (101) of FIG. 1 , the electronic device (301) of FIG. 2A , and the electronic device (401) of FIG. 3A ) may include a first housing (810) (e.g., the first housing (410) of FIG. 3A ), a second housing (820) (e.g., the second housing (420) of FIG. 3A ), and a PCB.

[0110] In one embodiment, the electronic device (801) may change its state depending on the relative movement of the first housing (810) and the second housing (820). For example, the second housing (820) may be movably connected to the first housing (810) along a direction of movement (e.g., the Y-axis direction in FIG. 3A). In one embodiment, the second housing (820) may be at least partially retractable relative to the first housing (810).

[0111] In one embodiment, the second housing (820) may include a side member (860) forming a side surface (e.g., the second side member (322) of FIG. 2A, the side member (460) of FIG. 3A). The side member (860) may include a conductive material and at least a portion of the side member may be recessed within the first housing (810).

[0112] In one embodiment, a first slit (862) (e.g., the first slit (462) of FIG. 3A) extending from a segment (861) of an electronic device (801) (e.g., the segment (461) of FIG. 3A) may include a first-first slit portion (862a) and a first-second slit portion (862b). The first-first slit portion (862a) may be formed in the first side portion (860a) of the side member (860), and the first-second slit portion (862b) may be formed in the second side portion (860b) of the side member (860). Here, the first side portion (860a) may be a portion of the side of the second housing (820) that is exposed to the outside and includes a first conductive region (e.g., the first conductive region (A1) of FIG. 3C). The second side portion (860b) may be a portion of the second housing (820) that is connected to the first side portion (860a), is introduced into the first housing (810) in the first state, and is exposed to the outside in the second state. From this structure, the lengths of the first slits (862) that are exposed to the outside in the first state and the second state may be different.

[0113] In one embodiment, the antenna performance deviation can be reduced by determining the length of the first slit (862) differently according to the first state and the second state. In the first state and the second state, the length of the third electrical path (e.g., the third electrical path (L3) of FIG. 3d) can be different. In the first state, the 1-2 slit portion (862b) is covered by the first housing (810), so the third electrical path can be formed along the 1-1 slit portion (862a). This third electrical path can be referred to as the 3-1 electrical path (L31). In the second state, the 1-2 slit portion (862b) is exposed to the outside, so the third electrical path can be formed along the 1-1 slit portion (862a) and the 1-2 slit portion (862b). This third electrical path may be referred to as the third-second electrical path (L32).

[0114] In one embodiment, the frequency band transmitted and received through the 3-1 electrical path (L31) may be substantially the same as the frequency band transmitted and received through the 3-2 electrical path (L32). For the frequency band added by the first slit (862), the antenna performance deviation between the first state and the second state may be reduced.

[0115] In Fig. 8a, as in Fig. 4b, a graph showing the resonance efficiency of an antenna including a conductive region formed by a slit structure with only a segmented portion without a first slit is marked as 'Default'. When the length (e.g., Y-axis direction) of the first slit (862) is 5 mm, the first slit (862) has a structure in which it is formed only in the first side portion (860a) of the second housing (820). For example, the first slit (862) may extend to the boundary between the first housing (810) and the second housing (820) in the first state. In other words, the first slit (862) may include the 1-1 slit portion (862a) and not include the 1-2 slit portion (862b). In Fig. 8a, when the length of the first slit (862) is 7 mm, the first slit (862) has a structure including a 1-1 slit portion (862a) and a 1-2 slit portion (862b). For example, it can be understood that the length of the 1-1 slit portion (862a) is 5 mm, and the length of the 1-2 slit portion (862b) is 2 mm.

[0116] As illustrated in FIGS. 8a and 8b, by forming the 1-1 slit portion (862a), it can be confirmed that a frequency band around 4.5 GHz, which was not secured in an antenna including a conductive region formed by a slit structure with only a segmented portion without a 1-1 slit, is additionally secured. By additionally forming the 1-2 slit portion (862b) in the 1-1 slit portion (862a), it can be confirmed that the antenna performance deviation in the additionally secured 4.5 GHz vicinity is reduced.

[0117] FIG. 9 is a side view of an electronic device illustrating a first slit according to one embodiment, and FIG. 10 is a graph illustrating a change in resonant frequency according to the width of the first slit.

[0118] Referring to FIGS. 9 and 10, an electronic device (1001) according to an embodiment (e.g., the electronic device (101) of FIG. 1, the electronic device (301) of FIG. 2A, the electronic device (401) of FIG. 3A, and the electronic device (801) of FIG. 7A) may include a first housing (1010) (e.g., the first housing (410) of FIG. 3A, the first housing (810) of FIG. 7A), a second housing (1020) (e.g., the second housing (420) of FIG. 3A, the second housing (820) of FIG. 7A)) and a PCB. A side member (1060) of the second housing (1020) (e.g., side member (460) of FIG. 3A, side member (860) of FIG. 7A) may be formed with a segment (e.g., segment (461) of FIG. 3A, segment (861) of FIG. 7A) and a first slit (1062) (e.g., first slit (462) of FIG. 3A, first slit (862) of FIG. 7A).

[0119] In one embodiment, the electronic device (1001) may change state based on relative movement of the first housing (1010) and the second housing (1020). In one embodiment, the second housing (1020) may be at least partially retractable relative to the first housing (1010).

[0120] In one embodiment, by differently determining the width of the first slit (1062) of the electronic device (1001), the impedance matching of the frequency band can be adjusted. Here, the width of the first slit (1062) is the length of the first slit (1062) measured along the direction parallel to the Z-axis of FIG. 9. By impedance matching, unnecessary radiation through the first slit (1062) can be reduced, and the loss of power applied from the first feed unit (e.g., the feed unit (440) of FIG. 3C) can be reduced. Compared to an antenna including a conductive area by an antenna slit in which only a segmented portion (1061) is formed without the first slit (1062), the width of the NR (New Radio) frequency band can be reduced by additionally forming the first slit (1062).

[0121] As illustrated in FIG. 10, as the width of the first slit (1062) increases from 0.1 mm to 1.5 mm, it can be confirmed that the impedance matching characteristics improve near the band of about 6 GHz, and the antenna performance increases in the band of about 6 GHz.

[0122] FIG. 11 is a side view of an electronic device illustrating a first slit according to one embodiment, and FIG. 12 is a graph illustrating a change in resonant frequency according to the length of the first slit.

[0123] Referring to FIGS. 11 and 12 , an electronic device (1201) according to an embodiment (e.g., the electronic device (401) of FIG. 3A , the electronic device (801) of FIG. 7A , and the electronic device (1001) of FIG. 9 ) may include a first housing (1210) (e.g., the first housing (410) of FIG. 3A , the first housing (810) of FIG. 7A , and the first housing (1010) of FIG. 9 ), a second housing (1220) (e.g., the second housing (420) of FIG. 3A , the second housing (820) of FIG. 7A , and the second housing (1020) of FIG. 9 )) and a PCB. A segmented portion (1261) (e.g., segmented portion (461) of FIG. 3A, segmented portion (861) of FIG. 7A, segmented portion (1061) of FIG. 9) and a first slit (1262) (e.g., first slit (462) of FIG. 3A, first slit (862) of FIG. 7A, first slit (1062) of FIG. 9) may be formed on the side member (1260) of the second housing (1220) (e.g., side member (460) of FIG. 3A, side member (860) of FIG. 7A, side member (1060) of FIG. 9).

[0124] In one embodiment, the electronic device (1201) can change its state based on the relative movement of the first housing (1210) and the second housing (1220). In one embodiment, the second housing (1220) can be at least partially retractable relative to the first housing (1210).

[0125] In one embodiment, the resonance of a frequency band can be adjusted by determining a different length of the first slit (1262) of the electronic device (1201). Here, the length of the first slit (1262) is the length of the first slit (1262) measured along the direction parallel to the Y-axis of FIG. 11.

[0126] In one embodiment, by adjusting the resonance of the frequency band, the amount of input voltage that is not reflected at the resonant frequency but is emitted to the outside increases, and the standing wave radio (SWR) value decreases, thereby improving the radiation characteristics of the antenna. Since the first slit (1262) is extended from the segment (1261), the overall length of the electrical path through which the current travels is increased, and thus the resonant frequency can be lowered.

[0127] As shown in Fig. 12, when the length of the first slit (1262) increases from 3 mm to 5 mm, the width of the frequency band corresponding to the length of the first slit (1262) decreases, and the S parameter (scattering parameter) value of the resonant frequency tends to decrease, so that the length of the first slit (1262) can be determined corresponding to the target frequency band.

[0128] In one embodiment, the first slit (1262) may extend from the segment (1261) to an end of the second housing (1220) toward the first housing (1210). For example, the first slit (1262) may have a length extending to the boundary of the first housing (1210) and the second housing (1220), based on the first state as shown in FIG. 11.

[0129] FIGS. 13 to 16 are partial side views of side members for illustrating a conductive region according to one embodiment, respectively.

[0130] Referring to FIG. 13, an electronic device (1401) according to an embodiment (e.g., the electronic device (401) of FIG. 3A, the electronic device (801) of FIG. 7A, the electronic device (1001) of FIG. 9, and the electronic device (1201) of FIG. 11) may include a first housing (1410) (e.g., the first housing (410) of FIG. 3A, the first housing (810) of FIG. 7A, the first housing (1010) of FIG. 9, and the first housing (1210) of FIG. 11), a second housing (1420) (e.g., the second housing (420) of FIG. 3A, the second housing (820) of FIG. 7A, the second housing (1020) of FIG. 9, and the second housing (1220) of FIG. 11)) and a PCB.

[0131] In one embodiment, the electronic device (1401) can change its state based on the relative movement of the first housing (1410) and the second housing (1420). In one embodiment, the second housing (1420) can be at least partially retractable relative to the first housing (1410).

[0132] In one embodiment, a side member (1460) of the second housing (e.g., side member (460) of FIG. 3A, side member (860) of FIG. 7A, side member (1060) of FIG. 9, side member (1260) of FIG. 11) may be formed with a segmented portion (1461) (e.g., segmented portion (461) of FIG. 3A, segmented portion (861) of FIG. 7A, segmented portion (1061) of FIG. 9, segmented portion (1261) of FIG. 11)) and a first slit (1462) extending from the segmented portion (1461) (e.g., first slit (462) of FIG. 3A, first slit (862) of FIG. 7A, first slit (1062) of FIG. 9, first slit (1262) of FIG. 11)).

[0133] In one embodiment, the side member (1460) of the electronic device (1401) may further include a second slit (1463). The second slit (1463) may extend from the segment (1461) in a direction opposite to the direction in which the first slit (1462) extends (e.g., the +Y direction in FIG. 13). The second slit (1463) may be formed in a second conductive region (e.g., the second conductive region (A2) in FIG. 3A).

[0134] In one embodiment, the second slit (1463) may be electrically connected to the PCB and the second feed portion (e.g., the second feed portion (442) of FIG. 3C) to form an electrical path. Current applied to the second conductive region through the second feed portion may travel along a fourth electrical path (L4) around the second slit (1463) and then exit through the ground.

[0135] In one embodiment, a second electrical path (not shown) corresponding to the length of a side member corresponding to the second conductive region (e.g., the length in the +Y-axis direction of FIG. 13) may be formed in the second conductive region. For example, by selectively operating the position of the second conductive region connected to the ground, the electrical path along which a current applied to the second conductive region flows may be changed. From this structure, a new frequency band matching the fourth electrical path (L4) can be additionally secured using a single power supply.

[0136] In one embodiment, similar to the first slit (1462), the width and length of the second slit (1463) may be determined differently depending on the target frequency band. For example, if the length of the second slit (1463) varies, the length of the fourth electrical path (L4) and the frequency band matching the fourth electrical path (L4) may vary.

[0137] Referring to FIG. 14, an electronic device (1501) according to an embodiment (e.g., the electronic device (401) of FIG. 3A, the electronic device (801) of FIG. 7A, the electronic device (1001) of FIG. 9, the electronic device (1201) of FIG. 11, and the electronic device (1401) of FIG. 13) includes a first housing (1510) (e.g., the first housing (410) of FIG. 3A, the first housing (810) of FIG. 7A, the first housing (1010) of FIG. 9, the first housing (1210) of FIG. 11, and the first housing (1410) of FIG. 13), a second housing (1520) (e.g., the second housing (420) of FIG. 3A, the second housing (820) of FIG. 7A, the second housing (1020) of FIG. 9, and the second housing (11) It may include a housing (1220), a second housing (1420) of FIG. 13) and a PCB.

[0138] In one embodiment, the electronic device (1501) can change its state based on the relative movement of the first housing (1510) and the second housing (1520). In one embodiment, the second housing (1520) can be at least partially retractable relative to the first housing (1510).

[0139] In one embodiment, the side member (1560) of the second housing (1520) (e.g., the side member (460) of FIG. 3A, the side member (860) of FIG. 7A, the side member (1060) of FIG. 9, the side member (1260) of FIG. 11, and the side member (1460) of FIG. 13) includes a segmented portion (1561) (e.g., the segmented portion (461) of FIG. 3A, the segmented portion (861) of FIG. 7A, the segmented portion (1061) of FIG. 9, the segmented portion (1261) of FIG. 11, and the segmented portion (1461) of FIG. 13)) and a first slit (1562) extending from the segmented portion (1561) (e.g., the first slit (462) of FIG. 3A, the first slit (862) of FIG. 7A, and the first slit (1462) of FIG. 9) A slit (1062), the first slit (1262) of FIG. 11, and the first slit (1462) of FIG. 13) can be formed.

[0140] In one embodiment, the point at which the first slit (1562) of the electronic device (1501) extends from the segment (1561) may be determined differently. For example, as illustrated in FIG. 14, the first slit (1562) may be formed in an area closer to the rear surface (e.g., the rear surface (301b) of FIG. 2C) of the electronic device (1501) from the center of the first side portion (e.g., the first side portion (860a) of FIG. 7B). From this arrangement, the distance between the first feed portion (e.g., the first feed portion of FIG. 3C) and the first slit (1562) may vary, and the electrical influence of the first feed portion on the first slit (1562) may vary.

[0141] Referring to FIG. 15, an electronic device (1601) according to an embodiment (e.g., the electronic device (401) of FIG. 3A, the electronic device (801) of FIG. 7A, the electronic device (1001) of FIG. 9, the electronic device (1201) of FIG. 11, the electronic device (1401) of FIG. 13, the electronic device (1501) of FIG. 14) includes a first housing (1610) (e.g., the first housing (410) of FIG. 3A, the first housing (810) of FIG. 7A, the first housing (1010) of FIG. 9, the first housing (1210) of FIG. 11, the first housing (1410) of FIG. 13, the first housing (1510) of FIG. 14), a second housing (1620) (e.g., the second housing (420) of FIG. 3A, the second housing (820) of FIG. 7A), It may include a second housing (1020) of FIG. 9, a second housing (1220) of FIG. 11, a second housing (1420) of FIG. 13, a second housing (1520) of FIG. 14) and a PCB.

[0142] In one embodiment, the electronic device (1601) can change states based on relative movement of the first housing (1610) and the second housing (1620). In one embodiment, the second housing (1620) can be at least partially retractable relative to the first housing (1610).

[0143] In one embodiment, the side member (1660) of the second housing (1620) (e.g., the side member (460) of FIG. 3A, the side member (860) of FIG. 7A, the side member (1060) of FIG. 9, the side member (1260) of FIG. 11, the side member (1460) of FIG. 13, the side member (1560) of FIG. 14)) includes a segmented portion (1661) (e.g., the segmented portion (461) of FIG. 3A, the segmented portion (861) of FIG. 7A, the segmented portion (1061) of FIG. 9, the segmented portion (1261) of FIG. 11, the segmented portion (1461) of FIG. 13, the segmented portion (1561) of FIG. 14)) and a first slit (1662) extending from the segmented portion (1661) (e.g., the first slit (462) of FIG. 3A, FIG. The first slit (862) of 7a, the first slit (1062) of FIG. 9, the first slit (1262) of FIG. 11, the first slit (1462) of FIG. 13, and the first slit (1562) of FIG. 14 can be formed.

[0144] In one embodiment, the side member (1660) of the electronic device (1601) may further include a first auxiliary slit (1664). The first auxiliary slit (1664) may extend from the segment (1661) and be formed parallel to the first slit (1662) in the first conductive region (e.g., the first conductive region (A1) of FIG. 3C).

[0145] In one embodiment, the first slit (1662) and the first auxiliary slit (1664) may together form an electrical path along which a current applied to the first conductive region travels. For example, the current applied to the first conductive region through the first feed portion (e.g., the first feed portion (441) of FIG. 3C) may sequentially flow along an electrical path (L3) around the first slit (1662) and the first auxiliary slit (1664) and then exit through the ground. From this structure, the total length of the third electrical path (L3) along which the current applied through the first feed portion travels may increase. In the first conductive region, the first slit (1662) and the first auxiliary slit (1664) may function as an antenna having a frequency band corresponding to the length of the third electrical path (L3).

[0146] In one embodiment, the width and length of the first auxiliary slit (1664) may be different from the width and length of the first slit (1662), respectively. In this case, as described above, the impedance matching and resonance of the frequency band secured by the first slit (1662) and the first auxiliary slit (1664) may be adjusted.

[0147] In one embodiment, the first auxiliary slit (1664) may be formed in multiple numbers. For example, the plurality of first auxiliary slits (1664) may be formed on the same side or on the opposite side with respect to the first slit (1662). In the case where the first auxiliary slits (1664) are formed in multiple numbers, the length of the third electrical path (L3) may be further increased compared to the case where only one first auxiliary slit (1664) is formed.

[0148] Referring to FIG. 16, an electronic device (1701) according to an embodiment (e.g., the electronic device (401) of FIG. 3A, the electronic device (801) of FIG. 7A, the electronic device (1001) of FIG. 9, the electronic device (1201) of FIG. 11, the electronic device (1401) of FIG. 13, the electronic device (1501) of FIG. 14, the electronic device (1601) of FIG. 15) includes a first housing (1710) (e.g., the first housing (410) of FIG. 3A, the first housing (810) of FIG. 7A, the first housing (1010) of FIG. 9, the first housing (1210) of FIG. 11, the first housing (1410) of FIG. 13, the first housing (1510) of FIG. 14, the first housing (1610) of FIG. 15), a second housing (1720) (e.g., It may include a second housing (420) of FIG. 3a, a second housing (820) of FIG. 7a, a second housing (1020) of FIG. 9, a second housing (1220) of FIG. 11, a second housing (1420) of FIG. 13, a second housing (1520) of FIG. 14, a second housing (1620) of FIG. 15) and a PCB.

[0149] In one embodiment, the electronic device (1701) can change its state based on the relative movement of the first housing (1710) and the second housing (1720). In one embodiment, the second housing (1720) can be at least partially retractable relative to the first housing (1710).

[0150] In one embodiment, the side member (1760) of the second housing (1720) (e.g., the side member (460) of FIG. 3A, the side member (860) of FIG. 7A, the side member (1060) of FIG. 9, the side member (1260) of FIG. 11, the side member (1460) of FIG. 13, the side member (1560) of FIG. 14, the side member (1660) of FIG. 15)) has a segmented portion (1761) (e.g., the segmented portion (461) of FIG. 3A, the segmented portion (861) of FIG. 7A, the segmented portion (1061) of FIG. 9, the segmented portion (1261) of FIG. 11, the segmented portion (1461) of FIG. 13, the segmented portion (1561) of FIG. 14, the segmented portion (1661) of FIG. 15)) and a first segmented portion (1761) extending from the segmented portion A slit (1762) (e.g., the first slit (462) of FIG. 3a, the first slit (862) of FIG. 7a, the first slit (1062) of FIG. 9, the first slit (1262) of FIG. 11, the first slit (1462) of FIG. 13, the first slit (1562) of FIG. 14, the first slit (1662) of FIG. 15) can be formed.

[0151] In one embodiment, the side member (1760) of the electronic device (1701) may further include a second auxiliary slit (1765). The second auxiliary slit (1765) may extend from the first slit (1762) and be formed parallel to the segment (1761) in the first conductive region (e.g., the first conductive region (A1) of FIG. 3C). For example, as illustrated in FIG. 16, the second auxiliary slit (1765) may extend in the −Z-axis direction from the first slit (1762).

[0152] In one embodiment, the first slit (1762) and the second auxiliary slit (1765) may together form an electrical path along which a current applied to the first conductive region travels. For example, the current applied to the first conductive region through the first feed portion (e.g., the first feed portion (441) of FIG. 3C) may flow along an electrical path (L3) around the first slit (1762) and the second auxiliary slit (1765) and then exit to the ground. From this structure, the total length of the third electrical path (L3) along which the current applied through the first feed portion travels may increase. In the first conductive region, the first slit (1762) and the second auxiliary slit (1765) may function as an antenna having a frequency band corresponding to the length of the third electrical path (L3).

[0153] In one embodiment, the width of the second auxiliary slit (1765) may be different from the width of the segment (1761). In this case, as described above, the impedance matching of the frequency band secured by the first slit (1762) and the second auxiliary slit (1765) can be adjusted.

[0154] In one embodiment, the second auxiliary slits (1765) may be formed in multiple numbers. For example, the multiple second auxiliary slits (1765) may be formed on the same side or on the opposite side with respect to the first slit (1762). In the case where the multiple second auxiliary slits (1765) are formed, the length of the third electrical path (L3) may be further increased compared to the case where only one second auxiliary slit (1765) is formed.

[0155] FIG. 17 is a graph showing the antenna resonance efficiency using each of the side members illustrated in FIG. 3a, FIG. 14 to FIG. 16.

[0156] In Fig. 17, as in Fig. 4b, a graph showing the resonance efficiency of an antenna including a conductive region by a slit structure in which only a segmented portion is formed without a first slit is marked as 'Default'. It can be confirmed that the resonance efficiency of an antenna including a conductive region by an antenna structure in which the first slit (462) of Fig. 3a is formed close to the center region of the side member (460) is higher than the resonance efficiency of an antenna including a conductive region by a slit structure in which the first slit (1562) of Fig. 14 is formed by being deflected from the center of the side member (1560).

[0157] In one embodiment, it can be confirmed that the resonance efficiency of the antenna including the conductive region of FIG. 15 in which the first auxiliary slit (1664) is formed is higher than the resonance efficiency of the antenna including the conductive region of FIG. 14 and lower than the resonance efficiency of the antenna including the conductive region of FIG. 3a.

[0158] In one embodiment, in an antenna including a conductive region of FIG. 16 in which a second auxiliary slit (1765) is formed, it can be confirmed that impedance matching is improved in a frequency range of about 4 GHz to 6 GHz.

[0159] FIG. 18 is a side view illustrating a second state of an electronic device according to one embodiment.

[0160] Referring to FIG. 18, an electronic device (1801) according to an embodiment (e.g., the electronic device (101) of FIG. 1, the electronic device (301) of FIG. 2A, the electronic device (401) of FIG. 3A, the electronic device (801) of FIG. 7A) may include a first housing (1810) (e.g., the first housing (410) of FIG. 3A, the first housing (710) of FIG. 7A) and a second housing (1820) (e.g., the second housing (420) of FIG. 3A, the second housing (720) of FIG. 7A).

[0161] In one embodiment, the electronic device (1801) may change state based on relative movement of the first housing (1810) and the second housing (1820). The second housing (1820) may be retractable at least partially relative to the first housing (1810).

[0162] In one embodiment, the second housing (1820) may be formed with a segment (1861) (e.g., segment (461) of FIG. 3A, segment (861) of FIG. 7A) and a first slit (1862) extending from the segment (1861) (e.g., first slit (462) of FIG. 3A, first slit (862) of FIG. 7A). The first slit (1862) may include a first-first slit portion (1862a) (e.g., the first-first slit portion (862a) of FIG. 7b) formed in a first side portion (1860a) of the side member (1860) (e.g., the first-first slit portion (862a) of FIG. 7b) and a first-second slit portion (1862b) (e.g., the first-second slit portion (862b) of FIG. 7b) extending from the first-first slit portion (1862a) and formed in a second side portion (1860b) of the side member (1860) (e.g., the second side portion (860b) of FIG. 7b).

[0163] In one embodiment, the first-second slit portion (1862b) may extend from the first-first slit portion (1862a) past the second side portion (1860b) to the second plate (1821) of the second housing (1820) (e.g., the second plate (321) of FIG. 3c). The second plate (1821) may include a second-first plate portion (1821a) that is exposed to the outside in the first state and a second-second plate portion (1821b) that is retracted into the first housing (1810) in the first state. The first-second slit portion (1862b) may extend past the second side portion (1860b) to the second-second plate portion (1821b). From this structure, the first-second slit portion (1862b) can be covered by the first housing (1810) in the first state.

[0164] In one embodiment, a frequency band transmitted and received through a 3-1 electrical path (e.g., electrical path (L31) of FIG. 7a) formed along a 1-1 slit portion (1862a) in a first state may be substantially the same as a frequency band transmitted and received through a 3-2 electrical path (L32) (e.g., 3-2 electrical path (L32) of FIG. 18). For the frequency band added by the 1-1 slit (1862), the antenna performance deviation between the 1-1 state and the 2-2 state may be reduced.

[0165] In one embodiment, the end of the first-second slit portion (1862b) in FIG. 18 is illustrated as extending in the +Y direction and the -Y direction, but it should be noted that the shape of the first-second slit portion (1862b) is not limited thereto. For example, the end of the first-second slit portion (1862b) may extend only in the +X direction on the second-second plate portion (1821b).

[0166] FIG. 19a is a perspective view illustrating a first state of an electronic device having a conductive region according to one embodiment, and FIG. 19b is a perspective view illustrating a second state of an electronic device having a conductive region according to one embodiment.

[0167] Referring to FIGS. 19A and 19B , an electronic device (1901) according to an embodiment (e.g., the electronic device (301) of FIG. 2A , the electronic device (401) of FIG. 3A ) may include a first housing (1910) (e.g., the first housing (310) of FIG. 2A , the first housing (410) of FIG. 3A ) and a second housing (1920) (e.g., the second housing (320) of FIG. 2A , the second housing (420) of FIG. 3A ). In an embodiment, the electronic device (1901) may change its state depending on relative movement of the first housing (1910) and the second housing (1920). The second housing (1920) may be at least partially retractable relative to the first housing (1910).

[0168] In one embodiment, the first slit (1962) may extend from the segment (1961) on the front or rear surface of the second housing (1920). Meanwhile, when the side member (1960) and the second plate (1921) are formed integrally, the first slit (1962) may be understood to extend on the surface of the side member (1960) forming the front or rear surface of the electronic device (1901).

[0169] In one embodiment, the first slit (1962) may extend from the segment (1961) on the rear surface of the second housing (1920), for example, on the second plate (1921) (e.g., the second plate (321) of FIG. 3C). The second plate (1921) may include a 2-1 plate portion (1921a) that is exposed externally in the first state and a 2-2 plate portion (1921b) that is retracted into the first housing (1910) in the first state. The first-first slit portion (1962a) extending from the segment (1961) may be formed on the second-first plate portion (1921a), and the first-second slit portion (1962b) extending from the first-first slit portion (1962a) may be formed on the second-second plate portion (1921b). Meanwhile, considering the appearance of the electronic device (1901), the first-first slit portion (1962a) may be formed so as not to be exposed to the outside in the first state. In this case, it can be understood that the first-first slit portion (1962a) is formed on the inner surface of the second-first plate portion (1921a).

[0170] In one embodiment, the first slit (1962) may extend from the segment (1961) on the front side of the second housing (1920), for example, on the opposite side of the second plate (1921). In such a case, the first slit (1962) may be covered by the display and not exposed to the outside of the electronic device (1901).

[0171] FIG. 20 is a perspective view illustrating a second state of an electronic device having a conductive region according to one embodiment.

[0172] Referring to FIG. 20, an electronic device (2001) according to one embodiment (e.g., electronic device (1901) of FIG. 19a) may include a first housing (2010) (e.g., first housing (1910) of FIG. 19), a second housing (1920) (e.g., second housing (1920) of FIG. 19), a segment (2061) (e.g., segment (1961) of FIG. 19), and a first slit (2062) (e.g., first slit (1962) of FIG. 19).

[0173] In one embodiment, a first slit (2062) extending from a segment (2061) on a rear surface of the second housing (2020), for example, a second plate (2021) (e.g., the second plate (1921) of FIG. 19), may extend to a side surface of the second housing (2020), for example, a side member (2060) (e.g., the side member (1960) of FIG. 19).

[0174] In one embodiment, the side member (2060) may include a first side portion (2060a) that is exposed to the outside in a first state, and a second side portion (2060b) that is introduced into the first housing (2010). The 1-1 slit portion (2062a) (e.g., the 1-1 slit portion (1962a) of FIG. 19b) may extend from a segment (1961) formed in the first side portion (2060a) onto the 2-1 plate portion (2021a) (e.g., the 2-1 plate portion (1921a) of FIG. 19b). The first-second slit portion (2062b) (e.g., the first-second slit portion (1962b) of FIG. 19b) may extend from the first-first slit portion (2062a) to the second-second plate portion (2021b) (e.g., the second-second plate portion (1921b) of FIG. 19b) and then further extend to the second side portion (2060b).

[0175] In one embodiment, the portion of the first slit (2062) extending to the second side portion (2060b) may have various shapes. For example, the first slit (2062) may extend only in a direction extending from the second-second plate portion (2021b) on the second side portion (2060b) (e.g., in the +Z direction), and may not extend in a direction parallel to the Y-axis as shown in the drawings of the present specification.

[0176] So far, the slit antenna has been described as being formed in an electronic device using a roller including a first housing and a second housing. However, it should be noted in advance that the electronic device in which the slit antenna can be formed is not limited to a rollable electronic device. The slit antenna can be formed in any electronic device that uses a segment of a metal frame as an antenna. For example, the slit antenna can be formed in a bar-type smartphone, a foldable smartphone, a tablet device, etc.

[0177] An electronic device (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701) according to one embodiment comprises a first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710), a side surface movably connected to the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710) along a moving direction, at least a portion of which is inserted into the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710), and a side surface including a conductive material A second housing (420;820;1020;1220;1420;1520;1620;1720) including a member (460;860;1060;1260;1460;1560;1660;1760), a PCB disposed inside the electronic device (301;401;801;1001;1201;1401;1501;1601;1701) and having a wireless communication circuit disposed therein, a power supply unit (440) for applying current to the side member (460;860;1060;1260;1460;1560;1660;1760), and grounding the side member (460;860;1060;1260;1460;1560;1660;1760). May include ground. In one embodiment, the side members (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) are formed with segments (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) that are open in a first direction to segment the side members (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) into a first conductive region (A1) and a second conductive region (A2) that are electrically insulated from each other, and are formed with segments (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) that are open in a second direction perpendicular to the first direction and are connected to the first conductive region (A1). It may include a first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) located thereon.

[0178] In one embodiment, the second housing (420; 820; 1020; 1220; 1420; 1520; 1620; 1720) may be movable relative to the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710) such that the state changes between a first state in which the electronic device (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701) has a minimum size and a second state in which the electronic device (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701) has a maximum size. In one embodiment, the side members (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) include a first side portion (860a) that is exposed to the outside and forms the first conductive area (A1); And the second side portion (860b) connected to the first side portion (860a) and covered by the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710) in the first state and exposed to the outside in the second state, and the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) may include a 1-1 slit portion (862a) located in the first side portion (860a).

[0179] In one embodiment, the first-first slit portion (862a) may extend from the segmented portion (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) to the end of the first side portion (860a) facing the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710).

[0180] In one embodiment, the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) further includes a first-second slit portion (862b) connected to the first-first slit portion (862a) and formed on the second side portion (860b), and the length of the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) exposed to the outside in the second direction may be different in the first state and the second state.

[0181] In one embodiment, the power supply unit (440) includes a first power supply unit (441) connected to the first conductive region (A1), and the first slits (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) can form an electrical path along which a current applied through the first power supply unit (441) moves.

[0182] In one embodiment, the frequency band transmitted and received through the electrical path formed by the first slits (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) in the first state may be substantially the same as the frequency band transmitted and received through the electrical path formed by the first slits (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) in the second state.

[0183] In one embodiment, the side member (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) may further include a second slit (1463) that is formed to be open in a third direction opposite to the second direction from the segment (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) and is located in the second conductive region.

[0184] In one embodiment, the power supply unit (440) includes a second power supply unit (442) connected to the second conductive region (A2), and the second slit (1463) can form an electrical path along which a current applied through the second power supply unit (442) moves.

[0185] In one embodiment, the side member (460; 860; 1060; 1260; 1460; 1560; 1660; 1760)) may further include a first auxiliary slit (1664) that is positioned in the first conductive area (A1) and is formed to open in a direction parallel to the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) from the segment (461; 861; 1061; 1261; 1461; 1561; 1661; 1761).

[0186] In one embodiment, the side members (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) may further include a second auxiliary slit (1765) extending from the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) and formed parallel to the segmented portion (461; 861; 1061; 1261; 1461; 1561; 1661; 1761).

[0187] In one embodiment, the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) and the first auxiliary slit (1664) may together form an electrical path along which a current applied to the first conductive region (A1) moves.

[0188] In one embodiment, the width of the first auxiliary slit (1664) may be different from the width of the first slits (462; 862; 1062; 1262; 1462; 1562; 1662; 1762).

[0189] In one embodiment, the width of the second auxiliary slit (1765) may be different from the width of the segments (461; 861; 1061; 1261; 1461; 1561; 1661; 1761).

[0190] In one embodiment, the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) and the second auxiliary slit (1765) may together form an electrical path along which a current applied to the first conductive region (A1) moves.

[0191] In one embodiment, the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) may further include a dielectric (770) filled therein.

[0192] An electronic device (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701) according to one embodiment comprises a first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710), a second housing (410; 810; 1010; 1210; 1410; 1501; 1601; 1701) movably connected along a movement direction to the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710) such that the electronic device (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701) changes state between a first state having a minimum size and a second state having a maximum size. A housing (420; 820; 1020; 1220; 1420; 1520; 1620; 1720), and a PCB disposed inside the electronic device (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701), wherein a wireless communication circuit is disposed, and the second housing (420; 820; 1020; 1220; 1420; 1520; 1620; 1720) may include a side member (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) comprising a conductive material.In one embodiment, the side member (460; 860; 1060; 1260; 1460; 1560; 1660; 1760) comprises a first side portion (860a) forming at least a portion of a side, a second side portion (860b) connected to the first side portion (860a) and inserted into the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710) in the first state and withdrawn from the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710) in the second state, and an opening formed in the first side portion (860a) and facing the second side portion (860b) A first conductive region (A1) and a second conductive region (A2) electrically insulated from the first conductive region (A1) are segmented (461;861;1061;1261;1461;1561;1661;1761), and a first side portion (860a) is formed at least in part along a direction perpendicular to the segments (461;861;1061;1261;1461;1561;1661;1761) from the segments (461;861;1061;1261;1461;1561;1661;1761). It includes slits (462; 862; 1062; 1262; 1462; 1562; 1662; 1762), and a first power supply unit (441) for applying current to the first conductive area (A1) and a first ground for grounding the current from the first conductive area (A1) can be connected.

[0193] In one embodiment, the first slit (462; 1062; 1262; 1462; 1562; 1662; 1762) may extend from the segment (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) to an end of the first side portion (860a) facing the first housing (410; 810; 1010; 1210; 1410; 1510; 1610; 1710).

[0194] In one embodiment, the first slit (462; 1062; 1262; 1462; 1562; 1662; 1762) further includes a 1-1 slit portion (462a) formed in the first side portion (860a), and a 1-2 slit portion (462b) connected to the 1-1 slit portion (462a) and formed in the second side portion (860b), and the length of the first slit (462; 1062; 1262; 1462; 1562; 1662; 1762) exposed to the outside may be different in the first state and the second state.

[0195] In one embodiment, the frequency band transmitted and received through the electrical path formed by the first slits (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) in the first state may be substantially the same as the frequency band transmitted and received through the electrical path formed by the first slits in the second state.

[0196] In an electronic device (101) according to one embodiment, the electronic device may include a housing including a front surface, a rear surface opposite to the front surface, a side surface that surrounds a space between the front surface and the rear surface, and a side surface that surrounds the space between the front surface and the rear surface and includes a conductive material, a PCB disposed inside the housing and having a wireless communication circuit disposed thereon, a power supply unit (440) that applies current to the side surface, and a ground that grounds the side surface. In one embodiment, the side member may include a segment (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) that segments the side member into a first conductive region (A1) and a second conductive region (A2) that are electrically insulated from each other, and is formed to be open in a first direction perpendicular to the rear surface, and a first slit (462; 862; 1062; 1262; 1461; 1561; 1662; 1762) that is formed to be open in a second direction perpendicular to the first direction from the segment (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) and is located in the first conductive region (A1).

Claims

1. In electronic devices (301; 401; 801; 1001; 1201; 1401; 1501; 1601; 1701), 1st Housing (410;810;1010;1210;1410;1510;1610;1710); A second housing (420;820;1020;1220;1420;1520;1620;1720) including a side member (460;860;1060;1260;1460;1560;1660;1760) movably connected to the first housing along the direction of movement, at least a portion of which is introduced into the first housing, and comprising a conductive material; A PCB disposed inside the electronic device and having a wireless communication circuit disposed therein; A power supply unit (440) that applies current to the above-mentioned side member; and Including a ground for grounding the above side member, The above side members are, A segmented portion (461;861;1061;1261;1461;1561;1661;1761) formed open in a first direction to segment the side member into different first conductive regions (A1) and second conductive regions (A2); and An electronic device comprising a first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) which is formed open in a second direction perpendicular to the first direction from the segmented portion and is located in the first conductive region.

2. In paragraph 1, The above second housing (420;820;1020;1220;1420;1520;1620;1720) is The electronic device is movable relative to the first housing (410) so that the state changes between a first state in which the electronic device has a minimum size and a second state in which the electronic device has a maximum size. The above side members (460;860;1060;1260;1460;1560;1660;1760) are A first side portion (860a) exposed to the outside and forming the first challenging area (A1); and A second side portion (860b) connected to the first side portion and covered by the first housing in the first state and exposed to the outside in the second state, The above first slit (462;862;1062;1262;1462;1562;1662;1762) is An electronic device comprising a first-first slit portion (862a) positioned on the first side portion.

3. In paragraph 1 or 2, The above 1-1 slit portion (862a) is An electronic device extending from the segmented portion (461;861;1061;1261;1461;1561;1661;1761) to an end of the first side portion (860a) facing the first housing (410;810;1010;1210;1410;1510;1610;1710).

4. In any one of paragraphs 1 to 3, The above first slit (462;862;1062;1262;1462;1562;1662;1762) is It further includes a 1-2 slit portion (862b) connected to the 1-1 slit portion and formed on the 2nd side portion, An electronic device wherein the length of the first slit exposed to the outside in the second direction is different in the first state and the second state.

5. In any one of paragraphs 1 to 4, The above power supply unit (440) is Including a first power supply unit (441) connected to the first challenge area, An electronic device in which the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) forms an electrical path through which a current applied through the first power supply travels.

6. In any one of paragraphs 1 to 5, An electronic device wherein a frequency band transmitted and received through an electrical path formed by the first slits (462;862;1062;1262;1462;1562;1662;1762) in the first state is substantially the same as a frequency band transmitted and received through an electrical path formed by the first slits in the second state.

7. In any one of paragraphs 1 to 6, The above side members (460;860;1060;1260;1460;1560;1660;1760) are An electronic device further comprising a second slit (1463) formed to be open in a third direction opposite to the second direction from the segmented portion (461; 861; 1061; 1261; 1461; 1561; 1661; 1761) and located in the second conductive region.

8. In any one of paragraphs 1 to 7, The above power supply unit (440) is Including a second power supply unit (442) connected to the second challenge area, An electronic device in which the second slit (1463) forms an electrical path through which current applied through the second power supply travels.

9. In any one of paragraphs 1 to 8, The above side members (460;860;1060;1260;1460;1560;1660;1760) are An electronic device further comprising a first auxiliary slit (1664) positioned in the first challenging region and formed to open in a direction parallel to the first slit (462;862;1062;1262;1462;1562;1662;1762) from the segmented portion (461;861;1061;1261;1461;1561;1661;1761).

10. In any one of paragraphs 1 to 9, The above side members (460;860;1060;1260;1460;1560;1660;1760) are An electronic device further comprising a second auxiliary slit (1765) extending from the first slit (462;862;1062;1262;1462;1562;1662;1762) and formed parallel to the segmented portion (461;861;1061;1261;1461;1561;1661;1761).

11. In any one of paragraphs 1 to 10, An electronic device in which the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) and the first auxiliary slit (1664) together form an electrical path along which a current applied to the first conductive region (A1) moves.

12. In any one of paragraphs 1 to 11, An electronic device wherein the width of the first auxiliary slit (1664) is different from the width of the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762).

13. In any one of paragraphs 1 to 12, An electronic device in which the width of the second auxiliary slit (1765) is different from the width of the segmented portions (461; 861; 1061; 1261; 1461; 1561; 1661; 1761).

14. In any one of paragraphs 1 to 13, An electronic device in which the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762) and the second auxiliary slit (1765) together form an electrical path along which a current applied to the first conductive region (A1) moves.

15. In any one of paragraphs 1 to 14, An electronic device further comprising a dielectric (770) filled in the first slit (462; 862; 1062; 1262; 1462; 1562; 1662; 1762).

Images