Manufacturing method for heat dissipation assembly, mold, and heat dissipation assembly finished product

Abstract

A manufacturing method for a heat dissipation assembly, comprising the steps: preparing a mold, the interior of same forming a mold cavity corresponding to the heat dissipation assembly; placing a base plate and a plurality of heat dissipation fins into the mold cavity, and uniformly mixing copper material particles and aluminium material particles to form mixed particles for filling the remaining space in the mold cavity; and a pressing rotating shaft extends into the mold cavity and rotates while being displaced, so that the mixed particles are in a solid-state bond with the base plate and each heat dissipation fin.

Description

Manufacturing method of heat dissipation component, mold and finished product thereof Technical Field

[0001] The present invention relates to the technical field of heat dissipation equipment, and in particular to a manufacturing method, a mold and a finished product of a heat dissipation component for electronic equipment. Background Art

[0002] With the advancement of technology and the widespread use of electronic devices, electronic device performance has become a major requirement for both the manufacturing industry and users. Consequently, the heat dissipation of these electronic devices during operation has also become a priority. Heat sink fins made of heat-dissipating metal with high thermal conductivity are commonly found in these electronic devices.

[0003] The most common method for manufacturing heat sink fins is extrusion, which involves extruding a heat sink metal at high temperatures until it forms the heat sink metal into the mold holes. However, this method is limited to heat sink metals that are easily shaped, such as aluminum. Consequently, copper and copper alloys, commonly used in the manufacture of electronic components and precision micro-molds, are not suitable for this method due to their inherently difficult-to-process properties.

[0004] To produce the heat sink fins from copper metal, die casting is required. This involves heating and melting the heat sink metal, injecting it into a mold, and then cooling it to set the shape. However, this method is not only time-consuming but also extremely energy-intensive. Alternatively, forging can be used. However, when forming the heat sink base using forging, uneven plastic flow can easily cause height differences in the fins, requiring subsequent machining to achieve the desired product dimensions. Therefore, developing heat sink fins made from copper metal or copper alloys is a highly sought-after goal in the industry.

[0005] Summary of the Invention

[0006] In order to develop a heat sink fin made of copper metal or copper alloy, the present invention provides a method for manufacturing a heat sink assembly, the steps of which include:

[0007] A mold is provided, wherein a mold cavity is formed inside the mold cavity, a mold opening is formed on one side surface of the mold, the mold cavity includes a base portion and a central portion communicating between the base portion and the mold opening, and the radial extension range of the base portion covers the radial extension range of the central portion, a plurality of fin portions are radially arranged around the central portion, and a groove wall in the central portion is radially concavely formed.

[0008] placing a substrate in the substrate portion;

[0009] Evenly mixing copper material particles and aluminum material particles to form mixed particles, and placing the mixed particles into the mold cavity;

[0010] A pressure shaft is inserted into the mold cavity from the mold opening and rotates around the axis of the pressure shaft while the central portion is axially displaced.

[0011] The fin portion of the mold extends along the length direction of the central portion and is connected to the substrate portion. A fin portion opening is formed on the side of the mold. After the substrate is placed in the substrate portion, the plurality of heat dissipation fins are inserted into the fin portion opening.

[0012] The substrate is formed with a plurality of slots corresponding to the positions of the heat dissipation fins, and each heat dissipation fin is inserted into the slot corresponding to the position when inserted into the mold cavity.

[0013] The fin portion opening is communicated with the mold opening. When each of the heat dissipating fins is inserted into the mold cavity through the fin portion opening, at least a portion of each of the heat dissipating fins protrudes from the central portion.

[0014] Furthermore, the maximum distance between the pressurizing shaft and the portion extending deep into the central portion is smaller than the length of the central portion.

[0015] Furthermore, a thickness distance formed by each of the fin portions toward the central portion becomes thinner toward an end of the fin portion.

[0016] The present invention also provides a mold for making a heat dissipation component, which has a mold cavity inside. The mold cavity forms a mold opening on one side of the mold. The mold cavity includes a substrate portion and a central portion connected between the substrate portion and the mold opening, and the radial extension range of the substrate portion covers the radial extension range of the central portion. A plurality of fin portions are radially recessed around the groove wall in the central portion slot.

[0017] The fin portion extends along the length direction of the central portion, communicates with the base plate portion, and forms a fin portion opening on the side surface of the mold.

[0018] Furthermore, the fin portion opening is communicated with the mold opening.

[0019] Furthermore, the thickness of each fin portion toward the central portion is thinner toward the end of the fin portion.

[0020] The present invention also provides a heat dissipation component manufactured by the above method, comprising a substrate, a central column extending from one side surface of the substrate, a plurality of heat dissipation fins radially arranged around the central column and protruding radially outward, and each heat dissipation fin extends in a sheet-like manner from a free end of the central column toward the substrate 11.

[0021] Wherein, a joint interface is formed between the center column and the base plate.

[0022] Wherein, the joining interface is formed between each of the heat dissipation fins and the center column.

[0023] The base plate is formed with a plurality of slots corresponding to the positions of the heat dissipation fins, and each heat dissipation fin is embedded in a slot corresponding to a position.

[0024] Furthermore, at least a portion of the substrate and each of the heat dissipation fins is made of copper metal or aluminum metal.

[0025] Furthermore, at least a portion of the substrate and each of the heat dissipation fins is made of the copper material particles, the aluminum material particles, or a mixture of the above materials.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The heat dissipation assembly manufacturing method provided by the present invention utilizes only the high extrusion pressure generated by the axial displacement and rotation of the pressurized shaft within the mold cavity to produce plastic deformation lattice defects in the aluminum and copper particles, reducing interface bonding energy and allowing for mutual diffusion and filling, thereby achieving the effect of integrally forming the heat dissipation assembly with dissimilar materials, overcoming the difficulty of conventional copper and aluminum processing and synthesis. Furthermore, the manufacturing method provided by the present invention features simple steps and reduces energy consumption. The copper and aluminum particles can also be made of recycled materials, facilitating material reuse and achieving environmentally friendly results. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG1 is a schematic diagram of a finished product of a preferred embodiment of the present invention;

[0029] FIG2 is a top view of a first preferred embodiment of the mold of the present invention;

[0030] FIG3 is a top view of a second preferred embodiment of the mold of the present invention;

[0031] FIG4 is a top view of a preferred embodiment of the present invention;

[0032] FIG5 is a cross-sectional schematic diagram of a preferred manufacturing embodiment of the present invention;

[0033] FIG6 is a cross-sectional schematic diagram of a first preferred embodiment of the present invention;

[0034] FIG7 is a cross-sectional schematic diagram of a second preferred embodiment of the present invention.

[0035] Explanation of symbols: 10 heat sink 11 substrate 111 slot 12 center column 13 multiple heat sink fins 21 copper material particles 22 aluminum material particles 30 mold 31 mold cavity 311 substrate portion 312 center portion 313 fin portion 314 fin portion opening 32 mold opening 40 pressurizing shaft A mixed particles B bonding interface H thickness distance DETAILED DESCRIPTION

[0036] Please refer to Figures 1 and 3, which illustrate a preferred embodiment of a heat dissipation assembly 10 provided by the present invention, comprising a base plate 11, a center column 12, and a plurality of heat dissipation fins 13. The base plate 11 is a plate, the center column 12 is a hollow column, and the center column 12 extends from one side of the base plate 11. The plurality of heat dissipation fins 13 are arranged radially around the center column 12 and extend outward from the center column 12. Each heat dissipation fin 13 extends from a free end of the center column 12 toward the base plate 11.

[0037] Next, please refer to Figures 2, 3 and 5. The substrate 11, the center column 12 and the multiple heat dissipation fins 13 are made by mixing a copper material particle 21 and an aluminum material particle 22 and then integrally formed in a mold 30. A mold cavity 31 is formed in the mold 30, and the mold cavity 31 forms a mold opening 32 on one side of the mold 30. The mold cavity 31 corresponds to the shape of the heat dissipation component 10, and the inside of the mold cavity 31 toward the mold opening 32 includes a substrate portion 311, a central portion 312 and multiple fin portions 313.

[0038] In the present invention, the term "copper material" refers to a material in which copper is the most abundant metal element. Preferably, the copper material particles are pure copper with a copper content of 90% or more. The term "aluminum material" refers to a material in which aluminum is the most abundant metal element. The term "particles" refers to particles having a maximum equivalent spherical diameter of less than 10 mm. These particles may be in the form of flakes, needles, strips, spheres, or any other irregular shape.

[0039] The aluminum material particles 22 may include recycled aluminum material; and the copper material particles 21 may also include recycled copper material.

[0040] The so-called "particles" in the present invention refer to particles with a maximum equivalent spherical diameter of less than or equal to 10 mm. The particles can be in the shape of flakes, needles, strips, spheres or any irregular shapes.

[0041] The central portion 312 is an elongated slot connecting the base portion 311 and the mold opening 32. The maximum aperture of the base portion 311 is larger than the maximum aperture of the central portion 312, and the extension of the base portion 311 completely covers the extension range. A plurality of fins 313 are radially arranged around the central portion, and the slot walls within the central portion 312 are radially recessed.

[0042] Please refer to Figure 3, in which the thickness H of each fin portion 313 formed towards the central portion 312 becomes thinner towards the end of the fin portion 313, so that the cross-section of the fin portion 313 presents a triangular structure, which helps to improve the quality of the subsequent integrated forming of the heat dissipation component 10 during manufacturing.

[0043] Please refer to FIG. 4 to FIG. 6 , the present invention provides a first preferred embodiment of manufacturing the heat dissipation assembly 10 , wherein the steps include:

[0044] Step 1: Prepare the mold 30 and place the substrate 11 in the substrate portion 311 of the mold cavity 31. At this time, the substrate 11 is the completed plate, and the substrate 11 fills the substrate portion 311 after being placed.

[0045] At least a portion of the substrate 11 is made of the same material as at least a portion of the center column 12, which can be copper or aluminum. Alternatively, at least a portion of the substrate 11 can be made of the copper particles 21, the aluminum particles 22, or a mixture of these materials. In this embodiment, the substrate 11 is made of copper.

[0046] Step 2: The copper particles 21 and the aluminum particles 22 are uniformly mixed to form a mixed particle A, which is then placed into the mold cavity 31. The ratio of the copper particles 21 to the aluminum particles 22 is not limited and can be adjusted based on the operating environment, structural requirements, and other requirements of the heat dissipation component 10. A higher proportion of copper particles 21 can improve heat absorption and heat storage properties, exhibit antioxidant and corrosion resistance, and extend service life. A higher proportion of aluminum particles 22 can improve heat dissipation, reduce weight, and reduce costs.

[0047] Preferably, the mixed particles A can be placed into the mold cavity 31 through the mold opening 32. A material inlet communicating with the mold cavity 31 can also be provided in the mold 30.

[0048] Step 3: Solid-state bonding of the mixed particles A. A pressurizing shaft 40 is inserted into the mold cavity 31 through the mold opening 32 and simultaneously rotates about its axis while the central portion 312 is axially displaced. As the pressurizing shaft 40 axially displaces and rotates about the central portion 312, the mixed particles A are squeezed by the high pressure of the pressurizing shaft 40 and pushed into the gap between the pressurizing shaft 40 and the central portion 312 and into each of the fin portions 313.

[0049] It is worth noting that the mixed particles A are displaced by a high extrusion pressure, and in addition to being able to completely fill each of the fin portions 313, the lattice structures of the aluminum material particles 22 and the copper material particles 21 are destroyed due to the extrusion pressure, resulting in lattice gaps or lattice defects. At this time, the aluminum material particles 22 and the copper material particles 21 fill and diffuse with each other through the lattice gaps or lattice defects, so that part of the aluminum material particles 22 and the copper material particles 21 are compressed and bonded into a dense material due to the change in lattice structure, thereby achieving a solid-state bonding effect.

[0050] Step 4: Demolding to form the heat sink assembly 10 as shown in FIG6 . After removing the mold 30 , the mixed particles A are filled into the fin portion 313 and solid-state bonded to form the heat sink 13 . The mixed particles A remaining in the gap between the pressurizing shaft 40 and the central portion 312 are solid-state bonded to form the center column 12 .

[0051] It is worth noting that, due to the axial displacement of the pressurizing shaft 40 in the mold cavity 31 , the mixed particles A and the substrate 11 also have the above-mentioned solid bonding effect, so that a bonding interface B is formed between the center column 12 and the substrate 11 .

[0052] Furthermore, the maximum distance between the pressurizing shaft 40 and the central portion 312 is less than the length of the central portion 312, so that more of the mixed particles A can be retained for the solid-state bonding step with the substrate 11, so that a larger bonding interface B can be formed between the mixed particles A and the substrate 11.

[0053] In addition, when the thickness distance H of each fin portion 313 becomes thinner toward the end of the fin portion 313, in addition to facilitating the filling of the mixed particles A (from a large space to a small space), when the mixed particles A are filled into the end of the fin portion 313, the gradually shrinking space at the end of the fin portion 313 can also provide a resistance force to the mixed particles A, thereby helping to increase the material strength of the heat dissipation fins 13 of the heat dissipation component 10 after formation.

[0054] 5 and 7 , the present invention provides a second preferred embodiment, in which the mold 30 is different from the above in that the fin portion 313 extends along the length direction of the central portion 312 , connecting to the substrate portion 311 , and a fin portion opening 314 is formed on the side of the mold, and the fin portion opening 314 is connected to the mold opening 32 .

[0055] Furthermore, in the second preferred embodiment of manufacturing the heat dissipation component 10 , the difference from the above is that in step 1, after the substrate 11 is placed in the substrate portion 311 of the mold cavity 31 , the plurality of heat dissipation fins 13 are further inserted into the fin portion opening 314 .

[0056] The substrate 11 and the plurality of heat sink fins 13 are all manufactured plates, and at least a portion of the heat sink fins 13 is made of the same material as at least a portion of the center column 12, which can be copper metal, aluminum metal, the copper material particles 21, the aluminum material particles 22, or a mixture of the above materials.

[0057] It is worth noting that in step 3, the mixed particles A are solid-state combined to form the center column 12 and the bonding interface B is formed between each of the heat dissipation fins 13 and the substrate 11.

[0058] Preferably, a plurality of slots 111 are formed on a surface where the base plate 11 and the center column 12 meet, corresponding to the positions of the heat dissipation fins 13. When the heat dissipation fins 13 are inserted into the mold cavity 31 through the fin opening 314, one end of each heat dissipation fin 13 is simultaneously embedded in the corresponding slot 111. This helps to make the heat dissipation assembly 10 more structurally stable after being formed.

[0059] More preferably, when each of the heat sink fins 13 is inserted into the mold cavity 31 through the fin opening 314, at least a portion of each of the heat sink fins 13 protrudes from the central portion 312. This can help the mixed particles A to be solid-state bonded with each of the heat sink fins 13 to form a larger bonding interface B. After the heat sink assembly 10 is formed, the concave-convex bonding structure between the center column 12 and each of the heat sink fins 13 also contributes to structural stability.

[0060] The heat sink assembly manufacturing method provided by the present invention utilizes only the high extrusion pressure generated by the axial displacement and rotation of the pressurized shaft 40 within the mold cavity 31 to plastically deform the aluminum particles 22 and the copper particles 21, reducing interface bonding energy or lattice defects and allowing for mutual diffusion and filling, thereby achieving the effect of integrally forming the heat sink assembly 10 from dissimilar materials. This overcomes the difficulty of conventional copper and aluminum processing and synthesis. Furthermore, the manufacturing method provided by the present invention features simple steps and reduces energy consumption. The copper particles 21 and the aluminum particles 22 can also be made of recycled materials, facilitating material reuse and achieving environmentally friendly results.

[0061] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing a heat dissipation component, characterized in that: The steps include: A mold is provided, wherein a mold cavity is formed inside the mold cavity, a mold opening is formed on one side of the mold, the mold cavity includes a base plate portion and a central portion connected between the base plate portion and the mold opening, and the radial extension range of the base plate portion covers the radial extension range of the central portion, a plurality of fin portions are radially arranged around the central portion, and a groove wall in the central portion is radially concavely formed; a groove wall in the groove hole of the central portion is radially concavely formed; placing a substrate in the substrate portion; Evenly mixing a copper material particle and an aluminum material particle to form a mixed particle and placing the mixed particle into the mold cavity; A pressure shaft is inserted into the mold cavity from the mold opening and rotates around the axis of the pressure shaft while the central portion is axially displaced.

2. The method according to claim 1, characterized in that: in: The fin portion of the mold extends along the length direction of the central portion, communicates with the substrate portion, and forms a fin portion opening on the side surface of the mold; and After the substrate is placed in the substrate portion, a plurality of heat dissipation fins are inserted into the opening of the fin portion.

3. The method according to claim 2, characterized in that: The base plate is formed with a plurality of slots corresponding to the positions of the heat dissipation fins, and each of the heat dissipation fins is inserted into the slot corresponding to the position when being inserted into the mold cavity.

4. The method according to claim 2 or 3, characterized in that: The fin opening is communicated with the mold opening. When each of the heat dissipation fins is inserted into the mold cavity through the fin opening, at least a portion of each of the heat dissipation fins protrudes from the central portion.

5. The method according to any one of claims 1 to 3, characterized in that: The maximum distance between the pressurizing shaft and the central portion is smaller than the length of the central portion.

6. The method according to claim 5, characterized in that: A thickness distance formed by each of the fin portions toward the central portion becomes thinner toward the end of the fin portion.

7. A mold for making a heat dissipation component, characterized in that: The interior of the mold cavity has a mold opening formed on one side of the mold. The mold cavity includes a substrate portion and a central portion connected between the substrate portion and the mold opening. The radial extension range of the substrate portion covers the radial extension range of the central portion. A plurality of fin portions are radially recessed around the groove wall in the central portion groove.

8. The mold according to claim 7, characterized in that The fin portion extends along the length direction of the central portion, communicates with the substrate portion, and forms a fin portion opening on the side surface of the mold.

9. The mold according to claim 8, characterized in that The fin portion opening is communicated with the mold opening.

10. The mold according to any one of claims 7 to 8, characterized in that: A thickness distance formed by each of the fin portions toward the central portion decreases toward the end of the fin portion.

11. A heat dissipation component, characterized in that: The heat dissipation assembly includes a base plate, a central column extending from one side of the base plate, a plurality of heat dissipation fins radially arranged around the central column and protruding radially outward, each heat dissipation fin extending from a free end of the central column toward the base plate, wherein The center column is formed by uniformly mixing the copper material particles and the aluminum material particles and then extruding them; and A joint interface is formed between the center column and the base plate.

12. The heat dissipation assembly according to claim 11, wherein: The joint interface is formed between each of the heat dissipation fins and the center column.

13. The heat dissipation assembly according to claim 11 or 12, characterized in that: The base plate is formed with a plurality of slots corresponding to the positions of the heat dissipation fins, and each heat dissipation fin is embedded in a slot corresponding to a position.

14. The heat dissipation assembly according to claim 13, wherein: At least a portion of the material of the substrate and each of the heat dissipation fins is copper metal or aluminum metal.

15. The heat dissipation assembly according to claim 13, wherein: At least a portion of the material of the substrate and each of the heat dissipation fins is made of the copper material particles, the aluminum material particles or a mixture of the above materials.

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