Display panel and manufacturing method therefor, and display apparatus

Abstract

Provided in the present disclosure are a display panel and a manufacturing method therefor, and a display apparatus. The display panel comprises: a base substrate, wherein the base substrate has a display region and a peripheral region surrounding the display region, the peripheral region having a target region, which comprises at least one of an electrode joint region, part of the electrode joint region, a bonding region, part of the bonding region, an encapsulation region, part of the encapsulation region, and the whole peripheral region; residual photoresist, which is located on the base substrate and is located in the target region of the peripheral region; and a common layer, which is located on the base substrate and covers at least the display region of the base substrate, wherein the orthographic projection of the common layer on the base substrate does not overlap the orthographic projection of the residual photoresist on the base substrate, the common layer being used for transporting holes or electrons.

Description

Display panel, manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development and evolution of nanoscience and technology, the preparation of nanomaterials with specifically patterned structures has become an increasingly important research direction in modern nanoscience and technology. Quantum dots, a new type of nanomaterial, have attracted widespread attention from researchers due to their numerous advantages since their emergence. The successful preparation of specifically patterned quantum dot light-emitting layers has not only expanded their applications but also sparked a new wave of research in the nanotechnology community. Quantum dot light-emitting diode displays (QLEDs) are a new display technology developed based on organic light-emitting displays (OLEDs). The difference between the two is that the light-emitting layer in QLEDs is a quantum dot layer. The principle behind QLEDs is that electrons and holes are injected into the quantum dot layer through an electron / hole transport layer, where they recombine to produce light. Compared to OLED displays, QLEDs offer advantages such as a narrow emission peak, high color saturation, and a wide color gamut.

[0003] Summary of the Invention

[0004] The present disclosure provides a display panel and a manufacturing method thereof, and a display device. The specific solutions are as follows:

[0005] An embodiment of the present disclosure provides a display panel, including:

[0006] a base substrate, the base substrate having a display area and a peripheral area disposed around the display area, the peripheral area having a target area, the target area including at least one of an electrode overlapping area, a partial overlapping electrode area, a binding area, a partial binding area, a packaging area, a partial packaging area, and all areas of the peripheral area;

[0007] Residual photoresist is located on the substrate and in a target area of ​​the peripheral area;

[0008] A common layer is located on the base substrate and covers at least the display area of ​​the base substrate. The orthographic projection of the common layer on the base substrate does not overlap with the orthographic projection of the residual photoresist on the base substrate. The common layer is used to transfer holes or electrons.

[0009] Optionally, in the display panel provided in the embodiment of the present disclosure, the surface of the residual photoresist is connected to

[0010] Optionally, in the above-mentioned display panel provided by an embodiment of the present disclosure, the target area includes the entire area of ​​the peripheral area, and the common layer covers the display area.

[0011] Optionally, in the above-mentioned display panel provided in the embodiment of the present disclosure, the target area includes at least one of an electrode overlapping area, a partial overlapping electrode area, a binding area, a partial binding area, a packaging area, and a partial packaging area, and the common layer covers the display area and at most covers the area in the peripheral area except the target area.

[0012] Optionally, in the above-mentioned display panel provided by the embodiment of the present disclosure, the common layer includes at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0013] Optionally, the above-mentioned display panel provided in the embodiment of the present disclosure further includes: a first electrode layer located between the base substrate and the residual photoresist, a quantum dot light-emitting layer located between the hole transport layer and the electron transport layer, and a second electrode located on the side of the common layer away from the base substrate.

[0014] Correspondingly, an embodiment of the present disclosure further provides a display device, comprising any one of the above-mentioned display panels provided by the embodiment of the present disclosure.

[0015] Accordingly, an embodiment of the present disclosure further provides a method for manufacturing a display panel, comprising:

[0016] A base substrate is provided; wherein the base substrate has a display area and a peripheral area surrounding the display area, the peripheral area has a target area; wherein the target area includes at least one of an electrode overlapping area, a partial overlapping electrode area, a binding area, a partial binding area, a packaging area, a partial packaging area, and the entire area of ​​the peripheral area;

[0017] Coating a photoresist layer on the entire surface of the base substrate, and exposing and developing the photoresist layer to remove at least the photoresist located in the display area and retaining a photoresist pattern covering at least the target area;

[0018] coating a common layer for transferring holes or electrons on the base substrate on which the photoresist pattern is formed;

[0019] The photoresist pattern is removed to expose the target area, so that the common layer is formed in an area of ​​the base substrate except the target area.

[0020] Optionally, in the above-mentioned manufacturing method provided in the embodiment of the present disclosure, before coating the common layer on the base substrate, the method further includes:

[0021] The photoresist pattern is thinned.

[0022] Optionally, in the above-mentioned manufacturing method provided in the embodiment of the present disclosure, the photoresist pattern is thinned, specifically comprising:

[0023] The photoresist pattern is thinned by using oxygen plasma; wherein the surface of the thinned photoresist pattern is connected with hydroxyl groups and carboxyl groups.

[0024] Optionally, in the above-mentioned manufacturing method provided in the embodiment of the present disclosure, after the photoresist pattern is thinned by the oxygen plasma and before the common layer is coated on the base substrate, the method further includes:

[0025] The photoresist pattern is subjected to a liquid-repellent treatment using a fluorine-containing silane coupling agent, so that the surface of the thinned photoresist pattern is connected with a fluorine-containing group.

[0026] Optionally, in the above-mentioned manufacturing method provided in the embodiment of the present disclosure, the material of the photoresist layer is fluorine-containing resin photoresist.

[0027] Optionally, in the above-mentioned manufacturing method provided by the embodiment of the present disclosure, removing the photoresist pattern specifically includes:

[0028] The photoresist pattern is removed by a laser lift-off process.

[0029] Optionally, in the above-mentioned manufacturing method provided by the embodiment of the present disclosure, the laser power required when adopting the laser lift-off process is proportional to the size of the target area.

[0030] Optionally, in the above-mentioned manufacturing method provided by the embodiment of the present disclosure, before coating the entire surface of the base substrate with a photoresist layer, the method further comprises: forming a first electrode on the base substrate;

[0031] After removing the photoresist pattern to expose the target area, the method further includes:

[0032] forming a second electrode on a side of the common layer facing away from the base substrate; wherein the second electrode overlaps with the overlapping metal in the electrode overlapping region;

[0033] Encapsulating the base substrate on which the second electrode is formed; wherein the encapsulation material of the encapsulation area or the partial encapsulation area is in contact with the base substrate;

[0034] The substrate and the peripheral circuit are bonded and connected in the bonding area. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0036] FIG2 is a schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0037] FIG3 is a schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0038] FIG4 is a schematic flow chart of another method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0039] FIG5 is a schematic diagram of the mechanism of the reaction between Si-OCH3 groups and -OH in a fluorinated silane coupling agent;

[0040] FIG6 is a schematic flow chart of another method for manufacturing a display panel according to an embodiment of the present disclosure;

[0041] FIG7 is a schematic flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure;

[0042] 8A to 8L are schematic structural diagrams of manufacturing a display panel provided by an embodiment of the present disclosure after executing each step;

[0043] FIG9 is a schematic structural diagram of a manufacturing process of another display panel provided by an embodiment of the present disclosure;

[0044] FIG10 is a schematic structural diagram of a manufacturing process of another display panel provided by an embodiment of the present disclosure;

[0045] FIG11 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure;

[0046] FIG12 is a schematic structural diagram of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0048] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “include” or “comprise” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0049] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0050] Currently, QLED production efficiency has not reached mass production levels, primarily due to a lack of breakthroughs in high-resolution patterning technology. The inorganic nanoparticle nature of quantum dots makes them difficult to form and pattern via vapor deposition, and inkjet printing of patterned quantum dots is difficult to achieve high resolution.

[0051] In recent years, many researchers have done a lot of work on photolithographic patterning of quantum dots. The steps of photolithographic patterning of quantum dots include coating, exposure, and development. The hole injection layer, hole transport layer, and electron transport layer other than the quantum dot light-emitting layer are usually coated on the entire surface as a common layer. The entire surface coating means coating both the display area and the peripheral area. Therefore, the use of the entire surface coating will cause the peripheral area to be covered by the common layer, that is, the overlapping electrode area of ​​the peripheral area (such as the area where the cathode is electrically connected to the cathode ring located in the peripheral area), the packaging area (the area covering SiNx / SiOx, TFE glue, packaging glue, etc.), the binding area (such as the area where the FPC is bound to the metal pad), etc. are all covered by the common layer, resulting in the electrode overlapping area and the binding area being covered by the common layer and not conductive. Since QLED is generally encapsulated with glass glue, the encapsulation area is covered by the common layer, resulting in the inability to achieve effective encapsulation. Therefore, the common layer needs to be selectively coated. In the related art, one method of selectively coating the common layer is to block the coating head corresponding to the peripheral area. This method requires a specific coating head for each product design, which is costly.

[0052] In view of this, an embodiment of the present disclosure provides a method for manufacturing a display panel, as shown in FIG1 , comprising:

[0053] S101. Provide a base substrate; wherein the base substrate has a display area and a peripheral area surrounding the display area, wherein the peripheral area has a target area; wherein the target area includes at least one of the electrode overlapping area, the partial overlapping electrode area, the binding area, the partial binding area, the encapsulation area, the partial encapsulation area, and the peripheral area;

[0054] S102, coating the entire surface of the base substrate with a photoresist layer, and exposing and developing the photoresist layer to remove at least the photoresist located in the display area, and retaining at least the photoresist pattern covering the target area;

[0055] S103, coating a common layer for transferring holes or electrons on the base substrate on which the photoresist pattern is formed;

[0056] S104 , removing the photoresist pattern to expose the target area, so that the common layer is formed in the area of ​​the base substrate except the target area.

[0057] The manufacturing method of the above-mentioned display panel provided by the embodiment of the present disclosure, before making the common layer, at least the target area is covered by using a photoresist pattern, so that the selective coating of the common layer can be achieved by using existing coating equipment. In this way, after the common layer is coated, the photoresist pattern is removed, so that no common layer is formed in the target area. Since the target area includes at least one of the electrode overlapping area, partial overlapping electrode area, binding area, partial binding area, packaging area, partial packaging area, and peripheral area, this can avoid the problem that the overlapping electrode area and the binding area of ​​the peripheral area are covered by the common layer and cannot be conductive subsequently, and avoid the problem that the packaging area is covered by the common layer and cannot achieve effective glass glue packaging.

[0058] Currently, electroluminescent devices can be divided into upright and inverted structures. The difference between the upright and inverted structures lies in the different order in which the film layers are fabricated. Specifically, the upright structure sequentially forms an anode, hole injection layer, hole transport layer, quantum dot light-emitting layer, electron transport layer, and cathode on a substrate. The inverted structure sequentially forms an electron transport layer, quantum dot light-emitting layer, hole transport layer, hole injection layer, and anode on a substrate. The electroluminescent device in the display panel provided in the embodiments of the present disclosure can have either an upright or inverted structure.

[0059] It should be noted that the principle of luminescence of electroluminescent devices is: the holes in the anode and the electrons in the cathode are transferred to the quantum dot light-emitting layer to combine and emit light. Due to the difference in energy level barriers between the anode and the light-emitting layer and between the cathode and the light-emitting layer, the transmission of electrons and holes is more difficult and the transmission rate and quantity are also very different. Therefore, in order to balance the concentration of electrons and holes, a hole injection layer and a hole transport layer are generally set between the quantum dot light-emitting layer and the anode, and an electron transport layer is set between the quantum dot light-emitting layer and the cathode. Of course, in the specific implementation, the required layers can be selected according to actual needs.

[0060] Optionally, the common layer in the embodiment of the present disclosure may include a hole injection layer, a hole transport layer, and an electron transport layer, but is certainly not limited thereto.

[0061] Optionally, in the manufacturing method of the above-mentioned display panel provided in the embodiment of the present disclosure, the material of the photoresist layer can be positive photoresist. When the photoresist layer is exposed, a mask is used for blocking. The mask includes a shading area and a light-transmitting area. The light-transmitting area corresponds to the display area, and the shading area corresponds to the target area. In this way, the display area can be exposed and the target area can be blocked by the photoresist pattern.

[0062] Optionally, in the manufacturing method of the above-mentioned display panel provided in the embodiment of the present disclosure, the material of the photoresist layer can be negative photoresist, and when the photoresist layer is exposed, a mask is used for blocking. The mask includes a shading area and a light-transmitting area. The light-transmitting area corresponds to the target area, and the shading area corresponds to the display area. In this way, the display area can be exposed and the target area can be blocked by the photoresist pattern.

[0063] In a specific implementation, in the method for manufacturing the display panel provided in the embodiment of the present disclosure, removing the photoresist pattern specifically includes: removing the photoresist pattern using a laser lift-off process. Optionally, the laser lift-off process includes ablation, ashing, and removal of the photoresist pattern.

[0064] In a specific implementation, the thickness of the initially applied photoresist layer is generally relatively thick, for example, 1 μm to 1.5 μm, that is, the thickness of the photoresist pattern retained at least covering the target area is 1 μm to 1.5 μm. Therefore, when the photoresist pattern is removed by a laser lift-off process, a relatively high laser power is required. Excessive laser power may cause a thermal effect on the base substrate, causing defects. Therefore, in the above-mentioned method for manufacturing a display panel provided in an embodiment of the present disclosure, before coating the common layer on the base substrate, as shown in FIG2 , the method further includes:

[0065] S103', thinning the photoresist pattern, which can reduce the laser power, reduce the thermal effect of the laser on the substrate, and improve the product yield.

[0066] Optionally, the thickness of the thinned photoresist pattern may be 100 nm to 500 nm, for example, 100 nm, 200 nm, 300 nm, 400 nm, 500 nm, etc. The thickness of the thinned photoresist pattern may be selected according to actual needs.

[0067] In a specific implementation, since the bottom electrode in the electroluminescent device is generally made of a transparent conductive material (such as ITO), in order to prevent the method of thinning the photoresist pattern from affecting the properties of the ITO material, in the above-mentioned method for manufacturing the display panel provided by the embodiment of the present disclosure, the photoresist pattern is thinned in S103′ of FIG. 2 , as shown in FIG. 3 , and specifically may include:

[0068] S103', thinning the photoresist pattern using oxygen plasma; wherein the surface of the thinned photoresist pattern is connected with hydroxyl groups and carboxyl groups. This oxygen plasma thinning method does not affect the properties of the ITO material, but can also reduce the thickness of the photoresist pattern.

[0069] Optionally, the method for thinning the photoresist pattern does not require the oxygen plasma treatment method provided in the embodiment of the present disclosure, and may also include other thinning treatment methods as long as they do not affect the characteristics of the ITO material.

[0070] In a specific implementation, in the method for manufacturing the display panel provided in the embodiment of the present disclosure, after thinning the photoresist pattern using oxygen plasma and before coating the common layer on the base substrate, as shown in FIG4 , the method further includes:

[0071] S103", using a fluorine-containing silane coupling agent to perform liquid-repellent treatment on the photoresist pattern, so that the surface of the thinned photoresist pattern is connected with a fluorine-containing group. Specifically, the fluorine-containing silane coupling agent can be Since the surface of the thinned photoresist pattern is connected with a large number of hydroxyl groups (-OH) and carboxyl groups (-COOH), the groups in the fluorinated silane coupling agent (such as Si-Cl groups or Si-OCH3 groups) will react with -OH and -COOH, thereby forming a covalent bond between the fluorinated chain segment and the F-containing group and the surface of the photoresist pattern. The Si-OCH3 groups in the fluorinated silane coupling agent react with -OH. The reaction mechanism is shown in Figure 5. The fluorinated groups connected to the surface of the thinned photoresist pattern The surface of the photoresist pattern has liquid-repellent properties, so that when a common layer is coated on a substrate with a thinned photoresist pattern, the common layer will not be coated on the surface of the thinned photoresist pattern, that is, the surface of the thinned photoresist pattern is not covered by the common layer. In this way, when using a laser stripping process to remove the photoresist pattern, only the properties of a single film layer of the photoresist pattern need to be considered, thereby reducing the difficulty of the laser stripping process.

[0072] In specific implementations, the present disclosure can use the aforementioned common photoresist material without fluorine when coating the photoresist layer. To reduce laser power and the difficulty of the laser lift-off process, the aforementioned steps of thinning the photoresist pattern and performing a lyophobic treatment on the photoresist pattern using a fluorine-containing silane coupling agent are required. Of course, the present disclosure can also directly use a fluorine-containing photoresist to coat the photoresist layer. Therefore, in the above-mentioned display panel manufacturing method provided by the present disclosure, the photoresist layer can be made of a fluorine-containing resin photoresist. This can eliminate the steps of thinning the photoresist pattern and performing a lyophobic treatment on the photoresist pattern using a fluorine-containing silane coupling agent, reducing process complexity.

[0073] During specific implementation, in the manufacturing method of the above-mentioned display panel provided in the embodiment of the present disclosure, since the target area includes at least one of the electrode overlapping area, the partial overlapping electrode area, the binding area, the partial binding area, the packaging area, the partial packaging area, and the peripheral area, for example, when the photoresist layer coated on the entire surface is exposed and developed, the photoresist pattern covering the entire peripheral area can be retained, and the common layer formed in this way only covers the display area, thereby avoiding the problem that the electrode overlapping area and the binding area in the peripheral area cannot be electrically connected and the problem that the packaging area cannot achieve effective glass packaging; for another example, when the photoresist layer coated on the entire surface is exposed and developed, the photoresist pattern covering the electrode overlapping area, the binding area and the packaging area can be retained, and the common layer formed in this way not only covers the display area but also covers the area outside the electrode overlapping area, the binding area and the packaging area. The common layer located in the area outside the electrode overlapping area, the binding area and the packaging area neither affects the problems of electrode overlapping and packaging nor affects the performance of the common layer.

[0074] During specific implementation, in the manufacturing method of the above-mentioned display panel provided in the embodiment of the present disclosure, the laser power required when removing the photoresist pattern by the laser stripping process is proportional to the size of the target area. Optionally, when the target area is the entire peripheral area, that is, when the photoresist layer is developed, the retained photoresist pattern covers the entire peripheral area, when the laser glass process is used to remove the photoresist pattern, the entire photoresist pattern in the peripheral area can be removed, which requires a larger laser power; when the target area includes at least one of the electrode overlapping area, the binding area, and the packaging area, that is, when the photoresist layer is developed, the retained photoresist pattern only covers at least one of the electrode overlapping area, the binding area, and the packaging area, when the laser glass process is used to remove the photoresist pattern, the entire photoresist pattern in at least one of the overlapping area, the binding area, and the packaging area can be removed. Since the size of the electrode overlapping area, the binding area, and the packaging area is relatively large, the laser power required for the target area is proportional to the size of the target area. The size of each peripheral area is small, so there is no need to use the above-mentioned larger laser power, and the same laser stripping effect can be achieved; when the target area includes at least one of the partial overlapping electrode area, the partial binding area, and the partial packaging area, that is, when the photoresist layer is developed, the retained photoresist pattern only covers at least one of the partial overlapping electrode area, the partial binding area, and the partial packaging area. When the laser glass process is used to remove the photoresist pattern, the entire photoresist pattern of at least one of the partial overlapping area, the partial binding area, and the partial packaging area can be removed. Since the size of the partial electrode overlapping area, the partial binding area, and the partial packaging area is smaller, a smaller power laser can be selected to achieve the same laser stripping effect.

[0075] Optionally, for a target area with a smaller size, the laser may be further focused to remove the photoresist pattern in the target area.

[0076] In a specific implementation, in the manufacturing method of the display panel provided in the embodiment of the present disclosure, before coating the entire surface of the base substrate with a photoresist layer, as shown in FIG6 , the method further includes: S102 ′, forming a first electrode on the base substrate;

[0077] After removing the photoresist pattern to expose the target area, as shown in FIG7 , the method further includes:

[0078] S105, forming a second electrode on a side of the common layer facing away from the base substrate; wherein the second electrode is overlapped with the overlap metal in the electrode overlap region;

[0079] S106, encapsulating the base substrate on which the second electrode is formed; wherein the encapsulation material of the encapsulation area or a portion of the encapsulation area is in contact with the base substrate;

[0080] S107 , bonding and connecting the substrate and the peripheral circuit in the bonding area.

[0081] The following describes the method for manufacturing a display panel provided by an embodiment of the present disclosure, taking an upright electroluminescent device as an example. When manufacturing a display panel, multiple display panels are generally manufactured on a large substrate, and then individual display panels are obtained by cutting. The specific manufacturing process is as follows:

[0082] (1) As shown in FIG8A , an array mother substrate 100 is provided. The array mother substrate 100 includes a base substrate 1 and a device layer 2 arranged in a stacked manner, wherein the device layer 2 is located in the display area AA formation area of ​​each display panel. Optionally, the array mother substrate in this embodiment can be a substrate having a base substrate at any stage in the display panel motherboard manufacturing process, and a substrate having some layer structures formed on the base substrate. For example, the device layer 2 refers to some functional film layers formed on the base substrate 1, for example, the source, gate, drain, etc. of a thin film transistor.

[0083] (2) As shown in FIG8B , a first electrode (eg, an anode, not shown) is formed in each display area AA of the array mother substrate 100 , and a photoresist layer 3 ′ is coated on the entire surface of the first electrode facing away from the base substrate 1 .

[0084] (3) As shown in FIG8C , the photoresist layer 3 ′ is exposed and developed using a mask to remove the photoresist in the display area AA, while retaining the photoresist pattern 3 covering the target area (eg, the entire peripheral area BB).

[0085] (4) As shown in FIG8D , the photoresist pattern 3 is thinned by oxygen plasma, so that a large number of -OH and -COOH groups are connected to the surface of the thinned photoresist pattern 3 .

[0086] (5) As shown in FIG8E , the thinned photoresist pattern 3 is subjected to a lyophobic treatment using a fluorinated silane coupling agent. The groups in the fluorinated silane coupling agent (e.g., Si-Cl groups or Si-OCH3 groups) react with -OH and -COOH, thereby converting the F-containing groups into A covalent bond is formed with the surface of the photoresist pattern 3, so that the surface of the thinned photoresist pattern 3 is connected with a fluorine-containing group (represented by F).

[0087] (6) As shown in FIG8F , a hole injection layer 4 and a hole transport layer 5 are coated on the base substrate 1 on which the photoresist pattern 3 is formed. Since the surface of the thinned photoresist pattern 3 is connected with fluorine-containing groups, the surface thereof has liquid repellency. Therefore, the hole injection layer 4 and the hole transport layer 5 basically only cover the display area AA of the display panel.

[0088] (7) A quantum dot light-emitting layer (not shown) located in the display area is formed on the hole transport layer 5 shown in FIG8F by photolithography patterning.

[0089] (8) As shown in FIG8G , an electron transport layer 6 is formed on the quantum dot light-emitting layer. Since the surface of the thinned photoresist pattern 3 is connected with fluorine-containing groups, its surface has liquid repellency. Therefore, the electron transport layer 6 basically only covers the display area AA of the display panel; wherein, the hole injection layer 4, the hole transport layer 5 and the electron transport layer 6 constitute a common layer.

[0090] (9) As shown in FIG. 8H , the photoresist pattern 3 is removed to expose the target area (peripheral area BB), that is, the base substrate 1 , so that the common layer is formed in the base substrate 1 except for the target area.

[0091] (10) As shown in FIG8I , a second electrode (not shown) is formed on the side of the electron transport layer 6 facing away from the substrate 1 by an evaporation process; wherein the second electrode is overlapped with the overlap metal (not shown) in the electrode overlap region B1.

[0092] (11) As shown in FIG8J , the base substrate 1 formed with the second electrode is packaged; wherein the packaging material of the packaging area B2 or a portion of the packaging area (eg, the edge of the packaging area) is in contact with the base substrate 1 .

[0093] (12) As shown in FIG8K , the base substrate 1 is bonded and connected to the peripheral circuit (eg, FPC) in the bonding area B3.

[0094] (13) The base substrate 1 shown in FIG8K is cut to form independent display panels, as shown in FIG8L.

[0095] In a specific implementation, as shown in FIG9 , for example, the target area is a partial electrode overlapping area B1′. Thus, when removing the photoresist pattern 3, only the photoresist pattern 3 in the partial electrode overlapping area B1′ needs to be removed, and the photoresist layer 3′ in the remaining area of ​​the electrode overlapping area B1 does not need to be removed. This can reduce the laser power, and can also achieve overlapping of the second electrode with the overlapping metal (not shown) in the partial electrode overlapping area B1′.

[0096] As shown in Figure 10, for example, the target area includes a portion of the electrode overlapping area B1', a portion of the packaging area B2' and a portion of the binding area B3'. In this way, when removing the photoresist pattern 3, it is only necessary to remove the photoresist pattern 3 of the portion of the electrode overlapping area B1', the portion of the packaging area B2' and the portion of the binding area B3'. The photoresist layer 3' of the remaining areas of the electrode overlapping area B1, the packaging area B2 and the binding area B3 does not need to be removed. This can reduce the laser power, and can also achieve the overlap of the second electrode with the overlapping metal (not shown) in the portion of the electrode overlapping area B1', and achieve the binding connection between the substrate 1 and the peripheral circuit (such as FPC) through the portion of the binding area B3', and achieve the contact between the packaging material of the portion of the packaging area B2' and the substrate 1 to improve the packaging effect.

[0097] Based on the same inventive concept, an embodiment of the present invention further provides a display panel, as shown in FIG11 , comprising:

[0098] A base substrate 1 having a display area AA and a peripheral area BB disposed around the display area AA, wherein the peripheral area BB has a target area, and the target area includes at least one of the electrode overlapping area B1, the partial overlapping electrode area B1', the binding area B3, the partial binding area B3', the encapsulation area B2, the partial encapsulation area B2', and all of the peripheral area BB;

[0099] The residual photoresist 3'' is located on the substrate 1 and is located in the target area of ​​the peripheral area BB;

[0100] The common layers (4, 5, and 6) are located on the base substrate 1 and cover at least the display area AA of the base substrate 1. The orthographic projection of the common layers (4, 5, and 6) on the base substrate 1 does not overlap with the orthographic projection of the residual photoresist 3" on the base substrate 1. The common layers (4, 5, and 6) are used to transfer holes or electrons.

[0101] The above-mentioned display panel provided by the embodiment of the present disclosure can be prepared using the aforementioned method for manufacturing a display panel, that is, using photoresist to cover the target area and expose the display area, so that the existing coating equipment can be used to achieve selective coating of the common layer so that the common layer does not cover the target area; and when using a laser stripping process to remove the photoresist pattern, due to process limitations, there will eventually be a trace amount of residual photoresist in the target area, but the trace amount of residual photoresist does not affect the overlapping electrodes in the peripheral area, the binding in the binding area, and the effective packaging in the packaging area.

[0102] In a specific implementation, in the display panel provided in the embodiment of the present disclosure, in the display panel shown in FIG11 obtained by adopting the manufacturing method of the display panel disclosed above, the surface of the residual photoresist 3" may be connected with fluorine-containing groups, and the fluorine-containing groups may include but are not limited to Of course, the surface of the residual photoresist 3″ may not be connected to the fluorine-containing group.

[0103] In a specific implementation, in the above-mentioned display panel provided in an embodiment of the present disclosure, as shown in FIG11 , the target area includes the entire area of ​​the peripheral area BB, so that when the display panel shown in FIG11 is prepared using the aforementioned method for manufacturing a display panel of the present disclosure, the common layers (4, 5 and 6) cover the display area AA.

[0104] In a specific implementation, in the above-mentioned display panel provided in the embodiment of the present disclosure, the target area may include at least one of the aforementioned electrode overlapping area B1, partial overlapping electrode area B1', binding area B3, partial binding area B3', encapsulation area B2, and partial encapsulation area B2' (for example, including B1, B2 and B3 at the same time). In this way, in the display panel prepared by adopting the aforementioned method for manufacturing a display panel of the present disclosure, its common layer (4, 5 and 6) covers the display area AA and at most covers the area in the peripheral area BB except the target area (B1, B2 and B3).

[0105] In a specific implementation, in the display panel provided in the embodiments of the present disclosure, the common layer may include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. Alternatively, as shown in FIG11 , taking the electroluminescent device of the display panel as an upright structure as an example, the common layers (4, 5, and 6) may include a hole injection layer 4, a hole transport layer 5, and an electron transport layer 6.

[0106] In a specific implementation, the display panel provided in the embodiment of the present disclosure, as shown in FIG11 , further includes: a first electrode layer 7 (anode) located between the base substrate 1 and the residual photoresist 3″, a quantum dot light-emitting layer 8 located between the hole transport layer 5 and the electron transport layer 6, and a second electrode 9 (cathode) located on the side of the common layer away from the base substrate 1.

[0107] The present disclosure does not limit the light-emitting type of the electroluminescent device, such as bottom-emitting light or top-emitting light.

[0108] Specifically, the display panel provided by the embodiment of the present disclosure may further include a driving circuit, a passivation layer, a planarization layer, and other structures located between the base substrate and the first electrode.

[0109] Optionally, the substrate may be a flexible substrate or a rigid substrate. The flexible substrate may be, for example, a PI substrate, and the rigid substrate may be, for example, a glass substrate.

[0110] It should be noted that the embodiments of the present disclosure mainly describe in detail the manufacturing method and structure of the display panel using an electroluminescent device with an upright structure. Of course, the embodiments of the present disclosure are also applicable to the manufacturing of an electroluminescent device with an inverted structure.

[0111] In specific implementation, the display panel provided by the embodiment of the present disclosure also includes other functional film layers well known to those skilled in the art, which will not be described in detail here.

[0112] Based on the same inventive concept, the present disclosure also provides a display device comprising the display panel described above. The principles of this display device are similar to those of the aforementioned display panel, so the implementation of this display device can refer to the implementation of the aforementioned display panel, and any repetitions will not be repeated here.

[0113] In specific implementation, the above-mentioned display device provided in the embodiment of the present disclosure may be a full-screen display device, or may be a flexible display device, etc., which is not limited here.

[0114] In a specific implementation, the display device provided in the embodiment of the present disclosure may be a full-screen mobile phone as shown in FIG12 . Of course, the display device provided in the embodiment of the present disclosure may also be any product or component with a display function, such as a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or the like. Other essential components of the display device are well understood by those skilled in the art and are not described here in detail, nor should they be construed as limiting the present invention.

[0115] The embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device. Before manufacturing the common layer, at least the target area is covered by a photoresist pattern, so that the common layer can be selectively coated with existing coating equipment. After coating the common layer, the photoresist pattern is removed, so that no common layer is formed in the target area. Since the target area includes at least one of the electrode overlapping area, partial overlapping electrode area, binding area, partial binding area, packaging area, partial packaging area, and peripheral area, the problem that the overlapping electrode area and the binding area of ​​the peripheral area are covered by the common layer and cannot be conductive subsequently can be avoided, and the problem that the packaging area is covered by the common layer and cannot achieve effective glass glue packaging can be avoided.

[0116] Obviously, those skilled in the art may make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include these modifications and variations.

Claims

1. A display panel, wherein: include: A base substrate, the base substrate having a display area and a peripheral area arranged around the display area, the peripheral area having a target area, the target area including at least one of an electrode overlapping area, a partial overlapping electrode area, a binding area, a partial binding area, a packaging area, a partial packaging area, and all areas of the peripheral area; Residual photoresist is located on the substrate and in a target area of ​​the peripheral area; A common layer is located on the base substrate and at least covers the display area of ​​the base substrate, and the orthographic projection of the common layer on the base substrate does not overlap with the orthographic projection of the residual photoresist on the base substrate; wherein the common layer is used to transfer holes or electrons.

2. The display panel according to claim 1, wherein: The surface of the residual photoresist is connected 3. The display panel according to claim 1, wherein: The target area includes the entire area of ​​the peripheral area, and the common layer covers the display area.

4. The display panel according to claim 1, wherein: The target area includes at least one of an electrode overlapping area, a partial overlapping electrode area, a binding area, a partial binding area, a packaging area, and a partial packaging area. The common layer covers the display area and at most covers an area in the peripheral area except the target area.

5. The display panel according to any one of claims 1 to 4, wherein: The common layer includes at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

6. The display panel according to claim 5, wherein: It also includes: a first electrode layer located between the base substrate and the residual photoresist, a quantum dot light-emitting layer located between the hole transport layer and the electron transport layer, and a second electrode located on the side of the common layer away from the base substrate.

7. A display device, wherein: Comprising the display panel as described in any one of claims 1-6.

8. A method for manufacturing a display panel, wherein: include: A base substrate is provided; wherein the base substrate has a display area and a peripheral area surrounding the display area, and the peripheral area has a target area; wherein the target area includes at least one of an electrode overlapping area, a partial overlapping electrode area, a binding area, a partial binding area, a packaging area, a partial packaging area, and all areas of the peripheral area; Coating a photoresist layer on the entire surface of the substrate, and exposing and developing the photoresist layer to remove at least the photoresist located in the display area, and retaining the photoresist pattern covering at least the target area; coating a common layer for transferring holes or electrons on the base substrate on which the photoresist pattern is formed; The photoresist pattern is removed to expose the target area, so that the common layer is formed in a region of the base substrate except the target area.

9. The method for manufacturing a display panel according to claim 8, wherein: Before coating the common layer on the base substrate, the method further comprises: The photoresist pattern is thinned.

10. The method for manufacturing a display panel according to claim 9, wherein: The photoresist pattern is thinned, specifically comprising: The photoresist pattern is thinned by oxygen plasma; wherein the surface of the thinned photoresist pattern is connected with hydroxyl groups and carboxyl groups.

11. The method for manufacturing a display panel according to claim 10, wherein: After the photoresist pattern is thinned by the oxygen plasma and before the common layer is coated on the base substrate, the method further includes: The photoresist pattern is treated with a fluorine-containing silane coupling agent to make the photoresist pattern thinned. The surface of the photoresist pattern is connected with fluorine-containing groups.

12. The method for manufacturing a display panel according to claim 8 or 9, wherein: The material of the photoresist layer is fluorine-containing resin photoresist.

13. The method for manufacturing a display panel according to any one of claims 8 to 12, wherein: Removing the photoresist pattern specifically includes: The photoresist pattern is removed by a laser lift-off process.

14. The method for manufacturing a display panel according to claim 13, wherein: The laser power required when the laser lift-off process is used is proportional to the size of the target area.

15. The method for manufacturing a display panel according to any one of claims 8 to 14, wherein: Before coating the photoresist layer on the entire surface of the substrate, the method further includes: forming a first electrode on the substrate; After removing the photoresist pattern to expose the target area, the method further comprises: A second electrode is formed on a side of the common layer away from the base substrate; wherein the second electrode is overlapped with the overlap metal in the electrode overlap region; Encapsulating the substrate on which the second electrode is formed; wherein the encapsulation material of the encapsulation area or the partial encapsulation area is in contact with the substrate; The substrate base plate is bonded and connected with the peripheral circuit in the bonding area.

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