Bonding method and bonded object

Abstract

Provided are: a bonding method with which it is possible to reduce adhesive overflow and improve adhesion while reducing the number of steps for bonding and without requiring strict control of adhesive amount or load; and a bonded object. The bonding method comprises: an application step, a shaping step, or a placement step; and a setting step and a processing step in which a first base material 210 and a second base material 220 are set on a first mold 110 and a second mold 120 so that the portion where an adhesive 300 has been applied, shaped, or placed is located at a recess 114 and a recess 124, and the first base material 210 and the second base material 220 are pressed with the first mold 110 and the second mold 120. The first base material 210 deforms inside the recess 114 because of the adhesive 300, thereby forming a protrusion 212 protruding toward the recess 114. The second base 220 deforms inside the recess 124 because of the adhesive 300, thereby forming a protrusion 222 protruding toward the recess 124. The adhesive 300 fills a gap formed by the protrusion 212 and the protrusion 222.

Description

Adhesion method and objects to be adhered

[0001] The present invention relates to a bonding method and an object to be bonded.

[0002] Conventionally, a method for bonding two adherends (hereinafter referred to as substrates) using a mold has been used (see, for example, Patent Document 1). For example, adhesive is applied to the desired bonding position (hereinafter referred to as the bonding portion) on one substrate, and the two substrates are then pressed and held together using a mold to obtain a bonded product (hereinafter referred to as a bonded product). With conventional methods, the adhesive spreads when pressure is applied, preventing the adhesive from achieving the required thickness and making the two substrates prone to peeling. Therefore, it is necessary to strictly control the load applied to the mold and the amount of adhesive. For example, for thick substrates with a thickness of over 1 mm, one method involves forming a groove in one substrate by pre-grooving or the like, and then applying adhesive to the groove. For example, for thin substrates with a thickness of 0.1 mm or less, one method involves forming an enclosure in one substrate by pre-drawing or the like, and then applying adhesive to the enclosure. This prevents the adhesive from overflowing when the mold is used to hold the substrate under pressure.

[0003] Japanese Patent Application Laid-Open No. 2002-347123

[0004] However, the method of forming a groove or a surrounding portion in advance in one of the substrates requires man-hours for groove processing, drawing, and the like. Furthermore, to prevent the adhesive from spilling out of the groove or surrounding portion, the amount of adhesive and the weight applied during processing ultimately require highly precise control. If the amount of adhesive is less than required or the pressure is too weak, underfill may occur in the adhesive joint, resulting in insufficient strength. Conversely, if the amount of adhesive is more than required or the pressure is too strong, the adhesive may leak and cause flash, or the internal pressure during molding may become too high, resulting in cracks in the substrate.

[0005] The present invention has been made in view of the above circumstances, and an exemplary object of the present invention is to provide a bonding method and an adherend that can reduce the number of steps during bonding, do not require strict control of the amount of adhesive or load, reduce adhesive overflow, and improve adhesiveness.

[0006] In order to solve the above problems, an adhesive method as an exemplary aspect of the present invention has the following configuration.

[0007] a bonding method for sandwiching an adhesive between a first bonding surface of a first substrate and a second bonding surface of a second substrate, and bonding the first substrate and the second substrate by sandwiching and pressurizing them between a first mold and a second mold opposed to the first mold, wherein the first mold has a first recess, and the second mold has a second recess at a position opposed to the first recess; a first step of applying, shaping or arranging the adhesive on the first bonding surface or the second bonding surface; and a second step of placing the first substrate on the first mold side and the second substrate on the second mold side so that the portions where the adhesive is applied, shaped or arranged are located in the first recess and the second recess, and pressurizing the first substrate and the second substrate with the first mold and the second mold; The adhesive is filled into a gap formed by the first convex portion and the second convex portion.

[0008] A bonding method according to yet another exemplary aspect of the present invention has the following configuration.

[0009] 1. A bonding method for sandwiching an adhesive between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and sandwiching and pressurizing the first substrate and the second substrate between a first mold and a second mold opposed to the first mold, wherein the first mold has a recess, the method comprising: a first step of applying, shaping or arranging the adhesive on the first adhesive surface or the second adhesive surface; and a second step of placing the first substrate on the first mold side and the second substrate on the second mold side so that the portion where the adhesive is applied, shaped or arranged is located in the recess, and pressurizing the first substrate and the second substrate with the first mold and the second mold, wherein the first substrate is deformed within the recess due to the adhesive, forming a convex portion that protrudes toward the recess, and the adhesive is filled into a void formed by the convex portion.

[0010] In order to solve the above problems, an adherend as an exemplary aspect of the present invention has the following configuration.

[0011] an adherend comprising: a first substrate having a first adhesive surface; a second substrate having a second adhesive surface; and an adhesive bonding at least a portion of the first adhesive surface and the second adhesive surface together, wherein the first substrate has a first convex portion that is deformed and protrudes toward the surface opposite the first adhesive surface due to the adhesive, and / or the second substrate has a second convex portion that is deformed and protrudes toward the surface opposite the second adhesive surface due to the adhesive, and the adhesive is filled in a gap formed by the first convex portion and / or the second convex portion.

[0012] Further objects and other features of the present invention will become apparent from the following description of preferred embodiments with reference to the accompanying drawings.

[0013] According to the present invention, it is possible to provide a bonding method and an adherend that can reduce the number of steps during bonding, do not require strict control of the amount of adhesive or load, reduce adhesive overflow, and improve adhesion.

[0014] Schematic diagrams showing a method for bonding substrates according to a first embodiment, including (a) a schematic diagram showing the application step of applying adhesive to the substrates, (b) a schematic diagram showing a pressure device for bonding two substrates together, (c) a schematic diagram showing the two substrates being pressed and held by a mold, and (d) a schematic diagram showing the substrates being removed after bonding. (a) to (d) are diagrams showing the state of molding an adhesive using the injection molding methods of the first to fifth embodiments. Diagrams explaining the relationship between the recesses of the mold and the protrusions of the substrates according to the first embodiment. Schematic diagrams showing a method for bonding substrates according to a second embodiment, including (a) a schematic diagram showing the application step of applying adhesive to the substrates, (b) a schematic diagram showing a pressure device for bonding two substrates together, and (c) a schematic diagram showing the state of pressing the two substrates together using a mold. (d) is a schematic diagram showing the state where the substrates are being held, and (d) is a schematic diagram showing the state where the substrates are removed after bonding. Schematic diagrams showing the method for bonding substrates of the third embodiment, (a) is a schematic diagram showing a first application step of applying an adhesive to the substrates, (b) is a schematic diagram showing a second application step of applying a binder to the substrates, (c) is a schematic diagram showing the state where two substrates are being bonded, (d) is a schematic diagram showing the state where the two substrates are being pressed and held by a mold, and (e) is a schematic diagram showing the state where the substrates are removed after bonding. (a) is an enlarged view of the bonded portion bonded by the bonding method of the third embodiment, and (b) is a schematic diagram showing a molded product when two substrates are bonded together while a sealing member is processed, and (c) is a cross-sectional view taken along the E-E arrows in (b).

[0015] Hereinafter, embodiments will be described with reference to the drawings. Here, "molding" refers to the process of shaping rubber, resin, or adhesive without using a mold or without a curing (crosslinking) reaction, and "molding" refers to the process of shaping rubber, resin, or adhesive using a mold heated to, for example, 150°C to 200°C while causing a curing (crosslinking) reaction. Furthermore, the position (portion) of two substrates where adhesion is desired (or requires adhesion) is referred to as the adhesive portion.

[0016] [First embodiment] In the first embodiment, a bonding method will be described in which an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold facing the first mold and pressed together to bond them.

[0017] <Substrate, adhesive, and mold> Figure 1 is a schematic diagram showing a method for bonding substrates according to the first embodiment, in which Figure 1(a) is a schematic diagram showing a coating step of coating an adhesive on a substrate, Figure 1(b) is a schematic diagram showing a pressure device for bonding two substrates together, Figure 1(c) is a schematic diagram showing the state in which the two substrates are pressed and held by a mold, and Figure 1(d) is a schematic diagram showing the state in which the substrates have been removed after bonding.

[0018] The bonding method of the first embodiment is carried out using a coating device 400 and a pressure applying device 100. Here, the coating device 400 applies the adhesive 300 to the first substrate 210, and the pressure applying device 100 bonds the first substrate 210 and the second substrate 220 together.

[0019] (Substrate) The first substrate 210 and the second substrate 220, which are the adherends, are made of a material that is resistant to deformation, such as a thin metal plate or a resin film, and have a thickness of, for example, 0.1 mm or less. Note that the thickness may exceed 0.1 mm as long as the material is resistant to deformation. The first substrate 210 and the second substrate 220 do not include materials that are prone to brittle fracture, such as ceramic or glass.

[0020] The first substrate 210 has a surface 210a which is a first adhesive surface to which the adhesive 300 is applied, and a surface 210b opposite to the surface 210a. The second substrate 220 has a surface 220a which is a second adhesive surface to which the adhesive 300 is applied, and a surface 220b opposite to the surface 220a.

[0021] (Adhesive) The adhesive 300 is made of a material that can adhere to the first substrate 210 and the second substrate 220. The adhesive 300 is made of a material that has a viscosity that allows the adhesive to maintain the shape it takes when applied to the first substrate 210. Therefore, the adhesive 300 does not include a material with a viscosity that prevents the adhesive from maintaining the shape it takes when applied.

[0022] (Mold) The pressure device 100 of the first embodiment includes a first mold 110 and a second mold 120. The first mold 110 and the second mold 120 have concave portions. As shown in FIG. 1B , when viewing the vertical cross section of the first mold 110 and the second mold 120, a concave first recess (or recess) 114 is provided on a surface 112 of the first mold 110 facing the second mold 120. The recess 114 is formed by a bottom surface 114a, a wall surface 114b connecting the bottom surface 114a and the surface 112, and a wall surface 114c facing the wall surface 114b, forming a space 114Sp. In the first embodiment, the recess 114 has a U-shaped cross section. However, the cross section is not limited to a U-shaped cross section, and may be, for example, a curved cross section, as long as a deformed first substrate 210 (described later) fits within the space 114Sp formed by the recess 114.

[0023] Furthermore, a recess 124, which is a concave second recess (or recess), is provided on a surface 122 of the second mold 120 that faces the first mold 110, at a position facing the recess 114. The recess 124 is formed by a bottom surface 124a, a wall surface 124b that connects the bottom surface 124a and the surface 122, and a wall surface 124c that faces the wall surface 124b, and a space 124Sp is formed. The recess 124 also has a U-shaped cross section like the recess 114, but the cross-sectional shape is not limited to being U-shaped.

[0024] 1(b) , in other words, the length of the adhesive portion in the direction perpendicular to the paper surface, may be determined depending on the intended use of the first substrate 210 and the second substrate 220. Furthermore, when viewed from a direction perpendicular to the surface 112 of the first mold 110 and the surface 122 of the second mold 120, the recess 114 and the recess 124 are not limited to extending linearly, and may be formed into any shape depending on the intended use of the first substrate 210 and the second substrate 220.

[0025] For example, as shown in Fig. 6(b) described later, the convex portions 222 of the second substrate 220 described later form lines that are a combination of straight lines and curved lines. In this manner, the surface 112 of the first mold 110 and the surface 122 of the second mold 120 may have recesses 114 and recesses 124 formed thereon corresponding to the convex portions 212 (see Fig. 6(c)) and the convex portions 222.

[0026] <Bonding Method> The bonding method of the first embodiment is performed by the coating device 400 and the pressure applying device 100, and includes a coating step, a setting step, a pressure applying step, and a removal step. In the first embodiment, a bonding method utilizing deformation of the base material caused by the adhesive will be described.

[0027] (Coating Process, Molding Process, or Arranging Process) As shown in FIG. 1( a), the coating process, which is the first process of coating the adhesive 300 on the surface 210a or the surface 220a, is performed using a coating device 400. The coating device 400 includes a nozzle 410 and a table 420. The nozzle 410 sprays the adhesive 300 stored in the coating device 400 downward. The table 420 holds the positioned first substrate 210. The first substrate 210 is precisely positioned and placed on the table 420 so that the first substrate 210 is adhered at a predetermined position with precision.

[0028] The nozzle 410 sprays the adhesive 300 onto the surface 210a of the first substrate 210 positioned on the table 420. Note that the coating device 400 may be configured so that either or both of the nozzle 410 and the table 420 can move in a plane perpendicular to the vertical direction (hereinafter referred to as a horizontal plane). This allows the adhesive 300 to draw necessary lines so that the protrusions 212 and 222 as shown in FIG. 6 can be formed on the first substrate 210 and the second substrate 220.

[0029] The application device 400 shown in FIG. 1( a) is an example, and the application method of the adhesive 300 may be performed using, for example, a spray gun, a dispenser, a coater, a printer, or injection molding using a mold. Furthermore, adhesives used in methods that do not use an application device or a mold, such as hot melt adhesive processed into a sheet or film, or the placement (simple installation) of a film with adhesive coated on both sides, may also be used. In this case, the bonding method includes a placement step in which the adhesive is placed on the substrate as the first step. As such, the bonding method of the first embodiment includes a coating step of applying an adhesive or a placement step of placing an adhesive. Hereinafter, the adhesive will be described as being applied in the coating step.

[0030] (Injection Molding) FIG. 2 is a diagram showing a method of molding (adhering) adhesive 300 by injection molding instead of the application method using application device 400 of FIG. 1( a). As shown in FIG. 2, a molding device 450 for adhesive 300 includes molds 450A, 450B, and 450C. Mold 450B is provided with a gate 450Ba and a recess 450Bb. As shown in FIG. 2( a), adhesive or binder 301 is placed between mold 450A and mold 450B, and first substrate 210 is placed between mold 450B and mold 450C. As shown in FIG. 2( b), by applying pressure using molding device 450, adhesive or binder 301 is injected from gate 450Ba into recess 450Bb on first substrate 210, thereby molding adhesive 300 on first substrate 210. As shown in Fig. 2(c), by separating the molds 450A and 450B from the mold 450C, i.e., by opening the molds, it is possible to obtain the first substrate 210 to which the adhesive 300 is adhered (molded), as shown in Fig. 2(d). Note that the method shown in Fig. 2 may be used instead of the coating method using the coating device 400 in Fig. 4(a) or the coating device 500 in Fig. 5(b), which will be described later.

[0031] (Installation Process) Next, an installation process will be described in which the first substrate 210 is installed on the first mold 110 side and the second substrate 220 is installed on the second mold 120 side so that the portions to which the adhesive 300 is applied are located in the recesses 114 and 124. As shown in FIG. 1B, the first substrate 210 and the second substrate 220 are precisely positioned and installed in the pressure device 100. The first substrate 210 to which the adhesive 300 has been applied is placed on the surface 112 of the first mold 110 after the position of the adhesive 300, the position of the recess 114 of the first mold 110, and the position of the recess 124 of the second mold 120 are precisely positioned. Furthermore, the second substrate 220 is precisely positioned and placed on the first substrate 210 to which the adhesive 300 has been applied. The first substrate 210 and the second substrate 220 can be positioned relative to the first mold 110 by, for example, fitting a pilot pin (not shown) on the first mold 110 into a hole (not shown) pre-formed in the first substrate 210 and the second substrate 220, or by recognizing and positioning the substrate using a camera or the like.

[0032] (Pressing Step) Next, the pressing step of pressing the first substrate 210 and the second substrate 220 with the first mold 110 and the second mold 120 will be described. In this state, the first substrate 210 and the second substrate 220 are pressed and held by the first mold 110 and the second mold 120. Here, as shown in FIG. 1C , the first substrate 210 and the second substrate 220 have portions A1 and A2 indicated by dashed lines that are pressed by the first mold 110 and the second mold 120, and a portion B1 indicated by dashed lines that is not pressed due to the presence of the recesses 114 and 124. The portion B1 is pre-positioned so that the portion to which the adhesive 300 is applied is located, and the adhesive 300 is sandwiched between the first substrate 210 and the second substrate 220. Note that in the portion B1, the side with the adhesive 300 is referred to as the inside and the side without the adhesive 300 is referred to as the outside, based on the first substrate 210 or the second substrate 220.

[0033] Regarding portion B1, before deformation of the first substrate 210 and the second substrate 220, the first substrate 210 and the second substrate 220 are not in contact with the first mold 110 and the second mold 120, and thus the flow of the adhesive 300 in the vertical direction of the page within portion B1 due to pressure is not hindered. On the other hand, the presence of the pressurized portions A1 and A2 restricts the flow in the horizontal direction of the page. Due to this anisotropic flow of the adhesive 300, the first substrate 210 and the second substrate 220 deform in at least a portion of portion B1, becoming a first convex portion (or convex portion) 212 and a second convex portion (or convex portion) 222 that protrude outward. Regarding portion B1, after deformation of the first substrate 210 and the second substrate 220, the first substrate 210 may or may not be in contact with the first mold 110, and similarly, the second substrate 220 may or may not be in contact with the second mold 120. Whether or not the first substrate 210 and the first mold 110, and the second substrate 220 and the second mold 120 come into contact with each other after deformation depends on the amount of adhesive 300 filled inside.

[0034] 3 is a diagram illustrating the relationship between the recess 114 of the first mold 110, the protrusion 212 of the first substrate 210, the recess 124 of the second mold 120, and the protrusion 222 of the second substrate 220 in the first embodiment. Here, the width of the recess 114 and the recess 124 is defined as W1, and the height of the recess 114 and the recess 124 is defined as H1. The width of the protrusion 212 and the protrusion 222 after deformation due to the flow of the adhesive 300 is defined as W2, and the height of the protrusion 212 and the protrusion 222 after deformation due to the flow of the adhesive 300 is defined as H2. The width of the protrusion 212 and the protrusion 222 is measured from the position where deformation of the first substrate 210 and the second substrate 220 begins to the position where deformation ends when viewing the cross section in the direction in which the adhesive portion extends (the direction perpendicular to the paper surface). Furthermore, although the height is based on the surface 210b of the first substrate 210 or the surface 220b of the second substrate 220, other positions may be used as the reference as long as the heights H1 and H2 can be measured using the same reference.

[0035] At this time, the recess 114 of the first mold 110 and the recess 124 of the second mold 120 are formed so as to satisfy the relationship W1 ≥ W2 H1 ≥ H2. The first substrate 210 and the second substrate 220 are made of the same material, and the protrusions 212 and 222 have approximately the same degree of protrusion.

[0036] By satisfying the above relationship, the first mold 110 and the second mold 120 do not hinder the deformation of the first substrate 210 and the second substrate 220, and it is possible to prevent the adhesive 300 from spilling out into areas where it is not required. The protrusions 212 and the protrusions 222 are filled with the adhesive 300, forming adhesive reservoirs 310.

[0037] 1( d ), the first substrate 210 and the second substrate 220 bonded with the adhesive 300 in the processing step are removed as the adherend 200. Note that the removal step may be performed automatically by, for example, a robot hand, a robot arm, or the like, or may be performed manually.

[0038] <Adherend> The adherend 200, in which the first substrate 210 and the second substrate 220 are adhered with the adhesive 300, includes the adhesive 300 that at least partially bonds the surface 210a of the first substrate 210 and the surface 220a of the second substrate 220. In the adherend 200, the first substrate 210 has a protrusion 212 that has deformed and protruded toward the surface 210b opposite the surface 210a, together with the adhesive 300. And / or the second substrate 220 has a protrusion 222 that has deformed and protruded toward the surface 220b opposite the surface 220a, together with the adhesive 300.

[0039] <Effects> As described above, in the bonding method of the first embodiment, the adhesive 300 flows in the second step by being pressurized by the first mold 110 and the second mold 120. The first substrate 210 is deformed by the flow of the adhesive 300 within the recess 114, forming a convex portion 212 that protrudes toward the recess 114. The second substrate 220 is deformed by the flow of the adhesive 300 within the recess 124, forming a convex portion 222 that protrudes toward the recess 124.

[0040] The bonding method using the pressure device 100 of the first embodiment eliminates the need for groove processing or drawing on the first substrate 210 and the second substrate 220. The formation of the adhesive reservoir 310 at the bonding portion of the first substrate 210 and the second substrate 220 ensures a sufficient amount of adhesive 300, making the first substrate 210 and the second substrate 220 less likely to peel due to shear force after bonding. Here, the direction of the shear force is the direction of the arrows Sr1 and Sr2 indicated by solid lines (or the arrows Sr3 and Sr4 indicated by dashed lines) in FIG. 1( d ).

[0041] Furthermore, the first substrate 210 and the second substrate 220 are deformed by the flow of the adhesive 300. Therefore, the first substrate 210 and the second substrate 220 can deform according to the amount of adhesive 300, as long as it is within the deformation limit. Regarding the degree of protrusion of the convex portions 212 of the first substrate 210 and the convex portions 222 of the second substrate 220, if the amount of adhesive 300 trapped inside is small, the protrusion amount will be small, and if the amount of adhesive 300 trapped inside is large, the protrusion amount will be large. Therefore, strict control of the amount of adhesive as in the past is not necessary.

[0042] As described above, according to the first embodiment, it is possible to provide a bonding method and an adherend that can reduce the number of steps during bonding, do not require strict control of the amount of adhesive or the load, reduce adhesive overflow, and improve adhesion.

[0043] In the first embodiment, an example was described in which pressure causes the adhesive to flow and deform the substrate. However, the present invention is not limited to this. For example, if the adhesive is hard and has low fluidity, the substrate will deform when pressure is applied, at least due to the presence of the adhesive. Furthermore, in the case of thermoplastic adhesives (hot melt) or thermosetting adhesives (e.g., epoxy adhesives), heating is required simultaneously with pressure application. In this case, in addition to the adhesive flowing due to pressure, the thermal expansion of the adhesive also deforms the substrate. In this case, by appropriately setting the width W1 and height H1 taking the expansion into account, the adhesive 300 will not protrude into areas where it is not needed. This also applies to the following embodiments. That is, adhesives include those with low fluidity, those whose volume changes with expansion, and those whose volume does not change (non-expanding or non-compressible). That is, the present invention includes the following first substrate 210, second substrate 220, and adhesive 300. The first substrate 210 deforms within the recess 114 due to the adhesive 300, forming a convex portion 212 that protrudes toward the recess 114. The second base material 220 is deformed within the recess 124 due to the adhesive 300, and a convex portion 222 is formed that protrudes toward the recess 124. The adhesive 300 is then filled into the gap formed by the convex portion 212 and the convex portion 222.

[0044] [Second Embodiment] In the first embodiment described above, a recessed shape was provided in both the first mold 110 and the second mold 120, but in the second embodiment, a recessed shape (depression) is provided in only one of the two molds. Figure 4 is a schematic diagram showing a method for bonding substrates in the second embodiment. Figure 4(a) is a schematic diagram showing a coating step of coating an adhesive on a first substrate. Figure 4(b) is a schematic diagram showing a pressure device for bonding the first substrate and the second substrate. Figure 4(c) is a schematic diagram showing the first substrate and the second substrate being pressed and held by the first mold and the second mold. Figure 4(d) is a schematic diagram showing the first substrate and the second substrate removed after bonding.

[0045] <Mold> The pressure device 100 of the second embodiment includes a first mold 110A and a second mold 120. The first mold 110A does not have a concave portion on the surface 112A. The second mold 120 is the same as in the first embodiment, so a description thereof will be omitted. The first mold 110A of the second embodiment does not have a recess. That is, the pressure device 100 of the second embodiment has a recess 124 only in one of the molds (the second mold 120). The configuration of the recess 124 is the same as in the first embodiment, so a description thereof will be omitted.

[0046] <Pressure application process> The application process shown in FIG. 4(a) and the installation process shown in FIG. 4(b) are similar to those shown in FIGS. 1(a) and 1(b), and therefore will not be described here. The pressure application process of the second embodiment will be described. As shown in FIG. 4(c), the first substrate 210 and the second substrate 220 have portions C1 and C2, indicated by dashed lines, that are pressurized by the first mold 110A and the second mold 120, and a portion D1, indicated by dashed lines, that is not pressurized due to the presence of the recess 124. The portion D1 is pre-positioned so that the portion to which the adhesive 300 is applied is located, and the adhesive 300 is sandwiched between the first substrate 210 and the second substrate 220. In the portion D1, the side with the adhesive 300 is referred to as the inside, and the side without the adhesive 300 is referred to as the outside, based on the first substrate 210 or the second substrate 220.

[0047] Portion D1 is not in contact with the first mold 110A or the second mold 120, and the upward flow of the adhesive 300 in portion D1 due to pressure is not hindered. On the other hand, the presence of pressurized portions C1 and C2 restricts the flow in the left-right direction of the page. Due to this anisotropic flow of the adhesive 300, only the second substrate 220 located on the side where the recess 124 is provided is deformed in at least a portion of portion D1, forming a convex portion 222 that protrudes outward. The relationship between W1, W2, H1, and H2 is the same as in the first embodiment, and therefore will not be described further.

[0048] 4(d), the first substrate 210 and the second substrate 220 bonded by the adhesive 300 in the processing step are removed as the adherend 200A. This is the same as the first embodiment except that the adherend 200A is deformed only by the second substrate 220.

[0049] <Effects> The bonding method using the pressure device 100 of the second embodiment, in which a recess is provided only on one side of the mold, also eliminates the need for groove processing or drawing on the first substrate 210 and the second substrate 220. The formation of the adhesive reservoir 310 ensures a sufficient amount of adhesive 300, making the first substrate 210 and the second substrate 220 less likely to peel off due to shear force after bonding. As shown in FIG. 4(d), the shear force is similar to that of the first embodiment, and therefore will not be described here.

[0050] Furthermore, in the second embodiment, only the second substrate 220 is deformed by the flow of the adhesive 300. Even in this case, the second substrate 220 can deform according to the amount of adhesive 300, as long as it is within the deformation limit. Regarding the degree of protrusion of the convex portion 222 of the second substrate 220, if the amount of adhesive 300 trapped inside is small, the protrusion amount will be small, and if the amount of adhesive 300 trapped inside is large, the protrusion amount will be large. Therefore, strict control of the amount of adhesive as in the conventional method is not required.

[0051] 4, the first mold 110 may be provided with the recess 114, while the second mold 120 may not be provided with a recess. In this case, the flow of the adhesive 300 when pressurized causes the first substrate 210 to deform, forming the protrusion 212, while the second substrate 220 does not deform. Even in this case, the same effects as those described above can be obtained.

[0052] As described above, according to the second embodiment, it is possible to provide a bonding method and an adherend that can reduce the number of steps during bonding, do not require strict control of the amount of adhesive or the load, reduce adhesive overflow, and improve adhesion.

[0053] [Third Embodiment] In the first and second embodiments, two substrates are bonded together using an adhesive. However, depending on the material of the substrate, the adhesive may be incompatible with the substrate, making bonding using an adhesive difficult. In the third embodiment, a method using a binder that can bond two substrates together even in such cases is described. Furthermore, in the third embodiment, a step of applying an adhesive to a first substrate 210 to bond the first substrate 210 to the binder, and a step of applying an adhesive to a second substrate 220 to bond the second substrate 220 to the binder are performed before the application step. While the above-described embodiments utilize the flow of the adhesive and the deformation of the substrate, the third embodiment utilizes the flow of the binder and the deformation of the substrate.

[0054] <Binder> Figure 5 is a schematic diagram showing a method for bonding substrates according to a third embodiment. Figure 5(a) is a schematic diagram showing a first application step of applying an adhesive to the substrates, and Figure 5(b) is a schematic diagram showing a second application step of applying a binder to the substrates. Figure 5(c) is a schematic diagram showing a pressure device for bonding two substrates together, Figure 5(d) is a schematic diagram showing the two substrates being pressed and held by a mold, and Figure 5(e) is a schematic diagram showing the substrates removed after bonding.

[0055] The binder 360 used as the first adhesive is, for example, resin or rubber. The binder 360 is applied by an application device 500. As shown in FIG. 5B , the second application step is performed using the application device 500. The application device 500 includes a nozzle 510 and a table 520. The nozzle 510 sprays the binder 360 contained in the application device 500 downward. The table 520 holds the positioned first substrate 210. The first substrate 210 is precisely positioned and placed on the table 520 so that the first substrate 210 is adhered precisely to a predetermined position.

[0056] The nozzle 510 sprays the binder 360 onto the surface 210a of the first substrate 210 positioned on the table 520. The coating device 500 may be configured so that either or both of the nozzle 510 and the table 520 are movable within a horizontal plane. This allows the binder 360 to draw necessary lines so as to form the convex portions 212 and 222 on the first substrate 210 and the second substrate 220 as shown in FIG. 6B . The coating device 500 shown in FIG. 5B is merely an example, and the binder 360 may be applied using, for example, a spray gun, a dispenser, a coater, a printer, or injection molding using a mold. For example, a hot-melt binder processed into a sheet or film, or a film coated with a binder on both sides, may be disposed, and this may be performed as a disposing process instead of the coating process, as in the first embodiment. That is, the first application step and / or the second application step described below may be the first disposing step and / or the second disposing step.

[0057] <Bonding Method> The bonding method of the third embodiment is performed by the coating device 400, the coating device 500, and the pressure device 100, and includes a first coating step, a second coating step, a setting step, a pressure step, and a removal step.

[0058] (First Application Step) In the third embodiment, the adhesive 300 serving as the second adhesive is uniformly applied to the surface 210 a of the first substrate 210 and the surface 220 a of the second substrate 220 by the application device 400 .

[0059] In the third embodiment, the adhesive 300 is uniformly applied to both the first substrate 210 and the second substrate 220, but it may be applied to only one of them. Furthermore, in the first application step, the adhesive 300 is applied to areas of the first substrate 210 and the second substrate 220 other than the areas where the binder 360 is to be applied, but the adhesive 300 may be applied to a part of the first substrate 210 and the second substrate 220 including the areas where the binder 360 is to be applied. Furthermore, the first application step may not be performed, i.e., the adhesive 300 is not applied to both the first substrate 210 and the second substrate 220, but the binder 360 may be applied directly to the first substrate 210 and the second substrate 220.

[0060] 1A and 4A is performed in the second coating step. Here, in the third embodiment, a coating device 500 applies the binder 360 to the surface 210a of the first substrate 210 to which the adhesive 300 has been applied. By applying the adhesive 300 to the first substrate 210 and the second substrate 220 in advance, the adhesion of the binder 360 can be made stronger.

[0061] 5(c) is the same as that of Fig. 1(b) and Fig. 4(b), and therefore a description thereof will be omitted. Also, the pressurizing step shown in Fig. 5(d) is the same as that of Fig. 5(d) except that the adhesive 300 is uniformly applied to both the first substrate 210 and the second substrate 220, and that the adhesive 300 of the first and second embodiments is replaced with a binder 360, and therefore a description thereof will be omitted.

[0062] As shown in Fig. 5(d) , in the third embodiment, convex portions 212 are formed on the first substrate 210 and convex portions 222 are formed on the second substrate 220 due to the flow of the binder 360. The convex portions 212 and 222 are filled with the binder 360, forming binder reservoirs 370. Note that the removal step in Fig. 5(e) in which the adherend 200B is removed is the same as in Figs. 1(d) and 4(d) , and therefore a description thereof will be omitted.

[0063] When the binder 360 is used, a recess may be provided in only one of the molds for bonding, as in the second embodiment.

[0064] In the third embodiment, the same effects as those of the first and second embodiments can be obtained, and further, by using a binder such as rubber or resin as an adhesive, the options for materials that can be used for the substrate can be increased.

[0065] As described above, according to the third embodiment, it is possible to provide a bonding method and an adherend that can reduce the number of steps during bonding, do not require strict control of the amount of adhesive or the load, reduce adhesive overflow, and improve adhesion.

[0066] Fourth Embodiment In the first, second, and third embodiments, a mold for bonding two substrates with an adhesive or binder was described. The bonding of the two substrates may be performed simultaneously with the process of molding a sealing member such as rubber on the substrates. That is, recesses 114, 124 for forming convex portions on the first substrate 210 and the second substrate 220 that deform due to the flow of the adhesive or binder may be provided in the mold for molding the sealing member. In the fourth embodiment, in the processing step, a sealing member is molded on the surface 210b of the first substrate 210 opposite the surface 210a, and / or a sealing member is molded on the surface 220b of the second substrate 220 opposite the surface 220a.

[0067] <Sealing member and adhesive portion> Figure 6(a) is an enlarged view of an adhesive portion bonded using the adhesive method of the third embodiment, (b) is a schematic diagram showing a molded product when two substrates are bonded together while the sealing member is processed, and (c) is a cross-sectional view taken along the arrows E-E in (b). As shown in Figure 6(a), even when the sealing member is processed and adhesive is performed at the same time, convex portions 212 and 222 are formed on the first substrate 210 and the second substrate 220 due to the flow of the binder 360, and binder reservoirs 370 are formed inside the convex portions 212 and 222. This allows the first substrate 210 and the second substrate 220 to be firmly bonded together.

[0068] FIG. 6( b ) is a view of the second substrate 220 side of the molded product 700 after molding of the seal member 600 is completed. The molded product 700 includes the seal member 600 molded on the surface 220 b of the second substrate 220, the first substrate 210 and the second substrate 220 bonded together by a binder 360, and a convex portion 222 formed on the surface 220 b of the second substrate 220 along a line appropriate for the shape of the seal member 600. Holes 228 are also formed in the first substrate 210 and the second substrate 220. Thus, the first substrate 210 and the second substrate 220 may have holes 228 or notches depending on the application, etc., and the arrangement and shape of the seal member molded on the surface 210 b or the surface 220 b can be freely designed. The adhesive portions, in other words, the convex portions 212 and the convex portions 222, can also be formed in a shape and at a position appropriate for the application, etc., of the molded product 700.

[0069] Figure 6(c) is a cross-sectional view taken along the line E-E in Figure 6(b). The flow of binder 360 causes the first substrate 210 to deform, forming convex portions 212, and the second substrate 220 to deform, forming convex portions 222. Binder reservoirs 370 are present within the convex portions 212 and 222 via adhesive 300, strengthening the bond between the first substrate 210 and the second substrate 220.

[0070] Furthermore, a seal member 600 is molded on the right side of the adhesive portion. More specifically, a seal member 600A1 is molded on the first base material 210, and a seal member 600A2 is molded on the second base material 220. Note that, although an example in which the seal member is molded together with the adhesive method described in the third embodiment has been described in Fig. 6, the seal member may also be molded together with the adhesive method described in the first or second embodiment.

[0071] As described above, according to the fourth embodiment, it is possible to provide a bonding method and an adherend that can reduce the number of steps during bonding, do not require strict control of the amount of adhesive or the load, reduce adhesive overflow, and improve adhesion.

[0072] [Other Embodiments] In the first to fourth embodiments, the two substrates are made of the same material, but the two substrates may be made of different materials and bonded using the bonding methods of the above-described embodiments. Even if the same adhesive or binder is used, if the substrates are made of different materials, the degree to which the substrates deform due to the flow of the adhesive or binder will differ. Therefore, the width W1 and height H1 of the recesses in the molds may be set to sizes corresponding to the sizes of the protrusions formed on the respective substrates for the recesses 114 in the first mold 110 and the recesses 124 in the second mold 120.

[0073] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these, and various modifications and changes are possible within the scope of the gist of the present invention.

[0074] Furthermore, for example, the present invention includes the following.

[0075] [Aim 1] A bonding method for sandwiching an adhesive between a first bonding surface of a first substrate and a second bonding surface of a second substrate, and bonding the first substrate and the second substrate by sandwiching and pressurizing them between a first mold and a second mold opposed to the first mold, wherein the first mold has a first recess, and the second mold has a second recess at a position opposed to the first recess, the method comprising: a first step of applying, shaping or arranging the adhesive on the first bonding surface or the second bonding surface; and a second step of placing the first substrate on the first mold side and the second substrate on the second mold side so that the portions where the adhesive is applied, shaped or arranged are located in the first recess and the second recess, and pressurizing the first substrate and the second substrate with the first mold and the second mold, wherein the first substrate is deformed in the first recess due to the adhesive and a first convex portion protruding toward the first concave, and the second substrate is deformed in the second recess due to the adhesive and a second convex portion protruding toward the second concave, The adhesive is filled into a gap formed by the first convex portion and the second convex portion.

[0076] [Purpose 2] A bonding method for sandwiching an adhesive between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and sandwiching and pressurizing the first substrate and the second substrate between a first mold and a second mold facing the first mold, wherein the first mold has a recess, the method comprising: a first step of applying, shaping or arranging the adhesive on the first adhesive surface or the second adhesive surface; and a second step of placing the first substrate on the first mold side and the second substrate on the second mold side so that the portion where the adhesive is applied, shaped or arranged is located in the recess, and pressurizing the first substrate and the second substrate with the first mold and the second mold, wherein the first substrate is deformed within the recess due to the adhesive, and a convex portion that protrudes toward the recess is formed, and the adhesive is filled into a void formed by the convex portion.

[0077] [Meaning 3] The adhesive may contain rubber or resin.

[0078] [Purpose 4] The bonding method according to claim 3, wherein, when the adhesive is a first adhesive, the bonding method further comprises, before the first step, a step of applying, forming, or placing a second adhesive on the first substrate to bond the first substrate and the first adhesive, and / or a step of applying, forming, or placing the second adhesive on the second substrate to bond the second substrate and the first adhesive.

[0079] [Purpose 5] In the second step, a sealing member may be molded on a surface of the first base material opposite to the first adhesive surface, and / or a sealing member may be molded on a surface of the second base material opposite to the second adhesive surface, using the first mold and the second mold.

[0080] [Purpose 6] An adherend comprising: a first substrate having a first adhesive surface; a second substrate having a second adhesive surface; and an adhesive that bonds at least a portion of the first adhesive surface and the second adhesive surface, wherein the first substrate has a first convex portion that is deformed and protrudes toward the surface opposite the first adhesive surface due to the adhesive, and / or the second substrate has a second convex portion that is deformed and protrudes toward the surface opposite the second adhesive surface due to the adhesive, and the adhesive is filled in a gap formed by the first convex portion and / or the second convex portion.

[0081] 100 Pressure device 110, 110A First mold 112 Surface 114 Recess 114Sp Space, 114a Bottom surface, 114b Wall surface, 114c Wall surface 120 Second mold 122 Surface 124 Recess 124Sp Space, 124a Bottom surface, 124b Wall surface, 124c Wall surface 200, 200A Adherend 210 First substrate 210a, 210b Surface 212 Convex portion 220 Second substrate 220a, 220b Surface 222 Convex portion 228 Hole 300 Adhesive, 301 Adhesive or binder, 310 Adhesive reservoir 360 Binder 400 Application device 410 Nozzle 420 Table 450 Molding device 450A, 450B, 450C Mold 450Ba Gate 450Bb Recess 500 Coating device 510 Nozzle 520 Table 600, 600A1, 600A2 Sealing member 700 Molded product A1, A2, B1, C1, C2, D1 Parts Sr1, Sr2, Sr3, Sr4 Arrows W1, W2 Width H1, H2 Height

Claims

1. A bonding method for sandwiching an adhesive between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and sandwiching and pressurizing the first substrate and the second substrate between a first mold and a second mold opposed to the first mold, the method comprising: a first step of applying, shaping or arranging the adhesive on the first adhesive surface or the second adhesive surface; and a second step of placing the first substrate on the first mold side and the second substrate on the second mold side such that the portions to which the adhesive has been applied, shaped or arranged are located in the first and second recesses, and applying pressure to the first substrate and the second substrate by the first and second molds, the first substrate being deformed in the first recess due to the adhesive and forming a first convex portion protruding towards the first recess, and the second substrate being deformed in the second recess due to the adhesive and forming a second convex portion protruding towards the second recess, The adhesive is filled into a gap formed by the first convex portion and the second convex portion.

2. A bonding method in which an adhesive is sandwiched between a first adhesive surface of a first substrate and a second adhesive surface of a second substrate, and the first substrate and the second substrate are sandwiched between a first mold and a second mold opposed to the first mold and pressurized to bond them, the first mold having a recess, the method comprising: a first step of applying, shaping or arranging the adhesive on the first adhesive surface or the second adhesive surface; and a second step of placing the first substrate on the first mold side and the second substrate on the second mold side so that the portion where the adhesive is applied, shaped or arranged is located in the recess, and pressurizing the first substrate and the second substrate with the first mold and the second mold, the first substrate being deformed within the recess due to the adhesive, forming a convex portion that protrudes toward the recess, and the adhesive being filled into a gap formed by the convex portion.

3. The bonding method according to claim 1 or 2, wherein the adhesive comprises rubber or resin.

4. The bonding method according to claim 3, further comprising, prior to the first step, a step of applying, forming or placing a second adhesive on the first substrate to bond the first substrate and the first adhesive, and / or a step of applying, forming or placing the second adhesive on the second substrate to bond the second substrate and the first adhesive, when the adhesive is a first adhesive.

5. A bonding method as described in claim 1 or claim 2, wherein in the second step, a sealing member is molded on a surface of the first base material opposite to the first adhesive surface by using the first mold and the second mold, and / or a sealing member is molded on a surface of the second base material opposite to the second adhesive surface.

6. An adherend comprising: a first substrate having a first adhesive surface; a second substrate having a second adhesive surface; and an adhesive bonding at least a portion of the first adhesive surface and the second adhesive surface, wherein the first substrate has a first convex portion that is deformed and protrudes toward the surface opposite the first adhesive surface due to the adhesive, and / or the second substrate has a second convex portion that is deformed and protrudes toward the surface opposite the second adhesive surface due to the adhesive, and the adhesive is filled in a gap formed by the first convex portion and / or the second convex portion.

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