Compound, method for producing same, curable resin composition, and cured product of same

Abstract

Provided are a compound having excellent low dielectric properties, a curable resin composition, and a cured product of the same.　This compound is represented by formula (1). In formula (1), R1's, which exist in a quantity of more than one, each independently represent a hydrogen atom or a hydrocarbon group having 1-5 carbon atoms. R2's, which exist in a quantity of more than one, each independently represent a hydrocarbon group represented by formula (a). X represents a structure represented by formula (c)-(f). l's, which exist in a quantity of more than one, each independently represent an integer of 1-4. m's, which exist in a quantity of more than one, each independently represent an integer of 0-3 and the average value mave of m's satisfies 0<mave≤3. n represents the number of repeats, and the average nave of n's satisfies 0.05≤nave≤20. In formula (a), * represents the site of binding to a fluorene structure in formula (1). R3 represents a hydrogen atom or a hydrocarbon group having 1-5 carbon atoms. k represents an integer of 1-5. In formulae (c)-(f), * represents the site of binding to a fluorene structure in formula (1). R4's, which exist in a quantity of more than one, each independently represent a hydrogen atom or a hydrocarbon group having 1-5 carbon atoms. p's, which exist in a quantity of more than one, each independently represent an integer of 1-4, and q's, which exist in a quantity of more than one, each independently represent an integer of 1-3.