Detection apparatus and driving method therefor

Abstract

A detection apparatus and a driving method therefor. The detection apparatus comprises: a detection substrate (100), the detection substrate (100) comprising a detection surface (S1) and a back surface (S2) which are arranged opposite one another, as well as a first side edge (S3), a second side edge (S4), and a third side edge (S5) connecting the detection surface (S1) and the back surface (S2), the first side edge (S1) being arranged opposite to the second side edge (S4), and the third side edge (S5) being connected to the first side edge (S3) and the second side edge (S4); a driving system, which comprises a plurality of first circuit boards (101), the plurality of first circuit boards (101) extending, by passing over at least one of the first side edge (S3) and the second side edge (S4), from the side on which the back surface (S2) is located to the side on which the back surface (S2) is located, and on the side on which the back surface (S2) is located, the farthest distance between the first circuit board (101) and the back surface (S2) in a first direction (Z) being a first distance (d1), the first direction (Z) being the vertical direction of the detection surface (S1); and a plurality of second circuit boards (102), the plurality of second circuit boards (102) extending, by passing over the third side edge (S5), from the side on which the detection surface (S1) is located to the side on which the back surface (S2) is located, and on the side on which the back surface (S2) is located, the farthest distance (d2) between the second circuit board (102) and the back surface (S2) in the first direction (Z) being a second distance, the second distance (d2) being different from the first distance (d1).

Description

Detection device and driving method thereof Technical Field

[0001] The present disclosure relates to the field of photoelectric detection technology, and in particular to a detection device and a driving method thereof. Background Art

[0002] X-ray inspection technology is widely used in industrial nondestructive testing, container scanning, circuit board inspection, healthcare, security, and industry, and holds broad application prospects. Traditional X-ray imaging relies on analog signals, resulting in low resolution and poor image quality. Digital radiography (DR), which emerged in the late 1990s, uses an X-ray detector substrate to directly convert X-ray images into digital images. With its significant advantages, including ease of operation, rapid imaging, high resolution, clear digital images, and ease of storage and transmission, DR has become a leading technology in digital radiography.

[0003] Summary of the Invention

[0004] The present disclosure provides a detection device and a driving method thereof, the specific scheme of which is as follows:

[0005] In one aspect, an embodiment of the present disclosure provides a detection device, comprising:

[0006] A detection substrate, the detection substrate comprising a detection surface and a back surface opposite to each other, a first side, a second side, and a third side connecting the detection surface and the back surface, wherein the first side is opposite to the second side, and the third side connects the first side and the second side;

[0007] A drive system, comprising:

[0008] a plurality of first circuit boards, the plurality of first circuit boards extending from the side where the detection surface is located through at least one of the first side edge and the second side edge to the side where the back surface is located; on the side where the back surface is located, the maximum distance between the first circuit boards and the back surface in a first direction is a first distance, and the first direction is a direction perpendicular to the detection surface;

[0009] A plurality of second circuit boards extend from the side where the detection surface is located through the third side to the side where the back surface is located; on the side where the back surface is located, the maximum distance between the second circuit boards and the back surface in the first direction is a second distance, and the second distance is different from the first distance.

[0010] In a possible implementation, in the detection device provided in an embodiment of the present disclosure, the first circuit board includes a reading chip, the second circuit board includes a gate driving chip, and the second distance is greater than the first distance.

[0011] In one possible implementation, the detection device provided in the embodiment of the present disclosure further includes a middle frame, the middle frame including a bottom frame and a side frame, wherein the bottom frame is located on a side of the back surface away from the detection surface, the side frame is fixed to an end of the bottom frame adjacent to the third side, and the side frame is located on a side of the bottom frame away from the back surface;

[0012] The first circuit board extends to a side of the bottom frame away from the back surface, and the second circuit board extends to a surface of the side frame away from the back surface.

[0013] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading chip is located on a side of the bottom frame away from the back side, and the gate driving chip is located on a side of the side frame that is arranged on the same side as the third side.

[0014] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the multiple first circuit boards include multiple first sub-circuit boards and multiple second sub-circuit boards, wherein the multiple first sub-circuit boards extend from the side where the detection surface is located through the first side edge to the side of the bottom frame away from the back side, and the multiple second sub-circuit boards extend from the side where the detection surface is located through the second side edge to the side of the bottom frame away from the back side; and the setting positions of the multiple first sub-circuit boards and the setting positions of the multiple second sub-circuit boards are symmetrical with respect to the second direction, and the second direction is the perpendicular direction of the third side edge.

[0015] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the driving system also includes two reading circuit boards located on the side of the bottom frame away from the back side, one of the reading circuit boards is connected to the multiple first sub-circuit boards, and the other reading circuit board is connected to the multiple second sub-circuit boards, and the component structures of the two reading circuit boards are symmetrically arranged about the center of the detection substrate.

[0016] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading circuit board includes at least one first through hole, the reading circuit board is fixedly connected to the bottom frame at the at least one first through hole, and the at least one first through hole is a conductive hole.

[0017] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading circuit board also includes a first edge area close to one side of the at least one first through hole and away from the center of the detection substrate, and the surface of the reading circuit board in contact with the bottom frame is conductively arranged in the first edge area.

[0018] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading circuit board also includes at least one first electrostatic protection circuit, and the at least one first electrostatic protection circuit is arranged on a side of the first connection port close to the center of the detection substrate, and the first connection port connects the first circuit board and the reading circuit board.

[0019] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading circuit board further includes at least one first filtering circuit, and the at least one first filtering circuit is located on a side of the at least one first electrostatic protection circuit close to the center of the detection substrate.

[0020] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the driving system also includes a gate drive circuit board and a main control board, wherein the gate drive circuit board is connected to the second circuit board, and the main control board is located between the layer where the reading circuit board is located and the layer where the gate drive circuit board is located.

[0021] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading circuit board includes a first boundary away from the center of the detection substrate and extending along the second direction, and the main control board includes a second boundary away from the center of the detection substrate and extending along the second direction, wherein the first boundary is located on the side of the second boundary away from the center of the detection substrate, and there is a third distance between the first boundary and the second boundary, the second direction is a direction perpendicular to the third side, and the third direction is a direction perpendicular to the first side.

[0022] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the drive system also includes a first flat flexible cable, the reading circuit board also includes a first power signal connector, and the main control board includes a second power signal connector, and the first power signal connector is connected to the second power signal connector through the first flat flexible cable.

[0023] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the driving system also includes a first flexible circuit board, the reading circuit board also includes a first data signal connector, the main control board includes a plurality of second data signal connectors, the first data signal connector is connected to at least one second data signal connector through the first flexible circuit board, and the number of the second data signal connectors is greater than the number of the first data signal connectors or the first flexible circuit board.

[0024] In a possible implementation, in the detection device provided in an embodiment of the present disclosure, the second data signal connector is a miniature video connector, and the miniature video connector includes a shielding layer, and the shielding layer is grounded.

[0025] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the first flexible circuit board includes a plurality of pins arranged side by side, and a plurality of differential design cables, wherein the outermost pins are grounded, and the remaining pins are connected to each of the differential design cables.

[0026] In one possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the reading circuit board also includes at least one second through hole, the main control board includes at least one third through hole that is conductively connected to the at least one second through hole, the main control board is fixedly connected to the bottom frame at the at least one third through hole, and the at least one third through hole is a conductive hole.

[0027] In a possible implementation, the detection device provided in the embodiment of the present disclosure further includes a heat-conducting structure, which is located between the first circuit board and the bottom frame and is in contact with the reading chip and the surface of the bottom frame away from the back surface.

[0028] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the driving system further includes a gate driving circuit board, which is connected to the second circuit board; the gate driving circuit board includes at least one fourth through hole, and the gate driving circuit board is fixedly connected to the side frame at the at least one fourth through hole, and the at least one fourth through hole is a conductive hole.

[0029] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the gate drive circuit board also includes a second edge area covering the at least one fourth through hole, and the surface of the gate drive circuit board in contact with the side frame is conductively arranged in the second edge area.

[0030] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the gate drive circuit board also includes at least one second electrostatic protection circuit, and the at least one second electrostatic protection circuit is arranged on a side of the second connection port close to the center of the detection substrate, and the second connection port connects the second circuit board with the gate drive circuit board.

[0031] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the gate drive circuit board also includes at least one second filter circuit, and the at least one second filter circuit is located on a side of the at least one second electrostatic protection circuit close to the center of the detection substrate.

[0032] In one possible implementation, in the detection device provided in an embodiment of the present disclosure, the middle frame further includes a boss structure, the boss structure being fixed to a side of the bottom frame away from the back surface, and the boss structure being fixedly connected to a partial surface of the side frame on a side close to the bottom frame;

[0033] The gate driving circuit board further includes at least one fifth through hole, the gate driving circuit board is fixedly connected to the boss structure at the at least one fifth through hole, and the at least one fifth through hole is a conductive hole.

[0034] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the drive system also includes a main control board located on the side of the gate drive circuit board facing the bottom frame, and the main control board includes a first notch structure, and the boss structure is accommodated in the first notch structure.

[0035] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the drive system also includes a second flat flexible cable, the gate drive circuit board also includes a third power signal connector, the main control board includes a fourth power signal connector, and the third power signal connector is connected to the fourth power signal connector through the second flat flexible cable.

[0036] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the driving system also includes a second flexible circuit board, the gate circuit board also includes a first scan signal connector, the main control board includes a second scan signal connector, and the first scan signal connector is connected to the second scan signal connector through the second flexible circuit board.

[0037] In a possible implementation, in the detection device provided in an embodiment of the present disclosure, the main control board further includes a second notch structure, and the second notch structure is arranged opposite to the first notch structure;

[0038] The drive system further includes a first adapter plate, a portion of the first adapter plate is embedded in the second notch structure, and the first adapter plate is connected to the main control board.

[0039] In a possible implementation, in the above-mentioned detection device provided in an embodiment of the present disclosure, the drive system further includes an indicator light board and a power input board, and the indicator light board, the power input board and the first adapter board are located on the same vertical plane of the detection surface.

[0040] In some possible implementations, in the above-mentioned detection device provided in an embodiment of the present disclosure, the drive system further includes a main control board and a second adapter board, wherein the second adapter board includes a reading circuit board connected to the first circuit board, and multiple types of signal expansion boards connected to the reading circuit board, and the main control board is connected to the reading circuit board through the signal expansion board.

[0041] In some possible implementations, in the above-mentioned detection device provided in the embodiment of the present disclosure, the driving system also includes a main control board, a second adapter board and a gold finger contact connector, wherein the second adapter board includes a reading circuit board connected to the first circuit board, and a gate drive circuit board connected to the second circuit board, and the main control board is connected to the reading circuit board and the gate drive circuit board through the gold finger contact connector.

[0042] On the other hand, an embodiment of the present disclosure provides a driving method for a detection device, wherein the detection substrate includes a plurality of data lines arranged in sequence, the plurality of first circuit boards include at least one first sub-circuit board connected to the odd-numbered data lines at one end of the data lines, and at least one second sub-circuit board connected to the even-numbered data lines at the other end of the data lines, the at least one first sub-circuit board and the at least one second sub-circuit board being symmetrically arranged about a center of the detection substrate;

[0043] The driving method includes:

[0044] Acquire and buffer a plurality of first data signals outputted in positive sequence by the at least one first sub-circuit board and a plurality of second data signals outputted in positive sequence by the at least one second sub-circuit board;

[0045] Flipping the plurality of second data signals outputted in positive sequence by the second sub-circuit board so that the plurality of second data signals outputted by the second sub-circuit board are arranged in reverse order;

[0046] The plurality of first data signals output in positive order and the plurality of second data signals output in reverse order are framed and then transmitted to a host computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] FIG1 is a schematic diagram of the interference between a first COF and a second COF in the related art;

[0048] FIG2 is a schematic diagram of a first circuit board and a second circuit board provided by an embodiment of the present disclosure, in which the first circuit board and the second circuit board do not interfere with each other;

[0049] FIG3 is a schematic diagram of a symmetrical design of a reading circuit board provided in an embodiment of the present disclosure;

[0050] FIG4 is a schematic diagram showing the position of a second circuit board provided in an embodiment of the present disclosure;

[0051] FIG5 is a schematic diagram of another symmetrical design of a reading circuit board provided in an embodiment of the present disclosure;

[0052] FIG6 is a schematic diagram of another symmetrical design of a reading circuit board provided in an embodiment of the present disclosure;

[0053] FIG7 is a schematic structural diagram of a reading circuit board provided in an embodiment of the present disclosure;

[0054] FIG8 is a schematic diagram of another structure of a reading circuit board provided in an embodiment of the present disclosure;

[0055] FIG9 is a schematic structural diagram of a drive system provided by an embodiment of the present disclosure;

[0056] FIG10 is another structural schematic diagram of a drive system provided in an embodiment of the present disclosure;

[0057] FIG11 is a schematic structural diagram of a main control chip provided in an embodiment of the present disclosure;

[0058] FIG12 is a schematic structural diagram of a gate drive circuit board provided in an embodiment of the present disclosure;

[0059] FIG13 is another structural schematic diagram of a gate drive circuit board provided in an embodiment of the present disclosure;

[0060] FIG14 is another structural diagram of a drive system provided by an embodiment of the present disclosure;

[0061] FIG15 is another structural schematic diagram of a drive system provided in an embodiment of the present disclosure;

[0062] FIG16 is another structural diagram of a drive system provided by an embodiment of the present disclosure;

[0063] FIG17 is another structural diagram of a drive system provided by an embodiment of the present disclosure;

[0064] FIG18 is another structural diagram of a drive system provided by an embodiment of the present disclosure;

[0065] FIG19 is another structural diagram of a drive system provided by an embodiment of the present disclosure;

[0066] FIG20 is another structural schematic diagram of a drive system provided by an embodiment of the present disclosure;

[0067] FIG21 is another structural diagram of a drive system provided by an embodiment of the present disclosure;

[0068] FIG22 is a schematic diagram of the arrangement of the first sub-circuit board and the second sub-circuit board provided in an embodiment of the present disclosure;

[0069] FIG23 is a flow chart of a driving method provided by an embodiment of the present disclosure;

[0070] Icons: 100 - detection substrate; 101 - first circuit board; 102 - second circuit board; 103 - middle frame; 1031 - bottom frame; 1032-side frame; 1033-boss structure; 104-heat-conducting structure; 105-reading circuit board; 1051-first reading circuit board; 1052-second reading circuit board; 501-first electrostatic protection circuit; 502-first filtering circuit; 503-first power signal connector; 504-first data signal connector; 106-first protective layer; 107-main control board; 1071-second power signal connector; 1072-second data signal connector; 1073-FPGA main control; 1074-DDR3 cache; 1075-FLASH storage; 1076-system power supply; 1077-fourth power signal connector; 1078-second scan signal connector; 108-gate drive circuit board; 1081-second electrostatic protection circuit; 1082-second filtering circuit; 1083-third power signal connector; 1084-first scan signal connector; 109-first flat flexible cable; 110- First flexible circuit board; 111 - fixing column; 112 - second protective layer; 113 - second flexible circuit board; 114 - first adapter board; 115 - third flexible circuit board; 116 - indicator board; 117 - power input board; 118 - fourth flexible circuit board; 119 - fifth flexible circuit board; 120 - second adapter board; 121 - gold finger contact connector; S1 - detection surface; S2 - back; S3 - first side; S4 - second side; S5 - third side ; S6-fourth side; d1-first distance; d2-second distance; d3-third distance; ROIC_L-first sub-circuit board; ROIC_R-second sub-circuit board; h1-first through hole; h2-second through hole; h3-third through hole; h4-fourth through hole; h5-fifth through hole; O-center of detection substrate; A1-first edge area; A2-second edge area; C1-first connection port; C2-second connection port; L1-first boundary; L2-second boundary. DETAILED DESCRIPTION

[0071] To further clarify the objectives, technical solutions, and advantages of the embodiments of the present disclosure, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present disclosure. It should be noted that in the drawings, the thicknesses of layers, films, panels, regions, etc. are exaggerated for clarity. In this disclosure, exemplary embodiments are described with reference to cross-sectional views that are schematic representations of idealized embodiments. As such, deviations from the shapes shown in the drawings are to be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments described in this disclosure should not be construed as limited to the specific shapes of the regions shown in this disclosure, but rather include deviations in shape resulting from, for example, manufacturing. For example, a region illustrated or described as flat may typically have rough and / or nonlinear features; a sharp angle illustrated may be rounded, etc. Therefore, the regions shown in the drawings are schematic in nature, and their sizes and shapes are not intended to illustrate the precise shapes of the regions or reflect true scale, but are intended solely to illustrate the present disclosure. Throughout, identical or similar reference numerals denote identical or similar elements or elements having identical or similar functions. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components.

[0072] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the present disclosure belongs. The words "first", "second" and similar terms used in the present disclosure and the claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Inside", "outside", "upper", "lower" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0073] In the following description, when an element or layer is referred to as being “on” or “connected to” another element or layer, the element or layer may be directly on, directly connected to, the other element or layer, or there may be intermediate elements or intermediate layers. When an element or layer is referred to as being “disposed on one side of” another element or layer, the element or layer may be directly on, directly connected to, the other element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as being “directly on” or “directly connected to” another element or layer, there are no intermediate elements or intermediate layers. The term “and / or” includes any and all combinations of one or more of the associated listed items.

[0074] The X-ray detection substrate comprises multiple intersecting gate and data lines arranged in different layers, and detection pixels located within the area defined by these lines. The detection pixels comprise thin-film transistors (TFTs) and light-sensitive photodiodes. The gate lines control the conduction and cutoff of the TFTs, while the data lines work in conjunction with the gate lines to transfer the photocharge stored in the photodiodes, generating an electrical signal. This electrical signal undergoes A / D conversion to a digital signal, which is then processed by a computer to form a digital X-ray image.

[0075] In some embodiments, as shown in FIG1 , an X-ray detection substrate 100 in the related art includes a detection surface S1 and a back surface S2 that are opposite each other, a first side S3, a second side S4, and a third side S5 that connect the detection surface S1 and the back surface S2, wherein the first side S3 and the second side S4 are opposite each other, and the third side S5 connects the first side S3 and the second side S4. Its driving circuit may include multiple first chip-on-film (COF)s having readout chips and multiple second chip-on-film (Gate COF)s having gate driver chips. The first chip-on-film (ROIC COF) is connected to the data line on the side of the detection surface S1, and the second chip-on-film (Gate COF) is connected to the gate line on the side of the detection surface S1. In order to reduce the volume of the x-ray detection substrate, in Figure 1, multiple first chip-on-film ROIC COFs are flipped to the back side S2 of the x-ray detection substrate via the first side S3 and the second side S4, and multiple second chip-on-film Gate COFs are flipped to the back side S2 of the x-ray detection substrate via the third side S5. However, since the multiple first chip-on-film ROIC COFs and the multiple second chip-on-film Gate COFs are at the same height after flipping, the first chip-on-film ROIC COFs and the second chip-on-film Gate COFs will interfere with each other at the corners of the first side S3 and the third side S5, and at the corners of the second side S4 and the third side S5.

[0076] In order to at least solve the above technical problems existing in the related art, the present disclosure provides a detection device, as shown in FIG2 , which may include:

[0077] The detection substrate 100 includes a detection surface S1 and a back surface S2 that are opposite to each other, a first side S3, a second side S4, and a third side S5 that connect the detection surface S1 and the back surface S2, wherein the first side S3 and the second side S4 are opposite to each other, and the third side S5 connects the first side S3 and the second side S4;

[0078] The drive system includes a plurality of first circuit boards 101. The plurality of first circuit boards 101 extend from a detection surface S1 side through at least one of a first side S3 and a second side S4 to a back surface S2 side. On the back surface S2 side, the maximum distance between the first circuit board 101 and the back surface S2 in a first direction Z is a first distance d1. The first direction Z is perpendicular to the detection surface S1.

[0079] Multiple second circuit boards 102 extend from the side where the detection surface S1 is located through the third side S5 to the side where the back surface S2 is located; on the side where the back surface S2 is located, the maximum distance between the second circuit board 102 and the back surface S2 in the first direction Z is a second distance d2, and the second distance d2 is different from the first distance d1.

[0080] In the above-mentioned detection device provided in the embodiment of the present disclosure, by setting the first circuit board 101 to have a first distance d1 from the back side S2 after being flipped to the side where the back side S2 is located, and the second circuit board 102 to have a second distance d2 from the back side S2 after being flipped to the side where the back side S2 is located, and the first distance d1 is different from the second distance d2, the flipping heights of the first circuit board 101 and the second circuit board 102 are staggered, thereby avoiding mutual interference between the first circuit board 101 and the second circuit board 102.

[0081] In some embodiments, in the detection device provided by the embodiments of the present disclosure, as shown in FIG2 , the first circuit board 101 includes a readout chip (ROIC), and the second circuit board 102 includes a gate driver chip (Gate IC). The second distance d2 can be greater than the first distance d1, so that the readout chip (ROIC) can be flipped to the back side S2 for protection, thereby preventing the readout chip (ROIC), a precision semiconductor device, from being affected by radiation in applications with relatively high X-ray dosimetry (e.g., industrial flaw detection). The gate driver chip (Gate IC) generates little heat, is relatively small, and has a high operating voltage, making it less susceptible to radiation. Therefore, even if the gate driver chip (Gate IC) is not flipped to the back side S2 for protection, it will not affect the normal operation of the gate driver chip (Gate IC). It should be understood that in applications with low X-ray dose (e.g., lesion detection), the radiation interference to the readout chip (ROIC) is relatively small. In this case, the first distance d1 can be set to be greater than the second distance d2, or the second distance d2 can be set to be greater than the first distance d1. As long as the two distances are different, interference can be avoided after flipping. Optionally, the first circuit board 101 and the second circuit board 102 may both be chip-on-film (COF).

[0082] In some embodiments, in combination with Figures 2 to 4, it can be seen that the above-mentioned detection device provided in the embodiments of the present disclosure may further include a middle frame 103. Optionally, the middle frame 103 includes a bottom frame 1031 and a side frame 1032, wherein the bottom frame 1031 is located on the side of the back side S2 away from the detection surface S1 to effectively support the detection substrate 100; the side frame 1032 is fixed to one end of the bottom frame 1031 adjacent to the third side S5, and the side frame 1032 is located on the side of the bottom frame 1031 away from the back side S2. In some embodiments, the side frame 1032 can raise the second circuit board 102 so that on the side where the back side S2 is located, the second circuit board 102 is higher than the first circuit board 101 in the first direction Z; exemplarily, the first circuit board 101 extends to the side of the bottom frame 1031 away from the back side S2, and the second circuit board 102 extends to the surface of the side frame 1032 away from the back side S2. Of course, in specific implementations, other methods may also be used to ensure that the second circuit board 102 is higher than the first circuit board 101 in the first direction Z on the side where the back surface S2 is located, and this disclosure does not make any specific limitations.

[0083] Continuing to refer to Figures 2 to 4, it can be seen that the reading chip (ROIC) of the first circuit board 101 is located on the side of the bottom frame 1031 away from the back side S2, and the gate driver chip (Gate IC) of the second circuit board 102 is located on the outer surface of the side frame 1032 away from the center of the detection substrate 100, and the outer surface is located on the side where the third side S5 is located. Optionally, the gate driver chip (Gate IC) is in contact with the outer surface; this can make the reading chip (ROIC) further away from the detection surface S1, avoiding the radiation impact of large doses of x-rays received by the detection surface S1 or incident from the side of the detection surface S1 on the reading chip (ROIC).

[0084] In some embodiments, in the above-mentioned detection device provided in the embodiments of the present disclosure, as shown in Figures 2 and 3, a heat-conducting structure 104 may also be included. The heat-conducting structure 104 is located between the first circuit board 101 and the bottom frame 1031, and is in contact with the reading chip (ROIC) and the surface of the bottom frame 1031 away from the back surface S2. When the reading chip (ROIC) is in operation, the heat is relatively serious. By providing a heat-conducting structure 104 that is in contact with the reading chip (ROIC) and the bottom frame 1031 at the same time, the heat of the reading chip (ROIC) can be transferred to the bottom frame 1031 through the heat-conducting structure 104, thereby dissipating the heat and ensuring the normal operation of the system. In some embodiments, the material of the heat-conducting structure 104 includes but is not limited to thermally conductive silicone.

[0085] Continuing with FIG3 , it can be seen that the heat-conducting structure 104 can be in the shape of an elongated strip, so that the heat of multiple readout chips (ROICs) on a single side (e.g., the left or right side) can be transferred to the bottom frame 1031 through the same heat-conducting structure 104. Furthermore, compared to a solution in which a heat-conducting structure 104 is provided one-to-one at a single readout chip (ROIC), the elongated heat-conducting structure 104 that contacts multiple readout chips (ROICs) simultaneously has a larger area, so that the heat of the readout chip (ROIC) can be transferred to the bottom frame 1031 not only through the heat-conducting structure 104 that overlaps with it, but also through the heat-conducting structure 104 that does not overlap with it. This allows the heat of the readout chip (ROIC) to be dissipated to the bottom frame 1031 more quickly, resulting in a better cooling effect on the readout chip (ROIC), thereby ensuring that the temperature of the readout chip (ROIC) is normal.

[0086] In some embodiments, in the detection device provided by the embodiments of the present disclosure, as shown in Figures 2 to 4 , the plurality of first circuit boards 101 may include a plurality of first sub-circuit boards ROIC_L and a plurality of second sub-circuit boards ROIC_R. The plurality of first sub-circuit boards ROIC_L extend from the detection surface S1 side through the first side S3 to the side of the bottom frame 1031 away from the back surface S2, and the plurality of second sub-circuit boards ROIC_R extend from the detection surface S1 side through the second side S4 to the side of the bottom frame 1031 away from the back surface S2. Furthermore, the positions of the plurality of first sub-circuit boards ROIC_L and the positions of the plurality of second sub-circuit boards ROIC_R are symmetrical about a second direction Y, and the channel numbers of the plurality of first sub-circuit boards ROIC_L and the channel numbers of the plurality of second sub-circuit boards ROIC_R are symmetrical about the center O of the detection substrate 100. The second direction Y is perpendicular to the third side S5. In this arrangement, the plurality of first sub-circuit boards ROIC_L and the plurality of second sub-circuit boards ROIC_R can be used to achieve bilateral actuation of the detection substrate 100. Of course, in some embodiments, the entire first circuit board 101 may extend to the side of the back surface S2 through the first side S3 or the second side S4, and the entire first circuit board 101 may be used to realize unilateral driving of the detection substrate 100, which is not limited here.

[0087] In some embodiments, the detection device provided in the embodiments of the present disclosure, as shown in Figures 2, 3, and 5, may further include two readout circuit boards 105 (e.g., a first readout circuit board 1051 and a second readout circuit board 1052) located on the side of the bottom frame 1031 away from the back surface S2. One readout circuit board 105 (e.g., the first readout circuit board 1051) is connected to the plurality of first sub-circuit boards ROIC_L, and the other readout circuit board 105 (e.g., the second readout circuit board 1052) is connected to the plurality of second sub-circuit boards ROIC_R. The component structures of the two readout circuit boards 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) are symmetrically arranged about the center O of the detection substrate 100. Thus, using two readout circuit boards 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) with the same component structure can realize the reading of electrical signals from both the left and right sides, thereby saving costs. Furthermore, the design of the two readout circuit boards 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) can be unified, reducing the workload during design and production. Furthermore, the unified design can prevent mistakes and incorrect installation. At the same time, corresponding space is reserved for the installation operation of the connecting piece (used to connect the reading circuit board 105 and the main control board 107).

[0088] In some embodiments, in the above-mentioned detection device provided by the embodiments of the present disclosure, as shown in Figures 3 and 5 to 8, the read circuit board 105 (e.g., the first read circuit board 1051 and the second read circuit board 1052) includes at least one first through hole h1 disposed adjacent to the first circuit board 101. Figures 3 and 5 to 8 specifically illustrate that the read circuit board 105 (e.g., the first read circuit board 1051 and the second read circuit board 1052) has four first through holes h1, and the first through holes h1 and the first connection ports C1 (for achieving electrical connection between the first circuit board 101 and the read circuit board 105) are alternately disposed in the second direction Y. In some embodiments, the read circuit board 105 (e.g., the first read circuit board 1051 and the second read circuit board 1052) is fixedly connected to the bottom frame 1031 at the at least one first through hole h1.

[0089] Because the entire drive system has many boards, and the ground signal serves as the reference signal for the entire drive system, its integrity directly affects the image acquisition quality. To ensure reliable connection of the ground network of each system, the present disclosure can use the middle frame 103 as the ground plane of the drive system. The first through hole h1 used to secure the pickup circuit board 105 (e.g., the first pickup circuit board 1051 and the second pickup circuit board 1052) to the bottom frame 1031 can be designed as a conductive hole (e.g., a metalized fixing hole) to ensure that the pickup circuit board 105 (e.g., the first pickup circuit board 1051 and the second pickup circuit board 1052) are connected to the ground network.

[0090] In some embodiments, in the above-mentioned detection device provided by the embodiments of the present disclosure, as shown in Figures 7 and 8, the reading circuit board 105 (for example, the first reading circuit board 1051 and the second reading circuit board 1052) may further include a first edge area A1 close to one side of at least one first through hole h1 and away from the center of the detection substrate 100 (that is, close to the first side S3 or the second side S4). Specifically, the first reading circuit board 1051 has a first edge area A1 close to the first side S3, and the second reading circuit board 1052 has a first edge area A1 close to the second side S4. Optionally, the surface of the reading circuit board 105 (for example, the first reading circuit board 1051 and the second reading circuit board 1052) in contact with the bottom frame 1031 is conductively arranged in the first edge area A1 to ensure that the reading circuit board 105 (for example, the first reading circuit board 1051 and the second reading circuit board 1052) are in full contact with the bottom frame 1031, thereby better connecting to the ground network.

[0091] In some embodiments, the conductive properties of the readout circuit board 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) can be achieved by not coating the surface of the readout circuit board 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) in the first edge region A1 and the first through hole h1 with a protective layer (e.g., green oil). Optionally, to protect the readout circuit board 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) from corrosion caused by water, oxygen, and the like, the present disclosure can coat the surface of the readout circuit board 105 (e.g., the first readout circuit board 1051 and the second readout circuit board 1052) in the first edge region A1 and the first through hole h1 with a first protective layer 106 (e.g., green oil), as shown in FIG. 7 .

[0092] In some embodiments, in the above-mentioned detection device provided in the embodiments of the present disclosure, as can be seen in conjunction with Figures 3, 5, 6, and 8, the reading circuit board 105 may further include at least one first electrostatic discharge (ESD) protection circuit 501 disposed adjacent to the first circuit board 101 to prevent static electricity from interfering with the reading circuit board 105. Optionally, as shown in Figures 3, 5, 6, and 8, the first ESD protection circuit 501 may be disposed on a side of the first connection port C1 close to the center O of the detection substrate 100, and the first ESD protection circuit 501 may be disposed adjacent to the first connection port C1, so that the first ESD protection circuit 501 is disposed closer to the first edge area A1 of the reading circuit board 105, thereby achieving a good protection effect against external static electricity (e.g., static electricity from the human body). Considering that the data signals collected by the reading circuit board 105 are mainly differential (LVDS) signals with a transmission rate of more than 100 MHZ, the first electrostatic protection circuit 501 can select a diode with small parasitic capacitance and suitable for differential signal transmission. For example, the present disclosure adopts a differential (LVDS) signal-specific electrostatic protection diode array provided by Littlefuse, model SP3012-06UTG. The diode array has a 14-pin package and can protect 3 pairs of differential (LVDS) signals. The parasitic capacitance is 0.3 pF.

[0093] In some embodiments, in the above-mentioned detection device provided in the embodiments of the present disclosure, as shown in Figures 3, 5, 6, and 8, to ensure the power supply stability of the readout circuit board 105, the readout circuit board 105 can be configured to further include at least one first filter circuit 502, and the at least one first filter circuit 502 can be disposed on a side of the at least one first electrostatic protection circuit 501 close to the center O of the detection substrate 100. In other words, the at least one first filter circuit 502 can be located on a side of the at least one first electrostatic protection circuit 501 away from the first connection port C1. Continuing to refer to Figures 3, 5, 6, and 8, it can be seen that the first filter circuit 502 can be staggered with the first electrostatic protection circuit 501 in a third direction X, and the first filter circuit 502 is disposed approximately side by side with the end of the first connection port C1 in the third direction X, where the third direction X is perpendicular to the first side S3. In some embodiments, the first filter circuit 502 includes a filter capacitor, for example, the filter capacitor has a specification of 47μF / 20V.

[0094] In some embodiments, in the above-mentioned detection device provided in the embodiment of the present disclosure, as shown in Figures 9 and 10, it can also include a main control board 107 and a gate drive circuit board 108, wherein the gate drive circuit board 108 is connected to the second circuit board 102, and the main control board 107 is located between the layer where the reading circuit board 105 is located and the layer where the gate drive circuit board 108 is located. In combination with the above content, it can be seen that the reading circuit board 105 is located on the surface of the bottom frame 1031 away from the detection substrate 100. Therefore, in the present disclosure, the reading circuit board 105, the main control board 107 and the gate drive circuit board 108 are sequentially arranged on the side of the bottom frame 1031 away from the detection substrate 100. This method of designing different circuit boards in layers is conducive to the assembly between the circuit boards.

[0095] Continuing with FIG. 9 , it can be seen that in the above-mentioned detection device provided by the embodiment of the present disclosure, the readout circuit board 105 includes a first boundary L1 extending along the second direction Y away from the center O of the detection substrate 100, and the main control board 107 includes a second boundary L2 extending along the second direction Y away from the center O of the detection substrate 100. The first boundary L1 is located on a side of the second boundary L2 away from the center O of the detection substrate 100, and a third distance d3 is defined between the first boundary L1 and the second boundary L2. In other words, the readout circuit board 105 extends beyond the main control board 107 by the third distance d3 in the third direction X. The second direction Y is perpendicular to the third side S5, and the third direction X is perpendicular to the first side S1. This means that the readout circuit board 105 has an edge region not covered by the main control board 107. Optionally, a first connection port C1 for connecting the first circuit board 101 and the readout circuit board 105 may be provided within the third distance d3 where the readout circuit board 105 extends beyond the main control board 107. By arranging the readout circuit board 105 to extend beyond the main control board 107 in the third direction X, the first circuit board 101 having the readout chip (ROIC) can be installed more conveniently. Specifically, since it is necessary to press the piano cover of the first connection port C1 (e.g., connector) on the readout circuit board 105 when fixing the first circuit board 101 on the readout circuit board 105, if the main control board 107 completely covers the readout circuit board 105, the main control board 107 must be removed when removing and installing the first circuit board 101, otherwise it will be impossible to operate. This will result in the entire drive system having to be removed when replacing the detection substrate 100. By reducing the size of the main control board 107, space for installing and removing the first circuit board 101 can be reserved without removing the board.

[0096] Continuing with FIG10 , it can be seen that, in the third direction X, the size of the gate drive circuit board 108 is larger than the size of the read circuit board 105 and the size of the main control board 107. This is because, in the third direction X, the size of the entire drive system is consistent with the size of the detection substrate 100, and the size of the gate drive circuit board 108 in the third direction X is equal to the size of the detection substrate 100; however, space is required on both sides of the read circuit board 105 to fold over, so its width in the third direction X is smaller than the width of the gate drive circuit board 108; and both the read circuit board 105 and the main control board 107 must be fixed to the bottom frame 1031. Therefore, in the third direction X, the width of the main control board 107 is smaller than the width of the bottom frame 1031 (equivalent to the width of the detection substrate 100).

[0097] In some embodiments, the detection device provided in the embodiments of the present disclosure, as shown in Figures 5, 6, 9, and 10, may further include a first flat flexible cable (FFC) 109. The readout circuit board 105 may also include a first power signal connector 503. The main control board 107 may include a second power signal connector 1071. The first power signal connector 503 is connected to the second power signal connector 1071 via the first flat flexible cable 109, thereby enabling the main control board 107 to independently power the readout circuit board 105. Furthermore, the number and spacing of conductors in the first flat flexible cable 109 can be arbitrarily selected, making wiring more convenient, significantly reducing the size of electronic products, reducing production costs, and improving production efficiency. Furthermore, since the readout circuit board 105 includes a bias (Vbias) power supply, which serves as a reference power source for the circuits in the detection substrate 100 and is typically -6V, and the data signal operating voltage of the readout circuit board 105 is 2.5V, a short circuit between the two could damage the readout circuit board 105. For safety reasons, the bias (Vbias) power supply can be isolated as a separate power supply for the main control board 107, connected to the readout circuit board 105. This isolation also offers another benefit: with the bias (Vbias) power supply isolated, the remaining data signals are all differential (LVDS) data signals with consistent electrical properties. Therefore, the first power signal connector 503 can be used with any of the remaining first data signal connectors 504 to drive the readout circuit board 105. Furthermore, the provision of a second power signal connector 1071 on the main control board 107 to independently power the readout circuit board 105 facilitates subsequent interface expansion, reducing the design and material costs required for expansion.

[0098] Continuing with reference to Figures 5, 6, 9, and 10, it can be seen that the above-mentioned detection device provided in the embodiment of the present disclosure may further include a first flexible circuit board 110, the readout circuit board 105 further includes a first data signal connector 504, and the main control board 107 includes multiple second data signal connectors 1072. The first data signal connector 504 is connected to at least one second data signal connector 1072 via the first flexible circuit board 110, and the number of second data signal connectors 1072 is greater than the number of first data signal connectors 504 or the first flexible circuit board 110. This ensures the scalability of the drive system. Furthermore, because the length of the first flexible circuit board 110 can be purchased as needed, the drive system structure of the present disclosure has excellent scalability. When the size of the detection substrate 100 changes, the readout circuit board 105 can be placed as needed, and the first flexible circuit board 110 can be designed or purchased as a pre-made product according to the specific location.

[0099] Optionally, as shown in FIG5 , on the readout circuit board 105 , the first power signal connector 503 and the first data signal connector 504 are disposed on a side of the first filter circuit 502 close to the center O of the detection substrate 100 , and the first power signal connector 503 and the first data signal connector 504 may be disposed side by side in the second direction Y. As shown in FIG11 , on the main control board 107 , the second power signal connector 1071 and the second data signal connector 1072 are disposed at two edges of the main control board 107 away from the center O of the detection substrate 100 and extending along the second direction Y; and the second power signal connector 1071 and the plurality of second data signal connectors 1072 on a single edge may also be disposed side by side in the second direction Y.

[0100] In some embodiments, as shown in Figures 9 and 11 , the present disclosure divides the interface connector between the main control board 107 and a readout circuit board 105 into four parts, including a second power signal connector 1071 and three second data signal connectors 1072. The signal definitions of the three second data signal connectors 1072 are completely consistent, ensuring that the second power signal connector 1071 and any second data signal connector 1072 can drive a readout circuit board 105. Furthermore, the number of second data signal connectors 1072 used can be freely selected based on the size of the detection substrate 100. Since the number of first circuit boards 101 on a single side is 12 for the largest commonly used detection substrate, this embodiment uses four first circuit boards 101 on a single side as an example. Taking into account the connector size and layout considerations, the present disclosure designates three second data signal connectors 1072 on a single side of the main control board 107, each of which can control the signals of the four first circuit boards 101 on the same side.

[0101] In some embodiments, the second data signal connector 1072 can be an eDP connector. The eDP connector is a communication interface commonly used on computer displays. It has a micro-packet structure that can realize the simultaneous transmission of large amounts of data and ensure the reliable transmission of differential signals. The 4-lanes transmission rate can reach up to 21.6 Gbps. It is 26.3 mm wide and 1.1 mm high. It has a small size, which is conducive to the lightweight and thin product. Optionally, the eDP connector includes a shielding layer, and the shielding layer is grounded. Since the eDP connector, the first flexible circuit board 109, and the first data signal connector 504 are conductive, it is equivalent to the shielding layer of the eDP connector and the shielding layer of the first flexible circuit board 109 being conductive. When the shielding layer of the eDP connector is grounded, the shielding layer of the first flexible circuit board 109 is also grounded, thereby reducing the interference of external signals on the differential signal transmitted by the first flexible circuit board 109 and increasing the anti-interference ability of the system.

[0102] Ordinary signal traces are single-ended, with a line spacing greater than three times the line width to reduce interference between signals. The cable impedance is generally 50 ohms. A differential design cable uses two cables to transmit a single signal. The two cables are placed close together to reduce common-mode interference. At the same time, the two cables need to be designed to be equal lengths and have interchangeable holes. The differential line impedance is generally 100 ohms. This allows for the transmission of higher-speed signals. Based on this, in some embodiments, the first flexible circuit board 109 may include multiple differential design cables to increase signal transmission rates. Optionally, the differential design cables are isolated by ground to reduce electromagnetic interference between them. In some embodiments, the first flexible circuit board 109 may also include multiple pins arranged side by side. Optionally, the outermost pins are grounded, and the remaining pins are connected one-to-one to the differential design cables. This can also reduce interference from external electromagnetic signals on the differential signals on the differential design cables.

[0103] In some embodiments, in the above-mentioned detection device provided by the embodiments of the present disclosure, as shown in Figures 5 and 8 to 11, the reading circuit board 105 also includes at least one second through hole h2. Optionally, the second through hole h2 is arranged on the side of the first filter circuit 502 close to the center O of the detection substrate 100; the main control board 107 includes at least one third through hole h3 that is conductively connected to the at least one second through hole h2, for example, the third through hole h3 is conductively connected to the second through hole h2 one-to-one. Optionally, the third through hole h3 is located on the side of the row where the second power signal connector 1071 and the second data signal connector 1072 are located close to the center O of the detection substrate 100; the main control board 107 is fixedly connected to the bottom frame 1031 at at least one third through hole h3. Optionally, the main control board 107 is connected to the bottom frame 1031 at the third through hole h3 through a fixing column 111 and a screw. Since the middle frame 103 of the present disclosure can serve as the ground plane of the driving system, in some embodiments, the third through hole h3 can be designed as a conductive hole (eg, a metalized fixing hole) to ensure that the main control board 107 is connected to the ground network.

[0104] In some embodiments, as shown in Figure 11, the main control board 107 may also include an FPGA controller 1073, a DDR3 cache 1074, a FLASH memory 1075, and a system power supply 1076. The FPGA controller 1073 is the system's main control unit, with primary functions including ROIC data stream processing, gate IC signal driving, power control, synchronous exposure control, indicator light control, and sensor control. The DDR3 cache 1074 serves as the system cache. The eight ROIC signals received by the FPGA controller 1073 are first cached in the DDR3 before being proofread and framed for transmission. The FLASH memory 1075 is used to store the system's operating code. The system power supply 1076 provides power to the entire drive system and various connectors.

[0105] In some embodiments, in the above-mentioned detection device provided by the embodiments of the present disclosure, as shown in Figures 10 and 12, the gate drive circuit board 108 includes at least one fourth through hole h4, and the gate drive circuit board 108 is fixedly connected to the side frame 1032 at the at least one fourth through hole h4. Optionally, the fourth through hole h4 and the second connection port C2 (for achieving electrical connection between the second circuit board 102 and the gate drive circuit board 108) are alternately arranged in the second direction Y. Since the middle frame 103 is the ground plane of the present disclosure, the fourth through hole h4 can be set as a conductive hole, so that the gate drive circuit board 108 is connected to the ground network.

[0106] In some embodiments, as shown in Figures 12 and 13, the gate drive circuit board 108 may further include a second edge area A2 covering at least one fourth through hole h4, and the surface of the gate drive circuit board 108 in contact with the side frame 1032 is conductively arranged in the second edge area A2, so as to ensure that the gate drive circuit 108 is in full contact with the bottom frame 1031, thereby better connecting to the ground network. In some embodiments, the conductive properties of the gate drive circuit board 108 can be achieved by not coating the surface in contact with the bottom frame 1031 with a protective layer (e.g., green oil) in the first edge area A1 and the fourth through hole h4. Optionally, as shown in Figure 13, in order to protect the gate drive circuit board 108 and avoid possible corrosion caused by water, oxygen, etc., the present disclosure may apply a second protective layer 112 (e.g., green oil) to other areas of the surface of the gate drive circuit board 108 in contact with the bottom frame 1031 other than the second edge area A2 and the fourth through hole h4 that do not need to maintain conductive properties.

[0107] In some embodiments, in combination with Figures 2, 3, 6 and 12, it can be seen that the middle frame 103 further includes a boss structure 1033, the boss structure 1033 is fixed to the side of the bottom frame 1031 away from the back surface S2, and the boss structure 1033 is fixedly connected to the local surface of the side frame 1032 close to the bottom frame 1031; optionally, the gate drive circuit board 108 further includes at least one fifth through hole h5, and the gate drive circuit board 108 is fixedly connected to the boss structure 1033 at at least one fifth through hole h5 to improve the fixing strength of the gate drive circuit board 108. In addition, since the middle frame 103 is the ground plane of the present disclosure, the fifth through hole h5 can be set as a conductive hole so that the gate drive circuit board 108 is connected to the ground network. Optionally, in the surface of the gate drive circuit board 108 in contact with the bottom frame 1031, the fifth through hole h5 is also not coated with a protective layer (such as green oil).

[0108] In some embodiments, in the above-mentioned detection device provided in the embodiments of the present disclosure, as shown in Figures 10 and 12, the gate drive circuit board 108 further includes at least one second electrostatic protection circuit 1081 to prevent static electricity from interfering with the gate drive circuit board 108. Optionally, as shown in Figures 10 and 12, the second electrostatic protection circuit 1081 can be set on the side of the second connection port C2 (for connecting the second circuit board 102 and the gate drive circuit board 108) close to the center O of the detection substrate 100, and the second electrostatic protection circuit 1081 is set adjacent to the second connection port C2, so that the second electrostatic protection circuit 1081 is closer to the second edge area A2 of the gate drive circuit board 108, thereby achieving a good protection effect against external static electricity (such as human body static electricity). Given that the main signals of the gate drive circuit 108 are CPV (line scan clock), OE (TFT turn-on signal), and STV (start signal), the rate is relatively low and they are all 3.3V TTL single-ended signals. Therefore, the second electrostatic protection circuit 1081 can use a single-ended signal Littlefuse company's dedicated electrostatic protection diode, model V3.5MLA0603N.

[0109] In some embodiments, in the above-mentioned detection device provided by the embodiment of the present disclosure, as shown in FIG12 , the gate drive circuit board 108 may further include at least one second filter circuit 1082, and the at least one second filter circuit 1082 is located on one side of the at least one second electrostatic protection circuit 1081 close to the center O of the detection substrate 100. The main source of image noise on the detection substrate 100 is that the image output is in a progressive scanning mode, and the output conversion of each line of data is different in time. If the power supply of the gate drive circuit board 108 is unstable, the signals collected at different times are also unstable, and lateral noise will appear in the output graph. The second filter circuit 1082 can ensure the power supply stability of the gate drive circuit board 108. Optionally, the second filter circuit 1082 includes multiple filter capacitors, for example, the filter capacitor specification is 47μF\20V.

[0110] In some embodiments, in the above-mentioned detection device provided by the embodiment of the present disclosure, as shown in Figure 10, a second flat flexible cable (not shown) may also be included, the gate drive circuit board 108 also includes a third power signal connector 1083, and the main control board 107 includes a fourth power signal connector 1077. The third power signal connector 1083 is connected to the fourth power signal connector 1077 through the second flat flexible cable, thereby realizing independent power supply of the gate drive circuit board 108 by the main control board 107. In addition, the number and spacing of the wires in the second flat flexible cable can be arbitrarily selected, making wiring more convenient, greatly reducing the volume of electronic products, reducing production costs, and improving production efficiency. In addition, by setting the fourth power signal connector 1077 on the main control board 107 to independently power the gate drive circuit board 108, subsequent interface expansion is facilitated, reducing the design cost and material cost required for expansion.

[0111] In some embodiments, the detection device provided in the embodiments of the present disclosure, as shown in Figures 10 and 14 , may further include a second flexible circuit board 113. The gate circuit board 108 may also include a first scan signal connector 1084. The main control board 107 may include a second scan signal connector 1078. The first scan signal connector 1084 is connected to the second scan signal connector 1078 via the second flexible circuit board 113. Because the length of the second flexible circuit board 113 can be purchased as needed, the drive system structure of the present disclosure has excellent scalability. When the size of the detection substrate 100 changes, the gate drive circuit board 108 can be placed as needed, and the second flexible circuit board 113 can be designed or purchased pre-made to suit the specific location. Furthermore, by providing the second scan signal connector 1078 for controlling the gate drive circuit board 108 on the main control board 107, subsequent interface expansion is facilitated, reducing the design and material costs required for expansion. In addition, since the power supply voltage of the gate driver chip (Gate IC) has a higher voltage signal of 16V / -8V, and the maximum tolerance voltage of the scan signal is 3.6V, the present disclosure divides the signal of the gate driver circuit board 108 into two parts: a low-voltage signal and a power signal, which are transmitted through the second scan signal connector 1078 and the second power signal connector 1077 respectively, which can effectively prevent the second flexible circuit board 113 from causing a voltage short circuit due to misalignment of installation and burning the main control chip.

[0112] In some embodiments, in the above-mentioned detection device provided by the embodiments of the present disclosure, it can be seen from Figures 2 and 6 that the main control board 107 includes a first notch structure G1, which can accommodate the boss structure 1033 of the middle frame 103, so that the main control board 107 avoids the boss structure 1033, ensuring that the main control board 107 is stably fixed on the bottom frame 1031 of the middle frame 103. Optionally, referring to Figure 11, the main control board 107 can also include a second notch structure G2, which is arranged opposite to the first notch structure G1, that is, the second notch structure G2 is arranged adjacent to the end of the bottom frame 1031 away from the side frame 1032; as shown in Figures 10 and 14, the drive system can also include a first adapter plate 114, the first adapter plate 114 is partially embedded in the second notch structure G2, and the first adapter plate 114 is connected to the main control board 107. Optionally, the first adapter plate 114 is connected to the main control board 107 via a third flexible circuit board 115.

[0113] In some embodiments, the first adapter board 114 may include a USB (Universal Serial Bus) interface, a Gigabit Ethernet interface, a 10 Gigabit Ethernet interface, and a UART (Universal Asynchronous Receiver, Transmitter) interface, etc., to meet the application requirements of different application scenarios and different transmission bandwidths, and improve the performance of the drive system. The main control board 107 can determine to use one of the interfaces of the first adapter board 114 to receive control instructions based on the bandwidth and application scenario. For example, for scenarios requiring high frame rate, large bandwidth, and dynamic acquisition, a 10 Gigabit Ethernet interface with an effective bandwidth of up to 1GB / S can be used to receive control instructions; for another example, for scenarios requiring static acquisition, a Gigabit Ethernet interface with an effective bandwidth of up to 60MB / S can be used to receive control instructions.

[0114] In some embodiments, the detection device provided in the embodiments of the present disclosure, as shown in FIG14 , may further include an indicator light board 116 for indicating the operating status of the main control board 107 and a power input board 117 for supplying power to the main control board 107. In some embodiments, the indicator light board 116 is connected to the main control board 107 via a fourth flexible printed circuit board 118, and the power input board 117 is connected to the main control board 107 via a fifth flexible printed circuit board 119. Optionally, the indicator light board 116, the power input board 117, and the first adapter board 114 are located on the same vertical plane of the detection surface S1, such that the indicator light board 116, the power input board 117, and the first adapter board 114 are approximately the same distance from the detection substrate 100. This facilitates assembly of the indicator light board 116, the power input board 117, and the first adapter board 114 on the side of the detection substrate 100 where the fourth side S6 is located, which is opposite to the third side S5 where the second circuit board 102 is located (as shown in FIG2 ). It should be noted that, due to limitations of process conditions or the influence of other factors such as measurement, the “same vertical plane” disclosed in the present invention may have a position deviation of ±5%.

[0115] In some embodiments, the detection device provided in the embodiments of the present disclosure, as shown in FIG15 , may further include a second adapter board 120. The second adapter board 120 may integrate a first readout board 1051, a second readout board 1052, and other readout boards 105 connected to the first circuit board 101, as well as a multi-type signal expansion board 1201 connected to the readout boards 105. The main control board 107 is connected to the readout boards 105 via the signal expansion board 1201. The first circuit board 101 includes a readout chip (ROIC). Because a single ROIC has a large number of signals but high repetitiveness, duplicate signals can be merged and processed to reduce the I / O port requirements of the main control board 107 and the number of signal lines. The ROIC signals primarily include three types: SPI control signals, clock input signals, and clock and data output signals. The SPI control signals are TTL single-ended signals, consistent across all ROICs, and are repetitive. The clock input signals are LVDS differential signals, consistent across all ROICs, and the clock and data output signals are LVDS differential signals, totaling three pairs of output signals. Therefore, the present disclosure utilizes the same signal expansion board 1201 (e.g., a BUFFER chip) for a one-to-many design, using the same ROIC signals. The SPI control signal utilizes a BUFFER chip model N74AVCH16T245GR, expanding one SPI control signal to 16 channels. The clock input signal and clock and data output signals utilize a BUFFER chip model ADCLK854BCPZ, expanding one clock input signal and one clock and data output signal to 12 channels. This allows eight ROICs to be driven by simply inputting one set of SPI control signals and a pair of LVDS clocks to the second adapter board 120.

[0116] In some embodiments, in the above-mentioned detection device provided in the embodiment of the present disclosure, as shown in Figure 16, a gold finger contact connector (FMC) 121 is also included. The second adapter board 120 includes a reading circuit board 105 (for example, a first reading circuit board 1051 and a second reading circuit board 1052) connected to the first circuit board 101, and a gate drive circuit board 108 connected to the second circuit board 102. The main control board 107 is connected to the reading circuit board 105 and the gate drive circuit board 108 through the gold finger contact connector (FMC) 121. The gold finger contact connector (FMC) 121 can provide a standard mezzanine board (daughter card) size, connector and module interface for the FPGA on the basic board (carrier card). In this way, the I / O interface is separated from the FPGA, which not only simplifies the I / O interface module design, but also maximizes the reuse rate of the carrier card. This interface has the characteristics of high data throughput, supports a large number of I / O ports, and can support a large number of LVDS interfaces. It is particularly suitable for a large number of high-speed differential signal transmissions. To this end, the present disclosure sets a gold finger contact connector (FMC) 121 between the second adapter board 120 and the main control board 107, which can connect all data and power signals including but not limited to the reading circuit board 105 and the gate drive circuit board 108. In addition, due to the high data signal rate during ROIC transmission, differential signal transmission is adopted to ensure signal reliability. The commonly used FPC is a parallel signal without a differential design. There will be impedance discontinuity during the transfer, resulting in signal reflection and affecting signal quality. The interface of the gold finger contact connector (FMC) 121 has a corresponding impedance design, which can greatly improve the signal transmission quality.

[0117] In some embodiments, a board-to-board connector such as FMC is used between the main control board 107 and the second adapter board 120. This not only achieves compatibility with scalability and signal integrity (i.e., high signal transmission quality), but also because the pin (PIN) density of the board-to-board connector is relatively high, the ground connection is more precise, which can save a large amount of FPC and reduce the design complexity and assembly complexity of the system. However, there are two problems with using a board-to-board connector for docking. One is that the scalability of the board-to-board connector is weaker than that of a connector such as a flexible circuit board. If a large-sized detection substrate 100 needs to be driven, a larger special-shaped PCB will need to be made on the board-to-board connector to connect the main control board 107 and the second adapter board 120, which is not conducive to production. The second is that when the board-to-board connector is plugged in, the structural accuracy requirements are relatively high. Large processing errors are likely to cause the system to be unable to be installed, thereby increasing the difficulty of structural design and production costs. In view of this, the present disclosure preferably uses a flexible circuit board to realize the connection between the main control board 107 and the reading circuit board 105 and the gate drive circuit board 108 respectively.

[0118] It should be noted that, as shown in FIG17 , the present disclosure utilizes a separate power supply on the main control board 107 to drive the pickup circuit board 105 (e.g., the first pickup circuit board 1051 and the second pickup circuit board 1052) and the gate drive circuit board 108. However, in some embodiments, as shown in FIG18 , to ensure the integrity of the power signal from the pickup circuit board 105 (e.g., the first pickup circuit board 1051 and the second pickup circuit board 1052) and to reduce power signal interference during transmission, the separate power supply can be integrated on the pickup circuit board 105 (e.g., the first pickup circuit board 1051 and the second pickup circuit board 1052) and the gate drive circuit board 108, rather than on the main control board 107. However, since the pickup circuit board 105 includes two boards, the first pickup circuit board 1051 and the second pickup circuit board 1052, two separate power supply systems are required for the pickup circuit board 105, plus one separate power supply system for the gate drive circuit board 108, for a total of three separate power supply systems. This design incurs additional cost compared to the drive system shown in FIG17 , in which the separate power supply is integrated on the main control board 107.

[0119] Continuing with FIG. 17 , it can be seen that the first pickup circuit board 1051, the second pickup circuit board 1052, and the gate driver circuit board 108 of the present disclosure are three separate boards. In some embodiments, as shown in FIG. 19 , the first pickup circuit board 1051, the second pickup circuit board 1052, and the gate driver circuit board 108 can be combined into a single large board (e.g., integrated onto the same interface board), and the power supply system designed onto this interface board. Because the first pickup circuit board 1051, the second pickup circuit board 1052, and the gate driver circuit board 108 are on the same interface board, their ground reference is the same ground plane. This provides better ground consistency and more stable signals compared to a decentralized design where the first pickup circuit board 1051, the second pickup circuit board 1052, and the gate driver circuit board 108 are three separate boards, without incurring additional costs. However, when this system drives a large-scale detection substrate 100, the first pickup circuit board 1051 and the second pickup circuit board 1052 will be very large. Accordingly, the interface board integrating the first pickup circuit board 1051 and the second pickup circuit board 1052 will also be larger, which is not conducive to production and also increases additional board costs.

[0120] In some embodiments, considering that the first circuit board 101 and the second circuit board 102 interfere with each other mainly at the corners of the first side S2 and the third side S5, and at the corners of the second side S4 and the third side S5, in some embodiments, the first circuit board 101 or the second circuit board 102 at the two corners can be separated into small boards to solve the interference problem, and the entire drive system can be made into a large control board as shown in Figure 20. In this way, the system will not have poor ground signal contact, the signal integrity is the best, and the use of connectors such as flexible circuit boards can be reduced, reducing costs. However, this system does not have scalability, and when driving a large-sized detection substrate 100, the control board will be very large, which is not conducive to production.

[0121] In some embodiments, the entire drive system can also be made into a smaller control board. As shown in FIG21 , the first readout circuit board 1051, the second readout circuit board 1052, the main control board 107, the gate drive circuit board 108, the first adapter board 114, the indicator board 116, and the power input board 117 are integrated into the same control board. Compared with the above embodiment, in which the detection substrate 100 is arranged on one side of the bottom frame 1031 and the drive system (including the readout circuit board 105, the main control board 107, and the gate drive circuit board 108 stacked in sequence) is arranged on the opposite side of the bottom frame 1031, the layout of the detection substrate 100 and the drive system is more compact. In the scheme shown in FIG21 , the detection substrate 100 is relatively far away from the control board of the integrated drive system. The first readout circuit board 1051, the second readout circuit board 1052, and the gate drive circuit board 108 can be connected to the detection substrate 100 using extended flexible printed circuit boards (FPCs). Optionally, in the solution shown in FIG21 , the electrical connection relationship between the main control board 107 and the first readout circuit board 1051, the second readout circuit board 1052, and the gate drive circuit board 108 can be the same as the electrical connection relationship in the solution described above in which the detection substrate 100 is disposed on one side of the bottom frame 1031 and the drive system is disposed on the opposite side of the bottom frame 1031. This ensures that the drive system can drive both large-sized detection substrates 100 and small-sized detection substrates 100, and that when driving detection substrates 100 of different sizes, there is no need to design additional boards, which does not increase additional costs. However, in the solution shown in FIG21 , a large number of extended FPCs are used, which cannot perform signal processing and cannot guarantee signal integrity. This also increases the difficulty of system wiring. When driving large-sized detection substrates 100, the entire drive system will appear to be more messy.

[0122] In some embodiments, the multiple first sub-circuit boards (ROICs) with readout chips (ROICs) in the present disclosure are arranged symmetrically with the multiple second sub-circuit boards (ROIC_R). The channel numbers of the multiple first sub-circuit boards (ROIC_L) are also symmetrical with the channel numbers of the multiple second sub-circuit boards (ROIC_R). The data signals of each first sub-circuit board (ROIC_L) and second sub-circuit board (ROIC_R) are always output sequentially from the first channel to the last channel. For example, in FIG22 , ROIC_L1, ROIC_L2, ROIC_L3, and ROIC_L4 represent the four first sub-circuit boards (ROIC_L), and ROIC_R1, ROIC_R2, ROIC_R3, and ROIC_R4 represent the four second sub-circuit boards (ROIC_R). As can be seen from Figure 22, the actual arrangement order of a frame of graphics is (ROIC_R4_256)~(ROIC_R4_1)~(ROIC_L1_1)~(ROIC_L1_256)~(ROIC_R3_256)~(ROIC_R3_1)~(ROIC_L2_1)~(ROIC_L2_256)~(ROIC_R2_256)~(ROIC_R2_1)~(ROIC_L3_1)~(ROIC_L3_256)~(ROIC_R1_256)~(ROIC_R1_1)~(ROIC_L4_1)~(ROIC_L4_256). Therefore, when actually assembling the puzzle, the data of the second sub-circuit board ROIC_R needs to be flipped and sorted according to the actual order.

[0123] Based on this, an embodiment of the present disclosure provides a driving method for a detection device, wherein, optionally, the detection substrate includes a plurality of data lines arranged in sequence, the plurality of first circuit boards include at least one first sub-circuit board connected to the odd-numbered data lines at one end of the data lines, and at least one second sub-circuit board connected to the even-numbered data lines at the other end of the data lines, and the at least one first sub-circuit board and the at least one second sub-circuit board are symmetrically arranged about the center of the detection substrate;

[0124] The driving method may include the steps shown in FIG23 :

[0125] S2301, acquiring and buffering a plurality of first data signals outputted in positive sequence by at least one first sub-circuit board, and a plurality of second data signals outputted in positive sequence by at least one second sub-circuit board;

[0126] S2302, flipping the plurality of second data signals outputted in positive sequence by the second sub-circuit board so that the plurality of second data signals outputted by the second sub-circuit board are arranged in reverse order;

[0127] S2303: Frame the plurality of first data signals output in positive order and the plurality of second data signals output in reverse order and transmit them to a host computer.

[0128] Although the preferred embodiments of the present disclosure have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present disclosure.

[0129] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such changes and modifications of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such changes and modifications.

Claims

1. A detection device, wherein: include: A detection substrate, the detection substrate comprising a detection surface and a back surface arranged opposite to each other, a first side edge, a second side edge, and a third side edge connecting the detection surface and the back surface, wherein the first side edge is arranged opposite to the second side edge, and the third side edge connects the first side edge and the second side edge; A drive system, the drive system comprising: A plurality of first circuit boards, wherein the plurality of first circuit boards extend from the side where the detection surface is located through at least one of the first side edge and the second side edge to the side where the back surface is located; on the side where the back surface is located, the farthest distance between the first circuit board and the back surface in a first direction is a first distance, and the first direction is a direction perpendicular to the detection surface; A plurality of second circuit boards extend from the side where the detection surface is located through the third side to the side where the back surface is located; on the side where the back surface is located, the farthest distance between the second circuit boards and the back surface in the first direction is a second distance, and the second distance is different from the first distance.

2. The detection device according to claim 1, wherein: The first circuit board includes a reading chip, the second circuit board includes a gate driving chip, and the second distance is greater than the first distance.

3. The detection device according to claim 2, wherein: It also includes a middle frame, the middle frame includes a bottom frame and a side frame, wherein the bottom frame is located on a side of the back surface away from the detection surface, the side frame is fixed to an end of the bottom frame adjacent to the third side, and the side frame is located on a side of the bottom frame away from the back surface; The first circuit board extends to a side of the bottom frame away from the back surface, and the second circuit board extends to a surface of the side frame away from the back surface.

4. The detection device according to claim 3, wherein: The reading chip is located on a side of the bottom frame away from the back side, and the gate driving chip is located on a side surface of the side frame that is arranged on the same side as the third side edge.

5. The detection device according to claim 3 or 4, wherein: The multiple first circuit boards include multiple first sub-circuit boards and multiple second sub-circuit boards, wherein the multiple first sub-circuit boards extend from the side where the detection surface is located through the first side edge to the side of the bottom frame away from the back side, and the multiple second sub-circuit boards extend from the side where the detection surface is located through the second side edge to the side of the bottom frame away from the back side; and the setting positions of the multiple first sub-circuit boards and the setting positions of the multiple second sub-circuit boards are symmetrical about a second direction, and the second direction is a direction perpendicular to the third side edge.

6. The detection device according to claim 5, wherein: The driving system also includes two reading circuit boards located on the side of the bottom frame away from the back side, one of which is connected to the multiple first sub-circuit boards, and the other is connected to the multiple second sub-circuit boards, and the component structures of the two reading circuit boards are symmetrically arranged about the center of the detection substrate.

7. The detection device according to claim 6, wherein: The reading circuit board includes at least one first through hole, and the reading circuit board is fixedly connected to the bottom frame at the at least one first through hole, and the at least one first through hole is a conductive hole.

8. The detection device according to claim 7, wherein: The readout circuit board further includes a first edge region close to one side of the at least one first through hole and away from the center of the detection substrate, and a surface of the readout circuit board in contact with the bottom frame is conductively disposed in the first edge region.

9. The detection device according to any one of claims 6 to 8, wherein: The read circuit board further includes at least one first electrostatic protection circuit, which is arranged on a side of a first connection port close to the center of the detection substrate, and the first connection port connects the first circuit board and the read circuit board.

10. The detection device according to claim 9, wherein: The reading circuit board further includes at least one first filtering circuit, and the at least one first filtering circuit is located on a side of the at least one first electrostatic protection circuit close to the center of the detection substrate.

11. The detection device according to any one of claims 6 to 10, wherein: The driving system further includes a gate driving circuit board and a main control board, wherein the gate driving circuit board is connected to the second circuit board, and the main control board is located between the layer where the reading circuit board is located and the layer where the gate driving circuit board is located.

12. The detection device according to claim 11, wherein: The reading circuit board includes a first boundary away from the center of the detection substrate and extending along the second direction, and the main control board includes a second boundary away from the center of the detection substrate and extending along the second direction, wherein the first boundary is located on a side of the second boundary away from the center of the detection substrate, and there is a third distance between the first boundary and the second boundary, the second direction is a direction perpendicular to the third side, and the third direction is a direction perpendicular to the first side.

13. The detection device according to claim 11 or 12, wherein: The driving system further includes a first flat flexible cable, the reading circuit board further includes a first power signal connector, the main control board includes a second power signal connector, and the first power signal connector is connected to the second power signal connector via the first flat flexible cable.

14. The detection device according to any one of claims 11 to 13, wherein: The driving system also includes a first flexible circuit board, the reading circuit board also includes a first data signal connector, the main control board includes a plurality of second data signal connectors, the first data signal connector is connected to at least one of the second data signal connectors through the first flexible circuit board, and the number of the second data signal connectors is greater than the number of the first data signal connectors or the first flexible circuit board.

15. The detection device according to claim 14, wherein: The second data signal connector is a mini video connector. The mini video connector includes a shielding layer. The shielding layer is grounded.

16. The detection device according to claim 14 or 15, wherein: The first flexible circuit board includes a plurality of pins arranged side by side and a plurality of differential design cables, wherein the outermost pins are grounded, and the remaining pins are connected to the differential design cables.

17. The detection device according to any one of claims 11 to 16, wherein: The reading circuit board also includes at least one second through hole, the main control board includes at least one third through hole that is conductively connected to the at least one second through hole, the main control board is fixedly connected to the bottom frame at the at least one third through hole, and the at least one third through hole is a conductive hole.

18. The detection device according to any one of claims 4 to 17, wherein: It also includes a heat-conducting structure, which is located between the first circuit board and the bottom frame and is in contact with the reading chip and a surface of the bottom frame away from the back surface.

19. The detection device according to any one of claims 4 to 18, wherein: The driving system also includes a gate driving circuit board, which is connected to the second circuit board; the gate driving circuit board includes at least one fourth through hole, and the gate driving circuit board is fixedly connected to the side frame at the at least one fourth through hole, and the at least one fourth through hole is a conductive hole.

20. The detection device according to claim 19, wherein: The gate driving circuit board further includes a second edge region covering the at least one fourth through hole, and a surface of the gate driving circuit board in contact with the side frame is conductively disposed in the second edge region.

21. The detection device according to claim 20, wherein: The gate drive circuit board also includes at least one second electrostatic protection circuit, which is arranged on a side of a second connection port close to the center of the detection substrate, and the second connection port connects the second circuit board with the gate drive circuit board.

22. The detection device according to claim 21, wherein: The gate driving circuit board further includes at least one second filtering circuit, and the at least one second filtering circuit is located on a side of the at least one second electrostatic protection circuit close to the center of the detection substrate.

23. The detection device according to any one of claims 19 to 22, wherein: The middle frame further comprises a boss structure, the boss structure is fixed to a side of the bottom frame away from the back surface, and the boss structure is fixedly connected to a local surface of the side frame close to the bottom frame; The gate driving circuit board further includes at least one fifth through hole, the gate driving circuit board is fixedly connected to the boss structure at the at least one fifth through hole, and the at least one fifth through hole is a conductive hole.

24. The detection device according to claim 23, wherein: The driving system further includes a main control board located on a side of the gate driving circuit board facing the bottom frame. The main control board includes a first notch structure, and the boss structure is accommodated in the first notch structure.

25. The detection device according to claim 24, wherein: The drive system further includes a second flat flexible cable, the gate drive circuit board further includes a third power signal connector, the main control board includes a fourth power signal connector, and the third power signal connector is connected to the fourth power signal connector through the second flat flexible cable.

26. The detection device according to claim 24 or 25, wherein: The driving system further includes a second flexible circuit board, the gate circuit board further includes a first scan signal connector, the main control board includes a second scan signal connector, and the first scan signal connector is connected to the second scan signal connector through the second flexible circuit board.

27. The detection device according to any one of claims 24 to 26, wherein: The main control board further includes a second notch structure, and the second notch structure is arranged opposite to the first notch structure; The detection device further includes a first adapter plate, a portion of which is embedded in the second notch structure, and the first adapter plate is connected to the main control board.

28. The detection device according to claim 27, wherein: The driving system further comprises an indicator light board and a power input board, wherein the indicator light board, the power input board and the first adapter board are located on the same vertical plane of the detection surface.

29. The detection device according to claim 1, wherein: The drive system also includes a main control board and a second adapter board, wherein the second adapter board includes a reading circuit board connected to the first circuit board, and multiple types of signal expansion boards connected to the reading circuit board, and the main control board is connected to the reading circuit board through the signal expansion board.

30. The detection device according to claim 1, wherein: The drive system also includes a main control board, a second adapter board and a gold finger contact connector, wherein the second adapter board includes a read circuit board connected to the first circuit board, and a gate drive circuit board connected to the second circuit board, and the main control board is connected to the read circuit board and the gate drive circuit board through the gold finger contact connector.

31. A method for driving a detection device according to any one of claims 1 to 30, wherein: The detection substrate comprises a plurality of data lines arranged in sequence, the plurality of first circuit boards comprises at least one first sub-circuit board connected to the odd-numbered data lines at one end of the data lines, and at least one second sub-circuit board connected to the even-numbered data lines at the other end of the data lines, the at least one first sub-circuit board and the at least one second sub-circuit board being symmetrically arranged about the center of the detection substrate; The driving method comprises: Acquire and cache a plurality of first data signals outputted in positive sequence by the at least one first sub-circuit board and a plurality of second data signals outputted in positive sequence by the at least one second sub-circuit board; Flipping the plurality of second data signals outputted by the second sub-circuit board in positive sequence, so that the plurality of second data signals outputted by the second sub-circuit board are arranged in reverse sequence; The plurality of first data signals output in positive order and the plurality of second data signals arranged in reverse order are framed and transmitted to a host computer.

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