Display substrate and display apparatus

Abstract

A display substrate and a display apparatus. The display substrate comprises a base substrate, and a conductive structure and an inorganic layer which are located on the base substrate. The base substrate comprises a first zone and a second zone. The conductive structure is located in the first zone and the second zone on the base substrate. The inorganic layer is located on the side of the conductive structure away from the base substrate and is located in the first zone and the second zone. The first zone comprises a display region, and the second zone comprises a non-display region. The display region comprises sub-pixels and a limiting structure. Each sub-pixel comprises a light-emitting functional layer. The limiting structure comprises a portion of the inorganic layer located in the display region. The limiting structure is located between the light-emitting functional layers and the base substrate. A portion of the limiting structure located between adjacent sub-pixels is configured to partition at least one layer of the light-emitting functional layers. In the second zone, the inorganic layer comprises a sub-portion which exposes the conductive structure, and / or comprises a sub-portion which is in contact with the conductive structure. Configuring the inorganic layer to comprise portions in the first zone and the second zone facilitates simplifying a masking process.

Description

Display substrate and display device Technical Field

[0001] Embodiments of the present disclosure relate to a display substrate and a display device. Background Art

[0002] With the development of display technology, users are increasingly demanding higher performance from display devices. Organic light-emitting diode (OLED) display products are gaining popularity due to their rich colors, fast response time, and foldability. Organic light-emitting diode displays, including tandem devices, minimize signal crosstalk by isolating the light-emitting material layers between adjacent sub-pixels to meet the performance requirements of high brightness and low power consumption.

[0003] Summary of the Invention

[0004] The present disclosure provides a display substrate and a display device.

[0005] The embodiment of the present disclosure provides a display substrate, including a base substrate and a conductive structure and an inorganic layer located on the base substrate. The base substrate includes a first area and a second area; the conductive structure is located in the first area and the second area on the base substrate; the inorganic layer is located on the side of the conductive structure away from the base substrate, and is located in the first area and the second area. The first area includes a display area, the second area includes a portion of the non-display area, the display area includes a plurality of sub-pixels and a defining structure, each sub-pixel in at least some of the sub-pixels includes a light-emitting functional layer, the light-emitting functional layer includes a plurality of film layers, the defining structure includes a portion of the inorganic layer located in the display area, the defining structure is located between the light-emitting functional layer and the base substrate, and the portion of the defining structure located between adjacent sub-pixels is configured to isolate at least one layer of the light-emitting functional layer; in the second area, the inorganic layer includes a sub-portion that exposes at least a portion of the conductive structure, and / or the inorganic layer includes a sub-portion that is in contact with the conductive structure.

[0006] For example, the display substrate further includes an organic layer positioned between the film layer containing the inorganic layer and the base substrate. The defining structure further includes at least one protrusion in the organic layer that contacts the surface of the inorganic layer, with at least a portion of the edge of the protrusion being indented relative to an edge of the inorganic layer in the defining structure.

[0007] For example, along a direction perpendicular to the substrate, a portion of the conductive structure located in at least a portion of the second region does not overlap with the organic layer.

[0008] For example, in at least a portion of the second region, the organic layer covers an edge of the conductive structure, and the inorganic layer covers an edge of the organic layer and exposes at least a portion of the conductive structure.

[0009] For example, the second region includes a first sub-region, in which the inorganic layer covers the conductive structure and contacts a surface of the conductive structure.

[0010] For example, the portion of the conductive structure located in the first sub-region includes a test pad.

[0011] For example, the second region further includes a second sub-region, and in the second sub-region, the inorganic layer covers an edge of the conductive structure.

[0012] For example, the portion of the conductive structure located in the second sub-region includes a contact pad, and the contact pad is configured to be electrically connected to a pin of the circuit board.

[0013] For example, in a direction perpendicular to the substrate, at least a portion of the organic layer located in the second region is removed.

[0014] For example, each sub-pixel in at least some of the sub-pixels also includes a first electrode and a second electrode located on both sides of the light-emitting functional layer, and the first electrode is located between the light-emitting functional layer and the base substrate; the display substrate also includes a pixel defining pattern, the pixel defining pattern includes a plurality of first openings and a plurality of second openings, one sub-pixel corresponds to at least one first opening, at least part of the light-emitting functional layer of the sub-pixel is located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode, and the second opening is configured to expose the edge of the defining structure.

[0015] For example, the first sub-region is located between the second sub-region and the first region.

[0016] For example, the portion of the conductive structure located in the second region includes a power signal line, and the inorganic layer contacts a portion of the surface of the power signal line.

[0017] For example, the display substrate further includes: at least one circle of blocking portions surrounding the display area, with at least a portion of the blocking portion's film layer located on a side of the conductive structure away from the base substrate. The orthographic projection of the power signal line on the base substrate overlaps with the orthographic projection of the at least one circle of blocking portions on the base substrate. The portion of the power signal line located in the second area extends along a first direction. The portion of the at least one circle of blocking portions located in the second area includes strip-shaped blocking portions extending along a second direction. At least a portion of the inorganic layer located in the second area extends along the second direction, and the first direction intersects the second direction.

[0018] For example, at least a portion of the inorganic layer located in the second region includes at least one inorganic layer pattern, and the inorganic layer pattern extends along the second direction and covers an edge of the power signal line extending along the first direction.

[0019] For example, the at least one inorganic layer pattern includes a plurality of inorganic layer patterns, the number of the strip-shaped barrier portion is at least one, and the strip-shaped barrier portions and the plurality of inorganic layer patterns are alternately arranged along the first direction.

[0020] For example, the edge of the strip-shaped barrier portion covers at least a portion of the edge of the inorganic layer pattern.

[0021] For example, the base substrate includes a third area surrounding a portion of the display area, and the orthographic projection of the edge of the power signal line located in the third area on the base substrate is completely located within the orthographic projection of at least one circle of blocking portions on the base substrate.

[0022] For example, in a direction perpendicular to the base substrate, a portion of the power signal line located in the third region does not overlap with the inorganic layer.

[0023] For example, the power signal line includes a first power signal line and a second power signal line, the first power signal line includes parts located in the first area and the second area, and only the second power signal line is provided in the third area.

[0024] Another embodiment of the present disclosure provides a display device, comprising any of the above-mentioned display substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0026] FIG1 is a schematic diagram of a partial planar structure of a display substrate provided according to an embodiment of the present disclosure.

[0027] FIG. 2 is a partial structural diagram of the first region and the second sub-region in the second region of the display substrate shown in FIG. 1 .

[0028] FIG3 is a partial enlarged view of the second area shown in FIG1 .

[0029] FIG4 is a partial enlarged view of the first sub-area shown in FIG3 .

[0030] FIG5 is a schematic diagram of a partial cross-sectional structure of a second sub-region in a second region provided according to an example of an embodiment of the present disclosure.

[0031] FIG. 6 is a schematic diagram showing a partial cross-sectional structure of a second region in a general display substrate.

[0032] FIG7 is a schematic diagram of a partial cross-sectional structure of a second region provided according to another example of an embodiment of the present disclosure.

[0033] FIG. 8 is a partial structural diagram of the first sub-region in the first region and the second region of the display substrate shown in FIG. 1 .

[0034] FIG9 is a partial enlarged view of the first sub-area shown in FIG3 .

[0035] FIG10 is a schematic diagram of a partial cross-sectional structure of a first sub-region in a second region provided according to an example of an embodiment of the present disclosure.

[0036] FIG. 11 is a schematic diagram showing a partial cross-sectional structure of a first sub-region in a second region of a general display substrate.

[0037] FIG. 12 is a schematic diagram of a partial planar structure of a region where a barrier portion is provided in the second region of a general display substrate.

[0038] FIG13 is a schematic diagram of a partial planar structure of an area in the second zone provided with a blocking portion according to an embodiment of the present disclosure.

[0039] FIG14 is a schematic diagram of a partial cross-sectional structure taken along line CC′ shown in FIG13 .

[0040] FIG15 is a schematic block diagram of a display device according to another embodiment of the present disclosure. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0042] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0043] The features such as “parallel”, “perpendicular” and “same” used in the embodiments of the present disclosure include the features such as “parallel”, “perpendicular” and “same” in the strict sense, as well as the cases where “approximately parallel”, “approximately perpendicular” and “approximately the same” contain certain errors, taking into account the errors associated with the measurement and the measurement of specific quantities (for example, the limitations of the measurement system), and are expressed as being within the acceptable deviation range for a specific value determined by ordinary technicians in this field. For example, “approximately” can mean within one or more standard deviations, or within 10% or 5% of the value. When the number of a component is not specifically indicated below in the embodiments of the present disclosure, it means that the component can be one or more, or can be understood as at least one. “At least one” means one or more, and “plurality” means at least two. The “same-layer arrangement” referred to in the disclosure refers to a structure in which two (or more) structures are formed by the same deposition process and patterned by the same composition process, and their materials can be the same or different.

[0044] The present disclosure provides a display substrate and a display device. The display substrate includes a base substrate and a conductive structure and an inorganic layer located on the base substrate. The base substrate includes a first region and a second region; the conductive structure is located in the first region and the second region on the base substrate; and the inorganic layer is located on a side of the conductive structure away from the base substrate, and is located in the first region and the second region. The first region includes a display area, and the second region includes a portion of a non-display area. The display area includes a plurality of sub-pixels and a defining structure. Each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes multiple film layers. The defining structure includes a portion of the inorganic layer located in the display area, the defining structure is located between the light-emitting functional layer and the base substrate, and the portion of the defining structure located between adjacent sub-pixels is configured to isolate at least one layer of the light-emitting functional layer. In the second region, the inorganic layer includes a sub-portion that exposes at least a portion of the conductive structure and / or includes a sub-portion that contacts the conductive structure. In the display substrate provided by the present disclosure, by configuring the inorganic layer to include, in addition to the portion including the defining structure, a sub-portion in the second region that exposes the conductive structure and / or a sub-portion that contacts the conductive structure, it is advantageous to save mask processing and reduce production costs.

[0045] The display substrate and the display device provided by the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0046] Figure 1 is a schematic diagram of a partial planar structure of a display substrate provided according to an embodiment of the present disclosure. Figure 2 is a schematic diagram of a partial structure of a first region and a second sub-region in a second region of the display substrate shown in Figure 1 .

[0047] As shown in Figures 1 and 2, the display substrate includes a base substrate 01, a conductive structure 100, and an inorganic layer 210 located on the base substrate 01. The base substrate 01 includes a first region 011 and a second region 012. The conductive structure 100 is located in the first and second regions 011 and 012 of the base substrate 01. The inorganic layer 210 is located on the side of the conductive structure 100 away from the base substrate 01, and is located in the first and second regions 011 and 012. The first region 011 includes a display area, and the second region 012 includes a portion of a non-display area. For example, the display area is the area used to display images, and the non-display area is the area not displayed. For example, the second region 012 is located to one side of the first region 011 in the X direction. For example, with the X-direction arrow in Figure 1 as the upward direction, the second region 012 is located below the first region 011. For example, the conductive structure 100 can be a metal structure.

[0048] As shown in Figures 1 and 2, the display area includes multiple sub-pixels 300 and a defining structure 400. Each of at least some of the sub-pixels 300 includes a light-emitting functional layer 310, which includes multiple film layers. The defining structure 400 includes a portion of the inorganic layer 210 located in the display area. The defining structure 400 is located between the light-emitting functional layer 310 and the base substrate 01. The portion of the defining structure 400 located between adjacent sub-pixels 300 is configured to isolate at least one layer of the light-emitting functional layer 310. In the second area 012, the inorganic layer 210 includes a sub-portion that exposes at least a portion of the conductive structure 100. For example, the inorganic layer 210 covers the edge of the surface of the conductive structure 100 facing away from the base substrate 01 and the sidewalls of the conductive structure 100. For example, the inorganic layer 210 exposes the middle portion of the surface of the conductive structure 100 facing away from the base substrate 01.

[0049] In the display substrate provided by the present disclosure, by configuring the inorganic layer to include, in addition to the portion defining the structure, also the portion exposing the conductive structure in the second region, it is advantageous to save mask processes and reduce production costs.

[0050] In some examples, as shown in FIG2 , each sub-pixel 300 in at least some of the sub-pixels 300 further includes a first electrode 320 and a second electrode 330 located on both sides of the light-emitting functional layer 310, and the first electrode 320 is located between the light-emitting functional layer 310 and the base substrate 01. For example, the plurality of sub-pixels 300 include sub-pixels emitting light of different colors, such as a red sub-pixel emitting red light, a green sub-pixel emitting green light, and a blue sub-pixel emitting blue light.

[0051] For example, as shown in FIG2 , each sub-pixel 300 in the display area includes a light-emitting element. For example, the light-emitting functional layer 310 includes a charge generation layer. For example, the light-emitting functional layer 310 can be a light-emitting functional layer 310 included in an organic light-emitting element, and the light-emitting functional layer 310 includes an organic light-emitting layer.

[0052] For example, as shown in FIG2 , the light-emitting functional layer 310 may include a first light-emitting layer (EML), a charge generation layer (CGL), and a second light-emitting layer (EML) stacked together, with the charge generation layer being located between the first and second light-emitting layers. The charge generation layer has strong conductivity, which can give the light-emitting functional layer 310 the advantages of long life, low power consumption, and high brightness. For example, compared to a light-emitting functional layer 310 without a charge generation layer, the sub-pixel 300 can nearly double its brightness by providing a charge generation layer in the light-emitting functional layer 310.

[0053] For example, the light-emitting elements of the same sub-pixel 300 may be tandem light-emitting elements, such as a Tandem OLED.

[0054] For example, the charge generation layer may include an N-type charge generation layer and a P-type charge generation layer.

[0055] For example, in each sub-pixel 300 , the light emitting functional layer 310 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0056] For example, the hole injection layer, hole transport layer, electron transport layer, electron injection layer, and charge generation layer are all shared layers of the multiple sub-pixels 300 and can be referred to as common layers. For example, the common layers and the second electrode 330 can be layers formed using an open mask.

[0057] For example, the first electrode 320 may be an anode, and the second electrode 330 may be a cathode. For example, the cathode may be formed of a material with high conductivity and low work function, such as a metal material. For example, the anode may be formed of a transparent conductive material with a high work function.

[0058] 2 , the orthographic projection of the second electrode 330 in at least some of the sub-pixels 300 on the base substrate 01 is a full-surface structure. For example, the second electrode 330 may be a common electrode shared by multiple sub-pixels 300 .

[0059] For example, as shown in FIG2 , the confinement structure 400 can isolate the charge generation layer to prevent crosstalk between adjacent sub-pixels 300 of different colors. For example, all film layers in the light-emitting functional layer 310 between the charge generation layer and the base substrate 01 can be isolated at the edge of the confinement structure 400. For example, all film layers in the light-emitting functional layer 310 can be isolated at the edge of the confinement structure 400. For example, the second electrode 330 can be isolated at the edge of the confinement structure 400 or can be provided continuously.

[0060] In some examples, as shown in FIG2 , the display substrate further includes an organic layer 510 located between the film layer where the inorganic layer 210 is located and the base substrate 01. The defining structure 400 further includes a plurality of protrusions 501 in the organic layer 510 that contact the surface of the inorganic layer 210, with at least portions of the edges of the protrusions 501 being retracted relative to the edges of the inorganic layer 210 in the defining structure 400. For example, the organic layer 510 includes a plurality of protrusions 501, each of which corresponds one-to-one to a plurality of sub-pixels 300, and the orthographic projection of the light-emitting area of ​​the sub-pixel 300 on the base substrate 01 is located within the orthographic projection of the protrusion 501 on the base substrate 01.

[0061] For example, as shown in FIG2 , the defining structure 400 is composed of an inorganic layer 210 and a protrusion 501 of an organic layer 510. For example, the orthographic projection of the first electrode 320 of the sub-pixel 300 on the base substrate 01 is completely located within the orthographic projection of the defining structure 400 on the base substrate 01. For example, the orthographic projection of the protrusion 501 on the base substrate 01 is completely located within the orthographic projection of the inorganic layer 210 on the base substrate 01. For example, the thickness of the organic layer 510 can be 2 microns. For example, the portion of the organic layer 510 located in the display area can be the flat layer (PLN) closest to the first electrode 320 of the sub-pixel 300. For example, the material of the inorganic layer 210 can include silicon nitride, silicon oxide, or silicon oxynitride. For example, the material of the organic layer 510 can include materials such as polyimide.

[0062] In some examples, as shown in Figure 2, the display substrate also includes a pixel defining pattern 5200, the pixel defining pattern 5200 includes a plurality of first openings 5210 and a plurality of second openings 5220, one sub-pixel 300 corresponds to at least one first opening 5210, at least a portion of the light-emitting functional layer 310 of the sub-pixel 300 is located in the first opening 5210 corresponding to the sub-pixel 300, and the first opening 5210 is configured to expose the first electrode 320, and the second opening 5220 is configured to expose the edge of the defining structure 400.

[0063] For example, as shown in FIG2 , one sub-pixel 300 corresponds to one first opening 5210, and the light-emitting functional layer 310 located within the first opening 5210 emits light by contacting the first electrode 320 and the second electrode 330. For example, the first opening 5210 is used to define the light-emitting area of ​​the sub-pixel 300. For example, the edge of the defining structure 400 exposed by the second opening 5220 is used to isolate at least one layer of the light-emitting functional layer 310. For example, the pixel-defining pattern 5200 includes a pixel-defining portion surrounding the first opening 5210 and the second opening 5220, and the light-emitting functional layer 310 may include a portion located within the first opening 5210 and a portion located on the pixel-defining portion.

[0064] Figure 2 does not illustrate other film layers between the conductive structure 100 and the base substrate 01. For example, at least one metal layer and multiple insulating layers are disposed between the conductive structure 100 and the base substrate 01. For example, the at least one metal layer includes a gate electrode of a thin-film transistor serving as a pixel electrode, a gate line electrically connected to the gate electrode, and other structures. For example, the multiple insulating layers include a gate insulating layer, a buffer layer, an interlayer insulating layer, and other film layers. Figure 2 omits the structure between the pixel defining pattern 5200 and the contact pad 130.

[0065] Figure 3 is a partial enlarged view of the second area shown in Figure 1. Figure 4 is a partial enlarged view of the first sub-area shown in Figure 3. The partial cross-sectional structural diagram of the second area 012 in Figure 2 can be a partial cross-sectional structural diagram taken along line AA' shown in Figure 4.

[0066] 2 to 4 , the second region 012 includes a first sub-region 0121 and a second sub-region 0122. In the second sub-region 0122, the inorganic layer 210 covers the edge of the conductive structure 100. For example, the second region 012 includes at least part of the binding region, and the second sub-region 0122 is located in the binding region.

[0067] In some examples, as shown in FIG3 , the first sub-area 0121 is located between the second sub-area 0122 and the first area 011. For example, as shown in FIG3 , the second area 012 also includes pins 141 and 143 required for the test phase, and a trace 142 located in a bending area and connected to a signal line (such as a data line) located in the display area.

[0068] In some examples, as shown in FIG4 , the portion of the conductive structure 100 located in the second sub-area 0122 includes a contact pad 130, and the contact pad 130 is configured to be electrically connected to a pin of a circuit board. For example, the contact pad 130 is a structure for binding to a pin of a circuit board. For example, the second sub-area 0122 may be a lower contact pad 130 (pad) area. For example, the circuit board may be a flexible circuit board (FPC), and the second sub-area 0122 may be an FOP (FPC on panel) area. For example, the conductive structure 100 includes a plurality of contact pads 130 arranged along the Y direction, an inorganic layer 210 is provided between adjacent contact pads 130, and the inorganic layer 210 wraps around an edge of each contact pad 130, and the portion of the contact pad 130 not covered by the inorganic layer 210 is used to bind to the pin of the circuit board.

[0069] For example, FIG2 schematically illustrates that the conductive structure 100 includes a single layer, but is not limited thereto. The conductive structure 100 may include a multilayer structure, and an organic layer, or an organic layer and an inorganic layer, may be disposed between two adjacent layers of the multilayer structure located in the first region 011. For example, the boundaries of different layers of the conductive structure 100 may be the same or different.

[0070] For example, as shown in FIG. 2 , the thickness of the inorganic layer 210 may be 20 to 100 nanometers, or 30 to 50 nanometers, or 40 to 80 nanometers, or 60 to 90 nanometers.

[0071] 2 , in the second region 012 , no other inorganic layer is disposed between the inorganic layer 210 and the conductive structure 100 . For example, in the second region 012 , no other organic layer is disposed between the inorganic layer 210 and the conductive structure 100 .

[0072] Figure 5 shows a partial cross-sectional view of the second sub-region within the second region, according to an example embodiment of the present disclosure. The structure shown in Figure 5 differs from the structure shown in Figure 2 in that conductive structure 100 includes different structural layers. The partial cross-sectional view of the second region 012 in Figure 5 may be a partial cross-sectional view taken along line AA' shown in Figure 4.

[0073] For example, as shown in FIG5 , the conductive structure 100 includes multiple sub-conductive structures, such as a two-layer sub-conductive structure, including a first sub-conductive structure 101 and a second sub-conductive structure 102, with the first sub-conductive structure 101 being located between the second sub-conductive structure 102 and the substrate 01. For example, the boundary of the second sub-conductive structure 102 may be larger than the boundary of the first sub-conductive structure 101, but is not limited thereto. The boundary of the second sub-conductive structure 102 may be flush with the boundary of the first sub-conductive structure 101. For example, the first sub-conductive structure 101 may contact the second sub-conductive structure 102. For example, the first sub-conductive structure 101 and the second sub-conductive structure 102 may be made of the same material. For example, each layer of the sub-conductive structure 100 may include multiple metal layers, such as a stacked arrangement of titanium / aluminum / titanium. For example, the contact pad 130 may include a titanium / aluminum / titanium metal layer.

[0074] For example, as shown in FIG5 , the inorganic layer 210 covers the surface of the second sub-conductive structure 102 away from the base substrate 01. For example, the inorganic layer 210 covers the side surface of the second sub-conductive structure 102. However, this is not limiting. When the boundary of the second sub-conductive structure is flush with the boundary of the first sub-conductive structure, the inorganic layer covers both the side surface of the first sub-conductive structure and the side surface of the second sub-conductive structure.

[0075] Figure 6 is a schematic diagram of a partial cross-sectional structure of the second region of a typical display substrate. As shown in Figure 6, in a typical display substrate, the first sub-conductive structure 101 is in direct contact with the second sub-conductive structure 102. A planar layer 03 is provided on the side of the second sub-conductive structure 102 facing away from the base substrate 01. The planar layer 03 shown in Figure 6 can be the portion of the organic layer 510 located in the second region 012 shown in Figure 2.

[0076] Compared to the situation shown in FIG6 in which a passivation layer and a planarization layer are used to cover the edge of the conductive structure 100 in a general display substrate, the display substrate provided by the present disclosure uses an inorganic layer 210 to replace the passivation layer, and uses an inorganic layer 210 to replace the planarization layer portion of the organic layer 510 located in the second area 012. This is beneficial for reducing the mask process for patterning the passivation layer to reduce production costs while improving the yield of the FPC bonding process. It is also beneficial for solving problems such as dark spots in the second area 012 caused by residual metal at a certain position with a large step difference due to the large thickness of the originally set planarization layer, which affects the subsequent anode wet etching, and poor adhesion between the originally set passivation layer and the planarization layer, which leads to FPC bonding peeling.

[0077] In some examples, as shown in Figures 2 and 5 , along a direction perpendicular to the base substrate 01, the portion of the conductive structure 100 located in at least a portion of the second region 012 does not overlap with the organic layer 510. For example, the edge of the conductive structure 100 is not covered by the organic layer 510. For example, no organic layer is provided in the pad bending region.

[0078] 2 and 5 , at least a portion of the organic layer 510 located in the second region 012 is removed in a direction perpendicular to the base substrate 01. For example, the organic layer 510 is not provided in the second region 012.

[0079] Figure 7 is a schematic diagram of a partial cross-sectional structure of a second region according to another example embodiment of the present disclosure. The structure shown in Figure 7 differs from the structure shown in Figure 5 in that the portion of the organic layer 510 located in the second region 012 is located between the inorganic layer 210 and the base substrate 01. The schematic diagram of the partial cross-sectional structure of the second region 012 in Figure 7 may be a schematic diagram of the partial cross-sectional structure taken along line AA' shown in Figure 4.

[0080] During the study, the inventors of the present application discovered that: during the patterning process of the inorganic layer 210 provided in the limiting structure 400 of the light-emitting functional layer 310 provided in the display area for isolating adjacent sub-pixels 300 of different colors, the portion of the inorganic layer 210 located in the second area 012 needs to be completely etched away, which may easily cause the organic layer 510 at the edge of the contact pad 130 in the second area 012 and the contact pad 130 itself to be over-etched, resulting in the titanium on the side of the contact pad 130 farthest from the base substrate 01 being easily etched, and even the intermediate layer of aluminum included in the contact pad 130 may be corroded, thereby affecting the quality of the display substrate when used for display.

[0081] In some examples, as shown in FIG7 , in the second region 012 , the organic layer 510 covers the edge of the conductive structure 100, and the inorganic layer 210 completely covers the edge of the organic layer 510 and exposes at least a portion of the conductive structure 100. For example, the organic layer 510 includes a via 5100 that exposes the conductive structure 100, and the boundary of the organic layer 510 surrounding the via is completely covered by the inorganic layer 210, so that the via 2100 formed in the inorganic layer 210 forms a nested structure with the via 5100 in the organic layer 510. For example, the size of the via 2100 in the inorganic layer 210 is smaller than the size of the via 5100 in the organic layer 510. For example, the orthographic projection of the via 2100 in the inorganic layer 210 on the base substrate 01 is completely within the orthographic projection of the via 5100 in the organic layer 510 on the base substrate 01.

[0082] The display substrate provided by the present disclosure forms an inorganic layer included in a defined structure in a display area while patterning an inorganic layer covering an organic layer in a second area. This replaces the passivation layer located between the organic layer and the base substrate in a general display substrate, thereby saving a step of the mask process. At the same time, the inorganic layer is used to protect the edges of the organic layer and the edges of the contact pad to prevent the contact pad in the second area and the organic layer covering the contact pad from being affected during the process of patterning the defined structure in the display area.

[0083] Figure 8 is a partial structural diagram of the first sub-region in the first and second regions of the display substrate shown in Figure 1. Figure 9 is a partial enlarged view of the first sub-region shown in Figure 3. The structure of the first sub-region 0121 shown in Figure 8 can be a partial cross-sectional structural diagram taken along line BB' shown in Figure 9.

[0084] 8 and 9 , in the second region 012 , the inorganic layer 210 includes a sub-portion in contact with the conductive structure 100 . For example, the inorganic layer 210 completely covers the surface of the conductive structure 100 .

[0085] In some examples, as shown in Figures 8 and 9, in the first sub-region 0121, the inorganic layer 210 covers the conductive structure 100 and contacts the surface of the conductive structure 100. For example, the first sub-region 0121 is located in a bonding region. For example, the first sub-region 0121 can be a circuit board bonding region, such as an IC bonding region.

[0086] In some examples, as shown in Figures 8 and 9, the portion of the conductive structure 100 located in the first sub-area 0121 includes an AT (Array Test) test circuit unit, such as a test pad 120 (AT Pad). For example, the conductive structure 100 includes a plurality of test pads 120 arranged along the Y direction, and the surface and side surface of each test pad 120 away from the base substrate 01 are covered by the inorganic layer 210. For example, the intervals between adjacent test pads 120 are covered by the inorganic layer 210. For example, after the display substrate, such as the array substrate, is manufactured, the test (Array Test, AT) equipment loads the signal required to drive the array substrate from the AT Pad, uses optical and electrical analog display, converts the voltage difference between defective and normal pixels into a light intensity difference, and then outputs an image signal through photoelectric conversion and detects defects. After the array substrate is tested, the above-mentioned AT Pad needs to be covered to avoid adverse effects in subsequent processes.

[0087] For example, as shown in FIG9 , the second area further includes pins 144 electrically connected to a circuit board (such as a COP) and connection traces 145 connecting the pins in the first sub-area and the second sub-area.

[0088] For example, FIG8 schematically shows that the conductive structure 100 is a one-layer structure, but is not limited thereto.

[0089] Figure 10 shows a schematic partial cross-sectional structure diagram of a first sub-region within a second region, according to an example embodiment of the present disclosure. The structure shown in Figure 10 differs from the structure shown in Figure 8 in that conductive structure 100 includes different structural layers. The schematic partial cross-sectional structure diagram of the second region 012 in Figure 10 may be a schematic partial cross-sectional structure diagram taken along line BB' shown in Figure 9.

[0090] For example, as shown in Figure 10, the conductive structure 100 includes a multi-layer sub-conductive structure, such as a two-layer sub-conductive structure, including a first sub-conductive structure 101 and a second sub-conductive structure 102, and the first sub-conductive structure 101 is located between the second sub-conductive structure 102 and the base substrate 01. For example, the boundary of the second sub-conductive structure 102 can be flush with the boundary of the first sub-conductive structure 101. However, it is not limited to this, and the boundary of the second sub-conductive structure 102 can be larger than the boundary of the first sub-conductive structure 101. For example, the first sub-conductive structure 101 can be in contact with the second sub-conductive structure 102. For example, the material of the first sub-conductive structure 101 and the second sub-conductive structure 102 can be the same. For example, each layer of the sub-conductive structure 100 can include multiple metal layers, such as titanium / aluminum / titanium stacked together. For example, the test pad 120 can include a titanium / aluminum / titanium metal layer.

[0091] For example, as shown in FIG10 , the inorganic layer 210 covers the surface of the second sub-conductive structure 102 away from the base substrate 01. For example, the inorganic layer 210 covers the side surface of the second sub-conductive structure 102. For example, the inorganic layer 210 covers the side surface of the first sub-conductive structure 101 and the side surface of the second sub-conductive structure 102.

[0092] Figure 11 is a schematic diagram of a partial cross-sectional structure of the first sub-region within the second region of a typical display substrate. As shown in Figure 11, in a typical display substrate, a passivation layer 02 is disposed between the first sub-conductive structure 101 and the second sub-conductive structure 102. A planarization layer 03 is disposed on the side of the second sub-conductive structure 102 facing away from the base substrate 01. The planarization layer 03 shown in Figure 11 may be the portion of the organic layer 510 located in the second region 012 shown in Figure 8. For example, the portion of the planarization layer covering the second sub-conductive structure 102 may be a thinned film layer.

[0093] Compared to the structure shown in FIG11 in which a passivation layer combined with an organic layer is used to cover the test pads separately in a general display substrate, the display substrate provided by the present disclosure uses an inorganic layer 210 to simultaneously replace the passivation layer and the organic layer on the test pad 120, so as to protect the test pad 120 from adverse effects in subsequent processes while reducing the production cost of the mask process.

[0094] For example, as shown in Figures 8 and 10, no organic layer 510 is provided in the first sub-region 0121. By omitting the organic layer 510 in the first sub-region 0121, the yield of IC bonding is improved, while also significantly reducing backplane circuit manufacturing costs and production efficiency. This also prevents problems such as dark spots in this area caused by subsequent processing.

[0095] FIG. 12 is a schematic diagram of a partial planar structure of a region where a barrier portion is provided in the second region of a general display substrate.

[0096] During research, the inventors of this application discovered that, as shown in FIG12 , the conductive structure 100 in the second region 012 of a typical display substrate includes a power signal line 110. A blocking portion 630 is provided on the side of the power signal line 110 away from the base substrate 01. The organic layers 510 of the power signal line 110, except for those covered by the blocking portion 630, are removed. For example, three organic layers 510 are provided on the side of the power signal line 110 away from the base substrate 01: organic layer 61, organic layer 62, and organic layer 63, stacked in sequence perpendicular to the base substrate, with organic layer 61 located between organic layer 62 and the base substrate. These three organic layers are provided in the blocking portion 630, and the power signal line 110 at locations outside the blocking portion 630 is exposed by these three organic layers. Therefore, during the process of patterning the first electrode of the sub-pixel, the exposed portion of the power signal line 110 will be etched, resulting in an undercut structure. This will cause the encapsulation layer formed on the etched surface of the power signal line 110 to crack, affecting the encapsulation effect. This will further form a path for water vapor intrusion, resulting in growth-type dark spots (GDS) defects, and affecting the image quality of the display area.

[0097] Currently, the main solution to this defect is to form a passivation layer (passivation layer 02 as shown in Figures 6 and 11) on the side of the power signal line 110 away from the substrate after patterning the power signal line 110, so as to protect the power signal line 110 when patterning the first electrode of the sub-pixel, thereby preventing the power signal line 110 from being undercut and causing GDS defects.

[0098] Figure 13 is a schematic diagram of a partial planar structure of a region provided with a barrier portion within the second region according to an embodiment of the present disclosure. Figure 14 is a schematic diagram of a partial cross-sectional structure taken along line CC' shown in Figure 13 .

[0099] In some examples, as shown in Figures 1, 13, and 14, the portion of the conductive structure 100 located in the second region 012 includes a power signal line 110, and the inorganic layer 210 contacts a portion of the surface of the power signal line 110. For example, the power signal line 110 can be a signal line that transmits at least one of a VDD power signal and a VSS power signal.

[0100] In some examples, as shown in Figures 1, 13, and 14, the display substrate further includes at least one ring of blocking portions 630 surrounding the display area, with at least a portion of the blocking portion 630 located on the side of the conductive structure 100 facing away from the base substrate 01. The orthographic projection of the power signal line 110 on the base substrate 01 overlaps with the orthographic projection of the at least one ring of blocking portions 630 on the base substrate 01. The portion of the power signal line 110 located in the second area 012 extends along a first direction. The portion of the at least one ring of blocking portions 630 located in the second area 012 includes strip-shaped blocking portions 6300 extending along a second direction. At least a portion of the inorganic layer 210 located in the second area 012 extends along the second direction, with the first direction intersecting the second direction. For example, the first direction can be the X direction shown in the figure, and the second direction can be the Y direction shown in the figure. For example, the angle between the first direction and the second direction can be 80 to 100 degrees. For example, the first direction is perpendicular to the second direction. The disclosed embodiments are not limited to this, and the first and second directions can be interchangeable.

[0101] In some examples, as shown in Figures 1, 13, and 14, at least a portion of the inorganic layer 210 located in the second region 012 includes at least one inorganic layer pattern 211. The inorganic layer pattern 211 extends along the second direction and covers an edge of the power signal line 110 extending along the first direction. For example, the inorganic layer pattern 211 can be a strip-shaped film layer.

[0102] The inorganic layer provided in the display substrate provided by the present disclosure is arranged in a portion located in the display area and is used to form a limiting structure to separate at least one layer of the light-emitting functional layer of adjacent sub-pixels with different colors, thereby achieving the purpose of reducing crosstalk. At the same time, the inorganic layer is located in the non-display area and covers the edge of the power signal line exposed in the blocked portion, which can enhance the strict reliability verification conditions of the non-display area and avoid the occurrence of related growth-type dark spots (GDS) problems. Compared with a general display substrate in which a passivation layer (the passivation layer 02 shown in Figures 6 and 11) is provided on the side of the conductive structure away from the base substrate, the display substrate provided by the present disclosure replaces the above-mentioned passivation layer with an inorganic layer. On the basis of being compatible with the film layer of the limiting structure in the display area, the inorganic layer can protect the power signal line exposed in the blocked portion in the second area while saving the mask process of forming the above-mentioned passivation layer, thereby saving production costs and improving the production capacity of the backplane circuit.

[0103] In some examples, as shown in Figures 1, 13, and 14, the at least one inorganic layer pattern 211 includes a plurality of inorganic layer patterns 211, the number of the strip-shaped barrier portions 6300 is at least one, and the strip-shaped barrier portions 6300 and the plurality of inorganic layer patterns 211 are alternately arranged along the first direction. For example, there may be two strip-shaped barrier portions 6300 and three inorganic layer patterns 211. The inorganic layer patterns 211 and the strip-shaped barrier portions 6300 are alternately arranged along the first direction, and the inorganic layer patterns 211 are located on both sides of the strip-shaped barrier portions 6300.

[0104] In some examples, as shown in Figures 1, 13, and 14, the edges of the strip-shaped barrier 630 cover at least a portion of the edges of the inorganic layer pattern 211. For example, the edges of the inorganic layer pattern 211 located on both sides of the strip-shaped barrier 6300, which are adjacent to the strip-shaped barrier 630, extend into the strip-shaped barrier 6300 to prevent the strip-shaped barrier 6300 and the inorganic layer pattern 211 from being misaligned due to process reasons, thereby exposing a portion of the conductive structure 100. For example, the inorganic layer pattern 211 covers the conductive structure 100 exposed by the strip-shaped barrier 6300.

[0105] For example, as shown in FIG14 , the barrier portion 630 may include a first film layer 631 and a second film layer 632 stacked together, with the second film layer 632 located on a side of the first film layer 631 away from the base substrate 01 . For example, the portion of the organic layer 510 located in the second region 012 serves as the first film layer 631 of the barrier portion 630 , while the portion of the film layer containing the pixel defining portion of the pixel defining pattern 5200 located in the second region 012 serves as the second film layer 632 of the barrier portion 630 . FIG14 schematically illustrates that the first film layer includes a single film layer, but the present invention is not limited thereto. The first film layer may include at least two film layers, such as two planar layers.

[0106] For example, as shown in Figures 13 and 14 , in a direction perpendicular to the base substrate 01, the portion where the inorganic layer pattern 211 overlaps the barrier portion 630 is located between the first film layer 631 and the second film layer 632. For example, the first film layer 631 and the second film layer 632 can be made of the same material, and there can be no clear boundary between the first film layer 631 and the second film layer 632 of the barrier portion 630, except where the inorganic layer 210 is disposed between them.

[0107] For example, as shown in FIG13 and FIG14 , along the direction perpendicular to the base substrate 01 , the size of the portion where the inorganic layer pattern 211 overlaps the strip barrier 6300 in the first direction is 10 to 40 microns, or 15 to 20 microns, or 12 to 18 microns.

[0108] In some examples, as shown in FIG1 , the base substrate 01 includes a third region 013 that surrounds a portion of the display area. The orthographic projection of the edge of the portion of the power signal line 110 located in the third region 013 on the base substrate 01 is completely within the orthographic projection of at least one ring of blocking portions 630 on the base substrate 01. For example, the first region 011 is the display area, and the third region 013 and the second region 012 form a ring of non-display area surrounding the display area. For example, the second region 012 is located below the display area, and the fourth region 014 is located above, to the left, and to the right of the display area. For example, a ring of blocking portions 630 is distributed within the ring of non-display area formed by the fourth region 014 and the second region 012. The blocking portions 630 located in the fourth region 014 completely cover the edge of the power signal line 110, while the blocking portions 630 located in the second region 012 intersect the power signal line and expose a portion of the edge of the power signal line 110. This exposed edge of the power signal line 110 is covered by the inorganic layer 210.

[0109] In some examples, as shown in Figures 1, 13, and 14, the portion of the power signal line 110 located in the third region 013 does not overlap with the inorganic layer 210 in a direction perpendicular to the base substrate 01. For example, the inorganic layer 210 is not provided in the third region 013. For example, in the non-display area outside the display area, the inorganic layer 210 is provided only on the lower side of the second region 012 (such as the lower pad area). For example, the edge of the power signal line 110 includes a portion covered only by the inorganic layer 210, a portion covered only by the barrier 630, and a portion covered by both the inorganic layer 210 and the strip barrier 630.

[0110] In some examples, as shown in Figures 1 and 3, the power signal line 110 includes a first power signal line 111 and a second power signal line 112. The first power signal line 111 includes portions located in the first area 011 and the second area 012, with only the second power signal line 112 located in the third area 013. For example, the second power signal line 112 can be a VSS power signal line, which can be connected to a voltage source to output a constant voltage signal, such as a negative voltage signal. For example, the second power signal line 112 can also be grounded. For example, the first power signal line 111 can be a VDD power signal line, which can be connected to a voltage source to output a constant voltage signal, such as a positive voltage signal. For example, the first power signal line 111 also includes a portion located in the display area to electrically connect to the pixel circuit included in the sub-pixel 300 to provide a power signal. For example, the second power signal line 112 is located in the non-display area and is arranged around the display area. The second power signal line 112 can include a portion located in the display area to electrically connect to the second electrode 330 included in the sub-pixel 300. For example, the second power signal line 112 is located on both sides of the first power signal line 111 in the second direction. For example, the conductive structure 100 shown in FIG13 can be the second power signal line 112, but is not limited thereto and can also be the first power signal line 111.

[0111] FIG15 is a schematic block diagram of a display device according to another embodiment of the present disclosure. As shown in FIG15 , the display device 1000 includes a display substrate 1001. The display substrate 1001 can be the display substrate in any of the above embodiments.

[0112] For example, the display device 1000 may be an organic light emitting diode display device.

[0113] For example, the display device 1000 may further include a cover plate located on the light-emitting side of the display substrate 1001 .

[0114] For example, the display device 1000 may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc., but the present embodiment is not limited thereto.

[0115] For example, the display device 1000 may be a medium or large-sized smart handheld display device (NB) or a touch screen display device (TPC), and also has broad application potential in the field of foldable products.

[0116] There are a few points to note:

[0117] (1) The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures can refer to general designs.

[0118] (2) In the absence of conflict, features in the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0119] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure. The scope of protection of the present disclosure is determined by the appended claims.

Claims

1. A display substrate, comprising: A substrate base plate, comprising a first region and a second region; A conductive structure located in the first region and the second region on the substrate; an inorganic layer, located on a side of the conductive structure away from the substrate, and located in the first area and the second area; The first area includes a display area, the second area includes a part of a non-display area, the display area includes a plurality of sub-pixels and a limiting structure, each of at least some of the sub-pixels includes a light-emitting functional layer, the light-emitting functional layer includes a plurality of film layers, the limiting structure includes a portion of the inorganic layer located in the display area, the limiting structure is located between the light-emitting functional layer and the base substrate, and a portion of the limiting structure located between adjacent sub-pixels is configured to isolate at least one layer of the light-emitting functional layer; In the second region, the inorganic layer includes a sub-portion exposing at least a portion of the conductive structure, and / or the inorganic layer includes a sub-portion in contact with the conductive structure.

2. The display substrate according to claim 1, further comprising: The organic layer is located between the film layer where the inorganic layer is located and the substrate. The defined structure further includes at least one protrusion in the organic layer that contacts the surface of the inorganic layer, and at least a portion of the edge of the protrusion is retracted relative to the edge of the inorganic layer in the defined structure.

3. The display substrate according to claim 2, wherein: Along a direction perpendicular to the substrate, a portion of the conductive structure located in at least a portion of the second region does not overlap with the organic layer.

4. The display substrate according to claim 2, wherein: In at least a portion of the second region, the organic layer covers an edge of the conductive structure, and the inorganic layer covers an edge of the organic layer and exposes at least a portion of the conductive structure.

5. The display substrate according to any one of claims 1 to 4, wherein: The second region includes a first sub-region, in which the inorganic layer covers the conductive structure and contacts a surface of the conductive structure.

6. The display substrate according to claim 5, wherein: The portion of the conductive structure located in the first sub-region includes a test pad.

7. The display substrate according to any one of claims 5 to 6, wherein: The second region further includes a second sub-region, in which the inorganic layer covers an edge of the conductive structure.

8. The display substrate according to claim 7, wherein: The portion of the conductive structure located in the second sub-region includes a contact pad, and the contact pad is configured to be electrically connected to a pin of a circuit board.

9. The display substrate according to claim 2 or 3, wherein: In a direction perpendicular to the substrate, at least a portion of the organic layer in the second region is removed.

10. The display substrate according to any one of claims 1 to 9, wherein: Each of the at least some of the sub-pixels further comprises a first electrode and a second electrode located on both sides of the light-emitting functional layer, wherein the first electrode is located between the light-emitting functional layer and the base substrate; The display substrate also includes a pixel defining pattern, which includes a plurality of first openings and a plurality of second openings. One sub-pixel corresponds to at least one first opening, at least part of the light-emitting functional layer of the sub-pixel is located in the first opening corresponding to the sub-pixel, and the first opening is configured to expose the first electrode, and the second opening is configured to expose an edge of the defining structure.

11. The display substrate according to claim 7 or 8, wherein: The first sub-region is located between the second sub-region and the first region.

12. The display substrate according to any one of claims 1 to 11, wherein: The portion of the conductive structure located in the second region includes a power signal line, and the inorganic layer contacts a portion of the surface of the power signal line.

13. The display substrate according to claim 12, further comprising: At least one circle of blocking parts surrounds the display area, and at least a portion of the film layer of the blocking parts is located on a side of the conductive structure away from the base substrate. Among them, the orthographic projection of the power signal line on the base substrate overlaps with the orthographic projection of the at least one circle of blocking parts on the base substrate, the portion of the power signal line located in the second zone extends along the first direction, the portion of the at least one circle of blocking parts located in the second zone includes a strip-shaped blocking part extending along the second direction, and at least the portion of the inorganic layer located in the second zone extends along the second direction, and the first direction intersects with the second direction.

14. The display substrate according to claim 13, wherein: At least a portion of the inorganic layer located in the second region includes at least one inorganic layer pattern, and the inorganic layer pattern extends along the second direction and covers an edge of the power signal line extending along the first direction.

15. The display substrate according to claim 14, wherein: The at least one inorganic layer pattern includes a plurality of inorganic layer patterns, the number of the strip-shaped barrier portions is at least one, and the strip-shaped barrier portions and the plurality of inorganic layer patterns are alternately arranged along the first direction.

16. The display substrate according to claim 15, wherein: The edge of the strip-shaped barrier covers at least a portion of the edge of the inorganic layer pattern.

17. The display substrate according to any one of claims 13 to 16, wherein: The base substrate comprises a third area surrounding a portion of the display area, and the orthographic projection of the edge of the portion of the power signal line located in the third area on the base substrate is completely located within the orthographic projection of the at least one circle of blocking portions on the base substrate.

18. The display substrate according to claim 17, wherein: In a direction perpendicular to the base substrate, a portion of the power signal line located in the third region does not overlap with the inorganic layer.

19. The display substrate according to claim 17, wherein: The power signal line includes a first power signal line and a second power signal line. The first power signal line includes parts located in the first area and the second area. Only the second power signal line is arranged in the third area.

20. A display device comprising the display substrate according to any one of claims 1 to 19.

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