Display panel and manufacturing method therefor, and display apparatus

Abstract

A display panel and a manufacturing method therefor, and a display apparatus. The display panel comprises: a first region; a second region; a third region; a plurality of sub-pixels; a base substrate; and an inorganic layer, a first partition structure, and a second partition structure which are located on the base substrate. The first partition structure comprises a first separation portion and a second separation portion which are stackedly arranged, and the first separation portion comprises a first protruding portion protruding relative to an edge of the second separation portion. The second partition structure comprises a first separation member and a second separation member which are stackedly arranged, and the first separation member comprises a second protruding portion protruding relative to at least part of an edge of the second separation member. The first partition structure and the second partition structure are both configured to partition at least one layer of light-emitting functional layers, at least a portion of the inorganic layer located in the first region serves as the first separation portion, and at least a portion of the inorganic layer located in the third region serves as the first separation member. The first partition structure and the second partition structure of the display panel provided by the present disclosure have simple structures and are easy to manufacture.

Description

Display panel, manufacturing method thereof, and display device Technical Field

[0001] Embodiments of the present disclosure relate to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Organic light-emitting diode (OLED) display products offer advantages such as rich colors, fast response times, and foldability, and are gradually replacing liquid crystal displays (LCDs). Consequently, the market is increasingly demanding higher lifespans, power consumption, and high-brightness modes for OLED displays. Organic light-emitting diode (OLED) display devices include tandem devices. By adding at least one light-emitting layer and a charge-generating layer to a tandem device, the lifespan and brightness of the light-emitting device can be increased, while power consumption can be reduced, thereby meeting user requirements for display device lifespan and power consumption.

[0003] Summary of the Invention

[0004] Embodiments of the present disclosure provide a display panel, a manufacturing method thereof, and a display device.

[0005] The display panel provided by the embodiment of the present disclosure includes: a first area, a second area, a third area, a plurality of sub-pixels, a base substrate and an inorganic layer located on the base substrate, a first partition structure and a second partition structure, the first area is configured to display; the second area is configured to transmit light, the first area is located on at least one side of the second area; the third area is located between the first area and the second area; a plurality of sub-pixels are located in the first area, each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes a plurality of film layers; the first partition structure is located on the base substrate and between adjacent sub-pixels in the first area, the first partition structure includes a first isolation portion and a second isolation portion stacked, the first isolation portion is located in the The second isolation portion is on a side away from the base substrate, and the first isolation portion includes a first protrusion protruding relative to an edge of the second isolation portion; the second partition structure is located on the base substrate and is located in the third region, and the second partition structure includes a first isolation member and a second isolation member arranged in a stacked manner, and the first isolation member is located on a side of the second isolation member away from the base substrate, and the first isolation member includes a second protrusion protruding relative to at least part of the edge of the second isolation member; wherein the first partition structure and the second partition structure are both configured to isolate at least one layer of the light-emitting functional layer, and at least part of the inorganic layer located in the first region serves as the first isolation portion, and at least part of the inorganic layer located in the third region serves as the first isolation member.

[0006] For example, according to the display panel provided in an embodiment of the present disclosure, the display panel also includes an organic layer located on the base substrate, and the inorganic layer is located on the side of the organic layer away from the base substrate, wherein at least a portion of the organic layer located in the first region serves as the second isolation portion, and at least a portion of the organic layer located in the third region serves as at least a portion of the second isolation member.

[0007] For example, according to the display panel provided by an embodiment of the present disclosure, the orthographic projection of the first protrusion of the first isolation part on the base substrate is a first ring shape, and the orthographic projection of the second protrusion of the first isolation part on the base substrate is a second ring shape, and the average ring width of the first ring shape is smaller than the average ring width of the second ring shape.

[0008] For example, according to the display panel provided by the embodiment of the present disclosure, the average width of the second ring shape is 1.2 to 3 times the average width of the first ring shape.

[0009] For example, in the display panel provided according to an embodiment of the present disclosure, in a direction perpendicular to the base substrate, the thickness of the first isolation portion is substantially equal to the thickness of the first isolation member.

[0010] For example, according to the display panel provided by an embodiment of the present disclosure, in a direction perpendicular to the base substrate, the maximum thickness of the portion of the organic layer located in the first region is greater than or equal to the maximum thickness of the portion of the organic layer located in the third region.

[0011] For example, according to the display panel provided by the embodiment of the present disclosure, the orthographic projection of the first spacer of the second partition structure on the base substrate falls within the orthographic projection of the second spacer of the second partition structure on the base substrate.

[0012] For example, according to the display panel provided in an embodiment of the present disclosure, the second isolation member includes a first sub-isolating portion and a second sub-isolating portion, the first sub-isolating portion is located on a side of the second sub-isolating portion away from the base substrate, the edge of the first isolation member protrudes relative to the edge of the first sub-isolating portion, and the edge of the second sub-isolating portion protrudes relative to the edge of the first isolation member or is flush with the edge of the first isolation member.

[0013] For example, according to the display panel provided by an embodiment of the present disclosure, the second isolation member includes at least one metal structure layer, and at least a portion of the organic layer located in the third region covers a surface of the at least one metal structure layer.

[0014] For example, in a display panel provided according to an embodiment of the present disclosure, the at least one layer of metal structure includes a first metal structure and a second metal structure stacked in sequence along a direction perpendicular to the base substrate, the first metal structure is closer to the first isolation member than the second metal structure, and an edge of the second metal structure protrudes relative to an edge of the first metal structure.

[0015] For example, according to the display panel provided by the embodiment of the present disclosure, the first metal structure and the first isolation member are in contact with each other, and the orthographic projection of the first metal structure on the base substrate falls within the orthographic projection of the first isolation member on the base substrate.

[0016] For example, in the display panel provided according to an embodiment of the present disclosure, the thickness of the portion of the organic layer covering the surface of the first metal structure is smaller than the thickness of the portion of the organic layer covering the surface of the second metal structure.

[0017] For example, according to the display panel provided in an embodiment of the present disclosure, the second isolation member also includes an insulating structure, which is located between the first metal structure and the second metal structure so that the first metal structure and the second metal structure are insulated from each other, and the insulating structure includes an inorganic material.

[0018] For example, in the display panel provided according to an embodiment of the present disclosure, in a direction perpendicular to the base substrate, the maximum thickness of the second spacer is 1 / 3 to 1 / 2 of the maximum thickness of the portion of the organic layer located in the first region.

[0019] For example, according to the display panel provided in an embodiment of the present disclosure, the display panel further includes a pixel defining pattern, the pixel defining pattern is located in the first area and on the base substrate, the pixel defining pattern includes a plurality of first openings to define the light-emitting area of ​​the at least part of the sub-pixels, wherein the first partition structure is located between the light-emitting functional layer and the base substrate, the first partition structure includes a portion surrounding the light-emitting area of ​​each sub-pixel in the at least part of the sub-pixels, the pixel defining pattern further includes a second opening, the portion of at least one layer of the light-emitting functional layer located in the first opening is a continuous portion, and the at least part of the partition located in at least one second opening, the first partition structure includes a plurality of first openings to define the light-emitting area of ​​the at least part of the sub-pixels ... The portion of a partition structure exposed by the second opening is configured to isolate at least one layer of the light-emitting functional layer; each sub-pixel in the at least part of the sub-pixels also includes: a first electrode and a second electrode located on both sides of the light-emitting functional layer along a direction perpendicular to the base substrate, the first electrode is located between the light-emitting functional layer and the base substrate, the pixel defining pattern is located on the side of the first electrode away from the base substrate, the first partition structure is located between the first electrode and the base substrate, the display panel also includes a pixel circuit, the pixel circuit is located on the side of the first partition structure close to the base substrate, and the pixel circuit is electrically connected to the first electrode.

[0020] For example, according to the display panel provided in an embodiment of the present disclosure, the display panel also includes a data line and a gate line, the data line and the gate line are located on the base substrate and in the first area, the data line and the gate line are electrically connected to the pixel circuit respectively, the data line is configured to provide a data signal to the pixel circuit, and the gate line is configured to provide a scanning signal to the pixel circuit, wherein the first metal structure is arranged on the same layer as the data line, and the second metal structure is arranged on the same layer as the gate line.

[0021] For example, in the display panel provided according to an embodiment of the present disclosure, in a direction perpendicular to the base substrate, the thickness of the first sub-isolating portion is 1 / 4 to 1 / 3 of the thickness of the second sub-isolating portion.

[0022] At least one embodiment of the present disclosure further provides a display device, comprising any one of the display panels described above.

[0023] At least one embodiment of the present disclosure further provides a method for manufacturing a display panel, wherein the display panel includes a first area, a second area, and a third area located between the first area and the second area, wherein the first area is configured to display, the second area is configured to transmit light, and the first area is located on at least one side of the second area; the manufacturing method includes: forming an organic material layer on the base substrate, patterning the organic material layer to form an organic layer pattern in the third area; forming an inorganic material layer on the organic layer pattern, patterning the inorganic material layer to form a first partition structure in the first area, and forming a second partition structure in the third area, wherein the first partition structure includes a first isolation portion and a second isolation portion stacked together, The first isolation portion is located on a side of the second isolation portion away from the base substrate, the first isolation portion includes a first protrusion, and the first protrusion protrudes relative to an edge of the second isolation portion; the second partition structure includes a first isolation member and a second isolation member arranged in a stacked manner, the first isolation member is located on a side of the second isolation member away from the base substrate, the first isolation member includes a second protrusion, and the second protrusion protrudes relative to at least a portion of the edge of the second isolation member, the first partition structure and the second partition structure are both configured to isolate at least one layer of the light-emitting functional layer, at least a portion of the inorganic material layer located in the first region is patterned to form the first isolation portion, and at least a portion of the inorganic material layer located in the third region is patterned to form the first isolation member.

[0024] For example, according to at least one embodiment of the present disclosure, a method for manufacturing a display panel is provided, in which an inorganic material layer is formed on the organic layer pattern, and the inorganic material layer is patterned to form a first partition structure in the first region, and a second partition structure is formed in the third region, including: patterning the inorganic material layer to form the first partition structure in the first region, and forming an initial partition structure in the third region, wherein the initial partition structure includes the first isolation member and the second initial isolation member, the first isolation member and the second initial isolation member are stacked, and the edge of the first isolation member protrudes relative to at least part of the edge of the second initial isolation member; and further etching the second initial isolation member in the third region to form the second partition structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0026] FIG1 is a schematic plan view of a display panel provided by at least one embodiment of the present disclosure.

[0027] FIG. 2 is a partial cross-sectional schematic diagram taken along line W1 - W1 ′ shown in FIG. 1 .

[0028] FIG3 is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0029] FIG4 is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0030] FIG5A is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0031] FIG5B is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0032] FIG6A is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0033] FIG. 6B is a schematic diagram of a light-emitting element having a Tandem structure.

[0034] FIG. 7 is a structural diagram of the first region of the display panel shown in FIG. 1 in one example.

[0035] FIG8 is a partial enlarged schematic diagram of the M region in FIG7 .

[0036] FIG9 is a schematic block diagram of a display device according to at least one embodiment of the present disclosure.

[0037] 10 to 14 are flow charts of a method for manufacturing a display panel according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0039] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are simply used to distinguish different components. The words "include" or "comprising" and similar terms mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0040] The features such as “parallel”, “perpendicular” and “same” used in at least one embodiment of the present disclosure include the features such as “parallel”, “perpendicular” and “same” in the strict sense, as well as the cases where “approximately parallel”, “approximately perpendicular” and “approximately the same” contain certain errors, taking into account the errors associated with the measurement and the measurement of specific quantities (for example, the limitations of the measurement system), and are expressed as being within the acceptable deviation range for a specific value determined by a person of ordinary skill in the art. For example, “approximately” can mean within one or more standard deviations, or within 10% or 5% of the value. When the number of a component is not specifically indicated below in the embodiments of the present disclosure, it means that the component can be one or more, or can be understood as at least one. “At least one” refers to one or more, and “a plurality” refers to at least two.

[0041] As used herein, "same-layer arrangement" refers to a structure in which two (or more) structures are formed through the same deposition process and patterned through the same patterning process, and the materials used for the structures may be the same or different. As used herein, "integrated arrangement" refers to a structure in which two (or more) structures are formed through the same deposition process and patterned through the same patterning process, and the materials used for the structures may be the same or different.

[0042] Typically, a display panel with a "pinhole screen" generally includes a display area for normal display and a hollow area for setting a sensor (for example, a camera). The display area for normal display generally includes a light-emitting element and a pixel circuit, the pixel circuit is electrically connected to the light-emitting element, and the pixel circuit is used to drive the light-emitting element to emit light. The sensor is generally arranged in the hollow area. Relative to the normal display area, the hollow area is an area where material is removed to facilitate the sensor to receive external ambient light. Therefore, the display panel with a "pinhole screen" is different from the display panel with a "full screen". The hollow area of ​​the display panel with a "pinhole screen" has good light transmittance. Generally, the display panel also includes a third area between the display area and the hollow area.

[0043] During research, the inventors of the present application discovered that tandem (Tandem) devices have the characteristics of low power consumption and long life. For Tandem devices, the light-emitting functional layer in the light-emitting element may include a stacked multilayer film layer. However, since a charge generation layer (CGL) is provided between at least two layers of the multilayer film layer in the Tandem device, and the charge generation layer (CGL) has a relatively high conductivity, when the charge generation layer (CGL) is a full-surface film layer, the charge generation layers (CGL) of two adjacent light-emitting elements are continuous film layers. Therefore, lateral charge migration is prone to occur, resulting in a low-grayscale monochrome chromaticity shift of the display panel, which easily causes crosstalk between adjacent sub-pixels and causes color shift of the display panel.

[0044] In order to reduce the risk of crosstalk between sub-pixels of different colors, it is necessary to isolate at least one film layer in the light-emitting functional layer between sub-pixels of different colors. In addition, in order to ensure the isolation effect of the light-emitting functional layer and other film layers, it is necessary to further provide a partition structure in the area near the edge of the display area (for example, the third area between the display area and the hollow area), thereby further isolating the light-emitting functional layer and other film layers in the edge area to reduce crosstalk and ensure the display effect of the sub-pixels in the display area. In some display panels, the partition structure in the third area has a different morphology and structure from the partition structure in the display area. For example, the partition structure in the display area generally has a composite structure formed by an inorganic structural layer and an organic structural layer, while the partition structure in the third area generally has a multi-layer metal composite structure, such as Ti / Al / Ti. Therefore, the partition structure in the third area generally requires a different manufacturing process, which makes the manufacturing process cumbersome and prone to process deviations. Therefore, the overall uniformity of the partition structures in the display area and the third area needs to be improved.

[0045] At least one embodiment of the present disclosure provides a display panel, a manufacturing method thereof, and a display device.

[0046] At least one embodiment of the present disclosure provides a display panel comprising: a first region, a second region, a third region, a plurality of sub-pixels, a base substrate, an inorganic layer located on the base substrate, a first partition structure, and a second partition structure, wherein the first region is configured to display; the second region is configured to transmit light, and the first region is located on at least one side of the second region; the third region is located between the first region and the second region; a plurality of sub-pixels are located in the first region, and each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes a plurality of film layers; the first partition structure is located on the base substrate and between adjacent sub-pixels in the first region, and the first partition structure includes a first isolation portion and a The second isolation portion, the first isolation portion is located on a side of the second isolation portion away from the base substrate, and the first isolation portion includes a first protrusion protruding relative to an edge of the second isolation portion; the second partition structure is located on the base substrate and is located in the third area, the second partition structure includes a first isolation member and a second isolation member arranged in a stacked manner, the first isolation member is located on a side of the second isolation member away from the base substrate, and the first isolation member includes a second protrusion protruding relative to at least part of the edge of the second isolation member; the first partition structure and the second partition structure are both configured to isolate at least one layer of the light-emitting functional layer, at least part of the inorganic layer located in the first area serves as the first isolation portion, and at least part of the inorganic layer located in the third area serves as the first isolation member.

[0047] In the display panel provided by at least one embodiment of the present disclosure, the first isolation portion of the first partition structure located in the first display area and the first isolation member of the second partition structure located in the third area are arranged in the same layer, that is, they are formed by the same deposition process and patterned by the same composition process, which is conducive to simplifying the manufacturing process of the first isolation portion and the first isolation member, so that the structures of the first partition structure and the second partition structure can be simplified and have good uniformity.

[0048] The display panel, its manufacturing method, and the display device provided by the embodiments of the present disclosure are described below with reference to the accompanying drawings.

[0049] FIG1 is a schematic plan view of a display panel provided by at least one embodiment of the present disclosure; FIG2 is a schematic partial cross-sectional view taken along line W1 - W1 ′ shown in FIG1 .

[0050] As shown in Figure 1, the display panel 01 includes a first area A1, a second area A2, and a third area A3. The first area A1 is a display area and is configured to display. The second area A2 is a hollow area and is configured to transmit light. For example, devices such as photosensors can be provided in the second area A2. For example, the first area A1 can be located on at least one side of the second area A2. For example, in some embodiments, the first area A1 surrounds the second area A2, that is, the second area A2 can be surrounded by the first area A1. For example, the second area A2 can also be provided at other locations, depending on the needs. For example, the second area A2 can be located in the middle of the top of the base substrate BS.

[0051] For example, as shown in FIG1 , the number of second areas A2 and third areas A3 is the same. For example, in some embodiments, the number of second areas A2 and third areas A3 may be greater than one. For example, multiple second areas A2 may be located at different positions or have different shapes based on design requirements. For example, the shape of the second areas A2 may be circular, elliptical, or polygonal. For example, the second areas A2 and third areas A3 may also have other shapes, such as a racetrack shape or a polygonal shape, etc., which are not limited in the embodiments of the present disclosure.

[0052] For example, as shown in FIG1 , the display panel 01 includes a base substrate BS and a plurality of sub-pixels 10 located on the base substrate BS. The plurality of sub-pixels 10 are located in a first area A1, so that the first area A1 serves as a display area. As shown in FIG1 and FIG2 , each of at least some of the sub-pixels 10 includes a light-emitting element 100, and the light-emitting element 100 includes a light-emitting functional layer 110, and a first electrode 120 and a second electrode 130 located on both sides of the light-emitting functional layer 110 along a direction perpendicular to the base substrate BS (for example, the Z direction shown in FIG2 ), and the first electrode 120 is located between the light-emitting functional layer 110 and the base substrate BS. For example, each sub-pixel 10 located in the first area A1 includes a light-emitting element 100, and for example, the light-emitting element 100 can be an organic light-emitting element.

[0053] For example, as shown in FIG2 , the light-emitting functional layer 110 in the light-emitting element 100 may include a first light-emitting layer (EML) 111, a charge generation layer (CGL) 113, and a second light-emitting layer (EML) 112, which are stacked, and the charge generation layer 113 is located between the first light-emitting layer 111 and the second light-emitting layer 112. The charge generation layer 113 has strong conductivity, which can make the light-emitting functional layer 110 have the advantages of long life, low power consumption, and high brightness. For example, compared with a light-emitting functional layer 110 without a charge generation layer 113, providing a charge generation layer 113 in the light-emitting functional layer 110 can increase the luminous brightness of the light-emitting element 100 by nearly double. For example, the light-emitting element 100 of the sub-pixel 10 can be a tandem light-emitting element, such as a Tandem OLED. For example, the first light-emitting layer 111 and the second light-emitting layer 112 can be a structure obtained after patterning, and the charge generation layer 113 can be a structure provided as a whole layer.

[0054] For example, as shown in FIG2 , the charge generation layer 113 may include an N-type charge generation layer and a P-type charge generation layer. For example, in each sub-pixel 10, the light-emitting functional layer 110 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). For example, the hole injection layer (HIL), the hole transport layer (HTL), the electron transport layer (ETL), the electron injection layer (EIL), and the charge generation layer 113 are all shared film layers of multiple sub-pixels 10 and may be referred to as common layers.

[0055] For example, as shown in FIG2 , the second light-emitting layer 112 can be positioned between the first light-emitting layer 111 and the second electrode 130, and the hole injection layer can be positioned between the first electrode 120 and the first light-emitting layer 111. For example, an electron transport layer can be positioned between the charge generation layer 113 and the first light-emitting layer 111. For example, a hole transport layer can be positioned between the second light-emitting layer 112 and the charge generation layer 113. For example, an electron transport layer and an electron injection layer can be positioned between the second light-emitting layer 112 and the second electrode 130.

[0056] For example, the material of the electron transport layer may include aromatic heterocyclic compounds, such as imidazole derivatives such as benzimidazole derivatives, imidazopyridine derivatives, and benzimidazolephenanthridine derivatives; oxazine derivatives such as pyrimidine derivatives and triazine derivatives; quinoline derivatives, isoquinoline derivatives, phenanthroline derivatives, and other compounds containing nitrogen-containing six-membered ring structures (including compounds having phosphine oxide-based substituents on heterocyclic rings). For example, as shown in FIG2 , the material of the charge generation layer 113 may be a material containing a phosphorus oxide group or a material containing a triazine. For example, the ratio of the electron mobility of the material of the charge generation layer 113 to the electron mobility of the electron transport layer is 10 -2 ~102 .

[0057] For example, as shown in FIG2 , the first electrode 120 may be an anode, and the second electrode 130 may be a cathode. For example, the cathode may be formed of a material with high conductivity and low work function, such as a metal material. For example, the anode may be formed of a transparent conductive material with a high work function.

[0058] For example, as shown in FIG2 , the orthographic projection of the second electrode 130 in at least some of the sub-pixels 10 on the base substrate BS is a full-surface structure. For example, the second electrode 130 may be a common electrode shared by multiple sub-pixels 10. For example, the second electrode 130 may be a common electrode shared by at least some of the sub-pixels 10.

[0059] For example, as shown in FIG2 , an insulating layer 020 is disposed between the first electrode 120 and the base substrate BS. For example, a film layer 021 and a film layer 022 are further disposed between the insulating layer 020 and the base substrate BS to provide insulation. FIG2 omits some structures between the insulating layer 020 and the base substrate BS, such as the film layer where signal lines such as data lines are located, and other insulating layers.

[0060] 2 , the display panel 01 further includes an inorganic layer 010 located on the base substrate BS. For example, the inorganic layer 010 is located on a side of the insulating layer 020 away from the base substrate BS and is in contact with the insulating layer 020 .

[0061] As shown in FIG2 , the display panel 01 further includes a first partition structure 200 and a second partition structure 300 located on the base substrate BS. The first partition structure 200 is located between adjacent sub-pixels 10 in the first area A1 and includes a first isolation portion 210 and a second isolation portion 220 arranged in a stacked manner. The first isolation portion 210 is located on a side of the second isolation portion 220 away from the base substrate BS. The first isolation portion 210 includes a first protrusion 201 that protrudes relative to an edge of the second isolation portion 220. The second partition structure 300 is located in the third area A3 and includes a first isolation member 310 and a second isolation member 320 arranged in a stacked manner. The first isolation member 310 is located on a side of the second isolation member 320 away from the base substrate BS. The first isolation member 310 includes a second protrusion 301 that protrudes relative to at least a portion of the edge of the second isolation member 320.

[0062] As shown in FIG2 , the first partition structure 200 and the second partition structure 300 are both configured to partition at least one film layer of the light-emitting functional layer 100. For example, the first protrusion 201 of the first partition structure 200 can partition at least one film layer in the light-emitting functional layer 100, thereby reducing the risk of crosstalk between adjacent sub-pixels 10. The second protrusion 301 of the second partition structure 300 can partition at least one film layer in the light-emitting functional layer 100, thereby further reducing the risk of crosstalk.

[0063] As shown in FIG2 , at least a portion of the inorganic layer 010 located in the first area A1 serves as a first isolating portion 210, and at least a portion of the inorganic layer 010 located in the third area A3 serves as a first isolating member 310. That is, the first isolating portion 210 and the first isolating member 310 are disposed on the same layer, formed through the same deposition process, and patterned through the same patterning process. For example, the first isolating portion 210 and the first isolating member 310 are made of the same material. Thus, the first isolating portion 210 and the first isolating member 310 can be patterned using the same mask, thereby simplifying the manufacturing process. This simplifies the structures of the first partition structure 200 and the second partition structure 300, making them easier to manufacture and easier to control process deviations. This ensures that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0064] For example, as shown in Figure 2, the display panel 01 also includes an organic layer 020 (that is, the above-mentioned insulating layer 020) located on the base substrate BS, the inorganic layer 010 is located on the side of the organic layer 020 away from the base substrate BS, at least a portion of the organic layer 020 located in the first area A1 serves as a second isolation portion 220, and at least a portion of the organic layer 020 located in the third area A3 serves as at least a portion of the second isolation member 320.

[0065] For example, referring to FIG2 , the second isolation portion 220 in the first partition structure 200 and the second isolation member 320 in the second partition structure 300 can also be provided in the same layer. They can be formed through the same deposition process and patterned through the same patterning process. For example, the second isolation portion 220 and the second isolation member 320 can be formed of the same material. Thus, the second isolation portion 220 and the second isolation member 320 can be patterned using the same mask, thereby simplifying the manufacturing process and facilitating control of process deviations, thereby ensuring that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0066] Of course, referring to Figure 2, when the thickness of the light-emitting functional layer 110 to be isolated is different, the thickness of the second isolation member 320 in the direction perpendicular to the base substrate BS can be set according to design requirements. For example, when the thickness of the light-emitting functional layer 110 to be isolated is large, the thickness of the second isolation member 320 can be correspondingly large to enhance the isolation ability of the second partition structure 300. For example, when the thickness of the light-emitting functional layer 110 to be isolated is small, the thickness of the second isolation member 320 can be made smaller, as long as the second partition structure 300 can play its isolation role. For example, in some embodiments of the present disclosure, the first light-emitting layer 111 and the second light-emitting layer 112 may not be arranged in the third area A3, so that the second partition structure 300 can be used to isolate at least one film layer in the light-emitting functional layer 110 other than the first light-emitting layer 111 and the second light-emitting layer 112.

[0067] For example, as shown in FIG2 , when the thickness of the light-emitting functional layer 110 is relatively small, the thickness of the second spacer 320 in a direction perpendicular to the base substrate BS is less than the maximum thickness of the portion of the organic layer 020 located in the first area A1. For example, the thickness of the second spacer 320 is less than the thickness of the second isolation portion 220, but this is not limited thereto. For example, when the thickness of the second spacer 320 is relatively small, the second spacer 320 may be a structure obtained by thinning at least a portion of the organic layer 020. For example, a half-tone mask may be used to form the second isolation portion 220 located in the first area A1 and the second spacer 320 located in the third area A3.

[0068] For example, as shown in FIG. 2 , the number of the second partition structures 300 may be 5 to 10, for example, 5 to 8, such as 7 or 8, which is not limited in the embodiments of the present disclosure.

[0069] 2 , the inorganic layer 010 may include an inorganic material, such as silicon nitride, silicon oxide, or silicon oxynitride. For example, the organic layer 020 may include an organic material, such as polyimide.

[0070] For example, as shown in Figure 2, the orthographic projection of the first protrusion 201 of the first isolation portion 210 onto the base substrate BS is a first ring-shaped shape, while the orthographic projection of the second protrusion 301 of the first isolation member 310 onto the base substrate BS is a second ring-shaped shape, and the average ring width P1 of the first ring is smaller than the average ring width P2 of the second ring. For example, the first partition structure 200 can form an "undercut" structure through the first protrusion 201 of the first isolation portion 210 to isolate at least one film layer in the light-emitting functional layer 100, thereby reducing the risk of crosstalk between adjacent sub-pixels 10. For example, the second partition structure 300 can form an "undercut" structure through the second protrusion 301 of the first isolation member 310 to further enhance the isolation function. By setting the average ring width P2 of the second ring to be larger than the average ring width P1 of the first ring, the second protrusion 301 of the first isolation member 310 can protrude more relative to the second isolation member 320, thereby enhancing the isolation capability of the second partition structure 300. For example, in the third area A3, the second partition structure 300 can partition all film layers in the light-emitting functional layer 100. For example, in the third area A3, the second partition structure 300 can partition all film layers in the light-emitting functional layer 100 and simultaneously partition the second electrode 130.

[0071] For example, as shown in FIG2 , the average width of the second ring is 1.2 to 3 times the average width of the first ring, and may be at least one of 1.2 to 1.5 times, 1.6 to 1.8 times, 1.7 to 2 times, 2.2 to 2.5 times, and 2.6 to 3 times. For example, it may be 1.5 times, 1.8 times, 2 times, 2.5 times, 2.8 times, or 3 times, which is not limited in the embodiments of the present disclosure.

[0072] For example, as shown in FIG2 (and as shown in FIG7 below), the first ring corresponding to the first protrusion 201 in the first partition structure 200 surrounds the light-emitting area of ​​the sub-pixel 10, and the second ring corresponding to the second protrusion 301 in the second partition structure 300 surrounds the third area A3, that is, the non-display area. For example, the first ring is a non-closed ring, and the second ring is a closed ring. For example, the first ring and the second ring can have substantially the same shape, or different shapes. For example, the first ring can be in the shape of a circular ring or a rectangle with rounded corners. For example, the second ring can be in the shape of a circular ring or a rectangle with rounded corners.

[0073] For example, as shown in FIG2 (and as shown in FIG7 below), the outer circumference of the first ring corresponding to the first protrusion 201 in the first partition structure 200 is 10 to 90 microns, for example, can be at least one of 10 to 20 microns, 25 to 35 microns, 40 to 50 microns, 55 to 65 microns, 70 to 80 microns, 75 to 85 microns, and 80 to 90 microns, but is not limited thereto. For example, the outer circumference of the second ring corresponding to the second protrusion 301 in the second partition structure 300 is 100 to 800 microns, for example, can be at least one of 100 to 300 microns, 200 to 400 microns, 350 to 450 microns, 450 to 600 microns, 500 to 650 microns, and 700 to 800 microns, but is not limited thereto in the embodiments of the present disclosure.

[0074] For example, as shown in FIG2 (and as shown in FIG7 below), the light-emitting area of ​​a sub-pixel 10 can be surrounded by a continuous first ring as described above. For example, the first ring surrounding the light-emitting area of ​​a sub-pixel 10 can also include multiple first sub-rings, and the multiple first sub-rings are arranged at intervals. For example, the shapes of the multiple first sub-rings surrounding the light-emitting area of ​​the same sub-pixel 10 can be roughly the same or different. For example, the outer circumferences of the multiple first sub-rings surrounding the light-emitting area of ​​the same sub-pixel 10 can also be unequal, and the embodiments of the present disclosure are not limited to this.

[0075] For example, as shown in Figures 1 and 2, the number of the second rings surrounding the third area A3 can be 1 to 5, for example, at least one of 1 to 3, 2 to 4, 3 to 5, 1 to 4, and 4 to 5. For example, when there are multiple second rings surrounding the third area A3, the multiple second rings can have substantially the same shape, for example, they can all be at least one of a circle, an ellipse, and a rectangle with rounded corners, which is not limited in the embodiments of the present disclosure.

[0076] For example, as shown in FIG2 , in a direction perpendicular to the substrate BS, the thickness of the first isolation portion 210 is substantially equal to the thickness of the first isolation member 310. That is, during the formation of the first isolation portion 210 and the first isolation member 310, the inorganic layer 010 is not locally thinned, and its thickness is substantially uniform, thereby allowing the first isolation portion 210 and the first isolation member 310 to be disposed on the same layer. The term "substantially equal" may mean that the thicknesses of the two are equal, or that the ratio of the difference between the two thicknesses to the thickness of one of the two is no more than 3%.

[0077] For example, as shown in FIG2 , in a direction perpendicular to the base substrate BS, the maximum thickness of the portion of the organic layer 020 located in the first area A1 is greater than or equal to the maximum thickness of the portion of the organic layer 020 located in the third area A3. For example, the maximum thickness of the portion of the organic layer 020 located in the first area A1 is dimension P0 shown in FIG2 . For example, the maximum thickness of the portion of the organic layer 020 located in the third area A3 is the thickness of the second spacer 320.

[0078] For example, as shown in FIG2 , the maximum thickness of the portion of the organic layer 020 located in the first region A1 is 3 to 5 microns, for example, at least one of 3 to 3.5 microns, 3.5 to 4 microns, 4 to 4.5 microns, and 4.5 to 5 microns. For example, the maximum thickness of the portion of the organic layer 020 located in the third region A3 is 0.5 to 1.5 microns, for example, at least one of 0.5 to 0.8 microns, 1.0 to 1.2 microns, and 1.3 to 1.5 microns.

[0079] For example, as shown in FIG2 , a third partition structure R is further provided in the third region A3. The third partition structure R is also configured to partition at least one layer of the light-emitting functional layer 110. For example, the orthographic projection of the third partition structure R on the base substrate BS may be a closed ring. For example, the number of third partition structures R may be 1 to 5, such as at least one of 2 to 4, 3 to 5, and 1 to 2, but the embodiments of the present disclosure are not limited thereto.

[0080] It should be noted that the figures of the embodiments of the present disclosure are merely illustrative of the film layer structures included in the first partition structure 200, the second partition structure 300, and the third partition structure R, and are not intended to be limiting. For example, the display panel in the embodiments of the present disclosure may have other structures between the first partition structure 200 and the third partition structure R, and may also have other structures between the second partition structure 300 and the third partition structure R, and the embodiments of the present disclosure are not limited in this regard. Figure 3 is a schematic diagram of another display panel provided by at least one embodiment of the present disclosure.

[0081] For example, as shown in FIG3 , at least one embodiment of the present disclosure further provides another display panel 02. Compared to the display panel 01 in FIG2 , the second spacer 320 in the display panel 02 is thicker in a direction perpendicular to the base substrate BS, while the remaining structures are the same. For details, please refer to the relevant description of FIG2 in the above embodiment, and will not be repeated here.

[0082] For example, as shown in FIG3 , in a direction perpendicular to the base substrate BS, the thickness of the second spacer 320 in the second partition structure 300 is substantially equal to the maximum thickness of the portion of the organic layer 020 located in the first area A1. Thus, the second partition structure 300 has a strong partitioning capability, and can, for example, partition all film layers of the thicker light-emitting functional layer 110 and also partition the second electrode 130.

[0083] For example, as shown in FIG. 2 and FIG. 3 , the orthographic projection of the second spacer 320 on the base substrate BS is completely located within the orthographic projection of the first spacer 310 on the base substrate BS.

[0084] FIG4 is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0085] For example, as shown in FIG4 , at least one embodiment of the present disclosure further provides another display panel 03. Compared to the display panel 01 in FIG2 , the second spacer 320 in the second partition structure 300 of the display panel 03 is different, while the remaining structures are the same. For details, please refer to the relevant description of FIG2 in the above embodiment, and will not be repeated here.

[0086] For example, as shown in Figure 4, the orthographic projection of the first spacer 310 of the second partition structure 300 on the base substrate BS falls within the orthographic projection of the second spacer 320 of the second partition structure 300 on the base substrate BS. For example, the orthographic projection area of ​​the second spacer 320 of the second partition structure 300 on the base substrate BS is larger than the orthographic projection area of ​​the first spacer 310 of the second partition structure 300 on the base substrate BS.

[0087] For example, as shown in FIG4 , in the display panel 03, the second spacer 320 includes a first sub-isolating portion 3201 and a second sub-isolating portion 3202. The first sub-isolating portion 3201 is located on a side of the second sub-isolating portion 3202 that is away from the base substrate BS. The edge of the first spacer 310 protrudes relative to the edge of the first sub-isolating portion 3201, and the edge of the second sub-isolating portion 3202 protrudes relative to the edge of the first spacer 310.

[0088] Of course, in some embodiments, the edge of the first isolating member 310 protrudes relative to the edge of the first sub-isolating portion 3201 , and the edge of the second sub-isolating portion 3202 may also be flush with the edge of the first isolating member 310 .

[0089] For example, as shown in FIG4 , the first sub-isolating portion 3201 and the second sub-isolating portion 3202 are integrally formed and made of the same material. For example, the orthographic projection area of ​​the first sub-isolating portion 3201 on the base substrate BS is smaller than the orthographic projection area of ​​the second sub-isolating portion 3202 within the base substrate BS. The orthographic projection of the first sub-isolating portion 3201 on the base substrate BS falls within the orthographic projection of the second sub-isolating portion 3202 within the base substrate BS, resulting in the second sub-isolating portion 3202 having a third protrusion 3211. For example, the second partition structure 300 can isolate at least one film layer in the light-emitting functional layer 110 via the second protrusion 301 to reduce the risk of crosstalk. For example, an encapsulation layer is provided on the side of the second electrode 130 away from the substrate BS. By providing the second sub-isolating portion 3202 with a third protrusion 3211, the encapsulation layer is facilitated to overlap the second isolating member 320 via the third protrusion 3211, facilitating the "climbing" of the encapsulation layer. This reduces the risk of fracture in the encapsulation layer and ensures its continuity. Furthermore, this arrangement also provides excellent stability for the second partition structure 300, making it less susceptible to tilting or misalignment.

[0090] For example, as shown in FIG4 , in a direction perpendicular to the base substrate BS, the thickness of the first sub-isolating portion 3201 is less than the thickness of the second sub-isolating portion 3202. For example, the thickness of the first sub-isolating portion 3201 is 1 / 4 to 1 / 3 of the thickness of the second sub-isolating portion 3202, such as 1 / 4, 7 / 24, or 1 / 3. For example, the dimension L1 of the first sub-isolating portion 3201 in a direction perpendicular to the base substrate BS can be 0.2 to 0.3 microns, such as 0.2 microns, 0.25 microns, 0.28 microns, or 0.3 microns. For example, the dimension L2 of the second sub-isolating portion 3202 in a direction perpendicular to the base substrate BS can be 0.6 to 0.8 microns, such as 0.6 microns, 0.65 microns, 0.7 microns, 0.75 microns, or 0.8 microns, although this is not limited in the embodiments of the present disclosure. For example, in a direction perpendicular to the base substrate BS, the maximum thickness of the second spacer 320 is substantially equal to the maximum thickness of the portion of the organic layer 020 located in the first display area A1 , but is not limited thereto.

[0091] FIG5A is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure; FIG5B is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0092] For example, as shown in FIG5A , at least one embodiment of the present disclosure further provides another display panel 04. Compared to the display panel 01 in FIG2 , the second spacer 320 in the second partition structure 300 of the display panel 04 is different, while the remaining structures are the same. For details, please refer to the description of FIG2 in the above embodiment, and will not be repeated here.

[0093] For example, as shown in FIG5A , the second partition structure 300 includes a first spacer 310 and a second spacer 320. The first spacer 310 is located on a side of the second spacer 320 away from the base substrate BS. The second spacer 320 includes at least one metal structure 3200, and at least a portion of the organic layer O20 located in the third area A3 covers the surface of the at least one metal structure 3200.

[0094] For example, as shown in FIG5A , the at least one metal structure 3200 may include one or more metal structures. For example, the metal structure of the at least one metal structure 3200 that is farthest from the substrate BS contacts the first isolation member 310. The at least one metal structure 3200 may "raise" the first isolation member 310 to facilitate the second protrusion 301 in the first isolation member 310 to isolate at least one film layer in the light-emitting functional layer 110. For example, at least a portion of the organic layer 020 located in the third area A3 covers the surface of the at least one metal structure 3200, thereby preventing the metal structure 3200 from being exposed, thereby preventing the isolated light-emitting functional layer 110 from being electrically connected to the metal structure 3200, thereby reducing the risk of crosstalk.

[0095] For example, as shown in FIG5A , the at least one metal structure 3200 may include a first metal structure 3210 and a second metal structure 3220 stacked in sequence along a direction perpendicular to the base substrate BS, wherein the first metal structure 3210 is closer to the first isolation member 310 than the second metal structure 3220. The first metal structure 3210 is in contact with the first isolation member 310, and the orthographic projection of the first metal structure 3210 on the base substrate BS falls within the orthographic projection of the first isolation member 310 on the base substrate BS.

[0096] For example, as shown in FIG5A , the orthographic projection area of ​​the first metal structure 3210 on the first spacer 310 is smaller than the orthographic projection area of ​​the second metal structure 3220 on the first spacer 310. The edge of the first spacer 310 protrudes relative to the edge of the first metal structure 3210, and the edge of the second metal structure 3220 protrudes relative to the edge of the first metal structure 3210. This arrangement facilitates the protrusion of the edge of the first spacer 310 relative to the edge of the first metal structure 3210, thereby forming an "undercut" structure, thereby enabling the second partition structure 300 to have a good partitioning function.

[0097] For example, as shown in FIG5A , the at least one metal structure 3200 further includes a third metal structure 3230. The third metal structure 3230 is located on a side of the second metal structure 3220 that is closer to the base substrate BS. The orthographic projection area of ​​the third metal structure 3230 on the base substrate BS is larger than the orthographic projection area of ​​the second metal structure 3220 on the base substrate BS. Consequently, the orthographic projection areas of the first metal structure 3210, the second metal structure 3220, and the third metal structure 3230 on the base substrate BS gradually increase. Consequently, the portion of the first spacer 310 that protrudes relative to the first metal structure 3210 has a larger orthographic projection area on the base substrate BS, thereby facilitating the formation of an "undercut" structure. For example, in some embodiments, at least one metal structure 3200 may also include other metal structures. For example, at least one metal structure 3200 may include 4 to 8 metal structures, so that the second isolation member 320 has a larger thickness perpendicular to the substrate BS, which is beneficial for the second isolation structure 300 to isolate the light-emitting functional layer 110 with a larger thickness. The embodiments of the present disclosure do not limit the number of layers of the metal structure in the second isolation member 320.

[0098] For example, as shown in FIG5A , the thickness H1 of the portion of the organic layer 020 covering the surface of the first metal structure 3210 is less than the thickness H2 of the portion of the organic layer 020 covering the surface of the second metal structure 3220. For example, during the formation of the first spacer 310, the portion of the organic layer 020 covering the surface of the first metal structure 3210 is simultaneously etched, reducing the thickness of the portion of the organic layer 020, thereby making the "undercut" structure of the second partition structure 300 more prominent.

[0099] For example, as shown in Figure 5B, display panel also includes data line 850 and gate line 750, and data line 850 and gate line 710 are electrically connected with pixel circuit (for example, pixel circuit 500 as shown in Figure 5 A) respectively.Data line 850 is configured to provide data signal to pixel circuit.Gate line 750 is electrically connected with the grid 710 in the pixel circuit, and gate line 750 is configured to provide scanning signal, for example gate signal to pixel circuit.For example, first metal structure 3210 can be arranged in the same layer with data line 850, and second metal structure 3220 can be arranged in the same layer with gate line 750, thereby, can simplify the manufacturing process of first metal structure 3210 and second metal structure 3220 respectively, and be beneficial to control the manufacturing precision of first metal structure 3210 and second metal structure 3220.

[0100] FIG6A is a schematic diagram of yet another display panel provided by at least one embodiment of the present disclosure.

[0101] For example, as shown in FIG6A , at least one embodiment of the present disclosure further provides another display panel 05. Compared to the display panel 04 in FIG5A , the second spacer 320 in the second partition structure 300 of the display panel 05 is different, while the rest of the structure is the same. For details, please refer to the description of FIG5A in the above embodiment, and will not be repeated here.

[0102] For example, as shown in FIG6A , the second spacer 320 further includes an insulating structure 3001. The insulating structure 3001 is located between the first metal structure 3210 and the second metal structure 3220 to insulate the first metal structure 3210 from the second metal structure 3220. The insulating structure 3001 comprises an inorganic material. For example, the first metal structure 3210 and the second metal structure 3220 are separated from each other by the insulating structure 3001. The material of the insulating structure 3001 is different from that of the organic layer 020 to minimize the impact on the organic layer 020. For example, the orthographic projection of the insulating structure 3001 on the base substrate BS is not less than the orthographic projection of the first metal structure 3210 on the base substrate BS. For example, the orthographic projection of the insulating structure 3001 on the base substrate BS can substantially overlap with the orthographic projection of the first metal structure 3210 on the base substrate BS. For example, the insulating structure 3001 can be provided on the same layer as the insulating structure located on the base substrate BS in the first area A1 to simplify the manufacturing process.

[0103] For example, as shown in Figure 6A, in the direction perpendicular to the base substrate BS, the maximum thickness of the second isolation member 320 is 1 / 3 to 1 of the maximum thickness of the portion of the organic layer 020 located in the first area A1, for example, it can be 1 / 3 to 2 / 3 or 1 / 3 to 3 / 4, and the embodiments of the present disclosure are not limited to this.

[0104] For example, as shown in FIG6A , the display panel 05 further includes a pixel-defining pattern 400. The pixel-defining pattern 400 is located in the first area A1 and on the base substrate BS. The pixel-defining pattern 400 includes a plurality of first openings 410 to define the light-emitting areas of at least a portion of the sub-pixels 10. For example, each sub-pixel 10 corresponds to at least one first opening 410. At least a portion of the light-emitting element 100 of the sub-pixel 10 is located in the first opening 410 corresponding to the sub-pixel 10. The first opening 410 is configured to expose the first electrode 120 of the sub-pixel 10. For example, the first opening 410 exposes a portion of the first electrode 120. For example, each sub-pixel 10 may correspond to one first opening 410.

[0105] For example, as shown in FIG6A , the pixel-defining pattern 400 is located on a side of the first electrode 120 that is away from the base substrate BS, and the first partition structure 200 is located between the first electrode 120 and the base substrate BS. When the light-emitting functional layer 110 is formed in the first opening 410 of the pixel-defining pattern 400, the first electrode 120 and the second electrode 130 located on either side of the light-emitting functional layer 110 can drive the light-emitting functional layer 110 in the first opening 410 to emit light. For example, the light-emitting region described above can refer to the area of ​​the sub-pixel that effectively emits light, and the shape of the light-emitting region can refer to a two-dimensional shape. For example, the shape of the light-emitting region can be the same as the shape of the first opening 410 of the pixel-defining pattern 400.

[0106] For example, as shown in FIG6A , the first partition structure 200 is located in the first area A1 and between the light-emitting functional layer 110 and the base substrate BS. The first partition structure 200 includes a portion surrounding the light-emitting area of ​​each sub-pixel 10 in at least some of the sub-pixels 10. For example, the first partition structure 200 is located between the first electrode 120 and the base substrate BS, and the orthographic projection of the first opening 410 on the base substrate BS falls within the orthographic projection of the first partition structure 200 on the base substrate BS. For example, the orthographic projection of the first electrode 120 on the base substrate BS falls within the orthographic projection of the first partition structure 200 on the base substrate BS.

[0107] For example, as shown in FIG6A , the display panel 01 further includes a pixel circuit 500. The pixel circuit 500 is located on a side of the first partition structure 200 close to the base substrate BS, and the pixel circuit 500 is electrically connected to the first electrode 120. For example, the pixel circuit 500 is configured to drive the light-emitting element 100 to emit light. For example, the pixel circuit 500 is configured to provide a driving current to drive the light-emitting element 100 to emit light. For example, the pixel circuit 500 may include a plurality of transistors and at least one capacitor (not shown in the figure), and the first electrode 120 may be electrically connected to the pixel circuit 500 through a connecting via N1. For example, the pixel circuit may adopt a 2T1C, 3T1C, or 7T1C design.

[0108] FIG. 6B is a schematic diagram of a light-emitting element having a Tandem structure.

[0109] For example, as shown in FIG6B , the charge generation layers (CGLs) between different light-emitting elements having a tandem structure are connected to each other. FIG6B shows a first electrode E1, a second electrode E2, a light coupling layer CPL, a hole transport layer HTL, a hole injection layer HIL, an electron transport layer ETL, an electron injection layer EIL, a hole blocking layer HBL, a P-type doped charge generation layer P-CGL, an N-type doped charge generation layer N-CGL, a light-emitting layer R, a light-emitting layer G, and a light-emitting layer B. As shown in FIG6B , the hole transport layer HTL includes a hole transport layer HTL-1 and a hole transport layer HTL-2. The electron transport layer ETL includes an electron transport layer ETL-1 and an electron transport layer ETL-2. The hole blocking layer HBL includes a hole blocking layer HBL-1 and a hole blocking layer HBL-2. For example, the hole transport layer HTL, the hole injection layer HIL, the electron transport layer ETL, the electron injection layer EIL, the hole blocking layer HBL, the P-type doped charge generation layer P-CGL, and the N-type doped charge generation layer N-CGL can serve as common layers of the light-emitting functional layer.

[0110] For example, as shown in FIG6B , the light-emitting layer R includes a first sub-light-emitting layer R1 and a first auxiliary light-emitting layer R2, the light-emitting layer G includes a second sub-light-emitting layer G1 and a second auxiliary light-emitting layer G2, and the light-emitting layer B includes a third sub-light-emitting layer B1 and a third auxiliary light-emitting layer B2. For example, the first auxiliary light-emitting layer R2, the second auxiliary light-emitting layer G2, and the third auxiliary light-emitting layer B2 can adjust the microcavity thickness and the carrier transmission rate to enable excitons to recombine and emit light in the light-emitting layer.

[0111] Fig. 7 is a structural diagram of the first area of ​​the display panel shown in Fig. 1 in an example. Fig. 8 is a partial enlarged schematic diagram of the M area in Fig. 7 .

[0112] For example, as shown in Figures 6A and 7, the pixel defining pattern 400 also includes a second opening 420, the portion of at least one layer of the light-emitting functional layer 110 located in the first opening 410 is a continuous portion, and at least a portion located in at least one second opening 420 is separated, and the portion of the first partition structure 200 exposed by the second opening 420 is configured to separate at least one film layer of the light-emitting functional layer 110.

[0113] For example, as shown in Figures 6A and 7, the portion of the first partition structure 200 exposed by the second opening 420 includes a partition portion 415. The partition portion 415 is provided between at least two adjacent sub-pixels 10, and at least one film layer in the light-emitting functional layer 110 is disconnected at the edge of the partition portion 415. Providing the partition portion 415 between adjacent sub-pixels 10 to isolate at least one film layer in the light-emitting functional layer 110 helps reduce the probability of crosstalk between adjacent sub-pixels 10. For example, the partition portion 415 refers to the structure of the first partition structure 200 exposed by the second opening 420.

[0114] In any embodiment of the present disclosure, "adjacent sub-pixels" refer to two sub-pixels with no other sub-pixels arranged between them. The adjacent sub-pixels may be two sub-pixels of the same color or two sub-pixels of different colors.

[0115] For example, as shown in FIG. 6A and FIG. 7 , at least a portion of the second electrode 120 is disconnected at an edge of the partition portion 415 .

[0116] For example, as shown in FIG7 , the display panel 01 includes a first sub-pixel 11, a second sub-pixel 12, and a third sub-pixel 13. For example, the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 are configured to emit light of different colors, but are not limited thereto. For example, any two of the first sub-pixel 11, the second sub-pixel 12, and the third sub-pixel 13 may also be configured to emit light of the same color. For example, the area of ​​the light-emitting region of a first sub-pixel 11 is greater than the area of ​​the light-emitting region of a second sub-pixel 12, and the area of ​​the light-emitting region of a first sub-pixel 11 is greater than the area of ​​the light-emitting region of a third sub-pixel 13. For example, the area of ​​the light-emitting region of a second sub-pixel 12 is greater than the area of ​​the light-emitting region of a third sub-pixel 13.

[0117] In some examples, as shown in FIG7 , the first subpixel 11 is a blue subpixel, one of the second subpixel 12 and the third subpixel 13 is a red subpixel, and the other of the second subpixel 12 and the third subpixel 13 is a green subpixel. FIG7 schematically illustrates that the second subpixel 12 is a red subpixel and the third subpixel 13 is a green subpixel, but the present invention is not limited thereto. For example, the second subpixel 12 may also be a green subpixel and the third subpixel 13 may be a red subpixel.

[0118] For example, as shown in Figures 6A and 7 , in a direction perpendicular to the base substrate BS, the first partition structure 200 includes a portion overlapping the pixel defining pattern 400, a portion overlapping the first opening 410, and a portion overlapping the second opening 420. The portion of the first partition structure 200 exposed by the second opening 420 is configured to isolate at least one film layer of the light-emitting functional layer 110. For example, the display panel 01 includes a first partition portion 1101, a second partition portion 1102, and a third partition portion 1103. For example, the first partition portion 1101 includes a portion overlapping with the light-emitting area of ​​the first sub-pixel 11 and a portion surrounding the light-emitting area of ​​the first sub-pixel 11; the second partition portion 1102 includes a portion overlapping with the light-emitting area of ​​the second sub-pixel 12 and a portion surrounding the light-emitting area of ​​the second sub-pixel 12; and the third partition portion 1103 includes a portion overlapping with the light-emitting area of ​​the third sub-pixel 13 and a portion surrounding the light-emitting area of ​​the third sub-pixel 13.

[0119] For example, as shown in FIG7 , the portion of the first partition portion 1101 exposed by the second opening 420 is a first defined partition portion 11011, and the portion of the second partition portion 1102 exposed by the second opening 420 is a second defined partition portion 11021. For example, the light-emitting functional layer 110 and the second electrode 130 of the first sub-pixel 11 are disconnected at the edge of the first defined partition portion 11011. The light-emitting functional layer 110 and the second electrode 130 of the second sub-pixel 12 are disconnected at the edge of the second defined partition portion 11021.

[0120] For example, as shown in FIG7 , only one first limiting partition 11011 or one second limiting partition 11021 is provided between two adjacent sub-pixels arranged along the U direction, and only one first limiting partition 11011 or one second limiting partition 11021 is provided between two adjacent sub-pixels arranged along the V direction, thereby facilitating balancing crosstalk and power consumption between adjacent sub-pixels. For example, both the U direction and the V direction are parallel to the substrate, and the U direction is perpendicular to the V direction.

[0121] For example, as shown in FIG7 , the portions of the first partitioning portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 are arranged in a spaced arrangement, and the portions of the second partitioning portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 are arranged in a spaced arrangement. The orthographic projections of the first defining partitioning portion 11011 and the second defining partitioning portion 11021 on the substrate are both non-closed rings. The third defining partitioning portion 1103 corresponding to the third sub-pixel 13 is not exposed by the second opening 420.

[0122] For example, as shown in FIG7 , the first sub-pixel 11 includes a first corner portion 011 formed by connecting two adjacent sides of its light-emitting area, a second corner portion 012 formed by connecting two adjacent sides of its light-emitting area, a third corner portion 013 formed by connecting two adjacent sides of its light-emitting area, and a fourth corner portion 014 formed by connecting two adjacent sides of its light-emitting area. The portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 only surrounds the portion of the two adjacent sides of its light-emitting area excluding the first corner portion 011, the portion of the two adjacent sides of its light-emitting area excluding the second corner portion 012, the portion of the two adjacent sides of its light-emitting area excluding the third corner portion 013, and the portion of the two adjacent sides of its light-emitting area excluding the fourth corner portion 014. This helps improve the continuity of the second electrode 130 (as shown in FIG6A ) and reduces power consumption of the display panel.

[0123] For example, as shown in FIG7 , the second sub-pixel 12 includes a fifth corner portion 015 formed by connecting two adjacent sides of its light-emitting area, a sixth corner portion 016 formed by connecting two adjacent sides of its light-emitting area, a seventh corner portion 017 formed by connecting two adjacent sides of its light-emitting area, and an eighth corner portion 018 formed by connecting two adjacent sides of its light-emitting area. The portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 only surrounds the portion of the two adjacent sides of its light-emitting area excluding the fifth corner portion 015, the portion of the two adjacent sides of its light-emitting area excluding the sixth corner portion 016, the portion of the two adjacent sides of its light-emitting area excluding the seventh corner portion 017, and the portion of the two adjacent sides of its light-emitting area excluding the eighth corner portion 018, thereby improving the continuity of the second electrode 130 (as shown in FIG6A ) and reducing power consumption of the display panel.

[0124] For example, as shown in FIG8 , the display panel includes a plurality of first connecting portions 2101 extending along a direction X and a plurality of second connecting portions 2102 extending along a direction Y. Both the first connecting portions 2101 and the second connecting portions 2102 are integrally formed with the first isolating portion 210. The first partitioning portion 1101 is connected to the second partitioning portion 1102 via the second connecting portions 2102, and the third isolating portion 1103 is connected to the second connecting portion 2102 via the first connecting portions 2101. The second connecting portions 2102 extend along a direction Y and are generally strip-shaped to reduce the risk of peeling and facilitate outgassing of the organic layer 020 located on the side of the first isolating portion 210 closer to the base substrate BS. For example, both directions X and Y are parallel to the base substrate BS, with direction X being perpendicular to direction Y. For example, direction X intersects direction U, and direction Y intersects direction V. For example, the angle between direction X and direction U is 45°, and the angle between direction Y and direction V is also 45°.

[0125] For example, as shown in Figure 8, the minimum distance between the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 or the second sub-pixel 12 on the substrate and the orthographic projection of the second connecting portion 2102 on the substrate is d1, and d1 is greater than 2 microns, for example, it can be 3 microns or 4 microns, so that under the condition of complying with the process deviation, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 can effectively isolate at least one film layer in the light-emitting functional layer, or the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 can effectively isolate at least one film layer in the light-emitting functional layer.

[0126] For example, as shown in Figure 8, the minimum distance between the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 or the second sub-pixel 12 on the substrate and the orthographic projection of the second connecting portion 2102 on the substrate is d2, and d2 is greater than 2 microns, for example, it can be 3 microns or 4 microns, so that under the condition of meeting the process deviation, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 can effectively isolate at least one film layer in the light-emitting functional layer, or the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 can effectively isolate at least one film layer in the light-emitting functional layer.

[0127] For example, as shown in Figure 8, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 is an open first partition ring, and the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 is an open second partition ring, and the average ring width of the first partition ring and the average ring width of the second partition ring are both d3, and d3 is greater than 3 microns, for example, it can be 4 microns or 5 microns, so that the positive projection area of ​​the portion of the first partition portion 1101 and the second partition portion 1102 exposed by the second opening 420 on the substrate is large enough to meet the requirement of isolating at least one film layer in the light-emitting functional layer.

[0128] For example, as shown in FIG8 , the orthographic projection of the second opening 420 corresponding to the first sub-pixel 11 on the substrate is an open ring, and the difference between the average ring width of the ring and the average ring width d3 of the first partitioned ring is d4, and d4 is greater than 3 microns, for example, 4 microns or 5 microns. For example, the orthographic projection of the second opening 420 corresponding to the second sub-pixel 12 on the substrate is an open ring, and the difference between the average ring width of the ring and the average ring width d3 of the second partitioned ring is also d4. For example, the orthographic projection of the second opening 420 on the substrate is an open ring, and the ring width of the ring is d3 + d4, and is greater than 10 microns, for example, 11 microns, 12 microns, or 13 microns.

[0129] Such a setting can make the second opening 420 have a sufficiently large opening area, which is conducive to making the portion of the first partition portion 1101 exposed by the second opening 420 isolate at least one film layer in the light-emitting functional layer, and is conducive to making the portion of the second partition portion 1102 exposed by the second opening 420 isolate at least one film layer in the light-emitting functional layer.

[0130] For example, as shown in Figure 8, the third partition portion 1103 corresponding to the third sub-pixel 13 is not exposed by the second opening 420, and the portion of the third partition portion 1103 that exceeds the first electrode 120 of the third sub-pixel 13 has a roughly ring-shaped positive projection on the substrate. The average ring width of the ring is d5, and d5 is not greater than 3 microns, for example, it can be 2 microns, 1 micron or 0.5 microns, so as to improve the continuity of the second electrode 130 (as shown in Figure 6A).

[0131] For example, as shown in Figures 7 and 8, the portion of the first partition portion 1101 corresponding to the first sub-pixel 11 exposed by the second opening 420 includes multiple sub-portions spaced apart, such as a first sub-portion 1001, a second sub-portion 1002, a third sub-portion 1003, and a fourth sub-portion 1004. The minimum distance between the second openings 420 corresponding to adjacent sub-portions (e.g., the first sub-portion 1001 and the second sub-portion 1002) is d6, and d6 is not less than 20 microns, and can be, for example, 22 microns, 24 microns, or 25 microns. For example, the portion of the second partition portion 1102 corresponding to the second sub-pixel 12 exposed by the second opening 420 also includes multiple sub-portions spaced apart, and the minimum distance between the second openings 420 corresponding to adjacent sub-portions is also d6. This arrangement helps ensure the continuity of the second electrode 130 (as shown in Figure 6A), enables good overlap between the second electrodes 130 of adjacent sub-pixels 10, and helps reduce power consumption.

[0132] For example, as shown in Figures 6A and 7, a spacer 800 may be further provided on the side of the pixel defining pattern 400 away from the base substrate BS. The spacer 800 may serve as a supporting layer and be configured to support an evaporation mask, such as an FMM (high-precision mask), for fabricating the light-emitting functional layer 110. For example, the orthographic projection of the spacer 800 on the base substrate BS falls within the orthographic projection of the second connecting portion 2102 on the base substrate BS, and the spacer 800 is spaced apart from the connecting via N1. For example, the minimum distance between the spacer 800 and the connecting via N1 is greater than 3 microns, and may be 3.5 microns, 4 microns, or 5 microns to reduce the impact on the pixel circuit 500.

[0133] FIG9 is a schematic block diagram of a display device according to at least one embodiment of the present disclosure.

[0134] As shown in Fig. 9, the display device 1000 includes a display panel 001. The display panel 001 may be the display panel in any of the above embodiments.

[0135] For example, the display device 1000 may be an organic light emitting diode display device.

[0136] For example, the display device 1000 may further include a cover plate located on the light-emitting side of the display panel 1001 .

[0137] For example, the display device 1000 may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc., but the present embodiment is not limited thereto.

[0138] For example, the display device 1000 may be a medium or large-sized smart handheld display device (NB) or a touch screen display device (TPC), and also has broad application potential in the field of foldable products.

[0139] 10 to 14 are flow charts of a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0140] At least one embodiment of the present disclosure further provides a method for manufacturing a display panel. For example, the method is applicable to the display panel described in any of the above embodiments.

[0141] As shown in Figure 10, the display panel 0001 includes a first area A1, a second area A2, and a third area A3 located between the first and second areas A1 and A2. The first area A1 is configured for display, and the second area A2 is configured to transmit light. The first area A1 is located on at least one side of the second area A2. For example, the first area A1 is a display area configured for display. The second area A2 is a hollow area configured to transmit light. For example, hardware such as a photosensor can be located in the second area A2.

[0142] As shown in FIG10 and FIG11 , the manufacturing method of the display panel 0001 includes:

[0143] An organic material layer 020 is formed on the base substrate BS, and the organic material layer 020 is patterned to form an organic layer pattern 0200 in the third area A3.

[0144] Then, as shown in Figures 12 and 13, an inorganic material layer 010 is formed on the organic layer pattern 0200, and the inorganic material layer 010 is patterned to form a first partition structure 200 in the first area A1 and a second partition structure 300 in the third area A3. For example, as shown in Figure 14, after the inorganic material layer 010 is patterned, a first isolation portion 210 is formed in the first area A1, and a first isolation member 310 is formed in the third area A3. Thus, at least a portion of the inorganic material layer 010 located in the first area A1 is patterned to form the first isolation portion 210, and at least a portion of the inorganic material layer 010 located in the third area A3 is patterned to form the first isolation member 310.

[0145] As shown in FIG13 , the first partition structure 200 and the second partition structure 300 are each configured to partition at least one layer of the light-emitting functional layer 110. The first partition structure 200 includes a first isolating portion 210 and a second isolating portion 220 arranged in a stacked manner. The first isolating portion 210 is located on a side of the second isolating portion 220 away from the base substrate BS. The first isolating portion 210 includes a first protrusion 201 that protrudes relative to an edge of the second isolating portion 220. The second partition structure 300 includes a first isolating member 310 and a second isolating member 320 arranged in a stacked manner. The first isolating member 310 is located on a side of the second isolating member 320 away from the base substrate BS. The first isolating member 310 includes a second protrusion 301 that protrudes relative to at least a portion of an edge of the second isolating member 320. For example, the second protrusion 301 protrudes relative to an edge of the portion of the second isolating member 320 that is adjacent to and in contact with the first isolating member 310.

[0146] The manufacturing method of the display panel proposed in the embodiment of the present disclosure is simple and easy to implement. The first isolation portion 210 and the first isolation member 310 can be patterned through the same mask, thereby simplifying the manufacturing process and making it easy to control process deviations. At the same time, the structures of the first partition structure 200 and the second partition structure 300 can also be simplified, so that the first partition structure 200 located in the first display area A1 and the second partition structure 300 located in the third area A3 have good structural uniformity.

[0147] For example, as shown in FIG12 to FIG14 , an inorganic material layer 010 is formed on the organic layer pattern 0200 , and the inorganic material layer 010 is patterned to form a first partition structure 200 in the first area A1 and a second partition structure 300 in the third area A3 , including:

[0148] First, as shown in FIG12 and FIG14 , the inorganic material layer 010 is patterned to form a first partition structure 200 in the first area A1 and an initial partition structure 3000 in the third area A3. The initial partition structure 3000 includes a first spacer 310 and an initial spacer 3200. The first spacer 310 and the initial spacer 3200 are stacked, and the edge of the first spacer 310 protrudes relative to at least a portion of the edge of the initial spacer 3200. For example, the portion of the first spacer 310 that protrudes relative to at least a portion of the edge of the initial spacer 3200 is an initial protrusion 3010. The projection of the initial protrusion 3010 on the base substrate BS is annular, and the average width of the annular shape is D1.

[0149] Then, as shown in Figures 13 and 14, the initial isolation member 3200 in the third area A3 in Figure 14 is further etched to form the second isolation structure 300 in Figure 13. For example, an additional mask can be provided in the third area A3 to etch the initial isolation member 3200, so that at least the portion of the initial isolation member 3200 directly below the first isolation member 310 is etched. For example, the portion of the first isolation member 310 that protrudes from at least a portion of the edge of the second isolation member 320 is a second protrusion 301. The orthographic projection of the second protrusion 301 on the substrate BS is annular, and the average width of the ring is D2. As shown in Figures 13 and 14, D2 is greater than D1. Thus, by further etching the initial isolation member 3200 in the third area A3, the second isolation structure 300 can have a significant "undercut" structure, thereby enhancing isolation capability. For example, in some embodiments, in the first region A1, the first partition structure 200 only partitions a portion of the film layers in the light-emitting functional layer, but does not partition the second electrode. In the third region A3, the second partition structure 300 partitions all film layers in the light-emitting functional layer and also partitions the second electrode, thereby providing a stronger partitioning capability.

[0150] For example, as shown in FIG10 , the manufacturing method of the display panel provided by the embodiment of the present disclosure may include: preparing a base substrate BS on a glass carrier. For example, the base substrate BS may be a flexible base substrate. For example, forming the base substrate BS may include sequentially forming a first flexible material layer, a first inorganic material layer, a semiconductor layer, a second flexible material layer, and a second inorganic material layer stacked on a glass carrier. The materials of the first flexible material layer and the second flexible material layer are polyimide (PI), polyethylene terephthalate (PET), or a surface-treated polymer soft film. The materials of the first inorganic material layer and the second inorganic material layer are silicon nitride (SiNx) or silicon oxide (SiOx), etc., which are used to improve the water and oxygen resistance of the base substrate. The first inorganic material layer and the second inorganic material layer are also referred to as barrier layers.

[0151] For example, as shown in FIG10 , the method for manufacturing a display panel provided by an embodiment of the present disclosure may further include: forming a driving structure layer of a pixel circuit on a base substrate BS. The driving structure layer includes a plurality of pixel circuits 500, each pixel circuit 500 including a plurality of transistors and at least one storage capacitor. For example, the pixel circuit 500 may adopt a 2T1C, 3T1C, or 7T1C design. For example, in some embodiments, forming the driving structure layer may include: sequentially depositing a first insulating film and an active layer film on the base substrate BS, patterning the active layer film through a patterning process to form a first insulating layer covering the entire base substrate BS, and an active layer pattern disposed on the first insulating layer, the active layer pattern comprising at least an active layer. For example, sequentially depositing a second insulating film and a first metal film, patterning the first metal film through a patterning process to form a second insulating layer covering the active layer pattern, and a first gate metal layer pattern disposed on the second insulating layer, the first gate metal layer pattern comprising at least a gate electrode and a first capacitor electrode. For example, a third insulating film and a second metal film are sequentially deposited, and the second metal film is patterned through a composition process to form a third insulating layer covering the first gate metal layer, and a second gate metal layer pattern disposed on the third insulating layer, wherein the second gate metal layer pattern includes at least a second capacitor electrode, and the position of the second capacitor electrode corresponds to the position of the first capacitor electrode. Subsequently, a fourth insulating film is deposited and patterned through a composition process to form a fourth insulating layer covering the second gate metal layer, wherein at least two vias are provided on the fourth insulating layer, and the fourth insulating layer, the third insulating layer, and the second insulating layer within the two vias are etched away to expose the surface of the active layer of the active layer pattern. Subsequently, a third metal film is deposited and patterned through a composition process to form a source-drain metal layer pattern on the fourth insulating layer, wherein the source-drain metal layer pattern includes at least a source electrode and a drain electrode located in the display area. The source electrode and the drain electrode can be connected to the active layer in the active layer pattern through the vias, respectively.

[0152] For example, the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer may be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride (SiON), and may be a single layer, a multilayer or a composite layer. For example, the first insulating layer may be a buffer layer for improving the water and oxygen resistance of the substrate BS. For example, the second insulating layer and the third insulating layer may be gate insulating (GI) layers. For example, the fourth insulating layer may be an interlayer insulating (ILD) layer. For example, the first metal film, the second metal film and the third metal film may be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti) and molybdenum (Mo), or alloy materials of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and may be a single layer structure or a multilayer composite structure, such as Ti / Al / Ti. For example, the active layer thin film adopts one or more materials such as amorphous indium gallium zinc oxide material (a-IGZO), zinc oxynitride (ZnON), indium zinc tin oxide (IZTO), amorphous silicon (a-Si), polycrystalline silicon (p-Si), sexithiophene, polythiophene, etc., that is, the present disclosure is applicable to transistors manufactured based on oxide technology, silicon technology and organic technology.

[0153] For example, as shown in FIG2 , after forming the first partition structure 200 and the second partition structure 300, the method for manufacturing a display panel provided by an embodiment of the present disclosure further includes: patterning a first electrode 120 on the first partition structure 200. For example, the first electrode 120 can be made of a metal material, such as any one or more of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or an alloy material of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). It can be a single-layer structure, a multi-layer composite structure, such as Ti / Al / Ti, or a stack structure formed by a metal and a transparent conductive material, such as a reflective material such as ITO / Ag / ITO or Mo / AlNd / ITO. For example, the first electrode 120 is electrically connected to the pixel circuit 500 through a connecting via N1.

[0154] For example, as shown in FIG2 , after forming the first electrode 120, a pixel-defining pattern 400 can be formed. For example, a pixel-defining film is coated on the base substrate BS on which the aforementioned pattern is formed, and the pixel-defining pattern 400 is formed through masking, exposure, and development processes. For example, the pixel-defining pattern 400 in the first area A1 includes a first opening 410 and a second opening 420 (as shown in FIG7 ). The pixel-defining film within the first opening 410 and the second opening 420 is developed away. The first opening 410 exposes at least a portion of the surface of the first electrode 120 of the plurality of sub-pixels 10, and the second opening 420 exposes the first partition structure 200.

[0155] For example, as shown in Figures 2 and 7, after forming the pixel defining pattern 400, spacers 800 can be formed on the pixel defining pattern 400. For example, a thin film of organic material is coated on the base substrate BS on which the aforementioned pattern is formed, and the spacers are formed through masking, exposure, and development processes. The spacers can serve as a supporting layer, configured to support the FMM (high-precision mask) during the evaporation process.

[0156] For example, as shown in Figures 2 and 7, after forming the spacer 800, the light-emitting functional layer 110 and the second electrode 130 are sequentially formed. For example, the second electrode 130 can be a transparent cathode. The light-emitting functional layer 110 can emit light from the side away from the substrate BS through the transparent cathode, achieving top emission. For example, the second electrode 130 can be made of any one or more of magnesium (Mg), silver (Ag), and aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material, such as indium tin oxide (ITO), or a multilayer composite structure of a metal and a transparent conductive material.

[0157] For example, as shown in FIG2 , forming the light-emitting functional layer 110 may include: sequentially evaporating a hole injection layer and a hole transport layer using an open mask; sequentially evaporating a first light-emitting layer 111 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer, or a red light-emitting layer using a FMM; sequentially evaporating an electron transport layer, a charge generation layer 113, and a hole transport layer using an open mask; sequentially evaporating a second light-emitting layer 112 emitting light of different colors, such as a blue light-emitting layer, a green light-emitting layer, or a red light-emitting layer using an FMM; and sequentially evaporating an electron transport layer, a second electrode 130, and a light coupling layer using an open mask. For example, the hole injection layer, the hole transport layer, the electron transport layer, the charge generation layer, the second electrode 130, and the light coupling layer are all common layers for multiple sub-pixels.

[0158] For example, as shown in Figures 2 and 7, in the first area A1, the light-emitting functional layer 110 is formed to be disconnected at the edge of the first partition structure 200, thereby reducing the risk of crosstalk between adjacent sub-pixels 10. In the third area A3, the light-emitting functional layer 110 is formed to be disconnected at the edge of the second partition structure 300, thereby further reducing the risk of crosstalk between sub-pixels 10 located near the edge of the first area A1.

[0159] For example, after forming the second electrode, the method for manufacturing a display panel further includes forming an encapsulation layer. The encapsulation layer may include a stacked first encapsulation layer, a second encapsulation layer, and a third encapsulation layer. The first encapsulation layer is made of an inorganic material and covers the second electrode in the display area. The second encapsulation layer is made of an organic material. The third encapsulation layer is made of an inorganic material and covers the first and second encapsulation layers. However, this embodiment is not limited to this. For example, the encapsulation layer may also adopt a five-layer structure of inorganic / organic / inorganic / organic / inorganic.

[0160] There are a few points to note:

[0161] (1) The drawings of the embodiments of the present disclosure only involve structures related to the embodiments of the present disclosure, and other structures can refer to general designs.

[0162] (2) In the absence of conflict, features in the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0163] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure. The scope of protection of the present disclosure is determined by the appended claims.

Claims

1. A display panel, comprising: A first area is configured to display; a second region configured to transmit light, the first region being located on at least one side of the second region; a third area, located between the first area and the second area; A plurality of sub-pixels are located in the first region, and each of at least some of the sub-pixels includes a light-emitting functional layer, and the light-emitting functional layer includes a plurality of film layers; A base substrate, and an inorganic layer located on the base substrate; a first partition structure, located on the base substrate and between adjacent sub-pixels in the first region, the first partition structure comprising a first isolation portion and a second isolation portion which are stacked, the first isolation portion being located on a side of the second isolation portion away from the base substrate, and the first isolation portion comprising a first protrusion protruding relative to an edge of the second isolation portion; a second partition structure, located on the base substrate and located in the third region, the second partition structure comprising a first spacer and a second spacer which are stacked, the first spacer being located on a side of the second spacer away from the base substrate, and the first spacer comprising a second protrusion protruding relative to at least a portion of an edge of the second spacer; The first partition structure and the second partition structure are both configured to isolate at least one layer of the light-emitting functional layer, at least a portion of the inorganic layer located in the first region serves as the first isolation portion, and at least a portion of the inorganic layer located in the third region serves as the first isolation member.

2. The display panel according to claim 1, further comprising an organic layer located on the base substrate, wherein the inorganic layer is located on a side of the organic layer away from the base substrate. in, At least a portion of the organic layer located in the first region serves as the second isolation portion, and at least a portion of the organic layer located in the third region serves as at least a portion of the second isolation member.

3. The display panel according to claim 1 or 2, wherein: The orthographic projection of the first protrusion of the first isolation part on the substrate is a first ring shape, and the orthographic projection of the second protrusion of the first isolation part on the substrate is a second ring shape, and the average ring width of the first ring shape is smaller than the average ring width of the second ring shape.

4. The display panel according to claim 3, wherein: The average ring width of the second ring is 1.2 to 3 times the average ring width of the first ring. 5 . The display panel according to claim 1 , wherein in a direction perpendicular to the base substrate, a thickness of the first isolation portion is substantially equal to a thickness of the first isolation member. 6 .

6. The display panel according to claim 2, wherein: In a direction perpendicular to the base substrate, a maximum thickness of a portion of the organic layer located in the first region is greater than or equal to a maximum thickness of a portion of the organic layer located in the third region.

7. The display panel according to claim 6, wherein: The orthographic projection of the first isolation member of the second partition structure on the base substrate falls within the orthographic projection of the second isolation member of the second partition structure on the base substrate.

8. The display panel according to claim 6 or 7, wherein: The second isolation member includes a first sub-isolation portion and a second sub-isolation portion, wherein the first sub-isolation portion is located on a side of the second sub-isolation portion away from the base substrate. An edge of the first spacer protrudes relative to an edge of the first sub-spacer, and an edge of the second sub-spacer protrudes relative to an edge of the first spacer or is flush with an edge of the first spacer.

9. The display panel according to claim 2, wherein: The second isolation member includes at least one metal structure layer, and at least a portion of the organic layer located in the third region covers a surface of the at least one metal structure layer.

10. The display panel according to claim 9, wherein: The at least one metal structure layer includes a first metal structure and a second metal structure stacked in sequence along a direction perpendicular to the base substrate, the first metal structure is closer to the first isolation member than the second metal structure, and an edge of the second metal structure protrudes relative to an edge of the first metal structure.

11. The display panel according to claim 10, wherein: The first metal structure and the first isolation member are in contact with each other, and an orthographic projection of the first metal structure on the base substrate falls within an orthographic projection of the first isolation member on the base substrate.

12. The display panel according to claim 11, wherein: A thickness of a portion of the organic layer covering a surface of the first metal structure is smaller than a thickness of a portion of the organic layer covering a surface of the second metal structure.

13. The display panel according to claim 10, wherein: The second isolation member further includes an insulating structure, the insulating structure being located between the first metal structure and the second metal structure so as to insulate the first metal structure from the second metal structure, and the insulating structure including an inorganic material.

14. The display panel according to any one of claims 9 to 13, wherein: In a direction perpendicular to the base substrate, a maximum thickness of the second spacer is 1 / 3 to 1 / 3 of a maximum thickness of a portion of the organic layer located in the first region.

15. The display panel according to any one of claims 10 to 14, further comprising: a pixel defining pattern located in the first region and on the substrate, wherein the pixel defining pattern comprises a plurality of first openings to define a light emitting area of ​​at least part of the sub-pixels, The first partition structure is located between the light-emitting functional layer and the base substrate, and the first partition structure includes a portion surrounding the light-emitting area of ​​each sub-pixel in the at least part of the sub-pixels. The pixel defining pattern further includes a second opening, a portion of at least one layer of the light-emitting functional layer located in the first opening is a continuous portion, and at least a portion located in at least one second opening is partitioned, and a portion of the first partition structure exposed by the second opening is configured to partition the at least one layer of the light-emitting functional layer; Each of the at least some of the sub-pixels further comprises: a first electrode and a second electrode located on both sides of the light-emitting functional layer in a direction perpendicular to the substrate, the first electrode being located between the light-emitting functional layer and the substrate, the pixel defining pattern being located on a side of the first electrode away from the substrate, and the first partition structure being located between the first electrode and the substrate. The display panel further includes a pixel circuit, which is located on a side of the first partition structure close to the base substrate, and is electrically connected to the first electrode.

16. The display panel according to claim 15, further comprising a data line and a gate line, which are located on the base substrate and in the first area, the data line and the gate line are electrically connected to the pixel circuit respectively, the data line is configured to provide a data signal to the pixel circuit, and the gate line is configured to provide a scanning signal to the pixel circuit. in, The first metal structure is disposed in the same layer as the data line, and the second metal structure is disposed in the same layer as the gate line.

17. The display panel according to claim 8, wherein: In a direction perpendicular to the base substrate, the thickness of the first sub-isolation portion is 1 / 4 to 1 / 3 of the thickness of the second sub-isolation portion.

18. A display device comprising the display panel according to any one of claims 1 to 17.

19. A method for manufacturing a display panel, wherein: The display panel includes a first area, a second area, and a third area located between the first area and the second area, the first area is configured to display, the second area is configured to transmit light, and the first area is located on at least one side of the second area; The production method comprises: forming an organic material layer on the base substrate, and patterning the organic material layer to form an organic layer pattern in the third region; forming an inorganic material layer on the organic layer pattern, and patterning the inorganic material layer to form a first partition structure in the first region and a second partition structure in the third region, The first partition structure includes a first isolation portion and a second isolation portion which are stacked, the first isolation portion is located on a side of the second isolation portion away from the substrate, the first isolation portion includes a first protrusion, and the first protrusion protrudes relative to an edge of the second isolation portion; the second partition structure includes a first isolation member and a second isolation member which are stacked, the first isolation member is located on a side of the second isolation member away from the substrate, the first isolation member includes a second protrusion, and the second protrusion protrudes relative to at least a portion of the edge of the second isolation member, The first partition structure and the second partition structure are both configured to isolate at least one layer of the light-emitting functional layer, at least a portion of the inorganic material layer located in the first region is patterned to form the first isolation portion, and at least a portion of the inorganic material layer located in the third region is patterned to form the first isolation member.

20. The method according to claim 19, wherein: An inorganic material layer is formed on the organic layer pattern, and the inorganic material layer is patterned to form a first partition structure in the first region and a second partition structure in the third region, comprising: Patterning the inorganic material layer to form the first partition structure in the first region and to form an initial partition structure in the third region, wherein the initial partition structure includes the first spacer and the second initial spacer, the first spacer and the second initial spacer are stacked, and an edge of the first spacer protrudes relative to at least a portion of an edge of the second initial spacer; and The second initial isolation member in the third region is further etched to form the second partition structure.

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