Packaging structure and radio frequency front-end module

WO2025067032A1PCT designated stage expired Publication Date: 2025-04-03RADROCK (CHONGQING) TECHNOLOGY CO LTD
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Patent Information

Application Number
PCT/CN2024/119841
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-28
Filing Date
2024-09-19
Publication Date
2025-04-03

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    Figure CN2024119841_03042025_PF_FP_ABST
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Abstract

The present application relates to the technical field of packaging, and particularly relates to a packaging structure and a radio frequency front-end module. A first filter chip forms a cavity by means of a supporting structure and a first adhesive material, a first adhesive guide channel of a first passive component is filled with a first blocking material, and a second adhesive guide channel of a second passive component is filled with a second blocking material, thereby improving the overall packaging reliability.
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Citation Information

Patent Citations

  • Module structure of cavity chip device and packaging method

    CN115020400A

  • Radio frequency front-end module packaging structure

    CN218548411U

  • Packaging structure and radio frequency front-end module

    CN221282098U

  • Method for manufacturing module

    JP2023028625A

  • Module package and production method

    US20130168876A1