Resin material supply device, resin material supply method, resin material supply program, device for manufacturing resin molded article, and method for manufacturing resin molded article

Abstract

A resin material supply device according to the present invention discharges a liquid resin material to an object along a predetermined path, the resin material supply device comprising: a storage portion that stores the resin material and has a discharge portion for discharging the resin material; an extrusion member that is inserted into the storage portion to push out the resin material from the discharge portion; a movement mechanism for moving the storage portion relative to the object in an in-plane direction of a surface of the object; and a control unit for controlling the extrusion member and the movement mechanism. The control unit corrects the movement speed of the storage portion on the basis of a discharge amount per unit time of the resin material discharged from the storage portion and a target discharge amount per unit time of the resin material.

Description

Resin material supplying device, resin material supplying method, resin material supplying program, resin molded product manufacturing device, and resin molded product manufacturing method

[0001] The present invention relates to a resin material supplying device, a resin material supplying method, a resin material supplying program, a resin molded product manufacturing device, and a resin molded product manufacturing method.

[0002] Patent Document 1 discloses a method for producing a resin molded product by encapsulating a semiconductor substrate with a resin material. Liquid encapsulation resin material is applied to a release film using a dispenser, which is then placed on the lower die of a molding die. Meanwhile, a semiconductor substrate before resin encapsulation is placed in the upper die of the molding die, and the die is then clamped in this state. As a result, chips mounted on the semiconductor substrate are encapsulated with resin within the cavity of the lower die, resulting in a resin-encapsulated substrate.

[0003] Japanese Patent Application Laid-Open No. 2022-13023

[0004] In Patent Document 1, a liquid resin material is applied to a predetermined path on a release film by discharging the liquid resin material from the dispenser and moving the dispenser horizontally. The movement speed of the dispenser is set to match the dispensing speed of the liquid resin material. However, since the viscosity and compressibility of the liquid resin material vary due to, for example, temperature changes while the dispenser is dispensing, it is not easy to apply the liquid resin material uniformly throughout the entire path. This can lead to variations in the amount of liquid resin material applied within the path, which can result in variations in the distribution of the amount of liquid resin material applied onto the release film.

[0005] The present invention has been made to solve this problem, and aims to provide a resin material supplying device, a resin material supplying method, a resin material supplying program, a resin molded product manufacturing device, and a resin molded product manufacturing method that can suppress variation in the amount of liquid resin material applied along a specified path.

[0006] The resin material supplying device of the present invention is a resin material supplying device for discharging liquid resin material onto an object along a predetermined path, and comprises: a storage section for storing the resin material and having a discharge section for discharging the resin material; an extrusion member inserted into the storage section for extruding the resin material from the discharge section; a moving mechanism for moving the storage section relative to the object in the in-plane direction of the application surface; and a control section for controlling the extrusion member and the moving mechanism, and the control section corrects the movement speed of the storage section based on the discharge amount of the resin material discharged from the storage section per unit time and a target discharge amount of the resin material per unit time.

[0007] The resin material supplying method of the present invention is a resin material supplying method in which a resin material is discharged along a predetermined path onto an object by a resin material supplying device having a storage section that stores liquid resin material and has a discharge section that discharges the resin material, an extrusion member that is arranged within the storage section and that extrudes the resin material from the discharge section, a moving mechanism that moves the storage section, and a control section that controls the extrusion member and the moving mechanism, the method comprising: a first step of setting the movement speed of the storage section and the path; a second step of detecting the amount of resin material discharged per unit time when the storage section is moved relative to the in-plane direction of the application surface of the object at the movement speed; and a third step of correcting the movement speed of the storage section based on the detected discharge amount per unit time and a target discharge amount of resin material per unit time, and the second step and the third step are repeated until the storage section moves to the end point of the path.

[0008] The resin material supply program of the present invention is a resin material supply program that discharges resin material along a predetermined path onto an object using a resin material supply device that has a storage section that stores liquid resin material and has a discharge section that discharges the resin material, an extrusion member that is arranged within the storage section and that extrudes the resin material from the discharge section, a movement mechanism that moves the storage section, and a control section that controls the extrusion member and the movement mechanism.The program causes the control section to execute a first step of setting the movement speed of the storage section and the path, a second step of detecting the discharge amount of the resin material per unit time when the storage section is moved relatively in the in-plane direction of the application surface of the object at the movement speed, and a third step of correcting the movement speed of the storage section based on the detected discharge amount per unit time and a target discharge amount of the resin material per unit time, and repeats the second and third steps until the storage section moves to the end point of the path.

[0009] The apparatus for manufacturing resin molded products according to the present invention has the above-mentioned resin material supply device, and is equipped with a resin material supply module that supplies liquid resin material onto a film using the resin material supply device, and a press module that has an upper mold and a lower mold.The film to which the resin material has been supplied and a substrate are placed between the upper mold and the lower mold, and a resin molded product is manufactured in which the substrate is sealed with resin material by clamping the molds.

[0010] The method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the above-mentioned resin molded product manufacturing apparatus, and includes the steps of supplying liquid resin material onto a film using a resin material supply device, placing the film to which the resin material has been supplied and a substrate between the upper mold and the lower mold, and clamping the upper mold and the lower mold to manufacture a resin molded product in which the substrate is sealed with resin material.

[0011] According to the present invention, it is possible to suppress variations in the amount of liquid resin material applied along a predetermined path.

[0012] FIG. 1 is a plan view schematically showing a resin molding device. FIG. 1 is a cross-sectional view of a dispenser. FIG. 1 is a cross-sectional view showing the operation of the dispenser. FIG. 1 is a cross-sectional view showing the operation of the dispenser. FIG. 2 is a cross-sectional view of a press module. FIG. 2 is a plan view showing an application path of liquid resin material discharged from a dispenser onto a release film. FIG. 3 is a graph showing the relationship between the movement time and the movement distance of the dispenser. FIG. 4 is a graph showing the relationship between the dispensing time and the dispensing amount of liquid resin material. FIG. 4 is a block diagram showing control of the movement speed of the dispenser. FIG. 5 is a graph showing the relationship between the movement distance of the dispenser and the weight of the discharged liquid resin material. FIG. 5 is a flowchart showing the flow of supplying liquid resin material. FIG. 6 is a plan view showing another example of the application path of liquid resin material discharged from a dispenser onto a release film. FIG. 7 is a flowchart showing the flow of supplying liquid resin material by dripping and draining.

[0013] Hereinafter, an embodiment of a resin material supplying device and a resin molding device including the same according to the present invention will be described with reference to the drawings. Fig. 1 is a schematic plan view of the resin material supplying device according to this embodiment. Note that the following description may be made according to the directions indicated in the drawings. However, the present invention is not limited to these directions.

[0014] 1, the resin molding apparatus according to this embodiment includes a resin material supply module 2, multiple (three in this embodiment) press modules 3, a substrate module 4, a control unit 5, and a display unit 6. Each of the modules 2 to 4 can be independently attached or detached. Note that although the press modules 3 in this embodiment are configured with three modules, the apparatus may be configured with one or more modules.

[0015] <1-1. Resin Material Supply Module> The resin material supply module 2 has a resin material supply mechanism 21 that supplies liquid resin material for resin molding. Here, liquid resin material includes not only resin materials that are liquid at room temperature (room temperature) but also resin materials that melt from solid to liquid when heated, and may be thermoplastic or thermosetting resin materials. Thermosetting resin materials are liquid at room temperature, but their viscosity decreases when heated, and they polymerize and harden when further heated. The liquid resin material in this embodiment is preferably a thermosetting resin material with a relatively high viscosity that does not flow quickly at room temperature. The viscosity of the liquid resin material is preferably, for example, 100 to 200 Pa·s.

[0016] As shown in Figure 1, the resin material supply mechanism 21 includes a table 21A on which a release film F is placed, a discharge mechanism 21B that discharges the resin material, and a weight detection unit 25. The table 21A is provided with a release film supply mechanism 22 that feeds the release film F wound on a reel and cuts and separates the release film F. The separated release film F is held by suction on the upper surface of the table 21A by a suction mechanism. A frame-shaped member 21C is placed on the upper surface of the release film F (see Figure 2). A space corresponding to a lower mold cavity MC, which will be described later, is formed in this frame-shaped member 21C.

[0017] 2, the discharge mechanism 21B has a dispenser 24. The dispenser 24 has a cartridge 240 that contains a liquid resin material and a pusher member 244 for pushing out the liquid resin material contained in the cartridge 240. The pusher member 244 may be a plunger. The cartridge 240 has a cylindrical outer tube 241 made of a hard material such as metal, a cylindrical inner tube 242 that is housed in the outer tube 241 and made of an elastically deformable material such as plastic and that contains the liquid resin material, and a lid 243 that is placed on the surface of the liquid resin material inside the inner tube 242.

[0018] The extrusion member 244 is configured to move vertically by the servo motor 28. Although there may be a gap between the extrusion member 244 and the inner tube 242, a lid 243 provided on the cartridge 240 serves to seal the inner tube 242 to prevent leakage of the liquid resin material. The lid 243 is movable in the axial direction of the inner tube 242 when pressed by the extrusion member 244. A through-hole 245 is formed in the lower part of the outer tube 241, and a lower end 249 of the inner tube 242 protrudes downward from this through-hole 245. The lower end 249 of the inner tube 242 protruding from the outer tube 241 is provided with a discharge portion 246 having a discharge port. The discharge portion 246 may be formed by attaching a tube made of a soft material to the lower end 249. When the extrusion member 244 presses the lid 243 toward the discharge portion 246, the liquid resin material is discharged from the discharge port of the discharge portion 246. A chuck 247 is provided at a discharge portion 246 at a lower end 249 of the inner cylinder 242 that protrudes from the outer cylinder 241. This chuck 247 is capable of pressing the discharge portion 246 from the outside in the radial direction, thereby closing the discharge portion 246. In other words, it is possible to stop the liquid resin material from being discharged from the discharge port.

[0019] When the extrusion member 244 moves downward, the liquid resin material is extruded from the discharge portion 246, and the liquid resin material is applied onto the release film F. As shown in FIG. 6 , which will be described later, the liquid resin material is applied to a path R on the release film F, but generally, the liquid resin material contained in one cartridge 240 can be applied to multiple paths R. That is, the extrusion member 244 moves downward within the cartridge 240 multiple times, each time a predetermined distance, and each downward movement can apply the liquid resin material to one path R. Therefore, when the extrusion member 244 moves downward once before the liquid resin material is used up and application of the liquid resin material to one path R is completed, some liquid resin material remains in the cartridge 240. Therefore, pressure is applied to the remaining liquid resin material by the extrusion member 244, and as a result, the liquid resin material remaining mainly at the lower end 249 of the inner cylinder 242 may be discharged from the discharge part 246 even if the extrusion member 244 has not moved downward. Hereinafter, this phenomenon may be referred to as dripping.

[0020] 4, when the chuck 247 presses the discharge portion 246 at the lower end 249 of the inner cylinder 242, the liquid resin material remaining near the lower end 249 is pushed out and discharged onto the release film F (hereinafter, this may be referred to as "draining"). The amount of liquid resin material discharged due to dripping and draining can be calculated in advance by conducting a characteristic test of the dispenser 24 in advance.

[0021] The dispenser 24 is configured to be freely movable in the horizontal direction (in-plane direction) and up and down on the placement surface of the release film F by a movement mechanism having a servo motor or the like. More specifically, a flange 2411 protruding radially outward is provided at the upper end of the outer cylinder 241 of the cartridge 240, and a plurality of locking members 27 are locked to this flange 2411, thereby supporting the cartridge 240 from above. The locking members 27 are moved horizontally and up and down by the servo motor, thereby moving the cartridge 240. The extrusion member 244 and the chuck 247 are also movable together with the cartridge 240. Alternatively, instead of the dispenser 24, a table 21A may be configured to be freely movable on a horizontal plane. That is, it is sufficient if the dispenser 24 can move on a horizontal plane relative to the release film F.

[0022] The resin material supply module 2 has a resin material storage section 11 that stores a plurality of cartridges 240, and when the liquid resin material is used up in the dispenser 24, the cartridge 240 of the dispenser 24 is replaced with a new cartridge.

[0023] The weight detection unit 25 includes a weight sensor (not shown) installed below the table 21A. The weight sensor may be a known load sensor, and measures the weight of the table 21A and the release film F, and the total weight of the liquid resin material supplied onto the release film F at predetermined time intervals (also referred to as unit time). The weight detection unit 25 detects the weight of the liquid resin material supplied per unit time by using the weight sensor to determine the difference between the total weight measured previously and the total weight measured this time.

[0024] The resin material loader 12 is configured to be movable on rails between the resin material supply module 2 and the press module 3. The resin material loader 12 can hold the release film F to which liquid resin material has been supplied by the resin material supply mechanism 21, and transport it to the press module 3.

[0025] <1-2. Press Module> As shown in FIG. 5 , the press module 3 is configured as a press frame in which a lower fixed platen 31 and an upper fixed platen 33 are integrated by a plate-like member 32. A movable platen 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 is movable up and down along the plate-like member 32. A clamping mechanism 35 for moving the movable platen 34 up and down is provided above the lower fixed platen 31. The clamping mechanism 35 is configured with a pair of ball screws or the like. The clamping mechanism 35 clamps the mold M by moving the movable platen 34 upward, and opens the mold M by moving the movable platen 34 downward. The drive source for the clamping mechanism 35 is not particularly limited, but an electric motor such as a servo motor can be used, for example.

[0026] The upper mold UM and lower mold LM forming the molding die M are arranged opposite each other and are both composed of metal dies or the like. An upper heater plate 37 incorporating an upper heater 371 is arranged on the underside of the upper fixed platen 33, and the upper mold UM is attached below the upper heater plate 37. The upper mold UM is provided with a substrate setting section (not shown) for placing a substrate S. The substrate S, on which a chip or the like is mounted, is attached to the substrate setting section of the upper mold UM. A lower heater plate 36 incorporating a lower heater 361 is arranged on the upper surface of the movable platen 34, and the lower mold LM is provided on the lower heater plate 36. A suction mechanism is provided in the lower mold cavity MC, and this suction mechanism holds the release film F coated with a liquid resin material.

[0027] The mold clamping mechanism 35 clamps the molding die M, and heats the lower die LM with the lower heater plate 36. This hardens the liquid resin material in the lower die cavity MC. In other words, with the pre-resin-sealing substrate Sa and the release film F positioned between the upper die UM and the lower die LM, the mold clamping mechanism 35 clamps the molding die M. As a result, the chips and the like mounted on the pre-resin-sealing substrate Sa (pre-molding substrate) are resin-sealed in the lower die cavity MC to become a resin-sealed substrate Sb (resin molded product).

[0028] 1, the substrate module 4 transports pre-sealed substrates Sa (pre-molding substrates) on which chips are mounted before being encapsulated with resin, and transports encapsulated substrates Sb (resin molded products) after encapsulation with resin. The substrate module 4 includes a substrate loader 41, a first storage section 43 for storing pre-sealed substrates Sa, a second storage section 44 for storing encapsulated substrates Sb, and a substrate transfer section 45. The substrate transfer section 45 moves in the front-to-rear direction within the substrate module 4 and can transfer pre-sealed substrates Sa to the substrate loader 41. The substrate transfer section 45 can also receive encapsulated substrates Sb transported from the substrate loader 41. The substrate loader 41 moves horizontally within the substrate module 4 and each press module 3.

[0029] <1-4. Control Unit> The control unit 5 is configured with a computer such as a PLC that controls the operation of the resin molding apparatus. The control unit 5 has a storage unit configured with a HDD, SSD, or the like, and this storage unit stores a program for executing resin molding in the resin molding apparatus. This program is then executed by the CPU of the control unit 5, thereby performing resin molding, including the supply of a liquid resin material, as described below. This program can be transmitted to the control unit 5 via a telecommunications line such as a dedicated line or the Internet, or can be provided to the control unit 5 via a storage medium 51 such as a CD-ROM, DVD-ROM, or memory card.

[0030] <1-5. Display Unit> The display unit 6 displays various states of the resin molding device and inputs information for operation, and is configured as a known liquid crystal display fixed to the housing of the substrate module 4 in a state visible from the outside, and the display is controlled by the control unit 5. The display unit 6 is configured as a touch panel that can be operated by pressing the display on the screen with a finger. The display unit 6 may also be configured as a display of an external desktop computer, notebook computer, tablet terminal, or the like connected via a network.

[0031] 2. Resin Material Supplying Method Next, a method for supplying liquid resin material onto the release film F by the dispenser 24 in the resin material supplying module 2 will be described. FIG. 6 is a plan view showing a route R of the dispenser. The dispenser 24 applies the liquid resin material onto the release film F while moving horizontally above the release film F by the above-mentioned movement mechanism. As shown in FIG. 6, the dispenser 24 is set to move linearly from a start point R1 to the right, front, left, front, and right in this order, and to stop at an end point R2. However, this route R is just an example, and the route may include a curve.

[0032] In this embodiment, as shown in FIG. 7 , a target movement speed is set in the control unit 5 so that the dispenser 24 starts dispensing the liquid resin material from the start point R1 and arrives at the end point R2 at time Tg. Also, as shown in FIG. 8 , the dispenser 24 starts dispensing the liquid resin material from the start point R1, and the extrusion speed of the extrusion member 244 is set so that the dispenser 24 completes dispensing a target weight of the resin material at the end point R2. That is, the extrusion amount (or extrusion speed) of the extrusion member 244 is set in the control unit 5 so that a fixed amount of the liquid resin material (hereinafter referred to as the target dispensing amount) per unit time is dispensed from time 0 and dispensing of the liquid resin material is completed at time Tg. This allows a uniform amount of the liquid resin material to be dispensed over the entire length of the path R (a uniform line width of the liquid resin material is applied). Note that FIG. 8 shows the relationship between the target time and the dispensing amount of the liquid resin material for one movement of the extrusion member 244 corresponding to the application of the liquid resin material to one path R, and does not include the dispensing amount of the liquid resin material due to the dripping and draining described above.

[0033] However, because the viscosity and compressibility of the liquid resin material vary depending on the temperature change during discharging, the liquid resin material may not necessarily be discharged uniformly from the discharge portion 246 per unit time in accordance with the extrusion of the extrusion member 244. In other words, there is a risk that the liquid resin material will not be discharged according to the graph shown in FIG.

[0034] Therefore, in this embodiment, the movement speed of the dispenser 24 is controlled as described below, so that a substantially uniform amount of liquid resin material is dispensed over the entire length of the path R.

[0035] 9 is a block diagram showing control of the movement speed of the dispenser. As shown in FIG. 9, when a target movement speed of the dispenser 24 is input, the control unit 5 drives the servo motor of the movement mechanism in accordance with the input, thereby moving the dispenser 24 horizontally along the path R. Then, the weight detection unit 23 detects the weight of the liquid resin material applied to the release film F every unit time (e.g., every 0.1 to 0.5 seconds). If there is a difference between the detected amount of liquid resin material dispensed per unit time and the target amount of liquid resin material dispensed per unit time shown in FIG. 8, the control unit 5 changes the target value of the movement speed of the dispenser 24 and moves the dispenser 24 by the servo motor based on the new target value.

[0036] This point will be explained with reference to FIG. 10 . FIG. 10 is a graph showing the relationship between the movement distance of the dispenser and the weight of the dispensed liquid resin material. For example, if the detected amount of liquid resin material dispensed per unit time is higher than the target amount of liquid resin material dispensed per unit time (0 to L1 in FIG. 10 ), the movement speed of the dispenser 24 is increased (L1 to L2 in FIG. 10 ). On the other hand, if the detected amount of liquid resin material dispensed per unit time is lower than the target amount of liquid resin material dispensed per unit time (L3 to L4 in FIG. 10 ), the movement speed of the dispenser 24 is decreased (L4 to L5 in FIG. 10 ). That is, the control unit 5 changes the target value of the movement speed in accordance with the difference between the detected amount of liquid resin material dispensed per unit time and the target amount of liquid resin material dispensed per unit time. The greater the difference between the detected amount of liquid resin material dispensed per unit time and the target amount of liquid resin material dispensed per unit time, the greater the change in the target value of the movement speed. On the other hand, if the difference between the detected amount of liquid resin material discharged per unit time and the target amount of discharged per unit time is small, the amount of change in the target value of the movement speed will also be small. In this way, the control unit 5 controls the servo motor in accordance with the changed target value of the movement speed. In this way, the control unit 5 performs feedback control on the movement speed of the dispenser 24 as shown in FIG.

[0037] The above control will be explained again using the flowchart shown in Fig. 11. First, the total weight of the liquid resin material to be discharged and the movement time of the extrusion member 244 are set (step S1). Next, the movement speed and movement path (distance) of the dispenser 24 are set (step S2). That is, the settings shown in the graphs of Fig. 7 and Fig. 8 are made. Note that steps S1 and S2 may be reversed.

[0038] Once the settings are complete, the dispenser 24 is moved from the start point R1 to the end point R2 while dispensing the liquid resin material (step S3). During this process, the control unit 5 detects the weight of the liquid resin material dispensed per unit time using the weight detection unit 25 (step S4). The control unit 5 then determines whether there is a difference between the detected amount of liquid resin material dispensed per unit time and the target amount of liquid resin material dispensed. If there is a difference (YES in step S5), the control unit 5 changes the movement speed of the dispenser 24 as described above (step S7). That is, the control unit 5 sets a new target movement speed for the dispenser 24.

[0039] Thereafter, if there is no difference between the detected amount of liquid resin material discharged per unit time and the target amount of discharged resin (NO in step S5) and the dispenser 24 has moved to the end point R2 (YES in step S6), the process ends. On the other hand, if the dispenser 24 has not moved to the end point R2 (NO in step S6), steps S3 to S7 are repeated. In this manner, the liquid resin material is applied over the entire length of the set path R. Note that in step S5, the difference between the detected amount of liquid resin material discharged per unit time and the target amount of discharged resin is determined. No difference can mean a case where the difference is completely zero, or a small range of difference can be set, and if the difference is within this range, the target movement speed of the dispenser 24 is not changed.

[0040] However, if the liquid resin material continues to be discharged from the discharge portion 246 due to dripping and draining as described above even after the dispenser 24 has stopped at the end point R2, an excessive amount of liquid resin material may be applied at the end point R2. Therefore, the control after the dispenser 24 has stopped at the end point R2 will be described below with reference to the flowchart in FIG.

[0041] As described above, the amount of liquid resin material dispensed by dripping and draining can be calculated in advance. Therefore, when the control unit 5 determines that the dispenser 24 has reached the end point R2 (YES in step S11), it dispenses the liquid resin material by dripping while moving the dispenser 24 from the end point R2 along the path R toward the start point R1, as shown in FIG. 13 (step S12). Then, when the control unit 5 determines that dispensing of the liquid resin material by dripping is complete (YES in step S13), it closes the chuck 247 and dispenses the liquid resin material by draining (step S14). Then, when the control unit 5 determines that dispensing of the liquid resin material by draining is complete (YES in step S15), it stops the movement of the dispenser 24 (step S16) and ends the process. Therefore, during this movement, the liquid resin material is dispensed from the dispenser 24 by dripping and draining. During this time, the control unit 5 can perform the control shown in steps S3 to S7 of FIG. 11. However, it is also possible to control only the extrusion speed of the extrusion member 244 without performing such feedback control.

[0042] However, the control unit 5 adjusts the movement speed of the dispenser 24 so that the amount of liquid resin material dispensed per unit time on the path R is less than the target amount (for example, less than half the target amount). This is because the liquid resin material dispensed by dripping and draining is dispensed onto the path R where the liquid resin material has already been applied, resulting in two layers of liquid resin material being stacked. Therefore, in order to make the amount of liquid resin material applied on the path R as uniform as possible, it is necessary to reduce the amount of liquid resin material dispensed per unit length due to dripping and draining. Note that the liquid resin material dispensed by dripping and draining can also be dispensed to areas other than the path R.

[0043] <3. Features> Because the viscosity and compressibility of the liquid resin material fluctuate due to temperature changes during dispensing, there is a risk that the liquid resin material will not be uniformly discharged from the discharge section 246 per unit time according to the set extrusion of the extrusion member 244. Therefore, the resin material supply module 2 according to this embodiment detects the amount of liquid resin material discharged per unit time from the dispenser 24 and compares it with a target amount of liquid resin material discharged per unit time. If there is a difference between the two, the movement speed of the dispenser 24 is corrected.

[0044] For example, if the detected amount of liquid resin material dispensed is higher than the target amount per unit time, the movement speed of the dispenser 24 is increased, thereby reducing the amount of liquid resin material dispensed per unit length on the path R. On the other hand, if the detected amount of liquid resin material dispensed is lower than the target amount per unit time, the movement speed of the dispenser 24 is decreased, thereby increasing the amount of liquid resin material dispensed per unit length on the path R. This makes it possible to prevent variations in the amount of liquid resin material applied over the entire path R.

[0045] In addition to the aforementioned fluctuations in the viscosity and compressibility of the resin material, other factors may be considered as reasons why the liquid resin material is not dispensed as planned from the dispensing portion 246. For example, because the liquid resin material is a compressible fluid with high viscosity, it is possible that the desired amount of liquid resin material is not dispensed even when the extrusion member 244 is moved at the desired speed. Furthermore, if the inner tube 242 of the dispenser 24 is made of elastically deformable plastic, the inner tube 242 may be deformed. This deformation of the inner tube 242 may prevent the desired amount of liquid resin material from being dispensed. Therefore, various reasons are considered for the liquid resin material not being dispensed as planned, depending on the structure of the dispenser 24 and the composition of the liquid resin material. Therefore, as in this embodiment, it is effective to control the amount of liquid resin material applied to the path R by correcting the movement speed of the dispenser 24 based on the amount of liquid resin material dispensed per unit time from the dispenser 24.

[0046] 4. Modifications Although one embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit of the invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate. Furthermore, any of the following modifications can be combined with the configuration of the above embodiment.

[0047] (1) In the above embodiment, the liquid resin material is dispensed by dripping and draining by moving the dispenser 24 from the end point R2 toward the start point R1. However, since the amount of liquid resin material dispensed by dripping and draining can be calculated in advance, the above-described feedback control can also be performed taking these amounts into consideration. That is, the weight of the liquid resin material dispensed per unit time by dripping and draining can also be detected, and the movement speed of the dispenser 24 can be set based on this. In this case, the extrusion member 244 completes one downward movement before arriving at the end point R2 of the path R. Thereafter, the movement speed of the dispenser 24 is controlled while detecting the weight of the liquid resin material dispensed by dripping and draining so that the dispensing is completed at the end point R2.

[0048] (2) The configuration of the dispenser 24 is not particularly limited as long as the liquid resin material is discharged by extrusion by the extrusion member 244 and the dispenser 24 is movable in the horizontal direction. Therefore, the storage section that stores the liquid resin material and discharges it from the discharge section 246 does not need to be configured with the outer tube 241 and the inner tube 242, but may be configured with a single storage section.

[0049] (3) In the above embodiment, the release film F is given as an example of an object to which the liquid resin material is applied, but the object is not limited to this, and can also be, for example, a wafer or substrate on which electronic components are mounted. Therefore, the present invention can also be applied to cases where a liquid resin material is applied to these objects.

[0050] (4) In the above embodiment, when the liquid resin material dispensed from the dispenser is applied to the release film F, the amount of the liquid resin material dispensed is detected by a weight sensor (not shown) connected to the table 21A that supports it. However, this is not limited to this, and the amount of the liquid resin material dispensed can also be detected (or measured) by other methods.

[0051] 24 Dispenser 241 Outer cylinder (housing portion) 242 Inner cylinder (housing portion) 244 Extrusion member 25 Weight detection portion 5 Control portion

Claims

1. A resin material supplying device for discharging liquid resin material along a predetermined path onto an object, comprising: a storage unit for storing the resin material and having a discharge unit for discharging the resin material; an extrusion member inserted into the storage unit for extruding the resin material from the discharge unit; a movement mechanism for moving the storage unit relatively to the object in an in-plane direction of a surface of the object; and a control unit for controlling the extrusion member and the movement mechanism, wherein the control unit corrects the movement speed of the storage unit based on the discharge amount per unit time of the resin material discharged from the storage unit and a target discharge amount of the resin material per unit time.

2. The resin material supplying device according to claim 1, further comprising a weight detection section for supporting the object and detecting the weight of the resin material discharged from the container section per unit time.

3. The resin material supplying device of claim 2, wherein the control unit executes the following steps: a first step of setting the movement speed of the storage unit and the path; a second step of detecting the extrusion amount of the resin material per unit time when the storage unit is moved at the movement speed; and a third step of correcting the movement speed of the storage unit based on the detected extrusion amount per unit time and a target extrusion amount of the resin material per unit time, and repeats the second and third steps until the storage unit moves to the end point of the path.

4. A method for supplying resin material, comprising: a container having a container section for storing liquid resin material and having a discharge section for discharging the resin material; an extrusion member inserted into the container section for extruding the resin material from the discharge section; a movement mechanism for moving the container section; and a control section for controlling the extrusion member and the movement mechanism, and discharging the resin material along a predetermined path onto an object using a resin material supplying device, comprising: a first step of setting a movement speed of the container section and the path; a second step of detecting an amount of the resin material discharged per unit time when the container section is moved relatively in an in-plane direction of the surface of the object at the movement speed; and a third step of correcting the movement speed of the container section based on the detected amount of the resin material discharged per unit time and a target amount of the resin material discharged per unit time, and the second and third steps are repeated until the container section moves to an end point of the path.

5. A resin material supplying program for discharging a resin material along a predetermined path onto an object by a resin material supplying device having a storage unit which stores liquid resin material and has a discharge unit which discharges the resin material, an extrusion member which is disposed within the storage unit and which extrudes the resin material from the discharge unit, a moving mechanism for moving the storage unit, and a control unit for controlling the extrusion member and the moving mechanism, the program causing the control unit to execute a first step of setting a movement speed of the storage unit and the path, a second step of detecting an amount of the resin material discharged per unit time when the storage unit is moved relatively in an in-plane direction of the surface of the object at the movement speed, and a third step of correcting the movement speed of the storage unit based on the detected amount of the resin material discharged per unit time and a target amount of the resin material discharged per unit time, and the second and third steps are repeated until the storage unit moves to an end point of the path.

6. A resin molded product manufacturing device comprising: a resin material supply module having a resin material supply device according to any one of claims 1 to 3, which supplies liquid resin material onto a film by said resin material supply device; and a press module having an upper mold and a lower mold, wherein the film to which the resin material has been supplied and a substrate are placed between the upper mold and the lower mold, and the substrate is sealed with the resin material by clamping the molds to manufacture a resin molded product.

7. A method for manufacturing a resin molded product using the resin molded product manufacturing apparatus described in claim 6, comprising the steps of: supplying liquid resin material onto a film by the resin material supply device; arranging the film to which the resin material has been supplied and a substrate between the upper mold and the lower mold; and clamping the upper mold and the lower mold to manufacture a resin molded product in which the substrate is sealed with the resin material.

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