Electronic device comprising structure for coupling component and housing by using injection molding process
WO2025071177A1PCT designated stage expired Publication Date: 2025-04-03SAMSUNG ELECTRONICS CO LTD
Patent Information
- Application Number
- PCT/KR2024/014449
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-11-09
- Filing Date
- 2024-09-25
- Publication Date
- 2025-04-03
Smart Images
Figure KR2024014449_03042025_PF_FP_ABST
Abstract
An electronic device according to an embodiment of the present disclosure may comprise: a housing at least a part of which is formed of a metallic material and which includes a seating groove; a component which is disposed in the seating groove; and an injection-molded member which is formed of a nonmetallic material and at least a part of which is injected into the seating groove through an injection molding process to couple the housing and the component to each other. Various other embodiments may also be possible.
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Citation Information
Patent Citations
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