Selective layer transfer with glass panels
WO2025071754A1PCT designated stage expired Publication Date: 2025-04-03INTEL CORP
Patent Information
- Application Number
- PCT/US2024/040077
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-29
- Filing Date
- 2024-07-29
- Publication Date
- 2025-04-03
Smart Images
Figure US2024040077_03042025_PF_FP_ABST
Abstract
Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a microelectronic assembly includes a solid glass layer, a plurality of mesa structures on a surface of the glass layer, and an integrated circuit (IC) component on each respective mesa structure. The mesa structures have similar footprints as the IC components, and may be formed on or integrated with the glass layer.
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Citation Information
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