Recyclable blister pack with multilayer component, and method of recycling same

The recyclable blister pack design, featuring a same-material cover and backing with a multilayer component, addresses the recycling challenges of conventional blister packaging by enabling efficient recycling while preserving product integrity.

WO2025072515A1 Publication Date: 2025-04-03CSP TECHNOLOGIES INC
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Patent Information

Application Number
PCT/US2024/048653
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-07-31
Filing Date
2024-09-26
Publication Date
2025-04-03

AI Technical Summary

Technical Problem

Conventional blister packaging is difficult to recycle due to the use of different materials for the backing and cover, and the presence of active components like desiccants, which contaminate the packaging and prevent recycling.

Method used

A recyclable blister pack design featuring a cover and backing made from the same recyclable material, with an optional multilayer component including an active layer and a non-active layer, allowing for efficient recycling while maintaining product preservation.

Benefits of technology

The solution enables the recycling of blister packs by using a single recyclable material for both the cover and backing, reducing contamination from active components and facilitating efficient recycling processes.

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Abstract

A recyclable blister pack (110) configured to sealingly enclose at least one multilayer component (115, 116) comprising an active layer, and a product (117) includes a backing (112) having a first side and an opposing second side. Each of the first and second side is flat or planar. The blister pack includes a cover (114) having a first side and an opposing second side. At least a portion of the second side of the cover is adhered to the first side of the backing to form a sealed package for containing product. The cover includes at least one blister. The blister pack can be formed from one or more recyclable materials.
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