Wafer inspection device, laser processing device, and wafer inspection method

The wafer inspection apparatus addresses the challenge of imaging modified layers at multiple depth positions by using a lens switching member with refractive index-based focal positions, achieving precise and effective imaging for accurate wafer inspection and processing.

WO2025115226A1PCT designated stage expired Publication Date: 2025-06-05YAMAHA MOTOR CO LTD
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Patent Information

Application Number
PCT/JP2023/043177
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-01
Publication Date
2025-06-05

AI Technical Summary

Technical Problem

Existing wafer inspection and laser processing apparatuses struggle to accurately image modified layers at multiple depth positions within a wafer, due to misalignment of the focal position and condensing position of the illumination light, caused by the difference in refractive indices between the wafer and air.

Method used

A wafer inspection apparatus and method that includes a lens switching member with multiple lens units, each set to a specific focal position based on the refractive index of the wafer, allowing for precise adjustment of the focus at various depth positions within the wafer.

Benefits of technology

Enables clear and focused imaging of modified layers at multiple depth positions within the wafer, ensuring accurate inspection and processing, while minimizing light flux decrease and positional deviations.

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Abstract

This wafer inspection device 100 is provided with an imaging unit 34a for imaging a modified layer Wd in a wafer We on the basis of reflected light Lir1 of illumination light emitted from an illumination unit 34c. The wafer inspection device 100 is provided with a lens switching member 34e including: a plurality of lens parts 344e, lens parts 345e, and lens parts 346e in which focal positions Pim1 (Pim2 and Pim3) different from each other are set at a plurality of depth positions in the wafer We on the basis of the refractive index of the wafer We different from the refractive index of air; and a switching part 341e for switching the plurality of lens parts 344e, lens parts 345e, and lens parts 346e when imaging the modified layer Wd by using a camera part 34a for inspection of the wafer We.
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Citation Information

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