Wafer processing system and wafer processing method
WO2025126961A1PCT designated stage expired Publication Date: 2025-06-19TOKYO SEIMITSU CO LTD
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Patent Information
- Application Number
- PCT/JP2024/043154
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-11
- Filing Date
- 2024-12-06
- Publication Date
- 2025-06-19
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Figure JP2024043154_19062025_PF_FP_ABST
Abstract
A wafer processing system (10) comprises: a grinding unit (16) for subjecting an edge portion of a wafer to a grinding processing; a measuring unit (20) for measuring the shape of the edge portion of the ground-processed wafer, the measuring unit measuring the shape of the edge portion of a truer used in the grinding processing; and a feedback calculating unit (152) for performing feedback to the grinding processing on the basis of a measurement result of the shape of the edge portion of the truer.
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