Apparatus for fluid immersion cooling

Abstract

A device for cooling an electronic component in a cooling fluid immersion environment includes a heatsink, a casing, a micropump, and a first conduit. The heatsink is removably attached to the electronic component and includes baffles that direct the cooling fluid to flow over the electronic component. The cooling fluid absorbs heat from the electronic component. The casing includes an inlet orifice, an outlet orifice, and an internal volume containing the heatsink and the electronic component. The micropump actuates to forcefully direct the cooling fluid from an area surrounding the device, through the inlet orifice, through the series of baffles of the heatsink, and out of the outlet orifice of the casing. Further, the first conduit is connected to the micropump and directs the cooling fluid to the series of baffles of the heatsink within the internal volume of the casing.

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