Functional resin composition, composite cured resin and preparation method therefor, and package product

Abstract

A functional resin composition, a composite cured resin and a preparation method therefor, and a package product. The functional resin composition comprises, in parts by mass, 10-50 parts of a functional material, 10-50 parts of a functional resin, 10-50 parts of a curing agent, 1-10 parts of a curing accelerator, 50-250 parts of an inorganic filler, and 10-30 parts of an organic filler. The functional resin composition has the advantages of a low thermal expansion coefficient, a low water absorption rate and low warpage.

Description

Functional resin composition, composite cured resin and preparation method thereof, and packaged product Technical Field

[0001] The present invention relates to the technical field of composite resins, in particular to a functional resin composition, a composite curing resin and a preparation method thereof, and a packaged product. Background Art

[0002] Flip-chip ball grid array (FC-BGA) packaging substrates are the future development direction of semiconductor packaging substrates and have broad application prospects. FC-BGA packaging substrates utilize a technology that flips the chip upside down onto the substrate, connecting the chip and substrate via solder balls to achieve electrical connection and signal transmission. This high-density packaging substrate enables high-speed and multifunctional chips.

[0003] The foundation of FCBGA package substrates is build-up film, a key core material in the semi-additive manufacturing (SAP) process for FC-BGA package substrates. However, with the rapid development of the electronics industry, electronic products are moving towards miniaturization, higher functionality, and higher safety, placing higher demands on the packaging stability of FCBGA package substrates. Conventional resin materials used in build-up films have a high coefficient of thermal expansion, which can easily cause warping of the FCBGA package substrates. Furthermore, their high water absorption can easily lead to package failure.

[0004] Therefore, traditional technologies still need to be improved.

[0005] Summary of the Invention

[0006] Based on this, the present application provides a functional resin composition, a composite cured resin, a preparation method thereof, and a packaged product that have low thermal expansion, low water absorption, and low warpage.

[0007] The technical solution of this application is as follows.

[0008] In a first aspect of the present application, a functional resin composition is provided, wherein the functional resin composition comprises, in parts by mass:

[0009] Wherein, the structure of the functional material is shown in formula (1):

[0010] m1 and m2 are independently selected from any integer from 1 to 5, and n1 is an integer greater than or equal to 2.

[0011] The functional resin composition comprises a functional material, a functional resin, a curing agent, a curing accelerator, an inorganic filler and an organic filler in a specific mass fraction ratio. The components work synergistically to enable the functional resin composition to have low thermal expansion coefficient, low water absorption rate and low warpage. The structure of the functional material is as shown in formula (1), which is a polymeric naphthalene ether-type epoxy material with a specific structure. One molecule of the functional material contains multiple naphthalene ring structures. On the one hand, the naphthalene rings are connected by ether bonds, so that the planar structure of the naphthalene ring structure presents an arrangement similar to a mesh chain, reducing the free volume of the functional resin composition, thereby reducing the thermal expansion coefficient and water absorption of the functional resin after curing. On the other hand, the multiple naphthalene ring structures can improve the molecular chain rigidity of the functional material. After working together with other components in a specific ratio, the rigidity of the polymer chain segment after curing of the functional resin is greatly improved, thereby effectively suppressing the movement of the polymer chain segment during or after curing, greatly suppressing the warpage of the composite cured resin after curing, and reducing the warpage.

[0012] Moreover, the specific components work synergistically in a specific ratio, so that the functional resin composition has good electrical conductivity, low dielectric constant and dielectric loss after being cured.

[0013] In some embodiments, the structure of the functional material is shown in formula (1-1):

[0014] In some embodiments, the functional material satisfies at least one of the following conditions (1) to (2):

[0015] (1) m1 and m2 are independently selected from 1 or 2;

[0016] (2)n1 is 3.

[0017] In some embodiments, the structure of the functional material is shown in formula (1-2):

[0018] In some embodiments, the functional resin composition comprises, in parts by mass:

[0019] The mass fraction of each component in the functional resin composition is further regulated to further reduce the thermal expansion rate, water absorption rate and warpage of the functional resin.

[0020] In some embodiments, the functional resin composition satisfies at least one of the following conditions (1) to (3):

[0021] (1) The functional resin includes at least one of epoxy resin, benzoxazine resin and bismaleimide resin;

[0022] (2) the curing agent comprises at least one of an amine curing agent, a phenolic curing agent, an acid anhydride curing agent, a cyanate curing agent, and an active ester curing agent;

[0023] (3) The curing accelerator includes at least one of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organophosphorus accelerator, and a transition metal carboxylate accelerator.

[0024] In some embodiments, the inorganic filler satisfies at least one of the following conditions (1) to (2):

[0025] (1) The inorganic filler includes at least one of spherical silica and spherical alumina;

[0026] (2) The particle size D50 of the inorganic filler is 0.01 μm to 10 μm.

[0027] In some embodiments, the organic filler satisfies at least one of the following conditions (1) to (2):

[0028] (1) The organic filler comprises at least one of silicone particles, core-shell rubber particles and olefin elastomer particles;

[0029] (2) The particle size D50 of the organic filler is 10 nm to 1000 nm.

[0030] In some embodiments, the functional resin composition further comprises other auxiliary agents, and the other auxiliary agents meet at least one of the following conditions (1) to (2):

[0031] (1) The other additives include at least one of a dispersant, a leveling agent, a defoaming agent, a treating agent and a coupling agent;

[0032] (2) The mass fraction of the other auxiliary agents is 1 to 5 parts.

[0033] In a second aspect, the present application further provides a composite curing resin, which is prepared using raw materials including the functional resin composition of the first aspect.

[0034] The composite cured resin has low thermal expansion, low water absorption and low warpage.

[0035] In a third aspect of the present application, a method for preparing a composite curing resin is provided, comprising the following steps:

[0036] The raw materials are subjected to a heating and curing treatment to prepare a composite curing resin;

[0037] The raw material includes the functional resin composition of the first aspect.

[0038] According to a fourth aspect of the present application, a packaged product is provided, comprising the composite cured resin according to the second aspect or the composite cured resin prepared by the method for preparing the composite cured resin according to the third aspect.

[0039] The composite cured resin has low thermal expansion, low water absorption and low warpage, thereby improving the packaging structure stability of the packaged product. DETAILED DESCRIPTION

[0040] To facilitate understanding of the present application, the present application will be described in more detail below, along with preferred embodiments thereof. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure herein.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0042] In this application, "*" represents a linking site.

[0043] In the present application, when a linking site is not specified in a group, it means that any linking site in the group can be used as the linking site.

[0044] In the present application, the single bond to which the substituent is connected runs through the corresponding ring, indicating that the substituent can be connected to any position of the ring, for example R is connected to any substitutable position of the benzene ring.

[0045] One embodiment of the present application provides a functional resin composition, which comprises, in parts by mass:

[0046] Wherein, the structure of the functional material is shown in formula (1):

[0047] m1 and m2 are independently selected from any integer from 1 to 5, and n1 is an integer greater than or equal to 2.

[0048] The functional resin composition comprises a functional material, a functional resin, a curing agent, a curing accelerator, an inorganic filler and an organic filler in a specific mass fraction ratio. The components work synergistically to enable the functional resin composition to have low thermal expansion coefficient, low water absorption rate and low warpage. The structure of the functional material is as shown in formula (1), which is a polymeric naphthalene ether-type epoxy material with a specific structure. One molecule of the functional material contains multiple naphthalene ring structures. On the one hand, the naphthalene rings are connected by ether bonds, so that the planar structure of the naphthalene ring structure presents an arrangement similar to a mesh chain, reducing the free volume of the functional resin composition, thereby reducing the thermal expansion coefficient and water absorption of the functional resin after curing. On the other hand, the multiple naphthalene ring structures can improve the molecular chain rigidity of the functional material. After working together with other components in a specific ratio, the rigidity of the polymer chain segment after curing of the functional resin is greatly improved, thereby effectively suppressing the movement of the polymer chain segment during or after curing, greatly suppressing the warpage of the composite cured resin after curing, and reducing the warpage.

[0049] In some embodiments, the structure of the functional material is shown in formula (1-1):

[0050] In some embodiments, m1 and m2 are independently selected from 1, 2, 3 or 4. Further, m1 and m2 are independently selected from 1 or 2.

[0051] In some embodiments, m1 and m2 are the same.

[0052] In some embodiments, m1 and m2 are both 2.

[0053] In some embodiments, n1 is any integer from 2 to 5.

[0054] In some embodiments, n1 is 1, 2, 3 or 4; further, n1 is 3.

[0055] In some embodiments, the structure of the functional material is shown in formula (1-2):

[0056] In some embodiments, the functional resin composition comprises, in parts by mass:

[0057] The mass fraction of each component in the functional resin composition is further regulated to further reduce the thermal expansion rate, water absorption rate and warpage of the functional resin.

[0058] The functional materials can be obtained commercially or by existing preparation methods, for example, by referring to the literature "Synthesis of a Novel Naphthyl Ether Oligomer and Its Application in Environmentally Compatible Epoxy Resins - <Network Polymer>. Vol. 30 No. 4 (2009) - Arita Kazuo, Ogura Ichiro" (original title: "Synthesis of a New Naphthyl Ether Oligomer and Its Application in Environmentally Compatible Epoxy Resins - "Network Polymer").

[0059] In the above “10 to 50 parts”, the mass fraction of the functional material includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Specific examples include but are not limited to the point values ​​in the embodiments and the following point values: 10 parts, 13 parts, 15 parts, 17 parts, 20 parts, 21 parts, 23 parts, 25 parts, 27 parts, 29 parts, 30 parts, 30 parts, 31 parts, 33 parts, 35 parts, 37 parts, 39 parts, or a range consisting of any two numerical values, for example, 10 to 50 parts, 10 to 45 parts, 10 to 40 parts, 10 to 35 parts, 10 to 30 parts, 10 to 25 parts, 10 to 20 parts, 20 to 45 parts, 20 to 40 parts, 20 to 35 parts, 20 to 30 parts, 20 to 25 parts.

[0060] In the above "10 parts to 50 parts", the mass fraction of the functional resin includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Specific examples include but are not limited to the points in the embodiments and the following points: 10 parts, 13 parts, 15 parts, 17 parts, 20 parts, 21 parts, 23 parts, 25 parts, 27 parts, 29 parts, 30 parts, 30 parts, 31 parts, 33 parts, 35 parts, 37 parts, 39 parts, or a range consisting of any two numerical values, for example, 10 to 50 parts, 10 to 45 parts, 10 to 40 parts, 10 to 35 parts, 10 to 30 parts, 10 to 25 parts, 10 to 20 parts, 20 to 45 parts, 20 to 40 parts, 20 to 35 parts, 20 to 30 parts, 20 to 25 parts.

[0061] In the above "10 parts to 50 parts", the mass fraction of the curing agent includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Specific examples include but are not limited to the point values ​​in the embodiments and the following point values: 10 parts, 13 parts, 15 parts, 17 parts, 20 parts, 21 parts, 23 parts, 25 parts, 27 parts, 29 parts, 30 parts, 30 parts, 31 parts, 33 parts, 35 parts, 37 parts, 39 parts, or a range consisting of any two numerical values, for example, 10 to 50 parts, 10 to 45 parts, 10 to 40 parts, 10 to 35 parts, 10 to 30 parts, 10 to 25 parts, 10 to 20 parts, 20 to 45 parts, 20 to 40 parts, 20 to 35 parts, 20 to 30 parts, 20 to 25 parts.

[0062] In the above "1 part to 10 parts", the mass fraction of the curing agent accelerator includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Specific examples include but are not limited to the point values ​​in the embodiments and the following point values: 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts; or a range consisting of any two values.

[0063] In the above-mentioned "50 parts to 250 parts", the mass fraction of the inorganic filler includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Specific examples include but are not limited to the point values ​​in the embodiments and the following point values: 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, 150 parts, 160 parts, 170 parts, 180 parts, 190 parts, 200 parts, 210 parts, 220 parts, 230 parts, 240 parts, 250 parts; or a range consisting of any two numerical values.

[0064] In the above-mentioned "10 parts to 30 parts", the mass fraction of the organic filler includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Specific examples include but are not limited to the point values ​​in the embodiments and the following point values: 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts; or a range consisting of any two values.

[0065] In some embodiments, the weight fraction of the functional resin is greater than the weight fraction of the curing agent.

[0066] In some embodiments, the weight fraction of the functional material is less than the weight fraction of the functional resin.

[0067] In some embodiments, the functional resin includes at least one of an epoxy resin, a benzoxazine resin, and a bismaleimide resin.

[0068] It is understood that the structure of the epoxy resin is different from that of the functional material.

[0069] In some embodiments, the epoxy resin includes at least one of a saturated epoxy resin and an unsaturated epoxy resin; further, the saturated epoxy resin includes at least one of an alicyclic epoxy resin and an aliphatic epoxy resin, and the unsaturated epoxy resin includes at least one of an olefin epoxy resin, an aromatic epoxy resin, and a heteroaromatic epoxy resin.

[0070] In some embodiments, the epoxy resin includes at least one of naphthalene-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phosphorus-containing epoxy resin, novolac-type epoxy resin, o-cresol-type epoxy resin, bisphenol A novolac-type epoxy resin, resorcinol epoxy resin, rubber-modified epoxy resin, biphenyl epoxy resin and dicyclopentadiene epoxy resin.

[0071] In some embodiments, the benzoxazine resin is not limited to a specific type, including but not limited to one or more of bisphenol A benzoxazine resin, bisphenol F benzoxazine resin, main chain benzoxazine resin, phosphorus-containing benzoxazine, bisphenol S benzoxazine resin, dicyclopentadiene benzoxazine resin, biphenyl benzoxazine resin, tetraphenol ethane benzoxazine resin, and naphthalene benzoxazine resin.

[0072] In some embodiments, the bismaleimide resin is not particularly limited, and one molecule of the bismaleimide resin contains two or more maleimide groups.

[0073] In one embodiment, the monomer of the bismaleimide resin is selected from one or more of N-phenylmaleimide, N-(2-methylphenyl)maleimide, N-(4-methylphenyl)maleimide, N-(2,6-dimethylphenyl)maleimide, bis(4-maleimidophenyl)methane, 2,2-bis(4-(4-maleimidophenoxy)-phenyl)propane, bis(3,5-dimethyl-4-maleimidophenyl)methane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, bis(3,5-diethyl-4-maleimidophenyl)methane, polyphenylmethane bismaleimide, bismaleimide containing biphenyl structure and polymaleimide.

[0074] It is understood that the curing agent can be a curing agent commonly used in the art.

[0075] In some embodiments, the curing agent includes at least one of an amine curing agent, a phenolic curing agent, an acid anhydride curing agent, a cyanate curing agent, and an active ester curing agent.

[0076] In some embodiments, the curing accelerator includes at least one of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organophosphorus accelerator, and a transition metal carboxylate accelerator.

[0077] In one embodiment, the tertiary amine accelerator is selected from one or more of tris(dimethylaminomethyl)phenol, triethylenediamine and dimethylaniline.

[0078] In one embodiment, the imidazole accelerator is selected from one or more of 2-methylimidazole, 2-ethylimidazole and 2-ethyl-4-methylimidazole.

[0079] In one embodiment, the peroxide accelerator is selected from one or more of dicumyl peroxide, tert-butyl perbenzoate and tert-butyl peroxyoctanoate.

[0080] In one embodiment, the organophosphorus accelerator is selected from triphenylphosphine.

[0081] In some embodiments, the inorganic filler includes at least one of spherical silica and spherical alumina.

[0082] The spherical silica and spherical alumina may be unmodified spherical silica and spherical alumina, or chemically modified spherical silica and spherical alumina.

[0083] In some embodiments, the inorganic filler includes at least one of epoxy-modified spherical silica, aniline-modified spherical silica, vinyl-modified spherical silica, hollow spherical silica, acrylic-modified spherical silica, fluoroalkyl-modified spherical silica, molybdate-modified spherical silica, epoxy-modified spherical alumina, aniline-modified spherical alumina, vinyl-modified spherical alumina, hollow spherical alumina, acrylic-modified spherical alumina, fluoroalkyl-modified spherical alumina and molybdate-modified spherical alumina.

[0084] In some embodiments, the particle size D50 of the inorganic filler is 0.01 μm to 10 μm.

[0085] In some embodiments, the particle size D50 of the inorganic filler may be 10 μm, 5 μm, 3 μm, 1 μm, 0.5 μm, 0.1 μm, 0.05 μm, or 0.01 μm.

[0086] In some embodiments, the organic filler includes at least one of silicone particles, core-shell rubber particles, and olefin elastomer particles.

[0087] In some embodiments, the particle size D50 of the organic filler is 10 nm to 1000 nm.

[0088] In some embodiments, the particle size D50 of the organic filler may be 10 nm, 50 nm, 100 nm, 200 nm, 300 nm, 500 nm, or 1000 nm.

[0089] D50 refers to the particle size at which the cumulative particle size distribution percentage of a sample reaches 50%. This refers to the particle size at which the volume distribution percentage reaches 50% in a particle size-volume cumulative distribution curve. This is also called the median particle size. For example, this can be conveniently measured using a laser particle size analyzer, referring to the laser diffraction method for particle size distribution in GB / T 19077-2016.

[0090] In some embodiments, the functional resin composition further comprises other auxiliary agents.

[0091] In some embodiments, the other additives include at least one of a dispersant, a leveling agent, a defoaming agent, a treating agent, and a coupling agent.

[0092] The dispersant, leveling agent, defoaming agent, treating agent and coupling agent may be commonly used dispersants, leveling agents, defoaming agents, treating agents and coupling agents in the art.

[0093] In some embodiments, the weight percentage of other auxiliary agents is 1 to 5 parts.

[0094] In one embodiment of the present application, a composite curing resin is provided. The composite curing resin is prepared using raw materials including the functional resin composition described above.

[0095] The composite cured resin has low thermal expansion, low water absorption and low warpage.

[0096] In one embodiment of the present application, a method for preparing a composite curing resin is further provided, comprising the following step S10.

[0097] Step S10: heat and cure the raw materials to prepare a composite cured resin; the raw materials include the functional resin composition mentioned above.

[0098] In some embodiments, the heat curing process includes a first curing stage and a second curing stage. The first curing stage is at a temperature of 70°C to 140°C for 2 minutes to 15 minutes, and the second curing stage is at a temperature of 150°C to 200°C for 20 minutes to 90 minutes.

[0099] An embodiment of the present application further provides a packaged product, which includes the composite curing resin or the composite curing resin prepared by the method for preparing the composite curing resin.

[0100] The composite cured resin has low thermal expansion, low water absorption and low warpage, thereby improving the packaging structure stability of the packaged product.

[0101] In some embodiments, the packaged product is a package carrier; further, the package carrier is an FCBGA package carrier.

[0102] In some embodiments, the package carrier includes a build-up adhesive film, and the build-up adhesive film includes the composite curing resin described above or a composite curing resin prepared by the method for preparing the composite curing resin described above.

[0103] Furthermore, the preparation method of the build-up film includes the following steps:

[0104] The functional resin composition is coated on the surface of the support to form a resin composition coating, which is then heated and cured to prepare a build-up adhesive film.

[0105] In some embodiments, in the coating step, the functional resin composition is coated in the form of a mixed liquid of the functional resin composition.

[0106] The mixed liquid of the functional resin composition includes the functional resin composition and an organic solvent.

[0107] In some embodiments, the organic solvent includes at least one of butanone, toluene, and propylene glycol methyl ether.

[0108] Furthermore, the organic solvent includes butanone, toluene and propylene glycol methyl ether; further, the mass ratio of butanone, toluene and propylene glycol methyl ether is (1-5):(1-5):(1-5).

[0109] In some embodiments, the heating curing includes a first curing stage and a second curing stage. The temperature of the first curing stage is 70°C to 140°C and the time is 2 minutes to 15 minutes. The temperature of the second curing stage is 150°C to 200°C and the time is 20 minutes to 90 minutes.

[0110] The temperature of the first curing stage is mainly used to remove the organic solvent film, accompanied by slight curing, and the second curing stage is mainly used to promote complete curing.

[0111] In some embodiments, the support body includes one or more of a plastic film and a metal film.

[0112] The plastic film includes but is not limited to at least one of polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), and the like.

[0113] In some embodiments, the metal film includes at least one of copper foil or aluminum foil.

[0114] In some embodiments, the thickness of the support body is 3 μm to 105 μm.

[0115] In some embodiments, the thickness of the resin composition coating is 5 μm to 50 μm.

[0116] The present application will be described below in conjunction with specific embodiments, but the present application is not limited to the following embodiments. It should be understood that the attached claims summarize the scope of the present application. Under the guidance of the concept of the present application, those skilled in the art should realize that certain changes made to the various embodiments of the present application will be covered by the spirit and scope of the claims of the present application.

[0117] The following are specific embodiments

[0118] Example 1

[0119] (1) By weight, 10 parts of a trimerized naphthyl ether epoxy compound, 20 parts of a biphenyl epoxy resin, 10 parts of a phenolic curing agent, 1 part of an imidazole accelerator, 100 parts of spherical silica, 10 parts of core-shell particles, and 1 part of other additives were mixed to obtain a functional resin composition. The specific components and weight percentages are shown in Table 1.

[0120] The functional resin composition was dissolved in 30 parts of a mixed solvent, wherein butanone, toluene and propylene glycol methyl ether were in a mass ratio of 1:1:1, and stirred thoroughly to obtain a mixed liquid of the resin composition. The mixed liquid was then sprayed on the surface of the PET film and baked at 100°C for 5 minutes to obtain a semi-cured build-up adhesive film.

[0121] (2) Performance test, as follows:

[0122] The semi-cured build-up film prepared above was bonded to a 12 μm thick copper foil by a bonding machine. The bonding surface was the surface without the PET film. After removing the PET film, a 12 μm thick copper foil was covered. The film was placed in a programmable temperature and pressure controlled vacuum press. The vacuum parameters were <10 mBar and the pressure was 13 kgf / cm 2 Under the pressure of 100℃×30min+170℃×30min+190℃×100min, the cured film was completely obtained by curing at 100℃×30min+170℃×30min+190℃×100min. The following tests were finally carried out:

[0123] Thermomechanical Analysis (TMA): Tests the glass transition temperature (TG), the coefficient of thermal expansion (CTE) before and after the glass transition temperature (TG) in accordance with IPC-TM-650-2.4.24.5.

[0124] Warpage test: Warpage is tested according to IPC-TM-650-2.4.22.1;

[0125] Electrical performance test: Dielectric constant (Dk) and dielectric loss factor (Df) are tested according to IPC-TM-650-2.5.5.2;

[0126] Water absorption: Tested according to IPC-TM650-2.6.2.1.

[0127] Please see Table 1 for specific results.

[0128] Examples 2 to 5

[0129] Examples 2 to 5 are substantially the same as Example 1, except that the types or mass fractions of the components of the functional resin composition are different from those of Example 1. Specific types and mass fractions of the components are shown in Table 1.

[0130] The other steps are the same as those in Example 1.

[0131] Comparative Examples 1-2

[0132] Comparative Examples 1 and 2 are substantially the same as Example 1, except that the types or mass fractions of the components of the functional resin composition are different from those of Example 1. Specific types and mass fractions of the components are shown in Table 1.

[0133] The other steps are the same as those in Example 1.

[0134] Comparative Example 3

[0135] Comparative Example 3 is substantially the same as Example 1, except that in Comparative Example 3, the trimer naphthyl ether epoxy compound is replaced with an equal mass of EBA-65 naphthalene-based epoxy resin: 2,2-1,6-naphthylenebis(oxymethylene)dioxirane (CAS: 27610-48-6).

[0136] The other steps are the same as those in Example 1.

[0137] The raw materials in Examples 1 to 5 and Comparative Examples 1 to 3 are shown in Table 1.

[0138] Table 1

[0139] Among them, the raw materials can be purchased from commercially available products:

[0140] Trimeric naphthyl ether epoxy compound: provided by Kungang New Materials, the structure is shown below:

[0141] Biphenyl epoxy resin: Nippon Kayaku NC3000H; naphthalene-type epoxy resin HP-5000: DIC Chemical; phenolic curing agent: Nippon Kayaku GPH-65; active ester curing agent: DIC Chemical HPC-8000-65T; imidazole accelerator: Shikoku Chemicals 2MI; spherical silica: Yaduma SO-C1; core-shell rubber particles: UMG Co., Ltd. B0603; additive: BYK-1650.

[0142] Analysis of the data in Table 1 shows that the build-up film prepared using the functional resin composition of the present application can have low thermal expansion, low water absorption and low warpage, as well as low dielectric constant and low dielectric loss.

[0143] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0144] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of this patent shall be determined by the appended claims.

Claims

1. A functional resin composition, characterized in that In terms of parts by mass, the functional resin composition comprises: Wherein, the structure of the functional material is shown in formula (1): m1 and m2 are independently selected from any integer from 1 to 5, and n1 is an integer greater than or equal to 2.

2. The functional resin composition according to claim 1, characterized in that The structure of the functional material is shown in formula (1-1):

3. The functional resin composition according to claim 1, characterized in that The functional material satisfies at least one of the following conditions (1) to (2): (1) m1 and m2 are independently selected from 1 or 2; (2)n1 is 3.

4. The functional resin composition according to any one of claims 1 to 3, characterized in that The structure of the functional material is shown in formula (1-2):

5. The functional resin composition according to any one of claims 1 to 3, characterized in that In terms of parts by mass, the functional resin composition comprises:

6. The functional resin composition according to any one of claims 1 to 3, characterized in that: The functional resin composition satisfies at least one of the following conditions (1) to (3): (1) The functional resin includes at least one of epoxy resin, benzoxazine resin and bismaleimide resin; (2) the curing agent comprises at least one of an amine curing agent, a phenolic curing agent, an acid anhydride curing agent, a cyanate curing agent and an active ester curing agent; (3) The curing accelerator includes at least one of a tertiary amine accelerator, an imidazole accelerator, a peroxide accelerator, an organic phosphorus accelerator and a transition metal carboxylate accelerator.

7. The functional resin composition according to any one of claims 1 to 3, characterized in that The inorganic filler satisfies at least one of the following conditions (1) to (2): (1) The inorganic filler includes at least one of spherical silica and spherical alumina; (2) The particle size D50 of the inorganic filler is 0.01 μm to 10 μm.

8. The functional resin composition according to any one of claims 1 to 5, characterized in that: The organic filler satisfies at least one of the following conditions (1) to (2): (1) The organic filler comprises at least one of silicone particles, core-shell rubber particles and olefin elastomer particles; (2) The particle size D50 of the organic filler is 10 nm to 1000 nm.

9. The functional resin composition according to any one of claims 1 to 3, characterized in that The functional resin composition further comprises other auxiliary agents, and the other auxiliary agents satisfy at least one of the following conditions (1) to (2): (1) The other additives include at least one of a dispersant, a leveling agent, a defoaming agent, a treating agent and a coupling agent; (2) The mass fraction of the other auxiliary agents is 1 to 5 parts.

10. A composite curing resin, characterized in that: The composite curing resin is prepared using raw materials including the functional resin composition according to any one of claims 1 to 9.

11. A method for preparing a composite cured resin, characterized in that: The steps include: The raw materials are subjected to a heating and curing treatment to prepare a composite curing resin; The raw material comprises the functional resin composition according to any one of claims 1 to 9.

12. A packaging product, characterized in that: The packaged product comprises the composite cured resin according to claim 10 or the composite cured resin prepared by the method for preparing the composite cured resin according to claim 11.

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