Polymer compositions comprising a semi-aromatic polyamide and a poly(arylene sulfide) and articles of the same

Abstract

Disclosed herein are polymer compositions comprising a poly(arylene sulfide) polymer, a semi-aromatic polyamide polymer, and a filler material. The filler material can comprise Mg(OH)2 and a reinforcing agent. The semi-aromatic polyamide polymer can be present in the polymer composition in an mount from 5.0% to 19.0% by weight, based on the total weight of the polymer composition. The filler material can be present in an amount from 50.0% to 75.0% by weight, based on the total weight of the polymer composition.

Description

POLYMER COMPOSITIONS COMPRISING A SEMI-AROMATIC POLYAMIDE AND A POLY(ARYLENE SULFIDE) AND ARTICLES OF THE SAMEREFERENCE TO RELATED APPLICATIONSThis application claims priority from US provisional application Nr. 63 / 612619 and Nr. 63 / 612631 , both filed on December 20, 2023, and from European patent application Nr. 24157667.7 and Nr. 24157665.1 , both filed on February 14, 2024, the whole content of each of these applications being incorporated herein by reference for all purposes.FIELD OF THE DISCLOSURE

[0001] The present disclosure relates to polymer compositions including a polyamide and a poly(arylene sulfide) and having excellent retention of mechanical and dielectric properties after exposure to elevated temperatures at normal conditions. The invention also relates to methods of making articles incorporating the polymer compositions.BACKGROUND

[0002] Traditionally, the high CTI of semi-aromatic polyamides make them excellent materials for use in the manufacture of components exposed to high temperature in applications like surface mount technology devices. However, as the technology advances, especially in the drive for technology miniaturization, more high temperature demands are being exacted on these materials. In this scenario, semi-aromatic polyamides do not meet the high temperature demand in these applications.

[0003] On the other hand, poly(arylene sulfides) polymers have high temperature resistance that makes them attractive material of choice in SMT technologies. However, poly(arylene sulfides) polymers alone have low CTI. Efforts to blend poly(arylene sulfides) and semi-aromatic polyamides have shown an increase in CTI without a corresponding increase in electrical and mechanical property retention when exposed to high temperature ageing. Under these ageing conditions, mechanical and electrical performance of these blended compounds tend to degrade to undesirable levels. Thus,a problem exists for which a solution of a poly(arylene sulfides) based compound with high CTI and high mechanical and electrical property retention is required.US6310130 discloses compositions containing, per 100 parts by weight of polyphenylene sulfide: 10 to 300 parts by weight of a polyamide and 20 to 350 parts by weight of a metal hydroxide the main constituent of which is magnesium hydroxide and additionally from 20 to 500 parts of a fibrous reinforcing material per 100 parts by weight of polyphenylene sulfide. The polyamides are preferably PA66 or PA MXD6.BRIEF SUMMARY

[0004] Disclosed herein are polymer compositions comprising a poly(arylene sulfide) polymer, a semi-aromatic polyamide polymer, and a filler material as defined in the appended claims. The filler material comprises comprise Mg(OH)2 and a reinforcing agent. The semi-aromatic polyamide polymer as defined in the claims is present in the polymer composition in an amount from 5.0% to 19.0% by weight, based on the total weight of the polymer composition. The filler material is present in an amount from 50.0% to 75.0% by weight, based on the total weight of the polymer composition.

[0005] The disclosed polymer compositions provide a balance between mechanical and dielectric property retention at elevated temperatures for extended periods of time. The presence of a semi-aromatic polyamide polymer as defined in claim 1 was found to be advantageous for tensile property retention and dielectric strength retention. The inventive compositions possess a satisfactory comparative tracking index (CTI). Furthermore, the effect of the Mg(OH)2 in the filler material was found to advantageously increase the tensile property retention at an optimized maximum concentration of Mg(OH)2 in the filler material.DETAILED DESCRIPTION

[0006] In the present application, any description, even if described in relation to a specific embodiment, is applicable to and interchangeable with other embodiments of the present disclosure, and each embodiment thus defined may be combined with another embodiment, unless otherwise indicated or clearly incompatible.

[0007] Where an element or component is said to be included in and / or selected from a list of recited elements or components, it should be understood that in relatedembodiments explicitly contemplated here, the element or component can also be any one of the individuals recited elements or components, or can also be selected from a group consisting of any two or more of the explicitly listed elements or components; any element or component recited in a list of elements or components may be omitted from such list.

[0008] Any recitation herein of numerical ranges by endpoints includes all numbers subsumed within the recited ranges as well as the endpoints of the range and equivalents.

[0009] The term “comprising” (or equivalents) includes “consisting essentially of,” and also “consisting of.”

[0010] As used herein, the term “consisting essentially of” or “essentially consisting” indicates that the referred to composition contains less than 5.0 wt%, typically less than 2.0 wt% or less than 1 .0 wt%, of any other ingredient.

[0011] The use of the singular “a” or “one” herein includes the plural unless specifically stated otherwise.

[0012] It should be understood that the elements, properties, and / or the characteristics of a (co)polymer, product or article, a process, or a use, described in the present specification, may be combined in all possible ways with the other elements, properties and / or characteristics of the (co)polymer, product or article, process or use, explicitly or implicitly, this being done without departing from the scope of the present description.

[0013] Should the disclosure of any patents, patent applications, and publications that are incorporated herein by reference conflict with the description of the present application to the extent that it may render a term unclear, the present description shall take precedence.

[0014] The Polymer Composition

[0015] The presently disclosed polymer compositions comprise a poly(arylene sulfide) polymer; a semi-aromatic polyamide polymer in an amount from 5.0 wt% to 19.0 wt%, wherein the semi-aromatic polyamide polymer is derived from the polycondensation of monomers in a reaction mixture comprising: (1 ) a diamine component (A) comprising 20.0 mol% to 95.0 mol% of a C4 to C12 aliphatic diamine and 5.0 mol% to 80.0 mol% of a bis(aminoalkyl)cyclohexane, where mol% is relative to the total moles of diamine monomers in the diamine component; and (2) a dicarboxylic acid component (B)comprising: 30.0 mol% to 100.0 mol% of terephthalic acid and 0 mol% to 70.0 mol% of a cyclohexane dicarboxylic acid, wherein mol% is relative to the total moles of dicarboxylic acid monomers in the dicarboxylic acid component ; and a filler material in an amount from 50.0 wt% to 75.0 wt%, based on the total weight of the polymer composition, the filler material comprising Mg(OH)2 and a reinforcing agent.

[0016] As noted above, it was surprisingly discovered that the disclosed polymer compositions provide mechanical and dielectric property retention after aging at elevated temperatures for extended periods of time.

[0017] Retention of mechanical properties can be determined according to following formula: 100*(Xi / Xo), where Xi is the value of a given mechanical property after aging and Xo is the value of the mechanical property prior to aging. Tensile modulus, tensile strength, tensile strain, and tensile elongation can be measured as described in the Examples section.

[0018] Similarly, retention of dielectric properties, both comparative tracking index and dielectric strength, can be determined according to the following formula: 100*(Yi / Yo), where Yi is the value of a given dielectric property after aging and Yo is the value of the dielectric property prior to aging. Comparative tracking index (CTI) and dielectric strength can be measured as described in the Examples section. Aging for the purposes of measuring mechanical property retention can be performed in a convection oven at 175°C or 225°C for up to 2500 hours. Aging for the purposes of measuring dielectric property retention can be performed by submerging a 1.5 mm thick sample in a 225°C oil bath for up to 2500 hours.

[0019] The polymer composition can have a comparative tracking index (CTI) of 375 V or more, 380 V or more, 390 V or more, 400 V or more, 410 V or more, 420 V or more, 430 V or more, 440 V or more, 450 V or more, 460 V or more, 470 V or more, 480 V or more, 490 V or more, 500 V or more, 510 V or more, 520 V or more, 525 V or more, 530V or more, 535 V or more, 540 V or more, 545 V or more, 550 V or more, 555 V or more, 560 V or more, 565 V or more, 570 V or more, 575 V or more, 580 V or more, 585 V or more, 590 V or more, 595 V or more, or 600 V or more. Alternatively, or in addition, the polymer composition can have a CTI of 650 V or less, 645 V or less, 640 V or less, 635V or less, 630 V or less, 625 V or less, 620 V or less, 615 V or less, or 610 V or less.

[0020] The polymer composition can have a tensile strain retention of at least 50%, at least 55%, at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 100%, or at least 105% after aging. The polymer composition can have a tensile strength retention of at least 60%, at least 65%, at least 70%, at least 75%, at least 80%, at least 85%, at least 90%, at least 95%, at least 100%, at least 105%, or at least 110% after aging.

[0021] The polymer composition can have a dielectric strength retention of at least 85%, at least 88%, at least 90%, at least 91 %, at least 92% or at least 94% after aging in an oil bath at 175°C for 2400 hours. The polymer composition can have a dielectric strength retention of at least 55%, at least 60%, at least 65%, at least 68%, at least 70% or at least 74% after aging in an oil bath at 225°C for 2400 hours.

[0022] The Poly(Arylene Sulfide) Polymer

[0023] The presently disclosed polymer compositions comprise a poly(arylene sulfide) polymer. As used herein, a poly(arylene sulfide) polymer refers to any polymer including at least 50.0 mol% of a recurring unit (RPAS) having the following formula: -[-Ar-S-]-, where Ar is an arylene. The poly(arylene sulfide) polymer can have at least 60.0 mol%, at least 70.0 mol%, at least 80.0 mol%, at least 90.0 mol%, at least 95.0 mol%, at least 99.0 mol% or at least 99.9 mol% of recurring unit (RPAS).

[0024] The recurring unit (RPAS) is represented by a formula selected from the following group of formulae:where R, at each instance, is independently selected from the group consisting of a Ci- 012 alkyl group, a C7-C24 alkylaryl group, a C7-C24 aralkyl group, a C6-C24 arylene group, and a Ce-C aryloxy group; T is selected from the group consisting of a bond, -CO-, - SO2-, -O-, -C(CH3)2, phenyl and -CH2-; k, at each instance, is an independently selected integer from 0 to 4; and I, at each instance, is an independently selected integer from 0 to 3.

[0025] Alternatively, or in addition, k and I, at each instance, is zero. Preferably, -Ar- is represented by either Formula (1 ) or (2), more preferably Formula (1 ) (recurring unit (RPAS) corresponding to recurring units of polyphenylene sulfide), still more preferably, recurring unit (RPAS) is represented by the following formula:wherein k =0.

[0026] The concentration of recurring unit (RPAS) in the poly(arylene sulfide) polymer is at least 50.0 mol%, at least 60.0 mol%, at least 70.0 mol%, at least 80.0 mol%, at least 90.0 mol%, at least 95.0 mol%, at least 98.0 mol%, at least 99.0 mol% or at least 99.9 mol%.

[0027] The poly(arylene sulfide) polymer can have a weight average molecular weight (“Mw”) of at least 10,000 g / mol, at least 20,000 g / mol, at least 25,000 g / mol, at least 30,000 g / mol, or at least 35,000 g / mol. In some embodiments, the poly(arylene sulfide) has an Mwof no more than 150,000 g / mol, no more than 100,000 g / mol, no more than 90,000 g / mol, no more than 85,000 g / mol, or no more than 80,000 g / mol. In some embodiments, the poly(arylene sulfide) (PASP) has an Mwof from 10,000 g / mol to 150,000 g / mol, from 20,000 g / mol to 100,000 g / mol, from 25,000 g / mol to 90,000 g / mol, from 30,000 g / mol to 85,000 g / mol, or from 35,000 g / mol to 80,000 g / mol. Mwcan bemeasured with gel permeation chromatography (“GPC”) using a 4-chloronapthalene standard.

[0028] The poly(arylene sulfide) polymer can be semi-crystalline. The person of ordinary skill in the art will recognize that when a polymer is amorphous, it lacks a detectable Tm. Accordingly, when a poly(arylene sulfide) polymer has a Tm, the person of ordinary skill in the art will recognize that it refers to semi-crystalline polymer. The PAS polymer can also have a AHf of at least 10 J / g, at least 20 J / g, at least, or at least 25 J / g. Alternatively, or in addition, the PAS polymer can have a AHf of no more than 90 J / g, no more than 70 J / g or no more than 60 J / g. The poly(arylene sulfide) polymer can have a AHf of from 10 J / g to 90 J / g or from 20 J / g to 70 J / g.

[0029] The poly(arylene sulfide) polymer can have a melting temperature (“Tm”) of at least 200 °C, at least 220°C, at least 240°C, or at least 250°C. Alternatively, or in addition, the poly(arylene sulfide) polymer can have a Tmof no more 350°C, no more than 320°C, no more than 300°C, or no more than 285°C. The PAS polymer can have a Tmof from 200°C to 350°C, from 220°C to 320°C, from 240°C to 300°C, or from 250°C to 285°C.

[0030] The poly(arylene sulfide) polymer can be present in the polymer composition in an amount from 10.0 wt% to 40.0 wt%, from 12.5 wt% to 40.0 wt%, from 14.0 wt% to 40.0 wt%, from 15.0 wt% to 40.0 wt%, from 16.0 wt% to 40.0 wt%, from 17.0 wt% to 40.0 wt%, from 18.0 wt% to 40.0 wt%, from 10.0 wt% to 37.5 wt%, from 15.0 wt% to 37.5 wt%, from 17.0 wt% to 37.5 wt%, from 12.5 wt% to 35.0 wt%, from 14.0 wt% to 35.0 wt%, from 15.0 wt% to 35.0 wt%, from 17.5 wt% to 35.0 wt%, based on the total weight of the polymer composition.

[0031] One or more poly(arylene sulfide) polymers may be present in the inventive composition. The amounts above refer to the total amount of the poly(arylene sulfide) polymer.

[0032] The Semi-Aromatic Polyamide Polymer

[0033] The presently disclosed polymer compositions comprise a semi-aromatic polyamide polymer derived from the polycondensation of monomers in a reaction mixture comprising: (1 ) a diamine component (A) comprising 20.0 mol% to 95.0 mol% of a C4 to C12 aliphatic diamine and 5.0 mol% to 80.0 mol% of a bis(aminoalkyl)cyclohexane, where mol% is relative to the total moles of diamine monomers in the diamine component; and(2) a dicarboxylic acid component (B) comprising: 30.0 mol% to 100.0 mol% of terephthalic acid and 0 mol% to 70.0 mol% of a cyclohexane dicarboxylic acid, wherein mol% is relative to the total moles of dicarboxylic acid monomers in the dicarboxylic acid component.

[0034] The semi-aromatic polyamide polymers described herein have a glass transition temperature (“Tg”) of at least 100 °C, a melting temperature (“Tm”) of at least 295 °C, and a heat of fusion (“AHf”) of at least 30 J / g.

[0035] The diamine component (A) includes all diamines in the reaction mixture, including 20.0 mol% to 95.0 mol% of a C4 to C12 aliphatic diamine and 5.0 mol% to 80.0 mol% of a bis(aminoalkyl)cyclohexane. When referring to the concentration of monomers in the diamine component (A), it will be understood that the concentration is relative to the total number of moles of all diamines in the diamine component (A), unless explicitly noted otherwise.

[0036] The C4 to C12 aliphatic diamine is represented by the following formula:H2N-R1-NH2, (4) where R1 is a C4 to C12 alkyl group, preferably a Ce to C10 alkyl group. In some embodiments, the C4 to C12 aliphatic diamine is selected from the group consisting of 1 ,4-diaminobutane (putrescine), 1 ,5-diaminopentane (cadaverine), 2-methyl-1 ,5- diaminopentane, hexamethylenediamine (or 1 ,6-diaminohexane), 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4-trimethyl- hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1 ,7-diaminoheptane, 1 ,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1 ,9-diaminononane, 2- methyl-1 ,8-diaminooctane, 5-methyl-1 ,9-diaminononane, 1 , 10-diaminodecane, 1 ,11 -diaminoundecane, and 1 ,12-diaminododecane. Preferably, the C4 to C12 aliphatic diamine is selected from the group consisting of 1 ,6-diaminohexane, 3-methylhexamethylenediamine, 2,2,4-trimethyl-hexamethylenediamine, 2,4,4-trimethyl- hexamethylenediamine, 1 ,9-diaminononane, 2-methyl-1 ,8-diaminooctane, 5-methyl-1 ,9- diaminononane, and 1 ,10-diaminodecane. Preferably, the C4 to C12 aliphatic diamine is a C5 to C10 aliphatic diamine. Most preferably, the C4 to C12 aliphatic diamine is selectedfrom 1 ,6-diaminohexane and 1 , 10-diaminodecane. More than one C4 to C12 aliphatic diamine can be present in the diamine component (A). In an advantageous embodiment, the diamine component (A) comprises, preferably consists of 1 ,6- diaminohexane and 1 ,10-diaminodecane.

[0037] The concentration of the C4 to C12 aliphatic diamine relative to the total moles of the diamine component is from 25.0 mol% to 95.0 mol%, from 30.0 mol% to 95.0 mol%, from 35.0 mol% to 95.0 mol%, from 40.0 mol% to 95.0 mol%, from 45.0 mol% to 95.0 mol%, or from 50.0 mol% to 95.0 mol%. In some embodiments, concentration of the C4 to C12 diamine is from 20.0 mol% to 90.0 mol%, from 25.0 mol% to 90.0 mol%, from 30.0 mol% to 90.0 mol%, from 35.0 mol% to 90.0 mol%, from 40.0 mol% to 90.0 mol%, from 45.0 mol% to 90.0 mol%, or from 50.0 mol% to 90.0 mol%.

[0038] The bis(aminoalkyl)cyclohexane is represented by the following formula:where R2 and R3 are independently selected Ci to C10 alkyls; Rj, at each location, is selected from the group consisting of an alkyl, an aryl, an alkali or alkaline earth metal sulfonate, an alkyl sulfonate, and a quaternary ammonium; and i is an integer from 0 to 10. The -R3-NH2 groups are relatively positioned in the meta position (1 ,3-) or the para position (1 ,4-). Preferably, i is 0 and R2 and R3 are both -CH2-. Most preferably, the bis(aminoalkyl)cyclohexane is selected from 1 ,3-bis(aminomethyl)cyclohexane (“1 ,3- BAC”) and 1 ,4-bis(aminomethyl)cyclohexane (“1 ,4-BAC”). Of course, the bis(aminoalkyl)cyclohexane can be in a cis or trans conformation. Accordingly, the diamine component (A) can include only the cis-bis(aminoalkyl)cyclohexane, only trans- bis(aminoalkyl)cyclohexane or a mixture of cis- and trans- bis(aminoalkyl)cyclohexane.

[0039] The amount of bis(aminoalkyl)cyclohexane is from 5.0 mol% to 75.0 mol%, from 5.0 mol% to 70.0 mol%, from 5.0 mol% to 65.0 mol%, from 5.0 mol% to 60.0 mol%, from 5.0 mol% to 55.0 mol%, or from 5.0 mol% to 50.0 mol%. In some embodiments, the concentration of the bis(aminoalkyl)cyclohexane is from 10.0 mol% to 75.0 mol%,from 10.0 mol% to 70.0 mol%, from 10.0 mol% to 65.0 mol%, from 10.0 mol% to 60.0 mol%, from 10.0 mol% to 55.0 mol%, or from 10.0 mol% to 50.0 mol%, or from 20.0 mol% to 40.0 mol%.

[0040] The diamine component (A) may include one or more additional diamines. The additional diamines are distinct from the C4 to C12 aliphatic diamine and distinct from the bis(aminoalkyl)cyclohexane. In some embodiments, one, some, or all of the additional diamines are represented by Formula (5), each distinct from each other and distinct from the C4 to C12 aliphatic diamine. In some embodiments, the each additional diamine is selected from the group consisting of 1 ,2 diaminoethane, 1 ,2-diaminopropane, propylene-1.3-diamine, 1 ,3 diaminobutane, , 2-methyl-1 ,5-diaminopentane, 1 ,13-diaminotridecane, 2,5-bis(aminomethyl)tetrahydrofuran and N,N-Bis(3-aminopropyl)methylamine. Included in this category are also cycloaliphatic diamine such as isophorone diamine,1.3-diaminocyclohexane, 1 ,4-diaminocyclohexane, bis-p-aminocyclohexylmethane. In some embodiments, the diamine component is free of cycloaliphatic diamines others than the bis(aminoalkyl)cyclohexane. As used herein, free of a monomer (e.g. bis(aminoalkyl)cyclohexane) means that the concentration of the monomer in the corresponding component (e.g. the diamine component (A)) is less than 1 mol%, preferably less than 0.5 mol.%, more preferably less than 0.10 mol%, even more preferably less than 0.05 mol%, most preferably less than 0.01 mol%.

[0041] The dicarboxylic acid component (B) includes all dicarboxylic acids in the reaction mixture, including 30.0 mol% to 100.0 mol% of terephthalic acid and 0.0 mol% to 70.0 mol%, preferably from 1 .0 mol% to 70.0 mol%, of a cyclohexanedicarboxylic acid. When referring to the concentration of monomers in the dicarboxylic acid component (B), it will be understood that the concentration is relative to number of moles of all dicarboxylic acids in the dicarboxylic acid component (B), unless explicitly noted otherwise.

[0042] The concentration of the terephthalic acid is from 35.0 mol% to 100.0 mol%, from 40.0 mol% to 100.0 mol%, from 45.0 mol% to 100.0 mol%, or from 50.0 mol% to 100.0 mol%. In some embodiments, the concentration of the terephthalic acid is from 30.0 mol% to 99.0 mol%, from 35.0 mol% to 99.0 mol%, from 40.0 mol% to 99.0 mol%, from 45.0 mol% to 99.0 mol% or from 50.0 mol% to 99.0 mol%. In some embodiments, the concentration of the terephthalic acid is from 30.0 mol% to 95.0 mol%, from 35.0 mol%to 97.0 mol%, from 40.0 mol% to 97.0 mol%, from 45.0 mol% to 97.0 mol% or from 50.0 mol% to 97.0 mol%.

[0043] The cyclohexanedicarboxylic acid is represented by the following formula:, (6) where Rj is selected from the group consisting of an alkyl, an aryl, an alkali or alkaline earth metal sulfonate, an alkyl sulfonate, and a quaternary ammonium; and j is an integer from 0 to 10. The explicit -COOH groups are relatively positioned in the meta position (1 ,3-) or the para position (1 ,4-), preferably the para position. Preferably, the cyclohexanedicarboxylic acid is 1 ,4-cyclohexanedicarboxylic acid (“CHDA”) (j is 0). Of course, the cyclohexanedicarboxylic acid can be in a cis or trans conformation. Accordingly, the dicarboxylic acid component (B) can include only the cis- cyclohexanedicarboxylicacid, only trans-cyclohexanedicarboxylic acid ora mixture of cisand trans-cyclohexanedicarboxylic acid.

[0044] The amount of the cyclohexanedicarboxylic acid, when present, is from 1 .0 mol% to 70.0 mol%, from 1.0 mol% to 65.0 mol%, from 1.0 mol%, to 60.0 mol%, from 1.0 mol% to 55.0 mol%, or from 1.0 mol% to 50.0 mol.%.

[0045] The dicarboxylic acid component (B) may include one or more additional dicarboxylic acids. Each additional dicarboxylic acid is distinct from each other and distinct from the terephthalic acid and the cyclohexanedicarboxylic acid. In some embodiments, one, some, or all of the additional dicarboxylic acids are represented by Formula (6), each distinct from each other and distinct from the cyclohexanedicarboxylic acid.

[0046] The one or more additional dicarboxylic acids are independently selected from the group consisting of C4 to C12 aliphatic dicarboxylic acids, aromatic dicarboxylic acids, and cycloaliphatic dicarboxylic acids. Examples of desirable C4 to C10 aliphatic dicarboxylicacids include, but are not limited to, succinic acid [HOOC-(CH2)2-COOH], glutaric acid [HOOC-(CH2)3-COOH], 2,2-dimethyl-glutaric acid [HOOC-C(CH3)2-(CH2)2-COOH], adipic acid [HOOC-(CH2)4-COOH], 2,4,4-trimethyl-adipic acid [HOOC-CH(CH3)-CH2-C(CH3)2-CH2-COOH], pimelic acid [HOOC-(CH2)5-COOH], suberic acid [H00C-(CH2)e-C00H], azelaic acid [H00C-(CH2)?-C00H], sebacic acid [HOOC-(CH2)8-COOH], 1 ,12-dodecanedioic acid [HOOC-(CH2)IO-COOH],

[0047] Suitable examples of desirable aromatic dicarboxylic acids include, but are not limited to, phthalic acids, including isophthalic acid (I A) , naphthalenedicarboxylic acids (e.g. naphthalene-2,6-dicarboxylic acid), 4,4’ bibenzoic acid, 2,5-pyridinedicarboxylic acid, 2,4-pyridinedicarboxylic acid, 3,5-pyridinedicarboxylic acid, 2,2-bis(4- carboxyphenyl)propane, 2,2 -bis(4-carboxyphenyl)hexafluoropropane, 2,2-bis(4- carboxyphenyl)ketone, 4,4’-bis(4-carboxyphenyl)sulfone, 2,2-bis(3- carboxyphenyl)propane, 2,2-bis(3-carboxyphenyl)hexafluoropropane, 2,2-bis(3- carboxyphenyl)ketone, bis(3-carboxyphenoxy)benzene.

[0048] Examples of desirably cycloaliphatic dicarboxylic acids include, but are not limited to, cyclopropane-1 , 2-dicarboxylic acid, 1-methylcyclopropane-1 ,2-dicarboxylic acid, cyclobutane-1 ,2-dicarboxylic acid, tetrahydrofuran-2,5-dicarboxylic acid, 1 ,3-adamantanedicarboxylic acid.

[0049] When the semi-aromatic polyamide polymer includes one or more additional dicarboxylic acids, the total concentration of the one or more additional dicarboxylic acids is no more than 20.0 mol%.

[0050] The semi-aromatic polyamide polymer formed from the polycondensation of the monomers in the diamine component (A) and dicarboxylic acid component (B), as described above, includes recurring units RPAI and RPA2, represented by the following formulae, respectively:and, additionally, when the cyclohexanedicarboxylic acid is present in the dicarboxylic acid component (B), recurring units RPAS and RPA4 represented by the following formulae, respectively:where Ri to R3, Ri, Rj, i and j are as defined above. The person of ordinary skill in the art will recognize that recurring unit RPAI is formed from the polycondensation of the C4 to C12 aliphatic diamine with the terephthalic acid, recurring unit RPAS is formed from the polycondensation of the C4 to C12 aliphatic diamine with the cyclohexane dicarboxylic acid, recurring unit RPA2 is formed from the polycondensation of the bis(aminoalkyl)cyclohexane with the terephthalic acid, and recurring unit RPA4 is formed from the polycondensation of the bis(aminoalkyl)cyclohexane with the cyclohexanedicarboxylic acid. In some embodiments, Ri is -(CH2)-m, where m is from 5 to 10, preferably from 5 to 9, most preferably 6. Additionally or alternatively, in some embodiments R2 and R3 are both -CH2-, and i and j are both zero. In some embodiments,the bis(aminalkyl)cyclohexane is 1 ,3-bis(aminomethyl)cyclohexane and the cyclohexanedicarboxylic acid is 1 ,4-cyclohexane dicarboxylic acid.

[0051] The total concentration of recurring units RPAI and RPA2 is at least 50.0 mol%, at least 60.0 mol%, at least 70.0 mol%, at least 80.0 mol%, at least 90.0 mol%, at least 95.0 mol%, at least 97.0 mol%, at least 98.0 mol%, at least 99.0 mol% or at least 99.5 mol%. In some embodiments in which the optional cyclohexanedicarboxylic acid is present in the dicarboxylic acid component (B), the total concentration of recurring units RPAI to RPA4 is at least 50.0 mol%, at least 60.0 mol%, at least 70.0 mol%, at least 80.0 mol%, at least 90.0 mol%, at least 95.0 mol%, at least 97.0 mol%, at least 98.0 mol%, at least 99.0 mol% or at least 99.5 mol%. When referring to mol% of a recurring unit, it will be understood that the concentration is relative to the total number of recurring units in the indicated polymer, unless explicitly noted otherwise.

[0052] Advantageously the semi-aromatic polyamide may derive from the condensation reaction of a diamine component consisting of 1 ,3-bis(aminomethyl)cyclohexane, 1 ,6- diaminohexane and 1 ,10-diaminodecane and a dicarboxylic acid component consisting of terephthalic acid.

[0053] Also advantageously the semi-aromatic polyamide may derive from the condensation reaction of a diamine component consisting of 1 ,3- bis(aminomethyl)cyclohexane and 1 ,6-diaminohexane and a dicarboxylic acid component consisting of terephthalic acidand 1 ,4-cyclohexanedicarboxylic acid.

[0054] The presently disclosed semi-aromatic polyamide polymers are semi-crystalline polyamides. As used herein, a semi-crystalline polyamide is a polyamide that has a heat of fusion (“AHf”) of at least 5 Joules per gram (“J / g”). In some embodiments, the semiaromatic polyamide polymers described herein have a AHf of at least 30 J / g, or at least 35 J / g. Alternatively, or in addition, the semi-aromatic polyamide polymers has a AHf of no more than 60 J / g or no more than 55 J / g. The semi-aromatic polyamide polymers can have a AHf of from 30 J / g to 60 J / g or from 35 J / g to 60 J / g, from 30 J / g to 55 J / g, or from 35 J / g to 55 J / g. AHf can be measured according to ASTM D3418 using a heating rate of 20 °C / minute.

[0055] The semi-aromatic polyamide polymer can have a Tg of at least 100 °C, at least 110 °C, at least 120 °C, at least 130 °C, at least 140 °C, at least 145°C, preferably at least150 °C. Alternatively, or in addition, the semi-aromatic polyamide polymer can have a Tg of no more than 190 °C, no more than 180 °C, or no more than 170 °C. The semi-aromatic PA polymer can have a Tg of from 100°C to 190°C, from 120 °C to 180 °C, from 145 °C to 170 °C, from 150 °C to 190 °C, from 150 °C to 180°C, or from 150 °C to 170°C. Tg can be measured according to ASTM D3418.

[0056] The semi-aromatic polyamide polymer can have a number average molecular weight ("Mn") ranging from 1 ,000 g / mol to 40,000 g / mol, for example from 2,000 g / mol to 35,000 g / mol, from 4,000 to 30,000 g / mol, or from 5,000 g / mol to 20,000 g / mol. The number average molecular weight Mn can be determined by gel permeation chromatography (GPC) using ASTM D5296 with polystyrene standards.

[0057] The semi-aromatic polyamide polymer can be prepared by any conventional method adapted to the synthesis of polyamides and polyphthalamides. Preferentially, the polyamide is prepared by reacting (by heating) the monomers in presence of less than 60 wt% of water, preferentially less than 50 wt%, up to a temperature of at least Tm+ 10°C, Tmbeing the melting temperature of the semi-aromatic polyamide polymer, where wt.% is relative to the total weight of the reaction mixture.

[0058] The semi-aromatic polyamide polymer described herein can for example be prepared by thermal polycondensation (also referred to as polycondensation or condensation) of aqueous solution of monomers and comonomers. In one embodiment, the semi-aromatic polyamide polymer is formed by reacting, in the reaction mixture, at least the C4 to C12 aliphatic diamine, the bis(aminoalkyl)cyclohexane, the terephthalic acid, and, if present in the dicarboxylic acid component (B), the cyclohexanedicarboxylic acid. In some embodiments, the total number of moles of diamines in the reaction mixture is substantially equimolar to the total number of moles of dicarboxylic acids in the reaction mixture. As used herein, substantial equimolar denotes a value that is ± 15% of the indicated number of moles. For example, in the context of the diamine and dicarboxylic acid concentrations in the reaction mixture, total number of moles of diamines in the reaction mixture is ± 15% of the total number of moles of dicarboxylic acids in the reaction mixture. The semi-aromatic polyamide polymer may contain a chain limiter, which is a monofunctional molecule capable of reacting with the amine or carboxylic acid moiety, and is used to control the molecular weight of the semi-aromatic polyamide polymer. Forexample, the chain limiter can be acetic acid, propionic acid, benzoic acid and / or benzylamine. A catalyst can also be used. Examples of catalyst are phosphorous acid, ortho-phosphoric acid, meta-phosphoric acid, alkali-metal hypophosphite such as sodium hypophosphite and phenylphosphinic acid. A stabilizer, such as a phosphite, may also be used.

[0059] The semi-aromatic polyamide polymer can be present in the polymer composition in an amount from 5.0 wt% to 19.0 wt%, from 5.0 wt% to 18.0 wt%, from 5.0 wt% to 17.5 wt%, from 5.0 wt% to 15.0 wt%, from 5.0 wt% to 14.0 wt%, from 5.0 to 13.0 wt%, from 5.0 to 12.5 wt%, 5.0 wt% to 10.0 wt%, based on the total weight of the polymer composition. The semi-aromatic polyamide polymer being present in the polymer composition in an amount of from 5.0 wt% to 15.0 wt% was found to have excellent mechanical property retention. Similarly, the semi-aromatic polyamide polymer being present in the polymer composition in an amount of 5.0 wt% or greater was found to advantageously increase the CTI of the polymer composition as well as the dielectric strength retention.

[0060] The Filler Material

[0061] The presently disclosed polymer compositions comprise a filler material including a metal hydroxide and a reinforcing agent. The filler material is present in the polymer composition in an amount from 50.0 wt% to 75.0 wt%, from 50.0 wt% to 67.5 wt%, from 55.0 wt% to 75.0 wt%, from 56.0 wt% to 74.0 wt%, from 57.0 wt% to 73.0 wt%, from 58.0 wt% to 72.0 wt%, from 60.0 wt% to 70.0 wt%, from 61 .0 wt% to 69.0 wt%, from 62.0 wt% to 68.0 wt%, from 63.0 wt% to 67.0 wt%, or from 64.0 wt% to 66.0 wt%, based on the total weight of the polymer composition.

[0062] The metal hydroxide is magnesium hydroxide (Mg(OH)2). The magnesium hydroxide used according to the embodiment of the invention is relatively high-purity magnesium hydroxide including not less than 70.0 wt% of an inorganic substance expressed by the chemical formula Mg(OH)2. In terms of the tracking resistance, the mechanical strength and the melt viscosity, suitably used is high-purity magnesium hydroxide preferably including not less than 80.0 wt% of the inorganic substance expressed by Mg(OH)2, not greater than 5.0 wt% of CaO content and not greater than 1.0 wt% of chlorine content, more preferably including not less than 95.0 wt% of the inorganicsubstance expressed by Mg(0H)2, not greater than 1.0 wt% of CaO content and not greater than 0.5 wt% of chlorine content and furthermore preferably including not less than 98.0 wt% of the inorganic substance expressed by Mg(OH)2, not greater than 0.1 wt% of CaO content and not greater than 0.1 wt% of chlorine content.

[0063] The magnesium hydroxide used according to the embodiment of the invention may be any form, such as granular form, flake form or fibrous form. In terms of, for example, the dispersibility, the granular form and the flake form are most preferable. The specific surface area is preferably not greater than 15 m2 / g and is more preferably not greater than 10 m2 / g. The specific surface area of greater than 15 m2 / g may affect the dispersibility of magnesium hydroxide and undesirably has adverse effects on the improvement of the tracking resistance and the mechanical strength. The “specific surface area” herein is a value measured by the BET method using nitrogen as adsorbed gas. In the case of using magnesium hydroxide in the granular form or the flake form, suitable magnesium hydroxide has the average primary particle diameter in the range of 0.3 to 5.0 pm or preferably in the range of 0.3 to 3.0 pm in terms of the good balance among the improvement of the tracking resistance, the mechanical strength and the melt viscosity. The “average primary particle diameter” is a value measured by the laser diffraction scattering method. In the case of using magnesium hydroxide in the fibrous form, suitable magnesium hydroxide has the average fiber diameter in the range of 0.1 to 2.0 pm and the aspect ratio in the range of 20 to 60 or preferably the average fiber diameter in the range of 0.3 to 2.0 pm and the aspect ratio in the range of 30 to 50. The “aspect ratio” is a ratio of the long side dimension of a substance to the short side dimension.

[0064] Magnesium hydroxide can be present in the filler material in an amount from 38.0 wt% to 62.0 wt%, from 39.0 wt% to 61 .0 wt%, from 40.0 wt% to 60.0 wt%, from 38.0 wt% to 61.0 wt%, from 38.0 wt% to 60.0 wt%, from 38.0 wt% to 59.0 wt%, from 38.0 wt% to 58.0 wt%, from 38.0 wt% to 57.0 wt%, from 38.0 wt% to 56.0 wt%, from 38.0 wt% to 55.0 wt%, from 39.0 wt% to 53.0 wt%, from 40.0 wt% to 52.0 wt%, from 41 .0 wt% to 51 .0 wt%, from 42.0 wt% to 50.0 wt%, from 43.0 wt% to 49.0 wt%, or from 44.0 wt% to 48.0 wt%, based on the total weight of the filler material. Magnesium hydroxide being present in anamount of approximately 46.0 wt% based on the total weight of the filler material was found to be an unexpectedly advantageous peak in mechanical property retention.

[0065] The filler further comprises a reinforcing agent. The reinforcing agent is different from magnesium hydroxide.

[0066] In general, reinforcing agents are fibrous reinforcing agents or particulate reinforcing agents or a mixture of the two. A fibrous reinforcing agent refers to a material having length, width and thickness, wherein the average length is significantly larger than both the width and thickness. Generally, such a material has an aspect ratio, defined as the average ratio between the length and the largest of the width and thickness of at least 5, at least 10, at least 20 or at least 50. In some embodiments, the fibrous reinforcing agent (e.g. glass fibers, or carbon fibers) has an average length of from 3 mm to 50 mm. In some such embodiments, the fibrous reinforcing agent has an average length of from 3 mm to 10 mm, from 3 mm to 8 mm, from 3 mm to 6 mm, or from 3 mm to 5 mm. In alternative embodiments, fibrous reinforcing agent has an average length of from 10 mm to 50 mm, from 10 mm to 45 mm, from 10 mm to 35 mm, from 10 mm to 30 mm, from 10 mm to 25 mm or from 15 mm to 25 mm. The average length of the fibrous reinforcing agent can be taken as the average length of the fibrous reinforcing agent prior to incorporation into the polymer composition or can be taken as the average length of the fibrous reinforcing agent in the polymer composition.

[0067] The morphology of the glass fiber is not particularly limited. As noted above, the glass fiber can have a circular cross-section (“round glass fiber”) or a non-circular crosssection (“flat glass fiber”). Examples of suitable flat glass fibers include, but are not limited to, glass fibers having oval, elliptical and rectangular cross sections. In some embodiments in which the polymer composition includes a flat glass fiber, the flat glass fiber has a cross-sectional longest diameter of at least 15 pm, preferably at least 20 pm, more preferably at least 22 pm, still more preferably at least 25 pm. Additionally or alternatively, in some embodiments, the flat glass fiber has a cross-sectional longest diameter of at most 40 pm, preferably at most 35 pm, more preferably at most 32 pm, still more preferably at most 30 pm. In some embodiments, the flat glass fiber has a cross- sectional diameter was in the range of 15 to 35 pm, preferably of 20 to 30 pm and more preferably of 25 to 29 pm. In some embodiments, the flat glass fiber has a cross-sectionalshortest diameter of at least 4 m, preferably at least 5 pm, more preferably at least 6 pm, still more preferably at least 7 pm. Additionally or alternatively, in some embodiments, the flat glass fiber has a cross-sectional shortest diameter of at most 25 pm, preferably at most 20 pm, more preferably at most 17 pm, still more preferably at most 15 pm. In some embodiments, the flat glass fiber has a cross-sectional shortest diameter was in the range of 5 to 20 preferably of 5 to 15 pm and more preferably of 7 to 11 pm.

[0068] The flat glass fiber has an aspect ratio of at least 2.0, preferably at least 2.2, more preferably at least 2.4, still more preferably at least 3. The aspect ratio is defined as a ratio of the longest diameter in the cross-section of the glass fiber to the shortest diameter in the same cross-section. Additionally or alternatively, in some embodiments, the flat glass fiber has an aspect ratio of at most 8.0, preferably at most 6.0, more preferably of at most 4.0. In some embodiments, the flat glass fiber has an aspect ratio of from 2.0 to 6.0, and preferably, from 2.2 to 4.0. In some embodiments, in which the glass fiber is a round glass fiber, the glass fiber has an aspect ratio of less than 2.0, preferably less than 1.5, more preferably less than 1.2, even more preferably less than 1.1 , most preferably, less than 1.05. Of course, the person of ordinary skill in the art will understand that regardless of the morphology of the glass fiber (e.g. round or flat), the aspect ratio cannot, by definition, be less than 1 .

[0069] The reinforcing agent may also be in the form of glass beads, including hollow glass beads. Hollow glass beads (also known as hollow glass microspheres or glass bubbles) are well known and notably are mentioned in Plastics Additives Handbook, Hanser, 4th edition, pages 537-538. The hollow glass beads that can be used in the inventive composition typically have a dimensional aspect ratio (short axis / long axis) of at least 0.9, preferably at least 0.95.

[0070] Examples of commercial hollow glass beads are available from 3M™ . A suitable example is iM16K (true density 0.46 g / cm3, crush strength 110 MPa).

[0071] Optional additive(s)

[0072] The polyamide composition may further comprise at least one additive.

[0073] The optional additive may be selected from the group consisting of ultra-violet (“UV”) stabilizers, heat stabilizers, antistatic agents, lubricants, nucleating agents,antioxidants, mold release agents, processing aids, and any combination of two or more thereof.

[0074] Preferably, the polyamide composition may further comprise at least one optional additive selected from the group consisting of antistatic agents, lubricants, and any combination thereof.

[0075] When the inventive composition further includes at least one optional additive the total concentration of the one or more optional additives is :- no more than 5.0 wt%, no more 3.0 wt%, no more 2.5 wt% based on the total weight of the composition, and / or- at least 0.05 wt%, at least 0.1 wt%, based on the total weight of the composition.

[0076] A suitable antistatic additive may be carbon black. Carbon black may be present in an amount of from 0 to 2.0 wt%, preferably from 0.05 wt.% to 1 .5 wt% and in particular from 0.1 wt.% to 1 .0 wt%, based on the total weight of the composition.

[0077] A suitable lubricant may be selected from high density polyethylene. A preferred concentration of lubricant in the composition may be from 0.05 wt% to 1.0 wt%, or from 0.1 wt% to 0.5 wt%, based on total weight of the composition.

[0078] Articles and Applications

[0079] The present disclosure also relates to articles comprising the disclosed polymer compositions. At least in part due to the improved mechanical and dielectric property retention after heat aging, the presently disclosed polymer compositions are desirably incorporated into any article that is exposed elevated temperatures during their intended use.

[0080] The article is selected from the group consisting of automotive components, marine components, and aerospace components. In some embodiments, the article is selected from the group consisting of fluid inlet / outlet ports, fluid inlet / outlet valves, fluid pump housings, fluid pump impellers, fluid hose connectors, fluid hoses, fluid reservoirs and fluid valves. The polymer compositions are even further advantageously incorporated into such articles when such articles are used within engine bays (e.g. exposed to elevated temperatures).

[0081] The article can be molded from the polymer composition by any process adapted to thermoplastics, e.g., extrusion, injection molding, blow molding, rotomolding orcompression molding. The polymer composition may also be used in overmolding preformed shapes to build hybrid structures. Suitable examples of molded articles comprising the polymer composition include, but are not limited to, busbars, semiconductors, surface mount devices, printed circuit boards, electrical component circuit boards, and combinations thereof.

[0082] The present disclosure will be now described with reference to the following examples, whose purpose is merely illustrative and not limitative of the present disclosure.

[0083] Raw Materials

[0084] PPS1 : poly(phenylene sulfide) having an MFR according to ASTM D1238 at 316 °C / 5.0 kg of 80 to 120 g / 10mins obtained from Solvay Specialty Polymers USA LLC.

[0085] PPS2: poly(phenylene sulfide) having an MFR according to ASTM D1238 at 316°C / 5.0 kg of 1300 to 1500 g / 10mins) were obtained from Solvay Specialty Polymers USA LLC.

[0086] PPA1 polymer is PA 6T / 1 ,3-BACT / 6CHDA / 1 ,3-BACCHDA, a copolyamide derived from 1 ,3-bis(aminomethyl)cyclohexane, hexamethylene diamine, terephthalic acid and 1 ,4-cyclohexanedicarboxylic acid; with intrinsic viscosity (IV) according to ASTM D2857 of 0.8 to 1 .2 dl / g; it was obtained from Solvay Specialty Polymers USA LLC.

[0087] PPA2 is PA 6T / 6I having IV of 0.8 to 1.2 g / dl according to ASTM D2857, was obtained from Solvay Specialty Polymers USA LLC.

[0088] PPA 3 is PA 6T / 10T / 1 ,3-BACT having IV of 0.9 to 1.15 g / dl according to ASTM D2857; it was obtained from Solvay Specialty Polymers USA.

[0089] PPA 4 is PA 9T with a MFR value ranging from 68 to 108 g / 10 mins at 320 °C and 2.16 Kg according to ISO 1133 method, it was obtained from Kuraray Co., LTD. Japan as Genestar GC51010.

[0090] GF: glass fiber DS 8800-11 P was obtained from 3B Fiberglass Belgium.

[0091] Magnesium hydroxide, (Mg(OH)2), Kisuma 5A was obtained from Kisuma Chemicals, Japan.

[0092] Lubricant: HDPE 6007G was procured from Nexeo Plastics USA.

[0093] Methods of Manufacture and Testing

[0094] The formulations shown in Tables I and V were compounded using a conventional twin screw extruder on the ZSK 26. The compounding was carried out at 350 to 360°C, screw speed of 200 rpm and a torque ranging from 35 to 80% of the extruder capacity. Samples were molded at higher temperature than is typical of PPS (360 to 370°C at a mold temperature of 150 to 180°C). Samples were molded into ISO multipurpose / tensile bars which were tested at room temperature according to ISO 527. Some tensile bars were then aged at 175°C and 225°C for 600 hrs and 2400 hrs and tested in accordance to ISO 527. The retention of the mechanical properties relative to room temperature values were then evaluated. The comparative tracking index was measured in accordance with IEC 60112. Aging for the purposes of measuring mechanical property retention can be performed in a convection oven at 175°C or 225°C for up to 2500 hours. Aging for the purposes of measuring dielectric property retention can be performed by submerging a 1 .5 mm thick sample in an oil bath at 225°C for up to 2500 hours. Dielectric strength was determined according to ASTM D149.

[0095] Examples 2-4 and Comparative Example 1

[0096] Comparative Example 1 , Example 2, Example 3, and Example 4 were prepared according to the above. The formulations are presented in Table I. The samples were then aged according to the above, and the results of the aging process on mechanical property retention are shown in Table II.

[0097] The CTI of the compositions is shown in Table III.Table I. Polymer compositions of Comparative Example 1 and Examples 2-4.Table II. Mechanical property retention of polymer compositions of Table Ia: TE is the Tensile Elongation measured according to ISO 527.b: TS is the Tensile Strength measured according to ISO 527.c: TM is the Tensile Modulus measured according to ISO 527.Table III: CTI of polymer compositions of Table I

[0098] As can be seen in Tables l-lll, the presence of 5.0 wt% to 15.0 wt% of the semiaromatic polyamide polymer from was found to have an excellent combination of tensile property retention and high CTI. The composition of Comp. Example 1 has good mechanical property retention but lower CTI in comparison to the compositions ofExamples 2 to 4. However, most applications need a combination of both CTI and tensile property retention.Table IV. Product of CTI and tensile properties for polymer compositions of Table I

[0099] Examples 5-6 and Comparative Examples 7-9

[0100] Comparative Examples 7 was prepared according to the above except the semiaromatic polyamide polymer was omitted. Examples 5 and 6 and Comp, Examples 8 and 9 were prepared according to the above. The formulations are presented in Table V. The samples were then aged according to the above, and the results of the aging process on mechanical property retention are shown in Table VI.Table V. Polymer compositions with different of semi-aromatic polyamidesTable VI. Tensile properties of polymer compositions of Table VTable VII. Product of CTI and tensile properties for polymer compositions of Table VTable VIII. Dielectric strength retention for polymer compositions of Table V

[0101] The results of Tables VI to VII show that formulations according to the invention provide a better balance of properties when compared to formulations that do not contain any semi-aromatic polyamide (CE7) or semi-aromatic polyamides like PPA2 or PPA4.

[0102] The compositions of Examples 5 and 6 exhibit a lower deterioration of the dielectric strength at long ageing times combined with good balance between CTI and tensile property retention.

Claims

CLAIMSWhat is claimed is:

1. A polymer composition comprising: a poly(arylene sulfide) polymer; a semi-aromatic polyamide polymer in an amount from 5.0 wt% to 19.0 wt%, based on the total weight of the polymer composition; and a filler material in an amount from 50.0 wt% to 75.0 wt%, based on the total weight of the polymer composition, the filler material comprising Mg(OH)2 and a reinforcing agent, wherein the semi-aromatic polyamide polymer is derived from the polycondensation of monomers in a reaction mixture comprising: (1) a diamine component (A) comprising 20.0 mol% to 95.0 mol% of a C4 to C12 aliphatic diamine and 5.0 mol% to 80.0 mol% of a bis(aminoalkyl)cyclohexane, where mol% is relative to the total moles of diamine monomers in the diamine component; and (2) a dicarboxylic acid component (B) comprising: 30.0 mol% to 100.0 mol% of terephthalic acid and 0.0 mol% to 70.0 mol% of a cyclohexane dicarboxylic acid, wherein mol% is relative to the total moles of dicarboxylic acid monomers in the dicarboxylic acid component.

2. The polymer composition of claim 1 , wherein the poly(arylene sulfide) polymer is present in the polymer composition in an amount from 15.0 wt% to 40.0 wt%, preferably 17.0 to 37.5 wt%, based on the total weight of the polymer composition.

3. The polymer composition of claim 1 or 2, wherein the poly(arylene sulfide) polymer is polyphenylene sulfide.

4. The polymer composition of any one of claims 1 to 3 wherein the semi-aromatic polyamide polymer is present in an amount from 5.0 wt% to 15.0 wt%, based on the total weight of the polymer composition.

5. The polymer composition of any one of claims 1 to 4 comprising:the poly(arylene sulfide) polymer in an amount from 17.5 wt% to 35.0 wt%; the semi-aromatic polyamide polymer in an amount from 5.0 wt% to 15.0 wt%; and the filler material in an amount from 50.0 wt% to 67.5 wt%, based on the total weight of the polymer composition.

6. The polymer composition of any one of claims 1 to 5, wherein the C4 to C12 aliphatic diamine is selected from the group consisting of 1 ,4-diaminobutane,1 ,5-diaminopentane, 2-methyl-1 ,5-diaminopentane, 1 ,6-diaminohexane, 3-methylhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2,2,4-trimethyl- hexamethylenediamine, 2,4,4-trimethyl-hexamethylenediamine, 1 ,7-diaminoheptane, 1 ,8-diaminooctane, 2,2,7,7-tetramethyloctamethylenediamine, 1 ,9-diaminononane, 2- methyl-1 ,8-diaminooctane, 5-methyl-1 ,9-diaminononane, 1 , 10-diaminodecane, 1 ,11 -diaminoundecane, and 1 ,12-diaminododecane; preferably the C4 to C12 aliphatic diamine is selected from the group consisting of 1 ,6-diaminohexane and 1 ,10- diaminodecane as well as their mixtures.

7. The polymer composition of any one of claims 1 to 6, wherein the bis(aminoalkyl)cyclohexane is 1 ,3-bis(aminomethyl)cyclohexane or 1 ,4- bis(aminomethyl)cyclohexane, preferably 1 ,3-bis(aminomethyl)cyclohexane.

8. The polymer composition of any one of claims 1 to 7 wherein the bis(aminoalkyl)cyclohexane is 1 ,3-bis(aminomethyl)cyclohexane and the C4 to C12 aliphatic diamine is a mixture of 1 ,6-diaminohexane and 1 , 10-diaminodecane.

9. The polymer composition of any one of claims 1 to 7, wherein the dicarboxylic acid component (B) comprises 1 .0 mol% to 70.0 mol% of cyclohexanedicarboxylic acid (CHDA), preferably 1 ,4-cyclohexanedicarboxylic acid, relative to the total moles of dicarboxylic acid monomer in the dicarboxylic acid component.

10. The polymer composition of claim 9 wherein the bis(aminoalkyl)cyclohexane is 1 ,3- bis(aminomethyl)cyclohexane and the C4 to C12 aliphatic diamine is 1 ,6-diaminohexane.11 . The polymer composition of any one of claims 1 to 10, wherein the semi-aromatic polyamide polymer is a polyamide with a glass transition temperature (Tg) of at least 100°C.

12. The polymer composition of any one of claims 1 to 11 , wherein the Mg(OH)2 is present in the filler material in an amount from 38.0 wt% to 62.0 wt%, based on the total weight of the filler material.

13. The polymer composition of any one of claims 1 to 12, wherein the reinforcing agent is selected from glass fibers or glass beads.

14. The polymer composition of any one of claims 1 to 13 further comprising a lubricant in an amount from 0.05 wt% to 1.0 wt%, based on total weight of the composition.

15. The polymer composition of any one of claims 1 to 14 further comprising carbon black in an amount of from 0.0 to 2.0 wt%, based on total weight of the composition.

16. A molded article comprising the polymer composition of any one of claims 1 to 15.

17. The molded article of claim 16, wherein the molded article is selected from the group consisting of: busbars, semiconductors, surface mount devices, printed circuit boards, electrical component circuit boards, and combinations thereof.

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