Lifting mechanism, housing and electronic device

Abstract

The embodiments of the present application relate to a lifting mechanism, a housing and an electronic device, which are used for solving the problem of relatively large thicknesses of electronic devices. The lifting mechanism comprises a base, a turn-over support, a lifting support and a linkage assembly. The turn-over support is rotatably connected to the base; the lifting support is movably connected to the base; the linkage assembly is connected to the turn-over support and the lifting support. In a closed state, the distance between a first free end of the turn-over support and a second surface is small, the distance between a second free end of the lifting support and the second surface is small, and the lifting support drives a heat dissipation housing to be closed with respect to a structural part, thus helping to reduce the thickness of an electronic device. In an open state, the distance between the first free end of the turn-over support and the second surface is large, and the distance between the second free end of the lifting support and the second surface is large, thus aiding in heat dissipation. In the process of the lifting mechanism switching from the closed state to the open state, by means of the linkage assembly, the turn-over support drives the lifting support to move in a lifting direction.

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