Cross-medium temperature measurement device and kitchen cooking appliance

Abstract

Provided in the embodiments of the present application are a cross-medium temperature measurement device and a kitchen cooking appliance. The cross-medium temperature measurement device comprises a thermal conductor, a temperature sensor and a thermal insulator. The temperature sensor is arranged in the thermal conductor, the thermal conductor is embedded in an installation chamber defined by a housing of the thermal insulator, an accommodation chamber formed in the thermal insulator is filled with a thermal insulation medium, and the thermal insulator wraps the thermal conductor so as to reduce the impact of the external environment on the thermal conductor, thus reducing the impact of the external environment on the temperature sensor, and finally making the cross-medium temperature measurement device provided by the embodiments of the present application have a higher measurement precision. In addition, a kitchen cooking appliance having the cross-medium temperature measurement device achieves more accurate temperature measurement of cooking utensils placed on the kitchen cooking appliance.

Description

Cross-medium temperature measuring device and kitchen cooking appliance

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese application No. 2023236631699, filed on December 29, 2023, which is hereby incorporated by reference in its entirety for all purposes. Technical Field

[0003] The embodiments of the present application relate to the field of temperature measurement technology, and in particular, to a cross-medium temperature measurement device and a kitchen cooking appliance. Background Art

[0004] Cooking appliances typically need to monitor the temperature of the ingredients or pots they heat in order to match the appropriate heating power and control measures that affect the food's properties. However, current temperature measurement methods in the appliance sector are relatively simple. Typically, a temperature sensor is placed on the appliance to monitor temperature. This temperature sensor typically has no direct contact with the food or pot, leading to significant drawbacks in many situations. This is particularly true when measuring the temperature of one object across another, as it relies heavily on the thermal conductivity of the object being crossed. Consequently, traditional temperature measurement devices suffer from poor structural stability and are easily affected by the external environment, resulting in low measurement accuracy. Summary of the Invention

[0005] The embodiments of the present application provide a cross-medium temperature measurement device to at least partially improve the above-mentioned problem.

[0006] In a first aspect, embodiments of the present application provide a trans-medium temperature measurement device, comprising: a thermal conductor, a temperature sensor, and a thermal insulator. The temperature sensor is disposed within the thermal conductor. The thermal insulator comprises a housing and a thermal insulating medium, the housing defining a mounting cavity, the thermal conductor embedded within the mounting cavity and abutting against the thermal insulator, and the housing defining a receiving cavity filled with the thermal insulating medium.

[0007] In a second aspect, an embodiment of the present application provides a kitchen cooking appliance, which is provided with the above-mentioned cross-medium temperature measuring device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0009] FIG1 shows a structural block diagram of a kitchen cooking appliance provided by an embodiment of the present application;

[0010] FIG2 shows a schematic structural diagram of a cross-medium temperature measurement device provided by an embodiment of the present application installed on an induction cooker;

[0011] FIG3 shows a schematic structural diagram of a cross-medium temperature measurement device provided in one embodiment of the present application;

[0012] FIG4 shows a schematic structural diagram of a heat conductor, a temperature sensor, and a wire provided in one embodiment of the present application;

[0013] FIG5 shows a schematic structural diagram of a temperature measurement device provided in an embodiment of the present application.

[0014] Figure 1: Kitchen cooking appliance 1, cross-medium temperature measuring device 10, heat conductor 110, first surface 111, second surface 112, contact portion 113, support portion 114, temperature sensor 120, first temperature sensor 121, second temperature sensor 122, thermal insulator 130, shell 131, installation cavity 1311, first installation cavity 1311a, second installation cavity 1311b, accommodating cavity 1312, inner shell 1313, outer shell 1314, thermal insulation medium 132, connecting hole 133, wire 140, microcrystalline panel 20, substrate 30, thermal insulator 200, thermal insulation medium 201. DETAILED DESCRIPTION

[0015] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0016] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0017] Cooking appliances typically need to monitor the temperature of the ingredients or pots they heat to determine the appropriate heating power and control measures that affect the food's properties. However, current temperature measurement methods in the appliance sector are relatively simple. Typically, a temperature sensor is placed on the appliance to monitor temperature, but this sensor typically has no direct contact with the food or pot. This method has significant drawbacks in many situations, particularly when measuring the temperature of one object across another, which depends heavily on the thermal conductivity of the object being measured.

[0018] As a result, traditional temperature measuring devices often have poor structural stability and are easily affected by the external environment. For example, when cooking appliances are in use, the heat generated by the appliances themselves is often transferred to the temperature measuring device. This can cause the temperature measuring device to simultaneously measure the heat generated by the cooking appliance itself and the temperature of the food or pot heated by the cooking appliance. These two temperatures are combined and difficult to distinguish, resulting in low measurement accuracy of traditional temperature measuring devices. Based on the above problems, embodiments of the present application provide a cross-medium temperature measuring device to at least partially improve the above problems.

[0019] Please refer to Figure 1, which shows a structural block diagram of a kitchen cooking appliance 1 provided in an embodiment of the present application. The embodiment of the present application also provides a kitchen cooking appliance 1, which is provided with a cross-medium temperature measuring device 10 as described above. The kitchen cooking appliance 1 includes but is not limited to: an induction cooker, a microwave oven, an air fryer, etc.

[0020] For ease of explanation, the embodiment of the present application is described by taking the cross-medium temperature measuring device 10 applied to an induction cooker as an example. Please refer to Figures 2-3. Figure 2 shows a structural schematic diagram of a cross-medium temperature measuring device 10 provided by an embodiment of the present application installed on an induction cooker. Figure 3 shows a structural schematic diagram of a cross-medium temperature measuring device 10 provided by an embodiment of the present application. The induction cooker may include a microcrystalline panel 20 and a substrate 30. The microcrystalline panel 20 may be used to hold pots and pans. The cross-medium temperature measuring device 10 may be disposed between the microcrystalline panel 20 and the substrate 30 to facilitate the fixation of the cross-medium temperature measuring device 10 and facilitate the cross-medium temperature measuring device 10 to transmit the temperature of the microcrystalline panel 20.

[0021] Referring to FIG. 3 , in this embodiment, the trans-medium temperature measurement device 10 may include a heat conductor 110 , a temperature sensor 120 , and a heat insulator 130 .

[0022] The heat conductor 110 has a first surface 111 and a second surface 112 facing each other. The first surface 111 is configured to contact a medium in contact with an object to be measured. In this embodiment, the microcrystalline panel 20 serves as the medium, and the cookware serves as the object to be measured, which abuts against the microcrystalline panel 20 and the substrate 30. The thermal conductivity of the heat conductor 110 is greater than that of the insulator 130.

[0023] The embodiments of the present application do not limit the specific structure and material of the heat conductor 110. For example, in some embodiments, the heat conductor 110 can be made of a material with high thermal conductivity. For example, the material of the heat conductor 110 can include at least one of metal, ceramic, graphite, etc. These materials have excellent thermal conductivity, can quickly transfer heat, reduce thermal resistance, and improve heat conduction efficiency. The specific thermal conductive material to be used can be selected according to actual conditions.

[0024] Specifically, metal materials are a common type of heat conductor 110, such as copper and silver, which have good thermal conductivity and high thermal stability. When the contact area between metals is large, the metallic bonds between atoms can transfer heat, allowing the heat to diffuse rapidly. In addition, metal materials have strong tensile strength and compressive resistance and can withstand large thermal stresses. However, metal materials also have certain limitations, such as high density, high cost, and poor oxidation resistance.

[0025] Ceramic materials, such as aluminum oxide and silicon nitride, are also excellent thermal conductors 110. Ceramics have advantages such as a high melting point, high hardness, and a low coefficient of thermal expansion, making them relatively stable in high-temperature environments. Furthermore, the small gaps between ceramic materials facilitate rapid heat transfer. However, ceramic materials still have slightly lower thermal conductivity than metals and have poor impact resistance, making them susceptible to breakage.

[0026] Graphite, as a heat conductor 110, has excellent thermal conductivity and chemical stability. The carbon atoms in graphite crystals are arranged in hexagonal, planar layers, forming strong π bonds that allow heat to be transferred rapidly between the graphite layers. Graphite also has a low coefficient of thermal expansion and good oxidation resistance, making it stable in high-temperature environments. However, graphite materials have relatively low tensile and compressive strengths.

[0027] In this embodiment, the cross-section of the heat conductor 110 can be a T-shaped structure. The heat conductor 110 can include a contact portion 113 and a support portion 114. The support portion 114 can be connected to the contact portion 113. The first surface 111 can be located at the contact portion 113. The cross-sectional area of ​​the contact portion 113 can be greater than the cross-sectional area of ​​the support portion 114. It can be understood that the embodiment of the present application does not limit the specific structure of the support portion 114 and the contact portion 113. For example, the support portion 114 and the contact portion 113 can both be cylindrical structures. For another example, the support portion 114 and the contact portion 113 can both be rectangular structures. For another example, one of the support portion 114 and the contact portion 113 is a rectangular structure and the other is a cylindrical structure, etc.

[0028] The embodiment of the present application is described using the example that both the support portion 114 and the contact portion 113 are cylindrical structures. The diameter of the contact portion 113 is larger than the diameter of the support portion 114, and the cross-sectional area of ​​the contact portion 113 is larger than the cross-sectional area of ​​the support portion 114. When the heat conductor 110 conducts heat, heat is transferred from the contact portion 113 to the support portion 114. The cross-sectional area of ​​the contact portion 113 is understood to be the cross-sectional area produced by cutting the contact portion 113 with a plane perpendicular to the direction of heat transfer, and the cross-sectional area of ​​the support portion 114 is understood to be the cross-sectional area produced by cutting the support portion 114 with a plane perpendicular to the direction of heat transfer. The cross-sectional area of ​​the contact portion 113 is larger than the cross-sectional area of ​​the support portion 114, which increases the contact area between the contact portion 113 and the microcrystalline panel 20, thereby facilitating the microcrystalline panel 20 to transfer heat to the heat conductor 110, thereby increasing the speed at which the temperature sensor 120 senses the temperature of the heat conductor 110, and thereby improving the temperature measurement efficiency of the cross-medium temperature measuring device 10.

[0029] In one embodiment, the temperature sensor 120 may be disposed in the heat conductor 110 , so that the temperature of the heat conductor 110 can be detected more intuitively and the influence of the external environment on the temperature sensor 120 can be reduced.

[0030] In another embodiment, the temperature sensor 120 may be directly printed on the outer surface of the heat conductor 110 through a printing process, so that the connection between the temperature sensor 120 and the heat conductor 110 can be tighter.

[0031] It should be noted that the embodiment of the present application does not limit the specific structure and type of the temperature sensor 120. For example, the temperature sensor 120 can be implemented by using at least one of a negative temperature coefficient thermistor (NTC) sensor, an infrared temperature sensor 120 or a thermocouple sensor. The embodiment of the present application preferably uses a negative temperature coefficient thermistor sensor.

[0032] Specifically, the negative temperature coefficient thermistor sensor may include at least one of a ceramic NTC thermistor, a thin film NTC thermistor, a glass NTC thermistor, or a silicon carbide NTC thermistor. Ceramic NTC thermistors, primarily made of oxide ceramics, have a high temperature coefficient of resistance and stability; thin film NTC thermistors, primarily made of metal oxide thin films, have high sensitivity and stability; glass NTC thermistors, primarily made of glass, have high stability and reliability; and silicon carbide NTC thermistors have high sensitivity and stability. The specific temperature sensor 120 used can be selected based on actual conditions.

[0033] The insulator 130 can be arranged on the periphery of the thermal conductor 110. The insulator 130 can be used to reduce the impact of the external environment on the thermal conductor 110, and further can be used to reduce the impact of the external environment on the temperature sensor 120, and ultimately improve the accuracy of the temperature measurement of the object to be measured. Among them, the insulator 130 is used to block and hinder the heat transfer between the external environment and the thermal conductor 110, and does not mean "completely isolating the heat transfer". It should be noted that, in one embodiment, the insulator 130 can be a solid insulator 130, such as rubber, plastic or wood. The molecular structure of these materials is relatively complex, and the interaction between molecules is weak, resulting in poor thermal conductivity.

[0034] In some other embodiments, gas, such as nitrogen, helium, etc., can also be used as an insulator. The molecular distance between these gases is large and the thermal conductivity is poor. Specifically, the above-mentioned gas can be filled between the microcrystalline panel 20 and the substrate 30. However, this method has high requirements on the sealing of the induction cooker. The embodiment of the present application preferably sets a solid insulator 130, and the following explanation is made by taking the insulator 130 as a solid material as an example.

[0035] Furthermore, in this embodiment, the thermal insulator 130 may include: a shell 131 and a thermal insulation medium 132. Specifically, the shell 131 may be made of the above-mentioned solid material.

[0036] The shell 131 can enclose an installation cavity 1311, and the heat conductor 110 can be embedded in the installation cavity 1311 and abut against the heat insulator 130. That is to say, in this embodiment, the shape and size of the installation cavity 1311 can match the shape and size of the heat conductor 110. As mentioned above, the cross-section of the heat conductor 110 is a T-shaped structure. Therefore, in this embodiment, the structure of the installation cavity 1311 can also be a T-shaped cavity, which can facilitate the installation of the heat conductor 110 and the shell 131.

[0037] Specifically, in one embodiment, the mounting cavity 1311 may include a first mounting cavity 1311a and a second mounting cavity 1311b that are connected. The contact portion 113 may be embedded in the first mounting cavity 1311a, and the support portion 114 may be embedded in the second mounting cavity 1311b. In this embodiment, when the heat conductor 110 is embedded in the mounting cavity 1311, the bottom surface of the first mounting cavity 1311a may abut against the bottom surface of the contact portion 113, thereby supporting the heat conductor 110.

[0038] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0039] A housing 1312 is formed in the housing 131, and the insulating medium 132 can be filled in the housing 1312. It should be noted that the embodiment of the present application does not limit the specific structure of the housing 1312. For example, it can be a cylinder or a square prism, etc., and can be specifically set according to actual conditions. At the same time, the embodiment of the present application does not limit the specific material of the insulating medium 132. In this embodiment, the thermal conductivity of the insulating medium 132 is less than 1W / (m·k). For example, it can be rubber, plastic, wood, etc. The molecular structure of these materials is relatively complex, and the interaction between molecules is weak, resulting in poor thermal conductivity. Furthermore, the thermal conductivity of the insulating medium 132 can be less than 0.12W / (m·k). For example, foamed cement, rock wool, or aluminum silicate wool can be used. The thermal conductivity of foamed cement is 0.08W / (m·k)-0.28W / (m·k). Specifically, the embodiment of the present application can use foamed cement with a thermal conductivity of 0.08W / (m·k)-0.12W / (m·k). The thermal conductivity of rock wool is 0.03W / (m·k)-0.047W / (m·k), and the thermal conductivity of aluminum silicate wool is less than 0.07W / (m·k). The use of these materials can further reduce the impact of the external environment on the heat conductor 110, thereby reducing the impact of the external environment on the temperature sensor 120, which is conducive to improving the accuracy of temperature detection by the cross-medium temperature measuring device 10.

[0040] In some embodiments, the housing 131 may not have the accommodating cavity 1312. The insulating medium 132 may be placed directly within the mounting cavity 1311 and in direct contact with the thermal conductor 130. For example, the insulating medium 132 may be air, and the thermal conductor 130 may be placed within the mounting cavity 1311. The air (insulating medium 132) surrounds the thermal conductor 130, separating the thermal conductor 130 from the inner wall of the housing 131 and reducing the impact of the external environment on the thermal conductor 130. Furthermore, to stabilize the position of the thermal conductor 130, a positioning portion may be provided within the housing 131 to secure the thermal conductor 130 and ensure separation between the thermal conductor 130 and the inner wall of the housing 131.

[0041] The cross-medium temperature measuring device 10 provided in the embodiment of the present application is configured to provide a temperature sensor 120 within a heat conductor 110, embed the heat conductor 110 within an installation cavity 1311 surrounded by a shell 131 of a heat insulator 130, and fill a receiving cavity 1312 formed inside the heat insulator 130 with a heat insulating medium 132. The heat insulator 130 wraps the heat conductor 110 to reduce the impact of the external environment on the heat conductor 110, thereby reducing the impact of the external environment on the temperature sensor 120. Ultimately, the cross-medium temperature measuring device 10 provided in the embodiment of the present application has higher measurement accuracy, and the kitchen cooking appliance 1 applied with the cross-medium temperature measuring device 10 can more accurately measure the temperature of cooking utensils placed on the kitchen cooking appliance 1.

[0042] Furthermore, in one embodiment, the shell 131 may include an inner shell 1313 and an outer shell 1314. The inner shell 1313 may form an installation cavity 1311. The outer shell 1314 may be closed and connected to the inner shell 1313, and there is a gap between the inner wall of the outer shell 1314 and the outer wall of the inner shell 1313. The outer shell 1314 surrounds the inner shell 1313 and together with the inner shell 1313 defines the accommodating cavity 1312. The inner shell 1313 and the outer shell 1314 may both be elastic shells 131. To facilitate production and processing, in this embodiment, the inner shell 1313 and the outer shell 1314 may be made of the same material, such as rubber or silicone. These materials have good deformation ability and are generally not affected within 200°C, which is beneficial to improving the stability of the shell 131.

[0043] The shell 131 is an elastic shell, and the insulation medium 132 is disposed in the shell 131 and fits against the inner wall of the shell 131. For example, there is an elastic resisting force between the insulation medium 132 and the shell 131, and the insulation medium 132 and the shell 131 fit closely under the action of the elastic resisting force.

[0044] In a more specific embodiment, the insulating medium 132 can be made of butyl rubber, and the shell 131 can be made of rubber. The thermal conductivity of butyl rubber is 0.09 W / (m·k), so it has a good insulating effect. At the same time, butyl rubber is an amorphous colloidal substance with good fluidity. Therefore, butyl rubber can be poured into the rubber shell 131. This allows the insulating medium 132 to be tightly attached to the shell 131, avoiding the formation of a gap between the insulating medium 132 and the shell 131, which would reduce the insulating effect. In addition, because rubber is elastic, during the process of pouring butyl rubber into the rubber shell 131, the rubber can produce a certain elastic deformation, so that the butyl rubber fills the entire rubber shell 131 after the pouring is completed. This also avoids the formation of a gap between the insulating medium 132 and the shell 131, which would reduce the insulating effect.

[0045] Furthermore, in this embodiment, the thickness of the outer shell 1314 and the inner shell 1313 are both greater than 1 mm, which can prevent the outer shell 1314 and the inner shell 1313 from being too thin, thereby preventing damage during the filling and perfusion process of the insulating medium 132. At the same time, if the thickness of the outer shell 1314 and the inner shell 1313 is too thin, it may also lead to poor insulation effect of the insulation body.

[0046] It can be understood that the embodiment of the present application does not limit the specific thickness and maximum thickness of the outer shell 1314 and the inner shell 1313, and can be selected according to actual conditions. For example, when the cross-medium temperature measuring device 10 is installed in an induction cooker with a large distance between the microcrystalline panel 20 and the substrate 30, the thickness of the outer shell 1314 and the inner shell 1313 can be set to be larger so that the two ends of the insulation body are in contact with the microcrystalline panel 20 and the substrate 30, ensuring the installation stability of the cross-medium temperature measuring device 10, and further ensuring the stability of the cross-medium temperature measuring device 10 when measuring temperature.

[0047] In one embodiment, the distance between the inner shell 1313 and the outer shell 1314 is greater than 1 mm, which can avoid the space in the installation cavity 1311 being too small, and further avoid the insulation medium 132 being too little, resulting in the insulation body 130 having difficulty in achieving insulation effect, or poor insulation effect.

[0048] It can be understood that the embodiment of the present application does not limit the specific spacing between the outer shell 1314 and the inner shell 1313, and the specific spacing can be selected according to actual conditions. In some embodiments, the distance between the outer shell 1314 and the inner shell 1313 can be set to be less than 10 mm, which can avoid the volume of the insulation body 130 being too large and is conducive to cost saving.

[0049] Furthermore, in one embodiment, a plurality of temperature sensors 120 may be provided, and the plurality of temperature sensors 120 may be evenly arranged in the heat conductor 110 , which is beneficial to improving the accuracy of temperature measurement by the cross-medium temperature measuring device 10 .

[0050] Please refer to Figure 4, which shows a schematic diagram of the structure of a heat conductor, a temperature sensor, and a wire provided in an embodiment of the present application. The temperature sensor 120 is provided on the support portion 114. Specifically, in this embodiment, there can be two temperature sensors 120, namely a first temperature sensor 121 and a second temperature sensor 122. The first temperature sensor 121 and the second temperature sensor 122 are arranged at intervals. It should be noted that the embodiment of the present application does not limit the specific positions of the first temperature sensor 121 and the second temperature sensor 122. For example, the first temperature sensor 121 can be arranged adjacent to the first surface 111, and the second temperature sensor 122 can be arranged adjacent to the second surface 112. In this embodiment, two temperature sensors 120 are provided, and the temperature of the object to be measured can be measured by measuring the heat flow.

[0051] Furthermore, in one embodiment, the first temperature sensor 121 and the second temperature sensor 122 can be arranged on the central axis of the heat conductor 110, and are arranged at intervals along the central axis direction of the heat conductor 110. It can be understood that the closer to the edge of the heat conductor 110, the greater the possibility of being affected by the external temperature. Therefore, the above-mentioned setting of the first temperature sensor 121 and the second temperature sensor 122 can further reduce the impact of the external temperature on the first temperature sensor 121 and the second temperature sensor 122, thereby helping to improve the measurement accuracy of the first temperature sensor 121 and the second temperature sensor 122.

[0052] In one embodiment, a connecting hole 133 is defined at one end of the housing 131 . The cross-medium temperature measuring device 10 may further include a wire 140 , one end of which is electrically connected to the temperature sensor 120 , and the other end of which is led out from the connecting hole 133 .

[0053] It should be noted that the embodiment of the present application does not limit the specific position of the connecting hole 133. For example, the connecting hole 133 can be set at an end away from the first surface 111. Since the first surface 111 is in contact with the medium of the object to be measured, if the connecting hole 133 is opened on the first surface 111, it will affect the heat transferred from the medium received by the heat conductor 110. Therefore, the above-mentioned arrangement of the wire 140 can reduce the impact of the external environment on the temperature sensor 120 when the wire 140 is led out, which is beneficial to improving the measurement accuracy of the temperature sensor 120, and further improve the measurement accuracy of the cross-medium temperature measuring device 10.

[0054] It should be noted that, in this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two elements, or interaction between two elements, unless otherwise expressly specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0055] The working principle of the cross-medium temperature measurement device 10 provided in the embodiment of the present application is as follows:

[0056] Because the first surface 111 of the thermal conductor 110 is in contact with the medium in contact with the object to be measured, the object to be measured can transfer its temperature to the medium, and the medium can transfer its temperature to the thermal conductor 110. The thermal insulator 130 disposed outside the thermal conductor 110 can avoid the influence of the ambient temperature. Specifically, the outer shell 1314 of the thermal insulator 130 can enclose an installation cavity 1311, and the thermal conductor 110 is disposed within the installation cavity 1311. The outer shell 1314 of the thermal insulator 130 can provide a certain degree of thermal insulation. In addition, the interior of the shell 131 also forms a receiving cavity 1312, which can be filled with a thermal insulation medium 132 to further provide a thermal insulation effect.

[0057] The kitchen cooking appliance 1 provided in the embodiment of the present application sets a temperature sensor 120 in a heat conductor 110, embeds the heat conductor 110 in an installation cavity 1311 surrounded by a shell 131 of an insulator 130, and fills an accommodating cavity 1312 formed inside the insulator 130 with an insulating medium 132. The insulator 130 wraps the heat conductor 110 to reduce the impact of the external environment on the heat conductor 110, thereby reducing the impact of the external environment on the temperature sensor 120. Ultimately, the measurement accuracy of the cross-medium temperature measuring device 10 provided in the embodiment of the present application is higher. At the same time, the kitchen cooking appliance 1 using the cross-medium temperature measuring device 10 can more accurately measure the temperature of cooking utensils placed on the kitchen cooking appliance 1.

[0058] Referring to FIG. 5 , an embodiment of the present application further provides a temperature measuring device, which may include a heat conductor, a temperature sensor, and a heat insulator 200. The temperature sensor is disposed on the heat conductor. The heat insulator 200 may include a housing and a heat insulating medium 201. The housing defines a mounting cavity, and the heat conductor is embedded within the mounting cavity and in contact with the heat insulator 200. The housing forms a receiving cavity, and the heat insulating medium 201 is disposed within the receiving cavity. The thermal conductivity of the heat insulator 200 is less than that of the heat conductor.

[0059] The temperature measuring device in this embodiment may have one or more features of the cross-medium temperature measuring device provided in any of the aforementioned embodiments. Where there is no conflict, the features of the cross-medium temperature measuring device provided in any of the aforementioned embodiments may be incorporated into the temperature measuring device in this embodiment. For example, the heat conductor in this embodiment may include one or more features of the heat conductor 110 provided in any of the aforementioned embodiments. Specifically, the heat conductor may include the contact portion 113 and the support portion 114 of the aforementioned heat conductor 110. The temperature sensor in this embodiment may be understood as the temperature sensor 120 provided in any of the aforementioned embodiments and may have one or more features of the aforementioned temperature sensor 120.

[0060] The thermal insulator 200 in this embodiment is used to block or hinder heat transfer between the outside world and the heat conductor. The thermal insulator 200 may include one or more features of the thermal insulator 130 provided in any of the above-mentioned embodiments. For example, the thermal insulator 200 may also include the shell 131 of the above-mentioned thermal insulator 130. The thermal insulating medium 201 in this embodiment may include one or more features of the thermal insulating medium 132 provided in any of the above-mentioned embodiments. For example, the thermal insulating medium 132 may also include at least one of materials such as rubber, plastic, wood, foamed cement, rock wool, and aluminum silicate wool.

[0061] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A cross-media temperature measuring device, wherein, Comprising: A heat conductor; A temperature sensor disposed on the heat conductor; And A heat insulator comprising a housing and a heat insulating medium. The housing defines an installation cavity. The heat conductor is embedded in the installation cavity and abuts against the heat insulator. A receiving cavity is formed within the housing; the heat insulating medium is filled in the receiving cavity.

2. The cross-media temperature measuring device according to claim 1, wherein The heat insulating medium has a thermal conductivity less than 1 W / (m·k).

3. The cross-media temperature measuring device according to claim 1 or 2, wherein, The housing includes an inner housing and an outer housing. The inner housing defines the installation cavity. The outer housing is hermetically connected to the inner housing and defines the receiving cavity. Both the inner housing and the outer housing are elastic housings.

4. The cross-media temperature measuring device according to claim 3, wherein, The thickness of both the outer housing and the inner housing is greater than 1 mm.

5. The cross-media temperature measuring device according to claim 3 or 4, wherein, The distance between the inner housing and the outer housing is greater than 1 mm.

6. The cross-media temperature measuring device according to any one of claims 3 to 5, wherein, The distance between the inner housing and the outer housing is less than 10 mm.

7. The cross-media temperature measuring device according to any one of claims 1 to 6, wherein, The heat conductor includes a contact portion and a support portion. The support portion is connected to the contact portion. The cross-sectional area of the contact portion is greater than that of the support portion. The temperature sensor is disposed on the support portion. The installation cavity includes a first installation cavity and a second installation cavity that communicate with each other. The contact portion is embedded in the first installation cavity, and the support portion is embedded in the second installation cavity.

8. The cross-media temperature measuring device according to any one of claims 1 to 7, wherein, The temperature sensor includes a first temperature sensor and a second temperature sensor, which are spaced apart.

9. The cross-media temperature measuring device according to claim 8, wherein, Both the first temperature sensor and the second temperature sensor are located on the central axis of the heat conductor and are spaced apart along the central axis direction of the heat conductor.

10. The cross-media temperature measuring device according to claim 8 or 9, wherein, The first temperature sensor and the second temperature sensor are respectively disposed close to two opposite surfaces of the heat conductor.

11. The cross-media temperature measuring device according to any one of claims 1 to 10, wherein, One end of the housing is provided with a communication hole. The cross-media temperature measurement device further includes a wire. One end of the wire is electrically connected to the temperature sensor, and the other end is led out from the communication hole.

12. The cross-media temperature measuring device according to claim 11, wherein, The heat conductor has a first surface and a second surface that are opposite to each other. The first surface is used to contact an object to be temperature-measured; the communication hole is provided at one end of the housing away from the first surface.

13. The cross-media temperature measuring device according to any one of claims 1 to 12, wherein, There is an elastic abutting force between the housing and the heat insulating medium to make the heat insulating medium closely fit the housing 131.

14. A kitchen cooking appliance, wherein, The kitchen cooking appliance is provided with the cross-media temperature measurement device according to any one of claims 1 to 13.

15. A temperature measuring device, wherein, Comprising: A heat conductor; A temperature sensor disposed on the heat conductor; And A heat insulation body comprising a housing and a heat insulation medium. The housing defines an installation cavity. The heat conductor is embedded in the installation cavity and contacts the heat insulation body. A receiving cavity is formed within the housing; the heat insulation medium is disposed in the receiving cavity. The heat conductivity of the heat insulation body is less than that of the heat conductor.

16. The temperature measuring device according to claim 15, wherein, The housing includes an inner housing and an outer housing. The inner housing defines the installation cavity. The outer housing is hermetically connected to the inner housing and defines the receiving cavity. Both the inner housing and the outer housing are elastic housings.

17. The temperature measuring device according to claim 15 or 16, wherein, The heat conductor includes a contact portion and a support portion. The support portion is connected to the contact portion. The cross-sectional area of the contact portion is larger than that of the support portion. The temperature sensor is disposed on the support portion. The installation cavity includes a first installation cavity and a second installation cavity that are communicated. The contact portion is embedded in the first installation cavity, and the support portion is embedded in the second installation cavity.

18. The temperature measuring device according to any one of claims 15 to 17, wherein, The temperature sensor includes a first temperature sensor and a second temperature sensor. The first temperature sensor and the second temperature sensor are spaced apart.

19. The temperature measuring device according to claim 18, wherein, Both the first temperature sensor and the second temperature sensor are located on the central axis of the heat conductor and are spaced apart along the central axis direction of the heat conductor.

20. The temperature measuring device according to any one of claims 15 to 19, wherein, One end of the housing is provided with a communication hole. The cross-media temperature measuring device further includes a wire. One end of the wire is electrically connected to the temperature sensor, and the other end is led out from the communication hole.

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