Charging system and method for controlling charging system

Abstract

This charging system (100) is provided with: a particle adsorption jig (10) in which static electricity is charged and particles are adsorbed by charged static electricity; and a charging device (20) that is disposed within the operation of a robot arm (152) that transports a substrate (1) inside a substrate transport device (200), and charges the particle adsorption jig (10) with static electricity.

Description

Charging system and method for controlling the charging system

[0001] This disclosure relates to a charging system and a method for controlling a charging system.

[0002] Conventionally, jigs that attract particles such as dust in a substrate transfer device have been known. JP 11-224895 A discloses a disk-shaped particle removal jig that is electrostatically charged. In JP 11-224895 A, the disk-shaped particle removal jig is held by a hand of a robot arm disposed in a substrate transfer device, similar to a wafer. As a result, the particle removal jig comes into contact with the hand, and particles adhering to the hand are attracted to the charged particle removal jig. As a result, particles adhering to the hand are removed from the hand.

[0003] Japanese Patent Application Publication No. 11-224895

[0004] Here, when particles are removed using a particle removal jig that is electrostatically charged, as in JP 11-224895 A, the particle removal jig must be charged in advance. Furthermore, when the robot arm hand and particle removal jig are disposed on a substrate transfer device, as in JP 11-224895 A, the interior of the substrate transfer device must be temporarily opened and the particle removal jig must be manually charged. However, once the interior of the substrate transfer device is opened, particles such as dust can enter the interior of the substrate transfer device. Therefore, it is desirable to charge the particle removal jig without opening the substrate transfer device.

[0005] This disclosure has been made to solve the above-mentioned problems, and one object of this disclosure is to provide a charging system and a method for controlling the charging system that can charge a particle attraction jig without opening a substrate transport device.

[0006] A charging system according to a first aspect of this disclosure includes a particle attracting jig that is charged with static electricity and attracts particles with the charged static electricity, and a charging device that is disposed within the movement of a robot arm that transports a substrate inside a substrate transport device and that charges the particle attracting jig with static electricity.

[0007] As described above, the charging system according to a first aspect of this disclosure includes a charging device that is disposed within the movement of a robot arm that transports a substrate inside the substrate transport device and that charges the particle attraction jig with static electricity. Since the charging device is disposed inside the substrate transport device, the particle attraction jig can be charged by the charging device in the internal space of the substrate transport device. As a result, the particle attraction jig can be charged without opening the substrate transport device.

[0008] A method for controlling a charging system according to a second aspect of this disclosure includes charging a particle attracting jig that attracts particles with static electricity by a charging device that is arranged within the movement of a robot arm that transports a substrate inside a substrate transport device, and attracting particles by the statically charged particle attracting jig.

[0009] A control method for a charging system according to a second aspect of this disclosure includes, as described above, charging a particle attraction jig that attracts particles with static electricity using a charging device that is located within the movement of a robot arm that transports a substrate inside the substrate transport device. Since the charging device is located inside the substrate transport device, the particle attraction jig can be charged by the charging device in the internal space of the substrate transport device. As a result, a control method for a charging system can be provided that can charge the particle attraction jig without opening the substrate transport device.

[0010] According to the charging system and the control method for the charging system of the present disclosure, the particle attracting jig can be charged without opening the substrate transport device.

[0011] 4 is a diagram showing a semiconductor manufacturing apparatus according to the first embodiment. FIG. 5 is a block diagram of a charging system according to the first embodiment. FIG. 6 is a diagram showing a charging device arranged in an aligner according to the first embodiment. FIG. 7 is a diagram showing a particle adsorption jig according to the first embodiment. FIG. 8 is a cross-sectional view taken along line 1000-1000 in FIG. 4. FIG. 9 is a diagram showing a charging device according to the first embodiment. FIG. 10 is a diagram showing a particle adsorption jig arranged in a jig storage container according to the first embodiment. FIG. 11 is a cross-sectional view of the jig storage container according to the first embodiment as viewed from the side. FIG. 12 is a flow chart of a control method for the charging system according to the first embodiment. FIG. 13 is a diagram showing a state in which the particle adsorption jig is held by a hand. FIG. 14 is a diagram showing a state in which the robot arm is moved to bring the particle adsorption jig into contact with the voltage application unit of the charging device. FIG. 15 is a diagram showing a state in which particles on the aligner are removed by the particle adsorption jig. FIG. 16 is a diagram showing a state in which the particle adsorption jig is cleaned by a cleaning device. FIG. 17 is a diagram showing a charging device arranged in an aligner according to the second embodiment. FIG. 18 is a diagram showing an aligner according to the second embodiment as viewed from above. FIG. 19 is a diagram showing a state in which the aligner's movement mechanism is moved upward to bring the particle adsorption jig into contact with the voltage application unit of the charging device.

[0012] [First embodiment] A first embodiment of the present disclosure that embodies the present disclosure will be described below with reference to the drawings. In this specification, the up-down direction is referred to as the Z direction. The upper side is referred to as the Z1 side, and the lower side is referred to as the Z2 side. The direction perpendicular to the Z direction is referred to as the X direction. One side of the X direction is referred to as the X1 side, and the other side is referred to as the X2 side. The direction perpendicular to the Z direction and the X direction is referred to as the Y direction. One side of the Y direction is referred to as the Y1 side, and the other side is referred to as the Y2 side.

[0013] (Semiconductor Manufacturing Apparatus) First, a semiconductor manufacturing apparatus 500 will be described. As shown in Fig. 1, the semiconductor manufacturing apparatus 500 is an apparatus for processing a substrate 1 made of a semiconductor such as a wafer. The semiconductor manufacturing apparatus 500 includes a substrate transfer apparatus 200 and a substrate processing apparatus 300. The semiconductor manufacturing apparatus 500 is disposed, for example, in a clean room.

[0014] (Substrate Transfer Apparatus) The substrate transfer apparatus 200 will be described. The substrate transfer apparatus 200 is, for example, an EFEM (Equipment Front End Module). The substrate transfer apparatus 200 includes a FOUP 110, a housing 120, a FOUP opener 130, an aligner 140, a robot 150, and a control unit 160 shown in FIG. 2 .

[0015] (FOUP) The FOUP 110 accommodates a plurality of substrates 1 before and after processing. The interior of the FOUP 110 is maintained in a clean state similar to that of a clean room. The FOUP 110 includes a housing 111 and an opening / closing unit 112. The housing 111 has a box shape including an opening 111a that opens into the substrate transfer device 200. The opening / closing unit 112 covers the opening 111a of the housing 111. For example, four FOUPs 110 are arranged.

[0016] (Housing) The housing 120 includes an internal space 121. The internal space 121 is filled with a highly clean ambient gas. The robot 150 is disposed in the internal space 121 of the housing 120. The housing 120 has, for example, a rectangular parallelepiped shape. An opening 122a connected to the internal space 113 of the FOUP 110 is formed in a wall 122 on the Y1 side of the housing 120. The opening 122a allows the substrate 1 to move between the FOUP 110 and the substrate transfer device 200. An opening 123a connected to the internal space 311 of the substrate processing apparatus 300 is formed in a wall 123 on the Y2 side of the housing 120. The opening 123a allows the substrate 1 to move between the substrate processing apparatus 300 and the substrate transfer device 200.

[0017] The FOUP opener 130 will now be described. The FOUP opener 130 is disposed on the Y1 side of the substrate transfer device 200. The FOUP opener 130 includes an opening / closing unit 131 and a FOUP support unit 132. The opening / closing unit 131 is disposed in an opening 122a in the wall 122 on the Y1 side of the housing 120. An opening / closing mechanism (not shown) opens the opening / closing unit 131 of the FOUP opener 130 and the opening / closing unit 112 of the FOUP 110, thereby connecting the internal space 113 of the FOUP 110 with the internal space 121 of the housing 120.

[0018] The aligner 140 will now be described. The substrate 1 is placed on the aligner 140. The aligner 140 performs at least one of the following: rotating the substrate 1 to adjust the orientation of the substrate 1 so that a notch or orientation flat formed on the substrate 1 faces a predetermined direction; or rotating the substrate once to detect the edge of the substrate 1 using a line sensor 143 and detect eccentricity of the substrate 1. In the first embodiment, the aligner 140 is disposed in the internal space 121 of the housing 120 of the substrate transfer device 200. The notch or orientation flat is an example of a marking unit. As shown in FIG. 3 , the aligner 140 includes a frame 141, a rotating unit 142, and a line sensor 143. The frame 141 is a platform on which the rotating unit 142 and the line sensor 143 are placed. The rotating unit 142 rotates the substrate 1 while the substrate 1 is placed thereon. The line sensor 143 detects a notch or an orientation flat from the substrate 1 rotated by the rotating unit 142 .

[0019] The robot 150 will now be described. As shown in FIG. 1 , the robot 150 is disposed in the internal space 121 of the housing 120 of the substrate transfer device 200. The robot 150 is, for example, a horizontal articulated type. The robot 150 includes a hand 151 and a robot arm 152. The hand 151 holds the substrate 1. For example, the hand 151 has a Y-shape with a bifurcated tip. The hand 151 is also disposed at the tip of the robot arm 152. The robot arm 152 includes a plurality of link sections.

[0020] The configuration of the control unit 160 will be described. The control unit 160 is a robot controller. As shown in FIG. 2 , the control unit 160 includes a main control unit 161, a servo control unit 162, a drive circuit unit 163, and a storage unit 164. The main control unit 161 and the servo control unit 162 each include, for example, a CPU (Central Processing Unit). The main control unit 161 controls the drive unit 152a of the robot arm 152. The servo control unit 162 controls the power supplied to the drive unit 152a of the robot arm 152 based on a command from the main control unit 161. The drive circuit unit 163 supplies drive power to the drive unit 152a of the robot arm 152. The robot arm 152 includes a plurality of drive units 152a, and a drive circuit unit 163 is provided for each of the drive units 152a of the robot arm 152. Alternatively, one drive circuit unit 163 may be provided in common for each of the drive units 152 a. Each drive unit 152 a includes a servo motor, an encoder, and a reducer. The storage unit 164 stores programs executed by the control unit 160.

[0021] (Substrate Processing Apparatus) The substrate processing apparatus 300 will now be described. As shown in FIG. 1 , the substrate processing apparatus 300 performs processing on a substrate 1. For example, the substrate processing apparatus 300 performs heat treatment, impurity implantation, thin film formation, lithography, cleaning, and planarization on the substrate 1. The substrate processing apparatus 300 is disposed adjacent to the substrate transfer apparatus 200. The substrate processing apparatus 300 includes a housing 310 having an internal space 311. A wall 312 on the Y1 side of the housing 310 of the substrate processing apparatus 300 is shared with a wall 123 on the Y2 side of the housing 120 of the substrate transfer apparatus 200. The internal space 311 of the substrate processing apparatus 300 also includes a substrate placement section 313 on which the substrate 1 is placed.

[0022] (Charging System) The charging system 100 is a system for charging the particle adsorption jig 10. As shown in Fig. 2 , the charging system 100 includes an aligner 140, a robot 150, the particle adsorption jig 10, a charging device 20, a jig storage container 30, a particle detection unit 50, a cleaning device 60, and a control unit 160.

[0023] (Particle Adsorption Jig) The particle adsorption jig 10 will now be described. The particle adsorption jig 10 is held by a hand 151. The particle adsorption jig 10 is charged with static electricity and adsorbs particles by the charged static electricity. As shown in FIG. 4, the particle adsorption jig 10 has, for example, a disk shape and the same diameter as the substrate 1. As shown in FIG. 5, the particle adsorption jig 10 includes, for example, a semiconductor substrate 11, a positive electrode 12, a negative electrode 13, a bias electrode 14, and an interface 15. The positive electrode 12 and the negative electrode 13 are formed by implanting impurities. The positive electrode 12, the bias electrode 14, and the negative electrode 13 are arranged in this order on one surface 11a of the semiconductor substrate 11. The interface 15 is arranged on the other surface 11b of the semiconductor substrate 11. The interface 15 is connected to the positive electrode 12 and the negative electrode 13. 6 applies a voltage to the interface 15. As a result, a voltage is applied to the positive electrode 12 and the negative electrode 13, and one surface 11a of the semiconductor substrate 11 is charged.

[0024] (Charging Device) The charging device 20 will be described. The charging device 20 is a device that charges the particle adsorption jig 10 with static electricity. As shown in Fig. 6, the charging device 20 includes a housing 21, a voltage application unit 22, a contact detection unit 23, and the power storage unit 24 shown in Fig. 3. The housing 21 has a box shape.

[0025] The voltage application unit 22 contacts the interface 15 of the particle adsorption jig 10 and applies a voltage to the particle adsorption jig 10. For example, the voltage application unit 22 includes a plurality of probes 22a. The plurality of probes 22a protrude from holes 21a in the housing 21 to the outside of the housing 21. When the plurality of probes 22a contact the interface 15 of the particle adsorption jig 10, a voltage is applied to the positive electrode 12 and the negative electrode 13.

[0026] In the first embodiment, the contact detection unit 23 detects information regarding the contact of the voltage application unit 22 with the particle adsorption jig 10. Based on the detection of information regarding the contact of the voltage application unit 22 with the particle adsorption jig 10 by the contact detection unit 23, the charging device 20 starts applying a voltage from the voltage application unit 22 to the particle adsorption jig 10. For example, the contact detection unit 23 is a contact sensor. The contact detection unit 23 is disposed adjacent to the voltage application unit 22. The contact detection unit 23 and the voltage application unit 22 protrude to the same height from the housing 21. For example, the particle adsorption jig 10 held by the hand 151 comes into contact with the voltage application unit 22, and the particle adsorption jig 10 also comes into contact with the contact detection unit 23. In this case, the contact of the particle adsorption jig 10 with the contact detection unit 23 is information regarding the contact of the voltage application unit 22 with the particle adsorption jig 10. Then, when the contact detection unit 23 detects that the particle adsorptive jig 10 has come into contact with the voltage application unit 22, the charging device 20 starts applying a voltage from the voltage application unit 22 to the particle adsorptive jig 10. For example, a switch is disposed between the power storage unit 24 and the voltage application unit 22, and when the contact detection unit 23 detects that the particle adsorptive jig 10 has come into contact with the voltage application unit 22, the switch is turned on. As a result, a voltage is applied from the power storage unit 24 to the particle adsorptive jig 10 via the voltage application unit 22.

[0027] 3, in the first embodiment, the charging device 20 is disposed within the movement of the robot arm 152 that transports the substrate 1 inside the substrate transport device 200. Specifically, the charging device 20 is disposed in the aligner 140. For example, the charging device 20 is disposed above the line sensor 143. The charging device 20 is also disposed so as to face the rotating unit 142. The charging device 20 is also disposed so that the voltage application unit 22 faces downward.

[0028] (Jig Storage Container) The jig storage container 30 will be described. The jig storage container 30 is a container that stores the particle adsorption jig 10. As shown in FIG. 7 , the jig storage container 30 includes an opening 32 that opens into the substrate transfer device 200. The interior of the jig storage container 30, like the FOUP 110, is maintained in a clean state similar to that of a clean room. As shown in FIG. 8 , the jig storage container 30 includes a housing 34 and an opening / closing unit 35. The housing 34 has a box shape that includes the opening 32 that opens into the substrate transfer device 200. The opening / closing unit 35 covers the opening 32 of the housing 34. As shown in FIG. 10 , the jig storage container 30 is disposed in the FOUP opener 130 in which the FOUP 110 is disposed in the substrate transfer device 200. Then, by opening the opening / closing part 131 of the FOUP opener 130 and the opening / closing part 35 of the jig storage container 30, the internal space 33 of the jig storage container 30 and the internal space 121 of the housing 120 are connected. This allows the particle suction jig 10 to move back and forth between the jig storage container 30 and the substrate transport device 200 through the opening 122a of the housing 120. Also, the particle suction jig 10 can move back and forth between the substrate transport device 200 and the substrate processing device 300 through the opening 123a of the housing 120. Moreover, the external shape of the jig storage container 30 and the external shape of the FOUP 110 are the same, and the jig storage container 30 can store the particle suction jig 10. Specifically, the housing 34 of the jig storage container 30 and the housing 111 of the FOUP 110 shown in FIG. 1 have the same size. Therefore, the jig storage container 30 can be placed on the FOUP opener 130 instead of the FOUP 110. Furthermore, the diameter of the particle suction jig 10 and the diameter of the substrate 1 are the same. As a result, the particle suction jig 10 is stored in the jig storage container 30 in the same way that the substrate 1 is stored in the FOUP 110. For example, the particle suction jig 10 is supported by a support portion 30a of the jig storage container 30. With the particle suction jig 10 stored in the jig storage container 30, the inside of the jig storage container 30 is maintained in a clean state.

[0029] (Power Storage Unit) The power storage unit 24 stores power to be supplied to the voltage application unit 22. As shown in FIG. 3 , the power storage unit 24 is disposed, for example, inside the housing 21. In the first embodiment, the power storage unit 24 is charged by power supplied to the aligner 140. Specifically, the aligner 140 is supplied with power from an external power supply 144. The power storage unit 24 is also supplied with power from the external power supply 144.

[0030] (Particle Detector) In the first embodiment, the particle detector 50 detects the degree of particle adsorption by the particle adsorption jig 10 during a series of operations of the robot arm 152. The series of operations of the robot arm 152 will be described later. The particle detector 50 includes at least one of a charge amount detector 51 that detects the amount of charge on the particle adsorption jig 10 and an imaging unit 52 that images particles adsorbed to the particle adsorption jig 10. The charge amount detector 51 is, for example, a surface electrometer. The surface electrometer measures the amount of static electricity by utilizing the electrostatic induction phenomenon in which charged objects are attracted to conductors when brought close to each other. The surface electrometer measures the amount of static electricity without contacting the particle adsorption jig 10. The particle detector 50 is also disposed in the aligner 140. For example, the particle detector 50 is disposed above the frame 141 of the aligner 140. The imaging unit 52 is, for example, a high-resolution camera that can capture images of particles.

[0031] In the first embodiment, the cleaning device 60 cleans the particle adsorption jig 10. As shown in Fig. 1 , the cleaning device 60 is disposed, for example, in an internal space 311 of a substrate processing apparatus 300. The substrate processing apparatus 300 is, for example, a spin dryer. The spin dryer rotates the particle adsorption jig 10 to remove particles adsorbed to the particle adsorption jig 10 by centrifugal force.

[0032] (Operation of Charging System) Next, a particle removal operation inside the semiconductor manufacturing apparatus 500 by the charging system 100 will be described. The operation of the charging system 100 is controlled by the control unit 160. The power storage unit 24 of the charging device 20 is charged in advance. The particle adsorption jig 10 is manually placed in the jig storage container 30 in advance. When the particle removal operation is performed, the semiconductor manufacturing apparatus 500 is not processing the substrate 1. As shown in FIG. 10 , a jig storage container 30 is disposed in the FOUP opener 130 instead of the FOUP 110. One jig storage container 30 may be disposed in the FOUP opener 130, or multiple jig storage containers 30 may be disposed in the FOUP opener 130. An example in which one jig storage container 30 is disposed in the FOUP opener 130 will be described below.

[0033] As shown in Figure 9, in step S1, the control unit 160 operates an opening / closing mechanism (not shown) to open the opening / closing section 131 of the FOUP opener 130 and the opening / closing section 35 of the jig storage container 30, thereby connecting the internal space 33 of the jig storage container 30 with the internal space 121 of the housing 120 of the substrate transport device 200.

[0034] 10 , in the first embodiment, the control unit 160 executes a process of causing the hand 151 of the robot arm 152 to hold the particle adsorption jig 10, which has been previously housed in the jig housing container 30, in step S2. Specifically, the control unit 160 causes the hand 151 to enter the internal space 33 of the jig housing container 30 through the opening 122 a of the housing 120 of the substrate transfer device 200.

[0035] In step S3, as shown in FIG. 11 , the control unit 160 moves the robot arm 152 to move the particle adsorption jig 10 held by the hand 151 to the aligner 140. In the first embodiment, the control unit 160 then moves the robot arm 152 to bring the particle adsorption jig 10 held by the hand 151 into contact with the voltage application unit 22, thereby charging the particle adsorption jig 10. Specifically, the control unit 160 moves the robot arm 152 to move the particle adsorption jig 10 held by the hand 151 upward and bring it into contact with the voltage application unit 22, thereby charging the particle adsorption jig 10. At this time, the particle adsorption jig 10 comes into contact with the voltage application unit 22 and the contact detection unit 23. This causes the charging device 20 to start applying a voltage from the voltage application unit 22 to the particle adsorption jig 10. The application of voltage from the voltage application unit 22 is controlled by the charging device 20, not by the control unit 160.

[0036] In step S4, in the first embodiment, the control unit 160 performs a process of charging the particle attracting jig 10, and then moves the robot arm 152 to perform a process of attracting particles in at least one of the interior of the substrate transfer device 200 and the interior of the substrate processing apparatus 300 with the particle attracting jig 10 held by the hand 151. Specifically, the particle attracting jig 10 housed in the jig storage container 30 is moved to the substrate transfer device 200 or the substrate processing apparatus 300 through the openings 122a and 123a of the housing 120 of the substrate transfer device 200. Then, as shown in FIG. 12 , particles adhering to a portion of the aligner 140 arranged in the internal space 121 of the substrate transfer device 200 on which the substrate 1 is placed, a substrate placement portion 313 on which the substrate 1 is placed in the internal space 311 of the substrate processing apparatus 300, and the like are attracted by the particle attracting jig 10.

[0037] In step S5, in the first embodiment, the control unit 160 causes the particle detection unit 50 to detect the degree of particle adsorption by the particle adsorption jig 10. Specifically, the control unit 160 temporarily moves the particle adsorption jig 10 above the particle detection unit 50 of the aligner 140. Then, the control unit 160 causes the particle detection unit 50 to detect the amount of particles adsorbed by the particle adsorption jig 10.

[0038] Then, in step S6, the control unit 160 determines whether or not further particle adsorption by the particle adsorption jig 10 is possible. If the particle detection unit 50 is the imaging unit 52, the control unit 160 uses a technique such as image processing to detect the amount of particles adsorbed from the image of the particle adsorption jig 10 captured by the imaging unit 52. If the amount of adsorbed particles is equal to or less than a predetermined particle amount threshold, the control unit 160 determines that further particle adsorption by the particle adsorption jig 10 is possible, and the process returns to step S4. If the amount of adsorbed particles is greater than the predetermined particle amount threshold, the control unit 160 determines that further particle adsorption by the particle adsorption jig 10 is not possible, and the process proceeds to step S7. If the particle detection unit 50 is the charge amount detection unit 51, the charge amount detection unit 51 detects the charge amount of the particle adsorption jig 10. If the charge amount of the particle attracting jig 10 detected by the charge amount detection unit 51 is greater than a predetermined charge amount threshold, the control unit 160 determines that the particle attracting jig 10 is capable of further attracting particles, and the process returns to step S4. On the other hand, if the charge amount of the particle attracting jig 10 detected by the charge amount detection unit 51 is equal to or less than the predetermined charge amount threshold, the control unit 160 determines that the particle attracting jig 10 is not capable of further attracting particles, and the process proceeds to step S7. In this way, during the series of operations in which particle attraction is repeatedly performed in step S4, the particle detection unit 50 detects the degree of particle attraction.

[0039] 13 , in step S7, in the first embodiment, the control unit 160 executes a process of causing the particle adsorption jig 10 to adsorb particles, and then executes a process of moving the particle adsorption jig 10 to the cleaning device 60 using the robot arm 152. The cleaning device 60 executes a process of cleaning the particle adsorption jig 10 that has been moved.

[0040] Then, in step S8, the control unit 160 causes the charging device 20 to charge static electricity on the particle attracting jig 10, as in step S3. Then, in step S9, the control unit 160 executes a process of attracting particles in the same target region as in step S4 to confirm whether particle attraction has been completed in the target region for particle attraction in at least one of the interior of the substrate transfer device 200 and the interior of the substrate processing apparatus 300. In step S9, as in step S4, the control unit 160 performs an attraction operation of moving the particle attracting jig 10 in the target region when attracting particles. For example, as in step S4, the control unit 160 transports the particle attracting jig 10 held by the hand 151 to the substrate placement unit 313 of the substrate processing apparatus 300, which is the target region for particle attraction, and places the particle attracting jig 10 on the substrate placement unit 313 to perform the attraction operation.

[0041] Then, in step S10, the control unit 160 detects the degree of particle adsorption by the particle adsorption jig 10 using the particle detection unit 50, as in step S5. Then, in step S11, it determines whether particle adsorption in the target area is sufficient. For example, if the particle detection unit 50 is the image capture unit 52, the control unit 160 detects the amount of particles adsorbed from the image of the particle adsorption jig 10 captured by the image capture unit 52, as in step S6. Then, if the amount of adsorbed particles is greater than a predetermined particle amount threshold, the control unit 160 determines that particle adsorption is insufficient, and returns to step S4. On the other hand, if the amount of adsorbed particles is equal to or less than the predetermined particle amount threshold, the control unit 160 determines that particle adsorption is sufficient. If it is determined that particle adsorption is sufficient, the operation of removing particles from inside the semiconductor manufacturing apparatus 500 by the charging system 100 is terminated. Note that the predetermined particle amount threshold in step S11 may be a value different in magnitude from that in step S6.

[0042] In step S11, the determination of whether particle adsorption in the target area is sufficient may be performed based on the detection result of the charge amount detection unit 51. In this case, the charge amount detection unit 51 detects the charge amount of the particle adsorption jig 10. If the charge amount of the particle adsorption jig 10 detected by the charge amount detection unit 51 is equal to or less than a predetermined charge amount threshold, the control unit 160 determines that the charge amount has decreased due to particle adsorption in the same target area, and determines that a particle has been detected. In this case, the control unit 160 determines that particle adsorption is insufficient, and returns to step S4. On the other hand, if the charge amount of the particle adsorption jig 10 detected by the charge amount detection unit 51 is greater than the predetermined charge amount threshold, the control unit 160 determines that no further particle adsorption is occurring and that particle adsorption is sufficient, and terminates the control process.

[0043] Furthermore, if multiple target areas for particle adsorption are arranged, it is possible to perform the processes from step S8 to step S11 for each of the multiple target areas, thereby confirming whether particle adsorption has been completed for each of the multiple target areas.

[0044] Effect of First Embodiment The charging system 100 is disposed within the movement of the robot arm 152 that transports the substrate 1 inside the substrate transport device 200, and includes the charging device 20 that charges the particle attraction jig 10 with static electricity. As a result, since the charging device 20 is disposed in the aligner 140 that is disposed inside the substrate transport device 200, the particle attraction jig 10 can be charged by the charging device 20 in the internal space of the substrate transport device 200. As a result, the particle attraction jig 10 can be charged without opening the substrate transport device 200.

[0045] The charging system 100 includes a robot arm 152, a hand 151 attached to the robot arm 152 and holding a particle attracting jig 10, and a control unit 160 that executes a process of attracting particles in at least one of the interior of the substrate transport device 200 and the interior of the substrate processing device 300 using the charged particle attracting jig 10 held by the hand 151. This allows the process of attracting particles to be executed using the sufficiently charged particle attracting jig 10.

[0046] The control unit 160 executes a process of moving the robot arm 152 and bringing the particle adsorption jig 10 held by the hand 151 into contact with the voltage application unit 22 to charge the particle adsorption jig 10. This allows the particle adsorption jig 10 to be charged by the operation of the robot arm 152 without manual intervention, thereby reducing the amount of work required by the worker.

[0047] The charging system includes an aligner 140 disposed inside the substrate transport device 200. The voltage application unit 22 is disposed facing downward inside the jig storage container 30, and the control unit 160 executes a process of moving the robot arm 152 to move the particle adsorption jig 10 held by the hand 151 upward and bringing it into contact with the voltage application unit 22, thereby charging the particle adsorption jig 10. This allows the particle adsorption jig 10 to be easily charged simply by moving the particle adsorption jig 10 upward with the robot arm 152. Furthermore, by disposing the charging device 20 in the aligner 140, an increase in the installation area of ​​the equipment inside the substrate transport device 20 can be suppressed, unlike when a space for disposing the charging device 20 is secured separately from the aligner 140.

[0048] The charging device 20 includes a contact detection unit 23 that detects information regarding the contact of the voltage application unit 22 with the particle adsorptive jig 10. Based on the information regarding the contact of the voltage application unit 22 with the particle adsorptive jig 10 detected by the contact detection unit 23, the charging device 20 starts applying a voltage from the voltage application unit 22 to the particle adsorptive jig 10. This eliminates the need for the control unit 160 to control the application of voltage from the voltage application unit 22 to the particle adsorptive jig 10, thereby reducing the control burden on the control unit 160.

[0049] The charging system 100 includes a particle detection unit 50 that detects the degree of particle adsorption by the particle adsorption jig 10 during a series of operations of the robot arm 152. As a result, the control unit 160 determines whether or not the particle adsorption jig 10 can adsorb additional particles based on the detection results of the particle detection unit 50, thereby preventing the particle adsorption operation from continuing in a state in which the particle adsorption jig 10 is unable to adsorb particles.

[0050] The particle detection unit 50 includes at least one of a charge amount detection unit 51 that detects the charge amount of the particle adsorption jig 10 and an imaging unit 52 that images particles adsorbed to the particle adsorption jig 10. When the charge amount detection unit 51 detects that the charge amount of the particle adsorption jig 10 is relatively large, the control unit 160 can determine that the particle adsorption jig 10 is capable of adsorbing further particles. Furthermore, when the control unit 160 detects that the number of particles adhering to the particle adsorption jig 10 is relatively small based on the image of the particle adsorption jig 10 captured by the imaging unit 52, the control unit 160 can determine that the particle adsorption jig 10 is capable of adsorbing further particles.

[0051] The particle detection unit 50 is disposed in the aligner 140. This makes it possible to prevent the charging system 100 from becoming larger than when the detection of the degree of particle adsorption and the charging of the particle adsorption jig 10 are performed in separate locations.

[0052] The charging system 100 includes a cleaning device 60 that cleans the particle adsorption jig 10. After the control unit 160 executes a process of adsorbing particles using the particle adsorption jig 10, it executes a process of moving the particle adsorption jig 10 to the cleaning device 60 using the robot arm 152, and the cleaning device 60 executes a process of cleaning the moved particle adsorption jig 10. As a result, the particle adsorption jig 10 with particles attached thereto is cleaned, and the cleaned particle adsorption jig 10 can be charged and used the next time particles are adsorbed. This eliminates the need to provide multiple particle adsorption jigs 10.

[0053] The charging device 20 includes a power storage unit 40 that stores power and is charged by the power supplied to the aligner 140. As a result, the aligner 140 is supplied with power in advance, so there is no need to provide a separate power source to charge the power storage unit 40. This simplifies the configuration of the charging system 100.

[0054] Second Embodiment An aligner 240 according to a second embodiment of the present disclosure will be described.

[0055] In the second embodiment, as shown in FIG. 14 , the aligner 140 includes a moving mechanism 241 that moves the particle suction jig 10 in the vertical direction to bring the particle suction jig 10 into contact with the voltage application unit 22. The moving mechanism 241 then moves the particle suction jig 10 upward to bring the particle suction jig 10 into contact with the voltage application unit 22 that is positioned facing downward in the aligner 140. Specifically, the moving mechanism 241 includes a holding unit 241a that holds the particle suction jig 10 from below and an elevating unit 241b that raises and lowers the holding unit 241a. As shown in FIG. 15 , the holding unit 241a has, for example, a U-shape and a flat plate shape when viewed from the Z direction. The elevating unit 241b includes, for example, a driving unit such as a motor, and raises and lowers the holding unit 241a. 16 , unlike the first embodiment, the particle adsorption jig 10 is brought into contact with the voltage application unit 22 by a moving mechanism 241 without using the hand 151 of the robot 150. The moving mechanism 241 is controlled by, for example, the control unit 160. The control unit 160 then moves the robot arm 152 to hold the charged particle adsorption jig 10 with the hand 151, and then performs a process of adsorbing particles in at least one of the interior of the substrate transfer device 200 and the interior of the substrate processing device 300. The other configurations of the second embodiment are similar to those of the first embodiment.

[0056] Effect of the Second Embodiment The aligner 240 includes a moving mechanism 241 that moves the particle adsorption jig 10 in the vertical direction to bring the particle adsorption jig 10 into contact with the voltage application unit 22. This allows the particle adsorption jig 10 to be charged by the operation of the aligner 240 without manual operation, thereby reducing the amount of work required by the worker.

[0057] The voltage application unit 22 is disposed facing downward in the aligner 140, and the movement mechanism 241 moves the particle suction jig 10 upward to bring it into contact with the voltage application unit 22. As a result, the particle suction jig 10 can be easily charged simply by moving the particle suction jig 10 upward with the movement mechanism 241.

[0058] [Modifications] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the above-mentioned embodiments, and includes all modifications (modifications) within the meaning and scope of the claims.

[0059] In the first and second embodiments, the robot 150 that holds the substrate 1 and the robot 150 that holds the particle adsorption jig 10 are the same robot, but the present disclosure is not limited to this. For example, the robot that holds the particle adsorption jig 10 may be arranged separately from the robot 150 that holds the substrate 1.

[0060] In the first and second embodiments described above, an example has been shown in which the particle adsorption jig 10 is housed in the jig housing container 30, but the present disclosure is not limited to this. For example, the particle adsorption jig 10 may be disposed in the substrate transfer device 200 or the substrate processing device 300 without being housed in the jig housing container 30.

[0061] In the first and second embodiments, the voltage application unit 22 of the charging device 20 is disposed facing downward in the aligner 140, but the present disclosure is not limited to this. For example, the voltage application unit 22 of the charging device 20 may be disposed facing upward.

[0062] In the first and second embodiments, an example has been described in which the charging device 20 starts applying a voltage from the voltage application unit 22 to the particle adsorption jig 10 based on the information detected by the contact detection unit 23 that the particle adsorption jig 10 has come into contact with the voltage application unit 22. However, the present disclosure is not limited to this. For example, the control unit 160 may control the voltage application unit 22 to start applying a voltage to the particle adsorption jig 10 based on the information detected by the contact detection unit 23 that the particle adsorption jig 10 has come into contact with the voltage application unit 22.

[0063] In the first and second embodiments described above, an example has been shown in which the particle detection unit 50 is provided in the charging system 100, but the present disclosure is not limited to this. For example, the particle detection unit 50 does not have to be provided in the charging system 100. In this case, for example, once a series of particle adsorption operations by the particle adsorption jig 10 has been completed once, the particle adsorption operation ends.

[0064] In the first and second embodiments described above, an example in which the particle detection unit 50 is disposed in the aligner 140 has been described, but the present disclosure is not limited to this. For example, the particle detection unit 50 may be disposed in the substrate transfer device 200 or the substrate processing device 300 other than the aligner 140.

[0065] In the first and second embodiments, the cleaning device 60 is disposed in the substrate processing apparatus 300, but the present disclosure is not limited to this. For example, the cleaning device 60 may be disposed in the substrate transfer device 200.

[0066] In the first and second embodiments, the particle removal operation is terminated after the particle adsorption jig 10 is cleaned by the cleaning device 60, but the present disclosure is not limited to this. For example, after the particle adsorption jig 10 is cleaned by the cleaning device 60, the particle adsorption jig 10 may be charged again by the charging device 20, and the particle removal operation may be resumed.

[0067] In the first and second embodiments, the charging device 20 is charged by the power supplied to the aligner 140. However, the present disclosure is not limited to this. For example, the charging device 20 may be charged by a power separate from the power supplied to the aligner 140.

[0068] In the first and second embodiments, an example has been described in which the charging device 20 is disposed in the aligner 140, but the present disclosure is not limited to this. For example, the charging device 20 may be disposed within the movement of a robot arm other than the aligner 140 inside the substrate transport device 200. Note that when the charging device 20 is disposed at a relatively high position inside the substrate transport device 200, the robot arm 152 needs to move not only along a horizontal plane but also in the vertical direction.

[0069] The functions of the elements disclosed herein can be performed using circuits or processing circuits, including general-purpose processors, special-purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. A processor is considered a processing circuit or circuit because it includes transistors and other circuitry. In this disclosure, a circuit, unit, or means is hardware that performs the recited functions or hardware that is programmed to perform the recited functions. The hardware may be hardware disclosed herein or other known hardware that is programmed or configured to perform the recited functions. Where the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used to configure the hardware and / or processor.

[0070] Aspects It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0071] (Aspect 1) A charging system comprising: a particle attracting jig that is charged with static electricity and attracts particles using the charged static electricity; and a charging device that is disposed within the movement of a robot arm that transports a substrate inside a substrate transport device and charges the particle attracting jig with static electricity.

[0072] (Aspect 2) The charging system according to aspect 1, comprising: the robot arm; a hand attached to the robot arm and holding the particle adsorption jig; and a control unit that executes a process of holding the particle adsorption jig with the hand of the robot arm; and a process of adsorbing particles inside at least one of the inside of the substrate transport device and the inside of the substrate processing device with the charged particle adsorption jig held by the hand.

[0073] (Aspect 3) The charging system according to Aspect 2, wherein the charging device includes a voltage application unit that contacts the particle adsorption jig and applies a voltage to the particle adsorption jig, and the control unit moves the robot arm and brings the particle adsorption jig held by the hand into contact with the voltage application unit to charge the particle adsorption jig.

[0074] (Aspect 4) A charging system according to Aspect 3, further comprising an aligner disposed inside the substrate transport device, wherein the voltage application unit is disposed facing downward in the aligner, and the control unit moves the robot arm, moves the particle adsorption jig held by the hand upward, and brings it into contact with the voltage application unit, thereby performing a process of charging the particle adsorption jig.

[0075] (Aspect 5) The charging system according to aspect 3 or aspect 4, wherein the charging device includes a contact detection unit that detects information relating to the voltage application unit having come into contact with the particle adsorption jig, and the charging device starts applying voltage from the voltage application unit to the particle adsorption jig based on the information relating to the voltage application unit having come into contact with the particle adsorption jig being detected by the contact detection unit.

[0076] (Aspect 6) A charging system described in any one of Aspects 2 to 5, comprising an aligner arranged inside the substrate transport device, the charging device including a voltage application unit that contacts the particle adsorption jig and applies a voltage to the particle adsorption jig, and the aligner including a movement mechanism that moves the particle adsorption jig in an up and down direction to bring the particle adsorption jig into contact with the voltage application unit.

[0077] (Aspect 7) The charging system according to aspect 6, wherein the voltage application unit is disposed facing downward in the aligner, and the movement mechanism moves the particle attraction jig upward to bring it into contact with the voltage application unit.

[0078] (Aspect 8) The charging system according to any one of aspects 2 to 7, further comprising a particle detection unit that detects the degree of particle adsorption by the particle adsorption jig during a series of operations of the robot arm.

[0079] (Aspect 9) The charging system according to aspect 8, wherein the particle detection unit includes at least one of a charge amount detection unit that detects a charge amount of the particle adsorption jig and an imaging unit that images particles adsorbed to the particle adsorption jig.

[0080] (Aspect 10) The charging system according to aspect 8 or aspect 9, further comprising an aligner disposed inside the substrate transport device, wherein the particle detection unit is disposed in the aligner.

[0081] (Aspect 11) The charging system according to any one of Aspects 2 to 10, further comprising a cleaning device that cleans the particle adsorption jig, wherein the control unit performs a process of adsorbing particles using the particle adsorption jig, and then performs a process of moving the particle adsorption jig to the cleaning device using the robot arm, and the cleaning device performs a process of cleaning the moved particle adsorption jig.

[0082] (Aspect 12) The charging system according to any one of Aspects 1 to 11, further comprising an aligner disposed inside the substrate transport device, wherein the charging device includes a power storage unit that stores power and is charged by power supplied to the aligner.

[0083] (Aspect 13) A method for controlling a charging system, comprising: charging a particle attracting jig that attracts particles with static electricity using a charging device that is arranged within the movement of a robot arm that transports a substrate inside a substrate transport device; and attracting particles using the statically charged particle attracting jig.

Claims

1. A charging system comprising: a particle adsorption jig that is charged with static electricity and adsorbs particles by the charged static electricity; and a charging device that is disposed within the operation of a robot arm that transports a substrate inside a substrate transfer device and charges the particle adsorption jig with static electricity.

2. The charging system according to claim 1, further comprising: the robot arm; a hand attached to the robot arm that holds the particle adsorption jig; a process of holding the particle adsorption jig by the hand of the robot arm; and a control unit that executes a process of adsorbing at least some of the particles inside at least one of the inside of the substrate transfer device and the inside of the substrate processing device by the particle adsorption jig held and charged by the hand.

3. The charging system according to claim 2, wherein the charging device includes a voltage application unit that contacts the particle adsorption jig and applies a voltage to the particle adsorption jig, and the control unit executes a process of moving the robot arm and contacting the particle adsorption jig held by the hand with the voltage application unit to charge the particle adsorption jig.

4. The charging system according to claim 3, further comprising an aligner disposed inside the substrate transfer device, wherein the voltage application unit is disposed facing downward in the aligner, and the control unit executes a process of moving the robot arm, moving the particle adsorption jig held by the hand upward, and contacting the particle adsorption jig with the voltage application unit to charge the particle adsorption jig.

5. The charging system according to claim 3, wherein the charging device includes a contact detection unit that detects information regarding contact of the voltage application unit with the particle adsorption jig, and based on the information regarding contact of the voltage application unit with the particle adsorption jig being detected by the contact detection unit, the charging device starts applying a voltage from the voltage application unit to the particle adsorption jig.

6. The charging system according to claim 2, comprising an aligner disposed inside the substrate transfer device, wherein the charging device includes a voltage application unit that contacts the particle adsorption jig and applies a voltage to the particle adsorption jig, and the aligner includes a moving mechanism that moves the particle adsorption jig in the vertical direction to bring the particle adsorption jig into contact with the voltage application unit.

7. The charging system according to claim 6, wherein the voltage application unit is disposed facing downward in the aligner, and the moving mechanism moves the particle adsorption jig upward to bring it into contact with the voltage application unit.

8. The charging system according to claim 2, comprising a particle detection unit that detects the degree of particle adsorption by the particle adsorption jig during a series of operations of the robot arm.

9. The charging system according to claim 8, wherein the particle detection unit includes at least one of a charge amount detection unit that detects the charge amount of the particle adsorption jig and an imaging unit that images the particles adsorbed on the particle adsorption jig.

10. The charging system according to claim 8, comprising an aligner disposed inside the substrate transfer device, wherein the particle detection unit is disposed on the aligner.

11. The charging system according to claim 2, comprising a cleaning device that cleans the particle adsorption jig, wherein the control unit executes a process of moving the particle adsorption jig to the cleaning device by the robot arm after executing a process of adsorbing particles by the particle adsorption jig, and the cleaning device executes a process of cleaning the moved particle adsorption jig.

12. The charging system according to claim 1, comprising an aligner disposed inside the substrate transfer device, wherein the charging device includes a power storage unit that stores power and is charged by the power supplied to the aligner.

13. A control method for a charging system, comprising: charging static electricity to a particle adsorption jig that adsorbs particles by a charging device disposed within the operation of a robot arm that transfers a substrate inside a substrate transfer device; and adsorbing particles by the particle adsorption jig charged with static electricity.

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