Control parameter guidance device and control parameter guidance method

Abstract

This control parameter guidance device comprises a storage unit and a guidance unit. The storage unit stores quality relationship data related to print quality of solder to be printed on a substrate, control parameters of a printer for printing solder on the substrate, and inspection results by a printing inspection machine for inspecting the printing state of solder printed on the substrate, in association with one another. As the control parameters that are to be used, after being stored in the storage unit, in printing of a target substrate, which is a substrate on which solder is to be printed, the guidance unit provides control parameters that are specified on the basis of the quality relationship data acquired during printing of the target substrate and the quality relationship data and the inspection results that are stored in the storage unit.

Description

Control parameter guidance device and control parameter guidance method

[0001] This specification discloses a control parameter guidance device and a control parameter guidance method.

[0002] The printing device described in Patent Document 1 includes a viscometer, a processor, and a memory. The viscometer measures the viscosity of the solder paste placed on the mask. The processor determines printing conditions for printing the solder paste with a squeegee based on the viscosity of the solder paste measured by the viscometer.

[0003] Specifically, the processor stores in memory performance information on viscosity measured multiple times in the past by a viscometer, performance information on printing conditions determined multiple times in the past, and performance information on volume fraction obtained multiple times in the past from a solder print inspection device corresponding to the performance information on viscosity and the performance information on printing conditions.The processor then generates correlation information indicating the correlation between viscosity, printing conditions, and volume fraction based on the performance information on viscosity, the performance information on printing conditions, and the performance information on volume fraction, and determines the printing conditions based on the viscosity measured by the viscometer and the correlation information.

[0004] Japanese Patent Application Laid-Open No. 2022-076323

[0005] In order to improve print quality, it is necessary to adjust the control parameters of a printing press. However, it is difficult for a printing press user to derive appropriate control parameters for the printing press. Furthermore, when the control parameters are adjusted using inspection results obtained by a print inspection machine, the number of attempts to adjust the control parameters tends to increase.

[0006] In view of the above circumstances, this specification discloses a control parameter guidance device and a control parameter guidance method that are capable of guiding appropriate control parameters for a printing press.

[0007] This specification discloses a control parameter guidance device including a storage unit and a guidance unit. The storage unit stores quality-related data related to the printing quality of solder to be printed on a board, control parameters of a printer that prints the solder on the board, and inspection results from a print inspection machine that inspects the printing condition of the solder printed on the board, in association with each other. The guidance unit provides guidance on the quality-related data acquired during printing of the target board, as well as control parameters identified based on the quality-related data stored in the storage unit and the inspection results, as control parameters to be used in printing the target board, which is the board on which the solder is printed, after storage in the storage unit.

[0008] This specification also discloses a control parameter guidance method including a storage step and a guidance step. The storage step associates and stores quality-related data related to the printing quality of solder to be printed on a board, control parameters of a printer that prints the solder on the board, and inspection results from a print inspection machine that inspects the printing state of the solder printed on the board. The guidance step provides the quality-related data acquired during printing of the target board, which is the board on which the solder is printed after storage in the storage step, as the control parameters to be used in printing the target board, which is the board on which the solder is printed, and the control parameters identified based on the quality-related data stored in the storage step and the inspection results.

[0009] This specification discloses a technical idea in claim 4 of the claims originally attached to the application (hereinafter referred to as the "initial claims"), where "the control parameter guide device according to claim 1" is changed to "the control parameter guide device according to any one of claims 1 to 3." This specification also discloses a technical idea in claim 5 of the original claims, where "the control parameter guide device according to claim 1" is changed to "the control parameter guide device according to any one of claims 1 to 4." This specification also discloses a technical idea in claim 6 of the original claims, where "the control parameter guide device according to claim 1" is changed to "the control parameter guide device according to any one of claims 1 to 5."

[0010] This specification also discloses the technical idea of ​​changing "the control parameter guidance device according to claim 1" in claim 7 originally claimed to "the control parameter guidance device according to any one of claims 1 to 6." Furthermore, this specification also discloses the technical idea of ​​changing "the control parameter guidance device according to claim 1" in claim 8 originally claimed to "the control parameter guidance device according to any one of claims 1 to 7." Furthermore, this specification also discloses the technical idea of ​​changing "the control parameter guidance device according to claim 1" in claim 9 originally claimed to "the control parameter guidance device according to any one of claims 1 to 8."

[0011] Furthermore, this specification discloses a technical idea in which, in claim 10 originally claimed, "the control parameter guidance device according to claim 1" is changed to "the control parameter guidance device according to any one of claims 1 to 9." Also, this specification discloses a technical idea in claim 12 originally claimed, "the control parameter guidance device according to claim 1" is changed to "the control parameter guidance device according to any one of claims 1 to 11." Also, this specification discloses a technical idea in claim 13 originally claimed, "the control parameter guidance device according to claim 1" is changed to "the control parameter guidance device according to any one of claims 1 to 12." Also, this specification discloses a technical idea in claim 14 originally claimed, "the control parameter guidance device according to claim 1" is changed to "the control parameter guidance device according to any one of claims 1 to 13."

[0012] The control parameter guidance device described above can guide appropriate control parameters for a printing press. Specifically, the control parameter guidance device can guide control parameters to be used in printing a target substrate, identified based on quality-related data acquired during printing of the target substrate, as well as quality-related data and inspection results stored in a memory unit. What has been described above about the control parameter guidance device can also be applied to the control parameter guidance method.

[0013] FIG. 1 is a configuration diagram showing an example of the configuration of a substrate-related work line. FIG. 2 is a partial cross-sectional view showing an example of the configuration of a printing press. FIG. 3 is a block diagram showing an example of a control block of a control parameter guide device. FIG. 4 is a flowchart showing an example of a control procedure by the control parameter guide device. FIG. 5 is a schematic diagram showing an example of stored data.

[0014] 1. Embodiment 1-1. Configuration Example of Substrate-Related Work Line WML In the substrate-related work line WML, a substrate-related work machine WM0 performs a predetermined substrate-related work on a substrate 90 to produce a product substrate 900. The substrate-related work line WML of the embodiment only needs to include a printer WM1 and a print inspection machine WM2, and the type and number of substrate-related work machines WM0 that make up the substrate-related work line WML are not limited. As shown in FIG. 1 , the substrate-related work line WML of the embodiment includes multiple (five) substrate-related work machines WM0: a printer WM1, a print inspection machine WM2, a component placement machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in this order by a substrate transport device.

[0015] The printer WM1 prints solder 80 at the mounting positions of multiple components on the board 90. The print inspection machine WM2 inspects the printing condition of the solder 80 printed by the printer WM1. The component mounting machine WM3 mounts multiple components on the board 90 on which the solder 80 has been printed by the printer WM1. There may be one or more component mounting machines WM3. When multiple component mounting machines WM3 are provided, the multiple component mounting machines WM3 can share the mounting work of multiple components.

[0016] The reflow furnace WM4 heats the board 90 on which multiple components have been mounted by the component mounting machine WM3, melting the solder 80 and performing soldering. The visual inspection machine WM5 inspects the mounting state of the multiple components mounted by the component mounting machine WM3. In this way, the board-related work line WML uses multiple (five) board-related work machines WM0 to sequentially transport the boards 90 and perform production processes including inspection processes to produce the product board 900. Note that the board-related work line WML can also be equipped with other board-related work machines WM0 as needed, such as a function inspection machine, a buffer device, a board supply device, a board inverting device, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device.

[0017] The plurality (five) of substrate-related performing machines WM0 and the control device WMC that make up the substrate-related performing line WML are communicatively connected by a communication unit LC0. The communication unit LC0 may perform communication via a wired connection or wirelessly. Various communication methods are possible. In this embodiment, the plurality (five) of substrate-related performing machines WM0 and the control device WMC form a local area network (LAN). This allows the plurality (five) of substrate-related performing machines WM0 to communicate with each other via the communication unit LC0. Furthermore, the plurality (five) of substrate-related performing machines WM0 can communicate with the control device WMC via the communication unit LC0.

[0018] The management device WMC controls the plurality (five) of substrate-related performing machines WM0 that make up the substrate-related performing line WML and monitors the operating status of the substrate-related performing line WML. The management device WMC stores various control data for controlling the plurality (five) substrate-related performing machines WM0. The management device WMC transmits the control data to each of the plurality (five) substrate-related performing machines WM0. Furthermore, each of the plurality (five) substrate-related performing machines WM0 transmits its operating status and production status to the management device WMC.

[0019] The management device WMC may be provided with a data server DSV. The data server DSV may store, for example, acquired data acquired by the substrate-related performing machine WM0 regarding substrate-related performing operations. For example, the acquired data may include various image data captured by the substrate-related performing machine WM0. The acquired data may also include records (log data) of the operating status acquired by the substrate-related performing machine WM0.

[0020] The data server DSV can also store various production information related to the production of the board 90. For example, component data such as information on the shape of each component type, information on electrical characteristics, and information on how to handle the components are included in the production information. Furthermore, the inspection results obtained by inspection machines such as the print inspection machine WM2 and the appearance inspection machine WM5 are included in the acquired data as well as in the production information.

[0021] 1-2. Configuration Example of Printer WM1 In the printer WM1 of this embodiment, the squeegee 34 slides over the mask 70 to print solder 80 onto the substrate 90 through the openings 71 in the mask 70. As shown in FIG. 2 , the printer WM1 of this embodiment includes a substrate transport device 10, a mask support device 20, a squeegee moving device 30, a control device 40, and a display device 41. In this specification, the transport direction of the substrate 90 (the direction perpendicular to the paper surface of FIG. 2 ) is defined as the X-axis direction. Furthermore, the direction perpendicular to the X-axis direction in the horizontal plane (XY plane) (the front-to-rear direction of the printer WM1, the left-to-right direction on the paper surface of FIG. 2 ) is defined as the Y-axis direction. Furthermore, the vertical direction perpendicular to the X-axis direction and the Y-axis direction (the up-to-down direction on the paper surface of FIG. 2 ) is defined as the Z-axis direction.

[0022] The board transfer device 10 transfers a board 90 to be printed. The board 90 is a circuit board on which various circuits such as electronic circuits, electric circuits, and magnetic circuits are formed. The board transfer device 10 is provided on a base BS1 of the printing machine WM1. The board transfer device 10 transfers the board 90, for example, by a belt conveyor extending in the X-axis direction.

[0023] The substrate transport device 10 includes a substrate holding unit 11 that holds the substrate 90 that has been carried into the printing machine WM1. The substrate holding unit 11 is provided below the mask 70 and is configured to be able to move up and down in the Z-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate 90 is being transported, and when the substrate 90 is transported to a predetermined position, it rises together with the substrate 90 and holds the substrate 90 with the upper surface of the substrate 90 in close contact with the lower surface of the mask 70.

[0024] The mask support device 20 is provided above the substrate transport device 10. The mask support device 20 supports the mask 70 by a pair of support tables. The pair of support tables are arranged on the left side (the back side of the paper in FIG. 2 and shown in the figure) and the right side (the front side of the paper in FIG. 2 and not shown in the figure) of the printing machine WM1 when viewed from the front, and are formed to extend along the Y-axis direction.

[0025] 2 is a partial cross-sectional view of the printer WM1 taken along the Y-axis direction, and schematically shows the interior of the printer WM1 as viewed from the side, and cross sections of the mask 70 and the substrate 90. The mask 70 has openings 71 formed therethrough at predetermined positions on the wiring pattern of the substrate 90. The mask 70 is supported by the mask support device 20, for example, via a frame member provided on the outer periphery.

[0026] The squeegee moving device 30 raises and lowers the squeegee 34 in a direction perpendicular to the mask 70 (Z-axis direction), and moves the squeegee 34 in the Y-axis direction on the top surface of the mask 70. The squeegee moving device 30 includes a head driving device 31, a squeegee head 32, a pair of lifting devices 33, 33, and a pair of squeegees 34, 34. The head driving device 31 is disposed on the upper side of the printing machine WM1. The head driving device 31 can move the squeegee head 32 in the Y-axis direction by, for example, a linear motion mechanism such as a feed screw mechanism.

[0027] The squeegee head 32 is clamped and fixed to a moving body that constitutes the linear motion mechanism of the head drive device 31. The squeegee head 32 holds a pair of lifting devices 33, 33. Each of the pair of lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of lifting devices 33, 33 drives an actuator such as an air cylinder to raise and lower the squeegee 34 that it holds.

[0028] The squeegee 34 slides over the upper surface of the mask 70, moving the solder 80 supplied to the upper surface of the mask 70 along the mask 70. Cream solder (solder paste) can be used as the solder 80. The solder 80 is imprinted onto the substrate 90 through the openings 71 in the mask 70, and the solder 80 is printed on the substrate 90 arranged on the lower surface side of the mask 70. In this embodiment, each of the pair of squeegees 34, 34 is a plate-like member formed to extend along a width direction (X-axis direction) perpendicular to the printing direction (Y-axis direction) in a horizontal plane (XY plane).

[0029] The front squeegee 34 (on the left side of FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the front side to the rear side, with the direction from the front side to the rear side of the printer WM1 being the traveling direction. The rear squeegee 34 (on the right side of FIG. 2 ) of the pair of squeegees 34 is used in a printing process that moves the solder 80 from the rear side to the front side, with the direction from the rear side to the front side of the printer WM1 being the traveling direction. Furthermore, for both squeegees 34, the direction opposite to the traveling direction is the retreating direction.

[0030] Each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the front portion located on the traveling direction side faces downward. In other words, each of the pair of squeegees 34, 34 is held by the lifting device 33 at an inclination such that the back portion located on the retreating direction side faces upward. The inclination angle of each of the pair of squeegees 34, 34 can be adjusted by, for example, an adjustment mechanism provided below the lifting device 33.

[0031] The control device 40 includes a known arithmetic unit and a storage device, and forms a control circuit. The control device 40 is communicably connected to the management device WMC via the communication unit LC0 shown in FIG. 1, and can send and receive various data. The control device 40 can drive and control the substrate transport device 10, the mask support device 20, the squeegee moving device 30, and the display device 41 based on the production program, the detection results of various sensors, etc.

[0032] As shown in Figure 3, the control device 40 is provided with a storage device 60. The storage device 60 can be, for example, a magnetic storage device such as a hard disk drive, or a storage device using semiconductor elements such as flash memory. The storage device 60 stores a production program for driving the printing press WM1, etc. The control device 40 acquires various pieces of information stored in the storage device 60 and detection results of various sensors provided in the printing press WM1.

[0033] The control device 40, for example, drives and controls the squeegee moving device 30. The control device 40 sends a control signal to the squeegee moving device 30 based on the above-mentioned various information and detection results, etc. This controls the Y-axis position, Z-axis position (height), and movement speed of the pair of squeegees 34, 34 held by the squeegee head 32. Then, as described above, the pair of squeegees 34, 34 are driven and controlled, and solder 80 is printed on the substrate 90 arranged on the underside of the mask 70.

[0034] As shown in Figures 2 and 3, the control device 40 is provided with a display device 41. The display device 41 can display the operating status of the printing press WM1. The display device 41 is also configured as a touch panel and functions as an input device that accepts various operations by the operator. The operator can learn the operating status of the printing press WM1 via the display device 41. The operator can also set the printing press WM1, give instructions to the printing press WM1, and so on via the display device 41.

[0035] 1-3. Configuration Example of Control Parameter Guide Device 50 To improve print quality, it is necessary to adjust the control parameters CP0 of the printing press WM1. However, it is difficult for the user of the printing press WM1 to derive appropriate control parameters CP0 for the printing press WM1. Furthermore, when adjusting the control parameters CP0 using the inspection results IR0 acquired by the print inspection machine WM2, the number of attempts to adjust the control parameters CP0 tends to increase.

[0036] Therefore, the substrate-related operation line WML of this embodiment is provided with a control parameter guide device 50. The control parameter guide device 50 can guide appropriate control parameters CP0 for the printing machine WM1. Specifically, as shown in FIG. 3 , the control parameter guide device 50, when considered as a control block, includes a storage unit 51 and a guide unit 52. The storage unit 51 and the guide unit 52 can be provided in various control devices, such as the control device of the substrate-related operation machine WM0, and various management devices, such as the management device WMC.

[0037] For example, at least one of the storage unit 51 and the guide unit 52 can be provided in the control device 40 of the printing machine WM1. At least one of the storage unit 51 and the guide unit 52 can also be provided in the management device WMC. At least one of the storage unit 51 and the guide unit 52 can also be formed on the cloud. The storage unit 51 and the guide unit 52 can also be distributed and arranged in various control devices, various management devices, on the cloud, etc.

[0038] As shown in Fig. 3, in the control parameter guidance device 50 of this embodiment, a storage unit 51 and a guidance unit 52 are provided in the control device 40 of the printing press WM1. The control parameter guidance device 50 can execute control in accordance with the flowchart shown in Fig. 4. The storage unit 51 performs the process shown in step S11. The guidance unit 52 performs the processes shown in steps S12 and S13. The matters described in this specification can be selected and applied as appropriate. The matters described in this specification can also be combined as appropriate.

[0039] 1-3-1. Storage Unit 51 The storage unit 51 stores the quality-related data QD0, the control parameters CP0 of the printer WM1, and the inspection results IR0 from the print inspection machine WM2 in association with each other (step S11 shown in FIG. 4). The quality-related data QD0 refers to data related to the printing quality of the solder 80 printed on the board 90. The quality-related data QD0 may be any data related to printing quality, and may include a variety of data.

[0040] For example, if the fluidity of the solder 80 changes, the amount of solder 80 printed on the substrate 90 may fluctuate, which may affect print quality. Specifically, the lower the fluidity of the solder 80, the more likely it is that the amount of solder 80 printed will decrease. Conversely, the better the fluidity of the solder 80, the more likely it is that the amount of solder 80 printed will increase. Therefore, it is preferable that the quality-related data QD0 be related to the fluidity of the solder 80. For example, in the printer WM1 of this embodiment, the squeegee 34 slides over the mask 70 to print the solder 80 on the substrate 90 through the openings 71 in the mask 70.

[0041] In this embodiment, for example, the higher the viscosity of the solder 80, the more likely the fluidity of the solder 80 is to decrease. Also, the lower the tension of the mask 70, the more likely the fluidity of the solder 80 is to decrease in the opening 71 during plate separation. Furthermore, the lower the temperature inside the printing press WM1, the more likely the fluidity of the solder 80 is to decrease. Also, the lower the humidity inside the printing press WM1, the more likely the fluidity of the solder 80 is to decrease. Therefore, the quality-related data QD0 may be at least one of the viscosity of the solder 80, the tension of the mask 70, the temperature inside the printing press WM1, and the humidity inside the printing press WM1.

[0042] The storage unit 51 can acquire the quality-related data QD0 using a known acquisition device FC0. The acquisition device FC0 can acquire the viscosity of the solder 80 using, for example, a known spiral solder viscometer. The acquisition device FC0 can also acquire the tension of the mask 70 using a known tension sensor that can measure the tension of the mesh of the mask 70 (including the gauze (polyester mesh) hung on the frame member). The acquisition device FC0 can also acquire the temperature and humidity inside the printing machine WM1 using a known thermo-hygrometer.

[0043] In particular, if the tension of the mask 70 decreases, plate release becomes unstable, which may result in an insufficient amount of solder 80 being printed on the board 90, affecting print quality. Also, if the temperature inside the printer WM1 changes, the amount of solder 80 printed on the board 90 may fluctuate, which may affect print quality. Furthermore, if the humidity inside the printer WM1 changes, the amount of solder 80 printed on the board 90 may fluctuate, which may affect print quality. Therefore, it is preferable that the quality-related data QD0 be at least one of the tension of the mask 70, the temperature inside the printer WM1, and the humidity inside the printer WM1.

[0044] The control parameter CP0 is not limited to any particular parameter as long as it is a control parameter of the printer WM1 that prints the solder 80 on the substrate 90. As described above, in consideration of the fluidity of the solder 80, the control parameter CP0 is preferably one that can control the amount of solder 80 printed. For example, in the printer WM1 of the embodiment, the squeegee 34 slides over the mask 70 to print the solder 80 on the substrate 90 through the openings 71 in the mask 70. In this embodiment, for example, if the printing pressure when printing the solder 80 is lowered compared to when a predetermined amount of solder 80 is printed, the amount of solder 80 printed on the substrate 90 is likely to be less than the predetermined amount.

[0045] Furthermore, compared to when a predetermined amount of solder 80 is printed, if the printing speed when printing the solder 80 is increased, the amount of solder 80 printed on the board 90 is likely to be less than the predetermined amount. Furthermore, compared to when a predetermined amount of solder 80 is printed, if the angle of the squeegee 34 with respect to the mask 70 (squeegee angle) when printing the solder 80 is increased, the amount of solder 80 printed on the board 90 is likely to be less than the predetermined amount. Furthermore, if the speed pattern of the stencil separation speed when printing the solder 80 differs from the speed pattern of the stencil separation when a predetermined amount of solder 80 is printed, the solder 80 will have difficulty coming out of the openings 71 of the mask 70, and the amount of solder 80 printed on the board 90 will likely be less than the predetermined amount.

[0046] Furthermore, if the cleaning interval of the mask 70 when printing the solder 80 varies, the amount of solder 80 remaining in the openings 71 of the mask 70 changes, which tends to fluctuate the amount of solder 80 printed on the board 90. Therefore, the control parameter CP0 is preferably at least one of the printing pressure when printing the solder 80, the printing speed, the angle of the squeegee 34 relative to the mask 70, the plate release speed, and the cleaning interval of the mask 70. By changing the control parameter CP0, the printer WM1 can easily change the amount of solder 80 printed on the board 90.

[0047] The inspection result IR0 is not limited to any particular type, and may be an inspection result obtained by the print inspection machine WM2 that inspects the printing state of the solder 80 printed on the board 90. As described above, considering the fluidity of the solder 80, the inspection result IR0 may be related to the amount of solder 80 printed. For example, the amount of solder 80 printed can be expressed by the volume, area, and height of the solder 80 printed on the board 90. Furthermore, the more the amount of solder 80 printed exceeds the allowable range, the more likely it is that bridges connecting the pieces of solder 80 printed on the board 90 will occur. Therefore, the inspection result IR0 may indicate whether the volume, area, and height of the solder 80 printed on the board 90 are each within the allowable range, or whether bridges connecting the pieces of solder 80 printed on the board 90 have occurred.

[0048] For example, the memory unit 51 can acquire quality-related data QD0 using the acquisition device FC0 before printing solder 80 on the substrate 90. The acquisition device FC0 can acquire the quality-related data QD0 described above inside the printer WM1. The acquisition device FC0 can also acquire at least one of the viscosity of the solder 80 and the tension of the mask 70 included in the quality-related data QD0 outside the printer WM1. The printer WM1 prints the solder 80 on the substrate 90 using, for example, recommended values, theoretical values, etc. of the control parameters CP0. The memory unit 51 can acquire the control parameters CP0 used for printing from the printer WM1. Then, the print inspection machine WM2 inspects the printing condition of the solder 80 printed on the substrate 90. The memory unit 51 can acquire the inspection results IR0 from the print inspection machine WM2.

[0049] The storage unit 51 stores the acquired quality-related data QD0, control parameters CP0, and inspection results IR0 in an associated manner. The storage unit 51 may take various forms as long as it can store the quality-related data QD0, control parameters CP0, and inspection results IR0 in an associated manner. For example, the storage unit 51 can store the quality-related data QD0, control parameters CP0, and inspection results IR0 in the storage device 60 in an associated manner. The storage unit 51 can also store the quality-related data QD0, control parameters CP0, and inspection results IR0 in the data server DSV in an associated manner. The storage unit 51 can also store the quality-related data QD0, control parameters CP0, and inspection results IR0 in the cloud in an associated manner.

[0050] 5 is a schematic diagram illustrating an example of stored data MD0, which includes quality-related data QD0, control parameters CP0, and inspection results IR0 associated with each other and stored in the storage unit 51. In the figure, n data values ​​DV0 (where n is a natural number, and the same applies below) for the viscosity of the solder 80 are represented by data values ​​DV11 to DV1n. Furthermore, n data values ​​DV0 for the tension of the mask 70 are represented by data values ​​DV21 to DV2n. Furthermore, n data values ​​DV0 for the internal temperature of the printing press WM1 are represented by data values ​​DV31 to DV3n. Furthermore, n data values ​​DV0 for the internal humidity of the printing press WM1 are represented by data values ​​DV41 to DV4n.

[0051] In the figure, one of the plurality of control parameters CP0 is indicated by control parameter CP1, and another of the plurality of control parameters CP0 is indicated by control parameter CP2. Furthermore, the n parameter values ​​PV0 of the control parameter CP1 are indicated by parameter values ​​PV11 to PV1n. Furthermore, the n parameter values ​​PV0 of the control parameter CP2 are indicated by parameter values ​​PV21 to PV2n.

[0052] The control parameters CP1 and CP2 correspond to, for example, two of the printing pressure, printing speed, angle of the squeegee 34 relative to the mask 70, plate release speed, and cleaning interval of the mask 70 when printing the solder 80 as described above. For convenience of illustration, only the two control parameters CP1 and CP2 are shown in the figure, but the storage unit 51 can also store another control parameter CP0 in association with them.

[0053] Furthermore, in the same figure, the inspection result IR0 by the print inspection machine WM2 is shown as a good inspection result IR1 or a bad inspection result IR2. Good inspection result IR1 refers to an inspection result IR0 that meets the inspection standards of the print inspection machine WM2. Bad inspection result IR2 refers to an inspection result IR0 that does not meet the inspection standards of the print inspection machine WM2. In the example already described, good inspection result IR1 indicates that the volume, area, and height of the solder 80 printed on the board 90 are each within the allowable range. Good inspection result IR1 also indicates that no bridging has occurred. Bad inspection result IR2 indicates that at least one of the volume, area, and height of the solder 80 printed on the board 90 is not within the allowable range. Bad inspection result IR2 also indicates that bridging has occurred.

[0054] Note that the larger the amount of stored data MD0, which is the quality-related data QD0, control parameters CP0, and inspection results IR0 stored in association with each other, the more likely it is that the storage area of ​​the storage device 60 will be occupied. Also, the less frequently used the stored data MD0 is, the less necessary it is to store it in the storage device 60. Therefore, the storage unit 51 can delete stored data MD0 for which a predetermined time has elapsed since starting to store the stored data MD0, which is the quality-related data QD0, control parameters CP0, and inspection results IR0 stored in association with each other, or deleted stored data MD0 that has been used less than a predetermined number of times.

[0055] The predetermined time and the predetermined number of times can be set arbitrarily according to, for example, the storage capacity of the storage device 60. This allows for effective use of the storage area of ​​the storage device 60. The control device 40 of the printing machine WM1 can transmit the stored data MD0 to the data server DSV. In this case, the stored data MD0 can also be saved in the data server DSV, including the stored data MD0 deleted by the storage unit 51.

[0056] The storage unit 51 can also store at least one of board identification information, solder type information, used material identification information, and lot identification information in association with the quality-related data QD0, control parameters CP0, and inspection results IR0. Board identification information refers to information that identifies the board 90. Solder type information refers to information that identifies the type of solder 80. Used material identification information refers to information that identifies the used materials used when printing the solder 80 on the board 90. For example, the used materials include the squeegee 34, mask 70, etc. Lot identification information refers to information that identifies the production lot of the board 90.

[0057] This makes it easy to extract stored data MD0 related to the same type of board 90 based on, for example, board identification information. Also, it makes it easy to extract stored data MD0 related to the same type of solder 80 based on solder type information. Furthermore, it makes it easy to extract stored data MD0 related to the same type of used material based on used material identification information. Also, it makes it easy to extract stored data MD0 related to each production lot based on lot identification information.

[0058] The guide unit 52 provides, as the control parameters CP0 to be used in printing the target board 90t, the control parameters CP0 identified based on the quality-related data QD0 acquired during printing of the target board 90t, and the quality-related data QD0 and inspection results IR0 stored by the memory unit 51. The target board 90t refers to the board 90 on which solder 80 is printed after storage by the memory unit 51.

[0059] For example, the guide unit 52 can use the acquisition device FC0 to acquire the quality-related data QD0 before printing the solder 80 on the target board 90t (step S12 shown in FIG. 4). The acquisition device FC0 can acquire the quality-related data QD0 described above inside the printing machine WM1. The acquisition device FC0 can also acquire at least one of the viscosity of the solder 80 and the tension of the mask 70 included in the quality-related data QD0 outside the printing machine WM1.

[0060] For example, before printing the solder 80 on the target substrate 90t, the guiding unit 52 acquires the viscosity of the solder 80 using the acquisition device FC0. Assume that the data value DV0 acquired at this time is the data value DV11. In the stored data MD0 shown in FIG. 5 , when the viscosity of the solder 80 is the data value DV11, the data value DV11 is stored in association with the parameter value PV11 of the control parameter CP1 and the parameter value PV21 of the control parameter CP2. Therefore, in this case, the guiding unit 52 can provide the parameter value PV11 for the control parameter CP1 and the parameter value PV21 for the control parameter CP2.

[0061] Furthermore, if printing is performed on the target substrate 90t using the control parameters CP0 stored in association with the defective inspection result IR2, there is a higher possibility that the inspection criteria will not be met compared to using the control parameters CP0 stored in association with the good inspection result IR1. Therefore, the guidance unit 52 may provide guidance on the control parameters CP0 stored in association with the good inspection result IR1, which is the inspection result IR0 that meets the inspection criteria of the print inspection machine WM2. In the example described above, the parameter value PV11 of the control parameter CP1 and the parameter value PV21 of the control parameter CP2 are stored in association with the good inspection result IR1.

[0062] Therefore, in this case, the navigating unit 52 navigates the parameter value PV11 for the control parameter CP1 and the parameter value PV21 for the control parameter CP2 (step S13 shown in FIG. 4). The above description of the viscosity of the solder 80 also applies to the other quality-related data QD0. Note that if the control parameter CP0 stored in association with the acceptable inspection result IR1 is not stored by the storage unit 51, the navigating unit 52 can navigate the control parameter CP0 after the control parameter CP0 is stored. The navigating unit 52 can also perform a correction, as described below, and navigate the corrected control parameter CP0.

[0063] The guidance unit 52 may provide the control parameter CP0 in any manner, as long as it can provide the control parameter CP0. For example, the guidance unit 52 may provide the control parameter CP0 on a known display device (e.g., the display device 41 of the printing press WM1). In this configuration, the user of the printing press WM1 can set the control parameter CP0 for the printing press WM1 by referring to the control parameter CP0 provided by the guidance unit 52. The guidance unit 52 may also provide the control parameter CP0 to a control parameter setting device that automatically sets the control parameter CP0. The control parameter setting device can set the control parameter CP0 provided by the guidance unit 52 for the printing press WM1.

[0064] In this way, the guiding unit 52 can provide the control parameters CP0 to be used in printing the target substrate 90t, including the quality-related data QD0 acquired during printing of the target substrate 90t, as well as the control parameters CP0 identified based on the quality-related data QD0 stored by the memory unit 51 and the inspection results IR0. It should be noted that, for example, quality-related data QD0 that fluctuates little compared to the data value DV0 of the quality-related data QD0 acquired by the memory unit 51, such as the tension of the mask 70, acquisition by the acquisition device FC0 during printing of the target substrate 90t may be omitted. In this case, the guiding unit 52 can acquire the quality-related data QD0 stored by the memory unit 51 as the quality-related data QD0 to be acquired during printing of the target substrate 90t.

[0065] It is also possible that there is no control parameter CP0 stored in association with quality-related data QD0 having the same data value DV0 as the data value DV0 in the quality-related data QD0 acquired during printing of the target board 90t. In this case, the guiding unit 52 may provide the control parameter CP0 stored in association with quality-related data QD0 having the same data value DV0 that falls within a predetermined range based on a predetermined data value DV0 in the quality-related data QD0 acquired during printing of the target board 90t. For example, in the example described above, assume that the guiding unit 52 acquires the viscosity of the solder 80 using the acquisition device FC0, and the acquired data value DV0 is the data value DV11a.

[0066] 5, there is no control parameter CP0 stored in association with quality-related data QD0 having the same data value DV0 as data value DV11a. In this case, the guide unit 52 can guide the control parameter CP0 stored in association with quality-related data QD0 having the same data value DV0 within a predetermined range based on data value DV11a. For example, data value DV11 and data value DV11a indicate the viscosity of solder 80 and are the same data value DV0.

[0067] When the data value DV11 is within a predetermined range set based on the data value DV11a, the navigating unit 52 can present the control parameter CP0 stored in association with the quality-related data QD0 having the data value DV11. Specifically, the data value DV11 is stored in association with the parameter value PV11 of the control parameter CP1 and with the parameter value PV21 of the control parameter CP2. Thus, the navigating unit 52 can present the parameter value PV11 for the control parameter CP1 and the parameter value PV21 for the control parameter CP2.

[0068] Furthermore, when there are multiple types of quality-related data QD0, it is possible that one control parameter CP0 is identified using one type of quality-related data QD0 as a reference, and another control parameter CP0 is identified using another type of quality-related data QD0 as a reference. For example, the quality-related data QD0 shown in Figure 5 includes four types: the viscosity of the solder 80, the tension of the mask 70, the temperature inside the printing press WM1, and the humidity inside the printing press WM1. In the example described above, it is assumed that the guide unit 52 acquires the viscosity of the solder 80 using the acquisition device FC0, and the acquired data value DV0 is the data value DV11, and that the guide unit 52 acquires the tension of the mask 70 using the acquisition device FC0, and the acquired data value DV0 is the data value DV22.

[0069] In this case, when the viscosity of the solder 80 is used as a reference, the data value DV11 is stored in association with the parameter value PV11 of the control parameter CP1 and is stored in association with the parameter value PV21 of the control parameter CP2. Therefore, the guiding unit 52 can provide the parameter value PV11 for the control parameter CP1 and the parameter value PV21 for the control parameter CP2. In contrast, when the tension of the mask 70 is used as a reference, the data value DV22 is stored in association with the parameter value PV12 of the control parameter CP1 and is stored in association with the parameter value PV22 of the control parameter CP2. Therefore, the guiding unit 52 can provide the parameter value PV12 for the control parameter CP1 and the parameter value PV22 for the control parameter CP2.

[0070] In this way, when there are multiple types of quality-related data QD0, the guidance unit 52 can prioritize the guidance of the control parameter CP0 that is stored in association with the quality-related data QD0 with the highest importance. The importance of the quality-related data QD0 can be set arbitrarily. For example, the importance of the quality-related data QD0 can be set higher for quality-related data QD0 that is expected to have a higher possibility of affecting print quality.

[0071] For example, the guide unit 52 can also have the user of the printing machine WM1 input the importance of the quality-related data QD0. In this case, the guide unit 52 can have the user of the printing machine WM1 input the importance on a display device such as the display device 41. For example, in the example described above, assume that the tension of the mask 70 is more important than the viscosity of the solder 80. In this case, the guide unit 52 can provide a parameter value PV12 for the control parameter CP1 and a parameter value PV22 for the control parameter CP2 based on the tension of the mask 70.

[0072] Furthermore, when there are multiple candidates for the control parameter CP0 to be recommended, the guiding unit 52 can preferentially recommend the control parameter CP0 that will result in the shortest cycle time, which is the time it takes for the printing process to be performed in the printer WM1. For example, the faster the printing speed when printing the solder 80, the easier it is to minimize the cycle time. In this case, the guiding unit 52 can, for example, recommend the control parameter CP0 that has the fastest printing speed among the multiple recommendation candidates as the control parameter CP0 to be used in printing the target board 90t.

[0073] The guidance unit 52 can also correct the control parameter CP0 stored in the memory unit 51 based on the quality-related data QD0 acquired during printing of the target board 90t, and provide the corrected control parameter CP0. For example, in the example described above, assume that the guidance unit 52 acquires the viscosity of the solder 80 using the acquisition device FC0, and the acquired data value DV0 is data value DV12. Also assume that there is no control parameter CP0 (parameter value PV12 of control parameter CP1 and parameter value PV22 of control parameter CP2) stored in association with data value DV12.

[0074] In this case, the guidance unit 52 corrects the control parameter CP0 (parameter value PV11 and parameter value PV13) stored in the storage unit 51 for the control parameter CP1 based on the quality-related data QD0 (data value DV12) acquired during printing of the target substrate 90t. For example, assume that the stored data MD0 shown in FIG. 5 is sorted in ascending or descending order. In this case, the guidance unit 52 can interpolate (e.g., linearly interpolate) the parameter value PV11 in the data value DV11 and the parameter value PV13 in the data value DV13 to obtain the parameter value PV0 (corresponding to the parameter value PV12) in the data value DV12. The guidance unit 52 can then provide the corrected control parameter CP0 (corresponding to the parameter value PV12).

[0075] Similarly, for the control parameter CP2, the guidance unit 52 corrects the control parameter CP0 (parameter value PV21 and parameter value PV23) stored in the storage unit 51 based on the quality-related data QD0 (data value DV12) acquired during printing of the target substrate 90t. For example, assume that the stored data MD0 shown in FIG. 5 is sorted in ascending or descending order. In this case, the guidance unit 52 can interpolate (e.g., linearly interpolate) the parameter value PV21 for the data value DV11 and the parameter value PV23 for the data value DV13 to obtain the parameter value PV0 for the data value DV12 (corresponding to the parameter value PV22). The guidance unit 52 can then provide the corrected control parameter CP0 (corresponding to the parameter value PV22).

[0076] Furthermore, when a user of the printing press WM1 attempts to set the control parameter CP0 stored in association with the defective inspection result IR2, the guiding unit 52 can warn that printing on the target board 90t using the control parameter CP0 may not satisfy the inspection criteria. For example, in the example described above, when a user of the printing press WM1 attempts to set a parameter value PV13 for the control parameter CP1, the guiding unit 52 can provide the above warning on a known display device (e.g., the display device 41 of the printing press WM1). Similarly, when a user of the printing press WM1 attempts to set a parameter value PV23 for the control parameter CP2, the guiding unit 52 can provide the above warning on a known display device (e.g., the display device 41 of the printing press WM1).

[0077] Furthermore, the quality-related data QD0 acquired by the guiding unit 52 during printing of the target board 90t may fluctuate during printing. For example, the viscosity of the solder 80 may fluctuate as the squeegee 34 slides over the top surface of the mask 70 during printing. The temperature inside the printer WM1 may fluctuate during printing. Furthermore, the humidity inside the printer WM1 may fluctuate during printing. Therefore, when a predetermined data value DV0 in the quality-related data QD0 acquired during printing of the target board 90t changes beyond an allowable range during printing, the guiding unit 52 can provide information on the control parameter CP0 stored in association with quality-related data QD0 having the same data value DV0 within a predetermined range based on the changed data value DV0.

[0078] For example, in the example described above, assume that the navigator 52 acquires the viscosity of the solder 80 using the acquisition device FC0 during printing of the target substrate 90t, and the acquired data value DV0 changes from data value DV11 to data value DV12. If the change exceeds an acceptable range, the navigator 52 can provide the control parameter CP0 stored in association with quality-related data QD0 having the same type of data value DV0 (in this case, data value DV12) that falls within a predetermined range based on the changed data value DV12. Specifically, the data value DV12 is stored in association with the parameter value PV12 of the control parameter CP1 and the parameter value PV22 of the control parameter CP2. Thus, the navigator 52 can provide the parameter value PV12 for the control parameter CP1 and the parameter value PV22 for the control parameter CP2.

[0079] Furthermore, when the data value DV0 in the quality-related data QD0 acquired during printing of the target board 90t returns to the data value DV0 before the change, the navigator 52 can also provide the control parameter CP0 stored in association with the quality-related data QD0 having the data value DV0 before the change. For example, in the example described above, assume that the navigator 52 acquires the viscosity of the solder 80 using the acquisition device FC0 during printing of the target board 90t, and the acquired data value DV0 returns from the data value DV12 to the data value DV11. In this case, the navigator 52 can provide the parameter value PV11 for the control parameter CP1 and the parameter value PV21 for the control parameter CP2.

[0080] As described above, the storage unit 51 can store at least one of the board identification information, solder type information, component identification information, and lot identification information in association with the quality-related data QD0, control parameters CP0, and inspection results IR0. In this embodiment, for example, the guiding unit 52 can extract stored data MD0 related to the same type of board 90 based on the board identification information and provide the control parameters CP0 based on the extracted stored data MD0. The guiding unit 52 can also extract stored data MD0 related to the same type of solder 80 based on the solder type information and provide the control parameters CP0 based on the extracted stored data MD0.

[0081] Furthermore, the guidance unit 52 can extract stored data MD0 related to the same type of used component based on the used component identification information, and provide the control parameter CP0 based on the extracted stored data MD0. Furthermore, the guidance unit 52 can extract stored data MD0 related to each production lot based on the lot identification information, and provide the control parameter CP0 based on the extracted stored data MD0.

[0082] 2. Control Parameter Guidance Method What has already been described about the control parameter guidance device 50 also applies to the control parameter guidance method. Specifically, the control parameter guidance method includes a storage step and a guidance step. The storage step corresponds to the control performed by the storage unit 51. The guidance step corresponds to the control performed by the guidance unit 52. Note that duplicated explanations will be omitted in this specification.

[0083] 3. Example of Effect of the Embodiment The control parameter guidance device 50 can guide appropriate control parameters CP0 for the printing press WM1. Specifically, the control parameter guidance device 50 can guide, as the control parameters CP0 to be used in printing the target substrate 90t, control parameters CP0 identified based on the quality-related data QD0 acquired during printing of the target substrate 90t, and the quality-related data QD0 and inspection results IR0 stored in the storage unit 51. What has been described above about the control parameter guidance device 50 also applies to the control parameter guidance method.

[0084] 34: Squeegee, 50: Control parameter guide device, 51: Memory unit, 52: Guide unit, 70: Mask, 71: Opening, 80: Solder, 90: Board, 90t: Target board, QD0: Quality related data, DV0: Data value, CP0: Control parameter, IR0: Inspection result, IR1: Good inspection result, IR2: Bad inspection result, MD0: Stored data, WM1: Printing machine, WM2: Printing inspection machine.

Claims

1. A control parameter guidance device comprising: a memory unit that associates and stores quality-related data related to the printing quality of solder printed on a board, control parameters of a printer that prints the solder on the board, and inspection results from a print inspection machine that inspects the printing state of the solder printed on the board; and a guidance unit that, after storage by the memory unit, guides the quality-related data obtained when printing the target board, which is the board on which the solder is printed, as the control parameters to be used in printing the target board, and the control parameters identified based on the quality-related data stored by the memory unit and the inspection results.

2. A control parameter guidance device according to claim 1, wherein the guidance unit guides the control parameters stored in association with a good inspection result, which is the inspection result that satisfies the inspection standard of the print inspection machine.

3. A control parameter guidance device as described in claim 1 or claim 2, wherein the guidance unit guides the control parameters stored in association with quality-related data having the same type of data value that falls within a specified range based on a specified data value in the quality-related data acquired during printing of the target substrate.

4. A control parameter guidance device as described in claim 1, wherein when there are multiple types of quality-related data, the guidance unit preferentially guides the control parameters stored in association with the quality-related data with the highest importance.

5. A control parameter guidance device as described in claim 1, wherein when there are multiple candidates for the control parameter to be guided, the guidance unit preferentially guides the control parameter that results in the shortest cycle time, which is the time it takes for the printing process to be performed in the printing press.

6. A control parameter guidance device as described in claim 1, wherein the guidance unit corrects the control parameters stored by the memory unit based on the quality-related data acquired during printing of the target substrate, and guides the corrected control parameters.

7. The control parameter guidance device of claim 1, wherein the guidance unit warns a user of the printing machine that, when the user attempts to set the control parameters stored in association with a defective inspection result that does not satisfy the inspection criteria of the printing inspection machine, there is a possibility that the inspection criteria will not be satisfied if printing is performed on the target board using the control parameters.

8. A control parameter guidance device as described in claim 1, wherein the guidance unit, when a predetermined data value in the quality-related data acquired during printing of the target substrate changes beyond an allowable range during printing, guides the control parameter stored in association with the quality-related data having the same type of data value that falls within a predetermined range based on the changed data value.

9. The control parameter guidance device of claim 1, wherein the storage unit deletes the stored data, which are the quality-related data, the control parameters, and the inspection results that are stored in association with each other, if a predetermined time has elapsed since the start of storage of the stored data, or if the stored data has been used less than a predetermined number of times.

10. The control parameter guide device of claim 1, wherein the printing machine has a squeegee that slides over a mask to print the solder onto the board through an opening in the mask, and the quality-related data is at least one of the viscosity of the solder, the tension of the mask, the temperature inside the printing machine, and the humidity inside the printing machine.

11. The control parameter guide device according to claim 10, wherein the quality-related data is at least one of the tension of the mask, the temperature inside the printing press, and the humidity inside the printing press.

12. The control parameter guide device of claim 1, wherein the printing machine has a squeegee that slides over a mask to print the solder onto the substrate through openings in the mask, and the control parameter is at least one of the printing pressure when printing the solder, the printing speed, the angle of the squeegee relative to the mask, the plate release speed, and the mask cleaning interval.

13. The control parameter guidance device of claim 1, wherein the inspection results indicate whether the volume, area, and height of the solder printed on the board are each within an acceptable range, or whether a bridge connecting the solder printed on the board has occurred.

14. The control parameter guidance device of claim 1, wherein the memory unit stores at least one of board identification information that identifies the board, solder type information that identifies the type of solder, material identification information that identifies the material used when printing the solder on the board, and lot identification information that identifies the production lot of the board, in association with the quality-related data, the control parameters, and the inspection results.

15. A control parameter guidance method comprising: a storage step of associating and storing quality-related data relating to the printing quality of solder printed on a board, control parameters of a printer that prints the solder on the board, and inspection results from a print inspection machine that inspects the printing state of the solder printed on the board; and a guidance step of providing the quality-related data obtained when printing the target board, which is the board on which the solder is printed after storage in the storage step, as the control parameters to be used in printing the target board, which is the board on which the solder is printed, and the control parameters identified based on the quality-related data stored in the storage step and the inspection results.

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