Laminated film and method for producing same

WO2025225475A1PCT designated stage Publication Date: 2025-10-30AGC INC

Patent Information

Application Number
PCT/JP2025/014929
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-23
Filing Date
2025-04-16
Publication Date
2025-10-30

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    Figure JP2025014929_30102025_PF_FP_ABST
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Abstract

The present invention relates to a laminated film comprising a substrate and a functional layer provided on one surface side of the substrate. The functional layer contains an antistatic agent. The functional layer does not contain particles having an average particle diameter of 0.1 μm or more. When the thickness of the functional layer is Tf and the maximum depth of recesses and protrusions on the surface of the laminated film on the side opposite from the substrate-side surface, among the two surfaces opposite of each other of the laminated film, is Df, Tf > Df > 0.1 μm is satisfied.
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Citation Information

Patent Citations

  • Release film, method for producing the same and application therefor

    JP2014151483A

  • Mold releasing film

    JP2020082657A

  • Release sheet and adhesive material

    WO2009069445A1

  • Mold-releasing film and method for manufacturing light emitting diode

    WO2010079812A1

  • Film, method for producing same, and method for producing semiconductor element using film

    WO2016125796A1

Cited By

  • Laminated film

    WO2026075078A1