Method of metal plating a substrate by means of an intermediate functional organic layer and a product thus produced

WO2025231827A9PCT designated stage Publication Date: 2026-01-08HUAWEI TECH CO LTD
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Patent Information

Application Number
PCT/CN2024/092304
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-05-10
Publication Date
2026-01-08

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Abstract

A method of preparing a substrate (1), which method comprises the following steps: (a)providing a substrate (1) with a cleaned surface (2), (b) pre-treating the cleaned surface (2) of the substrate (1) with aryl diazonium compounds dissolved in a liquid solution, (c)activating the pre-treated surface of the substrate, and (d) metallizing the activated surface of the substrate by exposing the surface of the substrate to a metal salt to provide a metal plating (3) on the substrate.The pre-treating of the cleaned surface of the substrate is performed by exposing the cleaned surface to a liquid in which the aryl diazonium compounds are dissolved. Furthermore, providing a corresponding product comprising a substrate (1) as prepared by the method.
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