Solder paste and method for producing joined body

WO2025243792A1PCT designated stage Publication Date: 2025-11-27SENJU METAL IND CO LTD
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Patent Information

Application Number
PCT/JP2025/016031
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-05-24
Filing Date
2025-04-25
Publication Date
2025-11-27

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Abstract

This solder paste contains a first solder alloy powder, a second solder alloy powder and a flux, and is characterized in that: the first solder alloy flux powder is a powder of an alloy which contains Sn, Ag and In and in which the content of Ag is 2.9 mass% or more and the content of In is more than 17 mass%; the second solder alloy powder is a powder of an alloy which contains Sn, Ag and Cu and in which the content of Cu is less than 2 mass%; and the mixing ratio of the first solder alloy powder and the second solder alloy powder is such that the first solder alloy powder is 45-65 parts by mass of and the second solder alloy powder is 35-55 parts by mass. With this solder paste, paste melting properties are enhanced, and impact resistance and heat resistance of a solder joining part are both enhanced.
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Citation Information

Patent Citations

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