Frame of electronic device and method for manufacturing same

Abstract

A method for manufacturing a frame may include a step of forming, from a first metal material, a component including a first portion and a second portion. The second portion may include at least one opening and at least one engagement feature. The method may include the steps of: injecting a second metallic material in a liquid state into a mold in which the component is located, and bonding the second metallic material to the component by curing the second metallic material injected into the mold. The at least one opening and the at least one engagement feature may engage with the second metallic material while the second metallic material contracts due to the curing.

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