Display panel and display device

Abstract

A display panel and a display device. The display device comprises a display panel (100) and a backplane (200); the display panel (100) comprises a light exit side (110) and a backlight side (120) opposite to the light exit side (110); and the backplane (200) is in contact with the backlight side (120) by means of at least one elastic piece structure (210) at a preset position. The display panel (100) further comprises at least one stress structure (130) arranged on the backlight side (120) and at least partially corresponding to the at least one elastic piece structure (210); and the projection of the at least one stress structure (130) on the backplane (200) at least partially covers the at least one elastic piece structure (210).

Description

Display panel and display device

[0001] This application claims priority to Chinese Patent Application No. 202421237846.2, filed on May 31, 2024, entitled “Display Panel and Display Device”, the contents of which are to be understood as incorporated herein by reference. Technical Field

[0002] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0003] When designing the overall system structure of a mobile phone product, it is necessary to design the back panel where the system is located and the display panel where the display module is located to ensure conductive connection between the mobile phone product and the back panel.

[0004] In related technologies, conductive connections are generally made by using metal materials for contact. However, metal contact can put pressure on the display panel, which can cause localized molding defects to be visible on the front of the display panel. Summary of the Invention

[0005] This application provides a display panel for use in a display device. The display device includes the display panel and a back panel. The display panel includes a light-emitting side and a backlight side opposite to the light-emitting side. The back panel contacts the backlight side through at least one spring-loaded structure at a preset position. The display panel further includes:

[0006] At least one stress structure is disposed on the backlight side and is disposed at least partially corresponding to the at least one spring sheet structure.

[0007] In some exemplary embodiments, the spring structure includes a protrusion; the stress structure is configured to correspond to the protrusion, and its projection on the back plate at least partially covers the at least one spring structure.

[0008] In some exemplary embodiments, the projection of the stress structure onto the back plate completely covers the entire spring structure.

[0009] In some exemplary embodiments, the stress structure is a sheet-like structure.

[0010] In some exemplary embodiments, the stress structure includes a stainless steel sheet;

[0011] The stainless steel sheet has a hardness of less than or equal to 400Hv and a yield strength of greater than or equal to 1000MPa.

[0012] In some exemplary embodiments, the backlight side includes a heat dissipation film layer, which includes an adhesive layer, a conductive layer, and a copper surface layer stacked together, and the at least one stress structure is disposed on the side of the copper surface layer away from the light-emitting side.

[0013] In some exemplary embodiments, the compressive deformation value of the conductive layer is greater than or equal to 0.3.

[0014] In some exemplary embodiments, the copper surface layer is specifically a rolled copper layer.

[0015] In some exemplary embodiments, the backlight side further includes a PET layer disposed on the side of the copper surface layer away from the light-emitting side, and a groove structure corresponding to the at least one stress structure is disposed at a position corresponding to the at least one stress structure.

[0016] In some exemplary embodiments, the display device includes a display area and a non-display area; the at least one stress structure is provided in a one-to-one correspondence with the spring sheet structure of the back plate disposed in the display area.

[0017] In some exemplary embodiments, the at least one stress structure is provided in a one-to-one correspondence with the spring sheet structure of the back plate disposed in the non-display area.

[0018] In some exemplary embodiments, the at least one stress structure includes a conductive foam structure.

[0019] This application also provides a display device, including a back panel and a display panel as described in any of the preceding claims.

[0020] Overview of the attached figures

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 is a schematic diagram of the overall structure of the display device in the related technology provided in the embodiments of this application.

[0023] Figure 2 is a schematic diagram of the product molding mechanism analysis in the related technology provided in the embodiments of this application.

[0024] Figure 3 is a partial structural schematic diagram of the display panel provided in an embodiment of this application.

[0025] Figure 4 is a schematic diagram of the design structure of the backlight side of the display panel provided in the embodiment of this application.

[0026] Figure 5 is a schematic diagram of another design structure of the backlight side of the display panel provided in the embodiment of this application.

[0027] Figure 6 is a schematic diagram showing the comparison of some parameters of different stainless steel materials provided in the embodiments of this application.

[0028] Detailed Explanation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0030] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this specification should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, but do not exclude other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0031] As described in the background section, in order to achieve conductive design between the back panel and the display panel in mobile phone products, the conductive materials selected in related technologies are generally conductive adhesives, conductive foams, or metal materials for conductive connection.

[0032] Conductive adhesive is an adhesive that becomes conductive after curing or drying. It can connect various conductive materials together, creating an electrical path between them. Based on the type of conductive particles in the adhesive, conductive adhesives can be classified into silver-based, gold-based, copper-based, and carbon-based adhesives, with silver-based adhesives being the most widely used. However, in manufacturing processes, conductive adhesives suffer from low conductivity, long curing times, relatively low adhesive strength, and high costs, leading to a gradual decrease in their application scenarios.

[0033] Conductive foam refers to flame-retardant sponge wrapped with conductive cloth. After a series of treatments, it acquires excellent surface conductivity and can be easily fixed to devices requiring shielding using adhesive tape. Due to its superior cushioning properties, conductive foam can both conduct electricity and absorb shock, thereby increasing the mechanical properties of products. Currently, there are numerous applications of conductive foam as a conductive carrier in complete machine systems.

[0034] Direct metal contact is also adopted in some OEM designs. As shown in Figure 1, the OEM design utilizes metal spring contact in specific areas. In the OEM design, a metal spring contact structure can be fabricated above the metal shielding cover above the speaker or other electronic components. After the OLED display module is assembled, the metal spring contact contacts the copper surface layer (cooper) of the SCF on the back of the display panel to achieve conductivity between different parts, enhancing the overall grounding area of ​​the mobile phone system and achieving superior anti-static (ESD) and shielding performance. Specifically, as shown in Figure 1, this includes a display panel 100 and a backplate 200. Multiple spring contact structures 210 are provided on the backplate 200. During assembly, the display panel 100 is snapped onto the backplate 200, and the spring contact structures 210 on the backplate 200 can then contact the backlight side of the display panel 100 to achieve conductivity.

[0035] However, in this spring-loaded structure, after the spring-loaded structure 210 contacts the backlight side of the display panel 100, the spring-loaded structure exerts a certain pressure upon contact, causing some compression. This compression can lead to localized molding defects visible on the front side (i.e., the light-emitting side or display side) of the display panel 100. The specific principle is shown in Figure 2. The compression from the back causes deformation of the cover glass (CG) on the light-emitting side of the display panel 100. This deformation causes a change in the light reflection angle, thus forming molding defects on the light-emitting side of the display panel 100. Here, CG represents the cover glass; TOCA represents the top optically clear adhesive layer; PST represents the polarizer sensor touch structure; BOCA represents the bottom optically clear adhesive layer; and panel represents the display panel.

[0036] In view of this, this application provides a display panel applied to a display device. The display device includes a display panel and a back panel. The display panel includes a light-emitting side and a backlight side opposite to the light-emitting side. The back panel contacts the backlight side through at least one spring structure at a preset position. The display panel further includes at least one stress structure disposed on the backlight side, at least partially corresponding to the at least one spring structure, and its projection on the back panel at least partially covers the at least one spring structure. This application provides a stress structure on the backlight side of the display panel at a position corresponding to the spring structure of the back panel. This stress structure can disperse and buffer the force applied to the backlight side of the display panel by the spring structure, thereby reducing or preventing localized molding defects caused by the pressure of the spring structure on the display panel and improving the overall yield. It can be seen that improving this problem fundamentally requires optimizing the molding problem. Molding occurs because the back of the display panel 100 is subjected to stress, and the pressure is transmitted to the OCA (Optical Clear Adhesive) material of the cover plate (CG). The OCA material deforms, resulting in the molding phenomenon that can be observed by the user from the front.

[0037] Figure 3 shows a partial structural schematic diagram of the display panel provided in an embodiment of this application.

[0038] As shown in Figure 3, the display panel 100 of this embodiment is applied to a display device. The display device includes the display panel 100 and a back panel 200. The display panel 100 includes a light-emitting side 110 and a backlight side 120 opposite to the light-emitting side 110. The back panel 200 contacts the backlight side 120 through at least one spring sheet structure 210 at a preset position. The display panel 100 further includes at least one stress structure 130, disposed on the backlight side 120, at least partially corresponding to the at least one spring sheet structure 210, and its projection on the back panel 200 at least partially covers the at least one spring sheet structure 210.

[0039] The display panel 100 is primarily used for displaying images. Therefore, its structure typically requires a light-emitting side 110. The pixels and other light-emitting structures within the display panel 100 transmit light through the light-emitting side 110, allowing the user to see the image displayed on the display panel 100. The backlight side 120 is the opposite side of the light-emitting side 110, and typically houses control chips, signal lines, and drive circuits. The backplate 200 generally carries the battery and the overall control system. Besides being interconnected with the display panel 100 via centralized control data lines, the backplate 200 also incorporates conductive designs at specific locations, such as through spring-loaded contact structures 210. These locations are generally determined during the overall design of the display device. Furthermore, the backplate 200 may have conductive designs in more than one location; consequently, in this embodiment, there may be more than one spring-loaded contact structure 210 located at a preset position.

[0040] Figure 4 shows a schematic diagram of the backlight side design structure of the display panel provided in this embodiment of the application. 210 represents the projection position of the spring contact structure 210 on the backplate 200 onto the backlight side 120 of the display panel 100. It can be seen that in this embodiment, the spring contact structure 210 is designed in multiple positions, distributed throughout the display area 300 and non-display area 400 of the entire display device.

[0041] Subsequently, as shown in Figure 3, in this embodiment, on the backlight side 120 of the display panel 100, at positions corresponding to these spring structures 210, stress structures 130 corresponding to the spring structures 210 can be provided. These stress structures 130 can be one-to-one corresponding to these spring structures 210, that is, for each spring structure 210, a corresponding stress structure 130 is provided on the corresponding backlight side 120 of the display panel 100. Alternatively, depending on the specific application scenario, only some spring structures 210 can be selected, and corresponding stress structures 130 can be provided on the corresponding backlight side 120 of the display panel 100. For example, only the spring structures 210 located within the display area 300 can be provided with corresponding stress structures 130. That is, at least one stress structure 130 is at least partially corresponding to the at least one spring structure 210. In a specific embodiment, the stress structure 130 can be provided using a high-modulus conductive material, that is, at the contact position between the spring structure 210 and the backlight side 120, the high-modulus conductive material is used for conductivity and stress dispersion. The high-modulus conductive material can be stainless steel sheet (SUS steel sheet) or gold-plated stainless steel sheet. By contacting the stainless steel sheet, the point stress of the contact spring structure 210 can be transformed into surface stress. Under the action of surface stress, the corresponding structure of the backlight side 120 of the display panel 100 (such as SCF material) can effectively reduce the effect of front molding.

[0042] In some embodiments, since the non-display area 400 is generally not used for display work, and is typically a pad bending area or FPC area with materials such as bending spanner, IC cover tape, or FPC, even if a spring design is chosen, the material stack in these areas is relatively thick. The stress applied to the module by the spring is converted into a very slight deformation of the OCA material, which is not noticeable on the front of the module. Since the non-display area 400 is not used for display, even slight deformation will not be detected. Therefore, the spring structure 210 in the non-display area 400 may not have a stress structure 130 at its relative position on the backlight side 120 of the display panel 100. As shown in Figure 5, similar to Figure 4, 210 is the projection position of the spring structure 210 on the backplate 200 on the backlight side 120 of the display panel 100. In this embodiment, the stress structure 130 is only provided in the display area 300, while no stress structure 130 is provided in the non-display area 400. That is, in some embodiments, the display device includes a display area 300 and a non-display area 400; the at least one stress structure 130 is provided in a one-to-one correspondence with the spring sheet structure 210 of the back plate 200 disposed in the display area 300.

[0043] In other embodiments, the stress structure 130 may completely cover the spring sheet structure 210, meaning the projection of the stress structure 130 on the back plate 200 completely covers the entire spring sheet structure 210; alternatively, as shown in Figures 3 or 5, it may only cover a portion of the spring sheet structure 210, for example, only corresponding to the protrusion 211 of the spring sheet structure 210. Since the back plate 200 itself only needs the protrusion 211 to contact the backlight side 120 of the display panel 100, the area of ​​the stress structure 130 can be reduced. That is, the projection of at least one stress structure 130 on the back plate 200 at least partially covers the at least one spring sheet structure 210. In other words, in some embodiments, the spring sheet structure 210 includes a protrusion 211; the stress structure 130 is configured to correspond to the protrusion 211.

[0044] Subsequently, to further mitigate the risk of assembly mold defects at the spring contact point during the assembly of the display panel 100, as shown in Figures 3 and 5, it can be seen that the main cause of mold defect problems is likely due to excessive stress concentration caused by the small contact area of ​​the protrusion 211 of the spring contact structure 210 when it contacts the backlight side 120 of the display panel 100. Therefore, when designing the stress structure 130, a stress dispersion scheme can be considered. Furthermore, in some embodiments, the stress structure 130 can be designed as a sheet structure, and to balance hardness, conductivity, and other properties, it can be designed as a stainless steel sheet structure. The size of the stainless steel (SUS) sheet can be designed according to specific design requirements and the degree of stress dispersion; for example, it can be designed as a 2.5mm*2.5mm sheet structure.

[0045] Furthermore, as shown in Figure 6, a schematic diagram comparing some parameters of different stainless steel materials is presented. To solve the technical problems of this application, the main focus is on parameters such as the hardness and yield strength of the stainless steel material. A higher yield strength allows for greater deformation resistance or stress buffering. Therefore, in some embodiments, the yield strength of the selected stainless steel material needs to be greater than or equal to 1000 MPa. Subsequently, to improve the dimensional accuracy of the stainless steel sheet, it can be processed during the die-cutting of the corresponding structure on the backlight side of the display panel. This allows for integral forming, achieving a very high level of dimensional accuracy. For example, when processing and cutting the SCF (super clean foam) layer on the backlight side, the stainless steel sheet can be directly bonded, ensuring consistent alignment. Lower hardness stainless steel sheets have a lower risk of mold marks at the edges during SCF Roller bonding. Therefore, in some embodiments, there are certain requirements for the hardness of the stainless steel sheet, such as a hardness of less than or equal to 400 Hv. Referring to Figure 6, it can be seen that the selection of SUS 316L stainless steel material, compared with SUS 301 and SUS 304, meets the corresponding requirements in terms of hardness and yield strength, and can be better suited for different application scenarios. The risk of mold marks appearing on the edge of the stainless steel sheet during the SCF Roller bonding process is small.

[0046] Furthermore, in the previous embodiment, a stress structure 130 was provided on the heat dissipation film layer SCF layer (heat dissipation film layer 140 as shown in Figure 3) on the backlight side 120. As shown in Figure 3, if only the stress structure 130 is present, localized raised islands will be formed on the backlight side 120 during the overall processing, which may have a certain impact on the overall processing. Therefore, as shown in Figure 3, a PET layer 150 can be further added on the backlight side. The PET layer 150, like the stress structure 130, can be disposed on the side of the heat dissipation film layer 140 away from the light-emitting side 110. The heat dissipation film layer 140 can be specifically structured as a stacked adhesive layer 141, a conductive layer 142, and a copper surface layer 143. The adhesive layer 141 can be an embo adhesive layer, whose main function is to bond the heat dissipation film layer 140 to the backlight side 120 of the display panel 100. The conductive layer 142 can be a conductive foam layer, used for conductivity and cushioning, etc. The copper surface layer 143 is the outermost copper or copper-plated thin film or copper alloy thin film, used for shaping, protection, and conductivity. Then, the conductive layer 142 and the copper surface layer 143 are sequentially stacked outwards. That is, the stress structure 130 is located on the side of the copper surface layer 143 away from the light-emitting side 110. Specifically, in some embodiments, the backlight side 120 includes a heat dissipation film layer 140, which includes a stacked adhesive layer 141, a conductive layer 142, and a copper surface layer 143, with at least one stress structure 130 located on the side of the copper surface layer 143 away from the light-emitting side 110.

[0047] Subsequently, since both the PET layer 150 and the stress structure 130 are located on the side of the copper surface layer 143 away from the light-emitting side 110, a hole or groove structure corresponding to the stress structure 130 can be cut into the PET layer 150 at the corresponding position to support the stress structure 130. Specifically, as shown in Figure 3, a corresponding groove structure is cut into the PET layer 150 at the position corresponding to the stress structure 130. In practical applications, the PET layer 150 can cover the stress structure 130, thus forming a "concave" groove structure; if it is flush with the stress structure 130, it will form a "hole" groove structure. Of course, this description refers to the appearance after the structure is formed. During processing, since the PET layer 150 can be processed later, the PET filling design can be carried out after the stress structure 130 and the heat dissipation film layer 140 are bonded together. This solves the molding problem caused by height difference in the stainless steel sheet of the stress structure 130 during vacuum bonding (D-lami process) in specific application scenarios. It should be noted that the molding problem here is different from the molding problem that this application aims to solve. The molding problem in this application is formed by the pressure of the spring sheet structure 210, while the molding problem here is caused by the addition of the stress structure 130 (stainless steel sheet), which may form at the edge of the stress structure 130 (stainless steel sheet). Thus, through the PET filling design, it is ensured that the overall bonding presents an approximate fit with the whole surface (i.e., ensuring flatness) when the overall bonding is completed. The molding is reduced to the lightest level during the module D-lami process. That is, in some embodiments, the backlight side 120 further includes a PET layer 150 disposed on the side of the copper surface layer 143 away from the light-emitting side 110, and a groove structure corresponding to the at least one stress structure 130 is provided at a position corresponding to the at least one stress structure 130.

[0048] According to the foregoing embodiments, a heat dissipation film layer 140 is provided on the backlight side 120 of the display panel 100, and its corresponding structure is described in detail. Furthermore, the molding phenomenon can be further reduced by improving the material of the heat dissipation film layer 140. In some embodiments, the conductive layer 142 can be further restricted; for example, selecting foam with a high compression force deformation (CFD) value can reduce contact molding. Specifically, a material with a compression force deformation value greater than or equal to 0.3 (such as suitable conductive foam) can be selected to form the conductive layer 142. In other embodiments, the copper surface layer 143 can also be further restricted; for example, selecting a copper layer material with high modulus and high yield strength can reduce contact molding. In specific scenarios, since electrolytic copper is generally used to manufacture the copper surface layer 143 in related technologies, in order to improve the modulus and yield strength, the manufacturing process can be adjusted to rolled copper. The resulting rolled copper, as the copper surface layer 143, meets the corresponding requirements and reduces contact molding. That is, in some embodiments, the copper surface layer 143 is specifically a rolled copper layer.

[0049] Finally, in some embodiments, as shown in FIG5, the stress structure 130 can be a stainless steel sheet or a conductive foam structure 160. FIG5 shows an example where part of the stress structure 130 is a stainless steel sheet and part of the stress structure 130 is a conductive foam structure 160. Specifically, the conductive foam structure 160 can be a conductive buffer foam material added at the corresponding position of the spring structure 210. Through the material compression buffer function of the conductive foam structure 160, the stress influence of the spring structure 210 on the backlight side 120 of the display panel 100 (e.g., the stress on the SCF layer) can be reduced, thereby reducing contact molding. Since the conductive foam structure 160 itself has a conductive function and can also play a considerable buffering role, in some embodiments, the corresponding spring structure 130 can be omitted. That is, at this position, the contact connection between the display panel 100 and the back plate 200 can be made solely through the conductive foam structure 160. In other words, the overall design incorporates a conductive foam structure 160 in the module area to establish conductivity between the product's module (display panel 100) and the system (back panel 200). This design minimizes the risk of molding defects during assembly. However, due to material limitations, the conductive foam structure 160's conductivity is lower than that of metal-to-metal contact solutions (i.e., stainless steel sheet and spring contact structures). Its specific application can be chosen based on the requirements of the specific scenario.

[0050] As can be seen from the above embodiments, the display panel provided in this application is applied to a display device. The display device includes a display panel and a back panel. The display panel includes a light-emitting side and a backlight side opposite to the light-emitting side. The back panel contacts the backlight side through at least one spring sheet structure at a preset position. The display panel further includes at least one stress structure disposed on the backlight side, at least partially corresponding to the at least one spring sheet structure, and its projection on the back panel at least partially covers the at least one spring sheet structure. By providing a stress structure on the backlight side of the display panel at a position corresponding to the spring sheet structure of the back panel, this application can disperse and buffer the force applied to the backlight side of the display panel by the spring sheet structure, thereby reducing or preventing local molding defects caused by the pressure of the spring sheet structure on the display panel and improving the overall yield.

[0051] Based on the same concept, this application also provides a display device, including a back panel and a display panel as described in any of the foregoing embodiments.

[0052] The display device described above is used to apply the corresponding display panel in the foregoing embodiments and has the beneficial effects of the corresponding display panel embodiments, which will not be repeated here.

[0053] It is understandable that the display device is a product with image display function, and it is generally driven by multiple driving circuits. For example, it can be: monitor, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large wall area, home appliance, information query equipment (such as business query equipment of e-government, bank, hospital, power and other departments, monitor, etc.).

[0054] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0055] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0056] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. The embodiments of this application are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The invention is applied to a display device, which includes a display panel and a back panel. The display panel includes a light-emitting side and a backlight side opposite to the light-emitting side. The back panel contacts the backlight side through at least one spring-loaded structure at a preset position. The display panel further includes: At least one stress structure is disposed on the backlight side, and is disposed at least partially corresponding to the at least one spring structure, and its projection on the back plate at least partially covers the at least one spring structure.

2. The display panel according to claim 1, characterized in that, The spring structure includes a protrusion; the stress structure is configured to correspond to the protrusion.

3. The display panel according to claim 1, characterized in that, The projection of the stress structure onto the back plate completely covers the entire spring structure.

4. The display panel according to claim 1, characterized in that, The stress structure is a sheet-like structure.

5. The display panel according to claim 4, characterized in that, The stress structure includes a stainless steel sheet; The stainless steel sheet has a hardness of less than or equal to 400Hv and a yield strength of greater than or equal to 1000MPa.

6. The display panel according to claim 1, characterized in that, The backlight side includes a heat dissipation film layer, which includes an adhesive layer, a conductive layer and a copper surface layer stacked together, and the at least one stress structure is disposed on the side of the copper surface layer away from the light-emitting side.

7. The display panel according to claim 6, characterized in that, The compressive deformation value of the conductive layer is greater than or equal to 0.

3.

8. The display panel according to claim 6, characterized in that, The copper surface layer is specifically a rolled copper layer.

9. The display panel according to claim 6, characterized in that, The backlight side also includes a PET layer, which is disposed on the side of the copper surface layer away from the light-emitting side, and a groove structure corresponding to the at least one stress structure is provided at the position corresponding to the at least one stress structure.

10. The display panel according to claim 1, characterized in that, The display device includes a display area and a non-display area; the at least one stress structure is configured in a one-to-one correspondence with the spring sheet structure of the back plate disposed in the display area.

11. The display panel according to claim 10, characterized in that, The at least one stress structure is provided in a one-to-one correspondence with the spring sheet structure of the back plate located in the non-display area.

12. The display panel according to claim 1, characterized in that, The at least one stress structure includes a conductive foam structure.

13. A display device, characterized in that, include: The back panel and the display panel as described in any one of claims 1 to 12.

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