Millimeter-wave transceiver and electronic device

Abstract

Disclosed in the present invention are a millimeter-wave transceiver and an electronic device. The millimeter-wave transceiver comprises a transmitting end, a receiving end, a transmitting end matching network, a receiving end matching network, a transmitting antenna, and a receiving antenna; the transmitting end and the receiving end are integrated on a same chip and are spaced apart by a preset distance; the transmitting end matching network has one end connected to the transmitting end, and the other end connected to the transmitting antenna; the receiving end matching network has one end connected to the receiving end, and the other end connected to the receiving antenna; the transmitting antenna and the receiving antenna communicate with each other by means of millimeter waves; and the matching networks are added to the transmitting end and the receiving end, respectively, so as to realize impedance matching. By optimizing the overall design of the antennas and specific circuits on the millimeter-wave transceiver structure, the transmission performance is improved while ensuring the integrated design of the transceiver to reduce size.

Description

Millimeter wave transceiver and electronic device TECHNICAL FIELD

[0001] The present application relates to the field of transceiver, in particular to a millimeter wave transceiver and electronic device. BACKGROUND

[0002] In the field of general chip isolation, it is usually involved in the combination of capacitive coupling, magnetic coupling and optical coupling circuits to achieve the requirement of two-end isolation. In the Chinese invention patent with publication number CN115378468A, the concept of millimeter wave isolation is mentioned, which realizes the purpose of isolation by utilizing the transmission characteristics of millimeter waves in the chip field.

[0003] However, since millimeter waves are applied to the field of chip isolation, they are not the same as conventional wireless transmission. In general wireless transmission, the transmitting end and the receiving end are relatively independent and can be designed separately, while in millimeter wave isolation, the transmitting end and the receiving end appear in pairs and need to be considered as a whole when designing. In general wireless transmission, it is far-field communication, while in millimeter wave isolation, it is near-field communication. Therefore, due to the above characteristics of millimeter wave isolation, it is necessary to consider the problem of affecting the transmission characteristics caused by the transmitting end and the receiving end being a whole and being relatively close when designing the circuit. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a millimeter wave transceiver and electronic device that can improve the transmission performance of the millimeter wave transceiver.

[0005] To solve the above technical problems, a technical solution adopted by the present application is:

[0006] A millimeter wave transceiver, comprising a transmitting end, a receiving end, a transmitting end matching network, a receiving end matching network, a transmitting antenna and a receiving antenna;

[0007] The transmitting end and the receiving end are integrated on the same chip and are separated by a preset distance;

[0008] One end of the transmitting end matching network is connected to the transmitting end, and the other end is connected to the transmitting antenna;

[0009] One end of the receiving end matching network is connected to the receiving end, and the other end is connected to the receiving antenna;

[0010] The transmitting antenna and the receiving antenna communicate through millimeter waves.

[0011] Further, the preset distance is 0.5mm-3mm.

[0012] Further, the plurality of channels are included, each of which comprises the transmitting end, the receiving end, the transmitting end matching network, the receiving end matching network, the transmitting antenna and the receiving antenna.

[0013] Further, the transmitting antenna and the receiving antenna are horizontally polarized, vertically polarized, left-hand circularly polarized or right-hand circularly polarized antennas.

[0014] Further, the polarization directions of the transmitting antenna and the corresponding receiving antenna on each of the channels are the same.

[0015] The polarization directions of the adjacent transmitting antennas of the transmitting end are opposite.

[0016] Further, a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a control circuit, a receiving feedback end and a transmitting feedback end corresponding to each transmitting end are further included, and a high-power device driver corresponding to all receiving ends is further included.

[0017] The output end of the receiving end is connected to the input end of the second signal demodulation circuit.

[0018] The output ends of all the first signal demodulation circuits are connected to the input ends of the high-power device driver, and the output ends of the high-power device driver are connected to the input ends of all the second signal modulation circuits.

[0019] The output end of the second signal modulation circuit is connected to the input end of the transmitting feedback end.

[0020] The output end of the transmitting feedback end communicates with the input end of the receiving feedback end through millimeter waves.

[0021] The output end of the receiving feedback end is connected to the input end of the second signal demodulation circuit.

[0022] The output end of the second signal demodulation circuit is connected to the input end of the control circuit.

[0023] The first output end of the control circuit is connected to the feedback end of the first signal modulation circuit.

[0024] The second output end of the control circuit is connected to the feedback end of the transmitting end.

[0025] The output end of the first signal modulation circuit is connected to the input end of the transmitting end.

[0026] Further, a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a transmitting feedback end, a power detector and a power coupler are further included, which correspond to each transmitting end respectively, and a high-power device driver corresponds to all receiving ends;

[0027] The power coupler is connected between the receiving end matching network and the receiving antenna;

[0028] The output end of the receiving end is connected with the input end of the first signal demodulation circuit;

[0029] The output ends of all the first signal demodulation circuits are connected with the input end of the high-power device driver, and the output ends of the high-power device driver are connected with the input ends of all the second signal modulation circuits;

[0030] The output end of the second signal modulation circuit is connected with the input end of the transmitting feedback end;

[0031] The output end of the transmitting feedback end is connected with the feedback end of the power coupler;

[0032] The power detector is connected between the transmitting antenna and the transmitting end matching network;

[0033] The feedback end of the power detector is connected with the input end of the second signal demodulation circuit;

[0034] The output end of the second signal demodulation circuit is connected with the feedback end of the first signal modulation circuit;

[0035] The output end of the first signal modulation circuit is connected with the input end of the transmitting end.

[0036] Further, the transmitting end includes a first oscillator and a transmitting end power amplifier;

[0037] The output end of the first oscillator is connected with the first input end of the transmitting end power amplifier;

[0038] The second input end of the transmitting end power amplifier receives a signal to be modulated;

[0039] Or the input end of the first oscillator receives a signal to be modulated, and the output end is connected with the input end of the transmitting end power amplifier;

[0040] The output end of the transmitting end power amplifier is connected with the one end of the transmitting end matching network;

[0041] Or the transmitting end includes a first oscillator;

[0042] The input end of the first oscillator receives a signal to be modulated;

[0043] The output end of the first oscillator is connected with the one end of the transmitting end matching network;

[0044] The receiving end comprises a receiving end power amplifier and a detector;

[0045] The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network;

[0046] The output end of the receiving end power amplifier is connected with the input end of the detector;

[0047] Or the receiving end comprises a receiving end power amplifier and a mixer;

[0048] The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network;

[0049] The first output end of the receiving end power amplifier is connected with the first input end of the mixer;

[0050] The second output end of the receiving end power amplifier is connected with the second input end of the mixer;

[0051] Or the receiving end comprises a receiving end power amplifier, a mixer and a second oscillator;

[0052] The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network;

[0053] The output end of the receiving end power amplifier is connected with the first input end of the mixer;

[0054] The output end of the second oscillator is connected with the second input end of the mixer.

[0055] Further, the transmitting end and the receiving end are packaged along a horizontal direction or along a vertical direction.

[0056] Further, the transmitting end and the receiving end are integrated on the same chip by a lead frame mode or a stacked package mode.

[0057] Further, the lead frame mode comprises a flip-chip mode and a wire bonding mode.

[0058] Further, the flip-chip mode and the wire bonding mode comprise a wafer level fan-out mode.

[0059] In order to solve the above technical problems, another technical solution adopted by the present application is:

[0060] An electronic device comprising the above-mentioned millimeter wave transceiver.

[0061] Further, the electronic device comprises a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system.

[0062] The present application has the beneficial effect that: for the characteristics that the transmitting end and the receiving end in the millimeter wave transceiver appear in pairs and are integrated on the same chip and are separated by a preset distance, the transmitting antenna and the receiving antenna have coupling problems, a matching network is additionally arranged at the transmitting end and the receiving end respectively, impedance matching is realized, and through overall optimization design of the antenna and the specific circuit on the millimeter wave transceiver structure, the transmission performance is improved while ensuring the integrated design of the transceiver to reduce the volume. BRIEF DESCRIPTION OF DRAWINGS

[0063] Fig. 1 is a structural schematic diagram of a millimeter wave transceiver according to an embodiment of the present application;

[0064] Fig. 2 is a structural schematic diagram of a multi-channel millimeter wave transceiver according to an embodiment of the present application;

[0065] Fig. 3 is a structural schematic diagram of an implementation of a backhaul mechanism in a high-power device driver according to an embodiment of the present application;

[0066] Fig. 4 is a structural schematic diagram of another implementation of a backhaul mechanism in a high-power device driver according to an embodiment of the present application;

[0067] Fig. 5 is a structural schematic diagram of an implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0068] Fig. 6 is a structural schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0069] Fig. 7 is a structural schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0070] Fig. 8 is a structural schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0071] Fig. 9 is a structural schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0072] Fig. 10 is a structural schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0073] Fig. 11 is a structural schematic diagram of another implementation of a transmitting end and a receiving end of a millimeter wave transceiver according to an embodiment of the present application;

[0074] Fig. 12 is a schematic structural diagram of another implementation of the transmitting end and the receiving end of the millimeter wave transceiver according to an embodiment of the present application;

[0075] Fig. 13 is a schematic structural diagram of another implementation of the transmitting end and the receiving end of the millimeter wave transceiver according to an embodiment of the present application;

[0076] Fig. 14 is a schematic structural diagram of a packaging mode of the transmitting end and the receiving end of the millimeter wave transceiver according to an embodiment of the present application;

[0077] Fig. 15 is a schematic structural diagram of another packaging mode of the transmitting end and the receiving end of the millimeter wave transceiver according to an embodiment of the present application;

[0078] Fig. 16 is a schematic structural diagram of an implementation of the chip packaging of the millimeter wave transceiver according to an embodiment of the present application;

[0079] Fig. 17 is a schematic structural diagram of another implementation of the chip packaging of the millimeter wave transceiver according to an embodiment of the present application;

[0080] Fig. 18 is a schematic structural diagram of the flip-chip bonding and wire bonding implementation according to an embodiment of the present application;

[0081] Fig. 19 is a schematic structural diagram of the wafer-level fan-out implementation according to an embodiment of the present application. DETAILED DESCRIPTION

[0082] To make the technical content, the achieved purposes and effects of the present application clear, the following will be described in combination with the embodiments and the accompanying drawings.

[0083] The above millimeter wave transceiver can be applied to any electronic device that needs to achieve isolation, such as a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system. The following will be described through specific embodiments:

[0084] In an optional embodiment, referring to Fig. 1, a millimeter wave transceiver includes a transmitting end TX, a receiving end RX, a transmitting end matching network, a receiving end matching network, a transmitting antenna and a receiving antenna;

[0085] The transmitting end and the receiving end are integrated on the same chip and are separated by a preset distance;

[0086] The preset distance is 0.5mm-3mm, which belongs to the near-field communication propagation zone of the antenna, and the preset distance is determined by the isolation strength requirement and the packaging substrate material;

[0087] One end of the transmitting end matching network is connected to the transmitting end, and the other end is connected to the transmitting antenna;

[0088] The receiving end matching network is connected to the receiving end at one end and to the receiving antenna at the other end.

[0089] The transmitting antenna and the receiving antenna communicate through millimeter waves.

[0090] In this embodiment, the transmitting antenna and the receiving antenna are very close to each other, so that the transmitting antenna and the receiving antenna are coupled to each other in addition to transmitting signals. Therefore, the transmitting end matching network and the receiving end matching network are added to achieve impedance matching and ensure the transmission performance of the signals.

[0091] In another optional embodiment, as shown in FIG. 2, the millimeter wave transceiver includes multiple channels, each of which includes the transmitting end, the receiving end, the transmitting end matching network (not shown in the figure), the receiving end matching network (not shown in the figure), the transmitting antenna and the receiving antenna.

[0092] In FIG. 2, each channel includes a signal modulation circuit and a signal demodulation circuit. The output end of the signal modulation circuit is connected to the input end of the transmitting end of the corresponding channel, and the output end of the receiving end of the corresponding channel is connected to the input end of the signal demodulation circuit.

[0093] In this embodiment, multiple channels are implemented on the same chip, so that multiple single-channel millimeter wave isolators are not needed, and the area and cost can be further saved.

[0094] In another optional embodiment, the transmitting antenna and the receiving antenna are horizontally polarized, vertically polarized, left-hand circularly polarized or right-hand circularly polarized, wherein the polarization directions of the transmitting antenna and the corresponding receiving antenna on each channel are the same.

[0095] The polarization directions of the adjacent transmitting antennas of the transmitting end are opposite, such as horizontal and vertical polarization or left-hand and right-hand circular polarization.

[0096] In this embodiment, by setting the polarization directions of the transmitting antenna and the receiving antenna, and by setting the polarization directions of the transmitting antenna and the receiving antenna on the same channel to be the same and the polarization directions of the adjacent antennas at the same end to be opposite, the interference problem between the multiple channels can be effectively prevented.

[0097] In another optional embodiment, as shown in FIG. 3, it further comprises a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a control circuit, a receiving feedback end and a transmitting feedback end corresponding to each transmitting end, and a high-power device driver corresponding to all receiving ends; that is, for a multi-channel millimeter wave transceiver, a first signal modulation circuit (i.e., the signal modulation circuit in the low-voltage area in FIG. 3), a first signal demodulation circuit (i.e., the signal demodulation circuit in the high-voltage area in FIG. 3), a second signal modulation circuit (i.e., the signal modulation circuit in the high-voltage area in FIG. 3), a second signal demodulation circuit (i.e., the signal demodulation circuit in the low-voltage area in FIG. 3), a transmitting feedback end (i.e., the TX in the high-voltage area in FIG. 3), and a receiving feedback end (i.e., the RX in the low-voltage area in FIG. 3) are arranged on each channel;

[0098] The output end of the receiving end is connected with the input end of the second signal demodulation circuit;

[0099] The output ends of all the first signal demodulation circuits are connected with the input ends of the high-power device driver, and the output ends of the high-power device driver are connected with the input ends of all the second signal modulation circuits;

[0100] The output end of the second signal modulation circuit is connected with the input end of the transmitting feedback end;

[0101] The output end of the transmitting feedback end communicates with the input end of the receiving feedback end through millimeter waves;

[0102] The output end of the receiving feedback end is connected with the input end of the second signal demodulation circuit;

[0103] The output end of the second signal demodulation circuit is connected with the input end of the control circuit;

[0104] The first output end of the control circuit is connected with the feedback end of the first signal modulation circuit;

[0105] The second output end of the control circuit is connected with the feedback end of the transmitting end;

[0106] The output end of the first signal modulation circuit is connected with the input end of the transmitting end.

[0107] In this embodiment, the application of the millimeter wave transceiver in the high-power device driver is realized, and by arranging a backhaul mechanism on each channel, the input signal can be regulated according to the backhaul signal, further ensuring the signal transmission performance.

[0108] In another optional embodiment, as shown in FIG. 4, the above-mentioned millimeter wave transceiver further comprises a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a transmission feedback end, a power detector and a power coupler corresponding to each transmission end, and a high-power device driver corresponding to all the receiving ends; that is, for a multi-channel millimeter wave transceiver, each channel is provided with a first signal modulation circuit (i.e., the signal modulation circuit in the low-voltage area in FIG. 4), a first signal demodulation circuit (i.e., the signal demodulation circuit in the high-voltage area in FIG. 4), a second signal modulation circuit (i.e., the signal modulation circuit in the high-voltage area in FIG. 4), a second signal demodulation circuit (i.e., the signal demodulation circuit in the low-voltage area in FIG. 4), a power detector, a power coupler and a transmission feedback end (i.e., TX in the high-voltage area in FIG. 4);

[0109] The power coupler is connected between the receiving end matching network and the receiving antenna, wherein the power coupler and the receiving end matching network can be designed separately or integrally.

[0110] The output end of the receiving end is connected to the input end of the first signal demodulation circuit.

[0111] The output ends of all the first signal demodulation circuits are connected to the input end of the high-power device driver, and the output end of the high-power device driver is connected to the input ends of all the second signal modulation circuits.

[0112] The output end of the second signal modulation circuit is connected to the input end of the transmission feedback end.

[0113] The output end of the transmission feedback end is connected to the feedback end of the power coupler.

[0114] The power detector is connected between the transmission antenna and the transmission end matching network, wherein the power detector and the transmission end matching network can be designed separately or integrally.

[0115] The feedback end of the power detector is connected to the input end of the second signal demodulation circuit.

[0116] The output end of the second signal demodulation circuit is connected to the feedback end of the first signal modulation circuit.

[0117] The output end of the first signal modulation circuit is connected to the input end of the transmission end.

[0118] In this embodiment, only one pair of antennas on each channel is used to realize the backhaul mechanism, thereby further saving cost and reducing volume.

[0119] In another optional embodiment, several implementations of the transmitting end and the receiving end are listed as shown in Figs. 5-13 (the matching network is not shown in the figures):

[0120] As shown in Figs. 5-7, the transmitting end comprises a first oscillator and a transmitting end power amplifier, wherein the first oscillator is a voltage-controlled oscillator (VCO);

[0121] The output end of the first oscillator is connected with the first input end of the transmitting end power amplifier;

[0122] The second input end of the transmitting end power amplifier receives a signal to be modulated;

[0123] That is, in this implementation, the modulation of the carrier signal and the signal to be modulated is directly implemented at the transmitting end power amplifier;

[0124] Or as shown in Figs. 11-13, the input end of the first oscillator receives the signal to be modulated, and the output end is connected with the input end of the transmitting end power amplifier;

[0125] The output end of the transmitting end power amplifier is connected with the one end of the transmitting end matching network;

[0126] That is, in this implementation, the modulation of the carrier signal and the signal to be modulated is directly implemented at the first oscillator of the transmitting end;

[0127] The above two implementations, at the transmitting end, the mixer is omitted, and the modulation of the carrier signal and the signal to be modulated is directly implemented at the transmitting end power amplifier or the first oscillator, which not only omits the mixer, but also reduces the opening time of the power amplifier, thereby saving the power consumption to a certain extent.

[0128] Or as shown in Figs. 8-10, the transmitting end comprises a first oscillator;

[0129] The input end of the first oscillator receives the signal to be modulated;

[0130] The output end of the first oscillator is connected with the one end of the transmitting end matching network;

[0131] That is, in this implementation, the first oscillator of the transmitting end not only generates the carrier, but also is responsible for modulating the signal and the carrier together to form a mixed wave, and then transmitting the mixed wave through the antenna, thereby satisfying the signal transmission while saving the space.

[0132] As shown in Figs. 5, 8 and 11, the receiving end comprises a receiving end power amplifier and a detector;

[0133] The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network;

[0134] The output end of the receiving end power amplifier is connected with the input end of the detector;

[0135] Or as shown in FIG. 7, FIG. 10, FIG. 13, the receiving end comprises a receiving end power amplifier and a mixer;

[0136] The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network;

[0137] The first output end of the receiving end power amplifier is connected with the first input end of the mixer;

[0138] The second output end of the receiving end power amplifier is connected with the second input end of the mixer;

[0139] Or as shown in FIG. 6, FIG. 9, FIG. 12, the receiving end comprises a receiving end power amplifier, a mixer and a second oscillator LO;

[0140] The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network;

[0141] The output end of the receiving end power amplifier is connected with the first input end of the mixer;

[0142] The output end of the second oscillator is connected with the second input end of the mixer.

[0143] In an optional embodiment, as shown in FIG. 14, the transmitting end M1 and the receiving end M2 are packaged along the horizontal direction with a preset distance;

[0144] Specifically, the millimeter wave transceiver comprises a packaging layer, a first substrate and a second substrate which are sequentially stacked, wherein the transmitting end and the receiving end are horizontally and spacedly packaged in the packaging layer, that is, side transmission of signals between the transmitting end M1 and the receiving end M2 is realized.

[0145] In another optional embodiment, as shown in FIG. 15, the transmitting end M1 and the receiving end M2 are packaged along the vertical direction with a preset distance;

[0146] Specifically, the millimeter wave transceiver comprises a packaging layer, a first substrate and a second substrate which are sequentially stacked, wherein the transmitting end is packaged in the packaging layer, and the receiving end is packaged in the first substrate, that is, face-to-face transmission of signals between the transmitting end M1 and the receiving end M2 is realized.

[0147] In another optional embodiment, the transmitting end and the receiving end are integrated on the same chip in the manner of lead frame (as shown in FIG. 16) or package on package (POP) (as shown in FIG. 17).

[0148] Among them, in the way of realizing packaging integration by lead frame (LeadFrame), as shown in Figure 18, including flip chip, wire bonding (WireBond):

[0149] Flip chip: integrate millimeter wave antenna and transceiver chip on the substrate, and then paste it on the frame as a whole;

[0150] Wire bonding: chip mounting (die attach) is performed first, and then wire bonding is performed;

[0151] Among them, as shown in Figure 19, the flip chip method and the wire bonding method include a wafer-level fan-out type (FanOut+RDL) method;

[0152] Integrate millimeter wave antenna at wafer level using TSV / RDL process, which has two cases:

[0153] One is that the antenna is on the back of the wafer, and the application end still needs to flip chip the chip to the packaging substrate for wire bonding to lead out the signal;

[0154] The other is that the antenna and other signals are on the same side, and there is no need for a substrate, and the wire bonding can be directly done on the chip pad to realize millimeter wave module communication;

[0155] And the POP (Package on Package) is to stack two or more packaging bodies in the vertical direction, and the antenna position can be adjusted according to the actual situation. The upper and lower circuit modules of the POP packaging can be completely isolated. The upper signal is directly led out from the upper side. And because there is space between the upper and lower modules, other insulating substances can be added to increase the voltage level and make it controllable. At the same time, a part of the horizontal direction size pressure will be converted into the form of vertical direction, so as to realize the transmission of the antenna face to face.

[0156] In another optional embodiment, an electronic device includes a millimeter wave transceiver of any of the above embodiments.

[0157] Among them, any electronic device that needs to realize isolation can use the millimeter wave transceiver of the above embodiment, and the electronic device includes a motor driver, a DCDC power supply circuit, an isolated ADC, or a battery system.

[0158] In summary, the application provides a kind of millimeter wave transceiver and electronic equipment, for millimeter wave transceiver in transmitting end and receiving end pair appears and is integrated on the same chip and interval preset distance characteristics, its transmitting antenna and receiving antenna exist coupling problem, respectively add matching network in transmitting end and receiving end, realize impedance matching, by the overall optimization design of antenna and specific circuit on millimeter wave transceiver structure, while guaranteeing the integrated design of transceiver to reduce volume, improve transmission performance, can be applicable to the isolation circuit in various application scenarios.

[0159] The above is only the embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent transformation, direct or indirect application in related technical fields using the content of the present application specification and drawings are also included in the patent protection scope of the present application.

Claims

A millimeter wave transceiver, characterized by The transmitter and the receiver are integrated on the same chip and are spaced apart by a preset distance; One end of the transmitter matching network is connected with the transmitter, and the other end is connected with the transmitting antenna; One end of the receiver matching network is connected with the receiver, and the other end is connected with the receiving antenna; The transmitting antenna and the receiving antenna communicate through millimeter waves. The preset distance is 0.5mm-3mm. A millimeter wave transceiver according to claim 1, wherein Each channel comprises the transmitter, the receiver, the transmitter matching network, the receiver matching network, the transmitting antenna and the receiving antenna. A millimeter wave transceiver according to claim 1, wherein The transmitting antenna and the receiving antenna are horizontally polarized, vertically polarized, left-hand circularly polarized or right-hand circularly polarized antennas. A millimeter wave transceiver according to claim 3, wherein The polarization directions of the transmitting antenna and the corresponding receiving antenna on each channel are the same; A millimeter wave transceiver according to claim 4, wherein The polarization directions of the adjacent transmitting antennas of the transmitter are opposite. Further comprising a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a control circuit, a receiving feedback end and a transmitting feedback end corresponding to each transmitter, and a high-power device driver corresponding to all receivers; A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that The output end of the receiver is connected with the input end of the first signal demodulation circuit; The output ends of all the first signal demodulation circuits are connected with the input ends of the high-power device driver, and the output ends of the high-power device driver are connected with the input ends of all the second signal modulation circuits; The output end of the second signal modulation circuit is connected with the input end of the transmitting feedback end; The output end of the transmitting feedback end communicates with the input end of the receiving feedback end through millimeter waves; The output end of the receiving feedback end is connected with the input end of the second signal demodulation circuit; The output end of the second signal demodulation circuit is connected with the input end of the control circuit; The first output end of the control circuit is connected with the feedback end of the first signal modulation circuit; The second output end of the control circuit is connected with the feedback end of the transmitter; The output end of the first signal modulation circuit is connected with the input end of the transmitter. Further comprising a first signal modulation circuit, a first signal demodulation circuit, a second signal modulation circuit, a second signal demodulation circuit, a transmitting feedback end, a power detector and a power coupler corresponding to each transmitter, and a high-power device driver corresponding to all receivers; A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that The power coupler is connected between the receiver matching network and the receiving antenna; The output end of the receiver is connected with the input end of the first signal demodulation circuit; The output ends of all the first signal demodulation circuits are connected with the input ends of the high-power device driver, and the output ends of the high-power device driver are connected with the input ends of all the second signal modulation circuits; The output end of the second signal modulation circuit is connected with the input end of the transmitting feedback end; The output end of the transmitting feedback end is connected with the feedback end of the power coupler; The power detector is connected between the transmitting antenna and the transmitter matching network; ​ The feedback end of the power detector is connected with the input end of the second signal demodulation circuit; The output end of the second signal demodulation circuit is connected with the feedback end of the first signal modulation circuit; The output end of the first signal modulation circuit is connected with the input end of the transmitting end. A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that The transmitting end comprises a first oscillator and a transmitting end power amplifier; The output end of the first oscillator is connected with the first input end of the transmitting end power amplifier; The second input end of the transmitting end power amplifier receives a signal to be modulated; Or the input end of the first oscillator receives the signal to be modulated, and the output end is connected with the input end of the transmitting end power amplifier; The output end of the transmitting end power amplifier is connected with the one end of the transmitting end matching network; Or the transmitting end comprises a first oscillator; The input end of the first oscillator receives a signal to be modulated; The output end of the first oscillator is connected with the one end of the transmitting end matching network; The receiving end comprises a receiving end power amplifier and a detector; The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network; The output end of the receiving end power amplifier is connected with the input end of the detector; Or the receiving end comprises a receiving end power amplifier and a mixer; The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network; The first output end of the receiving end power amplifier is connected with the first input end of the mixer; The second output end of the receiving end power amplifier is connected with the second input end of the mixer; Or the receiving end comprises a receiving end power amplifier, a mixer and a second oscillator; The input end of the receiving end power amplifier is connected with the one end of the receiving end matching network; The output end of the receiving end power amplifier is connected with the first input end of the mixer; The output end of the second oscillator is connected with the second input end of the mixer. A millimeter wave transceiver according to any one of claims 1 to 5, characterized in that The transmitting end and the receiving end are packaged along a horizontal direction or along a vertical direction. A millimeter wave transceiver according to claim 9, wherein The transmitting end and the receiving end are integrated on the same chip in a way of lead frame or in a way of stacked package. A millimeter wave transceiver according to claim 10, wherein The way of lead frame comprises a flip-chip way and a wire-bonding way. The millimeter wave transceiver according to claim 11, wherein, The flip-chip way and the wire-bonding way comprise a wafer-level fan-out way. An electronic device, characterized by comprising: A millimeter wave transceiver comprising any one of claims 1-5, 8-12. An electronic device according to claim 13, wherein The electronic device comprises a motor driver, a DCDC power supply circuit, an isolated ADC or a battery system.

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