Storage apparatus and electronic device

Abstract

A storage apparatus and an electronic device. A shell of the storage apparatus is internally provided with a middle frame; an inner cavity of the shell is divided into a first space and a second space; an air inlet and an air outlet are formed on the middle frame; a rotating disc body, a heating power device, and an air guide component of the storage apparatus are located in the first space; the air inlet is located on the side close to the rotating disc body, and the air outlet is located on the side close to the heating power device; a guide air duct of the air guide component comprises an air guide port and an air discharge port, the air guide port and the air inlet are arranged adjacent to each other, and the air discharge port is located above the heating power device. When the rotating disc body works, air is sucked from the second space into the first space by means of the air inlet, and flows to the air discharge port along the guide air duct, so as to form a convective heat transfer path for the heating power device. In addition, all the components for constructing the convective heat transfer path are all located in the shell, and the sealing level of the shell can be set on the basis of the actual need of an application scenario, thereby realizing good adaptability while improving the heat dissipation effect.

Description

Storage devices and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 2024109818688, filed on July 19, 2024, entitled "Storage Device and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of terminal device technology, and in particular to a storage device and an electronic device. Background Technology

[0003] As technology continues to evolve, the performance requirements of power devices within electronic devices are increasing, leading to a rise in the heat generated during operation. For example, in magnetoelectric disks used for data storage, the head drive module inside generates a significant amount of heat during operation. In practical applications, it is necessary to effectively address the overheating issue of the head drive module to avoid impacting performance. Summary of the Invention

[0004] This application provides a storage device and an electronic device, which can effectively improve heat dissipation through structural optimization and avoid the adverse effects of overheating on product performance.

[0005] The first aspect of this application provides a storage device, which includes a housing, a rotating disk, a heating power device, and an air guide component. A middle frame is provided inside the housing, and the outer periphery of the middle frame is connected to the side wall of the housing, dividing the inner cavity of the housing into a first space and a second space. The rotating disk, the heating power device, and the air guide component are all located in the first space. An air inlet and an air outlet are provided on the middle frame, and the air inlet and the air outlet are connected to the first space and the second space on both sides of the middle frame. The air inlet is located on the side closer to the rotating disk, and the air outlet is located on the side closer to the heating power device. The air guide component includes an air duct body with a guiding air channel, which includes an air inlet and an air outlet. The air inlet is arranged adjacent to the air inlet, and the air outlet is located above the heating power device. With this configuration, when the rotating disk rotates, the air in its area is accelerated and flows. The air pressure in the first space is lower than that in the second space relative to the air inlet on the middle frame. Based on this pressure difference, air in the second space of the middle frame is drawn into the first space through the air inlet. The resulting cooling airflow enters the air duct through an air intake adjacent to the air inlet and flows further along the air duct to the exhaust outlet. Simultaneously, due to the heat generated by the power devices, the air temperature below the exhaust outlet rises, while the air temperature on the exhaust outlet side remains relatively low. Based on the physical property that cold air is denser than hot air, the low-temperature cooling airflow descends through the exhaust outlet and blows towards the power devices, roughly following the direction of gravity, to exchange heat with them. The hot air, having completed heat exchange, flows back to the second space through the air outlet on the middle frame, entering the next convection heat exchange cycle. In this way, the heat around the heat source is evenly distributed into the entire internal cavity of the casing. The airflow disturbance formed by the rotating disc is fully utilized to create a convective heat transfer path for the heat-generating power devices. This can quickly remove the working heat of the power devices, effectively improve the heat dissipation effect, and prevent the devices from overheating by reasonably controlling the temperature rise, thus providing technical assurance for ensuring product performance.

[0006] Furthermore, the proposed solution utilizes a convective heat transfer path formed by a rotating disk, with all components located within the casing. Therefore, the formation of the cooling airflow does not require an external cooling fan. This allows for the adjustment of the casing's sealing level according to the actual needs of different application scenarios, improving heat dissipation while maintaining good adaptability.

[0007] Furthermore, the construction of the convection heat transfer path in this solution eliminates the need for additional cooling fans, thus reasonably controlling the product's configuration and operating costs; while improving heat dissipation capacity, it also meets the design requirements of the trend towards product miniaturization.

[0008] For example, the housing may include a first housing and a second housing, which can be mated to form a sealed inner cavity to accommodate the internal components of the storage device, and based on this, cooperate with the airflow duct of the air duct body to constrain the heat dissipation airflow along the airflow duct to the exhaust port. In practical applications, the sidewalls of the housing may be formed on the first housing or on the second housing.

[0009] Based on the first aspect, this application also provides a first implementation of the first aspect: the air duct body includes a sidewall that encloses and forms a flow-guiding air duct, and the inner wall surface of the sidewall near the middle frame is inclined. In this way, the heat dissipation airflow can flow smoothly to the exhaust port side, avoiding obstruction in the flow direction within the flow-guiding air duct and preventing turbulent backflow, thus ensuring convective heat transfer efficiency.

[0010] Based on the first aspect, or the first embodiment of the first aspect, this application also provides a second embodiment of the first aspect: the air guide component further includes an air guide shroud, which covers the outer periphery of the rotating disk and the heating power device, and the air inlet and outlet on the middle frame are located inside the air guide shroud. Based on this air guide shroud, a convection space can be formed on the first space side of the middle frame. In this way, the air on the second space side below the middle frame is drawn to the first space side above the middle frame through the air inlet. Under the restriction of the air guide shroud, it will not flow to the outer area of ​​the first space. At the same time, it can cooperate with the air duct of the air duct body to constrain the heat dissipation airflow to flow stably along the air duct to the exhaust port, thereby ensuring the gas flow rate for heat exchange with the power heating device, shortening the convection heat dissipation path, and improving the convection heat transfer efficiency.

[0011] For example, the air duct body can be integrally formed with the air guide cover, or it can be processed separately and then assembled and fixed with the air guide cover, for example, but not limited to, fixing by adhesive bonding or welding.

[0012] Based on the second embodiment of the first aspect, this application also provides a third embodiment of the first aspect: Two rotating disks are configured, and an air inlet is located on the middle frame between the two rotating disks. In practical applications, the two rotating disks are spaced apart in the first direction, the heating power device is located beside the two rotating disks in the second direction, and the air outlet is located on the middle frame opposite to the heating power device; the first direction intersects the second direction. In this way, the disturbance of the gas in the area caused by the rotation of the two rotating disks is fully utilized to create a low air pressure on the first spatial side of the air inlet.

[0013] For example, the air inlet can also be located close to either of the two magnetic tapes, which can also effectively utilize the rotation of the rotating disc to create a low air pressure on the first space side.

[0014] Based on the third implementation of the first aspect, this application also provides a fourth implementation of the first aspect: the air inlet on the middle frame is a first strip-shaped hole, and the extension direction of the first strip-shaped hole intersects the line connecting the rotation centers of the two rotating disks. That is to say, the air inlet extending along the second direction, on the basis of establishing a convection heat dissipation path, lengthens the return path on the second space side. In this way, the temperature of the gas entering the next heat dissipation cycle can be effectively reduced, and the space occupation in the first direction can be reasonably controlled, which meets the design requirements of the trend of product miniaturization.

[0015] Based on the fourth implementation of the first aspect, this application also provides a fifth implementation of the first aspect: the air inlet is a second strip-shaped hole, and the extension direction of the second strip-shaped hole intersects the plane where the middle frame is located. Correspondingly, the air outlet of the air duct body is a third strip-shaped hole extending in the first direction. In this way, the construction of this convection heat dissipation path has a more compact structural layout.

[0016] Based on the fourth or fifth implementation of the first aspect, this application also provides a sixth implementation of the first aspect: the outer surface of the sidewalls of the duct body adjacent to the two rotating disks is concave arc-shaped. Thus, with the structural optimization of the duct body, the internal space is fully utilized to rationally arrange the airflow duct, providing technical assurance for product integration and miniaturization design.

[0017] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, this application also provides a seventh embodiment of the first aspect: the middle frame further includes a baffle portion, which is disposed on the side of the middle frame facing the second space. The air inlet and air outlet are both located in the cavity formed by the baffle portion, and the side wall of the baffle portion is provided with flow holes. In this way, a convection channel is formed by the baffle on the second space side of the middle frame, so that the hot air that has completed heat exchange can be quickly guided away; at the same time, the hot air flowing out from the side of the power heating device, after cooling, is partially circulated back to the air inlet and partially discharged from the flow holes, realizing the air in the convection heat exchange path and the air in the entire sealed cavity of the casing, uniformly dispersing the high temperature around the heat source into the entire sealed cavity, and improving the convection heat exchange efficiency.

[0018] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, this application also provides an eighth embodiment of the first aspect: the outer periphery of the rotating disk has a plurality of spaced-apart fan blades. In this way, the disturbance of the fan blades further accelerates the airflow, improving the convective heat transfer effect.

[0019] Based on the eighth embodiment of the first aspect, this application also provides a ninth embodiment of the first aspect: the upper surface of the fan blade is inclined and convex; in the rotation direction, both ends of the upper surface of the fan blade are arc surfaces that gradually convex upward from their respective ends. With this configuration, the area of ​​the upper surface of the fan blade is larger than the area of ​​the lower surface of the fan blade, the air velocity above the fan blade is higher than the air velocity below the fan blade, the air pressure above the fan blade is lower than the air pressure below the fan blade, allowing the airflow to flow in an upward trend, further increasing the flow velocity of the heat dissipation airflow and improving the convective heat dissipation efficiency.

[0020] For example, the fan blade is radially convex arc-shaped to adapt to the outer peripheral contour of the rotating disk, and the structure is simple and reliable.

[0021] Based on the first aspect, or the first embodiment of the first aspect, or the second embodiment of the first aspect, or the third embodiment of the first aspect, or the fourth embodiment of the first aspect, or the fifth embodiment of the first aspect, or the sixth embodiment of the first aspect, or the seventh embodiment of the first aspect, or the eighth embodiment of the first aspect, or the ninth embodiment of the first aspect, this application also provides a tenth embodiment of the first aspect: the heating power device is a magnetic head drive module, the magnetic head drive module includes a motor and a magnetic head, the motor includes a coil frame, a coil, a magnet and a fixing base, the coil frame includes a coil mounting part and a magnetic head mounting part, the magnetic head is fixed on the magnetic head mounting part, two coils are inserted into the mounting holes of the coil mounting part and have an appropriate spacing with the magnets located on both sides, the magnets are fixed on the fixing base, and heat dissipation fins are provided on the outer peripheral surface of the coil mounting part. In this way, based on the setting of heat dissipation fins, the contact area between the coil frame side and the air is increased, which can further improve the heat exchange efficiency.

[0022] Based on the tenth embodiment of the first aspect, this application also provides an eleventh embodiment of the first aspect: a heat-conducting block is inserted into the inner coil of the coil. In this way, the heat generated by the operation of the coil is conducted to the heat-conducting block side through the surface of the inner coil, and heat is exchanged with the convective heat dissipation airflow through the two sides of the heat-conducting block in the insertion direction.

[0023] Based on the eleventh embodiment of the first aspect, this application also provides a twelfth embodiment of the first aspect: the heat-conducting block has a plurality of protruding structures on both sides of its insertion direction. The protruding structures increase the surface area of ​​the heat-conducting block, thereby increasing the heat exchange area between the heat-conducting block and the heat dissipation airflow.

[0024] In practical applications, the protrusion height of the protrusion structure can be 50 micrometers to 100 micrometers. Without affecting the fitting distance between the coil and the magnet, it can also have good heat exchange capacity by increasing the contact heat exchange area.

[0025] For example, the protrusion structure is a series of raised ridges, for example, but not limited to, the raised ridges can be arranged vertically, or they can be arranged horizontally or obliquely.

[0026] Alternatively, the protrusion structure may also be dot-shaped.

[0027] Alternatively, the protrusions on the surface of the heat-conducting block can be arranged regularly or irregularly.

[0028] Based on the twelfth embodiment of the first aspect, this application also provides a thirteenth embodiment of the first aspect: the heat-conducting block is made of carbon fiber material, and the extension direction of the carbon fiber is arranged along the heat conduction direction between the heat-conducting block and the coil. Thus, based on the high thermal conductivity of carbon fiber in the fiber extension direction, the heat of each side frame of the coil can be quickly conducted through the carbon fiber.

[0029] Based on the thirteenth embodiment of the first aspect, this application also provides a fourteenth embodiment of the first aspect: the coil includes two sets of opposing side frame bodies, and the heat-conducting block includes two opposing first outer surfaces and two opposing second outer surfaces. The heat-conducting block is formed by interlacing carbon fibers extending between the two first outer surfaces and carbon fibers extending between the two second outer surfaces. With this arrangement, heat can be quickly carried away by the carbon fibers arranged laterally and longitudinally, respectively, through the increased contact heat exchange area, thereby creating a high-performance heat-conducting channel between the inner ring surfaces of the coil.

[0030] Based on the tenth, eleventh, twelfth, thirteenth, or fourteenth embodiment of the first aspect, this application also provides a fifteenth embodiment of the first aspect: a thermally conductive structural adhesive is provided between the magnetic head and the magnetic head mounting part, and a thermally conductive structural adhesive is provided between the coil and the mounting hole of the coil mounting part. The coil frame is connected to the fixing base via a spring. During operation, heat from the magnetic head side is transferred to the coil frame through the thermally conductive structural adhesive, and the heat transferred to the coil frame is then transferred to the fixing base via the spring. In this way, the heat dissipation area of ​​the magnetic head is increased without increasing the volume of the magnetic head drive module.

[0031] For example, the reed is made of a high thermal conductivity metal material such as titanium or copper.

[0032] A second aspect of this application provides an electronic device including the storage device described above. Based on the storage device provided in this application, good heat dissipation can be provided for heat-generating power devices, avoiding the potential effects of overheating and maintaining stable and reliable storage functionality.

[0033] For example, the electronic device can be an electronic device with storage devices, such as a server, switch, or data center. Attached Figure Description

[0034] Figure 1 is a schematic diagram of the assembly relationship of a magnetoelectric disk provided in an embodiment of this application;

[0035] Figure 2 is a cross-sectional view of AA in Figure 1;

[0036] Figure 3 is a schematic diagram showing the relative positional relationship between the magnetic tape disk and the head drive module shown in Figure 1 on the middle frame;

[0037] Figure 4 is a schematic diagram of the assembly relationship between the air guide component and the middle frame shown in Figure 1;

[0038] Figure 5 is a schematic diagram of the air guide component shown in Figure 1 from another angle;

[0039] Figure 6 is a cross-sectional view of BB in Figure 5;

[0040] Figure 7 is a CC cross-sectional view of Figure 6;

[0041] Figure 8 is a structural schematic diagram of the middle frame shown in Figure 1;

[0042] Figure 9 is a schematic diagram showing the middle frame in Figure 1 from another angle.

[0043] Figure 10 is a schematic diagram of the structure of a magnetic tape disk provided in an embodiment of this application;

[0044] Figure 11 is a schematic diagram of the structure of the first disk shown in Figure 10;

[0045] Figure 12 is a view of the fan blade shown in Figure 11 from direction D;

[0046] Figure 13 is a schematic diagram of the overall structure of the magnetic head drive module shown in Figure 1;

[0047] Figure 14 is an exploded view of the assembled magnetic head drive module shown in Figure 13;

[0048] Figure 15 is a schematic diagram of the assembly relationship between the coil and the coil frame shown in Figure 13;

[0049] Figure 16 is a schematic diagram of the heat dissipation principle of the coil shown in Figure 15;

[0050] Figure 17 is a cross-sectional view of EE in Figure 13;

[0051] Figure 18 is an enlarged view of part F in Figure 17;

[0052] Figure 19 is a schematic diagram of coil temperature change obtained through simulation and actual measurement based on the magnetodisc shown in Figure 1 and the comparative example. Detailed Implementation

[0053] This application provides a solution for implementing a storage device with good heat dissipation performance, which can effectively improve the heat dissipation effect of power heat-generating devices in the storage device and avoid the adverse effects of overheating on product performance.

[0054] As technology continues to evolve, the performance requirements of power devices within electronic devices are increasing, leading to a rise in the heat generated during operation. Taking a magnetoelectric disk used for data storage as an example, the head drive module inside the disk generates a significant amount of heat during operation. As a high-heat-generating component, the voice coil motor (VCM) of the head drive module can reach a maximum temperature of 115°C during continuous operation. This temperature exceeds the normal operating temperature of the VCM coil, and prolonged operation at high temperatures will cause the VCM coil to crack and fail. Furthermore, the magnetic head of the head drive module can reach a maximum temperature of 107°C during continuous operation. This high temperature causes severe deformation of the magnetic tape near the head, directly resulting in the destruction of the data stored on the tape.

[0055] In practical applications, timely and effective heat dissipation is necessary for high-heat-generating components such as the magnetic head drive module to ensure reliable data read and write functions. However, some typical application scenarios require storage devices to be waterproof, such as, but not limited to, data centers. The sealed casing prevents the high-heat-generating components inside the magnetic disk from being cooled by external cooling fans. To address the overheating issue of the magnetic head drive module, the device is typically shut down for cooling after a period of tape reading and writing. This means the magnetic disk operates intermittently during large-capacity data storage operations, allowing the temperature of the high-heat-generating components to drop by shutting down the system. This significantly reduces the read and write efficiency of the magnetic disk, resulting in suboptimal product performance.

[0056] It is understandable that there is an objective need to effectively improve the heat dissipation of high-heat-generating components such as hard disk drives (HDDs).

[0057] Based on this, this application provides a storage device, which includes a housing, a rotating disk, and a heating power device. A middle frame is provided inside the housing, and the outer periphery of the middle frame is connected to the side wall of the housing, dividing the inner cavity of the housing into a first space and a second space. The rotating disk and the heating power device are both located in the first space. An air inlet and an air outlet are provided on the middle frame, and the air inlet and the air outlet are connected to the first space and the second space on both sides of the middle frame. The air inlet is located on the side closer to the rotating disk, and the air outlet is located on the side closer to the heating power device. An air guiding component is provided in the first space. The air guiding component includes an air duct body with a guiding air channel. The guiding air channel includes an air inlet and an air outlet. One end of the corresponding air inlet of the air duct body is adjacent to the air inlet, and the other end of the corresponding air outlet of the air duct body is located above the magnetic head drive module.

[0058] With this configuration, when the rotating disk rotates, the air in its area is accelerated and flows. According to Bernoulli's principle, the air pressure on the first space side is lower than that on the second space side relative to the air inlet on the middle frame. Based on this pressure difference, air on the second space side of the middle frame is drawn into the first space side through the air inlet. The resulting cooling airflow enters the air duct through the air inlet adjacent to the air inlet and further flows along the air duct to the exhaust port. Due to the heat generated by the power devices, the air temperature below the exhaust port rises, while the air temperature on the exhaust port side is relatively lower. Based on the physical property that cold air is denser than hot air, the low-temperature cooling airflow descends through the exhaust port and blows towards the power devices in roughly the direction of gravity, exchanging heat with them. The hot air that has completed heat exchange flows back to the second space side through the air outlet on the middle frame, entering the next convection heat exchange cycle.

[0059] In this way, the heat around the heat source (heat-generating power device) is evenly distributed into the entire internal cavity of the casing. The airflow disturbance formed by the rotating disk is fully utilized to create a convective heat transfer path for the heat-generating power device. This can quickly remove the working heat of the heat-generating power device (e.g., the magnetic head drive module), effectively improve the heat dissipation effect, and avoid overheating by reasonably controlling the temperature rise, thus providing technical assurance for ensuring product performance.

[0060] Furthermore, the convective heat transfer path formed by the rotating disk in this application is entirely located within the casing; in other words, the formation of the cooling airflow does not require an external cooling fan. This allows the casing's sealing level to be set according to the actual needs of different application scenarios, improving heat dissipation while maintaining good adaptability.

[0061] Furthermore, the convective heat transfer path constructed in this solution eliminates the need for additional cooling fans. This allows for reasonable control of product configuration and operating costs, while simultaneously meeting the trend towards product miniaturization while improving heat dissipation capacity.

[0062] To better understand the technical solution and effects of this application, a magnetoelectric disk is used as the description object, and specific embodiments are described in detail below with reference to the accompanying drawings. Please refer to Figures 1 and 2, where Figure 1 is a schematic diagram of the assembly relationship of a magnetoelectric disk provided in an embodiment of this application, and Figure 2 is a cross-sectional view AA in Figure 1.

[0063] The magnetoelectric disk 100 is a sealed storage device with magnetic tape storage and magnetic tape reading / writing functions. As shown in Figure 1, the magnetoelectric disk 100 includes a magnetic tape reel 10 and a magnetic head drive module 20 disposed within a housing 40. The magnetic tape reel 10 is a rotating disk body that rotates under the drive of a drive component (not shown in the figure), causing the magnetic tape 30 coiled and stored on the magnetic tape reel 10 to move forward or backward. For example, but not limited to, the two magnetic tape reels 10 can achieve forward movement of the magnetic tape 30 by rotating clockwise, and correspondingly, the two magnetic tape reels 10 can achieve backward movement of the magnetic tape 30 by rotating counterclockwise, so that the magnetic head 21 (read / write head) of the magnetic head drive module 20 can access specific positions on the magnetic tape 30. Referring to Figure 2, the magnetic head drive module 20 is a high-heat-generating power device of the magnetoelectric disk, and its magnetic head 21 and motor 22 generate high heat during operation.

[0064] The housing 40 includes a first housing 41 and a second housing 42, which can be joined to form a sealed inner cavity. The first housing 41 has an outer peripheral sidewall 411 extending toward the second housing 42, and is joined and fixed to the second housing 42 through the sidewall 411, and the sidewall 411 of the second housing 42 forms the sidewall of the housing 40 of the magnetoelectric disk 100.

[0065] For ease of description, within the layout plane of the middle frame 50, the direction of the line connecting the rotation centers of the two cassette disks 10 is defined as the first direction X, and another direction perpendicular to the first direction X is defined as the second direction Y; at the same time, the direction perpendicular to the layout plane of the middle frame 50 is defined as the third direction Y.

[0066] In other implementations, the sidewall of the housing 40 may also be formed by an outer peripheral sidewall extending from the second housing 42 toward the first housing (not shown in the figure), as long as it can form a sealed internal cavity for accommodating the internal components. This application does not limit the specific implementation.

[0067] In this embodiment, a middle frame 50 and an air guide component 60 are provided inside the housing 40. As shown in Figure 2, the outer periphery of the middle frame 50 is connected to the side wall of the housing 40, and divides the sealed inner cavity of the housing 40 into a first space M1 and a second space M2. Here, the assembly and fixing method between the middle frame 50 and the housing 40 can be determined according to the overall product design requirements. For example, it can be assembled and fixed using pins or threaded fasteners, or it can be assembled and fixed to the housing 40 using an adhesive bonding process.

[0068] The magnetic tape 10, the magnetic head drive module 20, and the air guide component 60 are all located within the first space M1, that is, on the side of the first space M1 relative to the middle frame 50. The middle frame 50 has an air inlet 51 and an air outlet 52, which penetrate the body of the middle frame 50 to connect the first space M1 and the second space M2 on both sides of the middle frame 50, respectively.

[0069] Please refer to Figures 3 and 4 together. Figure 3 is a schematic diagram of the relative positional relationship between the magnetic tape 10 and the magnetic head drive module 20 shown in Figure 1 on the middle frame 50. Figure 4 is a schematic diagram of the assembly relationship between the air guide component 60 and the middle frame 50 shown in Figure 1.

[0070] Referring to Figures 2, 3, and 4, two magnetic tape reels 10 are spaced apart in the first direction X, and in the second direction Y, the magnetic head drive module 20 is located beside the two magnetic tape reels 10. The air inlet 51 on the middle frame 50 is located between the two magnetic tape reels 10 to make full use of the gas disturbance in the area caused by the rotation of the two magnetic tape reels 10, forming a low air pressure on the first space M1 side of the air inlet 51.

[0071] For ease of description, the air pressure on the first space M1 side of the air inlet 51 is defined as P0, and the air pressure on the second space M2 side of the air inlet 51 is defined as P1. According to Bernoulli's principle, the air pressure P0 on the first space M1 side is lower than the air pressure on the second space M2 side, that is, P0 < P1. Therefore, the air below the middle frame 50 (second space M2 side) is drawn to the upper part of the middle frame 50 (first space M1 side) through the air inlet 51 as shown by the arrow in Figure 2, forming a heat dissipation airflow.

[0072] In other specific implementations, the air inlet 51 can also be located close to either of the two magnetic tapes 10, and the rotation of the magnetic tapes 10 can also be used to create low air pressure on the first space M1 side.

[0073] In this embodiment, the air guiding component 60 includes an air duct body 61 with an air duct 611. The air duct 611 includes an air inlet 611a and an air outlet 611b. One end of the air duct body 61 corresponding to the air inlet 611a is adjacent to the air inlet 51, and the other end of the air duct body 61 corresponding to the air outlet 611b is located above the magnetic head drive module 20. Correspondingly, the air outlet 611b is located above the magnetic head drive module 20. In this way, the cooling airflow can enter the air duct 611 through the air inlet 611a adjacent to the air inlet 51, and further flow along the air duct 611 within the air duct body 61 to the air outlet 611b as shown by the arrow in FIG2.

[0074] Furthermore, for the head drive module 20, when the magnetic tape 30 moves at high speed relative to the head 21 of the head drive module 20, it can disturb the gas in the area where the head drive module 20 is located, forming a low pressure. Define the air pressure below the other end of the air duct body 61 corresponding to the exhaust port 611b as P2. According to Bernoulli's principle, the air pressure P2 < P0, which further causes the heat dissipation airflow to flow from the air duct 611 to the exhaust port 611b.

[0075] The air outlet 52 on the middle frame 50 is located below the head drive module 20. That is, the air outlet 52 is opened on the middle frame 50 at a position opposite to the head drive module 20, so that the heat dissipation airflow that completes heat exchange with the head drive module 20 flows into the second space M2 side through the air outlet 52 located below it, as shown by the arrow in Figure 2. Due to the heat generated by the operation of the head drive module 20, the air temperature below the exhaust vent 611b will rise, while the air temperature in the air duct 611 is relatively low. According to the physical property that the density of cold air is greater than that of hot air, the low-temperature heat dissipation airflow flows downward through the exhaust vent 611b as shown by the arrow in Figure 2, and blows towards the head drive module 20 in roughly the direction of gravity, where it exchanges heat with the head drive module 20. The hot air that has completed heat exchange flows back to the second space M2 side through the air outlet 52 on the middle frame 50, and can enter the next convection heat exchange cycle as shown by the arrow in Figure 2.

[0076] In other specific implementations, the location of the air outlet 52 can be determined according to the overall height design requirements. The air outlet 52 can also be staggered with the magnetic head drive module 20 in the vertical direction. As long as it is close to the side of the magnetic head drive module 20, the gas that has completed heat exchange can flow into the second space M2 side and enter the next convection heat exchange cycle.

[0077] It is understandable that the descriptions of the air inlet 51 being located closer to the magnetic tape 10 and the air outlet 52 being located closer to the magnetic head drive module 20 refer to the relative positions of the corresponding openings on the middle frame 50, rather than specific distance dimensions. In other words, relative to the magnetic head drive module 20, the air inlet 51 is located closer to the magnetic tape 10; and relative to the magnetic tape 10, the air outlet 52 is located closer to the magnetic head drive module 20. This allows for reasonable control of the flow resistance along the convection heat transfer path.

[0078] To improve convective heat transfer efficiency, in a specific implementation, the air guide component 60 also includes an air guide shroud 62. Please refer to Figures 1, 2, 4, 5, 6, and 7. Figure 5 is a schematic diagram of the air guide component 60 shown in Figure 1 from another angle, Figure 6 is a BB cross-sectional view in Figure 5, and Figure 7 is a CC cross-sectional view in Figure 6.

[0079] As shown in Figures 1 and 4, the air duct body 61 of the air guide component 60 can be connected to the air guide cover 62. The air guide cover 62 can be fixed on the middle frame 50 and cover the outer periphery of the magnetic tape 10 and the magnetic head drive module 20. The air inlet 51 and air outlet 52 on the middle frame 50 are located inside the air guide cover 62.

[0080] As shown in Figures 5 and 7, the air duct body 61 includes a sidewall 612 that encloses and forms the air duct 611. The air duct body 61 can be integrally formed with the air guide shroud 62, or it can be processed separately and then assembled and fixed with the air guide shroud 62, for example, but not limited to, fixing by adhesive bonding or welding.

[0081] Based on the air guide component 60, the air guide shroud 62 can be installed on the first space M1 side of the middle frame 50 to form a convection space. In this way, when the magnetic tape 10 rotates, the air on the second space M2 side below the middle frame 50 is drawn to the first space M1 side above the middle frame 50 through the air inlet 51. Under the restriction of the air guide shroud 62, it will not flow to the outer area of ​​the first space M1, thereby ensuring the gas flow for heat exchange with the magnetic head drive module 20, shortening the convection heat dissipation path, and improving the convection heat transfer efficiency.

[0082] In the specific implementation, the outer shape of the air guide shroud 62 is set close to the two magnetic tape disks 10 and the magnetic head drive module 20. It is roughly the outer shape of two circles that partially intersect in the X direction (covering the two magnetic tape disks 10), and one side of the intersection protrudes outward in the second direction Y (covering the magnetic head drive module 20), so as to maximize the control of the gas flow rate for heat exchange.

[0083] In other possible implementations, the outer shape of the air guide shroud 62 can adopt different structural forms depending on the layout of the rotating disk and the heat-generating power devices in different application scenarios. It should be understood that any form that can reasonably limit the diffusion and flow range of the heat dissipation airflow is acceptable, and it is not limited to the shape shown in the figure. The embodiments of this application are not limited.

[0084] In this embodiment, two magnetic tape reels 10 are used as the power source for accelerated airflow on the first space M1 side, and the air inlet 51 can be set between the two magnetic tape reels 10. Please refer to Figures 3 and 8 together, where Figure 8 is a structural schematic diagram of the middle frame 50 shown in Figure 1.

[0085] The air inlet 51 can be located between the two magnetic tape reels 10, making full use of the rotational disturbance between them to accelerate airflow on the first space M1 side. In a specific implementation, the air inlet 51 is a first strip-shaped hole extending in the second direction Y, and the air inlet 51 is located on the line L connecting the rotation centers of the two magnetic tape reels 10; in other words, the extension direction of the first strip-shaped hole intersects with the line L connecting the rotation centers of the two magnetic tape reels 10. In this way, based on the establishment of a convection heat dissipation path, the return flow path on the second space M2 side is lengthened, and the temperature of the gas entering the next heat dissipation cycle is effectively reduced; at the same time, the space occupancy in the first direction X can be reasonably controlled, which meets the design requirements of the trend of product miniaturization.

[0086] Furthermore, the air inlet 611a of the duct body 61 is arranged adjacent to the air inlet 51 on the middle frame 50, which ensures that most of the air enters the duct 611 along the shortest path after entering through the air inlet 51. As shown in Figures 2 and 6, the air inlet 611a is configured as a second strip-shaped hole, the extension direction of which intersects the plane where the middle frame 50 is located, so as to make full use of the space in the third direction Z to configure the airflow cross section; correspondingly, as shown in Figures 5 and 7, the air outlet 611b of the duct body 61 is configured as a third strip-shaped hole extending in the first direction X, so as to make full use of the space in the first direction X to configure the exhaust airflow cross section.

[0087] In the specific implementation, the outer surfaces 6121 of the sidewalls 612 adjacent to the air duct body 61 and the two magnetic tape reels 10 are all concave arc-shaped to avoid the magnetic tape reels 10 and make full use of the internal space to rationally arrange the air duct 611. In this way, with the structural optimization of the air duct body 61, technical guarantees are provided for the overall integration and miniaturization design.

[0088] In other possible implementations, the overall shape of the air duct 61 can be determined as needed, and this application embodiment does not limit it.

[0089] In addition, to reduce the flow resistance of the cooling airflow in the air intake duct 611, the inner wall of the air intake duct 611 near the middle frame 50 is sloped 611c. In this way, the cooling airflow can flow smoothly to the exhaust port 611b side, avoiding obstruction in the flow direction and the formation of turbulent backflow, thus ensuring convective heat transfer efficiency.

[0090] To further improve convective heat transfer efficiency, in a specific implementation, the middle frame 50 may also include a baffle portion 53. Please refer to Figures 2, 4, and 9, where Figure 9 is a schematic diagram of the middle frame 50 shown in Figure 1 from another angle.

[0091] The enclosure 53 is located on the side of the middle frame 50 facing the second space M2, and both the air inlet 51 and the air outlet 52 are located in the cavity formed by the enclosure 53. The side wall of the enclosure 53 is provided with a flow passage 531. In this way, a convection channel is formed in the enclosure on the side of the middle frame 50 facing the second space M2, so that the hot air that has completed the heat exchange can be quickly guided away. At the same time, the hot air flowing out from the side of the magnetic head drive module 20 is cooled down and part of it is circulated back to the air inlet 51, and part of it is discharged from the flow passage 531. This realizes the air in the convection heat exchange path and the air in the sealed cavity of the entire casing 40, and evenly disperses the high temperature around the heat source into the entire sealed cavity, thereby improving the convection heat exchange efficiency of the magnetic head drive module.

[0092] In specific implementations, the enclosure portion 53 on the middle frame 50 is an optional configuration structure, which can be determined according to the overall product design requirements. This application does not impose limitations on the embodiments described herein.

[0093] In addition to accelerating airflow through disturbances based on the structure of the magnetic tape reel 10 itself, fan blades can also be provided on the reel body of the magnetic tape reel 10 to further improve the convective heat transfer effect. Please refer to Figures 10, 11, and 12 together. Figure 10 is a structural schematic diagram of a magnetic tape reel provided in an embodiment of this application, Figure 11 is a structural schematic diagram of the first reel body 11 shown in Figure 10, and Figure 12 is a D-direction view of the fan blade 13 shown in Figure 11.

[0094] As shown in Figure 10, the magnetic tape reel 10 includes a first reel body 11 and a second reel body 12 coaxially arranged, and the two are spaced apart axially to form a receiving space for storing the wound magnetic tape. Referring to Figure 2, the first reel body 11 is located close to the middle frame 50, and the second reel body 12 is located away from the middle frame.

[0095] In this embodiment, fan blades 13 are disposed on the outer periphery of the first disk 11 near the middle frame 50 to further increase axial airflow disturbance in the area near the air inlet 51. Exemplarily, six fan blades 13 are disposed on the outer periphery of the first disk 11 shown in FIG. 11, with each fan blade 13 arranged sequentially at intervals along the circumference of the first disk 11. In other specific implementations, the number of fan blades 13 can be other than those specified in this embodiment.

[0096] The fan blade 13 has a radially convex arc shape to adapt to the outer periphery of the first disk 11, resulting in a simple and reliable structure. In specific implementations, the fan blade 13 can be integrally formed with the first disk 11, or it can be processed separately and then assembled and fixed with the first disk 11.

[0097] As shown in Figure 12, the upper surface of the fan blade 13 has an inclined and convex shape, and the area S1 of the upper surface of the fan blade 13 is larger than the area S0 of the lower surface of the fan blade 13. When rotating clockwise or counterclockwise, the air velocity above the fan blade 13 is higher than the air velocity below the fan blade 13. Thus, the air pressure Pa above the fan blade 13 is lower than the air pressure Pb below the fan blade, allowing the airflow to flow upwards, further increasing the flow velocity of the heat dissipation airflow and improving the convective heat dissipation efficiency.

[0098] To further reduce flow resistance, in the direction of rotation, the first end 131 and the second end 132 of the upper surface of the fan blade 13 are both arc surfaces that gradually convex upward from their respective ends.

[0099] In a specific implementation, the fan blades 13 can also be set on the outer periphery of the second disk 2 away from the middle frame 50 (not shown in the figure). In comparison, the configuration shown in the figure, in which the fan blades are set on the first disk 11 close to the middle frame 50, results in a higher speed and flow rate of the rising airflow.

[0100] Of course, in other possible implementations, fan blades 13 can also be provided on both the first disk body 11 and the second disk body 12 of the magnetic tape 10. This application does not limit the embodiments.

[0101] In addition to establishing a convection cooling path within the housing, the heat dissipation area of ​​the heat source can optionally be further increased. Please refer to Figures 13 and 14 together, where Figure 13 is a schematic diagram of the overall structure of the head drive module 20 shown in Figure 1, and Figure 14 is an exploded view of the assembly of the head drive module 20 shown in Figure 13.

[0102] The magnetic head drive module 20 includes a motor 22 and a magnetic head 21. The magnetic head 21 is fixed on the coil frame 221 of the motor 22. The two coils 222 disposed on the coil frame 221 have an appropriate spacing with the magnets 23 located on both sides. As shown in Figure 1, the magnetic head drive module 20 is fixed on the middle frame 50 by a mounting base 24.

[0103] When powered on, under the influence of magnetic force, the two coils 222 can drive the magnetic head 21 to move in the width direction of the magnetic tape via the coil holder 221, so that the magnetic head 21 can access a specific position on the magnetic tape 30 to realize read and write operations. Among them, the coils 222 and the magnetic head 21 are heating power devices.

[0104] In this embodiment, heat dissipation structures are designed for both the inner and outer coils of coil 222. Please also refer to Figure 15, which is a schematic diagram of the assembly relationship between the coil and the coil frame shown in Figure 13. The coil frame 221 of the motor 22 includes a coil mounting part 2211 and a magnetic head mounting part 2212.

[0105] The coil 222 is inserted into the mounting hole of the coil mounting part 2211, and the mounting hole of the coil mounting part 2211 is adapted to the outer surface of the coil 222. That is, the coil mounting part 2211 has a contoured structure corresponding to the outer ring of the coil 222 to increase the heat exchange contact area between the two. In this way, the heat generated by the operation of the coil 222 is conducted to the coil frame 221 side through the outer ring surface.

[0106] In a practical implementation, a thermally conductive structural adhesive can be applied between the outer peripheral surface of the coil 222 and the mounting hole of the coil frame 221 to fill the heat exchange interface between them, effectively reducing thermal resistance. This significantly improves the heat exchange efficiency between them. For example, but not limited to, the thermal conductivity of this thermally conductive structural adhesive is ≥2 W / mK.

[0107] Furthermore, in this embodiment, heat dissipation fins 2213 are provided on the outer peripheral surface of the coil mounting portion 2211. Please also refer to Figure 16, which is a schematic diagram of the heat dissipation principle of the coil shown in Figure 15. In the figure, arrow F indicates the flow direction of the heat dissipation airflow. The arrangement of heat dissipation fins 2213 increases the contact area between the coil frame 221 side and the air, which can further improve the heat exchange efficiency.

[0108] A heat-conducting block 25, made of a highly thermally conductive material, is inserted into the inner coil of the coil 222. In this way, the heat generated by the coil 222 during operation is conducted through the surface of the inner coil to the heat-conducting block 25, where it exchanges heat with the convective cooling airflow through the two surfaces of the heat-conducting block 25 in the insertion direction.

[0109] In order to increase the heat exchange area between the heat-conducting block 25 and the convective heat dissipation airflow, in a specific implementation, the heat-conducting block 25 has a number of protrusion structures 251 on both sides of the insertion direction. The surface area of ​​the heat-conducting block 25 can be increased based on the arrangement of the protrusion structures 251, thereby increasing the heat exchange area between the heat-conducting block 25 and the heat dissipation airflow.

[0110] In this embodiment, the protruding structures 251 are sequentially arranged convex ridges. In specific implementations, these convex ridges can be arranged vertically along the figure, or they can be arranged horizontally or obliquely (not shown in the figure). In other possible implementations, the protruding structures on the surface of the heat-conducting block 25 can be in the form of raised dots. It should be understood that the protruding structures can be regular or irregular in shape; and the protruding structures can be arranged regularly or irregularly, as long as they protrude from both sides of the heat-conducting block 25 in the insertion direction. This application embodiment does not limit this.

[0111] The protrusion height of the protrusion structure 251 can be 50-100 micrometers. Without affecting the fitting distance between the coil 222 and the magnet 23, it also achieves good heat transfer capacity through an increased contact heat transfer area. Please refer to Figures 17 and 18 together. Figure 17 is a cross-sectional view of EE in Figure 13, and Figure 18 is an enlarged view of part F in Figure 17. In Figure 18, solid dots indicate the airflow on both sides of the coil 222.

[0112] As shown in Figure 18, when the convective cooling airflow blows towards the coil 222 (heat source), the raised protrusion structure 251 increases the contact area between the heat-conducting block 25 and the air. In specific implementations, the heat-conducting block 25 can be made of different high thermal conductivity materials, such as, but not limited to, copper or carbon fiber.

[0113] Compared to copper heatsinks, heatsinks 25 made of carbon fiber are lighter, which can reduce the load on motor 22 and allow for reasonable control of power consumption.

[0114] For the heat-conducting block 25 made of carbon fiber material, the extension direction of the carbon fiber can be arranged along the heat conduction direction between the heat-conducting block 25 and the coil 222. In this embodiment, the coil 222 is generally rectangular with rounded corners, as shown in Figure 16. The coil 222 includes two sets of opposing side frame bodies. Correspondingly, a corresponding heat conduction direction is formed between the two opposing surfaces of the heat-conducting block 25. One heat conduction direction is indicated by the horizontal arrows on the sides of the two opposing first outer surfaces 253 in the figure, and the other heat conduction direction is indicated by the vertical arrows on the sides of the two opposing second outer surfaces 254 in the figure.

[0115] In its implementation, the heat-conducting block 25 can be formed by interweaving transversely extending carbon fiber L1 (shown by dashed lines, extending between the two first outer surfaces) and longitudinally extending carbon fiber L2 (shown by dashed lines, extending between the two second outer surfaces). Based on the high thermal conductivity (≥700 W / mK) of carbon fibers in the fiber extension direction, heat can be rapidly conducted to each side frame of the coil 222 through the transversely arranged carbon fiber L1 and the longitudinally arranged carbon fiber L2, and the increased contact heat exchange area can quickly remove the heat. Overall, this effectively constructs a channel for good heat conduction through the inner surface of the coil 222.

[0116] To reasonably balance the manufacturing cost of the carbon fiber heat-conducting block 25 and the heat exchange efficiency between the heat-conducting block 25 and the coil 222, the heat-conducting block 25 has clearance notches 252 at each of its four corners, corresponding to the rounded corners of the coil 222.

[0117] In other possible implementations, the heat-conducting block 25 has different structural dimensions in the corresponding heat-conducting direction for different types of coils 222, rather than being limited to the structure of the heat-conducting block 25 shown in the figure.

[0118] In addition to increasing the heat dissipation area of ​​coil 222 as mentioned above, the heat dissipation area of ​​magnetic head 21 can also be increased in a specific implementation.

[0119] The magnetic head 21 is bonded and fixed to the magnetic head mounting part 2212 of the coil frame 221 by thermally conductive structural adhesive (thermal conductivity ≥2w / mk). The magnet 23 is fixed on the mounting base 24 of the motor 22. The coil frame 221 and the mounting base 24 are connected by a spring 26 to maintain and adapt to the adjustment of the working posture of the coil 222 and the coil frame 221.

[0120] During operation, heat from the magnetic head 21 is transferred to the coil frame 221 via thermally conductive adhesive. The heat transferred to the coil frame 221 is then transferred to the mounting base 24 via the spring 26, as shown by the arrow in Figure 17. Preferably, the spring 26 is a high thermal conductivity metal spring, such as, but not limited to, a spring made of titanium copper. This increases the heat dissipation area of ​​the magnetic head 21 without increasing the volume of the magnetic head drive module 20.

[0121] Based on the magnetoelectric disk 100 provided in this embodiment, and using a magnetoelectric disk that does not employ the aforementioned convection heat dissipation path and heat dissipation area as a comparative example, the operating temperature of the coil was simulated and measured under the same read / write operating conditions. The test data are shown in Figure 19 and Table 1 below. In Figure 19, the solid line curve represents the highest coil temperature of the comparative example, and the dashed line curve represents the highest coil temperature of this embodiment.

[0122] Table 1

[0123] Based on the actual test data in the table above, when the coil current is 0.1mA, the coil temperature in both the embodiment and the comparative example is 50℃; when the coil current is 0.2mA, the coil temperature in the comparative example is 140℃, with a temperature rise of 90℃, while the coil temperature in the embodiment of this application is 80℃, with a temperature rise of 30℃. Based on the simulation test data in the table above, when the coil current is 0.1mA, the coil temperature in both the embodiment and the comparative example is 50℃; when the coil current is 0.35mA, the coil temperature in the comparative example is 800℃, with a temperature rise of 750℃, while the coil temperature in the embodiment of this application is 190℃, with a temperature rise of 140℃. Comparatively, based on the measured and simulated test results, applying the relevant heat dissipation measures of the embodiment of this application can significantly improve the heat dissipation effect. Overall, it can reduce the temperature rise of the magnetic head drive module by 50%-70%.

[0124] In addition to the magnetoelectric disk, the heat dissipation measures described in the aforementioned embodiments can also be applied to HDD scenarios (not shown in the figure). The rotating disk can be an HDD platter, and the magnetic head module can be used as a heat-generating power device to be dissipated. Similarly, a good convection heat dissipation path can be established in the casing, eliminating the need for additional cooling fans and effectively increasing the heat dissipation area on the heat source side, thereby effectively improving the heat dissipation effect.

[0125] It should be understood that the other functional components of the aforementioned magneto-electric disks and HDDs can be implemented using existing technologies. Therefore, they will not be elaborated upon further.

[0126] The storage device implementation schemes described in the foregoing embodiments can be widely applied to various electronic devices, including but not limited to servers, switches, and data centers, which have storage devices. Based on the storage device provided in the embodiments of this application, it can provide good heat dissipation for heat-generating power devices, avoid the potential effects of overheating, and maintain storage functionality.

[0127] The above are merely preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A memory device, comprising: The storage device comprises a casing, a rotating disc body and a heat generating power device, a middle frame is arranged in the casing, the outer periphery of the middle frame is connected with the side wall of the casing, and the inner cavity of the casing is divided into a first space and a second space; the rotating disc body and the heat generating power device are located in the first space; An air inlet and an air outlet are formed in the middle frame, and the air inlet and the air outlet are communicated with the first space and the second space, wherein the air inlet is located on the side close to the rotating disc body, and the air outlet is located on the side close to the heat generating power device; A wind guide component is arranged in the first space, the wind guide component comprises a wind channel body with a flow guide channel, the flow guide channel comprises an air inlet and an air outlet, the air inlet is arranged adjacent to the air inlet, and the air outlet is located above the heat generating power device.

2. The memory device of claim 1, wherein, The wind channel body comprises a side wall enclosing the flow guide channel, and the inner wall surface of the side wall close to the middle frame is a bevel.

3. The memory device of claim 1 or 2, wherein, The wind guide component further comprises a wind guide cover, the wind guide cover is covered on the outer periphery of the rotating disc body and the heat generating power device, and the air inlet and the air outlet are located on the inner side of the wind guide cover.

4. The memory device of claim 3, wherein, The rotating disc body is provided with two, and the air inlet is arranged on the middle frame between the two rotating disc bodies.

5. The memory device of claim 4, wherein, The air outlet is formed at the position of the middle frame opposite to the heat generating power device.

6. The memory device of claim 5, wherein, The air inlet is a first strip hole, and the extension direction of the first strip hole intersects with the center line of the two rotating disc bodies.

7. The memory device of claim 5 or 6, wherein, The air inlet is a second strip hole, and the extension direction of the second strip hole intersects with the plane where the middle frame is located.

8. The memory device of claim 6 or 7, wherein, The outer surface of the side wall of the wind channel body adjacent to the two rotating disc bodies is concave arc-shaped.

9. The memory device of any one of claims 1-8, wherein, The middle frame further comprises a surrounding part, the surrounding part is arranged on the side of the middle frame facing the second space, the air inlet and the air outlet are located in the cavity formed by the surrounding part, and the side wall of the surrounding part is provided with a flow hole.

10. The memory device of any one of claims 1-9, wherein, The outer periphery of the rotating disc body has a plurality of spaced fan leaves.

11. The memory device of claim 10, wherein, The upper surface of the fan leaf is inclined and convex; in the rotation direction, the upper surface of the fan leaf is gradually convex from the end to the arc surface.

12. The memory device of claims 1-11, wherein, The heat generating power device is a magnetic head driving module, the magnetic head driving module comprises a motor and a magnetic head, the motor comprises a coil holder, a coil, a magnet and a fixing seat, the coil holder comprises a coil mounting part and a magnetic head mounting part, the magnetic head is fixed on the magnetic head mounting part, two coils are inserted into the mounting holes of the coil mounting part, and have an adaptive spacing between the magnets on both sides, the magnets are fixedly arranged on the fixing seat, and the outer peripheral surface of the coil mounting part is provided with heat dissipation fins.

13. The memory device of claim 12, wherein, The inner coil of the coil is provided with a heat conducting block.

14. The memory device of claim 13, wherein, The two side surfaces of the heat conducting block in the insertion direction have a plurality of protruding structures.

15. The memory device of claim 14, wherein, The heat conducting block is made of carbon fiber material, and the extension direction of the carbon fiber is arranged along the heat conduction direction between the heat conducting block and the coil.

16. The memory device of claim 15, wherein, The coil comprises two sets of opposite side frame bodies, the heat-conducting block comprises two oppositely arranged first outer surfaces and two oppositely arranged second outer surfaces, and the heat-conducting block is formed by interlacing carbon fibers arranged between the two first outer surfaces and carbon fibers arranged between the two second outer surfaces.

17. The memory device of any one of claims 12-16, wherein, A heat-conducting structural adhesive is arranged between the magnetic head and the magnetic head mounting portion, a heat-conducting structural adhesive is arranged between the coil and the mounting hole of the coil mounting portion, and the coil holder is connected to the fixed seat through a spring piece.

18. An electronic device, comprising: The electronic device comprises a storage device, and the storage device is the storage device according to any one of claims 1 to 17.

Images