Wafer and roughness improvement method and apparatus therefor, and device and medium

Abstract

Provided in the present application are a wafer and a roughness improvement method and apparatus therefor, and a device and a medium. The method comprises: when the roughness within a target wavelength range of a bare wafer that has undergone a wire sawing process is greater than or equal to a set roughness threshold, on the basis of the geometric similarity between abrasive particles in the currently used sawing slurry which are used for the wire sawing process and a regular polyhedron, determining an indicator value for representing the sawing capability of the currently used sawing slurry; and when the indicator value is less than or equal to a set performance threshold, replenishing with a new sawing slurry a device executing the wire sawing process.

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