Liquid crystal polymer film, method for producing same, method for producing metal-clad laminate, and method for producing circuit board
Patent Information
- Application Number
- PCT/JP2025/027379
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-16
- Filing Date
- 2025-08-01
- Publication Date
- 2026-02-19
AI Technical Summary
Existing methods for producing metal-clad laminates using liquid crystal polymer films fail to maintain an isotropic dielectric constant due to changes in molecular orientation during thermocompression bonding, which is crucial for high-frequency circuit boards.
Control the molecular orientation of liquid crystal polymer films by adjusting the strain released when heated at the melting point and optimizing thermocompression bonding conditions, ensuring the dielectric constant ratio remains isotropic.
Achieves a stable isotropic dielectric constant in metal-clad laminates, suitable for high-frequency applications by precisely controlling molecular orientation through strain management and bonding conditions.
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Figure JP2025027379_19022026_PF_FP_ABST
Abstract
Citation Information
Patent Citations
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