Liquid crystal polymer film, method for producing same, method for producing metal-clad laminate, and method for producing circuit board

WO2026038482A1PCT designated stage Publication Date: 2026-02-19KURARAY CO LTD
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Patent Information

Application Number
PCT/JP2025/027379
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-16
Filing Date
2025-08-01
Publication Date
2026-02-19

AI Technical Summary

Technical Problem

Existing methods for producing metal-clad laminates using liquid crystal polymer films fail to maintain an isotropic dielectric constant due to changes in molecular orientation during thermocompression bonding, which is crucial for high-frequency circuit boards.

Method used

Control the molecular orientation of liquid crystal polymer films by adjusting the strain released when heated at the melting point and optimizing thermocompression bonding conditions, ensuring the dielectric constant ratio remains isotropic.

Benefits of technology

Achieves a stable isotropic dielectric constant in metal-clad laminates, suitable for high-frequency applications by precisely controlling molecular orientation through strain management and bonding conditions.

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Abstract

Provided is a liquid crystal polymer film with which it is possible to produce a metal-clad laminate, said liquid crystal polymer film having a relative dielectric constant which, when the liquid crystal polymer film is laminated with a metal sheet to form the metal-clad laminate, is isotropic after lamination. The liquid crystal polymer film contains a liquid crystal polymer, wherein the ratio (εMD / εTD) of the relative dielectric constant εMD in the machine direction at 20°C and 15 GHz to the relative dielectric constant εTD is 1.01 to 1.40, and the strains in the machine direction and the transverse direction, released when heat is applied at the melting point of the film for three minutes in a solder bath, are both negative.
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Citation Information

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