Polyorganosiloxane composition with bismaleimide inhibitor

WO2026039303A1PCT designated stage Publication Date: 2026-02-19DOW SILICONES CORP
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Patent Information

Application Number
PCT/US2025/041277
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-08-15
Filing Date
2025-08-08
Publication Date
2026-02-19

AI Technical Summary

Technical Problem

Existing thermally conductive silicone composites used as thermal interface materials (TIMs) require improvements in open time to beyond 60 minutes, followed by rapid cure in less than 10 minutes upon heating, which are not adequately addressed by current inhibitors like alkynols.

Method used

A composition comprising specific filler particles, polyorganosiloxanes functionalized with Si-H and ethylenically unsaturated groups, a treating agent, hydrosilylation catalyst, and a bismaleimide inhibitor, providing a balance of excellent open time and rapid cure properties.

Benefits of technology

The composition achieves extended open time at room temperature and rapid cure at elevated temperatures, enhancing processing flexibility and efficiency.

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Abstract

The present invention relates to a composition comprising one or more filler particles; a first polyorganosiloxane functionalized with at least two Si-H groups; a second polyorganosiloxane functionalized with at least two ethylenically unsaturated groups; a treating agent; a hydrosilylation catalyst; and a bismaleimide of Formula 2:; where n is from 0 to 20. The composition of the present invention is useful as a thermal interface material (TIM) with a combination of excellent open time and cure time properties.
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Citation Information

Patent Citations

  • Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts

    US4766176A

  • Thermosetting organosiloxane composition

    US5017654A

  • High-thermal-conductivity liquid silicone rubber for mold made of composite material

    CN113913019A

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    US20140050900A1

  • Silicone release coating compositions

    US20200325371A1