Electroplating apparatus and electroplating method

Abstract

Provided in the present application are an electroplating apparatus and an electroplating method. The electroplating apparatus comprises: a substrate loading port, a front-end module, a buffer module, a processing module, a front-end manipulator and a process manipulator; the front-end manipulator is used for transferring a substrate between the substrate loading port and the buffer module; the processing module comprises a plurality of process chambers; the process manipulator is used for transferring the substrate between the plurality of process chambers; the buffer module is arranged between the front-end module and the processing module, and comprises a flipping unit for flipping the substrate so as to exchange the positions of the front surface and the back surface of the substrate. In the present application, the buffer module is provided with the flipping unit to flip the substrate 180°, helping to keep the front surface of the substrate facing downwards in a horizontal electroplating process. During the whole process, it is only necessary to flip the substrate twice to horizontally electroplate the substrate, thereby ensuring the effect of panel-level electroplating and product performance.

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