Power converter module

Abstract

The invention relates to a power converter module having a heat sink, on the planar upper face of which a plurality of power semiconductor modules are arranged in parallel rows. A plurality of busbars interconnect DC voltage connections on the upper faces of the power semiconductor modules, wherein the busbars are, in the region of the modules to be interconnected, planar and arranged one above the other in parallel. In the region between the DC voltage connections of each power semiconductor module, a first busbar is angled and extends vertically downwards, where it forms a first connection region for first DC voltage connections of the power semiconductor module. A second busbar is likewise angled and forms a second connection region for second DC voltage connections of the power semiconductor module. The connection regions are mechanically connected to the DC voltage connections of each power semiconductor module.

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