Integrated device package lids with compliant features
WO2026064083A1PCT designated stage Publication Date: 2026-03-26QUALCOMM INC
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Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-08-26
- Publication Date
- 2026-03-26
Smart Images
Figure US2025043511_26032026_PF_FP_ABST
Abstract
An integrated device package includes a substrate and a die coupled to the substrate. The integrated device package also includes a thermal interface material coupled to the die, and a lid coupled to the substrate and to the thermal interface material. The lid includes a unitary body that includes one or more openings that define a die contact area of the unitary body and one or more compliant members of the unitary body.
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